Backlight module and display device

Abstract

This application belongs to the field of display technology, specifically relating to a backlight module and display device. The backlight module includes a driving substrate, light-emitting chips, a light-collecting bowl, a heat dissipation assembly, and a lifting mechanism. Multiple light-emitting chips are spaced apart on one side of the driving substrate, and the light-collecting bowl is also located on one side of the driving substrate. The orthographic projection of each light-emitting chip on the driving substrate lies within the orthographic projection of the light-collecting bowl on the driving substrate. The heat dissipation assembly is connected to the light-collecting bowl. The lifting mechanism at least drives the light-collecting bowl away from or closer to the driving substrate. When the light-collecting bowl moves away from the driving substrate, the light emission angle of the light-emitting chips gradually decreases due to the limitation imposed by the light-collecting bowl. When the backlight module is used in a display device, the lifting mechanism raises and lowers the light-collecting bowl, enabling the display device to achieve privacy protection and a wide viewing angle. Simultaneously, the viewing angle can be continuously adjusted, solving the problem of inconvenient privacy protection switching.

Description

Technical Field

[0001] This application belongs to the field of display, specifically relating to a backlight module and display device. Background Technology

[0002] Display devices offer a wider viewing angle, providing users with a better visual experience. However, sometimes users also want the viewing angle of the display device to be adjustable to effectively protect business secrets and personal privacy.

[0003] Existing display devices use privacy films to prevent privacy viewing. When the privacy function is not needed, the film can only be removed, making it inconvenient to turn the privacy function on and off. In addition, privacy films also cause a loss of light efficiency, leading to an increase in the power consumption of the display device. Summary of the Invention

[0004] The purpose of this application is to provide a backlight module and display device to solve the problem of inconvenient privacy protection function switch.

[0005] To achieve the above objectives, this application provides a backlight module, including a driving substrate and light-emitting chips, wherein a plurality of light-emitting chips are spaced apart on one side of the driving substrate, and the backlight module further includes:

[0006] A light-concentrating bowl is disposed on one side of the driving substrate, and the orthographic projection of the light-emitting chip on the driving substrate is located within the orthographic projection of the light-concentrating bowl on the driving substrate;

[0007] The heat dissipation component is connected to the light-concentrating bowl;

[0008] The lifting mechanism drives the light-concentrating bowl away from or closer to the driving substrate. When the light-concentrating bowl moves away from the driving substrate, the light emission angle of the light-emitting chip is gradually reduced due to the limitation imposed by the light-concentrating bowl.

[0009] Optionally, the heat dissipation assembly includes an annular tube and a first connecting tube. The annular tube is a pipe surrounding the light-emitting chip, and the first connecting tube communicates with the inner cavity of the annular tube. The light-concentrating bowl is disposed inside the annular tube.

[0010] Optionally, the focusing bowl is an annular tube surrounding the inner surface of the light-emitting chip, and the annular tube surrounding the inner surface of the light-emitting chip includes a parabolic surface or a square pyramidal surface.

[0011] Optionally, the inner surface of the annular tube is parabolic, and the heat dissipation assembly includes a reflective film formed on the inner surface of the annular tube surrounding the light-emitting chip.

[0012] Optionally, the light-emitting chips are arranged in an array along the row and column directions, and adjacent annular tubes in each row are connected through the first connecting tube. The heat dissipation component also includes a second connecting tube, and the first connecting tubes in adjacent rows are connected through the second connecting tube. Coolant is disposed in the annular tube, the first connecting tube and the second connecting tube. The backlight module also includes a circulation component, which drives the coolant to circulate.

[0013] Optionally, the coolant flows in opposite directions in adjacent rows of the first connecting pipe.

[0014] Optionally, a limiting groove is provided on one side of the driving substrate, and the annular tube, the first connecting tube, and the second connecting tube are all disposed in the limiting groove.

