A dual-frequency dual-polarized dipole phased array antenna

Abstract

The application discloses a dual-frequency dual-polarization dipole phased array antenna, which comprises a plurality of antenna units arranged according to a rectangular grid period, wherein the antenna unit comprises a reflecting plate, a multilayer slotted dielectric substrate located above the reflecting plate, and a winding layer located below the reflecting plate; four high-frequency dipoles, a pair of polarization-orthogonal low-frequency dipoles, four high-frequency feed baluns, a pair of orthogonal low-frequency feed baluns, and four groups of low-frequency ground hole groups are arranged in the multilayer slotted dielectric substrate; the high-frequency dipoles are located above the low-frequency dipoles; the spacing between adjacent high-frequency dipoles is 1 / 2 of the spacing between adjacent low-frequency dipoles; the polarization direction of the high-frequency dipoles is the horizontal direction; the angles between the two polarization directions of the low-frequency dipoles and the horizontal direction are 45 DEG and -45 DEG respectively; the high-frequency feed baluns provide feed for the high-frequency dipoles; the low-frequency feed baluns provide balanced coupling feed for the low-frequency dipoles; and the low-frequency ground hole groups connect the low-frequency dipole arms and the reflecting plate.

Description

Technical Field

[0001] This invention relates to the field of microwave antenna technology, specifically to a dual-frequency dual-polarized dipole phased array antenna. Background Technology

[0002] With the increasing complexity of modern warfare, carrier platforms need to carry more and more electronic information equipment, and correspondingly, the number of antennas is also constantly increasing. In order to improve the system aperture utilization, common aperture antennas that integrate antennas of different frequency bands and functions into the same radiating surface have gradually become a research hotspot in the antenna field. In addition, in order to achieve higher transmission efficiency and wider beam coverage, common aperture antennas are gradually developing towards multi-polarization and wide bandwidth angle scanning.

[0003] In the study of common-aperture antennas, based on the frequency ratio of the high-frequency antenna to the low-frequency antenna, multi-frequency common-aperture antennas are divided into three categories: small frequency ratio (<2), ordinary frequency ratio, and large frequency ratio (>8). When two antennas with small or close frequency ratios are placed in the same aperture, structural interference, obstruction, or energy coupling between harmonics can all have a significant impact on the realization of wide bandwidth angle scanning and multi-polarization performance of the antenna.

[0004] Therefore, to solve the above problems, this invention proposes a three-dimensional arrangement of dipoles with a common aperture, using a low-frequency antenna as a reflector for a high-frequency antenna, to balance the dual-band performance of the antenna (frequency ratio of 2.13), reduce aperture pressure, and improve antenna isolation. This achieves a design where the high-frequency antenna is horizontally polarized and the low-frequency antenna is dual-slant polarized, with relative impedance bandwidths of 12.5% ​​and 34% for the high-frequency and low-frequency antennas, respectively. Furthermore, the low-frequency antenna can achieve ±60° scanning coverage within certain operating frequency bands. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a dual-frequency dual-polarized dipole phased array antenna that integrates antennas of different frequency bands and polarizations onto the same radiating aperture, effectively improving aperture utilization.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: A dual-frequency dual-polarization dipole phased array antenna includes multiple antenna elements arranged periodically according to a rectangular grid. Each antenna element includes a reflector, a multilayer slotted dielectric substrate above the reflector, and a winding layer below the reflector. The multilayer slotted dielectric substrate contains four high-frequency dipoles, a pair of orthogonally polarized low-frequency dipoles, four high-frequency feed baluns, a pair of orthogonal low-frequency feed baluns, and four groups of low-frequency grounding holes. The high-frequency dipoles are located above the low-frequency dipoles, and the spacing between adjacent high-frequency dipoles is half the spacing between adjacent low-frequency dipoles. The polarization direction of the high-frequency dipoles is horizontal, and the two polarization directions of the low-frequency dipoles make angles of 45° and -45° with the horizontal direction, respectively. The high-frequency feed baluns provide power to the high-frequency dipoles, and the low-frequency feed baluns provide balanced coupled power to the low-frequency dipoles. The low-frequency grounding holes connect the low-frequency dipole arms and the reflector.

