Vehicle-mounted lamp and manufacturing method thereof

Abstract

To provide a vehicle-mounted lamp that is compact and has no space inside and that can realize a complex curved surface shape. A light emitting element is arranged on a wiring pattern on a substrate, and a resin-made outer lens layer is mounted on the light emitting element. The substrate has a shape that is curved in a front-rear direction of the outer lens layer.

Description

Technical Field

[0001] This invention relates to thin and three-dimensionally molded automotive lighting fixtures. Background Technology

[0002] Vehicle lighting fixtures such as headlights and taillights, as disclosed in Patent Document 1, are structures in which the light source unit, reflector, and projection lens unit are fixed within an opening in the housing by means of threaded fastening or other methods, and the opening is then sealed with a cover. Each unit consists of multiple parts and mechanisms, which are also assembled together by means of threaded fastening, fitting, welding, etc. In addition, a fan is installed in the lamp housing to cool the light source unit by exhausting air from inside the lamp housing to the outside.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6095931 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] As mentioned above, conventional automotive lighting fixtures are structures assembled from multiple components, requiring space within the housing. Consequently, the overall thickness of the automotive lighting fixture increases, and the volume it occupies becomes larger.

[0008] In recent years, automotive lighting has been required to have excellent design that matches the appearance of the vehicle and to provide comfort due to the increased interior space. Therefore, it is desirable to have a three-dimensional shape with complex curved surfaces and a compact structure.

[0009] The purpose of this invention is to provide a compact vehicle-mounted lamp that can achieve complex curved shapes.

[0010] Methods for solving problems

[0011] To achieve the above objectives, the vehicle-mounted lamp of the present invention comprises: a substrate; a wiring pattern mounted on the substrate; a light-emitting element disposed on the wiring pattern; and a resin outer lens layer mounted on the light-emitting element. The substrate has a shape that is bent along the front-rear direction of the outer lens layer.

[0012] The effects of the invention

[0013] According to the present invention, since the substrate has a curved shape along the front-rear direction of the outer lens layer, it is possible to provide a compact automotive lamp that can achieve complex curved shapes. Attached Figure Description

[0014] Figure 1(a) is a perspective view of the vehicle-mounted lamp according to Embodiment 1 of the present invention. Figure 1 (b) is a three-dimensional view of the cross-section.

[0015] Figure 2 (a) is a schematic cross-sectional view showing the structure of the vehicle-mounted lamp according to embodiment 1. Figure 2 (b) is an enlarged sectional view of (a).

[0016] Figure 3 This is a top view schematically showing a portion of the structure of the wiring pattern on the substrate 10 of the vehicle-mounted lamp according to Embodiment 1.

[0017] Figure 4 (a) to (g) are cross-sectional views showing the manufacturing process of the vehicle-mounted lamp according to Embodiment 1.

[0018] Figure 5 (a) to (c) are cross-sectional views showing the manufacturing process of the vehicle-mounted lamp according to Embodiment 1.

[0019] Figure 6 This is a cross-sectional view showing the manufacturing process of the vehicle-mounted lamp according to Embodiment 1.

[0020] Figure 7 (a) and (b) are diagrams illustrating the interior space of a vehicle equipped with the vehicle-mounted lamp 1 of Embodiment 1, viewed from the side and top, respectively. Figure 7 (c) and (d) are diagrams illustrating the interior space of a vehicle viewed from the side and top, respectively, when the vehicle is equipped with conventional lighting.

[0021] Figure 8 (a) to (c) are cross-sectional views showing the manufacturing process of the vehicle-mounted lamp according to Embodiment 2.

[0022] Figure 9 (a) to (e) are cross-sectional views showing the manufacturing process of the vehicle-mounted lamp according to Embodiment 3.

[0023] Figure 10 (a) to (j) are cross-sectional views of a vehicle-mounted lamp according to a modified example 1 of the present invention.

[0024] Figure 11 This is a cross-sectional view of a vehicle-mounted lamp according to a modified example 2 of the present invention. Detailed Implementation

[0025] The following description uses the accompanying drawings to illustrate an embodiment of a vehicle-mounted lamp according to the present invention.

[0026] Previously, automotive lighting fixtures consisted of multiple components, requiring internal space for assembly. However, inventors have provided automotive lighting fixtures that reduce the number of components by eliminating internal space.

[0027] To eliminate internal space, resin-based integral molding, such as insert molding, is effective. However, the resin heating temperature required for insert molding is usually higher than the melting point of solders such as low-melting-point solder, eutectic solder, and lead-free solder. Therefore, during insert molding, the solder may remelt due to the heat of the molten resin, causing the light-emitting element mounted on the substrate to fall off.

