Container for wiring circuit substrate

Abstract

A wiring circuit board container (1) for housing a wiring circuit board (C) includes a housing portion (2A) capable of housing one wiring circuit board (C), and a protrusion (23A) disposed inside the housing portion (2A) and extending in a thickness direction of the wiring circuit board (C) in a state where the wiring circuit board (C) is housed in the housing portion (2A), the protrusion (23A) facing an edge (E1) of the wiring circuit board (C) in a direction orthogonal to the thickness direction of the wiring circuit board (C) in the state where the wiring circuit board (C) is housed in the housing portion (2A).

Description

Technical Field

[0001] This invention relates to a container for wiring circuit boards. Background Technology

[0002] Conventionally, a container for accommodating a wiring circuit board is known. The container has a bottom wall and a peripheral sidewall extending upward from the periphery of the bottom wall. The wiring circuit board has a protruding portion made of an insulating layer. When the wiring circuit board moves within the container, the protruding portion of the wiring circuit board contacts the peripheral sidewall. This suppresses contact between the periphery of the metal support layer and the peripheral sidewall, thereby suppressing the generation of foreign matter due to contact between the periphery of the metal support layer and the peripheral sidewall (see, for example, Patent Document 1 below).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-34481 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In a container as described in Patent Document 1, if a wiring circuit board without protruding portions is contained, it may be impossible to suppress the generation of foreign matter.

[0008] Therefore, sometimes it is desirable to have a container that can suppress the generation of foreign matter regardless of whether the wiring circuit board has protruding parts.

[0009] The present invention provides a container for a wiring circuit board that can suppress the generation of foreign matter due to contact between the edge of the wiring circuit board and the receiving portion.

[0010] Solution for solving the problem

[0011] The present invention [1] provides a container for accommodating a wiring circuit board, wherein the container for accommodating the wiring circuit board includes: a receiving portion capable of accommodating one wiring circuit board; and a protrusion disposed within the receiving portion, wherein the protrusion extends along the thickness direction of the wiring circuit board when the wiring circuit board is accommodated within the receiving portion, and the protrusion faces the edge of the wiring circuit board in a direction orthogonal to the thickness direction of the wiring circuit board when the wiring circuit board is accommodated within the receiving portion.

[0012] With this structure, when the wiring circuit board is housed in the receiving section and transported, the protrusions can prevent the wiring circuit board from moving within the receiving section.

[0013] Therefore, it is possible to reduce the contact between the edge of the wiring circuit board and the sidewall of the receiving part.

[0014] As a result, it is possible to suppress the generation of foreign objects due to contact between the edge of the wiring circuit board and the sidewall of the receiving part.

[0015] Based on the wiring circuit board container of the present invention [2], the receiving portion has a sidewall that faces the edge at a distance from it when the wiring circuit board is received in the receiving portion, and the protrusion is disposed between the edge and the sidewall when the wiring circuit board is received in the receiving portion.

[0016] This structure allows the protrusions to suppress contact between the edge of the wiring circuit board and the sidewall of the receiving part.

[0017] Based on the wiring circuit board container of the present invention [3], the receiving portion has a bottom wall and the protrusion has an inclined surface that slopes away from the side wall as it approaches the bottom wall.

[0018] With this structure, when the wiring circuit board is received in the receiving part, the inclined surface can be used to guide the wiring circuit board away from the side wall.

[0019] As a result, when the wiring circuit board is accommodated in the receiving part, it is also possible to suppress the contact between the edge of the wiring circuit board and the side wall of the receiving part.

[0020] Based on the wiring circuit board container of the present invention [4], the receiving portion has a receiving area for receiving the wiring circuit board, the protrusion is disposed outside the receiving area, and when the wiring circuit board is received into the receiving portion, the inclined surface can guide the wiring circuit board toward the receiving area.

[0021] This structure allows the wiring circuit board to be reliably housed within the housing area.

[0022] Based on the container for wiring circuit board described in any one of [1] to [4] above, the wiring circuit board has a plurality of said edges, and the container for wiring circuit board has at least one protrusion relative to each of the plurality of said edges.

