Probe station pinning correction method and apparatus, probe station, and electronic device

Abstract

The application relates to a probe station pinning correction method and device, a probe station and electronic equipment. The method comprises the following steps: driving a wafer to move in an axial equal-step manner by operating a motor, obtaining a first image of a pinning mark obtained by pinning the wafer on the probe station; judging whether the pinning mark is linearly deviated based on the first image; if yes, determining a linear deviation amount of the pinning mark based on the first image, and determining a linear correction value according to the linear deviation amount; linearly correcting the probe station according to the linear correction value; driving the wafer to move in an axial equal-step manner by operating the motor, obtaining a second image of a pinning mark obtained by pinning the wafer on the linearly corrected probe station; judging whether the pinning mark is angularly deviated based on the second image; if yes, determining an angular deviation amount of the pinning mark based on the second image, and determining an angular correction value according to the angular deviation amount; and angularly correcting the probe station according to the angular correction value. By adopting the application, pinning errors can be reduced, and pinning precision can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a probe station pin correction method, apparatus, probe station, and electronic device. Background Technology

[0002] Testing is a crucial step in semiconductor manufacturing. By screening out defective products through testing, the pass rate can be ensured. Wafer pin piercing test is a testing operation on wafers. A probe station is used to operate pins to pierce the wafer. The pins contact the pads (bonding joints) on the wafer's die to transmit electrical signals.

[0003] During the wafer pinning process, due to the combined effects of temperature on the grating ruler, panel, etc., and after the probe station is opened or transported, the pinning marks of the same row of dies may have regular linear offsets or a certain angle of deflection along the X-axis or Y-axis during actual pinning, resulting in pinning errors. Summary of the Invention

[0004] Therefore, it is necessary to provide a probe station needle correction method, device, probe station, and electronic equipment that can improve needle insertion accuracy in response to the above-mentioned technical problems.

[0005] A method for correcting needle insertion on a probe station includes:

[0006] The operating motor drives the wafer to perform axial equal-step motion at fixed intervals of a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer on the probe stage;

[0007] Based on the first image, determine whether the needle mark has undergone linear displacement;

[0008] If a linear offset occurs, the linear offset amount of the needle mark is determined based on the first image, and a linear correction value is determined based on the linear offset amount;

[0009] The probe station is linearly corrected according to the linear correction value;

[0010] The operating motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0011] Based on the second image, determine whether the needle marks have undergone angular displacement;

[0012] If an angular offset occurs, the angular offset of the needle mark is determined based on the second image, and an angle correction value is determined based on the angular offset.

[0013] The probe station is angled according to the angle correction value.

[0014] A probe station needle correction device, comprising:

[0015] The first image acquisition module is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and acquire the first image of the needle marks obtained by piercing the wafer on the probe stage.

[0016] A linear offset analysis module is used to determine, based on the first image, whether the needle mark has undergone linear offset.

[0017] A linear correction calculation module is used to determine the linear offset of the needle mark based on the first image when a linear offset occurs, and to determine a linear correction value based on the linear offset.

[0018] A linear correction module is used to linearly correct the probe station according to the linear correction value;

[0019] The second image acquisition module is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and to acquire a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0020] An angle offset analysis module is used to determine, based on the second image, whether the needle mark has undergone an angle offset.

[0021] An angle correction calculation module is used to determine the angle offset of the needle mark based on the second image when an angle offset occurs, and to determine the angle correction value based on the angle offset.

[0022] An angle correction module is used to correct the angle of the probe station according to the angle correction value.

[0023] A probe station, wherein the probe station is used for needle correction using the above-mentioned probe station needle correction method.

[0024] An electronic device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0025] The operating motor drives the wafer to perform axial equal-step motion at fixed intervals of a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer on the probe stage;

[0026] Based on the first image, determine whether the needle mark has undergone linear displacement;

[0027] If a linear offset occurs, the linear offset amount of the needle mark is determined based on the first image, and a linear correction value is determined based on the linear offset amount;

[0028] The probe station is linearly corrected according to the linear correction value;

[0029] The operating motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0030] Based on the second image, determine whether the needle marks have undergone angular displacement;

[0031] If an angular offset occurs, the angular offset of the needle mark is determined based on the second image, and an angle correction value is determined based on the angular offset.

[0032] The probe station is angled according to the angle correction value.