[0015] Optionally, the lifting mechanism includes a telescopic rod disposed between the drive base plate and the second connecting pipe.

[0016] Optionally, the drive substrate includes a first receiving hole, the second connecting tube includes a second receiving hole, the second receiving hole is separated from the inner cavity of the second connecting tube, and the two ends of the telescopic rod are respectively inserted into the first receiving hole and the second receiving hole.

[0017] This application also provides a display device, including:

[0018] The backlight module;

[0019] The display panel is located on the light-emitting side of the backlight module.

[0020] The backlight module and display device disclosed in this application have the following beneficial effects:

[0021] In this application, the backlight module includes a driving substrate, light-emitting chips, a light-collecting bowl, a heat dissipation component, and a lifting mechanism. Multiple light-emitting chips are spaced apart on one side of the driving substrate, and the light-collecting bowl is also located on one side of the driving substrate. The orthographic projection of the light-emitting chips on the driving substrate lies within the orthographic projection of the light-collecting bowl on the driving substrate. The heat dissipation component is connected to the light-collecting bowl. The lifting mechanism can at least drive the light-collecting bowl away from or towards the driving substrate. When the light-collecting bowl moves away from the driving substrate, the light emission angle of the light-emitting chips gradually decreases due to the limitation imposed by the light-collecting bowl. When used in a display device, the backlight module allows for privacy protection and a wide viewing angle by raising and lowering the light-collecting bowl via the lifting mechanism. The viewing angle can be continuously adjusted, solving the problem of inconvenient privacy protection switching.

[0022] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0025] Figure 1 This is a schematic diagram of the backlight module in Embodiment 1 of this application.

[0026] Figure 2 yes Figure 1 Enlarged diagram of position A in the middle.

[0027] Figure 3 This is a schematic diagram of the end section of the backlight module in Embodiment 1 of this application.

[0028] Figure 4 This is a schematic diagram of a wide-viewing-angle display in Embodiment 1 of this application.

[0029] Figure 5 This is a schematic diagram of a narrow viewing angle display in Embodiment 1 of this application.

[0030] Figure 6 This is a schematic diagram of the heat dissipation component in Embodiment 1 of this application.

[0031] Figure 7 This is an exploded structural diagram of the backlight module in Embodiment 1 of this application.

[0032] Figure 8 This is a schematic diagram of the display device in Embodiment 2 of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Backlight module;

[0035] 110. Driving substrate; 111. Limiting groove; 112. First receiving hole; 120. Light-emitting chip; 130. Concentrating bowl;

[0036] 140. Heat dissipation assembly; 141. Annular tube; 142. First connecting tube; 143. Second connecting tube; 1431. Second receiving hole;

[0037] 150. Lifting mechanism; 151. Telescopic rod; 160. Circulation assembly;

[0038] 200, Display panel; 300, Optical film. Detailed Implementation

[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0040] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0041] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0042] Example 1

[0043] See Figures 1 to 5 As shown, in this embodiment, the backlight module 100 includes a driving substrate 110, light-emitting chips 120, a light-concentrating bowl 130, a heat dissipation assembly 140, and a lifting mechanism 150. Multiple light-emitting chips 120 are spaced apart and arranged on one side of the driving substrate 110. The light-emitting chips 120 may include light-emitting diode (LED) chips or mini / micro light-emitting diode (MID) chips. The driving substrate 110 may include a glass substrate and a printed circuit board assembly (PCBA).

[0044] The light-concentrating bowl 130 includes a light inlet and a light outlet, with the light inlet being smaller than or equal to the light outlet. The light-concentrating bowl 130 is disposed on one side of the driving substrate 110, and the orthographic projection of the light-emitting chip 120 on the driving substrate 110 is located within the orthographic projection of the light-concentrating bowl 130 on the driving substrate 110.

