A method for preparing a photovoltaic tin-plated copper strip coating additive

Abstract

A method for preparing a coating additive for photovoltaic tin-plated copper strips includes a film-forming agent, a surfactant, a wetting agent, a curing agent, and a main solvent. The additive is prepared according to the preparation steps in the specified weight ratio. The additive is then used to coat the surface of the photovoltaic tin-plated copper strip with a layer of the coating agent, achieving the effect of completing the welding process of the string welding machine without the need for flux immersion. This method can solve several technical difficulties and pain points in the enterprise's investment and production process, effectively reduce enterprise investment costs, production costs, and accident risks, and contribute to reducing carbon emissions to the environment.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic tin-plated copper strip welding technology, and in particular to a method for preparing flux for photovoltaic tin-plated copper strip welding. Background Technology

[0002] In the process of welding traditional photovoltaic tin-plated copper strips by a string welding machine, flux must be added to complete the welding process. This flux is classified as a Class III hazardous chemical, which is flammable and explosive. Therefore, it needs to be strictly managed and stored. All industries involved have strict regulations and management rules for its storage, transportation and use.

[0003] Therefore, companies that need to use this type of flux face the following pain points: 1. The company needs to build a separate hazardous chemical warehouse for storing welding flux; 2. Enterprises need to purchase professional explosion-proof facilities and configure them in the production workshop to store the amount of flux required for daily production; 3. The waste gas generated during the use of flux seriously affects air quality. Enterprises need to invest in air purification equipment to ensure that the waste gas emissions meet environmental protection standards. 4. Waste liquid generated during the use of flux will affect the surrounding environment and water quality, so it cannot be discharged directly and the company needs to pay a professional company to handle it. 5. When the crystals generated during the use of flux accumulate to a severe degree, they can seriously affect the normal operation of the equipment, requiring shutdown for cleaning, reducing equipment uptime, impacting enterprise production efficiency, and reducing capacity.

[0004] 6. When producing and transporting hazardous chemicals by road, the relevant production and transportation companies must have the corresponding hazardous materials production management qualifications, which will further increase the company's costs.

[0005] If an additive layer can be coated on the surface of the photovoltaic tin-plated copper strip to achieve the effect of completing the welding process of the string welding machine without soaking in flux, it can solve several technical difficulties and pain points in the enterprise's investment and production process, effectively reduce the enterprise's investment costs, production costs and accident risks, and contribute to "carbon peaking" and "carbon neutrality". Summary of the Invention

[0006] To address the above-mentioned problems, this invention proposes a method for preparing a coating additive for photovoltaic tin-plated copper strip. The prepared additive can be directly coated onto the copper strip, eliminating the need for flux soaking and allowing for the welding process of a string welding machine. This solves the problem of huge costs in enterprise investment and production, significantly reduces production costs, improves enterprise energy efficiency, and reduces storage, management, and transportation costs across the entire industrial chain.

[0007] The present invention relates to a method for preparing a photovoltaic tin-plated copper strip coating additive, comprising the following steps: The materials prepared for the preparation process include film-forming agents, surfactants, wetting agents, curing agents, and main solvents, in the following weight proportions: Film-forming agent: 3% Surfactant: 0.55% Wetting agent: 0.85% Hardener: 3.5% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; The preparation process is as follows: At an ambient temperature of 5~25℃, the main solvent is added to a clean chemical reaction vessel, the stirring speed is set to 45 rpm, stirring is started, and heating is set to 15~30℃; a wetting agent is added, and after stirring for 10~30 min, a surfactant is added and stirring is continued for 10 min; a film-forming agent is added and stirred for 25 min; finally, a curing agent is added and stirred for 35 min until all substances are completely dissolved and mixed evenly. Stirring and heating are stopped, and the mixture is allowed to stand and filtered to obtain the finished product.

[0008] For example: Component 1: Film-forming agent: 0.8~6.0% Surfactant: 0.2~5.0% Wetting agent: 0.1~3.5% Hardener: 1.0~10.0% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; For example: Component 2: Film-forming agent: 1.0~4.0% Surfactant: 0.5~4.5% Wetting agent: 0.4~2.2% Hardener: 1.0~8.0% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; For example: Component 3: Film-forming agent: 1.5~3.0% Surfactant: 0.5~2.0% Wetting agent: 0.5~1.5% Hardener: 1.5~5.0% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; For example: Component 4: Film-forming agent: 1.8~2.5% Surfactant: 0.5~1.0% Wetting agent: 0.6~1.0% Hardener: 3.0~4.0% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; Component 5: The following components are prepared: Film-forming agent ethylene glycol butyl ether 2.2% and film-forming agent tripropylene glycol methyl ether 0.8%; Surfactants: dodecyl polyoxyethylene ether 0.3% and polyoxyethylene glycerol ether 0.25%. Wetting agent: polyethylene glycol: 0.85% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 3.5% Deionized water as the main solvent: balance.