[0007] Furthermore, the multilayer slotted dielectric substrate has multiple slots. The principle of slotting is to minimize the volume of the dielectric substrate in the non-printed line area, provided that the printed circuit board process can achieve this.

[0008] Furthermore, the high-frequency dipoles are located directly above the low-frequency dipole arms, with the high-frequency dipoles being narrower and the low-frequency dipole arms being wider.

[0009] Furthermore, the high-frequency feeding balun consists of a high-frequency feeding signal hole, a high-frequency feeding open-circuit stub, and a high-frequency feeding grounding hole. The high-frequency feeding open-circuit stub is located above the high-frequency dipole. One end of both the high-frequency feeding signal hole and the high-frequency feeding grounding hole is located on the winding layer and passes through the low-frequency double opening on the low-frequency dipole arm. The other end of the high-frequency feeding signal hole passes upward through the high-frequency single opening on the high-frequency dipole and is finally electrically connected to the high-frequency feeding open-circuit stub located above the high-frequency dipole. The other end of the high-frequency feeding grounding hole is directly electrically connected to the high-frequency dipole.

[0010] Furthermore, the high-frequency power supply open-circuit branch has a multi-stage gradually changing structure with widened ends.

[0011] Furthermore, the low-frequency feeding balun consists of a low-frequency feeding signal hole, a low-frequency feeding signal line, a low-frequency feeding open circuit hole, a first low-frequency feeding grounding hole group, and a second low-frequency feeding grounding hole group. The low-frequency feeding signal hole, the low-frequency feeding signal line, and the low-frequency feeding open circuit hole are all located below the low-frequency dipole, and together transmit the signal from the winding layer and couple it to the low-frequency dipole. The low-frequency dipole arm is also electrically connected to the reflector through the first low-frequency feeding grounding hole group and the second low-frequency feeding grounding hole group, respectively, to achieve grounding.

[0012] Furthermore, the first low-frequency feed grounding hole group is composed of multiple first low-frequency feed grounding hole vias, and the second low-frequency feed grounding hole group is composed of multiple second low-frequency feed grounding hole vias. The first low-frequency feed grounding hole group surrounds the low-frequency feed signal hole, and the second low-frequency feed grounding hole group surrounds the low-frequency feed open hole.

[0013] Furthermore, the diameter of the low-frequency power supply signal hole is smaller than the diameter of the low-frequency power supply open hole, and the radius of the arc formed by the first low-frequency power supply grounding hole group is larger than the radius of the arc formed by the second low-frequency power supply grounding hole group.

[0014] Furthermore, the low-frequency feed signal line includes two orthogonal ones, one of which is divided into three segments with the middle segment recessed. The three segments are electrically continuous through a low-frequency feed signal line via, thus avoiding the orthogonal low-frequency feed signal lines.

[0015] Furthermore, the low-frequency grounding hole group comprises four groups, each group consisting of multiple low-frequency grounding hole vias. The low-frequency grounding hole vias are located on both sides of the corresponding high-frequency feed balun and are symmetrically distributed about the axis of the low-frequency dipole.

[0016] Compared with existing technologies, the present invention has the following advantages: (1) In this invention, the polarization direction of the high-frequency dipole is horizontal, and the two polarization directions of the low-frequency dipole are at angles of 45° and -45° with the horizontal direction, respectively, so as to reduce the coupling risk between the low frequency and the high frequency.

[0017] (2) In this invention, under the premise that the printed circuit board process is feasible, the non-printed line area in the multilayer dielectric substrate is removed as much as possible, the volume of the multilayer slotted dielectric substrate is minimized, and the influence of surface waves on the scanning performance of low frequency antenna is weakened as much as possible.

[0018] (3) In this invention, the high-frequency dipole is narrower, which can reduce the obstruction of the low-frequency antenna and thus reduce the impact on the low-frequency radiation performance, while the low-frequency dipole has a wide arm, which acts as a reflector for the high-frequency dipole.

[0019] (4) In this invention, the high-frequency feeding balun provides a broadband signal to the high-frequency dipole, and the high-frequency feeding open-circuit stub is designed as a multi-level gradual change and end widening form to achieve better impedance matching effect.

