An assembly device for a microfluidic chip

Abstract

The application discloses an assembling device of a micro-fluidic chip, which is used for bonding a glass cover plate and a chip bottom plate of the micro-fluidic chip, wherein the assembling device of the micro-fluidic chip comprises a base, a limiting structure, the limiting structure is detachably arranged on the base and comprises a light-guiding bearing block, and the limiting structure is used for bearing and limiting the glass cover plate; a position adjusting structure, the position adjusting structure is detachably arranged above the limiting structure and comprises a clearance; the chip bottom plate is partially located in the clearance and is driven by the position adjusting structure to adjust the relative position with the glass cover plate; and a pressing structure, the pressing structure is arranged above the position adjusting structure and is used for pressing the position adjusting structure to cover the chip bottom plate on the glass cover plate. The problems that the micro-fluidic chip is not easy to align and the production efficiency is slow in the prior art are solved.

Description

Technical Field

[0001] This invention relates to the field of microfluidic chip fabrication equipment, and more particularly to a microfluidic chip assembly apparatus. Background Technology

[0002] Microfluidics is a technology for precisely controlling and manipulating fluids at the microscale. It integrates basic operational units such as sample preparation, reaction, separation, and detection in biochemical analysis processes onto a single micrometer-scale chip, automating the entire analytical process. Microfluidics offers advantages such as low sample consumption, high detection speed, ease of operation, multifunctional integration, small size, and portability, making it a promising technology for applications in biology, chemistry, and medicine.

[0003] Microfluidic chips are formed by bonding a glass cover plate and a chip substrate (aluminum substrate) together, creating multiple liquid reservoirs between them. However, in the current microfluidic chip manufacturing process, the chip substrate is fixed in place, and then the glass cover plate is manually placed on top of it before UV curing. This manual process is difficult to align properly, requires highly skilled workers, and is slow, making existing microfluidic chips inconvenient.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a microfluidic chip assembly device, which solves the problems of difficulty in alignment and slow production efficiency when manually manufacturing microfluidic chips in the prior art.

[0006] The technical solution of the present invention is as follows:

[0007] An assembly apparatus for microfluidic chips, used to bond a glass cover plate and a chip substrate of a microfluidic chip, wherein the assembly apparatus for microfluidic chips includes: a base,

[0008] The limiting structure is detachably mounted on the base and includes a light guide support block. The limiting structure is used to support and limit the glass cover plate.

[0009] The positioning structure is detachably mounted above the limiting structure and includes a clearance zone. The chip base plate is located within the clearance zone and its relative position to the glass cover is adjusted by the driving mechanism of the positioning structure.

[0010] The pressure structure is positioned above the adjustment structure and is used to press down the adjustment structure so that the chip substrate is covered by the glass cover.

[0011] Furthermore, a through-hole is provided on the base, a light guide block is installed inside the through-hole, and a light guide support block is installed on the light guide block.

[0012] Furthermore, the limiting structure includes:

[0013] A limiting base plate has a vertically penetrating limiting cavity, and the light guide carrier block is located in the limiting cavity;

[0014] The first fixed boss and the second fixed boss are respectively disposed on the adjacent two side walls of the limiting inner cavity.

[0015] The first movable boss assembly is located on the opposite surface of the first fixed boss on the limiting inner cavity, and is movably disposed close to or away from the first fixed boss.

[0016] The second movable boss assembly is located on the opposite surface of the second fixed boss on the limiting cavity, and is movably disposed close to or away from the second fixed boss.

[0017] Furthermore, the first movable boss assembly is connected to a first adjustment assembly;

[0018] The first adjustment component includes: a push block, which is movably disposed in the limiting base plate along the width direction and connected to the first movable boss component; the push block is provided with a T-shaped groove.

[0019] The first adjusting screw has one end located in the T-groove and rotatably connected to the push block, and the other end screwed to the limiting base plate and extending out of the side of the limiting base plate in the width direction.

[0020] Furthermore, the second movable boss assembly is connected to a second adjustment assembly;

[0021] The second adjustment component includes: a reversing part, which is disposed at one end of the second movable boss assembly away from the limiting cavity. The reversing part moves directionally in the width direction within the limiting base plate and pushes the second movable boss assembly in the length direction.

[0022] The second adjusting screw has one end movably connected to the reversing part, and the other end screwed to the limiting base plate and extending out of the side of the limiting base plate in the width direction.

[0023] Furthermore, the adjustment structure includes: an adjustment base plate, which is set in a horizontal direction;

[0024] The XY adjustment table is connected to the adjustment base plate and is used to drive the adjustment base plate to move along the length or width direction.

[0025] The carrier plate has an air-avoidance zone on it. The carrier plate has a carrier surface, and the chip base plate is partially located on the carrier surface and partially located within the air-avoidance zone.

[0026] An elastic support assembly is installed between the load-bearing plate and the adjusting base plate;

[0027] The bearing surface of the bearing plate is compressed by the elastic support component and descends below the surface of the glass cover, or rises above the surface of the glass cover by the rebound of the elastic support component.

[0028] Furthermore, the adjusting base plate has threaded holes, and the elastic support assembly includes:

[0029] Support screws penetrate the support plate and are connected in threaded holes;

[0030] The elastic element is connected at one end to the adjusting base plate and at the other end to the bearing plate.