[0028] Therefore, the inventors used metal microparticles as the bonding material for the light-emitting element, enabling insert molding by utilizing the lower melting point of the metal microparticles. Thus, during bonding, the lower melting point of the metal microparticles is utilized; by taking advantage of the low melting point of the metal microparticles, they are melted and bulked at a low temperature to achieve bonding. During insert molding, the melting point of the bulked bonding material becomes a high melting point, so even with the heat of the molten resin, the bonding material will not melt again. This allows for insert molding.

[0029] <<Implementation Method 1>>

[0030] The vehicle-mounted lamp 1 of Embodiment 1 will be described using the accompanying drawings. Figure 1 (a) is a perspective view of the vehicle-mounted lamp 1 according to this embodiment. Figure 1 (b) is its sectional view. Figure 2 (a) is a schematic diagram showing the cross-sectional structure of the vehicle-mounted lamp 1. Figure 2 (b) is to Figure 1 A further enlarged version of part (a). Figure 3 This is a diagram showing an example of a portion of the wiring pattern on a substrate.

[0031] like Figure 1 (a), (b) and Figure 2 As shown in (a) and (b), the vehicle-mounted lamp 1 of Embodiment 1 includes a substrate 10 and a wiring pattern 11 mounted on the substrate 10. A light-emitting element 12 is disposed on the wiring pattern 11. A sealing resin layer 50 is disposed on the light-emitting element 12, covering the light-emitting element 12 and at least a portion of the wiring pattern 11 and the upper surface of the substrate 10. An outer lens layer 20 is disposed on the sealing resin layer 50.

[0032] The wiring pattern 11 is bonded to the electrodes of the light-emitting element 12 by a bonding material 13. The bonding material 13 is a metal formed by sintering metal particles.

[0033] The outer lens layer 20 is seamlessly and integrally bonded to the upper surface of the substrate 10, the light-emitting element 12, and the wiring pattern 11. Specifically, in the outer lens layer 20, the portion with the sealing resin layer 50 is in close contact with the sealing resin layer 50, while the portion without the sealing resin layer 50 is directly and integrally bonded to the upper surface of the substrate 10, the light-emitting element 12, and the wiring pattern 11.

[0034] Such an outer lens layer 20 is formed by insert molding using a pre-prepared mold that has the desired upper surface shape of the outer lens layer. That is, the outer lens layer 20 is formed by placing a substrate 10 on which the light-emitting element 12 is mounted inside the mold, filling the mold with resin and curing it.

[0035] Thus, in this embodiment, a material formed by sintering metal particles is used as the bonding material, so sintering can be performed at a relatively low temperature during bonding, such as by photo-sintering. Furthermore, by sintering, the material is bulked, so its melting point becomes higher than that of solder. Therefore, even if the resin molten by heating during insert molding or the like flows into the mold, the bonding material 13 will not melt again, and an outer lens layer 20 integrated with the light-emitting element 12 and the substrate 10 can be formed.

[0036] Therefore, according to this embodiment, a compact vehicle-mounted lamp 1 with no internal space can be provided. Furthermore, it can be molded using a die, thus allowing the outer lens layer 20 to have a complex curved shape.

[0037] Figure 1 The vehicle-mounted lamp has a curved shape (convex shape) in both the front-rear and vertical directions. Furthermore, in this context, the front-rear direction refers to the direction consistent with the front-rear direction of the vehicle when installed in a vehicle. The substrate 10 is curved in both the front-rear and vertical directions while in close contact with the outer lens layer 20. That is, the substrate 10 is curved in a shape that curves along the front-rear and vertical directions of the outer lens layer 20.

[0038] In addition, Figure 2 In (a) and (b), the area around the light-emitting element 12 is sealed with a sealing resin layer 50, but the sealing resin layer 50 may not be provided. In this case, the outer lens layer 20 is directly attached to the light-emitting element 12, the wiring pattern 11, and the upper surface of the substrate 10.

[0039] The light-emitting element 12 has a semiconductor layer including a light-emitting layer and electrodes. It can be an LED die without a package, an LED package formed by mounting an LED die on a sub-mounting substrate with sub-mounting electrodes and filling the surrounding area with sealing resin, phosphor layer, reflective resin layer, etc. as needed, an element with light-receiving function, or a semiconductor laser element.

