Chip lift module

Abstract

The application discloses a chip lifting module, which comprises a driving unit and a lifting unit. The driving unit is installed on a base and is used for providing lifting power and film suction negative pressure. The lifting unit is installed above the driving unit and is detachably connected with the driving unit through a quick-release structure. The lifting unit can be quickly switched according to different chips. The lifting unit is internally provided with a lifting rod, and a thimble is arranged at the upper end of the lifting rod. The lifting power provided by the driving unit acts on the lower end of the lifting rod, so that the chip on the blue film is lifted up through the thimble. The film suction negative pressure provided by the driving unit acts on the blue film on the wafer through the lifting unit, so that the blue film is downwardly adsorbed. The driving unit and the lifting unit are quickly connected, and the lifting unit can be quickly switched according to needs.

Description

Technical Field

[0001] This invention belongs to the field of chip mounting technology, specifically relating to a chip lifting module. Background Technology

[0002] When mounting chips on a lead frame, the chips need to be removed one by one from the wafer before mounting. This process requires a lifting module to lift the chips to facilitate chip removal.

[0003] However, different chips require lifting modules of corresponding sizes for lifting. Since the lifting process requires the simultaneous use of physical mechanisms for vertical lifting and negative pressure for adsorption, the lifting module can usually only be replaced as a whole, resulting in low efficiency in the disassembly and assembly of the entire device. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention proposes a chip lifting module, which has the advantages of quick-release connection between the driving unit and the lifting unit, and can quickly switch the lifting unit as needed.

[0006] According to an embodiment of the present invention, a chip lifting module includes: a driving unit mounted on a base, the driving unit being used to provide lifting power and suction negative pressure; and a lifting unit mounted above the driving unit, the lifting unit being detachably connected to the driving unit via a quick-release structure, the lifting unit being able to be quickly switched according to different chips, the lifting unit having a lifting rod inside, the upper end of the lifting rod being provided with a pin, the lifting power provided by the driving unit acting on the lower end of the lifting rod to lift the chip on the blue film through the pin, and the suction negative pressure provided by the driving unit acting on the blue film on the wafer through the lifting unit to adsorb the blue film downwards.

[0007] According to one embodiment of the present invention, the driving unit includes a voice coil motor mounted in the base; and a thrust shaft mounted at the output end of the voice coil motor, wherein the voice coil motor drives the thrust shaft to move in a vertical direction.

[0008] According to one embodiment of the present invention, a reading head is provided on one side of the base, and a detection bracket is slidably disposed on the base. The detection bracket is connected to the thrust shaft, and the detection bracket moves with the thrust shaft in the vertical direction, triggering the reading head during the movement.

[0009] According to one embodiment of the present invention, the quick-release structure includes a base plate mounted on the base; a plurality of magnets disposed within the base plate, the upper surfaces of the magnets being exposed to attract and fix the lifting unit; and a limiting post mounted on the upper surface of the base plate, the limiting post being used to position the lifting unit.

[0010] According to one embodiment of the present invention, a negative pressure connector is provided on one side of the base plate, and a first vacuum channel is provided on the base plate. The negative pressure connector is connected to one end of the first vacuum channel, and the other end of the first vacuum channel is connected to the lifting unit.

[0011] According to one embodiment of the present invention, the lifting unit includes a mounting base, the lower surface of which is in contact with the upper surface of the base plate, and a limiting engagement part provided on the mounting base, the limiting engagement part being positioned and engaged with the limiting post; and a housing, which is mounted above the mounting base, and the lifting rod and the ejector pin are both located inside the housing.

[0012] According to one embodiment of the present invention, a second vacuum channel is provided on the mounting base, one end of the second vacuum channel is connected to the first vacuum channel, the other end of the second vacuum channel is connected to the interior of the housing, and a first sealing ring is provided at the connection between the second vacuum channel and the first vacuum channel.

[0013] According to one embodiment of the present invention, the upper end of the housing is provided with a plurality of holes, the middle hole is used for the pin to pass through, and the remaining holes are used for negative pressure adsorption of the blue film.

[0014] According to one embodiment of the present invention, a second sealing ring is provided between the housing and the mounting base.

[0015] According to one embodiment of the present invention, an installation block is provided at the upper end of the lifting rod, a clamp is installed on the installation block, the ejector pin is vertically installed on the clamp, and the clamp is locked around its perimeter by locking caps.

[0016] According to one embodiment of the present invention, a sealing element is provided between the mounting base and the lifting rod. The sealing element is secured in the mounting base by a baffle plate, and the lifting rod protrudes downward from the baffle plate and abuts against the upper end of the thrust shaft.

[0017] According to one embodiment of the present invention, a limit ring and a spring are provided on the lifting rod, the lower end of the spring abuts against the limit ring, and the upper end of the spring abuts against the mounting base.