[0033] The aforementioned probe station pin insertion correction method, apparatus, probe station, and electronic device analyze a first image of the pin marks obtained from wafer pin insertion on the probe station. When linear offset occurs in the pin marks, the linear offset amount is determined based on the first image, a linear correction value is determined based on the linear offset amount, and the probe station is linearly corrected based on the linear correction value, thereby reducing the actual offset in the linear direction of pin insertion. After linear correction, a second image of the pin marks obtained from wafer pin insertion on the probe station is analyzed to accurately analyze whether angular offset occurs in the pin marks. When angular offset occurs in the pin marks, the angular offset amount is determined based on the second image, an angular correction value is determined based on the angular offset amount, and the probe station is angularly corrected based on the angular correction value, thereby reducing the actual angular offset of pin insertion. In this way, pin mark offset generated during the actual pin insertion process can be reduced, pin insertion error can be reduced, and pin insertion accuracy can be improved. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a flowchart illustrating a probe station needle correction method in one embodiment;

[0036] Figure 2(a) shows the needle mark image of the linear offset of the X-axis caused by the needle during the movement of the wafer along the X-axis by the motor;

[0037] Figure 2(b) shows the needle marks caused by the linear displacement of the Y-axis during the movement of the wafer along the Y-axis by the motor;

[0038] Figure 3 Here is a diagram showing the orientation of the X and Y axes in one embodiment;

[0039] Figure 4(a) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction along the X-axis, the linear offset direction of the needle mark is the positive direction of the X-axis.

[0040] Figure 4(b) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction along the X-axis, the linear offset direction of the needle mark is in the negative direction of the X-axis.

[0041] Figure 5(a) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction of the Y-axis, the linear offset direction of the needle mark is the positive direction of the Y-axis.

[0042] Figure 5(b) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction along the Y-axis, the linear offset direction of the needle mark is in the negative direction of the Y-axis.

[0043] Figure 6(a) shows the needle mark image of the X-axis angle shift caused by the needle when the motor drives the wafer to move along the X-axis;

[0044] Figure 6(b) shows the needle mark image of the Y-axis angle shift caused by the needle when the motor drives the wafer to move along the Y-axis;

[0045] Figure 7(a) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction of the X-axis, the offset direction of the needle mark is in the negative direction of the Y-axis.

[0046] Figure 7(b) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction of the X-axis, the offset direction of the needle mark is the positive direction of the Y-axis.

[0047] Figure 8(a) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction of the Y-axis, the offset direction of the needle mark is the positive direction of the X-axis.

[0048] Figure 8(b) is a schematic diagram showing that when the motor drives the wafer to move in the positive direction of the Y-axis, the offset direction of the needle mark is in the negative direction of the X-axis.

[0049] Figure 9 This is a structural block diagram of a probe station needle correction device in one embodiment. Detailed Implementation

[0050] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0052] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0053] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is transmission of electrical signals or data between the connected objects.

[0054] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0055] In one embodiment, a probe station pin insertion correction method is provided, which can be applied to electronic devices. The electronic device can be a terminal connected to the probe station, such as a computer, PDA, or microprocessor, and can act as a host computer for the probe station. Taking its application to an electronic device as an example, refer to... Figure 1 The method includes the following steps S110 to S180.

[0056] S110: The operating motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer on the probe stage.

[0057] Prepare a clean and intact wafer and place it in the chuck of the probe station. The probe station motors include an X-axis motor and a Y-axis motor, which drive the chuck carrying the wafer to move, thereby moving the wafer. The electronic equipment controls the motors to move axially at equal intervals with a fixed number of die bits, thereby moving the wafer axially at equal intervals. During the movement, the probe station's pins are used to prick the wafer, and the image acquisition device captures images of the pin marks.

[0058] The axial equal-step motion includes equal-step motion along the X-axis and equal-step motion along the Y-axis; the first image may include a first image of the needle marks obtained when the motor drives the wafer to move at equal steps along the X-axis and pierces the wafer on the probe stage, and / or a first image of the needle marks obtained when the motor drives the wafer to move at equal steps along the Y-axis and pierces the wafer on the probe stage.

[0059] S120: Based on the first image, determine whether the needle mark has undergone linear displacement.

[0060] Linear offset refers to the offset that occurs along the direction of the wafer's motion axis, including X-axis linear offset and / or Y-axis linear offset; wherein, X-axis linear offset refers to the offset of the needle mark along the X-axis when the wafer's motion axis is along the X-axis, and Y-axis linear offset refers to the offset of the needle mark along the Y-axis when the wafer's motion axis is along the Y-axis.

[0061] S130: If a linear offset occurs, determine the linear offset of the needle mark based on the first image, and determine the linear correction value based on the linear offset.