[0009] The additive prepared by this invention, when coated on copper strip, eliminates the need for soaking in welding flux during the next welding stage, avoiding the use of flammable and explosive welding flux. This significantly saves costs and reduces investment for enterprises. Moreover, the welding effect has been verified to be excellent. In the welding process of photovoltaic modules, it has a welding tensile force of more than 1N. After welding, there is no residue, resulting in a clean and aesthetically pleasing finish, providing high reliability for photovoltaic modules. Detailed Implementation

[0010] The present invention will now be described in detail with reference to specific embodiments. The following descriptions of specific embodiments are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0011] The coating additive involved in this invention replaces the traditional hazardous chemical photovoltaic flux. By simply coating the additive onto the photovoltaic tin-plated copper strip, the use of the hazardous consumable flux in the current production process can be eliminated, thereby transforming the entire processing and production process into a safe and environmentally friendly non-hazardous operation.

[0012] This reduces the investment cost per GW of photovoltaic module manufacturers by approximately RMB 1.5 million to 3 million (eliminating the need to construct dedicated warehouses for hazardous chemicals and explosion-proof facilities and devices related to flux use); during photovoltaic module production, the purchase of flux (a Class III hazardous chemical) is no longer required, saving approximately RMB 800,000 to 1.5 million in material procurement costs per GW of modules; the elimination of flux exhaust emissions and necessary environmental protection treatment devices and waste liquid treatment costs saves approximately RMB 500,000 to 1 million in investment costs per GW of modules; and maximizes equipment utilization (eliminating the need for mid-term shutdowns for cleaning and maintenance), thereby increasing daily equipment output by approximately 10% to 30% and reducing production costs for module manufacturers.

[0013] The materials prepared for the preparation process include film-forming agents, surfactants, wetting agents, curing agents, and main solvents, in the following weight proportions: Film-forming agent: 3% Surfactant: 0.55% Wetting agent: 0.85% Hardener: 3.5% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; The preparation process is as follows: At an ambient temperature of 5~25℃, the main solvent is added to a clean chemical reaction vessel, the stirring speed is set to 45 rpm, stirring is started, and heating is set to 15~30℃; a wetting agent is added, and after stirring for 10~30 min, a surfactant is added and stirring is continued for 10 min; a film-forming agent is added and stirred for 25 min; finally, a curing agent is added and stirred for 35 min until all substances are completely dissolved and mixed evenly. Stirring and heating are stopped, and the mixture is allowed to stand and filtered to obtain the finished product. Example 1:

[0014] Film-forming agent ethylene glycol butyl ether: 6.0% Surfactant: Dodecyl polyoxyethylene ether: 5.0% Wetting agent: polyethylene glycol: 3.5% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 10.0% Main solvent: deionized water; balance The preparation process is as follows: At an ambient temperature of 5~25℃, the main solvent is added to a clean chemical reaction vessel, the stirring speed is set to 45 rpm, stirring is started, and heating is set to 15~30℃; a wetting agent is added, and after stirring for 10~30 min, a surfactant is added and stirring is continued for 10 min; a film-forming agent is added and stirred for 25 min; finally, a curing agent is added and stirred for 35 min until all substances are completely dissolved and mixed evenly. Stirring and heating are stopped, and the mixture is allowed to stand and filtered to obtain the finished product.

[0015] The preparation process of Example 2 is basically the same as that of Example 1, but the components are different: Film-forming agent tripropylene glycol methyl ether: 0.8% Surfactant polyoxyethylene glycerol ether: 0.2% Wetting agent: polyethylene glycol: 3.0% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 8.0% Main solvent: deionized water; balance Example 3, prepared according to the following components Film-forming agent ethylene glycol butyl ether: 0.8% Surfactant: Dodecyl polyoxyethylene ether: 0.2% Wetting agent: polyethylene glycol: 3.0% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 1.0% Main solvent: deionized water; balance Example 4, prepared according to the following components: Film-forming agent tripropylene glycol methyl ether: 1.0% Surfactant: Polyoxyethylene glycerol ether: 0.25% Wetting agent: polyethylene glycol: 2.5% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 5.0% Main solvent: deionized water; balance Example 5, prepared according to the following components: Film-forming agent ethylene glycol butyl ether 2.0% and film-forming agent tripropylene glycol methyl ether 0.8%; Surfactants: dodecyl polyoxyethylene ether 0.5% and polyoxyethylene glycerol ether 0.2%. Wetting agent: polyethylene glycol: 1.0% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 4.0% Main solvent: deionized water; balance Example 6, prepared according to the following components: Film-forming agent ethylene glycol butyl ether 2.2% and film-forming agent tripropylene glycol methyl ether 0.8%; Surfactants: dodecyl polyoxyethylene ether 0.3% and polyoxyethylene glycerol ether 0.25%. Wetting agent: polyethylene glycol: 0.85% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 3.5% Main solvent: deionized water; balance The photovoltaic tin-plated copper strip additive involved in this invention, when coated on copper strip, provides a welding pull force greater than 1N in the photovoltaic module welding process, leaving no residue after welding, resulting in a clean and aesthetically pleasing finish and providing high reliability for photovoltaic modules. Specifically designed for copper strip surface coating, it has passed testing by several well-known photovoltaic copper strip companies.