[0031] Furthermore, a limiting groove is provided on the carrier plate. The limiting groove is located at both edges of the clearance area along the length direction. The chip base plate is located in the limiting groove, and the bottom surface of the limiting groove is the carrier surface. A hook hole is provided at one end of the chip base plate along the length direction, and a limiting component matching the hook hole is provided in the limiting groove.

[0032] Furthermore, the pressurization structure includes a support frame, which is mounted above the adjustment structure;

[0033] The power unit is mounted on the bracket.

[0034] The drive component is connected to the power component and rotates under the drive of the power component;

[0035] The lifting rope has one end connected to the drive assembly.

[0036] The lower pressure plate is connected to the end of the lifting rope that faces the microfluidic chip.

[0037] Multiple counterweights are arranged between the drive assembly and the lower pressure plate and are connected to the hoisting rope at intervals.

[0038] Furthermore, the drive assembly includes: a drive shaft, which is rotatably connected to the bracket and rotates by the drive of the power assembly;

[0039] The winding reel is mounted on the drive shaft, and one end of the lifting rope is fixedly connected to the winding reel.

[0040] There are two winding reels, which are spaced apart along the length direction.

[0041] There are two lifting ropes, which are connected to two winding reels respectively.

[0042] The beneficial effects of this solution: The microfluidic chip assembly device proposed in this invention uses a base for support. A light guide block is set on a limiting structure. The glass cover plate of the microfluidic chip is placed on the light guide block, and the limiting structure limits the glass cover plate, preventing it from moving. An adjusting structure is set above the limiting structure. The chip substrate is then placed on the adjusting structure, with the part of the chip substrate that needs to connect with the glass cover plate located in the clearance area, thus positioning the chip substrate above the glass cover plate. The adjusting structure adjusts the relative position of the chip substrate and the glass cover plate, ensuring that the chip substrate faces the glass cover plate directly. A pressure structure applies pressure to the adjusting structure, pressing it down to cover the glass cover plate with the chip substrate. The light is then guided by a light-guiding block, allowing UV light to penetrate the glass cover plate. This cures the adhesive between the glass cover plate and the chip substrate, connecting them to form a microfluidic chip. After the microfluidic chip is fabricated, the pressure structure is removed, and the positioning structure moves the chip substrate away from the support plate, thus removing the fabricated microfluidic chip from the limiting structure. This greatly facilitates the removal of the microfluidic chip. This assembly device achieves the assembly of microfluidic chips. Compared to manual operation, this method offers high precision, direct alignment of the glass cover plate and the chip substrate, and high production efficiency. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of an embodiment of a microfluidic chip assembly device according to the present invention;

[0044] Figure 2 This is an exploded view of the main structure of an embodiment of a microfluidic chip assembly device according to the present invention;

[0045] Figure 3 This is an exploded view of the base of an embodiment of a microfluidic chip assembly apparatus according to the present invention;

[0046] Figure 4 This is a schematic diagram of the limiting structure of an embodiment of a microfluidic chip assembly device according to the present invention;

[0047] Figure 5 This is a schematic diagram of the limiting structure from the rear view of an embodiment of a microfluidic chip assembly apparatus of the present invention.

[0048] Figure 6 This is a cross-sectional view of the limiting structure of an embodiment of a microfluidic chip assembly apparatus according to the present invention;

[0049] Figure 7 This is a cross-sectional view of another position of the limiting structure in an embodiment of a microfluidic chip assembly apparatus of the present invention;

[0050] Figure 8 This is a schematic diagram of the adjustment structure of an embodiment of a microfluidic chip assembly apparatus of the present invention;

[0051] Figure 9 This is a schematic diagram of another form of the positioning structure of an embodiment of a microfluidic chip assembly apparatus of the present invention;

[0052] Figure 10 This is a schematic diagram of the adjustment structure of an embodiment of the microfluidic chip assembly device of the present invention during use;

[0053] Figure 11 This is a cross-sectional view of the adjustment structure of an embodiment of a microfluidic chip assembly apparatus according to the present invention;

[0054] Figure 12 This is a schematic diagram of the pressurization structure of an embodiment of a microfluidic chip assembly apparatus of the present invention;

[0055] Figure 13 This is a schematic diagram of the pressurization structure from another perspective, representing an embodiment of a microfluidic chip assembly apparatus of the present invention.

