Substrate polishing apparatus and substrate polishing method

Abstract

The application discloses a substrate grinding device and a substrate grinding method, and relates to the technical field of substrate grinding devices, and discloses a substrate grinding device and a substrate grinding method.

Description

Technical Field

[0001] This invention belongs to the field of substrate grinding technology, and more specifically, relates to a substrate grinding apparatus and a substrate grinding method. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, dicing, packaging, and testing.

[0003] In the back-end process of integrated circuit manufacturing, in order to reduce the packaging height, reduce the chip package volume, improve the chip's thermal diffusion efficiency, electrical performance, mechanical performance, and reduce the amount of chip processing, the substrate needs to be back-side ground before subsequent packaging to thin the substrate to a predetermined thickness; the chip thickness after back-side grinding can even be less than 5% of the initial thickness.

[0004] Substrate thinning is performed on substrate grinding equipment, where the chuck table is one of the key components of the equipment, used to hold the substrate to be ground.

[0005] The loading stage typically includes a porous suction cup (ceramic suction cup), which holds the substrate to be ground by vacuum adsorption. Therefore, vacuum is an essential condition for the loading stage to adsorb the substrate.

[0006] In the prior art, a vacuum pump is usually configured on the loading stage to generate a vacuum for adsorbing the substrate; specifically, the porous suction cup is connected to a matching pipeline, which is connected to the vacuum pump, so as to form a negative pressure between the substrate and the porous suction cup to adsorb the substrate.

[0007] To ensure the surface of the porous suction cup is clean, cleaning water and compressed gas need to be introduced into the cup's connecting pipes. Since the vacuuming and cleaning operations share the same connecting pipes, residual water, gas, and abrasive particles can remain in the pipes, causing blockages and affecting the vacuum pump's suction efficiency.

[0008] Furthermore, when performing substrate "in-situ detection" on the loading stage, the negative pressure threshold set by the system is generally relatively low. The mixture of water and air in the piping of the multi-hole suction cup can easily cause pressure fluctuations, which can affect the accuracy of the system's judgment.

[0009] Figure 1This is a schematic diagram of the pressure change of the porous chuck during substrate in-situ detection in the existing solution. At this time, there is no substrate on the surface of the porous chuck, but because the supporting pipeline contains water, air and grinding particles, the porous chuck will generate a negative pressure below the set threshold momentarily. This will cause the software system to judge that there is a substrate on the porous chuck and erroneously start the grinding program.

[0010] In addition, to remove cleaning water from the surface of the porous suction cups, the loading stage is equipped with a suction pump to drain residual water and grinding particles from the pipeline. Considering the overall size of the substrate grinding unit, the suction pump should not be too large, which results in a small pump volume and the need to periodically drain the pumped liquid. Typically, drainage is required every 5-10 substrates processed, and frequent drainage reduces the efficiency of the loading stage in adsorbing substrates. Summary of the Invention

[0011] This invention provides a substrate grinding apparatus and a substrate grinding method, which aim to at least solve one of the technical problems existing in the prior art.

[0012] A first aspect of the present invention provides a substrate grinding apparatus, comprising:

[0013] Turntable;

[0014] The loading stage, located on top of the turntable, is used to support the substrate to be ground.

[0015] The grinding module, located above the loading stage, is used for grinding the substrate;

[0016] The loading platform includes a ceramic suction cup and a gas-liquid integrated assembly, the gas-liquid integrated assembly being connected to the lower part of the ceramic suction cup;

[0017] An external compressed air source is connected to the gas-liquid integrated component, and compressed gas can be introduced into the ceramic suction cup to blow upwards and remove contaminants.

[0018] In some embodiments, the gas-liquid integrated component is connected to the vacuum generating component so that when the vacuum generating component evacuates the ceramic suction cup, the contaminants remaining in the ceramic suction cup and its associated pipeline are collected in the micro-chamber configured in the gas-liquid integrated component.

[0019] In some embodiments, the vacuum generating component and its connecting pipeline are disposed above the gas-liquid integrated component.

[0020] In some embodiments, the gas-liquid integrated component is configured with a first interface and a second interface. The first interface is connected to a vacuum generating component, and the second interface is connected to a ceramic suction cup and its associated pipeline. The first interface and the second interface are alternately connected to a micro-chamber, and a partition is provided between the first interface and the second interface.

