A hand test chip with a self-test three-temperature cavity

Abstract

The application relates to a same-measuring three-temperature cavity for manually testing a chip, which comprises a test box body and further comprises: a first partition plate and a second partition plate, which are respectively fixed at the upper and lower ends of the inside of the test box body; and a multi-temperature testing mechanism, which penetrates the first partition plate and the second partition plate, and comprises a rotating rod, the outer side of the rotating rod penetrates the first partition plate and the second partition plate respectively. The application can effectively discharge and exhaust the airflow in the cavity, and the cavity inside will not be squeezed and damaged due to the different air pressures at the inlet and outlet positions. The fan design at the top end of the application can effectively make the temperatures at all positions in the cavity nearly consistent, so as to ensure the accuracy of the test results. Meanwhile, the problem of ice formation at local positions in the cavity will not occur, and the ice block will not melt into water drops to drop on the test module and cause damage. In addition, since a plurality of fans are arranged on the rotating rod, the wind speeds of the plurality of fans can be kept consistent in the rotating process of the rotating rod, so that the test accuracy is improved.

Description

Technical Field

[0001] This invention relates to the field of multi-temperature chip testing, specifically to a three-temperature chamber for manual chip testing. Background Technology

[0002] Currently, most existing high and low temperature testing chambers perform individual tests, meaning they can only test at one temperature. It's difficult to achieve near-uniform temperatures across all locations within the chamber, leading to inaccurate test results due to significant temperature differences. Furthermore, individual chamber testing is inefficient, and simultaneous testing is not possible to improve efficiency. The large temperature differences within the chamber also make some areas prone to icing during low-temperature production. De-icing after testing is labor-intensive and inconvenient, and water droplets from melting ice entering the test module can easily cause short circuits or irreversible damage. To address this, a three-temperature chamber for manual chip testing is proposed. This chamber allows for simultaneous high and low temperature testing in three separate chambers. The number of test modules within each chamber can be increased by the designer, significantly improving testing efficiency. Simultaneously, a fan at the top of the chamber maintains near-uniform temperatures across all locations, providing a reliable testing environment for accurate results. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies and meet practical needs by providing a simultaneous three-temperature chamber for manual chip testing. This addresses the problem that most existing high and low temperature testing chambers perform individual tests, meaning they can only be tested at one temperature. Furthermore, it is difficult to achieve near-uniform temperatures across all locations within the chamber, leading to inaccurate test results due to significant temperature differences. Individual testing chambers also have low efficiency and cannot perform simultaneous testing to improve overall efficiency. Moreover, the large temperature differences within the chamber make some areas prone to icing during low-temperature production. De-icing after testing is labor-intensive and inconvenient, and water droplets from melting ice entering the testing module can easily cause short circuits or irreversible damage.

[0004] To achieve the objectives of this invention, the technical solution adopted is as follows: A three-temperature chamber for manual chip testing is designed, comprising a test chamber and further comprising:

[0005] The first and second partitions are fixed to the upper and lower ends of the inside of the test chamber, respectively;

[0006] The multi-temperature testing mechanism runs through the first and second partitions. It can not only perform three-temperature tests on multiple chips simultaneously, but also maintain consistent wind speed and position during the three-temperature test process, thus improving the accuracy of the test. The multi-temperature testing mechanism includes a rotating rod, through which the first and second partitions pass respectively. Three fan blades are installed on the outside of the rotating rod, and the three fan blades are located in the three cavities formed by the first and second partitions.

[0007] The rotating rod has three rotating disks extending through its outer side, and the top of each of the three rotating disks has multiple placement slots. The three rotating disks are located in the three cavities formed by the first partition and the second partition.

[0008] It should be noted that the design incorporates three independent chambers into a single high and low temperature chamber: an upper ambient temperature chamber, a middle high temperature chamber, and a lower low temperature chamber. Each chamber can accommodate multiple test modules as needed. Each chamber is equipped with a fan at its top to ensure a nearly uniform temperature throughout the chamber. The left and right sides of each chamber have inlet and outlet temperature channels, used to expel and discharge heated gas. When a test module containing the chip under test is placed in the chamber, gas is introduced through the inlet temperature channel, the fan rotates to maintain a constant temperature, and the outlet temperature channel slowly expels the gas previously contained in the chamber, thus achieving a test environment that meets the testing requirements.

[0009] Preferably, a motor shaft is fixed to the top of the rotating rod, a motor is connected to the top of the motor shaft through the test housing, the test housing is installed at the bottom of the motor, a first bearing is rotatably connected to the bottom of the rotating rod, and the test housing is fixed at the bottom of the first bearing.