[0023] With this structure, contact between the material and the sidewalls of the receiving part can be suppressed at all edges of the multiple edges.

[0024] Therefore, it is possible to further suppress the generation of foreign objects due to the contact between the edge of the wiring circuit board and the sidewall of the receiving part.

[0025] Based on the container for wiring circuit boards described in any one of [1] to [5] above, the present invention [6] has a bottom wall with an opening for inspecting the wiring circuit board contained in the container.

[0026] With this structure, the wiring circuit board can be inspected through the opening while it is housed in the receiving part.

[0027] Based on the wiring circuit board container of the above [6], the present invention [7] wherein, in the state where the wiring circuit board is housed in the housing, a portion of the edge of the wiring circuit board overlaps with the opening in the thickness direction of the wiring circuit board.

[0028] With this structure, the edges of the wiring circuit board can be inspected through the opening while the wiring circuit board is housed in the receiving part.

[0029] The effects of the invention

[0030] The container for wiring circuit boards according to the present invention can suppress the generation of foreign matter due to contact between the edge of the wiring circuit board and the sidewall of the receiving portion. Attached Figure Description

[0031] Figure 1 This is a top view of a container for a wiring circuit board, as an embodiment of the present invention.

[0032] Figure 2 yes Figure 1 A three-dimensional view of the receiving part is shown.

[0033] Figure 3 Indicates in Figure 2 The diagram shows a top view of the housing containing the wiring circuit board.

[0034] Figure 4 yes Figure 3 The diagram shows a cross-sectional view (AA) of the container used for wiring circuit boards. Detailed Implementation

[0035] 1. Wiring circuit board container

[0036] like Figure 1 As shown, the container 1 for wiring circuit boards includes at least one receiving portion 2. In this embodiment, the container 1 for wiring circuit boards has multiple receiving portions 2.

[0037] Each of the plurality of receiving portions 2 can accommodate one wiring circuit board C. That is, the container 1 for wiring circuit boards can accommodate multiple wiring circuit boards C. The plurality of receiving portions 2 are arranged along a first direction and a second direction. The second direction is orthogonal to the first direction. The first and second directions are orthogonal to the vertical direction. When the wiring circuit board C is accommodated in the receiving portion 2, the wiring circuit board C has a thickness in the vertical direction. That is, when the wiring circuit board C is accommodated in the receiving portion 2, both the first and second directions are orthogonal to the thickness direction of the wiring circuit board C. Hereinafter, we will describe one of the plurality of receiving portions 2, receiving portion 2A, as an example.

[0038] like Figure 2 and Figure 3 As shown, in this embodiment, the receiving portion 2A has a rectangular shape. However, the shape of the receiving portion 2A is not limited. The receiving portion 2A has a receiving area A, multiple sidewalls 21A, 21B, 21C, 21D, a bottom wall 22, and multiple protrusions 23A, 23B, 23C, 23D. In other words, the container 1 for the wiring circuit board has multiple protrusions 23A, 23B, 23C, 23D.

[0039] (1) Accommodation area

[0040] The receiving area A is the area that receives the wiring circuit board C. The receiving area A is disposed in the center of the receiving portion 2. The shape of the receiving area A is the same as the shape of the wiring circuit board C. In this embodiment, the wiring circuit board C has a rectangular shape. The wiring circuit board C has multiple edges E1, E2, E3, and E4.

[0041] With the wiring circuit board C housed in the receiving portion 2A, edge E1 is disposed at one end of the wiring circuit board C in a first direction. Edge E1 extends along a second direction.

[0042] With the wiring circuit board C housed in the receiving portion 2A, edge E2 is disposed at the other end of the wiring circuit board C in the first direction. Edge E2 extends along the second direction.

[0043] With the wiring circuit board C housed in the receiving portion 2A, edge E3 is disposed at one end of the wiring circuit board C in a second direction. Edge E3 extends along the first direction.

[0044] With the wiring circuit board C housed in the receiving portion 2A, edge E4 is disposed at the other end of the wiring circuit board C in the second direction. Edge E4 extends along the first direction.

