Display panel and display device

Abstract

This application discloses a display panel and a display device, wherein an array substrate and a color filter substrate are disposed opposite to each other on the display panel, and the array substrate and the color filter substrate are sealed and connected by a frame adhesive. One end of the array substrate extends beyond the edge of the color filter substrate in a first direction to form a bonding area. The array substrate includes metal traces and bonding terminals electrically connected to the metal traces. One end of the metal trace connected to the bonding terminal terminates in the frame adhesive. A dielectric layer is disposed on the array substrate, covering the metal traces. The bonding terminals are disposed on the side of the dielectric layer away from the array substrate, and are located in the bonding area and used for bonding with a flip-chip film. One end of the bonding terminal extends to the inside of the frame adhesive and is electrically connected to the metal traces through a via. A barrier structure for blocking moisture is disposed in the bonding area, and the barrier structure is disposed at least on the bonding terminal. In this way, moisture intrusion can be blocked, and metal corrosion of the effective lines in the panel can be avoided.

Description

Technical Field

[0001] This application relates to the field of display device technology, specifically to a display panel and a display device. Background Technology

[0002] Display panels and driver ICs generally require bonding processes for bonding. A display panel is composed of a TFT substrate (array substrate) and a CF substrate (color filter substrate). The portion of the TFT substrate (array substrate) extending beyond the CF substrate (color filter substrate) forms an OLB (outer lead bonding) area. Bonding leads are located in the OLB area of ​​the TFT substrate for attaching COF (chip-on-film) terminals. Metal traces can be laid out on the TFT substrate and connected to the board. Metal traces typically extend into the OLB area. The ITO layer of the bonding lead is usually connected to the metal trace via vias, thus conducting input signals from the ITO layer to the metal trace. Because vias and metal traces are exposed in the OLB area, they are prone to corrosion when the display panel is used in high-humidity environments, affecting product reliability. Summary of the Invention

[0003] This application provides a display panel and display device that can prevent metal corrosion of effective circuits within the panel and improve product reliability.

[0004] In a first aspect, embodiments of this application provide a display panel, including an array substrate and a color filter substrate disposed opposite to each other, wherein the array substrate and the color filter substrate are sealed together by a frame adhesive, and one end of the array substrate extends beyond the edge of the color filter substrate in a first direction to form a bonding area;

[0005] The array substrate includes metal traces and bonding terminals electrically connected to the metal traces. One end of the metal trace connected to the bonding terminal terminates within the frame adhesive. A dielectric layer is disposed on the array substrate, covering the metal traces. The bonding terminal is disposed on the side of the dielectric layer away from the array substrate. The bonding terminal is located in the bonding area and is used for bonding with the flip-chip film. One end of the bonding terminal extends into the inner side of the frame adhesive and is electrically connected to the metal trace through a via.

[0006] The binding area is provided with a barrier structure for blocking water vapor, and the barrier structure is provided at least on the binding terminal.

[0007] In one embodiment, the bonding terminals include a plurality of first bonding terminals arranged side-by-side at intervals in a second direction;

[0008] Correspondingly, a plurality of metal traces are provided on the array substrate, and each metal trace is electrically connected to a first bonding terminal through a via.

[0009] The barrier structure includes a first barrier structure and / or a second barrier structure, wherein the first barrier structure is disposed on the first bonding terminal and the second barrier structure is disposed between two adjacent first bonding terminals.

[0010] In one embodiment, the first bonding terminal includes a connecting segment and a bonding segment that are connected to each other. The connecting segment is located within the frame adhesive and is electrically connected to the metal trace through a via. The bonding segment is located within the bonding area.

[0011] The binding segment has a notch, and the binding segment is divided into two branches in the second direction;

[0012] The first barrier structure includes the notch.

[0013] In one embodiment, the two bifurcations have a first surface and a second surface arranged opposite to each other in the second direction. A first water-blocking electrode group is provided on the first surface. The first water-blocking electrode includes a plurality of first water-blocking electrodes spaced apart in the first direction. A second water-blocking electrode group is provided on the second surface. The second water-blocking electrode includes a plurality of second water-blocking electrodes spaced apart in the first direction. The first water-blocking electrode group and the second water-blocking electrode group are spaced apart in the second direction.

[0014] The first barrier structure further includes the first water-blocking electrode group and the second water-blocking electrode group.