[0056] The following are the labels in the diagram: 10, Glass cover plate; 20, Chip base plate; 21, Hook hole; 30, Base; 3100, Stepped bottom hole; 3110, Light guide block; 40, Limiting structure; 4100, Limiting base plate; 4110, First fixed boss; 4120, Second fixed boss; 4130, Light guide carrier block; 4140, Limiting inner cavity; 4150, First movable boss assembly; 4151, First movable stage; 4152, First slide. 4160, second movable boss assembly; 4161, second movable platform; 4162, second sliding rod; 4170, movable slot; 4180, guide slot; 4200, first adjusting assembly; 4210, push block; 4211, T-slot; 4220, first adjusting screw; 4300, second adjusting assembly; 4310, reversing part; 4311, reversing block; 4312, tilting slot; 4313, connecting bracket; 4 320. Second adjusting screw; 50. Adjustment structure; 5100. Fixed base plate; 5110. Pin hole; 5200. XY adjustment platform; 5300. Adjustment base plate; 5310. Threaded hole; 5400. Bearing plate; 5410. Clearance area; 5420. Limiting groove; 5421. Limiting component; 5500. Elastic support assembly; 5510. Support screw; 5520. Elastic component; 60. Pressurization structure; 6100. Bracket; 6110, Support foot; 6200, Power assembly; 6210, Electric motor; 6220, Drive sprocket; 6230, Driven sprocket; 6240, Chain; 6300, Drive assembly; 6310, Drive shaft; 6320, Winding reel; 6330, Bearing housing; 6400, Lifting rope; 6500, Lower pressure plate; 6510, Lower pressure boss; 6520, Limiting guide block; 6600, Counterweight block; 6610, Handle slot. Detailed Implementation

[0057] This invention provides a microfluidic chip assembly apparatus and a microfluidic chip assembly device. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0058] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0059] It should also be noted that the same or similar reference numerals in the accompanying drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0061] like Figure 2 As shown, this invention proposes an assembly apparatus for microfluidic chips, used to bond a glass cover plate 10 and a chip substrate 20 to a microfluidic chip. Specific embodiments are as follows:

[0062] like Figure 1 , Figure 2 As shown, a microfluidic chip assembly apparatus includes: a base 30, a limiting structure 40, an adjusting structure 50, and a pressurizing structure 60. The limiting structure 40 is detachably mounted on the base 30 and includes a light guide block 4130. The limiting structure 40 is used to support and limit the glass cover plate 10. The adjusting structure 50 is detachably mounted above the limiting structure 40 and includes a clearance area 5410. The chip substrate 20 is partially located within the clearance area 5410 and its relative position to the glass cover plate 10 is adjusted by the driving of the adjusting structure 50. The pressurizing structure 60 is mounted above the adjusting structure 50 and is used to press down the adjusting structure 50 so that the chip substrate 20 covers the glass cover plate 10.

[0063] This assembly device is supported by a base 30. A light guide block 4130 is installed on a limiting structure 40. The glass cover plate 10 of the microfluidic chip is placed on the light guide block 4130, and the limiting structure 40 limits the glass cover plate 10, preventing it from moving. An adjusting structure 50 is set above the limiting structure 40. The chip substrate 20 is then placed on the adjusting structure 50, with the part of the chip substrate 20 that needs to connect with the glass cover plate 10 located within the clearance area 5410, thus positioning the chip substrate 20 above the glass cover plate 10. The adjusting structure 50 adjusts the relative position of the chip substrate 20 and the glass cover plate 10, ensuring that the chip substrate 20 faces the glass cover plate 10 directly. A pressure structure 60 applies pressure to the adjusting structure 50, pressing it down to cover the glass cover plate 10 with the chip substrate 20. The light is then guided by the light guide block 4130, allowing UV light to enter the glass cover plate 10, thereby curing the adhesive between the glass cover plate 10 and the chip substrate 20, connecting the glass cover plate 10 and the chip substrate 20 to form a microfluidic chip. After the microfluidic chip is fabricated, the pressure structure 60 is removed, and the positioning structure 50 moves the chip substrate 20 away from the support plate, thus removing the fabricated microfluidic chip from the limiting structure 40, greatly facilitating its removal. This assembly device achieves the assembly of microfluidic chips. Compared with manual operation, this method has high precision, achieves direct alignment of the glass cover plate 10 and the chip substrate 20, and has high production efficiency.

[0064] like Figure 1 , Figure 3 As shown, typical microfluidic chips are rectangular. Therefore, this embodiment uses a rectangular microfluidic chip as an example for structural description. The base 30 is placed on a table and is set to a matching rectangle. A through-hole 3100 is provided on the base 30, extending vertically to facilitate UV lamp irradiation. A step is provided within the step hole 3100, and a light guide block 3110 is provided within the step hole 3100. The light guide block 3110 is embedded within the step hole 3100 and placed on the step, serving both light transmission and support functions. When the limiting structure 40 is connected to the base 30, a light guide support block 4130 is placed on the light guide block 3110. The support of the light guide block 3110 prevents the light guide support block 4130 from falling out of the light transmission hole. The base 30 provides support for the limiting structure 40.