[0020] (5) In this invention, the low-frequency feeding balun adopts a balanced coupling feeding form. The first low-frequency feeding ground hole group and the second low-frequency feeding ground hole group surround the low-frequency feeding signal hole and the low-frequency feeding open hole, respectively, thereby improving the signal isolation between orthogonal polarizations. The diameter of the low-frequency feeding signal hole is smaller than the diameter of the low-frequency feeding open hole, and the radius of the arc formed by the first low-frequency feeding ground hole group is larger than the radius of the arc formed by the second low-frequency feeding ground hole group, thereby achieving broadband impedance matching.

[0021] (6) In this invention, the low-frequency grounding hole group enhances the reflector function of the low-frequency dipole for the high-frequency dipole and guides the current flow on the low-frequency dipole, reducing the impact of the high-frequency feed signal hole and the high-frequency feed grounding hole passing through the low-frequency dipole on the low-frequency performance. Moreover, the low-frequency grounding hole group is symmetrical about the axis of the low-frequency dipole, which can improve the isolation between the two orthogonal low-frequency dipoles.

[0022] (7) In this invention, the three-dimensional arrangement of dipoles with a common aperture, using a low-frequency antenna as a reflector for a high-frequency antenna, balances the dual-frequency performance of the antenna (frequency ratio of 2.13), reduces aperture pressure, and improves antenna isolation. This achieves a design where the high-frequency antenna is horizontally polarized and the low-frequency antenna is dual-slant polarized, with relative impedance bandwidths of 12.5% ​​and 34% for the high-frequency and low-frequency antennas, respectively. Furthermore, the low-frequency antenna can achieve ±60° scanning coverage in some operating frequency bands. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the array arrangement of a dual-frequency dual-polarized dipole antenna according to the present invention; Figure 2 This is a schematic diagram of the antenna unit of the present invention; Figure 3 This is a schematic diagram of the low-frequency antenna of the present invention; Figure 4 This is a schematic diagram of the low-frequency power supply balun and low-frequency grounding hole group of the present invention; Figure 5 This invention relates to the active standing wave ratio (VSWR) curve of the low-frequency antenna along the E-plane in a dual-frequency dual-polarized dipole antenna. Figure 6 This invention relates to the active standing wave ratio (VSWR) curve of a low-frequency antenna scanning along the H-plane in a dual-frequency dual-polarized dipole antenna. Figure 7 This invention relates to an orthogonal polarization port isolation curve for a low-frequency antenna in a dual-frequency dual-polarization dipole antenna. Figure 8 This is the normal active standing wave ratio curve of the four high-frequency antennas in a dual-frequency dual-polarized dipole antenna of the present invention; Figure 9 The port isolation curve between the high-frequency antenna and the low-frequency antenna in a dual-frequency dual-polarized dipole antenna of the present invention is shown. The components are as follows: 1. Reflector; 2. Multilayer slotted dielectric substrate; 3. High-frequency dipole; 4. Low-frequency dipole; 5. High-frequency feed balun; 6. Low-frequency feed balun; 7. Low-frequency grounding hole group; 8. Winding layer; 9. High-frequency feed signal hole; 10. High-frequency feed open-circuit stub; 11. High-frequency feed grounding hole; 12. Low-frequency double opening; 13. High-frequency single opening; 14. Top pad; 15. Stub hole; 16. Low-frequency feed signal hole; 17. Low-frequency feed signal line; 18. Low-frequency feed open-circuit hole; 19. First low-frequency feed grounding hole group; 20. Second low-frequency feed grounding hole group. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1 As shown, this is a dual-frequency dual-polarized dipole phased array antenna with a 5×5 antenna element scale (this embodiment shows a 5×5 small array scale, but other scales can also be used for the radar array), with multiple antenna elements arranged periodically according to a rectangular grid.

[0026] like Figure 2 As shown, an antenna unit includes a reflector 1, a multilayer slotted dielectric substrate 2 located above the reflector 1, and a winding layer 8 located below the reflector 1. The multilayer slotted dielectric substrate 2 is provided with four high-frequency dipoles 3, a pair of orthogonally polarized low-frequency dipoles 4, four high-frequency feed baluns 5, a pair of orthogonal low-frequency feed baluns 6, and four groups of low-frequency grounding holes 7.

[0027] Since the low-frequency antenna is located below the high-frequency antenna, to clearly demonstrate the low-frequency antenna, as shown below... Figure 3 The diagram shown is a schematic of a low-frequency antenna. Figure 4 The diagram shows a low-frequency power supply balun and a group of low-frequency grounding holes.