[0010] It should be noted that a fan is designed at the top. When airflow enters the cavity, the fan rotates, and the rotating airflow updates the temperature at each location, ensuring that the temperature rises or falls in real time. Ultimately, the temperature at each location within the cavity will be nearly uniform, preventing localized icing due to large temperature differences. Because the fan refreshes the temperature within the cavity, maintaining a constant temperature, when personnel open the cavity after testing, the test module will not be damaged by melting ice or dripping water. This effectively ensures the continuous operation of the equipment and testing efficiency.

[0011] Preferably, the test chamber has three channel holes on both sides, and the three channel holes are corresponding to the three cavities formed by the first partition and the second partition. The three channel holes on both sides are the temperature inlet channel and the temperature outlet channel, respectively.

[0012] It should be noted that there are inlet and outlet temperature holes on the left and right sides of the cavity, and both are on the same horizontal plane. This allows the gas inside the cavity to be discharged while the airflow is being discharged, ensuring a stable temperature rise or fall and reducing energy consumption of the equipment.

[0013] Preferably, a first groove and a second groove are respectively formed at the upper and lower ends of the channel hole. A motor is installed at the top of the first groove, a motor shaft is connected to the bottom of the motor, a semiconductor cooling chip is fixed to the bottom of the motor shaft, a connecting rod is fixed to the bottom of the semiconductor cooling chip, and the bottom of the connecting rod extends into the second groove and is rotatably connected to a second bearing.

[0014] Preferably, temperature sensors are installed on both sides of the top of the test chamber and on both sides of the bottom of the first and second partitions.

[0015] Preferably, both the first partition and the second partition have cavities inside, and a first heat insulation plate is fixed inside the cavity.

[0016] Preferably, a hinge is rotatably connected to one end of the front end of the test chamber, and a chamber baffle is fixed to the other end of the hinge. A handle is fixed to one end of the front end of the chamber baffle, and a second heat insulation plate is fixed to the rear end of the chamber baffle. The second heat insulation plate is arranged correspondingly to the first baffle and the second baffle.

[0017] Preferably, an industrial control computer is installed at the bottom front end of the test chamber, and the industrial control computer is connected to the temperature sensor and the semiconductor refrigeration chip respectively.

[0018] The three chambers in this invention can be tested simultaneously or individually, meaning that high and low temperature tests as well as room temperature tests can be performed at the same time, and the space inside the chambers can be designed according to production needs.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. This invention, through its horizontally aligned inlet and outlet temperature channels, effectively facilitates the intake and exhaust of airflow within the cavity, preventing damage to the cavity's interior due to pressure differences at the intake and outlet points. The top-mounted fan design ensures nearly uniform temperature throughout the cavity, guaranteeing accurate test results and preventing localized icing. This also prevents ice from melting and dripping onto the test module, thus avoiding damage. Furthermore, the multiple fans on the rotating rod maintain consistent airflow speeds during rotation, further enhancing test accuracy. The rotation of the rod also drives the rotating disk, where multiple chips are placed on top, ensuring even contact with the incoming temperature from one side, improving the accuracy of multi-temperature chip detection. The increased test cavity enhances testing efficiency and meets the requirements for simultaneous high / low temperature and room temperature testing in engineering verification.

[0021] 2. This invention combines a channel hole, a thermoelectric cooler, and a motor. A thermoelectric cooler can be installed within the channel hole, and the motor can rotate the thermoelectric cooler, switching the orientation of its cold and hot ends towards the cavity. This allows for direct, real-time, and rapid temperature adjustment within different cavities, improving the convenience of multi-temperature testing of the chip. Furthermore, since temperature sensors are installed in multiple cavities, they can be used in conjunction with the thermoelectric cooler to monitor the temperature within different cavities in real time. By switching the cold and hot ends of the thermoelectric cooler, the temperature within the cavity can be accurately adjusted. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a schematic diagram of the internal structure of the test chamber of the present invention;

[0024] Figure 3 This is a schematic diagram of the channel hole structure of the present invention;

[0025] Figure 4 This is a schematic diagram of the overall structure of the present invention.

