Wafer cleaning device

Abstract

The application discloses a wafer cleaning device, which comprises a box body, a clamping mechanism arranged in the box body to clamp a wafer to be treated, and a rotating speed measuring mechanism arranged in the box body to measure the rotating speed of the wafer. The rotating speed measuring mechanism comprises a detection piece hinged in the box body, one end of the detection piece is provided with a rotating wheel capable of abutting against the outer edge of the wafer and sensing the gap of the wafer, and a sensor is arranged at the other end of the detection piece to measure the swing information of the detection piece, so as to calculate the rotating speed of the wafer.

Description

Technical Field

[0001] This invention belongs to the field of wafer post-processing technology, and more specifically, relates to a wafer cleaning device. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer fabrication, wafer processing, electrical measurement, dicing, packaging, and testing. Among these, chemical mechanical polishing (CMP) is one of the five core processes in wafer fabrication.

[0003] After chemical mechanical polishing (CMP), wafers require post-processing such as cleaning and drying to prevent contamination of semiconductor devices by trace ions and metal particles, thus ensuring the performance and yield of the semiconductor devices. Wafer cleaning methods include roller cleaning and megasonic cleaning, with roller cleaning being one of the most commonly used methods.

[0004] During the roller brush cleaning process, wafer rotation speed control is an important means to ensure the cleaning effect of the wafer; however, since the wafer is in an environment with various chemicals such as water and chemical liquids, the wafer rotation speed is often difficult to detect.

[0005] In the wafer cleaning device disclosed in patent CN113976498A, a speed measuring wheel is used to contact the wafer, and a speed measuring module is configured at the rear end of the speed measuring wheel; the speed measuring module uses the principle of Hall switch or photoelectric switch to obtain the rotation speed of the speed measuring wheel, and then obtains the rotation speed of the wafer.

[0006] However, during the wafer cleaning process, the speed measuring wheel is prone to slippage, which affects the accuracy of wafer speed measurement and thus the control effect of wafer speed, resulting in a poorer wafer cleaning effect. Summary of the Invention

[0007] This invention provides a wafer cleaning apparatus, which aims to at least solve one of the technical problems existing in the prior art.

[0008] A first aspect of the present invention provides a wafer cleaning apparatus, comprising:

[0009] Box;

[0010] A clamping mechanism, located in the housing, is used to clamp the wafer to be processed;

[0011] A rotation speed measuring mechanism is installed in the housing to measure the wafer rotation speed;

[0012] The rotational speed measuring mechanism includes:

[0013] The detection component is hinged in the housing, and one end of the detection component is equipped with a rotating wheel that can abut against the outer edge of the wafer and sense wafer notches.

[0014] A sensor is positioned at the other end of the sensing element to measure the oscillation information of the sensing element, thereby calculating the wafer rotation speed.

[0015] In some embodiments, the hinge point of the detection element is positioned close to the rotating wheel, such that the other end of the detection element can amplify the movement of the rotating wheel.

[0016] In some embodiments, the rotational speed measuring mechanism further includes a limiting component disposed on the side of the sensing element, such that the sensing element can swing about the hinge point in a fixed direction.

[0017] In some embodiments, one end of the detection element is a columnar structure and the other end is a sheet-like structure; the rotating wheel is rotatably connected to the end of the columnar structure, and the sensor is disposed on the side of the sheet-like structure.

[0018] In some embodiments, the rotational speed measuring mechanism further includes a protective cover fitted over the outside of the sensing element and covering the hinge point.

[0019] In some embodiments, the sensor is a photoelectric sensor to measure the frequency of the oscillation of the detection element around the hinge point.

[0020] In some embodiments, the rotational speed measuring mechanism further includes an elastic element connected to the side of the detection element to adjust the contact force between the rotating wheel of the detection element and the wafer.

[0021] In some embodiments, the rotation speed measuring mechanism further includes a pusher that can push the detection element to rotate about the hinge point, such that the wheel at the end of the detection element is not higher than the plane on which the clamping mechanism holds the wafer.

[0022] In some embodiments, the number of rotation speed measuring mechanisms is at least two, which are evenly distributed on the outer periphery of the wafer holding area of ​​the clamping mechanism.