[0015] In one embodiment, a plurality of first water-blocking electrodes and a plurality of second water-blocking electrodes correspond one-to-one.

[0016] In one embodiment, the first barrier structure further includes:

[0017] A third water-blocking electrode group is disposed within the notch and close to the first surface. The third water-blocking electrode group includes a plurality of third water-blocking electrodes spaced apart in the first direction, with the plurality of third water-blocking electrodes and a plurality of first water-blocking electrodes alternately arranged.

[0018] A fourth water-blocking electrode group is disposed within the notch and close to the second surface. The fourth water-blocking electrode group includes a plurality of fourth water-blocking electrodes spaced apart in the first direction, and the plurality of fourth water-blocking electrodes and a plurality of second water-blocking electrodes are alternately arranged.

[0019] Wherein, the width of the third water-blocking electrode is smaller than the width of the first water-blocking electrode; and / or,

[0020] The width of the fourth water-blocking electrode is smaller than the width of the second water-blocking electrode.

[0021] In one embodiment, the ends of the first water-blocking electrode and the second water-blocking electrode both extend obliquely away from the frame adhesive and are close to each other.

[0022] In one embodiment, a plurality of fifth water-blocking electrodes are disposed between two adjacent first binding terminals, and the plurality of fifth water-blocking electrodes are spaced apart in the first direction;

[0023] The second barrier structure includes a plurality of the fifth water-blocking electrodes.

[0024] In one embodiment, the fifth water-blocking electrode includes two electrode segments arranged at relative intervals in the second direction, both electrode segments being arranged along the first direction, and their two ends away from the frame adhesive approaching each other.

[0025] Secondly, this application provides a display device, which includes the display panel described above.

[0026] Beneficial effects: In the display panel provided by this application, the metal traces and the bonding terminals are disposed on the array substrate. The metal traces are electrically connected to the bonding terminals through the vias. The bonding terminals are bonded to the flip-chip film. The metal traces are connected to the array substrate to transmit drive signals. One end of the metal trace connected to the bonding terminal terminates in the frame adhesive, and the other end of the bonding terminal extends to the inside of the frame adhesive and connects to the metal trace. Thus, in the bonding area, there are no exposed metal traces and vias, thereby avoiding metal corrosion and eliminating the weak points of the metal traces and the bonding terminals at the vias where they are susceptible to moisture corrosion. At the same time, a barrier structure is formed at least on the bonding terminals in the bonding area. The barrier structure can increase the resistance to moisture intrusion and prevent corrosion of the effective circuitry within the panel. Attached Figure Description

[0027] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0028] Figure 1This is a layout diagram of the metal traces and bonding terminals provided in the embodiments of this application;

[0029] Figure 2 This is a schematic diagram of the structure of the bonding terminal provided in an embodiment of this application;

[0030] Figure 3 for Figure 2 An enlarged schematic diagram of part A in the image;

[0031] Figure 4 for Figure 2 A magnified schematic diagram of part B in the image;

[0032] Figure 5 A cross-sectional view of the display panel provided in an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] In the description of this application, it should be understood that the terms "above," "below," "front," "back," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and should not be construed as limiting this application. Furthermore, unless otherwise expressly specified and limited, "above" or "below" the second feature of the first feature merely indicates that the first feature is at a higher or lower level than the second feature, and does not indicate a direct connection relationship.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only, and features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly without specifically limiting the connection method. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] The following disclosure provides many different embodiments for implementing different structures of this application. To simplify the disclosure of this application, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0039] This application provides a display panel and a display device. The display panel can be a display panel of a mobile phone, computer, or tablet, and there is no limitation herein.

[0040] Firstly, please refer to Figure 1 and Figure 2 This application provides a display panel 100, which includes an array substrate 1 and a color filter substrate 2 disposed opposite to each other. The array substrate 1 and the color filter substrate 2 are sealed together by a frame adhesive. One end of the array substrate 1 extends beyond the edge 2a of the color filter substrate 2 in a first direction F1 to form a bonding area 1a. The display panel 100 also includes metal traces 3 and bonding terminals 4 electrically connected to the metal traces 3. One end of the metal traces 3 connected to the bonding terminals 4 terminates in the frame adhesive. A dielectric layer 5 is disposed on the array substrate 1, covering the metal traces 3. The bonding terminals 4 are disposed on the side of the dielectric layer 5 away from the array substrate 1. The bonding terminals 4 are located in the bonding area 1a and are used to bond with a flip-chip film 200. One end of the bonding terminals 4 extends to the inside of the frame adhesive and is electrically connected to the metal traces 3 through a via 6. A barrier structure 7 for blocking moisture is disposed in the bonding area 1a, and the barrier structure 7 is disposed at least on the bonding terminals 4.