[0040] Furthermore, when the light-emitting element 12 is an LED package formed by mounting an LED die on a sub-mounting substrate with sub-mounting electrodes and filling the surrounding area with sealing resin, phosphor layer, reflective resin layer, etc. as needed, a metal formed by sintering metal particles is used as the die bonding material for bonding the sub-mounting electrodes to the LED die electrodes, and solder is not used. This prevents the LED die from detaching from the sub-mounting substrate during the molding of the outer lens layer 20.

[0041] like Figure 3 As shown, in addition to mounting the light-emitting element 12, electronic circuit elements 14 and 15 can also be mounted on the wiring pattern 11. For example, electronic circuit elements 14 and 15 are respectively the IC (integrated circuit) chip and chip resistor that drive the light-emitting element 12. The outer lens layer 20 is seamlessly attached to the electronic circuit elements 14 and 15 and integrated with them.

[0042] As the bonding material for joining the electrodes of electronic circuit elements 14 and 15 to the wiring pattern 11, a metal formed by sintering metal particles is used.

[0043] Bonding can be performed by oven heating such as reflow soldering, or by direct heating using heating tools. If the substrate 10 is translucent, bonding can also be performed by heating using light such as flash or laser. When bonding is performed using light, during the manufacturing process, light can be irradiated from the back side of the substrate 10 toward the bonding material 13, and the wiring pattern 11 and the bonding material 13 can be heated by the light to sinter the bonding material 13.

[0044] like Figure 1 (a), (b) Figure 2 As shown in (a) and (b), a housing 30 having a shape following the substrate is attached to the lower surface of the substrate 10.

[0045] The housing 30 is curved in a convex shape along the front-back and vertical directions of the substrate 10 and the outer lens layer 20, and is in close contact with the substrate 10 and the outer lens layer 20. The back surface of the housing 30 is also curved along the front-back and vertical directions of the outer lens layer 20.

[0046] Therefore, by forming the vehicle lamp 1 mounted at the front of the vehicle into a curved shape that protrudes forward, a space surrounded by the curved shape of the vehicle lamp 1 can be created on the back (rear side) of the vehicle lamp 1 mounted at the front of the vehicle. Similarly, by forming the vehicle lamp 1 mounted at the rear of the vehicle into a curved shape that protrudes rearward, a space surrounded by the curved shape of the vehicle lamp 1 can be created on the back (front side) of the vehicle lamp 1 mounted at the rear of the vehicle.

[0047] Alternatively, a decorative film 40, such as a reflector, that reflects light generated from the light-emitting element 12 can be inserted between the substrate 10 and the housing 30. In this case, the upper surface of the decorative film 40 is in close contact with the lower surface of the substrate 10, and the lower surface of the decorative film 40 is in close contact with the upper surface of the housing 30. The decorative film 40 also has a shape that bulges along the outer lens layer 20 in both the front-back and vertical directions.

[0048] <Material>

[0049] As the substrate 10, resin materials such as high heat-resistant PET (polyethylene terephthalate), PI (polyimide), and glass epoxy resin, as well as metal substrates such as aluminum substrates, can be used. Flexible materials are preferred. Preferably, the substrate 10 is selected from materials whose melting point and softening point are higher than the molding temperature (150–320°C) of the outer lens layer 20, and which do not deform or deteriorate during molding.

[0050] As an example, the thickness of substrate 10 is 25 μm to 2 mm.

[0051] (Wiring pattern 11)

[0052] As the wiring pattern 11, a wiring pattern in which a metal foil such as copper foil is bonded to the substrate 10 and processed into the shape of the wiring pattern 11 can be used. Alternatively, a metal film can be formed on the substrate 10 by sputtering or the like, and then etched to form the shape of the wiring pattern 11. Furthermore, after coating the substrate 10 with conductive ink or the like to form the shape of the wiring pattern 11, it can be heated and sintered.

[0053] The thickness of wiring pattern 11 is, for example, about 12μm to 35μm.

[0054] When conductive ink is formed on a substrate, methods such as gravure printing and screen printing can be used.

[0055] Alternatively, similar to bonding material 13, a material formed by dispersing metal particles in a solvent can be used as conductive ink to simultaneously form bonding material 13 and wiring pattern 11.

[0056] (Adhesive)

[0057] When the wiring pattern 11 is made of metal foil, the metal foil is fixed to the substrate 10 using an adhesive.

[0058] As an adhesive, ester-based polyurethane, acrylic-based, epoxy-based, silicone-based, etc., can be used.

[0059] As an example, the thickness of the adhesive is 5μm to 100μm.

[0060] As a method for bonding the substrate 10 to the wiring pattern 11 using an adhesive, bonding can be performed using methods such as dry lamination.