[0023] A second aspect of the present invention provides a wafer cleaning apparatus, comprising:

[0024] Box;

[0025] A clamping mechanism, located in the housing, is used to clamp the wafer to be processed;

[0026] A rotation speed measuring mechanism is installed in the housing to measure the wafer rotation speed;

[0027] The rotational speed measuring mechanism includes:

[0028] The test piece is slidably connected in the housing. One end of the test piece is equipped with a rotating wheel that can abut against the outer edge of the wafer. The wafer notch causes the rotating wheel in contact with it to move.

[0029] The sensor, which is a torque sensor, is connected to the other end of the sensing element; the moving wheel causes the torque value of the sensor to change and generate an output signal, and then the wafer rotation speed is calculated based on the frequency of the output signal.

[0030] The beneficial effects of this invention include:

[0031] a. The rotation speed measuring mechanism of the wafer cleaning equipment is not affected by wafer slippage, which effectively ensures the accuracy of rotation speed measurement, facilitates flexible adjustment of the cleaning process, and thus obtains good cleaning results;

[0032] b. One end of the detection element of the speed measuring mechanism is a plate-like structure, which helps to reduce the weight of the detection element and the moment of inertia of the detection element, and helps to improve the flexibility of the swing of the detection element.

[0033] c. A limiting component is configured on the side of the detection piece, which allows the detection piece to swing around the hinge point in a fixed direction, preventing the swing direction of the detection piece from deviating and affecting the accuracy of the detection.

[0034] d. The side of the test piece is equipped with an elastic element and a matching adjustment element. The elastic element is located between the support plate and the test piece. By adjusting the extension and retraction of the elastic element, the force exerted by the roller on the edge of the wafer is changed to prevent the roller from pressing the wafer too tightly and affecting the normal rotation of the wafer. Attached Figure Description

[0035] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0036] Figure 1 This is a schematic diagram of a wafer cleaning apparatus provided in an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of a speed measuring mechanism provided in an embodiment of the present invention;

[0038] Figure 3 yes Figure 2 Top view of the corresponding wafer cleaning device;

[0039] Figure 4 This is a schematic diagram of a detection element provided in an embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of a rotational speed measuring mechanism provided in another embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of a speed measuring mechanism provided in another embodiment of the present invention;

[0042] Figure 7 This is a schematic diagram of a wafer cleaning apparatus provided in another embodiment of the present invention.

[0043] Figure 8 yes Figure 7 A schematic diagram of the rotational speed measuring mechanism in the embodiment;

[0044] Figure 9 yes Figure 8 Side view of the medium speed measuring mechanism;

[0045] Figure 10 This is a schematic diagram of a wafer cleaning apparatus provided in another embodiment of the present invention. Detailed Implementation

[0046] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation of the present invention or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0047] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0048] In this invention, "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)," and a wafer (W) is also called a substrate (Substrate), with equivalent meanings and practical functions. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to." The term "based on" should be understood as "at least partially based on." The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment." The terms "first," "second," etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, equipment, apparatus, means, parts, components, etc., are referred to as "best," "lowest," "highest," "minimum," "maximum," etc. It should be understood that such descriptions are intended to indicate that selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred in any other aspect or all aspects than other options.

[0049] In this invention, the meaning of "wafer cleaning" is essentially the same as that of "wafer post-processing." Wafer cleaning operations include rinsing and drying, both of which involve spraying chemical solutions onto the wafer surface to remove residual particles and peel off the water film adhering to the wafer surface. Therefore, in this embodiment of the invention, wafer cleaning and wafer post-processing have largely equivalent meanings.

[0050] Figure 1 This is a schematic diagram of a wafer cleaning apparatus 100 provided in an embodiment of the present invention. The wafer cleaning apparatus 100 includes:

[0051] The enclosure 10 is designed to confine the wafer cleaning operation to a relatively enclosed space, avoiding interference from the external environment on the wafer cleaning effect, and also reducing interference from the cleaning operation on other functional modules. It is understood that the side or top of the enclosure 10 needs to be equipped with a door so that the turnover robot can place the wafer in the enclosure 10 or move the wafer out of the enclosure 10.