[0041] In the display panel 100 provided in this application, the metal trace 3 and the bonding terminal 4 are disposed on the array substrate 1. The metal trace 3 is electrically connected to the bonding terminal 4 through the via 6. The bonding terminal 4 is bonded to the flip-chip film 200. The metal trace 3 is connected to the array substrate 1 to transmit drive signals. One end of the metal trace 3 connected to the bonding terminal 4 terminates in the frame adhesive, and one end of the bonding terminal 4 extends to the inside of the frame adhesive and connects to the metal trace 3. Thus, in the bonding area 1a, there are no exposed metal traces 3 and vias 6, thereby avoiding metal corrosion and eliminating the weak point of water vapor corrosion of the metal trace 3 and bonding terminal 4 at the via 6. At the same time, in the bonding area 1a, at least on the bonding terminal 4, a barrier structure 7 is formed. The barrier structure 7 can increase the resistance to water vapor intrusion and avoid corrosion of the effective circuits in the panel.

[0042] It should be noted that this application does not specify the first direction F1 and the second direction F2. The first direction F1 and the second direction F2 can be arranged in an intersecting manner. For example, in some embodiments, the first direction F1 is set to left and right and the second direction F2 is set to front and back. No specific restrictions are made here.

[0043] This application does not limit the specific form of the dielectric layer 5. In one embodiment, the dielectric layer 5 includes an insulating layer 51 and a planarization layer 52. The insulating layer 51 is disposed on the array substrate 1 and covers the metal trace 3. The planarization layer 52 is disposed on the side of the insulating layer 51 away from the array substrate 1, and is used to planarize the surface of the array substrate 1. The via 6 is disposed on the insulating layer 51 and extends through the planarization layer 52. The bonding terminal 4 is disposed on the side of the planarization layer 52 away from the insulating layer 51 and is electrically connected to the metal trace 3 through the via 6.

[0044] In one embodiment, the bonding terminal 4 includes a plurality of first bonding terminals 41 arranged side by side at intervals in the second direction F2; correspondingly, a plurality of metal traces 3 are provided on the array substrate 1; each of the first bonding terminals 41 is electrically connected to one of the metal traces 3 through a via 6.

[0045] Please see Figure 1 and Figure 2 The barrier structure 7 includes a first barrier structure 71, which is disposed on the first bonding terminal 41. The first barrier structure 71 is disposed on each of the first bonding terminals 41 to prevent moisture from spreading along the surface of the first bonding terminal 41, thereby preventing metal corrosion of the first bonding terminal 41.

[0046] The barrier structure 7 includes a second barrier structure 72, which is disposed between two adjacent first bonding terminals 41. The second barrier structure 72 is disposed between two adjacent first bonding terminals 41 to prevent moisture from spreading between the two adjacent first bonding terminals 41, thereby preventing metal corrosion of the first bonding terminals 41.

[0047] It should be noted that the first barrier structure 71 and the second barrier structure 72 mentioned above can be selected to be provided or can be provided simultaneously. Specifically, in one embodiment, the first barrier structure 71 and the second barrier structure 72 are provided simultaneously, so as to have a better blocking effect on water vapor.

[0048] In one embodiment, please refer to further details. Figure 1The first bonding terminal 41 includes a connecting segment 411 and a bonding segment 412 that are connected to each other. The connecting segment 411 is located inside the frame adhesive and is electrically connected to the metal trace 3 through a through hole 6. The bonding segment 412 is located within the bonding area 1a. A notch 711 is provided on the bonding segment 412, which divides the bonding segment 412 in the second direction F2 to form two branches 4121. The first barrier structure 71 includes the notch 711. In this embodiment, the bonding segment 412 is divided into two branches 4121 by the notch 711. That is, the first bonding terminal 41 is arranged in a "Y" shape. When moisture intrusion causes metal corrosion in one of the branches 4121, the two branches 4121 that are spaced apart play a blocking role, which can prevent corrosion from spreading along the bonding segment 412, thereby reducing the degree of corrosion of the bonding segment 412.