[0028] The multilayer slotted dielectric substrate 2 is a microwave dielectric substrate with a dielectric constant of 2.94, such as the CLTE-XT high-frequency board produced by Arlon Corporation of the United States. The multilayer slotted dielectric substrate 2 has multiple slots. The principle of slotting is to minimize the volume of the dielectric substrate in the non-printed line area as much as possible, under the premise that the printed circuit board process can be realized, so as to reduce the influence of surface waves.

[0029] The low-frequency dipole 4 has a low-frequency double opening 12 on each low-frequency dipole arm, and the high-frequency dipole 3 has a high-frequency single opening 13 on each high-frequency dipole 3.

[0030] The four high-frequency dipoles 3 are located directly above the corresponding low-frequency dipole arms. The spacing between adjacent high-frequency dipoles 3 is half the spacing between adjacent low-frequency dipoles 4. The high-frequency dipoles 3 are narrower, which reduces obstruction of the low-frequency antenna and thus reduces the impact on low-frequency radiation performance. The low-frequency dipole arms are wider, acting as reflectors for the high-frequency dipoles 3. The polarization direction of the high-frequency dipoles 3 is horizontal, while the two polarization directions of the low-frequency dipoles 4 make angles of 45° and -45° with the horizontal direction, respectively, to reduce the risk of coupling between low and high frequencies.

[0031] The high-frequency feeding balun 5 is used to provide power to the high-frequency dipole 3. It consists of a high-frequency feeding signal hole 9, a high-frequency feeding open-circuit branch 10, and a high-frequency feeding ground hole 11. Specifically, the high-frequency feeding open-circuit branch 10 is located above the high-frequency dipole 3. One end of the high-frequency feeding signal hole 9 and the high-frequency feeding ground hole 11 are both located on the winding layer 8. They have the same diameter and both pass through the low-frequency double opening 12 on the low-frequency dipole arm. The high-frequency feeding signal hole 9 continues upward through the high-frequency single opening 13 on the high-frequency dipole. Finally, its other end is electrically connected to the high-frequency feeding open-circuit branch 10 located above the high-frequency dipole 3, while the other end of the high-frequency feeding ground hole 11 is directly electrically connected to the high-frequency dipole 3. In actual processing, to reduce the variety of vias in the multilayer slotted dielectric substrate 2 and lower the via difficulty, the high-frequency power supply grounding via 11 can also extend upwards to the upper surface of the multilayer slotted dielectric substrate 2. Its top pad 14 is located within the high-frequency power supply open circuit support 10, but does not make electrical contact with the high-frequency power supply open circuit support 10. This is achieved by creating a support hole 15 with a diameter larger than the top pad 14 within the high-frequency power supply open circuit support 10. To achieve better impedance matching, the high-frequency power supply open circuit support 10 is designed with a multi-stage gradient and a widened end.

[0032] The low-frequency feeding balun 6 is used to provide balanced coupling feeding for the low-frequency dipole 4. It consists of a low-frequency feeding signal hole 16, a low-frequency feeding signal line 17, a low-frequency feeding open hole 18, a first low-frequency feeding grounding hole group 19, and a second low-frequency feeding grounding hole group 20. Specifically, the low-frequency feeding signal hole 16, the low-frequency feeding signal line 17, and the low-frequency feeding open hole 18 are all located below the low-frequency dipole 4, and together transmit the signal from the winding layer 8 and couple it to the low-frequency dipole 4. The low-frequency dipole arm is also electrically connected to the reflector 1 through the first low-frequency feeding grounding hole group 19 and the second low-frequency feeding grounding hole group 20, respectively, thereby achieving grounding.

[0033] The first low-frequency feed grounding hole group 19 and the second low-frequency feed grounding hole group 20 are each composed of multiple first low-frequency feed grounding hole vias and second low-frequency feed grounding hole vias, respectively. The first low-frequency feed grounding hole group 19 surrounds the low-frequency feed signal hole 16, and the second low-frequency feed grounding hole group 20 surrounds the low-frequency feed open hole 18, thereby improving the signal isolation between orthogonal polarizations.

