Multi-source information fusion perception structure and integration method

Abstract

The application discloses a kind of multi-source information fusion perception structure and integrated method, belong to integrated manufacturing technical field.Rigid-flexible integrated board includes horizontal base plate, first vertical base plate and second vertical base plate, and first vertical base plate and second vertical base plate are vertically installed with horizontal base plate, and first vertical base plate and second vertical base plate are vertically arranged.By using rigid-flexible integrated board to install inertial sensor, the orthogonality of sensor is realized after folding, because non-orthogonal error is derived from installation error in assembly process, and installation surface deformation caused by mechanical stress and environmental stress in use process.To ensure low non-orthogonal error, high-precision, high-stability orthogonal assembly needs to be realized.Preform shape is carried out using mold, then sensor substrate and other substrates are stacked, micro coaxial cable is embedded in the stacking path to form a radio frequency signal channel, and finally resin encapsulation PoP packaging is carried out to meet the requirements of frameless orthogonal integrated sensor and radio frequency signal transmission.

Description

Technical Field

[0001] This invention belongs to the field of integrated manufacturing technology and relates to a multi-source information fusion sensing structure and integration method. Background Technology

[0002] Microsystems are miniaturized systems capable of information acquisition, processing, exchange, execution, or power supply, serving as a crucial bridge connecting systems and fundamental components. One microsystem for flight status control comprises an inertial information sensing unit, a signal processing unit, and a servo control output unit, integrated in three dimensions using Point of Precision (PoP) technology. It is a typical example of a multidisciplinary integrated microsystem module.

[0003] The traditional solution uses a six-sided perforated cubic aluminum alloy frame to position and mount sensors in three directions. To meet the mechanical stability requirements of the sensors, the frame columns need to be thickened, the PCB board for mounting the sensors needs to be over 4mm thick, and soldered cables are used to interconnect the orthogonal board and the control board. This results in a large weight and volume, and cannot meet the overload requirements of applications exceeding 3000g. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that the existing microsystem structures are large in size and weight and cannot meet the overload application requirements of more than 3000g, and to provide a multi-source information fusion sensing structure and integration method.

[0005] To achieve the above objectives, the present invention employs the following technical solution:

[0006] The present invention proposes a multi-source information fusion sensing structure, including a rigid-flex integrated board and five organic substrates; adjacent organic substrates are arranged in parallel, and interlayer spacers are provided on both sides of each organic substrate. A through hole is opened on the third organic substrate. One end of the rigid-flex integrated board is mounted on the fourth organic substrate, and the other end of the rigid-flex integrated board is placed on the second organic substrate through the through hole. An external lead is installed on the upper surface of the first organic substrate, and a radio frequency line is connected on the third organic substrate.

[0007] Preferably, the rigid-flex integrated board includes a horizontal substrate, a first vertical substrate, and a second vertical substrate;

[0008] The horizontal substrate is mounted on the upper surface of the second organic substrate and placed parallel to the second organic substrate. The first vertical substrate and the second vertical substrate are both connected to the bottom surface of the fourth organic substrate through through holes. The first vertical substrate and the second vertical substrate are both mounted perpendicular to the horizontal substrate and are arranged perpendicularly.

[0009] Preferably, the first vertical substrate and the horizontal substrate, and the second vertical substrate and the horizontal substrate are all connected by a flexible band.

[0010] Preferably, the first vertical substrate and the horizontal substrate, the second vertical substrate and the horizontal substrate, and the first vertical substrate and the second vertical substrate are all vertically arranged by orthogonal angle conformal fixtures.

[0011] Preferably, the first vertical substrate, the second vertical substrate, and the horizontal substrate are fixed with epoxy adhesive.

[0012] Preferably, the space between the through hole and the rigid-flex integrated plate is filled with insulating adhesive.

[0013] Preferably, the organic substrate and the interlayer spacer are fixed by positioning posts.

[0014] Preferably, the thickness of the interlayer spacer is greater than the height of the internal components.

[0015] Preferably, the internal potting and filling of the stacked structure is made of resin material.

[0016] This invention proposes an integration method for a multi-source information fusion sensing structure, which employs a multi-source information fusion sensing structure and includes the following steps:

[0017] Interlayer spacers are provided above and below each organic substrate, and through holes are provided on the third organic substrate;

[0018] To straighten the rigid-flex integrated board, one end of the rigid-flex integrated board is mounted on the fourth organic substrate, and the other end of the rigid-flex integrated board is placed on the second organic substrate through the through hole.