[0049] Although the bonding segment 412 is divided into two branches 4121 by the notch 711, which prevents corrosion from spreading along the bonding segment 412, moisture can still enter along the notch 711. To prevent moisture intrusion, in one embodiment, please refer to... Figure 2 and Figure 3 The two forks 4121 have a first surface 4121a and a second surface 4121b arranged opposite to each other in the second direction F2. A first water-blocking electrode group 712 protrudes from the first surface 4121a. The first water-blocking electrode 7121 includes a plurality of first water-blocking electrodes 7121 spaced apart in the first direction F1. A second water-blocking electrode group 713 protrudes from the second surface 4121b. The second water-blocking electrode group 7131 includes a plurality of second water-blocking electrodes 7131 spaced apart in the first direction F1. The first water-blocking electrode group 712 and the second water-blocking electrode group 713 are spaced apart in the second direction F2. The first barrier structure 71 also includes the first water-blocking electrode group 712 and the second water-blocking electrode group 713.

[0050] It is understood that the notch 711 reduces the conductive area of ​​the binding segment 412. By setting the first water-blocking electrode 7121 on the first surface 4121a and the second water-blocking electrode 7131 on the second surface 4121b, the conductive area of ​​the binding segment 412 can be increased and the impedance of the binding segment 412 can be reduced. At the same time, the multiple first water-blocking electrodes 7121 and the multiple second water-blocking electrodes 7131 are arranged in a branch-like manner within the notch 711, which can disturb the flow of water vapor and increase the resistance to water vapor intrusion.

[0051] This application does not limit the specific arrangement of the first water-blocking electrode 7121 and the second water-blocking electrode 7131. Multiple first water-blocking electrodes 7121 can correspond one-to-one with multiple second water-blocking electrodes 7131; multiple first water-blocking electrodes 7121 can also be staggered with multiple second water-blocking electrodes 7131; the arrangement can be made according to the specific usage.

[0052] Furthermore, to prevent adhesion between adjacent first water-blocking electrodes 7121, the gap between adjacent first water-blocking electrodes 7121 can be designed to be larger while ensuring the conductive area of ​​the binding segment 412. Simultaneously, a third water-blocking electrode group 714 is also provided within the gap 711. The third water-blocking electrode group 714 is positioned close to the first surface 4121a and includes multiple third water-blocking electrodes 7141 spaced apart in the first direction F1. These multiple third water-blocking electrodes 7141 and multiple first water-blocking electrodes 7121 are arranged alternately. In other words, a third water-blocking electrode 7141 is placed within the gap between adjacent first water-blocking electrodes 7121, thereby further disturbing the flow of water vapor and increasing the water-blocking effect.

[0053] Similarly, to prevent adhesion between adjacent second water-blocking electrodes 7131, the gap between adjacent second water-blocking electrodes 7131 can be designed to be larger while ensuring the conductive area of ​​the binding segment 412. Simultaneously, a fourth water-blocking electrode group 715 is also provided within the gap 711. The fourth water-blocking electrode group 715 is positioned close to the second surface 4121b and includes multiple fourth water-blocking electrodes 7151 spaced apart in the first direction F1. These multiple fourth water-blocking electrodes 7151 and multiple second water-blocking electrodes 7131 are arranged alternately. In other words, a fourth water-blocking electrode 7151 is placed within the gap between adjacent second water-blocking electrodes 7131, thereby further disturbing the flow of water vapor and increasing the water-blocking effect.

[0054] The width of the third water-blocking electrode 7141 is smaller than the width of the first water-blocking electrode 7121. By designing the width of the third water-blocking electrode 7141 to be narrower, adhesion between the first water-blocking electrode 7121 and the third water-blocking electrode 7141 can be avoided.

[0055] The width of the fourth water-blocking electrode 7151 is smaller than the width of the second water-blocking electrode 7131. By designing the width of the fourth water-blocking electrode 7151 to be narrower, adhesion between the second water-blocking electrode 7131 and the fourth water-blocking electrode 7151 can be avoided.

[0056] It should be noted that either of the two technical features mentioned above can be set, or both can be set simultaneously; no specific restrictions are imposed here.