[0034] To achieve broadband impedance matching, the diameter of the low-frequency feed signal hole 16 is smaller than the diameter of the low-frequency feed open hole 18, and the radius of the arc formed by the first low-frequency feed grounding hole group 19 is larger than the radius of the arc formed by the second low-frequency feed grounding hole group 20.

[0035] In this embodiment, the first low-frequency power supply grounding hole group 19 and the second low-frequency power supply grounding hole group 20 are composed of 5 and 3 vias of equal diameter, respectively. The diameter and number of vias can be adjusted according to the actual processing conditions.

[0036] The low-frequency feed signal line 17 includes two orthogonal ones. To avoid interference between the two orthogonal low-frequency feed signal lines 17, one of the low-frequency feed signal lines 17 is divided into three segments, with the middle segment being recessed to avoid interference. Electrical continuity between the three segments is achieved through a low-frequency feed signal line via.

[0037] The low-frequency grounding hole group 7 comprises four groups, each group consisting of multiple low-frequency grounding vias. These vias are located on both sides of the corresponding high-frequency feed balun 5 and are symmetrically distributed about the axis of the low-frequency dipole 4. They connect each low-frequency dipole arm to the reflector 1, thereby enhancing the reflector function of the low-frequency dipole 4 for the high-frequency dipole 3 and guiding the current flow on the low-frequency dipole 4. This reduces the impact of the high-frequency feed signal hole 9 and the high-frequency feed grounding hole 11 passing through the low-frequency dipole 4 on the low-frequency performance. The symmetry of the low-frequency grounding hole group 7 about the axis of the low-frequency dipole 4 can improve the isolation between the two orthogonal low-frequency dipoles 4.

[0038] In this embodiment, the low-frequency grounding hole group 7 consists of 5 vias of equal diameter. The diameter and number of vias can be adjusted according to the actual processing conditions.

[0039] In this embodiment, since the two feed ports of the low-frequency antenna are close to each other, structural interference may occur when welding them to the coaxial connector. Therefore, the signal ports of the low-frequency antenna are separated by the winding layer 8 below the reflector 1.

[0040] In this embodiment, the center frequency of the high-frequency antenna is f h The operating frequency range is 0.9375. f h ~1.0625 f hThe relative bandwidth is 12.5%, and the center frequency of the low-frequency antenna is... f l The operating frequency range is 0.83. f l ~1.17 f l The relative bandwidth is 34%, and the frequency ratio is... f h : f l Approximately 2.13. The spacing between the low-frequency units is 0.52. λ l The spacing between high-frequency elements is half that of low-frequency elements, and the total profile height of the antenna is 0.26. λ l .

[0041] The antenna model in this embodiment was simulated, and the simulation results are as follows: Figures 6 to 9 As shown.

[0042] Figure 5 and Figure 6 The figures show the active standing wave ratio (VSWR) curves of the low-frequency antenna scanned along the E-plane and H-plane in this embodiment. The horizontal axis represents the operating frequency, and the vertical axis represents the active VSWR. The scanning angles include 0°, 30°, 45°, and 60°. Using an active VSWR of less than 3 as a standard, the low-frequency antenna in this embodiment achieves a 34% impedance bandwidth when scanning along the normal direction. When the scanning angles are increased to 30°, 45°, and 60°, respectively, the active VSWR in the H-plane reaches 0.83 in the operating frequency band. f l ~1.17 f l The internal frequency remains below 3, inevitably affected by surface waves, and the high-frequency cutoff frequency of the E-plane drops to 1.13. f l 1.08 f l and 0.95 f l .

[0043] Figure 7 The isolation of the orthogonal polarization port of the low-frequency antenna in this embodiment is basically below -10dB.

[0044] Figure 8 The normal active VSWR of the four high-frequency antennas in this embodiment is 0.9375 in the operating frequency band. f h ~1.0625 f h The value is basically less than 2.

[0045] Figure 9The port isolation between the high-frequency antenna and the low-frequency antenna is below -12.5dB.