[0045] The heat dissipation assembly 140 is connected to the light-concentrating bowl 130. A lifting mechanism 150 is disposed on one side of the driving substrate 110. The lifting mechanism 150 can at least drive the light-concentrating bowl 130 away from or towards the driving substrate 110. The lifting mechanism 150 can be connected to the heat dissipation assembly 140, indirectly driving the light-concentrating bowl 130 away from or towards the driving substrate 110, i.e., lifting and lowering on the driving substrate 110. However, it is not limited to this; the lifting mechanism 150 can also be directly connected to the light-concentrating bowl 130, depending on the specific situation. When the light-concentrating bowl 130 moves away from the driving substrate 110, the light emission angle of the light-emitting chip 120 gradually decreases due to the limitation imposed by the light-concentrating bowl 130.

[0046] Specifically, when the condenser bowl 130 is far from the driving substrate 110, the light-emitting surface of the light-emitting chip 120 is located between the light inlet of the condenser bowl 130 and the driving substrate 110, or the light-emitting surface of the light-emitting chip 120 is located between the light inlet and the light outlet of the condenser bowl 130, and the light outlet of the condenser bowl 130 is located within the light-emitting area of ​​the light-emitting chip 120. The condenser bowl 130 can block part of the light from the light-emitting chip 120, resulting in a narrow viewing angle for the light emitted by the light-emitting chip 120. When the condenser bowl 130 is close to the driving substrate 110, the light-emitting surface of the light-emitting chip 120 is located on the side of the light outlet of the condenser bowl 130 away from the driving substrate 110, or the light-emitting surface of the light-emitting chip 120 is located between the light inlet and the light outlet of the condenser bowl 130, and the light outlet of the condenser bowl 130 is located outside the light-emitting area of ​​the light-emitting chip 120. The condenser bowl 130 does not block the light from the light-emitting chip 120, resulting in a wide viewing angle for the light emitted by the light-emitting chip 120.

[0047] In other words, by raising and lowering the light-concentrating bowl 130 via the lifting mechanism 150, the light emission angle of the light-emitting chip 120 can be adjusted. When the light emission angle of the light-emitting chip 120 is larger, the display device can achieve a wide viewing angle; when the light emission angle of the light-emitting chip 120 is smaller, the display device can achieve a narrow viewing angle, i.e., the display device can achieve privacy protection. Simultaneously, as the light-concentrating bowl 130 moves away from the driving substrate 110, the light emission angle of the light-emitting chip 120 continuously decreases, meaning the viewing angle of the display device is continuously adjustable.

[0048] For display devices that use privacy films for privacy protection, when the privacy function is not needed, the privacy film can only be removed, making it inconvenient to turn the privacy function on and off.

[0049] In this embodiment, the backlight module 100 includes a driving substrate 110, light-emitting chips 120, a light-concentrating bowl 130, a heat dissipation assembly 140, and a lifting mechanism 150. Multiple light-emitting chips 120 are spaced apart and arranged on one side of the driving substrate 110. The light-concentrating bowl 130 is also arranged on one side of the driving substrate 110. The orthographic projection of the light-emitting chips 120 on the driving substrate 110 lies within the orthographic projection of the light-concentrating bowl 130 on the driving substrate 110. The heat dissipation assembly 140 is connected to the light-concentrating bowl 130. The lifting mechanism 150 can at least drive the light-concentrating bowl 130 away from or closer to the driving substrate 110. When the light-concentrating bowl 130 moves away from the driving substrate 110, the light emission angle of the light-emitting chips 120 gradually decreases due to the limitation imposed by the light-concentrating bowl 130. The backlight module 100 is used in a display device. By raising and lowering the light-concentrating bowl 130 through the lifting mechanism 150, the display device can achieve privacy protection and a wide viewing angle. Simultaneously, the viewing angle can be continuously adjusted, solving the problem of inconvenient privacy protection function switching. At the same time, compared with the solution of using privacy films for privacy protection, it will not cause a loss of light efficiency, and when used in display devices, it can reduce the power consumption of the display device.