[0021] In some embodiments, the gas-liquid integration component is configured with a third interface communicating with a micro-chamber and connected to an external compressed air source.

[0022] A second aspect of the present invention provides a substrate grinding method using the substrate grinding apparatus described above, comprising:

[0023] Step 1: The substrate is loaded onto a ceramic chuck, and the grinding module thins the substrate.

[0024] Step 2: Remove the ground substrate from the loading stage and clean the surface of the ceramic suction cup;

[0025] Step 3: Introduce compressed gas into the ceramic suction cup and its associated piping to blow upwards and remove contaminants from the ceramic suction cup and its associated piping.

[0026] Step four: Drive the ceramic suction cup to rotate, centrifugally ejecting contaminants from the surface of the ceramic suction cup.

[0027] Furthermore, in step one, after the substrate is loaded onto the ceramic chuck, the vacuum generating component is turned on to determine whether the substrate is in place based on the pressure value of the ceramic chuck; in the initial stage of substrate in-place detection, the vacuum generating component draws out the contaminants remaining in the ceramic chuck and its associated pipelines into the micro-chamber.

[0028] A third aspect of the present invention provides a substrate grinding method, wherein the substrate grinding apparatus includes a turntable, a loading stage disposed on the turntable, and a grinding module located above the loading stage, wherein a ceramic chuck of the loading stage is used to carry the substrate to be ground; the method includes:

[0029] S10, the grinding module thins the substrate mounted on the ceramic chuck;

[0030] S20: Remove the ground substrate from the loading stage and clean the surface of the ceramic suction cup;

[0031] S30: Compressed gas is introduced from the bottom of the ceramic suction cup to blow upwards and remove internal contaminants.

[0032] Further, prior to step S30, cleaning water is introduced into the ceramic suction cup.

[0033] Further, in step S30, the interior of the ceramic suction cup is cleaned and repeated multiple times in the following manner: cleaning water and compressed gas are sequentially introduced into the interior of the ceramic suction cup and the ceramic suction cup is driven to rotate, so as to centrifugally throw out the contaminants above the ceramic suction cup.

[0034] The beneficial effects of this invention include:

[0035] a. The existing solution of downward suction to clean ceramic suction cups is abandoned. Instead, compressed gas is used to blow upwards to remove contaminants from the ceramic suction cups and their associated pipelines. This allows the contaminants to be discharged from the top of the ceramic suction cups, avoiding the shortcomings of the existing solution which requires a suction pump and frequent drainage operations, thus improving the efficiency of the loading platform in adsorbing the substrate.

[0036] b. When cleaning the ceramic suction cup and its associated pipeline, first use a mixture of compressed gas and cleaning water to flush the pipeline and ceramic suction cup. Then, use compressed gas to concentrate the liquid in the pipeline and ceramic suction cup onto the top surface of the ceramic suction cup. Next, drive the ceramic suction cup to rotate to centrifugally throw out the liquid on the surface of the ceramic suction cup, which effectively ensures the cleaning effect.

[0037] c. When evacuating the ceramic chuck, the trace amounts of water vapor in the ceramic chuck and its associated pipelines can be collected in the gas-liquid integrated component, so that the liquid gathers at the bottom of the micro-chamber and the gas is discharged from the micro-chamber of the gas-liquid integrated component, thereby further cleaning the ceramic chuck and its associated pipelines; at the same time, it is beneficial to improve the efficiency of evacuating the ceramic chuck, so as to improve the efficiency of substrate in-situ detection.