[0057] Based on the above embodiment where "a plurality of first water-blocking electrodes 7121 can correspond one-to-one with a plurality of second water-blocking electrodes 7131", the ends of the first water-blocking electrode 7121 and the ends of the second water-blocking electrode 7131 both extend obliquely away from the frame adhesive and are close to each other; it should be noted that the two ends of the first water-blocking electrode 7121 and the second water-blocking electrode 7131 are close to each other, so that the ends of the first water-blocking electrode 7121 and the second water-blocking electrode 7131 away from the frame adhesive are arranged in a "pointed" shape. The first water-blocking electrode 7121 and the second water-blocking electrode 7131 form a Tesla valve within the notch 711. The "pointed" structure can block moisture from entering the display panel 100 from the cut of the array substrate 1. At the same time, the first water-blocking electrode 7121 and the second water-blocking electrode 7131 are spaced apart to form a hydrophobic channel, which discharges moisture from the display panel 100. This arrangement can both block moisture from entering and drain moisture from the display panel 100, thus avoiding corrosion of the effective circuitry within the display panel 100.

[0058] In one embodiment, please refer to Figure 2 and Figure 4 A plurality of fifth water-blocking electrodes 721 are disposed between two adjacent first binding terminals 41, and the plurality of fifth water-blocking electrodes 721 are spaced apart in the first direction F1; wherein, the second barrier structure 72 includes the plurality of fifth water-blocking electrodes 721. It is understood that when water vapor intrudes, it will spread along the gap between two adjacent first binding terminals 41; the plurality of fifth water-blocking electrodes 721 disposed between two adjacent first binding terminals 41 can fill the terrain between two adjacent first binding terminals 41, thereby increasing the resistance to water vapor intrusion.

[0059] This application does not limit the specific form of the fifth water-blocking electrode 721. The third water-blocking electrode 7141 can be a single electrode or it can be spliced ​​together from electrode segments 7211; the choice can be made according to the specific product.

[0060] Furthermore, this application does not limit the specific shape of the fifth water-blocking electrode 721. The fifth water-blocking electrode 721 can be square, rectangular, or irregularly shaped; it can be selected according to the specific product.

[0061] In one embodiment, the fifth water-blocking electrode 721 includes two electrode segments 7211 arranged at a relative interval in the second direction F2. Both electrode segments 7211 are arranged along the first direction F1, and their two ends away from the frame adhesive are close to each other. That is, the fifth water-blocking electrode 721 includes two electrode segments 7211, and the two ends of the two electrode segments 7211 away from the frame adhesive are close to each other, so that the end of the third water-blocking electrode 7141 away from the frame adhesive is "pointed". The two electrode segments 7211 form a Tesla valve between two adjacent first bonding terminals 41. The "pointed" structure can block water vapor from entering the display panel 100 from the cut of the array substrate 1. At the same time, the two electrode segments 7211 are spaced apart and form a hydrophobic channel to discharge water vapor from the display panel 100. This arrangement can block water vapor from entering and guide water vapor in the display panel 100, thus avoiding corrosion of the effective circuits in the display panel 100.

[0062] It is understood that the positional relationship between the fifth water-blocking electrode 721, the first water-blocking electrode 7121, and the second water-blocking electrode 7131 can be one-to-one correspondence, two of the three can correspond, or all three can be staggered. There are no specific restrictions here, and the choice can be made according to the specific application scenario and product.

[0063] In one embodiment, the array base is provided with a second bonding pin within the bonding region 1a. The second bonding pin is electrically connected to the first bonding pin via an anisotropic conductive film 300. The anisotropic conductive film 300 (ACF) is characterized by a significant difference in resistance characteristics between the electrical conduction direction F3 in the third direction and the plane formed by the first direction F1 and the second direction F2. When the difference between the conduction resistance value in the third direction F3 and the insulation resistance value of the plane formed by the first direction F1 and the second direction F2 exceeds a certain ratio, it can be considered to have good anisotropic conductivity. The anisotropic conductive film 300 uses conductive particles to connect the second bonding pin and the first bonding pin to make them conductive, while simultaneously preventing short circuits between the sub-pins on the first and second bonding pins, thus achieving the purpose of conduction only in the third direction F3.

[0064] Secondly, embodiments of this application also provide a display device; please refer to [link to relevant documentation]. Figure 5 and Figure 6The display device includes a display panel 100. It should be noted that the display panel 100 is configured as described above. That is to say, the display panel 100 has all the embodiments of the display panel 100 described above, and the display device also has all the technical features of all the embodiments of the display panel 100 described above, and thus has all the beneficial effects brought about by all the technical features. These will not be elaborated here.