[0050] Furthermore, for the backlight module 100 using miniature LED chips, the large number of miniature LED chips integrated on the driving substrate 110 results in significant heat generation. Heat accumulation on the driving substrate 110 and the LED chips 120 accelerates the aging of the LED chips and negatively impacts the display performance. This embodiment integrates the light-concentrating bowl 130 and the heat dissipation component 140, enabling switching between wide and narrow viewing angles and reducing or eliminating heat accumulation on the driving substrate 110 and the LED chips 120, thereby extending the lifespan of the backlight module 100 and improving the display performance.

[0051] See Figure 3 As shown, the light-emitting chips 120 are arranged in an array along the row and column directions. The heat dissipation assembly 140 includes an annular tube 141 and a first connecting tube 142. The annular tube 141 is a pipe surrounding the light-emitting chips 120, and the first connecting tube 142 communicates with the inner cavity of the annular tube 141. The annular tubes 141 and the light-emitting chips 120 are arranged in a one-to-one correspondence. The first connecting tubes 142 are arranged on opposite sides of the annular tubes 141 in the row direction, and adjacent annular tubes 141 in the same row share the same first connecting tube 142 for connection. Both the annular tubes 141 and the first connecting tubes 142 can be round or square tubes. A light-concentrating bowl 130 is disposed inside the annular tube 141, and the outer wall of the light-concentrating bowl 130 can be connected to the inner wall of the annular tube 141 surrounding the light-emitting chips 120.

[0052] The concentrator bowl 130 is disposed inside the annular tube 141. The outer wall of the concentrator bowl 130 can be connected to the inner wall of the annular tube 141. This design increases the contact area between the concentrator bowl 130 and the annular tube 141, thereby enhancing the heat exchange between them.

[0053] It should be noted that the heat dissipation assembly 140 may include an annular tube 141 and a first connecting tube 142, and the light-concentrating bowl 130 is disposed inside the annular tube 141, but is not limited thereto. The heat dissipation assembly 140 may also include the first connecting tube 142, and the light-concentrating bowl 130 is disposed on one side of the first connecting tube 142, as long as the light-concentrating bowl 130 is in contact with the first connecting tube 142, depending on the specific situation.

[0054] See Figure 3 As shown, the annular tube 141 is a square tube, or both the annular tube 141 and the first connecting tube 142 are square tubes. The light-concentrating bowl 130 is formed by the annular tube 141 surrounding the inner surface of the light-emitting chip 120, and the inner surface of the annular tube 141 surrounding the light-emitting chip 120 includes a square pyramidal surface. The light inlet of the light-concentrating bowl 130 is the side of the square pyramid closer to the driving substrate 110, and the light outlet of the light-concentrating bowl 130 is the side of the square pyramid away from the driving substrate 110.

[0055] When the annular tube 141 is close to the driving substrate 110, the light-emitting surface of the light-emitting chip 120 is located on the side of the annular tube 141 away from the driving substrate 110, or the light-emitting surface of the light-emitting chip 120 is located in the inner cavity of the square pyramid formed by the annular tube 141. The annular tube 141 does not block the light from the light-emitting chip 120, and the light emitted by the light-emitting chip 120 has a wide viewing angle. The light emission angle of the light-emitting chip 120 is not limited by the annular tube 141, and the display device can achieve a wide viewing angle display.

[0056] When the annular tube 141 is far from the driving substrate 110, the light-emitting surface of the light-emitting chip 120 is located on the side of the annular tube 141 away from the driving substrate 110, or the light-emitting surface of the light-emitting chip 120 is located in the inner cavity of the square pyramid formed by the annular tube 141. The annular tube 141 blocks part of the light from the light-emitting chip 120, and the light emitted by the light-emitting chip 120 has a wide viewing angle. The light emission angle of the light-emitting chip 120 is limited by the annular tube 141, and the display device can achieve a narrow viewing angle display, that is, achieve privacy protection.