[0065] like Figure 1 , Figure 4 , Figure 5As shown, the limiting structure specifically includes: a limiting base plate 4100, a first fixed boss 4110 and a second fixed boss 4120, a first movable boss assembly 4150, and a second movable boss assembly 4160. The limiting base plate 4100 has a rectangular outline in the horizontal plane. The structure is described using the longer side of the rectangular limiting base plate 4100 as the length direction and the shorter side as the width direction. Figure 2 and Figure 4 The structure of the limiting base plate 4100 is different from that of the other type. Figure 2 The limiting base plate 4100 has a recessed clearance area on its upper surface as required. The limiting base plate 4100 has a vertically penetrating limiting cavity 4140 with a rectangular outline. The first fixing boss 4110 and the second fixing boss 4120 are respectively provided on the adjacent side walls of the limiting cavity 4140. Specifically, the first fixing boss 4110 protrudes from the inner wall of the limiting cavity 4140 in the width direction (the inner wall is perpendicular to the width direction), and the second fixing boss 4120 protrudes from the inner wall of the limiting cavity 4140 in the length direction (the inner wall is perpendicular to the length direction). The first fixing boss 4110, the second fixing boss 4120 and the limiting base plate 4100 are integrally formed. The first movable boss assembly 4150 is located on the opposite surface of the limiting cavity 4140 relative to the first fixed boss 4110, and is movably disposed near or away from the first fixed boss 4110. Specifically, the first movable boss assembly 4150 is disposed on the inner wall at the other end in the width direction, and the second movable boss assembly 4160 is disposed on the inner wall at the other end in the length direction. The second movable boss assembly 4160 is located on the opposite surface of the limiting cavity 4140 relative to the second fixed boss 4120, and is movably disposed near or away from the second fixed boss 4120. In this way, the glass cover plate is limited at both ends in the width direction by the first fixed boss 4110 and the first movable boss assembly 4150, and the glass cover plate is limited at both ends in the length direction by the second fixed boss 4120 and the second movable boss assembly 4160, thereby clamping the glass cover plate from the four sides and fixing the glass cover plate. The light guide block 4130 is located in the limiting cavity 4140 and is used to support the glass cover plate 10. The glass cover plate 10 is placed on the light guide block 4130, which supports the glass cover plate at the bottom. When the chip substrate of the microfluidic chip is placed on the glass cover plate, the light guide block 4130 is needed to guide the light to cure the adhesive between the chip substrate and the glass cover plate, thereby realizing the installation of the chip substrate and the glass cover plate.

[0066] In the above scheme, the glass cover of the microfluidic chip is placed on the light guide support block 4130, and the two sides of the glass cover are limited by the first fixed protrusion 4110 and the second fixed protrusion 4120 set on the adjacent two side walls of the limiting cavity 4140, so that the two sides of the glass cover abut against the first fixed protrusion 4110 and the second fixed protrusion 4120; then, by adjusting the first movable protrusion assembly 4150, the first movable protrusion assembly 4150 moves toward the first fixed protrusion 4110, thereby abutting against the side of the glass cover, so that the glass cover is fixed in one direction (width direction) by the first fixed protrusion 4110 and the first movable protrusion assembly 4150. Similarly, by adjusting the second movable boss assembly 4160, it moves towards the second fixed boss 4120, thus abutting against the other side of the glass cover plate. This allows the second fixed boss 4120 and the second movable boss assembly 4160 to fix the glass cover plate in another direction (length direction). This fixes the glass cover plate onto the limiting base plate 4100, facilitating the placement of the microfluidic chip's chip substrate on the glass cover plate to form a complete microfluidic chip. By setting the first movable boss assembly 4150 and the second movable boss assembly 4160, the limiting space for fixing the glass cover plate is first opened. Then, by adjusting the positions of the first movable boss assembly 4150 and the second movable boss assembly 4160, the glass cover plate is clamped. This achieves fixed limiting while avoiding the difficulty of the glass cover plate being easily inserted into the limiting part, eliminating the need for forcibly squeezing the glass cover plate and facilitating the use of the fixture.

[0067] like Figure 4 , Figure 5 As shown, to realize the adjustment function of the first movable boss assembly 4150, the first movable boss assembly 4150 is connected to a first adjustment assembly 4200, and the first movable boss assembly 4150 is adjusted through the first adjustment assembly 4200. Figure 2 , Figure 4As shown, the first adjustment assembly 4200 includes a push block 4210 and a first adjustment screw 4220. The push block 4210 is movably disposed within the limiting base plate 4100 along the width direction and is connected to the first movable boss assembly 4150. A T-shaped groove 4211 is provided on the push block 4210. One end of the first adjustment screw 4220 is located in the T-shaped groove 4211 and is rotatably connected to the push block 4210, and the other end is screwed to the limiting base plate 4100 and extends out of the side of the limiting base plate 4100 along the width direction. Since the first adjusting screw 4220 is screwed onto the limiting base plate 4100, when the first adjusting screw 4220 is turned, one end of the first adjusting screw 4220 in the T-shaped groove 4211 rotates within the T-shaped groove 4211 but does not disengage from the T-shaped groove 4211. Thus, the turning of the first adjusting screw 4220 drives the pushing block 4210 to move back and forth in the width direction, thereby driving the first movable boss assembly 4150 to move closer to or away from the first fixed boss 4110.

[0068] A first guide hole (not shown in the figure) is provided on the limiting base plate 4100. The first guide hole is set along the width direction and connects to the limiting inner cavity 4140. The first movable boss assembly 4150 includes a first movable platform 4151 and a first sliding rod 4152 connected to the first movable platform 4151. The first sliding rod 4152 passes through the first guide hole, and one end of the first sliding rod 4152 away from the first movable platform 4151 is connected to the push block 4210. The first sliding rod 4152 cooperates with the first guide hole to guide the sliding of the first movable boss assembly 4150, so that the first sliding rod 4152 can slide stably along the width direction. Driven by the first sliding rod 4152, the end face of the first movable platform 4151 abuts against or releases from the glass cover plate.