[0018] According to one embodiment of the present invention, the mounting base and the middle part of the lifting rod are slidably guided by a sliding limit sleeve.

[0019] The beneficial effects of this invention are as follows: The invention features a simple and compact structure, with the drive unit and lifting unit of the chip lifting module designed for quick-release connection. This allows for rapid replacement of the lifting unit for chips of different sizes without replacing the entire lifting module, thereby improving changeover speed and production efficiency. The invention uses a voice coil motor to drive the vertical lifting action, while a reading head accurately detects the lifting height, making the lifting height more precise and reliable. Furthermore, the lifting unit undergoes multiple sealing processes to ensure the stability of the negative pressure adsorption.

[0020] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention.

[0021] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, wherein:

[0023] Figure 1 This is a schematic diagram of the chip lifting module of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the drive unit of the present invention;

[0025] Figure 3 This is a schematic diagram of the drive unit of the present invention;

[0026] Figure 4 This is a schematic diagram of the lifting unit in this invention;

[0027] Figure 5 This is a cross-sectional structural schematic diagram of the lifting unit in this invention;

[0028] Reference numerals: Base 531, Voice coil motor 5311, Thrust shaft 5312, Reading head 5313, Detection bracket 5314, Base plate 532, Magnet 5321, Limiting post 5322, Negative pressure connector 5323, First vacuum channel 5324, Mounting seat 533, Second vacuum channel 5331, First sealing ring 5332, Limiting mating part 5333, Housing 534, Second sealing ring 5341, Hole 5342, Seal 535, Baffle 536, Spring 537, Limiting ring 538, Lifting rod 539, Sliding limiting sleeve 5391, Clamp 5392, Locking cap 5393, Mounting block 5394, Ejector pin 5395. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] The chip lifting module of the present invention will now be described in detail with reference to the accompanying drawings.

[0033] like Figures 1-4 As shown, the chip lifting module according to an embodiment of the present invention includes: a driving unit and a lifting unit. The driving unit is mounted on a base 531 and is used to provide lifting power and suction negative pressure. The lifting unit is mounted above the driving unit and is detachably connected to the driving unit through a quick-release structure. The lifting unit can be quickly switched according to different chips. The lifting unit has a lifting rod 539 inside, and a pin 5395 is provided at the upper end of the lifting rod 539. The lifting power provided by the driving unit acts on the lower end of the lifting rod 539 to lift the chip on the blue film through the pin 5395. The suction negative pressure provided by the driving unit acts on the blue film on the wafer through the lifting unit to adsorb the blue film downward.

[0034] In other words, the drive unit and the lifting unit are connected by a quick-release mechanism. The drive unit provides the power to lift the chip and the negative pressure to adsorb the blue film. When the lifting unit is replaced, the power to lift the chip and the negative pressure to adsorb the blue film are disconnected from the lifting unit. The connection is re-established after the lifting unit is replaced.

[0035] In this embodiment, the drive unit includes a voice coil motor 5311 and a thrust shaft 5312. The voice coil motor 5311 is installed inside the base 531; the thrust shaft 5312 is installed at the output end of the voice coil motor 5311, and the voice coil motor 5311 drives the thrust shaft 5312 to move in the vertical direction.

[0036] Furthermore, a reading head 5313 is provided on one side of the base 531, and a detection bracket 5314 is slidably provided on the base 531. The detection bracket 5314 is connected to the thrust shaft 5312. The detection bracket 5314 moves vertically along the thrust shaft 5312 and triggers the reading head 5313 during the movement.

[0037] In other words, the voice coil motor 5311 is vertically positioned, directly driving the thrust shaft 5312 to reciprocate vertically. Compared to a horizontally positioned motor driven by a cam mechanism, the direct drive structure is simpler, and the lifting speed is more stable with higher lifting accuracy. Furthermore, the reading head 5313 detects the lifting height of the detection bracket 5314, which in turn detects the lifting height of the ejector pin 5395 in real time, enabling real-time monitoring and adjustment of the chip lifting height, thus broadening its applicability.

[0038] The quick-release structure includes a base plate 532, multiple magnets 5321, and a limiting post 5322. The base plate 532 is mounted on the base 531. The multiple magnets 5321 are located inside the base plate 532, with their upper surfaces exposed to attract and fix the lifting unit. The limiting post 5322 is mounted on the upper surface of the base plate 532 and is used to position the lifting unit.

[0039] A through hole is provided in the upper center of the base plate 532 for the thrust shaft 5312 to pass through. There are two limiting posts 5322, which are located on the left and right sides of the through hole. In this embodiment, the limiting posts 5322 are positioning pins, which perform two-point positioning of the drive unit, making the positioning more accurate.