[0057] The ring tube 141 is designed as a four-sided pyramidal surface surrounding the inner surface of the light-emitting chip 120. The light-concentrating bowl 130 and the ring tube 141 can be connected as a whole, making the structure of the backlight module 100 simpler and reducing the manufacturing cost of the backlight module 100.

[0058] It should be noted that the focusing bowl 130 and the annular tube 141 can be integrally connected, with the focusing bowl 130 surrounding the inner surface of the light-emitting chip 120 via the annular tube 141. However, this is not a limitation; the focusing bowl 130 and the annular tube 141 can also be manufactured separately and then assembled together, depending on the specific circumstances. Manufacturing the focusing bowl 130 and the annular tube 141 separately reduces the requirements for the annular tube 141, which can be designed as either a round or square tube. The inner surface of the annular tube 141 surrounding the light-emitting chip 120 can be designed as a four-sided pyramidal surface, but this is not a limitation. The inner surface of the annular tube 141 surrounding the light-emitting chip 120 can also be a parabolic or conical surface, depending on the specific circumstances.

[0059] In some embodiments, the inner surface of the annular tube 141 surrounding the light-emitting chip 120 is parabolic, and the heat dissipation assembly 140 includes a reflective film formed on the inner surface of the annular tube 141. The reflective film may include a metal-generating film. When the lifting mechanism 150 lifts the focusing bowl 130, the light-emitting chip 120 may be located at or near the focal point of the focusing bowl 130.

[0060] The inner surface of the annular tube 141 is parabolic, and the light-concentrating bowl 130 includes a reflective film formed on the inner surface of the annular tube 141. This design allows the light-concentrating bowl 130 to reflect and converge the dispersed light from the light-emitting chip 120, thereby improving light utilization. The reflective film may include a metal generating film, which reflects light and enhances heat exchange between the light-emitting chip 120 and the light-concentrating bowl 130, thus improving the heat dissipation performance of the backlight module 100.

[0061] See Figures 1 to 3 As shown, the light-emitting chips 120 are arranged in an array along the row and column directions, and adjacent annular tubes 141 in each row are connected by a first connecting tube 142. The heat dissipation assembly 140 also includes a second connecting tube 143, and the first connecting tubes 142 in adjacent rows are connected by the second connecting tube 143. The second connecting tube 143 and the first connecting tube 142 can both be round tubes or square tubes. Coolant is disposed inside the annular tubes 141, the first connecting tubes 142 and the second connecting tubes 143. The backlight module 100 also includes a circulation assembly 160, which is connected to the first connecting tubes 142 and drives the coolant to circulate. The circulation assembly 160 may include a circulation pump. The first ends of the first connecting tubes 142 in the first row and the first ends of the first connecting tubes 142 in the last row are connected to the circulation assembly 160.

[0062] By using coolant to circulate and cool the annular tube 141, the first connecting tube 142, and the second connecting tube 143, the temperatures at different light-emitting chips 120 are the same or similar, resulting in better heat dissipation.

[0063] It should be noted that the concentrator bowl 130 can dissipate heat through the circulation of coolant within the annular pipe 141 and the first connecting pipe 142, but it is not limited to this. The annular pipe 141 and the first connecting pipe 142 can also be heat pipes, depending on the specific situation. The heat pipe may include an evaporation section and a condensation section, with the evaporation section of the heat pipe connected to the concentrator bowl 130.

[0064] When a heat pipe is working: the evaporation section of the heat pipe is heated, and the working liquid inside the pipe evaporates, carrying away heat. This heat is the latent heat of vaporization of the working liquid. The vapor flows from the central channel to the condensation section of the heat pipe, condenses into liquid, and releases latent heat. Under the action of capillary force, the liquid flows back to the evaporation section. In this way, a closed loop is completed, thereby transferring a large amount of heat from the evaporation section to the condensation section.