[0052] A clamping mechanism 20 is disposed in the housing 10 to clamp the wafer W to be processed. The clamping mechanism 20 typically includes multiple support components, which are evenly distributed on the outer periphery of the wafer clamping area. A clamping roller is disposed on the top of the support component, and the clamping roller abuts against the edge of the wafer to horizontally clamp the wafer to be cleaned. At the same time, a drive mechanism is disposed on the lower part of the support component to drive the clamping roller to rotate. The friction between the clamping roller and the wafer can drive the wafer to rotate around the central axis.

[0053] The housing 10 is also equipped with a pair of roller brushes 30, which are positioned on the upper and lower sides of the horizontally clamped wafer W to clean the front and back sides of the wafer simultaneously. Specifically, the ends of the roller brushes 30 are equipped with drive motors, which can drive the roller brushes 30 to rotate around their central axis. At the same time, the ends of the roller brushes 30 are also equipped with up and down drive mechanisms to drive the roller brushes 30 to move in the vertical direction to approach or move away from the wafer to be cleaned.

[0054] Figure 1 In the wafer cleaning apparatus 100, there is also a spray pipe 40, which can spray chemical liquid toward the roller brush 30 and the surface of the wafer W; the chemical liquid-soaked roller brush 30 rotates around its central axis, and the roller brush 30 contacts the rotating wafer to remove residual particles on the wafer surface, thereby cleaning the wafer surface.

[0055] To ensure effective wafer cleaning, the wafer's rotation speed needs to be controlled. Specifically, the wafer's rotation speed needs to be stabilized within a set range to guarantee the frequency of contact between the roller brush 30 and the wafer surface.

[0056] Figure 1 In the illustrated embodiment, the wafer cleaning apparatus 100 further includes a rotation speed measuring mechanism 50, which is disposed in the housing 10 to measure the rotation speed of the wafer.

[0057] Further, a schematic diagram of the speed measuring mechanism 50 is shown below. Figure 2 As shown, the rotational speed measuring mechanism 50 includes a detection element 51, which is hinged in the housing 10, allowing the detection element 51 to swing around the hinge point. One end of the detection element 51 is equipped with a rotating wheel 52, which can abut against the outer edge of the wafer and sense the wafer notch. That is, when the wafer notch contacts the rotating wheel 52, the rotating wheel 52 will deflect slightly along the radial direction of the wafer notch.

[0058] Figure 3 yes Figure 1 A top view of the wafer cleaning apparatus 100 (excluding the housing 10) shows that when the rotary wheel 52 contacts the wafer notch, the contact state between the two changes. This change in state causes the rotary wheel 52 to move slightly along the radius of the wafer notch.

[0059] When the wafer rotates, the rotational speed can be obtained by monitoring the frequency of minute movements of the rotating wheel 52. In this invention, the minute movements of the rotating wheel 52 are amplified using the lever amplification principle to improve the accuracy of rotational speed detection. Specifically, the oscillation of the other end of the hinged and fixed detection component 51 is monitored to reduce the difficulty of detection and ensure the accuracy of oscillation information detection.

[0060] Specifically, the speed measuring mechanism 50 also includes a sensor 53, such as... Figure 2 As shown. Sensor 53 is disposed at the other end of the detection element 51 to measure the oscillation information of the detection element 51, and then calculate the rotational speed of the wafer. Specifically, sensor 53 is disposed at the end of the detection element 51 away from the rotary wheel 52 to measure the oscillation of the detection element 51.

[0061] Figure 2 In this design, the hinge point of the detection element 51 is positioned close to the rotating wheel 52, allowing the other end of the detection element 51 to amplify the movement of the rotating wheel 52. This enables more accurate acquisition of the oscillation of the detection element 51, indirectly obtaining information about the minute displacement of the rotating wheel 52, and thus calculating the wafer's rotational speed. The aforementioned technical solution avoids the impact of wafer slippage on rotational speed measurement, thus ensuring the accuracy of the measurement.

[0062] Furthermore, sensor 53 can be a photoelectric sensor to measure the frequency of the oscillation of the detection element 51 around the hinge point, and then calculate the rotational speed of the wafer.

[0063] In this invention, the rotational speed measuring mechanism 50 further includes a limiting component 54, such as... Figure 2 As shown, the limiting component 54 is disposed on the side of the detection component 51, so that the detection component 51 can swing around the hinge point in a fixed direction to prevent the swing direction of the detection component 51 from deviating and affecting the accuracy of the detection.