[0016]

[0017] Table 1: Performance Comparison Table As shown in Table 1, compared with traditional flux-type self-coating welding, the self-coating welding type of the present invention significantly reduces the investment cost and material cost for component manufacturers; it also greatly improves equipment utilization, thereby reducing production costs.

[0018] The additive prepared by this invention, when coated on copper strip, eliminates the need for soaking in welding flux during the next welding stage, avoiding the use of flammable and explosive welding flux. This significantly saves costs and reduces investment for enterprises. Moreover, the welding effect has been verified to be excellent. In the welding process of photovoltaic modules, it has a welding tensile force of more than 1N. After welding, there is no residue, resulting in a clean and aesthetically pleasing finish, providing high reliability for photovoltaic modules.

[0019] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present invention without departing from the scope of the present invention are within the scope of the present invention.

Claims

1. A method for preparing a photovoltaic tin-plated copper strip coating additive, characterized in that, Includes the following steps: The materials prepared for the preparation process include film-forming agents, surfactants, wetting agents, curing agents, and main solvents, in the following weight proportions: Film-forming agent: 0.8~6.0% Surfactant: 0.2~5.0% Wetting agent: 0.1~3.5% Hardener: 1.0~10.0% Main solvent: Balance The film-forming agent mentioned above refers to ethylene glycol butyl ether and / or tripropylene glycol methyl ether; The surfactant is dodecyl polyoxyethylene ether and / or polyoxyethylene glycerol ether; The wetting agent is polyethylene glycol; The curing agent is 2-methyl-1H-imidazol-1-propionitrile; The main solvent is deionized water; The preparation process is as follows: At an ambient temperature of 5~25℃, the main solvent is added to a clean chemical reaction vessel, the stirring speed is set to 45 rpm, stirring is started, and heating is set to 15~30℃; a wetting agent is added, and after stirring for 10~30 min, a surfactant is added and stirring is continued for 10 min; a film-forming agent is added and stirred for 25 min; finally, a curing agent is added and stirred for 35 min until all substances are completely dissolved and mixed evenly. Stirring and heating are stopped, and the mixture is allowed to stand and filtered to obtain the finished product.

2. The method for preparing the photovoltaic tin-plated copper strip coating additive according to claim 1, characterized in that, Its weight ratio is as follows: Film-forming agent: 1.0~4.0% Surfactant: 0.5~4.5% Wetting agent: 0.4~2.2% Hardener: 1.0~8.0% Main solvent: balance.

3. The method for preparing the photovoltaic tin-plated copper strip coating additive according to claim 2, characterized in that, Its weight ratio is as follows: Film-forming agent: 1.5~3.0% Surfactant: 0.5~2.0% Wetting agent: 0.5~1.5% Hardener: 1.5~5.0% Main solvent: balance.

4. The method for preparing the photovoltaic tin-plated copper strip coating additive according to claim 3, characterized in that, The materials prepared for the preparation process include curing agent, film-forming agent, surfactant, wetting agent, and main solvent, in the following weight proportions: Film-forming agent: 1.8~2.5% Surfactant: 0.5~1.0% Wetting agent: 0.6~1.0% Hardener: 3.0~4.0% Main solvent: balance.

5. The method for preparing the photovoltaic tin-plated copper strip coating additive according to claim 3, characterized in that, The materials prepared for the preparation process include film-forming agents, surfactants, wetting agents, curing agents, and main solvents, in the following weight proportions: Film-forming agent: 3% Surfactant: 0.55% Wetting agent: 0.85% Hardener: 3.5% Main solvent: balance.

6. The method for preparing the photovoltaic tin-plated copper strip coating additive according to claim 3, characterized in that, The materials prepared for the preparation process include film-forming agents, surfactants, wetting agents, curing agents, and main solvents, in the following weight proportions: Film-forming agents: 2.2% ethylene glycol butyl ether and 0.8% tripropylene glycol methyl ether; Surfactants: 0.3% dodecyl polyoxyethylene ether and 0.25% polyoxyethylene glycerol ether Wetting agent: polyethylene glycol: 0.85% Curing agent 2-methyl-1H-imidazolium-1-propionitrile: 3.5% Deionized water as the main solvent: balance.

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