[0069] like Figure 4 As shown, two first movable boss assemblies 4150 are provided, arranged side by side along the length direction. The first sliding rods 4152 of both first movable boss assemblies 4150 are connected to the push block 4210. Due to the long length, if only one movable boss assembly is used, it can only be placed in the middle of the length direction to achieve balanced force, but it cannot maintain the limiting support of the glass cover at both ends of the length direction. Therefore, by arranging the first movable boss assemblies 4150 side by side along the length direction, and connecting the first sliding rods 4152 of both first movable boss assemblies 4150 to the push block 4210, both first movable boss assemblies 4150 can be pushed by one push block 4210, allowing both ends of the glass cover to be abutted. Correspondingly, two first fixed bosses 4110 are also provided, thus achieving stability of the glass cover at both ends of the long side, resulting in a reasonable structure.

[0070] like Figure 5 As shown, a movable slot 4170 extending along the length direction is provided on the limiting base plate 4100, and the pushing block 4210 is located in the movable slot 4170. By setting the movable slot 4170, the pushing block 4210 has enough space to move along the width direction, which facilitates pushing the first movable boss assembly 4150.

[0071] like Figure 4 , Figure 5 As shown, in this embodiment, the second movable boss assembly 4160 is connected to the second adjustment assembly 4300. Figure 5 , Figure 6 As shown, the second adjustment assembly 4300 includes a reversing part 4310 and a second adjustment screw 4320. The reversing part 4310 is disposed at one end of the second movable boss assembly 4160 away from the limiting inner cavity 4140. The reversing part 4310 moves directionally in the width direction within the limiting base plate 4100 and pushes the second movable boss assembly 4160 in the length direction. One end of the second adjustment screw 4320 is movably connected to the reversing part 4310, and the other end is screwed to the limiting base plate 4100 and extends out of the side of the limiting base plate 4100 in the width direction. Since the second adjusting screw 4320 is screwed onto the limiting base plate 4100, when the second adjusting screw 4320 is turned, the second adjusting screw 4320 rotates within the reversing part 4310 (a T-shaped groove can also be provided on the reversing part 4310) but does not disengage from the reversing part 4310. In this way, the turning of the second adjusting screw 4320 drives the reversing part 4310 to move back and forth in the width direction. The reversing part 4310 moving in the width direction can drive the second movable boss assembly 4160 to change direction, so that the second movable boss assembly 4160 moves in the length direction and moves closer to or further away from the second fixed boss 4120.

[0072] In this embodiment, the limiting base plate 4100 has a second guide hole (not shown in the figure), which is arranged along the length direction and communicates with the limiting inner cavity 4140. The second movable boss assembly 4160 includes a second movable platform 4161 and a second sliding rod 4162 connected to the second movable platform 4161. The second sliding rod 4162 passes through the second guide hole, and one end of the second sliding rod 4162 away from the second movable platform 4161 is connected to the reversing part 4310. The second sliding rod 4162 cooperates with the second guide hole to guide the sliding of the second movable boss assembly 4160, so that the second sliding rod 4162 can slide stably along the length direction. Driven by the second sliding rod 4162, the end face of the second movable platform 4161 abuts against or releases from the glass cover plate.

[0073] like Figure 5 , Figure 7As shown, to convert the movement of the reversing part 4310 in the width direction into the movement of the second movable boss assembly 4160 in the length direction, the reversing part 4310 includes a reversing block 4311. The reversing block 4311 has an inclined groove 4312, and the second sliding rod 4162 is provided with a connecting bracket 4313. The connecting bracket 4313 is engaged within the inclined groove 4312 and slides along the length direction driven by the reversing block 4311. Specifically, the inclined groove 4312 is set at a certain angle to the width direction, for example, 45°. With the movement of the reversing block 4311, the inclined groove 4312 can move. Due to the angle of inclination, the connecting bracket 4313 can move along the inclined contour of the inclined groove 4312, thereby driving the second sliding rod 4162 to move.

[0074] like Figure 5 As shown, a guide groove 4180 extending along the width direction is provided on the limiting base plate 4100, and the reversing block 4311 is slidably disposed within the guide groove 4180. The guide groove 4180 guides the reversing block 4311, thereby enabling the reversing block 4311 to slide stably along the guide groove 4180 in the width direction. In addition, an inclined surface is provided at one end of the guide block, which facilitates the installation of the reversing block 4311 into the guide groove 4180.

[0075] like Figure 1 , Figure 8 , Figure 9As shown, the adjustment structure 50 includes: an XY adjustment platform 5200, an adjustment base plate 5300, a support plate 5400, and an elastic support assembly 5500. The adjustment base plate 5300 is arranged horizontally, and its outline on the horizontal plane is similar to a rectangle. The length direction (X direction) is defined by the longer side, and the width direction (Y direction) by the shorter side. The XY adjustment platform 5200 is connected to the adjustment base plate 5300 and is used to drive the adjustment base plate 5300 to move along the length or width direction. The XY adjustment platform 5200 is fixedly arranged, and the adjustment base plate 5300 can be connected to the moving end of the XY adjustment platform 5200 via a bracket, thus allowing the XY adjustment platform 5200 to move along the length or width direction. The elastic support assembly 5500 is disposed between the support plate 5400 and the adjustment base plate 5300, with the support plate 5400 located above the adjustment base plate 5300. An air-relief zone 5410 is formed on the support plate 5400 and is used for air-relief of the glass cover. The support plate 5400 has a support surface located at the edge of the air-relief zone 5410. Part of the chip substrate 20 is located on the support surface and is supported by the support surface; another part is located within the air-relief zone 5410 and is bonded to the glass cover. The support surface of the support plate 5400 is compressed by the elastic support assembly 5500 and descends below the surface of the glass cover, or rises above the surface of the glass cover by the rebound of the elastic support assembly 5500.