[0045] (2) Side wall

[0046] Sidewall 21A is disposed at one end of the receiving portion 2 in a first direction. Sidewall 21A extends in a second direction. When the wiring circuit board C is received within the receiving portion 2A, sidewall 21A faces the edge E1 of the wiring circuit board C at a distance in the first direction. In addition, sidewall 21A separates two adjacent receiving portions 2A and 2B in the first direction.

[0047] Sidewall 21B is disposed at the other end of the receiving portion 2A in the first direction. Sidewall 21B extends in the second direction. When the wiring circuit board C is received in the receiving portion 2A, sidewall 21B faces the edge E2 of the wiring circuit board C at a distance in the first direction. In addition, sidewall 21B separates two adjacent receiving portions 2A and 2C in the first direction.

[0048] A sidewall 21C is disposed at one end of the receiving portion 2A in a second direction. The sidewall 21C extends along a first direction. When the wiring circuit board C is received within the receiving portion 2A, the sidewall 21C faces the edge E3 of the wiring circuit board C at a distance in the second direction. In addition, the sidewall 21C separates two adjacent receiving portions 2A and 2D in the second direction.

[0049] Sidewall 21D is disposed at the other end of the receiving portion 2A in the second direction. Sidewall 21D extends along the first direction. When the wiring circuit board C is received within the receiving portion 2A, sidewall 21D faces the edge E4 of the wiring circuit board C at a distance in the second direction. In addition, sidewall 21D separates two adjacent receiving portions 2A and 2E in the first direction.

[0050] (3)Bottom wall

[0051] like Figure 4 As shown, a bottom wall 22 is disposed at the lower end of the receiving portion 2A. With the wiring circuit board C housed within the receiving portion 2A, the bottom wall 22 contacts the wiring circuit board C. With the wiring circuit board C housed within the receiving portion 2A, the bottom wall 22 supports the wiring circuit board C. The bottom wall 22 extends along a first direction and a second direction. The bottom wall 22 has a plurality of openings 221A, 221B, and 221C. The openings 221A, 221B, and 221C are used when inspecting the wiring circuit board C housed within the receiving portion 2A.

[0052] The opening 221A is used, for example, to check whether there are burrs on the edge E1 of the wiring circuit board C. The opening 221A is disposed at one end in the first direction of the receiving area A. When the wiring circuit board C is received in the receiving portion 2A, a portion of the edge E1 overlaps with the opening 221A in the thickness direction of the wiring circuit board C.

[0053] The opening 221B is used, for example, to check whether there are burrs on the edge E2 of the wiring circuit board C. The opening 221B is disposed at the other end of the receiving area A in the first direction. When the wiring circuit board C is received in the receiving part 2A, the edge E2 partially overlaps with the opening 221B in the thickness direction of the wiring circuit board C.

[0054] The opening 221C is used, for example, to check the position of the wiring circuit board C within the receiving portion 2A. The opening 221C is located at the other end of the receiving region A in the second direction. With the wiring circuit board C received within the receiving portion 2, a portion of the edge E4 of the wiring circuit board C overlaps with the opening 221C in the thickness direction. The opening 221C has a rectangular shape. With the wiring circuit board C properly received within the receiving portion 2, the edge E4 of the wiring circuit board C extends along the edge of the opening 221C. Therefore, by checking the parallelism between the edge of the opening 221C and the edge E4 of the wiring circuit board C, it is possible to check whether the wiring circuit board C is received at an angle.

[0055] Furthermore, there are no limitations on the inspections performed using openings 221A, 221B, and 221C. Additionally, there are no limitations on the position and size of openings 221A, 221B, and 221C. The position and size of openings 221A, 221B, and 221C can be appropriately changed according to the inspection requirements.

[0056] (4) Protrusion

[0057] In the container 1 for wiring circuit boards, at least one protrusion is provided relative to each of the plurality of edges E1, E2, E3, and E4. In this embodiment, the container 1 for wiring circuit boards has two protrusions 23A relative to edge E1, two protrusions 23B relative to edge E2, two protrusions 23C relative to edge E3, and one protrusion 23D relative to edge E4. The plurality of protrusions 23A, 23B, 23C, and 23D are disposed within the receiving portion 2A. The plurality of protrusions 23A, 23B, 23C, and 23D are disposed outside the receiving area A.