[0062] If X-axis linear misalignment occurs, the linear offset of the pin mark is determined based on a first image acquired during equal-step movement of the motor and wafer along the X-axis. A linear correction value is then determined based on this linear offset. If Y-axis linear misalignment occurs, the linear offset of the pin mark is determined based on a first image acquired during equal-step movement of the motor and wafer along the Y-axis. A linear correction value is then determined based on this linear offset.

[0063] S140: Perform linear correction on the probe station based on the linear correction value.

[0064] Specifically, the position of the probe station motor can be adjusted based on the linear correction value to perform linear correction and thus reduce linear offset. For example, in the case of X-axis linear offset, the X-axis motor position is adjusted according to the linear correction value used to correct the X-axis linear offset; in the case of Y-axis linear offset, the Y-axis motor position is adjusted according to the linear correction value used to correct the Y-axis linear offset.

[0065] S150: The operating motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0066] After linear correction, the motor is controlled again to drive the wafer in axial equal-step motion, the probe holders on the probe station are operated to prick the wafer, and an image acquisition device is used to capture an image of the prick marks, resulting in a second image. The second image may include a second image of the prick marks obtained when the motor drives the wafer in equal-step motion along the X-axis and pricks the wafer on the probe station after linear correction, and / or a second image of the prick marks obtained when the motor drives the wafer in equal-step motion along the Y-axis and pricks the wafer on the probe station after linear correction.

[0067] S160: Based on the second image, determine whether the needle mark has shifted at an angle.

[0068] Angular offset refers to a deviation from the direction of the wafer's motion axis, including X-axis angular offset and / or Y-axis angular offset. Specifically, X-axis angular offset refers to the offset of the needle mark in the Y-axis direction when the wafer's motion axis is along the X-axis, and Y-axis angular offset refers to the offset of the needle mark in the X-axis direction when the wafer's motion axis is along the Y-axis. Specifically, based on a second image acquired under equal-step motion of the motor and wafer along the X-axis, it is determined whether the needle mark has undergone X-axis angular offset; similarly, based on a second image acquired under equal-step motion of the motor and wafer along the Y-axis, it is determined whether the needle mark has undergone Y-axis angular offset.

[0069] S170: If an angular offset occurs, determine the angular offset of the needle mark based on the second image, and determine the angular correction value based on the angular offset.

[0070] If an X-axis angular offset occurs, the angular offset of the pin mark is determined based on a second image acquired during equal-step movement of the motor and wafer along the X-axis direction. An angle correction value is then determined based on this angular offset. If a Y-axis angular offset occurs, the angular offset of the pin mark is determined based on a second image acquired during equal-step movement of the motor and wafer along the Y-axis direction. An angle correction value is then determined based on this angular offset.

[0071] S180: Adjust the angle of the probe station according to the angle correction value.

[0072] Specifically, the position of the probe station motor can be adjusted according to the angle correction value to correct the angle and reduce the angle offset.

[0073] The aforementioned probe station pin correction method analyzes a first image of the pin marks obtained from wafer pinning on the probe station. When linear offset occurs in the pin marks, the method determines the linear offset amount based on the first image, determines a linear correction value based on the linear offset amount, and then performs linear correction on the probe station based on the linear correction value, thereby reducing the actual offset in the linear direction of pinning. After linear correction, the method analyzes a second image of the pin marks obtained from wafer pinning on the probe station to accurately analyze whether angular offset occurs in the pin marks. When angular offset occurs in the pin marks, the method determines the angular offset amount based on the second image, determines an angular correction value based on the angular offset amount, and then performs angular correction on the probe station based on the angular correction value, thereby reducing the angular offset of actual pinning. In this way, the method can reduce the pin mark offset generated during the actual pinning process, reduce pinning errors, and thus improve pinning accuracy.

[0074] In one embodiment, step S110 is preceded by: performing orthogonal compensation on the XY axes of the probe station.

[0075] Specifically, the steps for orthogonal compensation of the XY axis of the probe station may include: selecting at least two points along the Y-axis / X-axis direction on the wafer on the probe station, fitting the calibrated points into a straight line; selecting two coordinate points on the generated straight line, calculating the angle between the straight line and the X-axis / Y-axis direction based on the coordinates of the coordinate points; calculating the difference between the angle and 90 degrees, and correcting the XY axis angle of the probe station based on the difference.