[0076] like Figure 9 , Figure 10 As shown, through the above scheme, the bearing plate 5400 is connected to the adjusting base plate 5300 by the elastic support component 5500. Figure 8 and Figure 9 The structure of the bearing plate 5400 is different. Figure 9 The carrier plate 5400 has a clearance area on its upper surface as required. The adjustment base plate 5300 is adjusted via the XY adjustment stage 5200, causing the carrier plate 5400 to move along the X or Y direction. In use, the chip substrate 20 is placed on the carrier plate 5400. Adjusting the base plate 5300 moves the chip substrate 20 to the correct position along the X or Y direction, directly above the glass cover. Pressing down on the carrier plate 5400 compresses the elastic support component 5500, thus pressing down on the chip substrate 20 and attaching it to the glass cover below, completing the assembly of the microfluidic chip. When no pressure is applied to the carrier plate 5400, the elastic support component 5500 rebounds and rises above the surface of the glass cover, facilitating the removal of the assembled microfluidic chip.

[0077] like Figure 8 , Figure 11As shown, in the specific structure of this embodiment, the adjusting base plate 5300 has a threaded hole 5310, and the elastic support assembly 5500 specifically includes a support screw 5510 and an elastic element 5520. The support screw 5510 passes through the support plate 5400 and is connected in the threaded hole 5310. One end of the elastic element 5520 is connected to the adjusting base plate 5300, and the other end is connected to the support plate 5400. The support plate 5400 can move up and down along the support screw 5510 and is pushed upward by the elastic force of the elastic element 5520. In this embodiment, the elastic element 5520 is a spring, which is sleeved in the support screw 5510.

[0078] like Figure 9 , Figure 10 As shown, in this embodiment, the adjusting base plate 5300 is L-shaped and located on the outside of the glass cover plate. Multiple elastic support components 5500 are provided and distributed on the L-shaped adjusting base plate 5300. An L-shape can be formed by cutting off one corner of a rectangular adjusting base plate 5300. The L-shape is primarily for adapting to the structure supporting the glass cover plate below, providing a large adjustment space in both the X and Y directions. Alternatively, it can be directly set as a square plate, as long as the clearance area is square, located above the glass cover plate, and has adjustment space in both the X and Y directions. Other shapes are also possible.

[0079] A limiting groove 5420 is formed on the carrier plate 5400. The limiting groove 5420 is located at both edges along the length of the clearance area 5410. The chip base plate 20 is located within the limiting groove 5420, and the bottom surface of the limiting groove 5420 is the bearing surface. The limiting groove 5420 can be set on the semi-open structure of the L-shaped carrier plate 5400 to support three sides of the chip base plate 20. Alternatively, a slot can be formed on the side wall of the limiting groove 5420 to snap one side of the chip base plate 20 into the slot, thereby limiting the chip base plate 20. If the carrier plate 5400 is set as a square plate, the clearance area 5410 can be set as a square and the area can be set to be larger, which can also allow the carrier plate 5400 to have enough space to move in the XY direction.

[0080] like Figure 8 , Figure 9 , Figure 10 As shown, in this embodiment, a hook hole 21 is provided at one end of the chip substrate 20 along its length; a limiting member 5421 that matches the hook hole is provided in the limiting groove 5420. By cooperating with the hook hole of the chip substrate 20, the chip substrate 20 can be limited within the limiting groove 5420. The limiting member 5421 is a spherical limiting member 5421.

[0081] The adjustment structure in this embodiment further includes: a fixed base plate 5100, which is fixedly connected to the XY adjustment platform 5200. The adjustment base plate 5300 moves relative to the fixed base plate 5100 via the drive of the XY adjustment platform 5200. The fixed base plate 5100 provides a support position for the XY adjustment platform 5200, thus fixing the XY adjustment platform 5200. A pin hole 5110 is provided on the fixed base plate 5100. The pin hole 5110 is used for pin engagement with other limiting structures 40 and pressure structures 60 via guide rods, which facilitates the assembly of the fixture.

[0082] like Figure 12 , Figure 13 As shown, the pressurization structure 60 includes: a bracket 6100, a power component 6200, a drive component 6300, a lifting rope 6400, a lower pressure plate 6500, and multiple counterweights 6600. The bracket 6100 is mounted above the positioning structure 50, and the bracket 6100 is also provided with support feet 6110. The bracket 6100 is supported by multiple support feet 6110, so that the bracket 6100 is positioned above the microfluidic chip. For ease of structural description, the bracket 6100 has a rectangular outline in the horizontal plane. The power component 6200 is mounted on the upper surface of the bracket 6100 and can generate power. The drive component 6300 is rotatably connected to the lower surface of the bracket 6100 and is connected to the power component 6200 for transmission; the drive component 6300 is driven by the power component 6200 to rotate. One end (upper end) of the lifting rope 6400 is connected to the drive assembly 6300, and the lower pressure plate 6500 is connected to the end (lower end) of the lifting rope 6400 facing the microfluidic chip. Multiple counterweights 6600 are disposed between the drive assembly 6300 and the lower pressure plate 6500 and are connected to the lifting rope 6400 at intervals.

