一种研磨头及化学机械抛光设备
By introducing an independent pressure chamber and flexible membrane control into the grinding head, the problems of uneven grinding and poor stability at the substrate edge are solved, achieving uniform grinding and improved stability at the substrate edge.
CN117444839BActive Publication Date: 2026-07-17BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
- Filing Date
- 2023-12-12
- Publication Date
- 2026-07-17
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Figure CN117444839B_ABST
Abstract
本发明公开了一种研磨头及化学机械抛光设备，应用于基板研磨工艺，研磨头包括：主体、边缘控制环、边缘保持组件、弹性连接件、承载件和法兰组件；弹性连接件的下表面、边缘控制环的上端面和主体的承载凸台的外周壁围合形成第一压力腔室，承载件的下表面、边缘控制环的上端面与弹性连接件的上表面围合形成第二压力腔室，法兰组件、承载件、弹性连接件和主体围合形成第三压力腔室；通过第一压力腔室对边缘控制环进行控制，通过第二压力腔室对边缘保持组件进行控制，从而避免了压力叠加，保证基板的受力均匀性，减小基板边缘的形变量，通过单独控制边缘控制环和边缘保持组件的压力，从而提高研磨头的结构稳定性，增加基板平面研磨平坦性。
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