[0076] For example, select a clean and intact wafer and flatten it. Select x coordinate points along the Y direction on the wafer and fit a straight line based on the x points. Select two more coordinates (x1, y1) and (x2, y2) on this generated straight line. The angle between this line and the X-axis is β: β = arctan((y2-y1) / (x2-x1)). Calculate the difference between angle β and 90 degrees, and perform a certain angle compensation correction based on the difference to complete the cross-orthogonal compensation of the XY axis. By performing orthogonal compensation to correct the XY axis angle before step S110, the insufficient orthogonality of the XY axis due to long-term use of the probe station is avoided, and the problem of needle insertion error caused by the XY axis angle error is solved.

[0077] In one embodiment, step S110 may include step (a1) and step (a2).

[0078] Step (a1): The operating motor drives the wafer to move at equal intervals along the X-axis by a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer on the probe stage along the X-axis.

[0079] Step (a2): The operating motor drives the wafer to move at equal intervals along the Y-axis by a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer moving along the Y-axis on the probe stage.

[0080] In one embodiment, step S120 includes step (b1) and step (b2).

[0081] Step (b1): When the motor drives the wafer to move along the X-axis, if the needle mark in the first image is offset in the X-axis direction, then the needle mark is linearly offset along the X-axis.

[0082] Step (b2): When the motor drives the wafer to move along the Y-axis, if the needle mark in the first image is offset in the Y-axis direction, then the needle mark undergoes a linear offset along the Y-axis.

[0083] Specifically, when the motor drives the wafer to move along the X-axis, based on the first image acquired during the movement of the motor and wafer along the X-axis, it is determined whether the pin mark has shifted in the X-axis direction. If so, the pin mark has undergone a linear shift along the X-axis. When the motor drives the wafer to move along the Y-axis, based on the first image acquired during the movement of the motor and wafer along the Y-axis, it is determined whether the pin mark has shifted in the Y-axis direction. If so, the pin mark has undergone a linear shift along the Y-axis. In this way, by analyzing whether linear shifts occur along the X-axis and Y-axis during movement in different directions, the linear shift situation can be accurately analyzed.

[0084] The execution order of steps (a1), (a2), (b1), and (b2) can be set according to actual needs. For example, after executing steps (a1) and (b1), first execute steps S130 and S140, then return to execute step (a1). If the needle mark still has a linear offset on the X-axis, then fine-tune the existing linear correction value for linear correction and return to step (a1), or execute steps S130 and S140 and then return to step (a1). If the needle mark does not have a linear offset on the X-axis, then execute steps (a2), (b2), S130, and S140, then return to execute step (a2). If the needle mark still has a linear offset on the Y-axis, then fine-tune the existing linear correction value for linear correction and return to step (a2), or execute steps S130 and S140 and then return to step (a2). If the needle mark does not have a linear offset on the Y-axis, then execute step S150. Thus, repeating this process multiple times ensures that there is no linear offset in the X-axis and Y-axis directions of the needle mark, eliminating linear offset during the actual needle insertion process and improving needle insertion accuracy. It is understood that in other embodiments, steps (a1), (a2), (b1), and (b2) can be executed in other orders; for example, steps (b1) and (b2) can be executed after steps (a1) and (a2).

[0085] In one embodiment, in step S130, the linear offset of the needle mark is determined based on the first image, and a linear correction value is determined based on the linear offset, including steps (c1) to (c5).

[0086] Step (c1): Obtain the radius of the wafer.

[0087] Step (c2): Select the linear offset needle point of the needle mark in the first image, and determine the linear offset of the linear offset needle point relative to the reference of the Pad where the linear offset needle point is located in the axial direction.

[0088] The reference point of the Pad where the linear offset pin point is located is the edge of the Pad closest to the center of the wafer chuck. For example, the pin mark image of the linear offset of the X-axis caused by the pin during the movement of the wafer along the X-axis by the motor is shown in Figure 2(a), and the pin mark image of the linear offset of the Y-axis caused by the pin during the movement of the wafer along the Y-axis by the motor is shown in Figure 2(b). The marked point represents the selected linear offset pin point, and 'a' is the linear offset amount, which is equal to the distance between the linear offset pin point and the reference point of the Pad in the X-axis direction.

[0089] Step (c3): Determine the sign of the linear offset.

[0090] Step (c4): Determine the distance from the reference point of the linear offset pin on the Pad to the center of the wafer chuck.

[0091] As shown in Figures 2(a) and 2(b), b is the distance from the reference of the Pad where the linear offset pin is located to the center of the wafer chuck.

[0092] Step (c5): Calculate the linear correction value based on the linear offset, distance value, and radius.