[0061] In addition to adhesives, adhesive sheets can also be used. In this case, bonding can be achieved through heat pressing, lamination, etc.

[0062] (Joint material 13)

[0063] The bonding material 13 is formed by sintering an ink or paste in which conductive metal nanoparticles are dispersed.

[0064] The preferred composition of conductive inks or pastes is 20wt% to 95wt% conductive particles, 5wt% to 70wt% solvent, and 0.01wt% to 10wt% organic dispersant.

[0065] As materials constituting conductive particles, one or more of conductive metals and conductive metal oxides such as Au, Ag, Cu, Pd, ITO, Ni, Pt, and Fe can be used.

[0066] The maximum particle size distribution of conductive particles is preferably above 1 nm and below 10 μm.

[0067] As a solvent, ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, etc., or propylene glycol, butanediol, phenylene glycol, etc., triols such as glycerol, diethyl ether, diphenyl ether, etc., can be used.

[0068] In addition to heating with an oven, sintering methods can also be achieved by irradiating the material with electromagnetic waves such as light. Specifically, laser or flash heating can be used, for example.

[0069] For example, as an installation method, conductive ink or paste is formed on the wiring pattern 11 or pads of the substrate 10 by means of dispensing or screen printing, and light-emitting elements 12 and electronic circuit elements 14 and 15 are set. The conductive ink or paste is heated to a temperature of 200 to 400°C to melt the conductive particles and sinter them.

[0070] When placing the light-emitting element 12, electronic circuit elements 14, and 15 on the conductive ink or paste of the wiring pattern 11 or pad, clamps such as collets can be used for fixing and applying loads, or loads can be applied while heating.

[0071] (Sealing resin layer 50)

[0072] The sealing resin layer 50 is made of a resin that is transparent to the light emitted by the light-emitting element 12. For example, epoxy resin, polyurethane-based resin, silicone resin, or a modified resin composed of these can be used.

[0073] (Outer lens layer 20)

[0074] Examples of resins used to mold the outer lens layer 20 include PMMA (polymethyl methacrylate), ABS (acrylonitrile-butadiene-styrene copolymer resin), PP (polypropylene), PC (polycarbonate), PBT (polybutylene terephthalate), and PES (polyethersulfone).

[0075] (Decorative film 40)

[0076] As a decorative film 40, it uses a reflective layer that functions as a reflector and an appearance design layer that has a display function such as light diffusion and light blocking effects, such as a translucent wood grain pattern or a metallic pattern.

[0077] <Manufacturing Method>

[0078] use Figure 4 , Figure 5 An example of the manufacturing method of this embodiment will be described.

[0079] ( Figure 4 (a) process)

[0080] First, a polyimide film with a thickness of 25 μm to 50 μm is prepared as a substrate 10. A copper foil with a thickness of 12 μm to 35 μm constituting the wiring pattern 11 is bonded to the adhesive layer 16 described above.

[0081] ( Figure 4 (b) process)

[0082] The copper foil is patterned into the desired wiring pattern 11 shape by subtractive etching.

[0083] ( Figure 4 (c) process)

[0084] A surface treatment layer 11a is formed on the surface of the copper foil. For example, a Ni layer and an Au layer are formed sequentially by electroless Ni plating and electroless gold plating as the surface treatment layer 11a.

[0085] As an example, the thickness of the Ni layer is 1–5 μm, and the thickness of the Au layer is about 0.03 μm.

[0086] In addition to plating, water-soluble pre-soldering flux can also be used.

[0087] ( Figure 4 (d) process)

[0088] Prepare the above-mentioned conductive ink and apply it to the areas of wiring pattern 11 where the electrodes of light-emitting element 12 and electronic circuit elements 14 and 15 are to be mounted, to form a coating film 13a.

[0089] ( Figure 4 (e) process)

[0090] The apparatus is used to mount the light-emitting element 12 and electronic circuit elements 14 and 15 onto a conductive ink coating film 13a. As needed, a laser is irradiated from the back side of the substrate 10 while applying a load to the light-emitting element 12 and electronic circuit elements 14 and 15. This heats the wiring pattern 11, and through heat transfer, the conductive particles of the conductive ink coating film 13a melt and sinter. A bonding material 13 is formed to bond the light-emitting element 12 and the others to the wiring pattern 11.

[0091] ( Figure 4 (f) process)

[0092] Resin such as silicone resin is filled around the light-emitting element 12 on the substrate 10 by means of dispensing coating or molding, and then heated to cure it to form a sealing resin layer 50.