[0038] d. Compressed gas is blown upwards to remove contaminants from the ceramic chuck and its associated pipelines, allowing the contaminants to be discharged from above the ceramic chuck. This avoids the influence of residual moisture in the ceramic chuck and pipelines on the vacuum level, effectively preventing software system misjudgments and ensuring the smoothness of the substrate grinding operation. Attached Figure Description

[0039] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0040] Figure 1 This is a schematic diagram of the pressure change of the porous chuck during in-situ detection of the substrate in the existing scheme;

[0041] Figure 2 This is a schematic diagram of a substrate grinding apparatus provided in an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of a loading platform provided in an embodiment of the present invention;

[0043] Figure 4 yes Figure 3 A schematic diagram of a ceramic suction cup and its suction cup support assembly;

[0044] Figure 5 This is a schematic diagram of a gas-liquid integrated component provided in an embodiment of the present invention;

[0045] Figure 6 yes Figure 5 A schematic diagram of the interior of the gas-liquid integrated module;

[0046] Figure 7 yes Figure 5 Top view of the corresponding gas-liquid integrated component;

[0047] Figure 8 This is a longitudinal cross-sectional view of the gas-liquid integrated component via the fourth and fifth connection ports;

[0048] Figure 9 This is a schematic diagram showing the change in ceramic chuck pressure value corresponding to substrate in-situ detection;

[0049] Figure 10 This is a flowchart of a substrate grinding method provided in an embodiment of the present invention;

[0050] Figure 11 This is a flowchart of a substrate grinding method provided in another embodiment of the present invention. Detailed Implementation

[0051] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation of the present invention or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0052] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0053] In this invention, the substrate is also called a wafer (W), with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0054] Figure 2 This is a schematic diagram of a substrate grinding apparatus 1000 provided in an embodiment of the present invention. The substrate grinding apparatus 1000 includes:

[0055] Spinning wheel 100;

[0056] A loading stage 200 is disposed above the turntable 100 and is used to support the substrate to be ground; a drive unit 220 is disposed below the loading stage 200. Figure 3 (As shown), to drive the loading stage 200 and the substrate adsorbed above it to rotate;

[0057] A grinding module 300 is disposed on the side of the turntable 100 and above the loading stage 200 to perform a thinning process on the substrate surface. A coarse grinding wheel and / or a fine grinding wheel can be disposed below the grinding module 300 to remove the substrate surface material by grinding.

[0058] Furthermore, the loading stage 200 includes a ceramic suction cup 210, a drive unit 220, and a pneumatic-hydraulic integrated assembly 230, such as... Figure 3 As shown; wherein, the drive unit 220 is disposed below the ceramic chuck 210 to drive the ceramic chuck 210 and the substrate it adheres to to rotate. Specifically, an air bearing is disposed between the drive unit 220 and the ceramic chuck 210, which can drive the ceramic chuck to rotate around the central axis to cooperate with the grinding module 300 to remove the material on the surface of the substrate.

[0059] It should be noted that the ceramic suction cup 210 is located in the suction cup support assembly 210a. Figure 4Above (shown), the suction cup support assembly 210a has multiple internal channels to evacuate the ceramic suction cup 210 and adsorb the substrate; furthermore, cleaning water, such as deionized water (DIW), and compressed gas (CDA) are sprayed toward the ceramic suction cup 210 through the internal channels of the suction cup support assembly 210a to clean the ceramic suction cup 210 and the contaminants remaining in the channels, thereby ensuring the reliability of the ceramic suction cup 210 in use.

[0060] Furthermore, the substrate grinding apparatus 1000 also includes a vacuum generating component 240, which is connected to the gas-liquid integration component 230 to create a negative pressure by drawing a vacuum on the ceramic chuck 210; the ceramic chuck 210 with a negative pressure on its surface can adsorb the substrate to be ground.

[0061] In the prior art, the substrate grinding apparatus 1000 requires a large vacuum pump, which increases the overall space occupied by the equipment. However, the technical solution provided by the present invention uses a vacuum generating component 240 to create a vacuum, which is smaller in size and has the advantage of occupying less space, thus improving the rationality of the layout of the substrate grinding equipment.

[0062] Furthermore, the loading platform 200 also includes a pressure sensor 250, such as... Figure 3 As shown, the pressure sensor 250 is disposed in the gas-liquid integrated assembly 230 and connected to the ceramic suction cup 210 and its supporting pipeline to detect the pressure value of the ceramic suction cup 210.

[0063] During the substrate grinding process, a large number of tiny particles are generated. These particles can enter the interior of the ceramic chuck 210 and even the pipes configured in the chuck support assembly 210a. These particles can easily accumulate between components, thus affecting the flatness of the ceramic chuck 210 surface. Therefore, after processing each substrate, the surface of the ceramic chuck 210 needs to be thoroughly cleaned.