[0093] In one embodiment, step (c3) includes: if the direction of wafer movement and the direction of needle mark offset are in the same direction, i.e. both are positive or both are negative, then the linear offset is negative; if the direction of needle mark offset is opposite to the direction of wafer movement, i.e. the direction of wafer movement is positive and the direction of needle mark offset is negative, or the direction of wafer movement is negative and the direction of needle mark offset is positive, then the linear offset is positive.

[0094] The sign of the wafer's movement direction can be predetermined. If the wafer's movement direction and the offset direction of the pin marks are in the same direction, it indicates that the pin mark offset is too large, and the pin mark spacing needs to be reduced to correct the offset. In this case, the linear offset is defined as a negative value. If the wafer's movement direction and the offset direction of the pin marks are in opposite directions, it indicates that the pin mark offset is too small, and the pin mark spacing needs to be increased to correct the offset. In this case, the linear offset is defined as a positive value. Thus, by analyzing the wafer's movement direction and the offset direction of the pin marks, the sign of the linear offset can be accurately determined, thereby determining the sign of the calculated linear correction value and reflecting whether the linear compensation required for linear correction should be increased or decreased.

[0095] For example, the positive and negative settings of the wafer movement direction are as follows: Figure 3 As shown, in the X-axis direction, rightward is positive and leftward is negative; in the Y-axis direction, upward is negative and downward is positive. When the motor drives the wafer to move in the positive X-axis direction, if the offset direction of the needle mark is in the positive X-axis direction, as shown in Figure 4(a), then the linear offset a < 0; if the offset direction of the needle mark is in the negative X-axis direction, as shown in Figure 4(b), then the linear offset a > 0. When the motor drives the wafer to move in the positive Y-axis direction, if the offset direction of the needle mark is in the positive Y-axis direction, as shown in Figure 5(a), then the linear offset a < 0; if the offset direction of the needle mark is in the negative Y-axis direction, as shown in Figure 5(b), then the linear offset a > 0.

[0096] In one embodiment, step (c5) includes:

[0097] Value = a*r / 1000*b; (Formula 1)

[0098] In the formula, a is the linear offset, b is the distance value, r is the radius, and Value is the linear correction value. Formula 1 can accurately calculate the linear correction value, which can be used to accurately correct the probe station and compensate for the linear offset, thereby eliminating needle insertion errors and improving needle insertion accuracy.

[0099] In one embodiment, step S150 includes step (d1) and step (d2).

[0100] Step (d1): The operating motor drives the wafer to move at equal steps along the X-axis at fixed intervals of a fixed number of chips, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0101] Step (d2): The operating motor drives the wafer to move at equal intervals along the Y-axis by a fixed number of chips, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0102] In one embodiment, step S160 includes step (e1) and step (e2).

[0103] Step (e1): When the motor drives the wafer to move along the X-axis, if the needle mark in the second image is offset in the Y-axis direction, then the needle mark will be offset by the X-axis angle.

[0104] Step (e2): When the motor drives the wafer to move along the Y-axis, if the needle mark in the second image is offset in the X-axis direction, then the needle mark will be offset by the Y-axis angle.

[0105] Specifically, based on the second image acquired while the motor and wafer are moving along the X-axis, it is determined whether the needle mark has shifted in the Y-axis direction. If so, the needle mark has undergone an X-axis angular shift. Similarly, based on the second image acquired while the motor and wafer are moving along the Y-axis, it is determined whether the needle mark has shifted in the X-axis direction. If so, the needle mark has undergone a Y-axis angular shift. In this way, by analyzing whether X-axis and Y-axis angular shifts occur during movement in different directions along the X and Y axes, the situation of angular shifts can be accurately analyzed.

[0106] The execution order of steps (d1), (d2), (e1), and (e2) can be set according to actual needs. For example, after executing steps (d1) and (e1), first execute steps S170 and S180, then return to execute step (d1). If the needle mark still has an X-axis angle offset, then fine-tune the existing angle correction value to correct the angle and return to step (d1), or execute steps S170 and S180 and then return to step (d1). If the needle mark does not have an X-axis angle offset, then execute steps (d2), (e2), S170, and S180, then return to execute step (d2). If the needle mark still has a Y-axis angle offset, then fine-tune the existing angle correction value to correct the angle and then return to step (d2), or execute steps S170 and S180 and then return to step (d2), until the needle mark does not have a Y-axis angle offset. Thus, repeating this process multiple times ensures that there is no X-axis or Y-axis angular deviation in the needle marks, eliminating angular deviations during the actual needle insertion process and improving needle insertion accuracy. It is understood that in other embodiments, steps (d1), (d2), (e1), and (e2) can be executed in a different order; for example, steps (e1) and (e2) can be executed after steps (d1) and (d2).