[0019] The radio frequency (RF) wires are threaded and fixed, and the RF wires are extended out of the first organic substrate. After installation, a stacked structure is formed. The inside of the stacked structure is potted with resin. After potting and curing, it is encapsulated and cut to form a cubic shape.

[0020] Selective composite plating is performed on the non-lead surfaces of a cube shape, and three-dimensional interconnect conductors are etched into the surface plating layer to realize the integration of a multi-source information fusion sensing structure.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention proposes a multi-source information fusion sensing structure that integrates multiple single-axis MEMS inertial sensors on a rigid-flex integrated board using a frameless orthogonal approach. It employs embedded high-speed cables to extract radio frequency signals from a navigation receiver, achieving multi-source information fusion sensing from inertial and satellite navigation systems. This invention achieves sensor orthogonality by mounting inertial sensors on a rigid-flex integrated substrate, stacking an organic substrate with the rigid-flex integrated board, embedding micro-coaxial cables along the stacking path to form radio frequency signal channels, and finally encapsulating the components to meet the requirements of frameless orthogonal sensor integration and radio frequency signal transmission.

[0023] Furthermore, orthogonality determines the difficulty of error calibration and the accuracy of subsequent applications. This non-orthogonal error originates from the deviation of the sensor's rotation and tilt angles within an ideal plane, requiring that the orthogonal error angle of each sensor be maintained at an error level within seconds. Non-orthogonal errors also arise from installation errors during assembly, and deformation of the mounting surface caused by mechanical and environmental stresses during use. To ensure low non-orthogonal errors, high-precision, high-stability orthogonal assembly is necessary.

[0024] Furthermore, epoxy adhesive is used for bonding and curing to achieve conformal locking of the orthogonal structure.

[0025] This invention proposes an integration method for a multi-source information fusion sensing structure. By using a rigid-flex integrated substrate to mount an inertial sensor, the orthogonality of the sensor is achieved. An organic substrate and a rigid-flex integrated board are stacked, and micro coaxial cables are embedded in the stacking path to form a radio frequency signal channel. Finally, the system is packaged to meet the requirements of frameless orthogonal integrated sensor and radio frequency signal transmission. The integration method is reliable. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the rigid-flex integrated board design of the present invention.

[0028] Figure 2 This is the orthogonal conformal tooling of the present invention.

[0029] Figure 3 This is a diagram of the stacked structure and a schematic diagram of the radio frequency line lead-out of the present invention.

[0030] Figure 4 This is a physical stacked structure that forms a self-sealing cavity structure according to the present invention.

[0031] Wherein: 1-rigid-flex integrated board, 1-1-horizontal substrate, 1-2-first vertical substrate, 1-3-second vertical substrate, 2-1-first organic substrate, 2-2-second organic substrate, 2-3-third organic substrate, 2-4-fourth organic substrate, 2-5-fifth organic substrate, 3-interlayer spacer, 4-positioning post, 5-flex strip, 6-cutting line, 7-RF line, 8-stacked structure. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0037] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0038] The present invention will now be described in further detail with reference to the accompanying drawings:

[0039] This invention proposes a multi-source information fusion sensing structure, such as... Figures 1 to 4 As shown, the system includes a rigid-flex integrated board 1 and five organic substrates. The organic substrates include a first organic substrate 2-1, a second organic substrate 2-2, a third organic substrate 2-3, a fourth organic substrate 2-4, and a fifth organic substrate 2-5. Adjacent organic substrates are arranged parallel to each other. Interlayer spacers 3 are provided on both sides of each organic substrate. A through-hole is formed on the third organic substrate 2-3. One end of the rigid-flex integrated board 1 is mounted on the fourth organic substrate 2-4, and the other end of the rigid-flex integrated board 1 passes through the through-hole and is positioned on the second organic substrate 2-2. External leads are mounted on the upper surface of the first organic substrate 2-1, and radio frequency lines 7 are connected to the third organic substrate. The outer wall of the interlayer spacer 3 has a cubic shape. Selective composite plating is performed on the five non-lead surfaces of the cubic shape. Finally, three-dimensional interconnect conductors are etched onto the surface plating layer using laser etching to achieve lateral three-dimensional interconnection. Insulating adhesive is filled between the through-hole and the rigid-flex integrated board 1. The organic substrates and the interlayer spacers 3 are fixed by positioning posts 4.