[0064] In existing solutions, a suction pump is typically connected to the piping of the suction cup support assembly 210a. The suction pump is used to suction the piping and the ceramic suction cup 210 to draw out residual water, air, and grinding particles from the piping downwards, thereby expelling them from the substrate grinding apparatus 1000. Considering the machinability of the component piping, the internal piping of the suction cup support assembly 210a often has right-angle bends, which results in a small amount of water, air, and particles remaining in the piping.

[0065] When performing on-site detection of the substrate on the loading stage 200, it is necessary to evacuate the ceramic suction cup 210 and its associated pipelines. Residual water, gas, and particulate matter in the pipelines can cause fluctuations in the readings of the pressure sensor 250. Figure 1is shown), which in turn affects the judgment of the supporting software system of the substrate grinding device 1000. For example, if no substrate is placed on the ceramic suction cup 210, but according to Figure 1 the shown pressure value, the software system will mistakenly think that there is a substrate on the ceramic suction cup 210 and start the grinding process, which will cause the grinding module 300 to directly process the ceramic suction cup 210 and damage the substrate grinding device.

[0066] To solve the problem of software system misjudgment, in the technical solution provided by the present invention, compressed gas is directly sprayed into the interior of the pipeline supporting the ceramic suction cup 210, so that the residual water, gas and grinding particles in the pipeline are discharged from the top of the ceramic suction cup 210, to prevent the residues in the pipeline from affecting the vacuum degree of the ceramic suction cup 210.

[0067] Figure 3 In the shown embodiment, the gas-liquid integration component 230 is arranged below the ceramic suction cup 210, and the gas-liquid integration component 230 is connected to the ceramic suction cup 210 through a pipeline. Compressed gas (CDA) can be blown upward through the gas-liquid integration component 230 and the ceramic suction cup 210 and discharged from above the ceramic suction cup 210 to remove the residual particles and waste water inside.

[0068] It should be noted that when cleaning the ceramic suction cup 210 and its supporting pipeline, compressed gas (CDA) and cleaning water (DIW) need to be sprayed into the pipeline at the same time. The mixture formed by water and gas can wrap the grinding particles in the ceramic suction cup 210 and its pipeline to clean the pollutants remaining in the pipeline and ensure a good cleaning effect.

[0069] Figure 5 is a schematic diagram of the gas-liquid integration component 230 provided by an embodiment of the present invention, Figure 6 is a schematic diagram of the internal structure of the gas-liquid integration component 230. A micro chamber 230a is arranged inside the gas-liquid integration component 230 to converge a small amount of pollutants remaining in the ceramic suction cup 210 and its supporting pipeline in the micro chamber 230a. In the present invention, the pollutants remaining in the ceramic suction cup 210 and its supporting pipeline refer to the mixture of grinding fluid, grinding particles, waste gas, etc.

[0070] Furthermore, the gas-liquid integration component 230 is configured with a first interface 231, as Figure 6 shown, the first interface 231 is connected to the vacuum generating component 240; the gas-liquid integration component 230 is further configured with a second interface 232, and the second interface 232 is connected to the ceramic suction cup 210 and its supporting pipeline to evacuate the ceramic suction cup 210 and its supporting pipeline.

[0071] The gas-liquid integration component 230 is a rectangular groove body, and the first interface 231 and the second interface 232 are respectively arranged on the opposite side walls of the micro chamber 230a, as Figure 6 As shown; furthermore, the gas-liquid integrated assembly 230 is also provided with a partition 230b, which is arranged along the length of the gas-liquid integrated assembly 230 to separate the first interface 231 from the second interface 232.

[0072] Furthermore, the length of the partition 230b is matched with the length of the micro-chamber 230a and is snapped into place inside the micro-chamber 230a; at the same time, the height of the partition 230b is less than the depth of the micro-chamber 230a, so that a gap is formed between the partition 230b and the bottom surface of the micro-chamber 230a for gas passage. Figure 6 In the embodiment shown, the height of the partition 230b is 1 / 3 of the depth of the microchamber 230a.