[0107] In one embodiment, in step S170, the angle offset of the needle mark is determined based on the second image, and the angle correction value is determined based on the angle offset, including steps (f1) to (f4).

[0108] Step (f1): Select the reference needle point and angle offset needle point of the needle mark in the second image.

[0109] Step (f2): Determine the first axial distance value of the reference pin point and the angle offset pin point in the wafer movement direction, and the second axial distance value of the reference pin point and the angle offset pin point in the pin mark offset direction.

[0110] In this system, the wafer movement direction is perpendicular to the pin mark offset direction. For example, if the motor drives the wafer to move along the X-axis, then when an X-axis angular offset occurs, the pin mark offset direction is the Y-axis direction; if the motor drives the wafer to move along the Y-axis, then when a Y-axis angular offset occurs, the pin mark offset direction is the X-axis direction. The distance between the reference pin point and the angular offset pin point in the wafer movement direction is measured to obtain the first axial distance value. The distance between the reference pin point and the angular offset pin point in the pin mark offset direction is measured to obtain the second axial distance value.

[0111] Step (f3): Determine the sign of the second axial distance value.

[0112] Step (f4): Calculate the angle correction value based on the first axial distance value and the second axial distance value.

[0113] For example, the needle mark image of the X-axis angle offset caused by the needle when the motor drives the wafer to move along the X-axis is shown in Figure 6(a), and the needle mark image of the Y-axis angle offset caused by the needle when the motor drives the wafer to move along the Y-axis is shown in Figure 6(b). d is the first axial distance value and c is the second axial distance value; the angle correction value can be calculated based on c and d.

[0114] In one embodiment, step (f3) includes: when the pin mark undergoes an X-axis angular shift, if both the wafer's movement direction and the pin mark's shift direction are positive or both are negative, the angular shift is positive; if the wafer's movement direction is positive and the pin mark's shift direction is negative, or if the wafer's movement direction is negative and the pin mark's shift direction is positive, the angular shift is negative. When the pin mark undergoes a Y-axis angular shift, if both the wafer's movement direction and the pin mark's shift direction are positive or both are negative, the angular shift is negative; if the wafer's movement direction is positive and the pin mark's shift direction is negative, or if the wafer's movement direction is negative and the pin mark's shift direction is positive, the angular shift is positive.

[0115] By analyzing the direction of wafer movement and the offset direction of the needle marks, the sign of the second axial distance value can be accurately determined, thereby obtaining the sign of the calculated angle correction value, reflecting whether the angle compensation required for angle correction is increased or decreased.

[0116] For example, the positive and negative settings of the wafer movement direction are as follows: Figure 3 As shown in Figure 7(a), when the motor drives the wafer to move in the positive direction along the X-axis, if the offset direction of the pin mark is in the negative direction of the Y-axis, as shown in Figure 7(b), then the second axial distance value c < 0, which is a negative value; if the offset direction of the pin mark is in the positive direction of the Y-axis, as shown in Figure 7(b), then the second axial distance value c > 0, which is a positive value. Similarly, when the motor drives the wafer to move in the positive direction along the Y-axis, if the offset direction of the pin mark is in the positive direction of the X-axis, as shown in Figure 8(a), then the second axial distance value c < 0, which is a negative value; if the offset direction of the pin mark is in the negative direction of the X-axis, as shown in Figure 8(b), then the second axial distance value c > 0, which is a positive value.

[0117] In one embodiment, step (f4) includes:

[0118] S = arctan(c / d); (Formula 2)

[0119] In the formula, c is the second axial distance value, d is the first axial distance value, and S is the angle correction value. Formula 2 can be used to accurately calculate the angle correction value. Based on this angle correction value, the probe station can be accurately corrected and the angle offset can be compensated, thereby eliminating needle insertion errors and improving needle insertion accuracy.

[0120] It should be understood that, although Figure 1 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0121] In one embodiment, such as Figure 9 As shown, a probe station needle correction device is provided, including a first image acquisition module 910, a linear offset analysis module 920, a linear correction calculation module 930, a linear correction module 940, a second image acquisition module 950, an angle offset analysis module 960, an angle correction calculation module 970, and an angle correction module 980.

[0122] The first image acquisition module 910 is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and acquire the first image of the needle marks obtained by piercing the wafer on the probe stage.