[0026] In the diagram: 1. Test chamber; 101. Hinge; 102. Chamber baffle; 103. Second insulation plate; 104. Handle; 105. Industrial control computer; 2. Motor; 201. First partition; 202. Second partition; 203. Motor shaft; 204. Fan blade; 205. Rotating rod; 206. Rotating disk; 207. Temperature sensor; 208. First bearing; 209. Cavity; 210. First insulation plate; 211. Placement slot; 3. Channel hole; 301. Second bearing; 302. First groove; 303. Motor; 304. Motor shaft; 305. Semiconductor cooling chip; 306. Second groove; 307. Connecting rod. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0028] Example 1: A three-temperature chamber for manual chip testing, see [link to example]. Figures 1 to 4The test chamber 1 includes a first partition 201 and a second partition 202, which are fixed to the upper and lower ends of the test chamber 1, respectively. A multi-temperature testing mechanism extends through the first and second partitions 201 and 202, enabling simultaneous three-temperature testing of multiple chips. During the three-temperature testing process, it maintains consistent wind speed and position, improving testing accuracy. The multi-temperature testing mechanism includes a rotating rod 205, with the first and second partitions 201 and 202 extending through its outer side. Three fan blades 204 are mounted on the outside of the rotating rod 205, located within the three cavities formed by the first and second partitions 201 and 202. Three rotating disks 206 extend through the outside of the rotating rod 205, with multiple placement slots 211 around the top of each disk. The three rotating disks 206 are located within the three cavities formed by the first and second partitions 201 and 202. Test modules are manually placed onto the rotating disks 206 according to different testing temperature requirements. In the placement slot 211 of 6, gas is introduced into the temperature inlet channel on the left side of the cavity to heat or cool the cavity. At the same time, the temperature outlet channel on the right side also works to expel the gas that was originally in the cavity, preventing excessive gas pressure in the cavity from damaging the cavity. During the test, motor 2 can be turned on. Motor 2 drives motor shaft 201, which in turn drives rotating rod 205. Rotating rod 205 drives multiple blower blades 204 to rotate simultaneously. After the blower fans at the top of the cavity start to rotate at the same time, the airflow inside the cavity can flow freely to achieve the same temperature at all positions in the cavity. Since multiple blower blades 204 are driven by the same drive device, the speed of each fan can be kept consistent, thereby increasing the accuracy of the test. In addition, during the rotation of rotating rod 205, rotating rod 205 also drives rotating disk 206 to rotate. Since multiple test modules are placed on top of rotating disk 206, multiple test modules can rotate and contact the temperature from one side evenly, improving the accuracy of multi-temperature detection of the chip.

[0029] For details, see Figure 2 The top of the rotating rod 205 is fixed with a motor shaft 201. The top of the motor shaft 201 passes through the test box 1 and is connected to a motor 2. The bottom of the motor 2 is installed with the test box 1. The bottom of the rotating rod 205 is rotatably connected with a first bearing 208. The bottom of the first bearing 208 is fixed with the test box 1.

[0030] For more details, see Figure 1 The test chamber 1 has three channel holes 3 on both sides, and the three channel holes 3 are corresponding to the three cavities formed by the first partition 201 and the second partition 202. The three channel holes 3 on both sides are the inlet temperature channel and the outlet temperature channel, respectively. The outlet temperature channel will not be closed during the test, but will slowly discharge the gas in the cavity to prevent the gas pressure in the cavity from being too high and damaging the inside of the cavity.

[0031] Further, see Figure 3 The channel hole 3 has a first groove 302 and a second groove 306 at its upper and lower ends, respectively. A motor 303 is installed at the top of the first groove 302, and a motor shaft 304 is connected to the bottom of the motor 303. A thermoelectric cooler 305 is fixed to the bottom of the motor shaft 304, and a connecting rod 307 is fixed to the bottom of the thermoelectric cooler 305. The bottom of the connecting rod 307 extends into the second groove 306 and is rotatably connected to a second bearing 301. Since a thermoelectric cooler 305 is provided in the channel hole 3, the motor 303 can be turned on. The motor 303 drives the motor shaft 304, which can rotate the thermoelectric cooler 305, thereby switching the cold end and hot end of the thermoelectric cooler 305 towards the cavity. This allows for real-time and rapid adjustment of the temperature in different cavities, improving the convenience of multi-temperature testing of the chip.

[0032] Further, see Figure 1 Temperature sensors 207 are installed on both sides of the top of the test chamber 1 and on both sides of the bottom of the first partition 201 and the second partition 202. Since temperature sensors 207 are installed in multiple chambers, they can be used in conjunction with the semiconductor cooling chip 305 to monitor the temperature in different chambers in real time. The temperature in the chambers can be accurately adjusted by switching between the cold end and the hot end through the semiconductor cooling chip 305.

[0033] It is worth noting that, see Figure 2 Both the first partition 201 and the second partition 202 have cavities 209 inside, and a first heat insulation plate 210 is fixed inside the cavity 209. The high and low temperature and normal temperature test chambers are isolated from each other and do not affect each other, so they can be tested simultaneously. The number of test modules inside a single cavity can be designed by the designer according to production needs. At the same time, since the first heat insulation plate 210 is set in the first partition 201 and the second partition 202, the temperature between each cavity can be blocked through the first partition 201, thus improving the heat insulation effect.