[0073] In the early stage of substrate in-situ detection, trace amounts of water, gas and particulate matter remaining in the pipeline are pre-collected inside the micro-chamber 230a configured in the gas-liquid integrated component 230 to prevent the residue in the pipeline from affecting the vacuum degree of the ceramic chuck 210.

[0074] When the vacuum generating assembly 240 is used to suction out trace amounts of contaminants remaining in the ceramic suction cup 210 and its tubing, the liquid containing particulate matter that is sucked into the micro-chamber 230a through the second interface 232 will adhere to the partition 230b and then fall to the bottom of the micro-chamber 230a under the action of gravity. Meanwhile, the gas flows towards the first interface 231 through the gap at the bottom of the partition 230b and is finally discharged through the first interface 231.

[0075] As Figure 5 In a variation of the embodiment, the partition 230b may also be arranged along the width direction of the micro-chamber 230a, or inclined inside the micro-chamber 230a; as long as the partition 230b separates the first interface 231 from the second interface 232, and a gap for gas passage is formed between the partition 230b and the bottom surface of the micro-chamber 230a.

[0076] Furthermore, the gas-liquid integrated component 230 is also equipped with a third interface 233, which is arranged adjacent to the first interface 231 and connected to an external compressed air source; specifically, the third interface 233 and the first interface 231 are located on the same side wall of the micro chamber 230a.

[0077] Figure 6 In the middle, the gas-liquid integrated component 230 also includes a fourth interface 234 and a fifth interface 235. The fourth interface 234 is located below the first interface 231 and is connected to the cleaning water (DIW). The fifth interface 235 is located below the second interface 232 and is connected to the ceramic suction cup 210 and its matching pipeline.

[0078] Figure 7This is a top view of the gas-liquid integrated assembly 230. A first one-way valve 261 is provided on the outside of the second interface 232, and a second one-way valve 262 is provided on the outside of the fifth interface 235. The first one-way valve 261 is set in the opposite direction to the second one-way valve 262 in order to control the flow direction of the fluid and prevent gas and / or liquid from entering other interfaces and affecting the stable operation of the ceramic suction cup 210 during cleaning and vacuuming operations. Figure 7 The dashed line with arrows indicates the flow direction of the contaminants drawn into the micro chamber 230a. The gas in the contaminants is discharged from the first interface 231 after passing through the partition 230b.

[0079] Figure 8 This is a longitudinal cross-sectional view of the gas-liquid integrated assembly 230 via the fourth connection port 234 and the fifth connection port 235. The bottom surface of the micro-chamber 230a is inclined. The bottom surface of the micro-chamber 230a is inclined towards the fifth interface 235, so that the liquid remaining in the ceramic chuck 210 and its associated pipeline can collect at the lowest point of the micro-chamber 230 and be close to the fifth interface 235. After the substrate is ground on the loading stage 200, the surface of the ceramic chuck 210 will be contaminated with grinding fluid, grinding particles and other pollutants; in order to ensure the grinding quality of the substrate, the ceramic chuck 210 and its associated pipeline need to be cleaned before loading the next substrate.

[0080] Specifically, the external compressed air source and cleaning water are turned on at the same time. The compressed air enters the micro chamber 230a through the third interface 233, and the cleaning water enters the micro chamber 230a through the fourth interface 234, and then is transmitted to the ceramic suction cup 210 through the fifth interface 235 to clean the ceramic suction cup 210 and the residual particles in its pipeline.

[0081] During the cleaning of the ceramic suction cup 210, the cleaning water collected at the bottom of the micro chamber 230a enters the ceramic suction cup 210 and its supporting pipeline through the fifth interface 235.

[0082] In this invention, Figure 3 The vacuum generating assembly 240 and its connecting pipes shown are positioned above the gas-liquid integrated assembly 230 to prevent fluid in the gas-liquid integrated assembly 230 and its pipes from entering the interior of the vacuum generating assembly 240 under the influence of gravity, thus affecting the efficiency of vacuuming.