[0040] The rigid-flex integrated board 1 includes a horizontal substrate 1-1, a first vertical substrate 1-2, and a second vertical substrate 1-3. The horizontal substrate 1-1 is mounted on a second organic substrate 2-2 and is placed horizontally with the second organic substrate 2-2. Both the first vertical substrate 1-2 and the second vertical substrate 1-3 are connected to the bottom surface of a fourth organic substrate 2-4 through through holes. The first vertical substrate 1-2 and the second vertical substrate 1-3 are both mounted perpendicularly to the horizontal substrate 1-1 and are arranged perpendicularly. The first vertical substrate 1-2 and the horizontal substrate 1-1, the second vertical substrate 1-3 and the horizontal substrate 1-1, and the first vertical substrate 1-2 and the second vertical substrate 1-3 are all vertically arranged through orthogonal angle conformal fixtures. The first vertical substrate 1-2 and the horizontal substrate 1-1, and the second vertical substrate 1-3 and the horizontal substrate 1-1 are all connected by a wrapping tape 5; the first vertical substrate 1-2, the second vertical substrate 1-3 and the horizontal substrate 1-1 are fixed by epoxy adhesive.

[0041] The thickness of the interlayer spacer 3 is greater than the height of the internal components, which is determined based on the height of the internal components.

[0042] The present invention proposes an integration method for a multi-source information fusion sensing structure, comprising the following steps:

[0043] Step 1: Interlayer spacers 3 are provided above and below each organic substrate, and through holes are provided on the third organic substrate 2-3;

[0044] Step 2: Correct the rigid-flex integrated board 1. Mount one end of the rigid-flex integrated board 1 on the fourth organic substrate 2-4 and set the other end of the rigid-flex integrated board 1 on the second organic substrate 2-2.

[0045] Step 3: Thread and fix the RF wire 7, extend the RF wire 7 out of the first organic substrate 2-1, and after installation, form a stacked structure 8. Fill the inside of the stacked structure 8 with resin, and after the filling and curing, encapsulate and cut to form a cubic shape.

[0046] Step 4: Selectively composite plate the non-lead surfaces of the cube shape, and etch three-dimensional interconnect conductors on the surface coating to realize the integration of multi-source information fusion sensing structure.

[0047] The specific steps are as follows:

[0048] First, the rigid-flex integrated board is designed to achieve process interconnection of the three assembly surfaces.

[0049] In the sensing microsystems project, the three single-axis accelerometers and three single-axis gyroscopes need to be orthogonal. Their orthogonality determines the difficulty of error calibration and the accuracy of subsequent applications. This non-orthogonal error originates from the deviations in the rotation and tilt angles of the sensors within an ideal plane. It is necessary to ensure that the orthogonal error angle of each sensor is maintained at an error level within seconds. Non-orthogonal errors also arise from installation errors during assembly and deformation of the mounting surface caused by mechanical and environmental stresses during use. To ensure low non-orthogonal errors, high-precision and high-stability orthogonal assembly is required.

[0050] To achieve this goal, a rigid-flex duct integrated plate was designed in this project, see... Figure 1 The Y-axis and Z-axis are separated by a perforation, and when perpendicular to the X-axis via a flexible strip, they can form a three-plane orthogonal assembly structure with the X-axis.

[0051] Second, design orthogonal conformal molds to fix the orthogonal structure.

[0052] To precisely fix the orthogonal structure, an orthogonal conformal mold was designed. Using a specially machined orthogonal structural component positioning fixture, the Y-axis and Z-axis substrates are orthogonally positioned. An alignment interface is designed on the lower substrate. After the flexible plate is inserted into the interface, epoxy adhesive is used for bonding and curing. This pre-bonding method achieves conformal locking of the orthogonal structure, thus ensuring the mutual orthogonality of the inertial navigation component's sensitive axes and the sensor installation accuracy even without a frame. See the orthogonal angle conformal fixture for details. Figure 2 .

[0053] Third, microsystem substrate stacking

[0054] This sensing microsystem is assembled in three dimensions using a 5-layer organic interconnect substrate and an interlayer spacer 3. The stacked structure is shown in [see figure]. Figure 3 To achieve resin potting, a method similar to SiP is used: a U-shaped interlayer spacer is used to control the layer height. This spacer is bonded to the substrate using liquid insulating adhesive, forming a self-potting cavity during stacking. After potting and curing, the perforated substrate and the stack are ground together as a single unit. A physical stack structure forming the self-potting structure is shown in [image / description]. Figure 4 .

[0055] Fourth, design a through-layer buried structure to implant micro-coaxial cables.

[0056] Radio frequency (RF) signal line channels are pre-reserved in the middle of each interconnect substrate. While stacking the substrate layers, the RF signal lines are threaded and secured, extending them out from the bottom surface. See the schematic diagram for the RF line lead-out. Figure 3 As shown.

[0057] Fifth, perform POP encapsulation on the microsystem.

