一种高硬度晶体材料的抛光打磨工艺
By using an automated polishing process, robotic arms and bonding components are employed to polish high-hardness crystals as a whole, solving the problem of low efficiency in existing technologies and achieving highly efficient crystal polishing.
CN117428579BActive Publication Date: 2026-07-17ANHUI CRESTRON CRYSTAL MATERIALS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI CRESTRON CRYSTAL MATERIALS CO LTD
- Filing Date
- 2023-11-28
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing technologies, polishing and grinding of high-hardness crystals need to be carried out separately, resulting in low efficiency and a large amount of manual intervention, making it impossible to achieve efficient grinding of the entire surface.
Method used
An automated polishing process is employed, using robotic arms and bonding components to fix and flip the crystal material. By combining coarse and fine grinding discs, the entire crystal material is polished, including the automated processing of the upper and lower surfaces and sides.
Benefits of technology
It improves the efficiency of crystal grinding and polishing, reduces manual intervention, realizes the overall automated grinding of crystal raw materials, and improves production efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN117428579B_ABST
Abstract
本发明公开了一种高硬度晶体材料的抛光打磨工艺，具体涉及晶体抛光加工技术领域，本发明晶体原料进入到输料筒的清洗后经由传送带的输送到达台面的位置，通过机械手一端部的粘接组件一对晶体原料的侧面接触粘接，并通过缺口进入到内罩板和外护盘形成的区域内，由转动板翻转带动晶体转动，通过粗磨盘对晶体原料的上下表面粗磨，晶体原料上下表面粗磨后，由粘接组件二对晶体原料的上表面接触粘接，之后粘接组件一打开，解除对晶体原料侧面的粘接限制，通过可转动的连接板带动晶体原料翻转角度，翻转角度的晶体原料与粗磨盘解除，对晶体原料的侧面粗磨，粗磨后，经过机械手二的转运，到达细磨盘进行细打磨，实现对晶体原料整体的依次打磨。
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