[0083] The schematic diagram showing the change in pressure value of the ceramic chuck 210 during substrate in-situ detection by the substrate grinding apparatus 1000 provided by the present invention is shown below. Figure 9As shown. When cleaning contaminants from the ceramic chuck 210 and its associated pipelines, a mixture of compressed gas and cleaning water is used for cleaning, and then compressed gas is used to remove moisture from the pipelines. This effectively avoids the impact of residual contaminants on the vacuum level, ensuring that the vacuum level of the ceramic chuck 210 does not fluctuate significantly. This effectively avoids software misjudgments caused by pressure fluctuations and helps ensure the reliable operation of the substrate grinding device 1000.

[0084] Meanwhile, the present invention also provides a substrate grinding method using the substrate grinding apparatus 1000 described above, the flowchart of which is shown below. Figure 10 As shown, the substrate grinding method includes:

[0085] Step 1: Place the substrate on the ceramic suction cup 210 of the loading stage 200, and the grinding module 300 thins the substrate.

[0086] Step 2: Remove the ground substrate from the loading stage 200 and clean the surface of the ceramic suction cup 210;

[0087] In this step, the turntable 100 is typically equipped with three loading stages 200, which can rotate around its central axis, so that the loading stages 200 pass through the coarse grinding wheel and the fine grinding wheel in sequence to achieve coarse grinding and fine grinding of the substrate; the substrate that has been ground is then moved to the interactive station by the turntable 100, at which time the substrate handling robot removes the ground substrate from the loading stage 200; then, the configured spray assembly sprays fluid toward the surface of the ceramic suction cup 210 to clean the surface of the ceramic suction cup 210;

[0088] Step 3: Compressed gas is introduced into the ceramic suction cup 210 and its associated pipeline to blow upwards and remove contaminants from the ceramic suction cup 210 and its associated pipeline.

[0089] Step four: The drive unit 220 drives the ceramic suction cup to rotate, centrifugally throwing off the contaminants on the surface of the ceramic suction cup 210; Figure 3 The liquid on the surface of the ceramic suction cup 210 is represented by a dashed line. Under centrifugal force, the mixture of contaminants and liquid is thrown out along the edge of the ceramic suction cup 210.

[0090] In step one, after the substrate is loaded onto the ceramic chuck 210, the vacuum generating assembly 240 is turned on to determine whether the substrate is in place based on the detection value of the pressure sensor 250, so as to determine the operation of the subsequent program of the substrate grinding device.

[0091] In the initial stage of substrate in-situ detection, the vacuum generating component 240 is activated to utilize the gas-liquid integration component 230 to treat contaminants remaining in the ceramic suction cup 210 and its associated pipelines. Specifically, contaminants in the ceramic suction cup 210 and its associated pipelines are removed via the first one-way valve 261. Figure 7(As shown) and the second interface 232 enter the interior of the micro chamber 230a. Under the obstruction of the partition 230b, the droplets adhere to the partition 230b and slide to the bottom of the micro chamber 230a. The gas remaining in the ceramic suction cup 210 and its matching pipeline passes through the gap at the bottom of the partition 230b and is discharged from the gas-liquid integrated assembly 230 through the first interface 231.

[0092] This operation effectively prevents contaminants remaining in the ceramic chuck 210 and its associated piping from affecting the vacuum level of the ceramic chuck 210, and effectively avoids misjudgments by the software system. Specifically, during the initial vacuuming stage of substrate in-situ detection, trace amounts of residual moisture in the piping are collected in the micro-chamber 230a of the gas-liquid integrated component 230 to further clean the ceramic chuck 210; this stage lasts for 1-2 seconds, and the pressure may fluctuate slightly within the allowable range; after this cleaning stage, the substrate in-situ detection is determined based on the pressure value of the ceramic chuck 210 to ensure the accuracy of the in-situ detection.

[0093] In step three, firstly, a mixture of compressed gas and cleaning water is introduced into the ceramic suction cup 210 and its associated pipeline. This mixture can encapsulate the particles in the ceramic suction cup 210 and its pipeline to effectively remove residual contaminants. Then, compressed gas is introduced into the ceramic suction cup 210 and its associated pipeline to remove the cleaning water remaining from the above cleaning operation.

[0094] In this invention, if the vacuum level of the connecting pipe of the ceramic suction cup 210 is lower than the set value within a predetermined time, the substrate is placed above the ceramic suction cup 210, and the grinding module 300 is activated to thin the surface of the substrate.