[0093] The curing temperature of the resin depends on the resin used, and for example, it is around 150°C.

[0094] Depending on the light-emitting element 12, the sealing resin layer 50 may not need to be formed.

[0095] The sealing resin layer 50 can be formed on the entire upper surface of the substrate 10, or it can be formed partially.

[0096] ( Figure 4 (g) process)

[0097] The pre-prepared decorative film 40 is bonded to the back side of the substrate 10 using an adhesive layer. For example, a reflector can be used as the decorative film 40. The adhesive used to form the adhesive layer can be... Figure 4 The adhesive used in process (a) for bonding the copper foil to the substrate 10.

[0098] Alternatively, the decorative film 40 can be formed on the lower surface of the substrate by printing.

[0099] ( Figure 5 (a) process)

[0100] In Figure 4 The laminate manufactured in processes (a) to (g) is placed inside molds 101a and 101b. The laminate is formed by mounting a light-emitting element 12 on a substrate 10 and placing a decorative film 40 on the back side.

[0101] At this point, three-dimensional molding can also be performed to obtain the desired shape.

[0102] ( Figure 5 (b) process)

[0103] To form the outer lens layer 20, the PC (polycarbonate) resin is preheated to approximately 260–320°C. The molds 101a and 101b are preheated to approximately 70–110°C.

[0104] After the heated and fluidized PC resin is injected into the molds 101a and 101b and cured, the desired shape of the outer lens layer 20 is formed into a single unit by insert molding, which tightly adheres to the substrate 10, the light-emitting element 12, the wiring pattern 11, etc.

[0105] ( Figure 5 (c) process)

[0106] Remove the integral molded part from molds 101a and 101b and cut off the nozzle mark 102 of the outer lens layer 20.

[0107] ( Figure 6 (process)

[0108] The housing 30 is bonded to the above-mentioned adhesive. Figure 5 The back side of the substrate 10 of the molded article obtained in process (c) after the substrate 10 and the outer lens layer 20 are integrally formed.

[0109] Alternatively, the substrate 10 and the housing 30 can be fixed without adhesives, but through snap-fit ​​or other interlocking structures, or formed by two-color molding or the like.

[0110] Therefore, it is possible to manufacture the vehicle-mounted lamp 1 according to embodiment 1.

[0111] In the vehicle-mounted lamp 1 of this embodiment manufactured in the manner described above, in order to form the bonding material 13, a conductive ink formed by dispersing conductive nanoparticles in a solvent is used. Figure 4 (d)). Thus, by utilizing the decreasing melting point characteristic of nanoparticles, conductive nanoparticles can be sintered at a lower melting point than typical bulk materials. Figure 4 (e)).

[0112] Furthermore, the sintered conductive nanoparticles possess near-bulk properties, thus preventing a decrease in melting point. Even at the high temperatures used to mold the outer lens layer 20, the conductive nanoparticles will not remelt, and the mounting components (light-emitting elements 12, etc.) will not detach. Figure 5 (b)

[0113] Furthermore, the bonding material 13, which is a sintered body of conductive particles, has the aforementioned bulk characteristics, and therefore its thermal / electrical properties are superior to those of resin-cured materials such as silver paste.

[0114] The vehicle-mounted lamp 1 of Embodiment 1 has no internal space and is therefore thin. In addition, it does not require threaded fastening, etc., which reduces the number of parts compared to the past, thus achieving weight reduction and simplification.

[0115] Figure 7 (a) and (b) are diagrams illustrating the interior space of a vehicle equipped with the vehicle-mounted lamp 1 of Embodiment 1, viewed from the side and top, respectively. Figure 7 Figures (c) and (d) illustrate the interior space as viewed from the side and top of a vehicle equipped with conventional lighting fixtures. Figure 7 As shown in (a) and (b), the vehicle-mounted lamp 1 of Embodiment 1 and Figure 7 Compared to conventional lamps (c) and (d), these lamps require less installation space when mounted in a vehicle. Therefore, they can effectively utilize the interior space.

