COG玻璃基微型LED板激光回流焊装置
By using a 45° beam splitter and a visible light source in conjunction with a mask for alignment calibration in a laser reflow soldering device, the problem of damage to non-pad areas during laser welding was solved, achieving precise welding of micro LED components and accurate calibration of pad positions, thus improving welding quality.
CN117444398BActive Publication Date: 2026-07-17CHENGDU GUANGHUAN INTELLIGENT EQUIP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHENGDU GUANGHUAN INTELLIGENT EQUIP CO LTD
- Filing Date
- 2023-12-12
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In traditional laser reflow soldering, the laser beam can easily damage the non-pad areas of the glass substrate, resulting in inaccurate soldering of Mini & Micro LED direct-view COG products.
Method used
A 45° beam splitter and a visible light source are used in conjunction with a mask to perform alignment calibration using low-energy visible light. This accurately calibrates the laser welding position, preventing damage to non-welding areas by the laser. A correction camera is used to calibrate the pad position and measure the offset.
Benefits of technology
It enables precise soldering of micro LED components, reduces damage to non-soldering areas, improves soldering accuracy, and can measure and compensate for pad offset, reducing die bonding offset.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN117444398B_ABST
Abstract
本发明涉及微型LED板技术领域，具体涉及一种COG玻璃基微型LED板激光回流焊装置。本发明的COG玻璃基微型LED板激光回流焊装置，通过激光光源、45°分光镜、可见光光源以及掩膜版等的配合，在激光光源的激光光路上增加45°分光镜、低能量的可见光光源，先将可见光通过掩膜版进行分解，分解成与微型LED元器件形状尺寸一致的光斑，用可见光对激光进行对位校准，精确校准调整位置完成后，遮盖可见光光源，打开激光光源进行激光焊接，可以有效的防止激光对于非焊接区域膜层的损伤和灼伤，做到对微型LED元器件的精准焊接。此外，该种对位方式还可以对焊盘的位置进行校准和焊盘偏移量的测定，可将偏移量数据测出后传给固晶设备，进行固晶补偿，减少固晶偏移。
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