[0058] The stacked components are encapsulated in resin to form a solid package structure. The package is then cut to expose the sides of the gold fingers at the substrate edge, forming a cubic shape. Selective composite plating is performed on the five non-lead surfaces of the shape, and finally, three-dimensional interconnect conductors are etched on the surface conductors to achieve three-dimensional interconnection on the sides.

[0059] This invention proposes a PoP (Position-of-Package) integration method for multi-source information fusion sensing microsystems. It utilizes PoP packaging to achieve three-dimensional microsystem integration. A frameless orthogonal structure assembly of a 9-axis inertial sensor is achieved through the design of an orthogonal conformal mold. A through-layer embedded structure is designed to embed micro-coaxial cables, enabling high-frequency signal transmission within the PoP package. Within the PoP package based on insulating sidewalls, a frameless orthogonal structure assembly of a 9-axis inertial sensor is achieved while maintaining orthogonality and structural stability. High-frequency signal transmission is achieved through the internal embedding of micro-coaxial cables. Specifically, this approach avoids the use of ultra-thick substrates and heavy metal frame support structures added to achieve orthogonality in other board-level products designed to reduce vibration deformation in MEMS applications. It eliminates structural components unrelated to system performance, significantly reducing module size and weight. The design of through-layer channels within the PoP package ensures high-quality RF signal transmission, enabling engineering applications.

[0060] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A multi-source information fusion sensing structure, characterized in that, It includes a rigid-flex integrated board (1) and five organic substrates; adjacent organic substrates are arranged in parallel, and interlayer spacers (3) are provided on both sides of each organic substrate. A through hole is opened on the third organic substrate. One end of the rigid-flex integrated board (1) is installed on the fourth organic substrate, and the other end of the rigid-flex integrated board (1) is passed through the through hole and located on the second organic substrate. An external lead is installed on the upper surface of the first organic substrate, and a radio frequency line (7) is connected on the third organic substrate. The rigid-flex integrated board (1) includes a horizontal substrate (1-1), a first vertical substrate (1-2), and a second vertical substrate (1-3); the horizontal substrate (1-1) is mounted on the upper surface of the second organic substrate and placed parallel to the second organic substrate; the first vertical substrate (1-2) and the second vertical substrate (1-3) are both connected to the bottom surface of the fourth organic substrate through through holes; the first vertical substrate (1-2) and the second vertical substrate (1-3) are both mounted perpendicularly to the horizontal substrate (1-1), and the first vertical substrate (1-2) and the second vertical substrate (1-3) are arranged vertically. The first vertical substrate (1-2) and the horizontal substrate (1-1), the second vertical substrate (1-3) and the horizontal substrate (1-1), and the first vertical substrate (1-2) and the second vertical substrate (1-3) are all vertically arranged by orthogonal angle conformal fixtures.

2. The multi-source information fusion sensing structure according to claim 1, characterized in that, The first vertical substrate (1-2) and the horizontal substrate (1-1), and the second vertical substrate (1-3) and the horizontal substrate (1-1) are all connected by a flexible band.

3. The multi-source information fusion sensing structure according to claim 1, characterized in that, The first vertical substrate (1-2), the second vertical substrate (1-3), and the horizontal substrate (1-1) are fixed with epoxy resin.

4. The multi-source information fusion sensing structure according to claim 1, characterized in that, The through hole and the rigid-flexible integrated plate (1) are filled with insulating adhesive.

5. The multi-source information fusion sensing structure according to claim 1, characterized in that, The organic substrate and the interlayer spacer (3) are fixed by positioning posts (4).

6. The multi-source information fusion sensing structure according to claim 1, characterized in that, The thickness of the interlayer spacer (3) is greater than the height of the internal components.

7. An integration method for a multi-source information fusion sensing structure, characterized in that, The multi-source information fusion sensing structure according to any one of claims 1 to 6 includes the following steps: Interlayer spacers (3) are provided above and below each organic substrate, and through holes are provided on the third organic substrate; The rigid-flex integrated board (1) is straightened. One end of the rigid-flex integrated board (1) is mounted on the fourth organic substrate, and the other end of the rigid-flex integrated board (1) is placed on the second organic substrate through the through hole. The radio frequency line (7) is threaded and fixed, and the radio frequency line (7) extends out of the first organic substrate. After installation, a stacked structure (8) is formed. The interior of the stacked structure (8) is encapsulated with resin. After the encapsulation is cured, it is encapsulated and cut to form a cubic shape. Selective composite plating is performed on the non-lead surfaces of a cube shape, and three-dimensional interconnect conductors are etched into the surface plating layer to realize the integration of a multi-source information fusion sensing structure.

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