[0040] Preferably, a negative pressure connector 5323 is provided on one side of the base plate 532, and a first vacuum channel 5324 is formed on the base plate 532. The negative pressure connector 5323 is connected to one end of the first vacuum channel 5324, and the other end of the first vacuum channel 5324 leads into the lifting unit. The other end of the first vacuum channel 5324 is located on the upper surface of the base plate 532. When the drive unit is replaced, the docking of the first vacuum channel 5324 and the docking of the thrust shaft 5312 are completed simultaneously.

[0041] In this embodiment, the lifting unit includes a mounting base 533 and a housing 534. The lower surface of the mounting base 533 is in contact with the upper surface of the base plate 532. The mounting base 533 is provided with a limiting engagement part 5333, which engages with the limiting post 5322 for positioning. The housing 534 is mounted above the mounting base 533, and the lifting rod 539 and the ejector pin 5395 are both located inside the housing 534. The limiting engagement part 5333 is a semi-circular surface, and there are two limiting engagement parts 5333. The two limiting engagement parts 5333 engage with the two limiting posts 5322 respectively. When replacing the lifting unit, the mounting base 533 is disassembled and assembled in the vertical direction, so that the semi-circular surface and the limiting post 5322 complete the insertion engagement and positioning.

[0042] Furthermore, a second vacuum channel 5331 is provided on the mounting base 533. One end of the second vacuum channel 5331 is connected to the first vacuum channel 5324, and the other end of the second vacuum channel 5331 is connected to the interior of the housing 534. A first sealing ring 5332 is provided at the connection between the second vacuum channel 5331 and the first vacuum channel 5324. A second sealing ring 5341 is also provided between the housing 534 and the mounting base 533.

[0043] Furthermore, the upper end of the housing 534 is provided with multiple holes 5342, the middle hole 5342 is used for the pin 5395 to pass through, and the other holes 5342 are used for negative pressure adsorption of the blue film.

[0044] Multiple holes 5342 are evenly arranged in a circular array. Negative pressure is applied to the blue membrane sequentially through the first vacuum channel 5324, the second vacuum channel 5331, the shell 534, and the holes 5342. The first sealing ring 5332 is located between the upper surface of the base plate 532 and the lower surface of the mounting base 533, and the seal is completed when the mounting base 533 is attracted by the magnet 5321.

[0045] According to one embodiment of the present invention, a mounting block 5394 is provided at the upper end of the lifting rod 539, and a clamp 5392 is mounted on the mounting block 5394. A ejector pin 5395 is vertically mounted on the clamp 5392, and the clamp 5392 is locked around its perimeter by a locking cap 5393. In this embodiment, the mounting block 5394 is sleeved on the upper end of the lifting rod 539, and the mounting block 5394 is fixed by a screw passing through it from the side and pressing against the lifting rod 539. The clamp 5392 has multiple clamping blocks arranged in a circumferential direction. The locking cap 5393 is sleeved on the clamp 5392. When locking, the multiple clamping blocks tighten inward, thereby clamping the ejector pin 5395.

[0046] A sealing element 535 is provided between the mounting base 533 and the lifting rod 539. The sealing element 535 is locked in the mounting base 533 by a baffle 536. The lifting rod 539 protrudes downward from the baffle 536 and abuts against the upper end of the thrust shaft 5312.

[0047] Furthermore, a limit ring 538 and a spring 537 are provided on the lifting rod 539. The lower end of the spring 537 abuts against the limit ring 538, and the upper end of the spring 537 abuts against the mounting base 533.

[0048] In other words, the mounting base 533 has two stepped holes. A sealing element 535 is placed at the opening of the stepped hole and is limited and fixed by a baffle 536. The outer circumferential surface of the sealing element 535 seals with the mounting base 533, and the inner circumferential surface of the sealing element 535 seals with the lifting rod 539. This ensures sealing performance when the lifting rod 539 is lifted, thereby improving the vacuum adsorption effect. On the other hand, a spring 537 is set at the bottom of the stepped hole. The elastic force of the spring 537 applies a downward force to the lifting rod 539, thereby ensuring that the lifting rod 539 always presses downward against the thrust shaft 5312. After the lifting is completed, the lifting rod 539 can fall down with the thrust shaft 5312.

[0049] Furthermore, the mounting base 533 and the middle part of the lifting rod 539 are connected by a sliding guide sleeve 5391.

[0050] In other words, the sliding limit sleeve 5391 is installed on the inner wall of the mounting base 533 and is slidably connected to the middle of the lifting rod 539. The sliding limit sleeve 5391 is a ball spline, which means that the sliding limit sleeve 5391 can guide the up and down movement of the lifting rod 539 to ensure stability during lifting. At the same time, it can prevent the lifting rod 539 from rotating during lifting, ensuring that the chip will not rotate when it is lifted. This can effectively avoid affecting the chip mounting angle.