[0095] In the technical solution provided by this invention, a predetermined time and a vacuum level setting are used to determine whether the substrate is in place. In some embodiments, the vacuum level of the ceramic chuck 210 needs to be lower than 3-5 psi within 5-10 seconds to improve the accuracy of substrate in-place detection.

[0096] In this invention, the operation time for introducing compressed gas into the ceramic suction cup 210 is T1, the operation time for driving the ceramic suction cup 210 to rotate is T2, and the two can overlap for an additional operation time T3; wherein, T1 ≥ T2.

[0097] In some embodiments, the operation time for introducing compressed gas into the ceramic suction cup 210 is 5-10 seconds, while the operation time for driving the ceramic suction cup 210 to rotate is 3-5 seconds. Furthermore, the operation time T2 for driving the ceramic suction cup 210 to rotate should be greater than the time required for the loading stage 200 to reach its rated speed, so as to ensure that the ceramic suction cup 210 rotates around its central axis under the drive of the drive unit 220, thereby throwing off the liquid from the surface of the ceramic suction cup 210 under centrifugal force.

[0098] Furthermore, the present invention also provides a substrate grinding method, the flowchart of which is shown below. Figure 11 As shown. A schematic diagram of the substrate grinding apparatus 1000 used in this method is shown. Figure 2 As shown. The loading stage 200 does not require the configuration of the gas-liquid integrated component 230 and its micro chamber 230a. Instead, the external compressed gas-liquid, vacuum generating component 240 and cleaning water are directly connected to the ceramic suction cup 210, which can also achieve internal cleaning of the ceramic suction cup 210.

[0099] The following is combined with Figure 2 and Figure 11 Briefly describe the steps of the substrate grinding method, which include:

[0100] S10, the grinding module 300 is thinned and mounted on the substrate of the ceramic chuck 210;

[0101] Specifically, after the ceramic chuck 210 completes the in-situ detection of the substrate, the grinding wheel at the bottom of the grinding module 300 abuts against the substrate to remove the material from the surface of the substrate according to the process requirements.

[0102] S20, move the ground substrate away from the loading stage 200 and clean the surface of the ceramic suction cup 210;

[0103] In this step, the turntable 100 is typically equipped with three loading stages 200, which can rotate around its central axis, so that the loading stages 200 pass through the coarse grinding wheel and the fine grinding wheel in sequence to achieve coarse grinding and fine grinding of the substrate; the substrate that has been ground is then moved to the interactive station by the turntable 100, at which time the substrate handling robot removes the ground substrate from the loading stage 200; then, the configured spray assembly sprays fluid toward the surface of the ceramic suction cup 210 to clean the surface of the ceramic suction cup 210;

[0104] S30, compressed gas is introduced from the bottom of the ceramic suction cup 210 to blow upwards and remove internal contaminants.

[0105] Further, before step S30, cleaning water is introduced into the ceramic suction cup 210 to clean the interior of the ceramic suction cup 210 and its associated pipes from bottom to top. It should be noted that during the cleaning process of the ceramic suction cup 210 and its associated pipes, a mixture of cleaning water and compressed gas can be introduced to ensure the cleaning effect; to remove the liquid in the ceramic suction cup 210 and its associated pipes, compressed gas should be introduced to finish the process.

[0106] Furthermore, in step S30, the interior of the ceramic suction cup 210 is cleaned in the following manner and repeated multiple times: cleaning water and compressed gas are sequentially introduced into the interior of the ceramic suction cup 210. During the cleaning process, the ceramic suction cup 210 is driven to rotate to centrifugally throw out the contaminants above the ceramic suction cup 210.

[0107] Specifically, when cleaning the interior of the ceramic suction cup 210 and its associated pipes according to the above steps, water and air can be circulated multiple times to ensure the cleaning effect. Finally, compressed gas is introduced to finish cleaning the liquid in the ceramic suction cup 210 and its associated pipes.

[0108] In this invention, contaminants remaining in the ceramic suction cup 210 and its associated pipeline are discharged from the top surface of the ceramic suction cup 210; this improves upon the problems of large space occupation and additional time consumption for quantitative drainage caused by the downward suction scheme, and is conducive to improving the operating efficiency of the substrate grinding device.