[0034] It is worth noting that, see Figure 4 The front end of the test chamber 1 is rotatably connected to one end of a hinge 101, and the other end of the hinge 101 is fixed to a chamber baffle 102. A handle 104 is fixed to one side of the front end of the chamber baffle 102, and a second heat insulation plate 103 is fixed to the rear end of the chamber baffle 102. The second heat insulation plate 103 is set in correspondence with the first baffle 201 and the second baffle 202.

[0035] It is worth mentioning that, see Figure 4 An industrial control computer 105 is installed at the bottom front of the test chamber 1. The industrial control computer 105 is connected to the temperature sensor 207 and the semiconductor cooling chip 305 respectively.

[0036] In summary, this type of three-temperature test chamber, which allows for manual simultaneous testing, is suitable for various scenarios, such as multi-temperature testing of precision electronic components, multi-temperature testing of chips, and temperature simulation testing of LCD panels. It solves the problem of ice and water dripping inside the chamber damaging the test module. At the same time, due to the unique design of the three-temperature chamber, high and low temperatures as well as room temperature can be tested simultaneously, which not only improves testing efficiency but also provides a reliable guarantee for the accuracy of test results.

[0037] In addition, all components designed in this invention are general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. They can be fully implemented by those skilled in the art, so there is no need to elaborate. The content protected by this invention does not involve improvements to the internal structure and methods.

[0038] The embodiments disclosed in this invention are preferred embodiments, but are not limited thereto. Those skilled in the art can easily understand the spirit of this invention based on the above embodiments and make different extensions and variations, but as long as they do not depart from the spirit of this invention, they are all within the protection scope of this invention.

Claims

1. A three-temperature chamber for manually testing chips, comprising a test chamber (1), characterized in that, Also includes: The first partition (201) and the second partition (202) are fixed to the upper and lower ends of the inside of the test chamber (1), respectively; The multi-temperature testing mechanism runs through the first partition (201) and the second partition (202). It can not only perform three-temperature testing on multiple chips at the same time, but also maintain consistent wind speed and position during the three-temperature testing process, thus improving the accuracy of the test. The multi-temperature testing mechanism includes a rotating rod (205), through which the first partition (201) and the second partition (202) run through the outside of the rotating rod (205). Three fan blades (204) are installed on the outside of the rotating rod (205), and the three fan blades (204) are located in the three cavities formed by the first partition (201) and the second partition (202). The rotating rod (205) has three rotating disks (206) extending through its outer side, and the top of the three rotating disks (206) is provided with multiple placement slots (211). The three rotating disks (206) are located in the three cavities formed by the first partition (201) and the second partition (202).

2. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, The top of the rotating rod (205) is fixed with a motor shaft (203), the top of the motor shaft (203) passes through the test box (1) and is connected to a motor (2), the bottom of the motor (2) is installed with the test box (1), the bottom of the rotating rod (205) is rotatably connected with a first bearing (208), and the bottom of the first bearing (208) is fixed with the test box (1).

3. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, The test chamber (1) has three channel holes (3) on both sides, and the three channel holes (3) are corresponding to the three cavities formed by the first partition (201) and the second partition (202). The three channel holes (3) on both sides are the temperature inlet channel and the temperature outlet channel, respectively.

4. The simultaneous three-temperature chamber for manually testing a chip as described in claim 3, characterized in that, The channel hole (3) has a first groove (302) and a second groove (306) at its upper and lower ends respectively. A motor (303) is installed at the top of the first groove (302). A motor shaft (304) is connected to the bottom of the motor (303). A semiconductor cooling chip (305) is fixed to the bottom of the motor shaft (304). A connecting rod (307) is fixed to the bottom of the semiconductor cooling chip (305). The bottom of the connecting rod (307) extends into the second groove (306) and is rotatably connected to a second bearing (301).

5. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, Temperature sensors (207) are installed on both sides of the top of the test chamber (1) and on both sides of the bottom of the first partition (201) and the second partition (202).

6. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, The first partition (201) and the second partition (202) each have a cavity (209) inside, and a first insulation plate (210) is fixed inside the cavity (209).

7. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, The test chamber (1) has a hinge (101) rotatably connected to one end of its front end. The other end of the hinge (101) is fixed with a chamber baffle (102). A handle (104) is fixed to one side of the front end of the chamber baffle (102). A second heat insulation plate (103) is fixed to the rear end of the chamber baffle (102). The second heat insulation plate (103) is correspondingly set with the first baffle (201) and the second baffle (202).

8. The simultaneous three-temperature chamber for manually testing a chip as described in claim 1, characterized in that, An industrial control computer (105) is installed at the bottom front end of the test chamber (1). The industrial control computer (105) is connected to the temperature sensor (207) and the semiconductor refrigeration chip (305) respectively.

Images