[0046] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-frequency dual-polarized dipole phased array antenna, comprising a plurality of antenna elements arranged periodically according to a rectangular grid, characterized in that, The antenna unit includes a reflector (1), a multilayer slotted dielectric substrate (2) located above the reflector, and a winding layer (8) located below the reflector. The multilayer slotted dielectric substrate (2) is provided with four high-frequency dipoles (3), a pair of orthogonally polarized low-frequency dipoles (4), four high-frequency feeding baluns (5), a pair of orthogonal low-frequency feeding baluns (6), and four groups of low-frequency grounding holes (7). The high-frequency dipoles (3) are located above the low-frequency dipoles (4). The spacing between adjacent high-frequency dipoles (3) is 1 / 2 of the spacing between adjacent low-frequency dipoles (4). The polarization direction of the high-frequency dipoles (3) is horizontal. The two polarization directions of the low-frequency dipoles (4) are at angles of 45° and -45° with the horizontal direction, respectively. The high-frequency feeding baluns (5) provide power to the high-frequency dipoles (3), and the low-frequency feeding baluns (6) provide balanced coupling power to the low-frequency dipoles (4). The low-frequency grounding holes (7) connect the low-frequency dipole arms and the reflector (1). The high-frequency dipoles (3) are located directly above the low-frequency dipole arms, and the width of the high-frequency dipoles (3) is smaller than the width of the low-frequency dipole arms. The high-frequency feeding balun (5) consists of a high-frequency feeding signal hole (9), a high-frequency feeding open circuit branch (10), and a high-frequency feeding ground hole (11). The high-frequency feeding open circuit branch (10) is located above the high-frequency dipole (3). One end of the high-frequency feeding signal hole (9) and the high-frequency feeding ground hole (11) are both located on the winding layer (8) and pass through the low-frequency double opening (12) on the low-frequency dipole arm. The other end of the high-frequency feeding signal hole (9) passes upward through the high-frequency single opening (13) on the high-frequency dipole (3) and is finally electrically connected to the high-frequency feeding open circuit branch (10) located above the high-frequency dipole (3). The other end of the high-frequency feeding ground hole (11) is directly electrically connected to the high-frequency dipole (3). The low-frequency feeding balun (6) consists of a low-frequency feeding signal hole (16), a low-frequency feeding signal line (17), a low-frequency feeding open hole (18), a first low-frequency feeding ground hole group (19), and a second low-frequency feeding ground hole group (20). The low-frequency feeding signal hole (16), the low-frequency feeding signal line (17), and the low-frequency feeding open hole (18) are all located below the low-frequency dipole (4), and together transmit the signal from the winding layer (8) and couple it to the low-frequency dipole (4). The low-frequency dipole arm is also electrically connected to the reflector (1) through the first low-frequency feeding ground hole group (19) and the second low-frequency feeding ground hole group (20) to achieve grounding. Each low-frequency grounding hole group (7) consists of multiple low-frequency grounding hole vias located on both sides of the corresponding high-frequency feed balun (5) and symmetrically distributed about the axis of the low-frequency dipole (4).

2. The dual-frequency dual-polarized dipole phased array antenna according to claim 1, characterized in that, The multilayer slotted dielectric substrate (2) has multiple slots.

3. The dual-frequency dual-polarized dipole phased array antenna according to claim 1, characterized in that, The high-frequency power supply open-circuit branch (10) has a multi-level gradient and widened end structure.

4. The dual-frequency dual-polarized dipole phased array antenna according to claim 1, characterized in that, The first low-frequency feed grounding hole group (19) is composed of multiple first low-frequency feed grounding hole vias, and the second low-frequency feed grounding hole group (20) is composed of multiple second low-frequency feed grounding hole vias. The first low-frequency feed grounding hole group (19) surrounds the low-frequency feed signal hole (16), and the second low-frequency feed grounding hole group (20) surrounds the low-frequency feed open hole (18).

5. A dual-frequency dual-polarized dipole phased array antenna according to claim 4, characterized in that, The diameter of the low-frequency power supply signal hole (16) is smaller than the diameter of the low-frequency power supply open hole (18), and the radius of the arc formed by the first low-frequency power supply grounding hole group (19) is larger than the radius of the arc formed by the second low-frequency power supply grounding hole group (20).

6. A dual-frequency dual-polarized dipole phased array antenna according to claim 1, characterized in that, The low-frequency feed signal line (17) includes two orthogonal ones. One of the low-frequency feed signal lines (17) is divided into three segments, with the middle segment being sunken. The three segments are electrically continuous through the low-frequency feed signal line via, thus avoiding the orthogonal low-frequency feed signal lines (17).

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