[0083] In the above scheme, a power component 6200 is installed on the support 6100 above the microfluidic chip. The power component 6200 provides power and drives the drive component 6300 to rotate on the support 6100. The rotation of the drive component 6300 drives the lifting rope 6400 to rotate, so that the lifting rope 6400 can be wound around the drive component 6300. The winding of the lifting rope 6400 drives the counterweight 6600 and the pressure block. For example, when the drive component 6300 rotates in the forward direction, the lifting rope 6400 is wound in the forward direction, so that the lifting rope 6400 is lowered, thus causing the counterweight 6600 and the pressure block to press down on the microfluidic chip. When the drive component 6300 rotates in the reverse direction, the lifting rope 6400 is wound in the reverse direction, so that the lifting rope 6400 is raised, thus causing the counterweight 6600 and the pressure block to rise and detach from the microfluidic chip. This enables automatic pressurization of the microfluidic chip, eliminating the need for manual handling of the pressurization block, reducing workload, and improving efficiency.

[0084] Furthermore, by setting multiple counterweights 6600 on the lifting rope 6400, the microfluidic chip below can be gradually pressurized during the pressurization process, making the applied pressure controllable. When a large pressure is required, more counterweights 6600 are lowered onto the pressure block by lowering the lifting rope 6400, while when a small pressure is required, fewer counterweights 6600 are lowered onto the pressure block by raising the lifting rope 6400. This simple structure achieves pressure adjustment, making the pressurization structure more convenient to use.

[0085] like Figure 12 , Figure 13 As shown, the drive assembly 6300 in this embodiment specifically includes: a drive shaft 6310 and a winding reel 6320. The drive shaft 6310 is rotatably connected to the bracket 6100 and rotates under the drive of the power assembly 6200; the winding reel 6320 is disposed on the drive shaft 6310, and one end of the lifting rope 6400 is fixedly connected to the winding reel 6320. Specifically, a rope-holding groove is provided on the outer circular wall of the winding reel 6320 to limit the lifting rope 6400 during the winding process. The rope-holding groove allows the lifting rope 6400 to be wound within it, preventing the lifting rope 6400 from tangling during the winding process.

[0086] In this embodiment, two winding reels 6320 are provided, spaced apart along the length direction; two lifting ropes 6400 are provided, each connected to one of the two winding reels 6320. This allows the counterweight 6600 and the lower pressure block to be lifted and lowered simultaneously via the two lifting ropes 6400. This ensures stable force on the counterweight 6600 and the lower pressure block during lifting, preventing them from tilting.

[0087] Bearing seats 6330 are fixedly installed at both ends of the bracket 6100 along its length, and the two ends of the drive shaft 6310 are respectively embedded in the bearing seats 6330 at both ends. The bearing seats 6330 are connected to the drive shaft 6310 through bearings, which enables the two ends of the drive shaft 6310 to rotate stably within the bearing seats 6330.

[0088] like Figure 13As shown, this embodiment employs an automatic power system. The power assembly 6200 specifically includes: a motor 6210, a drive sprocket 6220, a driven sprocket 6230, and a chain 6240. The motor 6210 is fixedly mounted on the bracket 6100, the drive sprocket 6220 is fixedly mounted on the shaft of the motor 6210, the driven sprocket 6230 is fixedly mounted on the drive shaft 6310, and the chain 6240 is sleeved on the drive sprocket 6220 and the driven sprocket 6230. When the motor 6210 is energized, it generates power, driving the drive sprocket 6220 to rotate. The chain 6240 then drives the driven sprocket 6230 to rotate, thereby driving the drive shaft 6310 to rotate. The chain drive structure consists of a drive sprocket 6220, a chain 6240, and a driven sprocket 6230. The chain drive structure transmits force stably and can drive the heavy counterweight 6600, providing stable power for lifting the counterweight 6600 and the pressure block.

[0089] like Figure 12 , Figure 13 As shown, a pressing boss 6510 is provided on the side of the pressing plate 6500 facing away from the lifting rope 6400. The outer contour of the pressing boss 6510 matches the outer contour of the microfluidic chip. During the pressing process, the pressing boss 6510 first contacts the microfluidic chip, so that the microfluidic chip is directly pressed by force.

[0090] A limiting guide block 6520 is provided on the edge of the lower pressure plate 6500 opposite to the lifting rope 6400. The limiting guide blocks 6520 are symmetrically arranged on the four sides of the lower pressure plate. The lower inner part of the limiting guide block 6520 is provided with an inclined surface, and the opposing inclined surfaces form an "eight"-shaped opening. Through the limiting guide block 6520, the lower pressure block can be pressed down to the correct position of the component carrying the microfluidic chip, so that the lower pressure block is not prone to deviating from the microfluidic chip.