[0058] With the wiring circuit board C housed within the receiving portion 2A, in the first direction, the protrusion 23A faces the edge E1 of the wiring circuit board C. With the wiring circuit board C housed within the receiving portion 2A, in the first direction, the protrusion 23A is positioned between the edge E1 and the sidewall 21A. In this embodiment, the protrusion 23A is connected to the sidewall 21A. The protrusion 23A is positioned on the side opposite to the protrusion 23B of the receiving portion 2C, relative to the sidewall 21A. The protrusion 23A is aligned in a straight line with the protrusion 23B of the receiving portion 2C in the first direction. The protrusion 23A is positioned at the same location as the protrusion 23B of the receiving portion 2C in the second direction. Furthermore, the protrusion 23A may also be separated from the sidewall 21A. Two protrusions 23A are arranged spaced apart from each other in the second direction. Furthermore, the number of protrusions 23A is not limited.

[0059] like Figure 4 As shown, the protrusion 23A extends in the vertical direction. With the wiring circuit board C housed within the receiving portion 2A, the protrusion 23A extends in the thickness direction of the wiring circuit board C. In this embodiment, the lower end of the protrusion 23A is connected to the bottom wall 22. Alternatively, the lower end of the protrusion 23A can be separated from the bottom wall 22. The protrusion 23A has an inclined surface 231.

[0060] The inclined surface 231 is the side surface of the protrusion 23A on the side closest to the receiving area A. The inclined surface 231 extends from the upper end to the lower end of the protrusion 23A. The inclined surface 231 is inclined away from the side wall 21A as it approaches the bottom wall 22. Therefore, when the wiring circuit board C is received into the receiving portion 2A, the inclined surface 231 can guide the wiring circuit board C toward the receiving area A.

[0061] Furthermore, the descriptions of protrusions 23B, 23C, and 23D are the same as those of protrusion 23A. Therefore, the descriptions of protrusions 23B, 23C, and 23D are omitted.

[0062] 2. Effects

[0063] (1) According to container 1 for wiring circuit board, such as Figure 3 As shown, with the wiring circuit board C housed within the receiving portion 2A, the protrusion 23A faces the edge E1 of the wiring circuit board C in the first direction (a direction orthogonal to the thickness direction of the wiring circuit board C).

[0064] Therefore, when the wiring circuit board C is housed in the receiving part 2A and transported, the protrusion 23A can be used to prevent the movement of the wiring circuit board C in the receiving part 2A.

[0065] This reduces the contact between the edge E1 of the wiring circuit board C and the side wall 21A of the receiving portion 2A.

[0066] As a result, it is possible to suppress the generation of foreign matter due to contact between the edge E1 of the wiring circuit board C and the side wall 21A of the receiving part 2A.

[0067] (2) According to container 1 for wiring circuit board, such as Figure 3 As shown, with the wiring circuit board C housed within the receiving portion 2A, the protrusion 23A is disposed between the edge E1 and the sidewall 21A.

[0068] Therefore, the protrusion 23A can be used to suppress the contact between the edge E1 of the wiring circuit board C and the side wall 21A of the receiving part 2A.

[0069] (3) According to container 1 for wiring circuit board, such as Figure 4 As shown, protrusion 23A has an inclined surface 231. The inclined surface 231 is inclined away from the side wall 21A as it approaches the bottom wall 22.

[0070] Therefore, when the wiring circuit board C is accommodated in the receiving part 2A, the inclined surface 231 can be used to guide the wiring circuit board C in a direction away from the side wall 21A.

[0071] As a result, when the wiring circuit board C is accommodated in the receiving portion 2A, it is also possible to prevent the edge E1 of the wiring circuit board C from contacting the side wall 21A of the receiving portion 2A.

[0072] (4) According to the container 1 for the wiring circuit board, such as Figure 3 and Figure 4 As shown, when the wiring circuit board C is accommodated in the receiving portion 2A, the inclined surface 231 can guide the wiring circuit board C toward the receiving area A.

[0073] Therefore, the wiring circuit board C can be reliably accommodated in the accommodating area A.