[0064] Furthermore, the limiting assembly 54 includes a limiting seat 54a and a limiting roller 54b. The limiting seat 54a is fixed in the housing 10, and the limiting roller 54b is disposed at the end of the limiting seat 54a and can rotate around the central axis. The outer peripheral side of the limiting roller 54b abuts against the side of the detection element 51 to ensure that the detection element 51 moves in a fixed direction.

[0065] As an embodiment of the present invention, one end of the detection element 51 is a columnar structure 51a, and the other end is a sheet-like structure 51b, such as... Figure 4 As shown. The sheet-like structure 51b configured on the detection element 51 can reduce its own weight, thereby reducing the moment of inertia of the detection element 51 and improving the flexibility of the swing of the detection element 51.

[0066] Furthermore, the rotating wheel 52 is rotatably connected to the end of the columnar structure 51a. Specifically, a corrosion-resistant bearing is provided between the columnar structure 51a and the rotating wheel 52 to ensure that the rotating wheel 52 can rotate smoothly around the central axis of the columnar structure 51a.

[0067] In some embodiments, the detection element 51 is made of corrosion-resistant non-metallic materials such as polyetheretherketone and polyphenyl sulfide to ensure the structural strength of the detection element 51 and extend its service life; while the rotating wheel 52 disposed at the end of the detection element 51 can be made of polyurethane, which has a certain wear resistance; the rotating wheel 52 contacts the edge of the wafer, and the friction between the two can drive the rotating wheel 52 to rotate freely.

[0068] Figure 2 In the embodiment shown, sensor 53 is disposed on the side of sheet structure 51b. Sensor 53 can detect the movement information of the flexibly swinging detection element 51, thereby obtaining the minute displacement information of the rotating wheel 52, so as to calculate the rotation speed of the wafer.

[0069] Furthermore, the speed measuring mechanism 50 also includes a protective cover 55, which is fitted over the outside of the sensing element 51 and covers the hinge point, such as... Figure 2 As shown. In this invention, the protective cover 55 configured in the housing 10 can effectively prevent particulate matter and other contaminants from adhering to the surface of the detection element 51 and the corresponding hinge point during the cleaning process, so as to ensure the flexible swing of the detection element 51 and avoid contaminants adhering to the hinge point and interfering with the measurement of the wafer rotation speed.

[0070] In some embodiments, the protective cover 55 is made of rubber material and covers the upper end of the detection element 51 to ensure the flexibility of the detection element 51 in swinging while ensuring a clean operating environment for the detection element 51.

[0071] Figure 2 In the middle, the protective cover 55 is a corrugated tube made of rubber, which can swing together with the detection piece 51 around the hinge point to prevent contaminants generated during cleaning from adhering to the hinge point and affecting the accuracy of wafer rotation speed measurement.

[0072] As an embodiment of the present invention, the rotation speed measuring mechanism 50 further includes an elastic element 56, which is connected to the side of the detection element 51 to adjust the contact force between the rotating wheel 52 of the detection element 51 and the wafer.

[0073] Specifically, the elastic element 56 is a spring, one end of which is fixed to the support plate 57a at the bottom of the housing 10, and the other end is connected to the detection element 51, such as... Figure 2 As shown; and, the end of the elastic member 56 is also provided with an adjusting member 57b, which abuts against the other side of the support plate 57a. It can pull the elastic member 56 to adjust the amount of extension and retraction of the elastic member 56, change the force of the roller 52 on the edge of the wafer, and prevent the roller 52 from pressing the wafer too tightly and affecting the normal rotation of the wafer.

[0074] Furthermore, the rotation speed measuring mechanism 50 also includes a pusher 58, which can push the detection element 51 to rotate around the hinge point, so that the roller 52 at the end of the detection element 51 is not higher than the plane where the clamping mechanism 20 holds the wafer, so that when the turnover robot picks up and puts in the wafer, the roller 52 of the rotation speed measuring mechanism 50 is not on the wafer's movement path, thus ensuring the smoothness of wafer transfer.

[0075] Figure 2 In the middle, the pusher 58 is a cylinder, the cylinder seat is fixed to the housing 10, and the piston rod of the cylinder can abut against the detection element 51, so that the detection element 51 can rotate around the hinge point, and the rotating wheel 52 changes from a vertical state to an inclined state to prevent the wafer from interfering with the rotating wheel 52.