[0091] The lifting rope 6400 has stops fixed at intervals along its length. The lifting rope 6400 passes through the counterweight 6600 and is supported by the stops. The counterweight 6600 is supported by the stops, and the upper surface of the counterweight 6600 has a receiving cavity. The receiving cavity can be concentrically set with the hole through which the lifting rope 6400 passes, forming a countersunk hole. In this way, when multiple counterweights 6600 are lowered, the lifting rope 6400 can be stored in the receiving cavity and will not push up the upper counterweight 6600. The side wall of the counterweight 6600 has a handle groove 6610, which facilitates manual lifting of the counterweight 6600 and also facilitates adding counterweights 6600 to the lifting rope 6400.

[0092] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A microfluidic chip assembly apparatus for bonding a glass cover plate and a chip substrate of a microfluidic chip, characterized in that, The assembly apparatus for the microfluidic chip includes: a base, A limiting structure is detachably mounted on the base and includes a light guide support block. The limiting structure is used to support and limit the glass cover plate. The positioning structure is detachably disposed above the limiting structure and includes a clearance area; the chip base plate is located within the clearance area and its relative position to the glass cover plate is adjusted by the driving of the positioning structure. A pressure structure is disposed above the adjustment structure and is used to press down the adjustment structure so that the chip substrate covers the glass cover plate. The limiting structure includes: A limiting base plate, wherein a limiting inner cavity is formed through the upper and lower parts of the limiting base plate, and the light guide carrier block is located in the limiting inner cavity; The first fixed boss and the second fixed boss are respectively disposed on the adjacent side walls of the limiting inner cavity. The first movable boss assembly is located on the opposite surface of the limiting cavity relative to the first fixed boss, and is movably disposed close to or away from the first fixed boss. The second movable boss assembly is located on the opposite surface of the second fixed boss on the limiting cavity, and is movably disposed close to or away from the second fixed boss. The adjustment structure includes: an adjustment base plate, which is arranged horizontally; XY adjustment platform, which is connected to the adjustment base plate and is used to drive the adjustment base plate to move along the length direction or the width direction; A carrier plate, wherein the clearance area is formed on the carrier plate, the carrier plate is provided with a carrier surface, and the chip base plate is partially located on the carrier surface and partially located within the clearance area; An elastic support assembly is disposed between the bearing plate and the adjusting base plate; The bearing surface of the bearing plate is compressed by the elastic support assembly and descends below the surface of the glass cover plate, or rises above the surface of the glass cover plate due to the rebound of the elastic support assembly. The base has a through stepped bottom hole, a light guide block is installed in the stepped bottom hole, a light guide support block is installed on the light guide block, and the glass cover is placed on the light guide support block.

2. The microfluidic chip assembly apparatus according to claim 1, characterized in that, The first movable boss assembly is connected to a first adjustment assembly; The first adjustment component includes: a push block, which is movably disposed within the limiting base plate along the width direction and connected to the first movable boss component; the push block is provided with a T-shaped groove. A first adjusting screw, one end of which is located in the T-groove and rotatably connected to the push block, and the other end of which is screwed to the limiting base plate and extends out of the side of the limiting base plate in the width direction.

3. The microfluidic chip assembly apparatus according to claim 1, characterized in that, The second movable boss assembly is connected to a second adjustment assembly; The second adjustment component includes: a reversing part, which is disposed at one end of the second movable boss assembly away from the limiting cavity. The reversing part moves directionally in the width direction within the limiting base plate and pushes the second movable boss assembly in the length direction. The second adjusting screw has one end movably connected to the reversing part, and the other end screwed to the limiting base plate and extending out of the side of the limiting base plate in the width direction.

4. The microfluidic chip assembly apparatus according to claim 1, characterized in that, The adjusting base plate has threaded holes, and the elastic support assembly includes: A support screw, which passes through the bearing plate and is connected in the threaded hole; An elastic element, one end of which is connected to the adjusting base plate and the other end of which is connected to the bearing plate.

5. The microfluidic chip assembly apparatus according to claim 1, characterized in that, The support plate has a limiting groove, which is located at both edges of the clearance area along its length. The chip base plate is located in the limiting groove, and the bottom surface of the limiting groove is the support surface. One end of the chip base plate along its length is provided with a hook hole, and a limiting member matching the hook hole is provided in the limiting groove.

6. The microfluidic chip assembly apparatus according to claim 1, characterized in that, The pressurization structure includes a support frame, which is mounted above the adjustment structure. A power assembly, which is mounted on the bracket; A drive assembly, which is connected to the power assembly and rotates under the drive of the power assembly; A lifting rope, one end of which is connected to the drive assembly; A pressure plate, the pressure plate being connected to the end of the lifting rope facing the microfluidic chip; Multiple counterweights are disposed between the drive assembly and the lower pressure plate and are spaced apart and connected to the lifting rope.

7. The microfluidic chip assembly apparatus according to claim 6, characterized in that, The drive assembly includes: a drive shaft, which is rotatably connected to the bracket and rotates by the drive of the power assembly; A winding reel is mounted on the drive shaft, and one end of the lifting rope is fixedly connected to the winding reel. Two winding reels are provided, and the two winding reels are spaced apart along the length direction; Two lifting ropes are provided, and the two lifting ropes are respectively connected to the two winding reels.

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