[0065] The display device also includes tuff adhesive 400, which can also be called tuffy adhesive. After the flip-chip film 200 is bonded to the array substrate 1, the tuff adhesive 400 is adhered to the color filter substrate 2, the array substrate 1, and the flip-chip film 200. The junction between the tuff adhesive 400 and the flip-chip film 200 and the color filter substrate 2 has a strong waterproof effect due to its good sealing performance and the long path to the first bonding pin.

[0066] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0067] The above provides a detailed description of a display panel and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized by, The array substrate and the color filter substrate are arranged opposite to each other, and the array substrate and the color filter substrate are sealed together by frame adhesive. One end of the array substrate extends beyond the edge of the color filter substrate in a first direction to form a bonding area. The array substrate includes metal traces and bonding terminals electrically connected to the metal traces. One end of the metal trace connected to the bonding terminal terminates within the frame adhesive. A dielectric layer is disposed on the array substrate, covering the metal traces. The bonding terminal is disposed on the side of the dielectric layer away from the array substrate. The bonding terminal is located in the bonding area and is used for bonding with the flip-chip film. One end of the bonding terminal extends into the inner side of the frame adhesive and is electrically connected to the metal trace through a via. The bonding area includes a barrier structure for blocking moisture, which is at least located on the bonding terminals. The bonding terminals include a plurality of first bonding terminals spaced side-by-side in a second direction. Correspondingly, the array substrate has a plurality of metal traces, each of which is electrically connected to a first bonding terminal via a via. The barrier structure includes a first barrier structure and / or a second barrier structure, the first barrier structure being located on the first bonding terminals and the second barrier structure being located between two adjacent first bonding terminals. The first bonding terminal includes a connecting segment and a bonding segment connected to each other. The connecting segment is located within the frame adhesive and electrically connected to the metal trace via a via, while the bonding segment is located within the bonding area. The bonding segment has a notch that divides the bonding segment in the second direction into two branches. The first barrier structure includes the notch.

2. The display panel of claim 1, wherein, The two bifurcations have a first surface and a second surface arranged opposite to each other in the second direction. A first water-blocking electrode group is provided on the first surface. The first water-blocking electrode includes a plurality of first water-blocking electrodes arranged at intervals in the first direction. A second water-blocking electrode group is provided on the second surface. The second water-blocking electrode includes a plurality of second water-blocking electrodes arranged at intervals in the first direction. The first water-blocking electrode group and the second water-blocking electrode group are arranged at intervals in the second direction. The first barrier structure further includes the first water-blocking electrode group and the second water-blocking electrode group.

3. The display panel of claim 2, wherein, The first water-blocking electrode and the second water-blocking electrode are in one-to-one correspondence.

4. The display panel of claim 2, wherein, The first barrier structure further includes: A third water-blocking electrode group is disposed within the notch and close to the first surface. The third water-blocking electrode group includes a plurality of third water-blocking electrodes spaced apart in the first direction, with the plurality of third water-blocking electrodes and a plurality of first water-blocking electrodes alternately arranged. A fourth water-blocking electrode group is disposed within the notch and close to the second surface. The fourth water-blocking electrode group includes a plurality of fourth water-blocking electrodes spaced apart in the first direction, and the plurality of fourth water-blocking electrodes and a plurality of second water-blocking electrodes are alternately arranged. Wherein, the width of the third water-blocking electrode is smaller than the width of the first water-blocking electrode; and / or, The width of the fourth water-blocking electrode is smaller than the width of the second water-blocking electrode.

5. The display panel as described in claim 2, characterized in that, The ends of the first water-blocking electrode and the second water-blocking electrode both extend obliquely away from the frame adhesive and are close to each other.

6. The display panel as described in claim 1, characterized in that, A plurality of fifth water-blocking electrodes are provided between two adjacent first binding terminals, and the plurality of fifth water-blocking electrodes are spaced apart in the first direction; The second barrier structure includes a plurality of the fifth water-blocking electrodes.

7. The display panel as described in claim 6, characterized in that, The fifth water-blocking electrode includes two electrode segments arranged at relative intervals in the second direction. Both electrode segments are arranged along the first direction, and their two ends away from the frame adhesive are close to each other.

8. A display device, characterized in that, Includes the display panel as described in any one of claims 1-7.

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