[0076] It is understood that the pushing component 58 can be an electric cylinder or a driving mechanism formed by other four-bar linkages. As long as the technical solution can drive the detection component 51 to rotate around the hinge point, it falls within the protection scope and disclosure scope of this embodiment.

[0077] Figure 1 In the illustrated embodiment, the wafer cleaning apparatus 100 is equipped with two rotation speed measuring mechanisms 50, which are evenly distributed on the outer periphery of the wafer holding area of ​​the clamping mechanism 20. Figure 3 (As shown), this ensures that the lateral load on the wafer to be cleaned is relatively uniform. It is understood that the rotational speed measuring mechanism 50 can also be of other quantities, such as three or four. It is also understood that the number of rotational speed measuring mechanisms 50 should not be excessive, so as not to increase the complexity of the wafer cleaning device 100 and reduce the operational stability of the wafer cleaning device 100.

[0078] When performing a wafer cleaning process using the wafer cleaning apparatus 100 provided by the present invention, the rotation speed of the wafer is monitored in real time using the rotation speed measuring mechanism 50; and the wafer cleaning process is flexibly controlled according to the rotation speed of the wafer to obtain a good cleaning effect.

[0079] The following is combined Figure 1 The illustrated embodiment briefly describes the steps of the wafer cleaning process:

[0080] First, the moving end of the pusher 58 moves forward to abut against the sheet-like structure 51b of the detector 51. Figure 4 (As shown), this allows the detection element 51 to rotate around the hinge point; the rotating wheel 52 at the end of the detection element 51 changes from a vertical state to an inclined state, and the rotating wheel 52 is lower than the plane of the moving path of the turnover robot placing the wafer; the turnover robot places the wafer to be cleaned in the box 10, and the clamping mechanism 20 clamps the wafer horizontally.

[0081] Next, the moving end of the pusher 58 returns to its original position, and the rotating wheel 52 at the end of the detector 51 abuts against the edge of the wafer;

[0082] Next, the wafer is driven to rotate, the roller brush 30 moves toward the rotating wafer and introduces deionized water and / or chemical liquid, and the spray pipe 40 sprays cleaning liquid toward the wafer surface; the roller brush 30 rotates around its central axis and contacts the rotating wafer surface, thereby removing residual particles on the wafer surface by contact.

[0083] During the wafer cleaning process, the detection unit 51 monitors the minute displacement of the rotating wheel 52, and the sensor 53 acquires the oscillation of the lower sheet structure 51b of the detection unit 51 in real time, thereby calculating the rotation speed of the wafer.

[0084] This invention utilizes a notch set at the edge of the wafer to monitor the oscillation information of the detection element 51 through sensor 53, effectively avoiding the influence of wafer slippage on the rotation speed measurement and improving the accuracy of wafer rotation speed measurement.

[0085] Figure 5 This is a schematic diagram of a speed measuring mechanism 50 provided in another embodiment of the present invention, and... Figure 2 Compared to the illustrated embodiment, the detection element 51 in this embodiment has an approximately L-shaped structure. Specifically, the lower part of the detection element 51 is provided with a transverse sheet-like structure 51b to reduce the space occupied by the detection element 51 in the vertical direction and expand the applicability of the rotational speed measuring mechanism 50.

[0086] Figure 5 Other components and their connections Figure 2 Similar examples are used in the embodiments, and will not be repeated here. When the wafer notch comes into contact with the rotating wheel 52, the rotating wheel 52 undergoes a slight displacement along the radial direction of the wafer notch; the detection element 51 rotates along the hinge point, thereby driving the horizontally arranged sheet structure 51b to move in the vertical direction; since there is a certain distance between the hinge point of the detection element 51 and the end of the sheet structure 51b, the end of the sheet structure 51b can magnify the rotating wheel 52.

[0087] The sensor 53 for monitoring is disposed on the side of the sheet structure 51b to detect the moving frequency of the sheet structure 51b, and then calculates the rotational speed of the wafer based on the oscillation frequency of the sheet structure 51b.

[0088] Figure 6 This is a schematic diagram of a speed measuring mechanism 50 provided in another embodiment of the present invention, and... Figure 2 Compared to the illustrated embodiment, in this embodiment, the sensor 53 is disposed between the elastic member 56 and the support plate 57a to monitor the swaying of the detection member 51.