[0051] In summary, this invention features a simple and compact structure. The drive unit and lifting unit of the chip lifting module are designed with a quick-release connection, allowing for rapid replacement of the lifting unit for chips of different sizes without replacing the entire lifting module, thus improving changeover speed and production efficiency. This invention uses a voice coil motor 5311 to drive the vertical lifting action, while a reading head 5313 accurately detects the lifting height, making the lifting height more precise and reliable. Multiple sealing processes within the lifting unit ensure the stability of the negative pressure adsorption. A spring 537 applies pressure to the lifting rod 539, ensuring unified movement between the lifting rod 539 and the drive unit. A sliding limit sleeve 5391 guides the lifting rod 539 vertically and limits its circumferential movement, improving the lifting effect.

[0052] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0053] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip lifting module, characterized in that, include: A drive unit is mounted on a base (531) and is used to provide lifting power and suction negative pressure. A lifting unit is installed above the driving unit. The lifting unit and the driving unit are detachably connected by a quick-release structure. The lifting unit can be quickly switched according to different chips. The lifting unit has a lifting rod (539) inside. The upper end of the lifting rod (539) is provided with a pin (5395). The lifting power provided by the driving unit acts on the lower end of the lifting rod (539) to lift the chip on the blue film through the pin (5395). The suction negative pressure provided by the driving unit acts on the blue film on the wafer through the lifting unit to adsorb the blue film downward. The drive unit includes a voice coil motor (5311) and a thrust shaft (5312). The voice coil motor (5311) is installed inside the base (531), and the thrust shaft (5312) is installed at the output end of the voice coil motor (5311). The voice coil motor (5311) drives the thrust shaft (5312) to move in the vertical direction. The quick-release structure includes a base plate (532), multiple magnets (5321), and a limiting post (5322). The base plate (532) is mounted on the base (531). The multiple magnets (5321) are disposed inside the base plate (532). The upper surface of the magnets (5321) is exposed to attract and fix the lifting unit. The limiting post (5322) is mounted on the upper surface of the base plate (532) and is used to position the lifting unit. A negative pressure connector (5323) is provided on one side of the base plate (532), and a first vacuum channel (5324) is provided on the base plate (532). The negative pressure connector (5323) is connected to one end of the first vacuum channel (5324), and the other end of the first vacuum channel (5324) is connected to the lifting unit. The lifting unit includes a mounting base (533) and a housing (534). The lower surface of the mounting base (533) is in contact with the upper surface of the base plate (532). The mounting base (533) is provided with a limiting engagement part (5333), which engages with the limiting post (5322) for positioning. The housing (534) is mounted above the mounting base (533), and the lifting rod (539) and the ejector pin (5395) are both located inside the housing (534). The mounting base (533) is provided with a second vacuum channel (5331), one end of the second vacuum channel (5331) is connected to the first vacuum channel (5324), and the other end of the second vacuum channel (5331) is connected to the inside of the housing (534). A sealing ring (5332) is provided at the connection between the second vacuum channel (5331) and the first vacuum channel (5324). A sealing element (535) is provided between the mounting base (533) and the lifting rod (539). The sealing element (535) is secured in the mounting base (533) by a baffle (536). The lifting rod (539) protrudes downward from the baffle (536) and abuts against the upper end of the thrust shaft (5312). The lifting rod (539) is provided with a limit ring (538) and a spring (537). The lower end of the spring (537) abuts against the limit ring (538), and the upper end of the spring (537) abuts against the mounting base (533). The mounting base (533) and the middle part of the lifting rod (539) are slidably guided by a sliding limit sleeve (5391).

2. The chip lifting module according to claim 1, characterized in that, A reading head (5313) is provided on one side of the base (531), and a detection bracket (5314) is slidably provided on the base (531). The detection bracket (5314) is connected to the thrust shaft (5312). The detection bracket (5314) moves vertically along the thrust shaft (5312) and triggers the reading head (5313) during the movement.

3. The chip lifting module according to claim 1, characterized in that, The upper end of the housing (534) has multiple holes (5342), the middle hole (5342) is used for the pin (5395) to pass through, and the other holes (5342) are used for negative pressure adsorption of the blue film.

4. The chip lifting module according to claim 1, characterized in that, A second sealing ring (5341) is provided between the housing (534) and the mounting base (533).

5. The chip lifting module according to claim 1, characterized in that, The upper end of the lifting rod (539) is provided with a mounting block (5394), and a clamp (5392) is mounted on the mounting block (5394). The ejector pin (5395) is vertically mounted on the clamp (5392), and the clamp (5392) is locked around its perimeter by locking caps (5393).

Images