[0109] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate grinding apparatus, characterized in that, include: Turntable; The loading stage, located on top of the turntable, is used to support the substrate to be ground. The grinding module, located above the loading stage, is used for grinding the substrate; Vacuum generating assembly; the loading stage includes a ceramic suction cup and a gas-liquid integrated assembly, the gas-liquid integrated assembly being connected to the lower part of the ceramic suction cup; A gas-liquid integrated component, which has a micro-chamber and is equipped with a first interface, a second interface and a third interface communicating with the micro-chamber; The first interface is connected to the vacuum generating component, the second interface is connected to the ceramic suction cup and its supporting pipeline, and the third interface is connected to the external compressed air source. A partition is provided in the micro chamber, which is located between the first interface and the second interface and separates the two. A gap is left between the partition and the bottom surface of the micro chamber for gas to pass through. The first interface and the second interface are alternately connected to the micro chamber. The first interface and the second interface are respectively located on opposite side walls of the micro chamber. The third interface and the first interface are located on the same side wall of the micro chamber. The gas-liquid integrated component is configured as follows: When using the vacuum generator to suction out trace contaminants remaining in the ceramic suction cup and its tubing, the liquid containing particulate matter that is sucked into the micro-chamber through the second interface will adhere to the partition and then fall to the bottom of the micro-chamber under the action of gravity, while the gas flows towards the first interface through the gap at the bottom of the partition and is finally discharged through the first interface. When the external compressed air source is working, the compressed gas enters the micro chamber through the third interface and is introduced into the ceramic suction cup to blow upwards and remove contaminants.

2. The substrate grinding apparatus as described in claim 1, characterized in that, The vacuum generating component and its connecting pipeline are positioned above the gas-liquid integrated component.

3. The substrate grinding apparatus as described in claim 1, characterized in that, The gas-liquid integrated component also includes a fourth interface and a fifth interface. The fourth interface is located below the first interface and is connected to the cleaning water. The fifth interface is located below the second interface and is connected to the ceramic suction cup and its matching pipeline.

4. The substrate grinding apparatus according to claim 1, characterized in that, A first check valve is provided on the outside of the second interface.

5. The substrate grinding apparatus as described in claim 3, characterized in that, The bottom surface of the micro-chamber is sloping and tilted towards the fifth interface.

6. A substrate grinding method, using the substrate grinding apparatus according to any one of claims 1 to 5, characterized in that, include: Step 1: Load the substrate onto the ceramic chuck, and use the grinding module to thin the substrate. Step 2: Remove the ground substrate from the loading stage and clean the surface of the ceramic suction cup; Step 3: Introduce compressed gas into the ceramic suction cup and its associated piping to blow upwards and remove contaminants from the ceramic suction cup and its associated piping; Step 4: Drive the ceramic suction cup to rotate to centrifugally eject contaminants from the surface of the ceramic suction cup.

7. The substrate grinding method as described in claim 6, characterized in that, In step one, after the substrate is loaded onto the ceramic chuck, the vacuum generating component is turned on to determine whether the substrate is in place based on the pressure value of the ceramic chuck. In the initial stage of substrate in-place detection, the vacuum generating component draws out contaminants remaining in the ceramic chuck and its associated pipelines into the micro-chamber.

8. A substrate grinding method, wherein the substrate grinding apparatus includes a rotary table, a loading stage disposed on the rotary table, and a grinding module located above the loading stage, wherein a ceramic chuck of the loading stage is used to support the substrate to be ground; characterized in that, include: S10, the grinding module thins the substrate mounted on the ceramic chuck; S20: Remove the ground substrate from the loading stage and clean the surface of the ceramic suction cup; S30: Compressed gas is introduced from the bottom of the ceramic suction cup to blow upwards and remove internal contaminants.

9. The substrate grinding method as described in claim 8, characterized in that, Before step S30, rinse water is introduced into the ceramic suction cup.

10. The substrate grinding method as described in claim 8, characterized in that, In step S30, the interior of the ceramic suction cup is cleaned in the following manner and repeated multiple times: cleaning water and compressed gas are sequentially introduced into the interior of the ceramic suction cup and the ceramic suction cup is driven to rotate, so as to centrifugally throw out the contaminants above the ceramic suction cup.

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