[0089] In this embodiment, by utilizing the amplification principle of the hinged and fixed detection element 51, the slight oscillation of the rotating wheel 52 can form a larger oscillation at the lower end of the detection element 51, thereby changing the degree of pressure of the detection element 51 on the sensor 53.

[0090] Furthermore, sensor 53 is a pressure sensor, which is located at the tail end of elastic member 56. When sensor 53 reaches a set threshold, it will send a switching signal to the system. The frequency of the switching signal is used to determine the frequency of contact between the wafer notch and the rotating wheel 52, and then the rotation speed of the wafer is calculated.

[0091] Figure 7 This is a schematic diagram of a wafer cleaning apparatus 100 provided in an embodiment of the present invention. The wafer cleaning apparatus 100 includes a housing 10, and a clamping mechanism 20 is provided inside the housing 10 to horizontally clamp the wafer to be cleaned. The housing 10 is also provided with two rotation speed measuring mechanisms 50 to measure the rotation speed of the wafer.

[0092] Further, a schematic diagram of the speed measuring mechanism 50 is shown below. Figure 8 and Figure 9 As shown, the speed measuring mechanism 50 includes:

[0093] The detection element 51 is slidably connected in the housing 10. Specifically, the detection element 51 is disposed on the sliding assembly 59, which includes a slide rail 59a fixed to the housing 10 and a sliding block 59b. The sliding block 59b is connected to the detection element 51 and can move in the horizontal direction. One end of the detection element 51 is provided with a rotating wheel 52, which can abut against the outer edge of the wafer W. The wafer notch causes the rotating wheel 52 in contact with it to move.

[0094] Sensor 53 is a torque sensor connected to the other end of the detection element 51; the moving wheel 52 causes the torque value of sensor 53 to change and generate an output signal, and then the wafer rotation speed is calculated based on the frequency of the output signal.

[0095] Figure 8 In the process, the speed measuring mechanism 50 also includes a protective cover 55, which is disposed on the outer periphery of the detection element 51 to prevent contaminants generated during cleaning from adhering to the moving parts of the speed measuring mechanism 50 and affecting the normal movement of the detection element 51.

[0096] Furthermore, the rotational speed measuring mechanism 50 also includes an elastic element 56, which in this embodiment is a spring. One end of the elastic element 56 is fixed to the support plate 57a, and the other end is connected to the sliding block 59b; and the elastic element 56 presses against the sliding block 59b, so that the rotating wheel 52 at the upper end of the detection element 51 presses against the edge of the wafer W.

[0097] When the rotating wheel 52 comes into contact with the wafer notch, the rotating wheel 52 will move, so that the detection element 51 acts on the sensor 53 below it.

[0098] When sensor 53 reaches the set threshold, sensor 53 will output a switching signal. By detecting the frequency of the switching signal, the contact frequency between the wafer notch and the rotary wheel 52 can be calculated, and thus the wafer rotation speed can be calculated.

[0099] Furthermore, the rotation speed measuring mechanism 50 also includes a pusher 58, the movable end of which can abut against the sliding block 59b, so that the detection element 51 and its rotating wheel 52 move outward to facilitate the handling of wafers by the turnover robot.

[0100] Figure 1 In the wafer cleaning apparatus 100, the wafer is horizontally clamped and its front and back sides are cleaned by a roller brush 30. A pair of rotation speed measuring mechanisms 50 are arranged inside the housing 10 to measure the rotation speed of the wafer. It is understood that the rotation speed measuring mechanisms 50 can also be used in a vertical wafer cleaning apparatus.

[0101] Figure 10 This is a schematic diagram of a wafer cleaning apparatus 100 provided in another embodiment of the present invention. In this embodiment, the wafer is subjected to surface post-processing in a vertical position. Specifically, the wafer cleaning apparatus 100 includes a housing 10, and a pair of drive wheels 21 are arranged at intervals inside the housing 10 to vertically fix the wafer to be cleaned and drive the wafer to rotate around the central axis.

[0102] Furthermore, roller brushes 30 are provided on both sides of the wafer W, and a drive motor (not shown) is connected to the end of the roller brushes 30 to drive the roller brushes 30 to rotate around their axis. A spray pipe 40 is provided on the upper part of the housing 10 to spray DIW and / or cleaning fluid toward the wafer W.