[0074] (5) Figure 3 As shown, in the container 1 for wiring circuit board, each of the plurality of edges E1, E2, E3, E4 has at least one protrusion 23 (protrusion 23A, 23B, 23C, 23D).

[0075] Therefore, at all the edges of the multiple edges E1, E2, E3, E4, it is possible to suppress contact with the side walls 21 (side walls 21A, 21B, 21C, 21D) of the receiving part 2A.

[0076] Therefore, it is possible to further suppress the generation of foreign matter due to the contact between the edges E1, E2, E3, E4 of the wiring circuit board C and the sidewall 21 of the receiving part 2A.

[0077] (6) According to container 1 for wiring circuit board, such as Figure 3As shown, the bottom wall 22 has openings 221A, 221B, and 221C. Openings 221A, 221B, and 221C are used when inspecting the wiring circuit board C housed in the receiving part 2A.

[0078] Therefore, with the wiring circuit board C housed in the receiving portion 2A, the wiring circuit board C can be inspected through the openings 221A, 221B, and 221C.

[0079] (7) According to container 1 for wiring circuit board, such as Figure 3 As shown, with the wiring circuit board C housed within the receiving portion 2A, in the thickness direction of the wiring circuit board C, a portion of edge E1 overlaps with opening 221A, and a portion of edge E2 overlaps with opening 221B.

[0080] Therefore, with the wiring circuit board C housed in the receiving portion 2A, the edge E1 of the wiring circuit board C can be inspected through the opening 221A, and the edge E2 of the wiring circuit board C can be inspected through the opening 221B.

[0081] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and not intended to limit the scope of the invention. Variations of the invention that will be apparent to those skilled in the art are included in the foregoing claims.

[0082] Industrial availability

[0083] The container for wiring circuit boards of the present invention is used to hold wiring circuit boards.

[0084] Explanation of reference numerals in the attached figures

[0085] 1. Container for wiring circuit board; 2A. Receiving part; 21A. Side wall; 21B. Side wall; 21C. Side wall; 21D. Side wall; 22. Bottom wall; 23A. Protrusion; 23B. Protrusion; 23C. Protrusion; 23D. Protrusion; 221A. Opening; 221B. Opening; 221C. Opening; 231. Inclined surface; A. Receiving area; C. Wiring circuit board; E1. Edge; E2. Edge; E3. Edge; E4. Edge.

Claims

1. A container for a wiring circuit board, used to hold the wiring circuit board, wherein, The container for the wiring circuit board includes: A receiving portion, capable of accommodating one of the aforementioned wiring circuit boards, and having a bottom wall; and A protrusion, disposed within the receiving portion, extends along the thickness direction of the wiring circuit board when the wiring circuit board is received within the receiving portion. The bottom wall has an opening used for inspecting the wiring circuit board housed in the receiving portion. With the wiring circuit board housed within the receiving portion, the protrusion faces the edge of the wiring circuit board in a direction orthogonal to the thickness direction of the wiring circuit board. With the wiring circuit board housed within the receiving portion, in the thickness direction of the wiring circuit board, a portion of the edge overlaps with the opening, and with the wiring circuit board housed within the receiving portion, the edge extends along the edge of the opening.

2. The container for wiring circuit boards according to claim 1, wherein, The receiving portion has sidewalls that face each other at a distance from the edge when the wiring circuit board is received within the receiving portion. With the wiring circuit board housed within the receiving portion, the protrusion is disposed between the edge and the sidewall.

3. The container for wiring circuit boards according to claim 2, wherein, The receiving part has a bottom wall. The protrusion has an inclined surface that slopes away from the sidewall as it approaches the bottom wall.

4. The container for wiring circuit boards according to claim 3, wherein, The receiving portion has a receiving area for receiving the wiring circuit board. The protrusion is positioned outside the receiving area. When the wiring circuit board is received into the receiving portion, the inclined surface can guide the wiring circuit board toward the receiving area.

5. The container for wiring circuit boards according to claim 1, wherein, The wiring circuit board has multiple edges. The container for the wiring circuit board has at least one protrusion relative to each of the plurality of edges.

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