[0116] Specifically, regarding the vehicle-mounted lamp 1 of Embodiment 1, the back surface of the vehicle-mounted lamp 1 itself is shaped by bending along the front-rear direction and the vertical direction of the outer lens layer 20. Therefore, on the back surface (rear side) of the vehicle-mounted lamp 1 installed at the front of the vehicle, as shown... Figure 7 (b) creates a space 71 surrounded by the curved shape of the vehicle-mounted lamp 1. A space 72 surrounded by the curved shape of the vehicle-mounted lamp 1 is created on the back (front) side of the vehicle-mounted lamp 1 installed at the rear of the vehicle. Spaces 71 and 72 are in vehicles where conventional lamps are installed. Figure 7 The space not present in (d)). Therefore, by mounting the vehicle-mounted lamp 1 of embodiment 1, such as Figure 7 As shown in (c), a portion of the vehicle's engine compartment or trunk can be positioned within the spaces 71, 72 behind the vehicle-mounted lamp 1 of Embodiment 1. In contrast, according to... Figure 7 As can be seen from (d), vehicles equipped with conventional lamps require a space corresponding to the thickness of the lamp in the longitudinal direction in order to accommodate the lamp, resulting in a smaller engine compartment or trunk. Therefore, the vehicle lamp 1 of Embodiment 1 can effectively utilize the vehicle interior space compared to conventional lamps.

[0117] Furthermore, regarding the vehicle-mounted lamp 1 of Embodiment 1, by pre-molding the molds 101a and 101b into the desired shape, it is possible to easily mold complex three-dimensional shapes. Therefore, a complex assembly structure is not required, and it is relatively easy to manufacture such lamps at low cost. Figure 1The vehicle-mounted lamps have a curved shape as shown in (a) and (b). Therefore, it is possible to manufacture vehicle-mounted lamps with a highly customizable curved surface that are compatible with the vehicle's design in a compact and cost-effective manner.

[0118] <Implementation Method 2>

[0119] As embodiment 2, a method for manufacturing a vehicle-mounted lamp without the decorative film 40 will be described.

[0120] Regarding the vehicle-mounted lighting fixture of Embodiment 2, Embodiment 1 is described. Figure 4 In processes (a) to (f), a wiring pattern 11 is formed on the substrate 10 and the light-emitting element 12 is bonded, without performing... Figure 4 The process of (g). Therefore, no decorative film 40 is provided. Used in Figure 4 The substrate 10 obtained in process (f) after the light-emitting element 12 has been bonded is then subjected to... Figure 8 The processes (a) to (c).

[0121] Figure 8 (a) to (c) are the same as those in Implementation Method 1. Figure 5 (a) through (c) are the same, but no pass is set. Figure 4 The decorative film 40 obtained by process (g) is obtained by placing the substrate 10 and the light-emitting element 12, etc., into molds 101a and 101b and filling them with resin. As a result, the outer lens layer 20 of the desired shape is integrally formed with the substrate 10, the light-emitting element 12, the wiring pattern 11, etc. by insert molding.

[0122] After that, with Figure 6 Similarly, the housing 30 is tightly attached to and bonded to the lower surface of the substrate 10 without any gaps.

[0123] Other structures, functions, and effects are the same as in Implementation Method 1, therefore descriptions are omitted.

[0124] <Implementation Method 3>

[0125] As an implementation method 3, using Figure 9 Sections (a) to (d) describe the manufacturing method of three-dimensional vehicle-mounted lamps.

[0126] ( Figure 9 (a) process)

[0127] like Figure 9 As shown in (a), molds 101a and 101b are pre-formed into desired three-dimensional shapes. The implementation of Embodiment 1... Figure 4 Laminated bodies manufactured by processes (a) to (g) or by Figure 4The laminates manufactured by processes (a) to (f) are placed inside molds 101a and 101b. Through Figure 4 The laminate manufactured by processes (a) to (g) is a laminate formed by stacking the light-emitting element 12 on the substrate 10 and bonding a decorative film to the lower surface of the substrate 10. Figure 4 The laminate manufactured by processes (a) to (g) is a laminate in which the light-emitting element 12 is laminated on the substrate 10 and no decorative film is provided.

[0128] ( Figure 9 (b) process)

[0129] like Figure 9 As shown in (b), the substrate 10 is inserted into the mold, softened by heating, and the laminate is deformed into the desired three-dimensional shape through vacuum forming, air forming, stamping, etc. The process can also be divided into two steps; in addition to heating, vacuum forming can also be used to form complex shapes. In this case, molds suitable for each step are used. In the case of a single step, Figure 9 (b) and Figure 9 The upper mold of (c) is the same mold.

[0130] ( Figure 9 (c) process)

[0131] and Figure 5 Similarly, in step (b), the molds 101a and 101b are heated, and the heated and fluid PC resin is injected into the molds 101a and 101b and cured. Thus, through insert molding, the desired three-dimensional shape of the outer lens layer 20 is integrally formed with the substrate 10, the light-emitting element 12, the wiring pattern 11, etc.