[0103] During wafer cleaning, a drive motor (not shown) located on the side of the drive wheel 21 drives it to rotate in the same direction; under the action of friction, the vertically positioned wafer W rotates around the wafer axis. The rotating roller brush 30 contacts the rotating wafer W to remove contaminants such as particulate matter remaining on the surface of the wafer W.

[0104] The housing 10 also houses three rotation speed measuring mechanisms 50, which are evenly distributed on the outer periphery of the wafer W to measure the wafer's rotation speed in real time. Specifically, one rotation speed measuring mechanism 50 is positioned between the two drive wheels 21, while the other two rotation speed measuring mechanisms 50 are positioned on the upper side of the roller brush 30 and symmetrically arranged on both sides of the wafer to ensure uniform force on the wafer and thus achieve a good cleaning effect.

[0105] Figure 10 In the illustrated embodiment, the rotation speed measuring mechanism 50 is not affected by wafer slippage, effectively ensuring the accuracy of wafer rotation speed measurement, thereby effectively controlling the wafer cleaning process and ensuring the cleaning effect of the wafer.

[0106] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0107] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer cleaning apparatus, characterized in that, include: Cabinet; clamping mechanism, disposed in the cabinet, for clamping the wafer to be processed; A rotation speed measuring mechanism is installed in the housing to measure the wafer rotation speed; The rotation speed measuring mechanism includes: a detection element hinged in the housing, one end of the detection element is provided with a rotating wheel, the rotating wheel can abut against the outer edge of the wafer and sense the wafer notch; A sensor is disposed at the other end of the detection element to measure the oscillation information of the detection element and thereby calculate the wafer rotation speed; the hinge point of the detection element is disposed close to the rotating wheel, so that the other end of the detection element can amplify the movement of the rotating wheel; the rotation speed measuring mechanism also includes a protective cover, which is sleeved on the outside of the detection element and covers the hinge point; the rotation speed measuring mechanism also includes an elastic element, which is connected to the side of the detection element to adjust the contact force between the rotating wheel of the detection element and the wafer.

2. The wafer cleaning apparatus according to claim 1, characterized in that, The rotational speed measuring mechanism also includes a limiting component, which is disposed on the side of the detection element, so that the detection element can swing around the hinge point in a fixed direction.

3. The wafer cleaning apparatus according to claim 1, characterized in that, One end of the detection element is a columnar structure, and the other end is a sheet-like structure; the rotating wheel is rotatably connected to the end of the columnar structure, and the sensor is disposed on the side of the sheet-like structure.

4. The wafer cleaning apparatus according to claim 1, characterized in that, The sensor is a photoelectric sensor.

5. The wafer cleaning apparatus according to claim 1, characterized in that, The rotational speed measuring mechanism also includes a pusher that can push the detection element to rotate around the hinge point, so that the wheel at the end of the detection element is not higher than the plane where the clamping mechanism holds the wafer.

6. The wafer cleaning apparatus according to claim 1, characterized in that, The number of rotational speed measuring mechanisms is at least two, and they are evenly distributed on the outer periphery of the wafer holding area of ​​the clamping mechanism.

7. A wafer cleaning apparatus, characterized in that, include: Cabinet; clamping mechanism, disposed in the cabinet, for clamping the wafer to be processed; A rotation speed measuring mechanism is installed in the housing to measure the wafer rotation speed; The rotational speed measuring mechanism includes: a detection element slidably connected in a housing, one end of which is equipped with a rotating wheel that can abut against the outer edge of the wafer; a wafer notch causes the rotating wheel in contact with it to move; a sensor, which is a torque sensor and connected to the other end of the detection element; the moving rotating wheel causes a change in the torque value of the sensor; when the torque value of the sensor reaches a set threshold, the sensor outputs a switching signal, and then calculates the wafer rotational speed based on the frequency of the switching signal; the rotational speed measuring mechanism also includes a sliding assembly, which includes a slide rail fixed to the housing and a sliding block connected to the detection element and capable of moving horizontally; the rotational speed measuring mechanism also includes an elastic element, one end of which is fixed to a support plate, and the other end of which is connected to the sliding block and presses against the sliding block, so that the rotating wheel presses against the edge of the wafer.

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