[0123] The linear offset analysis module 920 is used to determine whether the needle mark has undergone linear offset based on the first image.

[0124] The linear correction calculation module 930 is used to determine the linear offset of the needle mark based on the first image when a linear offset occurs, and to determine the linear correction value based on the linear offset.

[0125] The linear correction module 940 is used to perform linear correction on the probe station based on the linear correction value.

[0126] The second image acquisition module 950 is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and to acquire a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction.

[0127] The angle offset analysis module 960 is used to determine whether the needle mark has undergone angle offset based on the second image.

[0128] The angle correction calculation module 970 is used to determine the angle offset of the needle mark based on the second image when an angle offset occurs, and to determine the angle correction value based on the angle offset.

[0129] The angle correction module 980 is used to correct the angle of the probe station according to the angle correction value.

[0130] The aforementioned probe station pin correction device analyzes a first image of the pin marks obtained from wafer pinning on the probe station. When a linear offset occurs in the pin mark, it determines the linear offset amount based on the first image, determines a linear correction value based on the linear offset amount, and then performs linear correction on the probe station based on the linear correction value, thereby reducing the actual offset in the linear direction of the pinning. After linear correction, it analyzes a second image of the pin marks obtained from wafer pinning on the probe station to accurately analyze whether the pin mark has an angular offset. When an angular offset occurs in the pin mark, it determines the angular offset amount based on the second image, determines an angular correction value based on the angular offset amount, and then performs angular correction on the probe station based on the angular correction value, thereby reducing the actual angular offset of the pinning. In this way, it can reduce the pin mark offset generated during the actual pinning process, reduce pinning errors, and thus improve pinning accuracy.

[0131] Specific limitations regarding the probe station pin correction device can be found in the limitations of the probe station pin correction method described above, and will not be repeated here. Each module in the aforementioned probe station pin correction device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in the electronic device in hardware form, or stored in the memory of the electronic device in software form, so that the processor can call and execute the operations corresponding to each module. It should be noted that the module division in this embodiment is illustrative and only represents a logical functional division; other division methods may be used in actual implementation.

[0132] In one embodiment, a probe station is provided, wherein the probe station is used for needle correction using the probe station needle correction method described in the above embodiments.

[0133] The probe station described above can implement the probe station needle correction method in the above embodiments. Similarly, it can reduce the needle mark deviation generated during the actual needle insertion process, reduce needle insertion error, and thus improve needle insertion accuracy.

[0134] In one embodiment, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0135] When the processor of the aforementioned electronic device executes the computer program stored in the memory, it can implement the steps in the above-mentioned method embodiments. Similarly, it can reduce the needle mark deviation generated during the actual needle insertion process, reduce needle insertion error, and thus improve needle insertion accuracy.

[0136] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0137] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0138] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0139] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for correcting needle insertion on a probe station, characterized in that, include: The operating motor drives the wafer to perform axial equal-step motion at fixed intervals of a fixed number of chips, and obtains the first image of the needle marks obtained by piercing the wafer on the probe stage; Based on the first image, determine whether the needle mark has undergone linear displacement; If a linear offset occurs, the linear offset amount of the needle mark is determined based on the first image, and a linear correction value is determined based on the linear offset amount; The probe station is linearly corrected according to the linear correction value; The operating motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and obtains a second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction. Based on the second image, determine whether the needle marks have undergone angular displacement; If an angular offset occurs, the angular offset of the needle mark is determined based on the second image, and an angle correction value is determined based on the angular offset. The probe station is angled according to the angle correction value; The step of determining the linear offset of the needle mark based on the first image, and determining the linear correction value based on the linear offset, includes: Obtain the radius of the wafer; In the first image, select the linear offset needle point of the needle mark, and determine the linear offset of the linear offset needle point relative to the reference of the Pad where the linear offset needle point is located in the axial direction. Determine the sign of the linear offset; Determine the distance from the reference point of the linear offset pin on the Pad to the center of the wafer chuck; The linear correction value is calculated based on the linear offset, the distance value, and the radius; Wherein, the reference of the Pad where the linear offset pin point is located is the edge of the Pad close to the center of the wafer chuck; The step of calculating the linear correction value based on the linear offset, the distance value, and the radius includes: Value = a * r / 1000 * b; In the formula, a is the linear offset, b is the distance value, r is the radius, and Value is the linear correction value.