[0132] ( Figure 9 (d) and (e) of the process)

[0133] Remove the integrally molded part from molds 101a and 101b and remove nozzle marks 102. If there are unwanted parts on the periphery of the substrate 10, cut them off.

[0134] After that, with Figure 6 Similarly, the process involves seamlessly attaching and bonding the separately formed three-dimensional shell 30 to the lower surface of the three-dimensional substrate 10.

[0135] Thus, according to embodiment 3, while deforming the substrate 10 into a three-dimensional shape, the outer lens layer 20, which is in close contact with it, can be integrally formed, thereby making it easy to form a complex three-dimensional shape.

[0136] Therefore, it does not require a complex assembly structure and can be manufactured relatively easily and at low cost. Figure 1 The vehicle-mounted lamps have a curved shape as shown in (a) and (b). Therefore, it is possible to manufacture thin, lightweight, and highly design-oriented vehicle-mounted lamps with curved surfaces that match the design of the vehicle at a low cost.

[0137] <Variation Example 1>

[0138] use Figure 10 Sections (a) to (j) describe various modifications of vehicle-mounted lighting fixtures according to embodiments 1 to 3. Furthermore, in Figure 10 In (a) to (j), the wiring pattern 11, the light-emitting element 12, the sealing resin layer 50 and the housing 30 are omitted.

[0139] Figure 10 (a) is an example of forming the vehicle-mounted lamp of embodiment 2 into a flat plate (two-dimensional shape).

[0140] Figure 10 (b) is an example of forming a three-dimensional shape by stereolithography of the vehicle-mounted lamp of Embodiment 2, as described in Embodiment 3.

[0141] like Figure 10 As shown in (c), the outer lens layer 20 of the vehicle-mounted lamp can also have layers 20-1 and 20-2 of two or more resins respectively molded on different areas of the substrate 10 (two-color molding).

[0142] In addition, such as Figure 10 As shown in (d), the outer lens layer 20 of the vehicle-mounted lamp can also be configured to cover only a portion of the substrate 10.

[0143] And, as Figure 10 As shown in (e), the outer lens layer 20 of the vehicle-mounted lamp can be disposed not only on the upper surface of the substrate 10, but also on the lower surface side.

[0144] like Figure 10 As shown in (h), the outer lens layer 20 of the vehicle-mounted lamp can also have layers 20-3 and 20-4 of two or more different materials respectively formed on different areas of the substrate 10 (two-color molding).

[0145] also, Figure 10 Figures (c) to (e) and (h) illustrate examples of vehicle-mounted lamps according to Embodiment 2, but they can also be applied to vehicle-mounted lamps according to Embodiment 1.

[0146] Figure 10 (f) is an example in which a vehicle lamp with a decorative film 40 provided on the lower surface of the substrate 10 of Embodiment 1 is formed into a flat plate (two-dimensional shape).

[0147] like Figure 10 As shown in (g), the decorative film 40 may also be disposed only in a portion of the substrate 10.

[0148] In addition, such as Figure 10 As shown in (i), the decorative film 40 can also be disposed on the upper surface side of the substrate 10. For example, the decorative film 40 can also be disposed between the sealing resin layer 50 and the outer lens layer 20, and the sealing resin layer 50 can also serve as the decorative film 40.

[0149] And, as Figure 10 As shown in (j), the decorative film 40 can also be disposed on both sides of the substrate 10.

[0150] Furthermore, as a decorative film 40, when it is applied to the upper surface of the substrate 10, a layer of black semi-transparent resin or the like is used, for example.

[0151] The above can also be used as a basis for further discussion. Figure 10 Vehicle-mounted lighting fixtures of (c) to (j) such as Figure 10 It is shaped into a three-dimensional shape as in (b).

[0152] Alternatively, you can also Figure 10 The modified examples of the outer lens layer 20 of (c) to (e) and (h) are similar to Figure 10 The decorative film variations of (f), (g), (i) and (j) are combined.

[0153] <Variation Example 2>

[0154] Figure 11 These are other variations of automotive lighting fixtures that do not use insert molding.

[0155] Figure 11 The vehicle-mounted lamp has an outer lens layer 22 at the front and a housing 32 formed at the back. In this modified example, there are two substrates 17 on which light-emitting elements 12 are arranged, and the two are mounted overlapping each other. At least the substrate 17 disposed at the front is a light-transmitting substrate, allowing light from the light-emitting elements 12 arranged on the substrate 17 mounted at the back to pass through. In addition, both substrates 17 are flexible substrates.