[0065] By utilizing heat pipes for heat dissipation, the circulation component 160 can be omitted, thereby simplifying the structure of the backlight module 100 and reducing its manufacturing cost.

[0066] See Figures 1 to 3 As shown, the coolant flows in opposite directions in adjacent rows of first connecting pipes 142. That is, the tail ends of multiple first connecting pipes 142 in the first row are connected to the tail ends of multiple first connecting pipes 142 in the second row, and the head ends of multiple first connecting pipes 142 in the second row are connected to the head ends of multiple first connecting pipes 142 in the third row, and so on, connecting end to end, so that all annular pipes 141 and first connecting pipes 142 are connected into a unidirectional circulation pipeline. All annular pipes 141 and first connecting pipes 142 in each row can be connected as a single unit, and then connected together by a second connecting pipe 143, but this is not limited to this; all annular pipes 141, first connecting pipes 142, and second connecting pipes 143 can also be connected as a single unit, depending on the specific situation.

[0067] All the annular tubes 141 and the first connecting tube 142 are connected to form a unidirectional circulating pipeline, which can make the temperature of different light-emitting chips 120 the same or similar, and the heat dissipation effect is better.

[0068] See Figure 6 and Figure 7 As shown, a limiting groove 111 is provided on one side of the driving substrate 110, and the annular tube 141, the first connecting tube 142, and the second connecting tube 143 are all disposed in the limiting groove 111. The lifting mechanism 150 lifts and lowers the heat dissipation component 140 within the limiting groove 111, thereby driving the light-concentrating bowl 130 to lift and lower.

[0069] The annular tube 141, the first connecting tube 142, and the second connecting tube 143 are all disposed within the limiting groove 111. The limiting groove 111 enables lifting and lowering limits, preventing the heat dissipation component 140 from shifting and affecting the operation of the light-concentrating bowl 130. At the same time, the annular tube 141, the first connecting tube 142, and the second connecting tube 143 are all in contact with the driving substrate 110, which also facilitates heat dissipation of the driving substrate 110.

[0070] See Figure 6 and Figure 7 As shown, the lifting mechanism 150 includes a telescopic rod 151, which is disposed between the drive base plate 110 and the second connecting pipe 143.

[0071] The second connecting pipe 143 is raised and lowered by the telescopic rod 151, making the structure of the lifting mechanism 150 simpler.

[0072] It should be noted that the lifting mechanism 150 may include, but is not limited to, the telescopic rod 151. The lifting mechanism 150 may also include an electromagnet or a piezoelectric element, depending on the specific circumstances. When the lifting mechanism 150 is an electromagnet, a permanent magnet may be installed on the second connecting pipe 143, using the repulsion of like poles to lift the heat dissipation component 140, thereby lifting the light-concentrating bowl 130. When the lifting mechanism 150 is a piezoelectric element, the extension and retraction of the piezoelectric element can lift the heat dissipation component 140, thereby lifting the light-concentrating bowl 130.

[0073] See Figure 6 and Figure 7 As shown, the drive substrate 110 includes a first receiving hole 112, the second connecting tube 143 includes a second receiving hole 1431, the second receiving hole 1431 is separated from the inner cavity of the second connecting tube 143, and the two ends of the telescopic rod 151 are respectively inserted into the first receiving hole 112 and the second receiving hole 1431.

[0074] The two ends of the telescopic rod 151 are inserted into the first receiving hole 112 and the second receiving hole 1431 respectively, which can prevent the heat dissipation component 140 from shifting and affecting the operation of the light-concentrating bowl 130.

[0075] Example 2

[0076] See Figure 8 As shown, in this embodiment, the display device includes a backlight module 100 and a display panel 200. The display panel 200 is disposed on the light-emitting side of the backlight module 100, and the backlight module 100 includes the backlight module 100 disclosed in Embodiment 1. In addition, the display device may also include an optical film 300, which is disposed between the backlight module 100 and the display panel 200.