2. The method according to claim 1, characterized in that, The step of determining whether the needle mark has undergone linear displacement based on the first image includes: When the motor drives the wafer to move along the X-axis, if the needle mark in the first image shifts in the X-axis direction, then the needle mark undergoes a linear shift along the X-axis. When the motor drives the wafer to move along the Y-axis, if the needle mark in the first image shifts in the Y-axis direction, then the needle mark undergoes a linear shift along the Y-axis.

3. The method according to claim 1, characterized in that, Determining the sign of the linear offset includes: If the direction of movement of the wafer and the direction of offset of the needle mark are both positive or both negative, then the linear offset is negative. If the wafer's movement direction is positive and the pin mark's offset direction is negative, or if the wafer's movement direction is negative and the pin mark's offset direction is positive, then the linear offset is a positive value.

4. The method according to claim 1, characterized in that, The step of determining whether the needle mark has shifted in angle based on the second image includes: When the motor drives the wafer to move along the X-axis, if the needle mark in the second image shifts in the Y-axis direction, then the needle mark will shift in the X-axis angle. When the motor drives the wafer to move along the Y-axis, if the needle mark in the second image shifts in the X-axis direction, then the needle mark will shift in the Y-axis angle.

5. The method according to claim 4, characterized in that, The step of determining the angle offset of the needle mark based on the second image, and determining the angle correction value based on the angle offset, includes: In the second image, select the reference needle point and the angle offset needle point of the needle mark; Determine a first axial distance between the reference pin point and the angle offset pin point in the wafer movement direction, and a second axial distance between the reference pin point and the angle offset pin point in the pin mark offset direction; the wafer movement direction is perpendicular to the pin mark offset direction; Determine the sign of the second axial distance value; The angle correction value is calculated based on the first axial distance value and the second axial distance value.

6. The method according to claim 5, characterized in that, The determination of the positive or negative sign of the second axial distance value includes: When the needle mark shifts at an X-axis angle, if the movement direction of the wafer and the shift direction of the needle mark are both positive or both negative, then the angle shift is a positive value. If the direction of movement of the wafer is positive and the direction of offset of the pin mark is negative, or if the direction of movement of the wafer is negative and the direction of offset of the pin mark is positive, then the angular offset is negative. When the needle mark undergoes a Y-axis angular shift, if the movement direction of the wafer and the shift direction of the needle mark are both positive or both negative, then the angular shift amount is negative. If the direction of movement of the wafer is positive and the direction of offset of the pin mark is negative, or if the direction of movement of the wafer is negative and the direction of offset of the pin mark is positive, then the angular offset is a positive value.

7. The method according to claim 5 or 6, characterized in that, The step of calculating the angle correction value based on the first axial distance value and the second axial distance value includes: S = arctan(c / d); In the formula, c is the second axial distance value, d is the first axial distance value, and S is the angle correction value.

8. The method according to claim 1, characterized in that, Before the operation motor drives the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and before acquiring the first image of the needle marks obtained by piercing the wafer on the probe stage, the method further includes: The XY axes of the probe station are orthogonally compensated.

9. A probe station needle correction device, characterized in that, include: The first image acquisition module is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of chips, and acquire the first image of the needle marks obtained by piercing the wafer on the probe stage. A linear offset analysis module is used to determine, based on the first image, whether the needle mark has undergone linear offset. A linear correction calculation module is used to obtain the radius of the wafer when a linear offset occurs; select the linear offset pin point of the pin mark in the first image; determine the linear offset of the linear offset pin point relative to the reference of the Pad where the linear offset pin point is located in the axial direction; and determine the positive or negative sign of the linear offset. Determine the distance from the reference point of the linear offset pin on the Pad to the center of the wafer chuck; The linear correction value is calculated according to Value=a*r / 1000*b, where a is the linear offset, b is the distance value, r is the radius, and Value is the linear correction value; wherein, the reference of the Pad where the linear offset pin point is located is the edge of the Pad close to the center of the wafer chuck. A linear correction module is used to linearly correct the probe station according to the linear correction value; The second image acquisition module is used to operate the motor to drive the wafer to perform axial equal-step movement at fixed intervals of a fixed number of dies, and to acquire the second image of the needle marks obtained by piercing the wafer on the probe stage after linear correction. An angle offset analysis module is used to determine, based on the second image, whether the needle mark has undergone an angle offset. An angle correction calculation module is used to determine the angle offset of the needle mark based on the second image when an angle offset occurs, and to determine the angle correction value based on the angle offset. An angle correction module is used to correct the angle of the probe station according to the angle correction value.

10. A probe station, characterized in that, The probe station is corrected by the probe station needle correction method according to any one of claims 1 to 8.

11. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

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