[0156] In this modified example, the outer lens layer 22 and the housing 32 are formed separately. The outer lens layer 22 and the housing 32 are fixed in a manner that sandwiches the two substrates 17 in the middle. They are fixed using screws or the like (not shown).

[0157] In this modified example, a space is created between the outer lens layer 22 and the substrate 17 and housing 32. However, since the substrate 17 and housing 32 are also curved along the curved shape provided in the front-back direction and the vertical direction of the outer lens layer 22, the resulting internal space becomes extremely thin. Therefore, using Figure 7 The effective use of interior space, as illustrated in (a) and (b), also occurs in this variation.

[0158] <Application Examples>

[0159] The vehicle-mounted lighting fixtures described above are suitable for use as units in which electronic components and molded parts, such as headlights, taillights, high-mounted brake lights, DR-L, and lidar, are integrated into a single assembly.

[0160] In addition to automotive lighting, it is also suitable for flat or three-dimensional lighting devices for home appliances, information equipment, medical equipment, etc., as well as automotive interior lights and air conditioning panels.

[0161] Label Explanation

[0162] 1…Automotive lighting fixture; 10…Substrate; 11…Wiring pattern; 11a…Surface treatment layer; 12…Light-emitting element; 13…Bonding material; 13a…Coating film; 14, 15…Electronic circuit components; 16…Adhesive layer; 20, 20-1, 20-2, 20-3, 20-4…Outer lens layer; 30…Housing; 40…Decorative film; 50…Sealing resin layer; 101a, 101b…Mold; 102…Nozzle marks.

Claims

1. A vehicle-mounted lamp, characterized in that, have: substrate; Wiring patterns are mounted on the substrate; A light-emitting element disposed on the wiring pattern; A resin-made outer lens layer is mounted on the light-emitting element; as well as The housing is in close contact with the substrate and the outer lens layer. The substrate has a curved shape along the front-back direction of the outer lens layer. The vehicle-mounted lighting fixture has a three-dimensional structure. in, The outer lens layer and the housing have a three-dimensional shape that is curved along the front-back direction and the up-down direction. The outer lens layer is formed by molding an insert into which the substrate carrying the light-emitting element is placed in a mold and filled with resin, so that it has no internal space. The outer lens layer is seamlessly and integrally bonded to the upper surface of the substrate, the light-emitting element, and the wiring pattern. The substrate is flexible, and the housing is attached to the lower surface of the substrate.

2. The vehicle-mounted lighting fixture according to claim 1, characterized in that, The wiring pattern is bonded to the electrodes of the light-emitting element by a bonding material, which is a metal formed by sintering metal particles.

3. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, The light-emitting element, the wiring pattern, and at least a portion of the substrate are covered by a sealing resin layer. The portion of the sealing resin layer disposed between the outer lens layer and the substrate is integrated with the upper surface of the substrate, the light-emitting element, and the wiring pattern through the sealing resin layer without gaps.

4. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, The light-emitting element is an LED die.

5. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, The light-emitting element includes: A sub-mount substrate with sub-mount electrodes is formed; LED bare chips mounted on the sub-mount substrate; and A die bonding material for joining the sub-mount electrode and the electrode of the LED die. The bonding material used for the bare die is a metal formed by sintering metal particles.

6. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, Electronic circuit components are also mounted on the wiring pattern. Metal formed from sintered metal particles is used as a bonding material to bond the electrodes of the electronic circuit element to the wiring pattern. The outer lens layer is seamlessly integrated with the electronic circuit elements.

7. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, The substrate is transparent.

8. The vehicle-mounted lighting fixture according to claim 1 or 2, characterized in that, A decorative film is inserted between the substrate and the housing, with the upper surface of the decorative film in close contact with the lower surface of the substrate and the lower surface of the decorative film in close contact with the upper surface of the housing.

9. A method for manufacturing a vehicle-mounted lamp as described in claim 1, characterized in that, The process includes the following steps: A bonding material containing metal particles is coated onto a wiring pattern on a substrate, and a light-emitting element is mounted on the bonding material. The bonding material is heated to sinter the metal particles, thereby bonding the wiring pattern to the electrodes of the light-emitting element; as well as The substrate is placed in a mold of a specified shape, resin is filled into the mold and cured, thereby forming an outer lens layer that is seamlessly and integrally attached to the upper surface of the substrate, the light-emitting element and the wiring pattern.

10. The method for manufacturing a vehicle-mounted lamp according to claim 9, characterized in that, The bonding process involves sintering the metal particles by allowing light to pass through the substrate and irradiate the bonding material.

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