[0077] In this embodiment, the backlight module 100 includes a driving substrate 110, light-emitting chips 120, a light-concentrating bowl 130, a heat dissipation assembly 140, and a lifting mechanism 150. Multiple light-emitting chips 120 are spaced apart on one side of the driving substrate 110, and the light-concentrating bowl 130 is also located on one side of the driving substrate 110. The orthographic projection of the light-emitting chips 120 on the driving substrate 110 lies within the orthographic projection of the light-concentrating bowl 130 on the driving substrate 110. The heat dissipation assembly 140 is connected to the light-concentrating bowl 130. The lifting mechanism 150 can at least drive the light-concentrating bowl 130 away from or closer to the driving substrate 110. When the light-concentrating bowl 130 moves away from the driving substrate 110, the light emission angle of the light-emitting chips 120 gradually decreases due to the limitation imposed by the light-concentrating bowl 130. The display device includes the backlight module 100. By raising and lowering the light-concentrating bowl 130 through the lifting mechanism 150, the display device can achieve privacy protection and wide viewing angle display. Simultaneously, the viewing angle can be continuously adjusted, solving the problem of inconvenient privacy protection function switching.

[0078] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0079] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0080] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0081] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A backlight module, comprising a driving substrate and light-emitting chips, wherein a plurality of light-emitting chips are spaced apart and disposed on one side of the driving substrate, characterized in that, The backlight module also includes: A light-concentrating bowl is disposed on one side of the driving substrate, and the orthographic projection of the light-emitting chip on the driving substrate is located within the orthographic projection of the light-concentrating bowl on the driving substrate; The heat dissipation component is connected to the light-concentrating bowl; The lifting mechanism drives the light-concentrating bowl away from or closer to the driving substrate. When the light-concentrating bowl moves away from the driving substrate, the light emission angle of the light-emitting chip is gradually reduced due to the limitation imposed by the light-concentrating bowl. The heat dissipation assembly includes an annular tube and a first connecting tube. The annular tube is a pipe that surrounds the light-emitting chip. The annular tube is arranged in a one-to-one correspondence with the light-emitting chip. The first connecting tube communicates with the inner cavity of the annular tube. The light-concentrating bowl is formed by the annular tube surrounding the inner surface of the light-emitting chip. The inner surface of the annular tube surrounding the light-emitting chip includes a parabolic surface or a square pyramidal surface. The light-emitting chips are arranged in an array along the row and column directions. Adjacent annular tubes in each row are connected through the first connecting tube. The heat dissipation component also includes a second connecting tube. The first connecting tubes in adjacent rows are connected through the second connecting tube. Coolant is disposed in the annular tube, the first connecting tube and the second connecting tube. The backlight module also includes a circulation component, which drives the coolant to circulate.

2. The backlight module according to claim 1, characterized in that, The inner surface of the annular tube is parabolic, and the heat dissipation component includes a reflective film formed on the inner surface of the annular tube surrounding the light-emitting chip.

3. The backlight module according to claim 1, characterized in that, The coolant flows in opposite directions in the first connecting pipe of adjacent rows.

4. The backlight module according to claim 1, characterized in that, A limiting groove is provided on one side of the driving substrate, and the annular tube, the first connecting tube and the second connecting tube are all disposed in the limiting groove.

5. The backlight module according to claim 1, characterized in that, The lifting mechanism includes a telescopic rod, which is disposed between the drive base plate and the second connecting pipe.

6. The backlight module according to claim 5, characterized in that, The driving substrate includes a first receiving hole, the second connecting tube includes a second receiving hole, the second receiving hole is separated from the inner cavity of the second connecting tube, and the two ends of the telescopic rod are respectively inserted into the first receiving hole and the second receiving hole.

7. A display device, characterized in that, include: The backlight module as described in any one of claims 1 to 6; The display panel is located on the light-emitting side of the backlight module.

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