Polygonal string bead chip removal structure of a rope saw and processing method

Abstract

The present application relates to a kind of polygonal rope saw string bead chip removal structure and processing method, belong to the field of rope saw cutting.It includes: diamond working layer, matrix and multiple chip removal channels, diamond working layer sintering cover is set on the outer circumferential surface of matrix;Diamond working layer is similar to the tubular structure of polygonal cross section, diamond working layer is composed of multiple circular-arc corner sections and multiple plane sections, multiple circular-arc corner sections and multiple plane sections are alternately arranged with circular-arc transition, chip removal channel is obliquely arranged on circular-arc corner section and plane section, the end of diamond working layer entering workpiece first is working layer front end face, and the end of diamond working layer entering workpiece later is working layer rear end face, working layer front end face is plane, and working layer rear end face is wave surface.The present application is favorable to optimize the effect of chip removal in the process of rope saw machining, reduce cutting load, and improve the service life of string bead.

Description

Technical Field

[0001] This invention relates to the field of wire saw cutting, and more particularly to a polygonal wire saw beaded chip removal structure and processing method. Background Technology

[0002] Most existing wire saws use diamond beads sintered into shape. The beads are cylindrical, and the exposed diamond height is greater than the cutting depth. Therefore, a chip space is formed between the outer surface of the beads and the workpiece. However, the volume of this chip space is much smaller than the volume of chips generated by the diamond cutting within the workpiece. The chip removal direction is mainly axial. Due to the limitations of the bead's structural shape, the exposed diamond height, and the closed contact surface with the workpiece, chips cannot be smoothly discharged from the chip space and instead accumulate and compress within it. This affects the diamond cutting depth of the beads and reduces cutting efficiency. Increased frictional resistance from dust particles leads to increased heat in the cutting zone (the area where the beads contact the workpiece), resulting in increased heat loss and reduced lifespan of the diamond. Furthermore, while single-layer diamond beads manufactured through electroplating and brazing offer advantages such as high diamond tip height and large chip space, they are insufficient to allow dust particles to escape smoothly. This limitation, while improving cutting efficiency, does not significantly enhance it. Cylindrical beads, on the other hand, suffer from dust-occupied cooling channels, severely limiting cooling effectiveness. Excessive water supply can also increase the load and cause unnecessary power loss.

[0003] Existing technologies incorporate axially continuous chip removal grooves, axially continuous spiral chip removal grooves, and axially non-continuous spiral grooves on the circumferential surface of the beads. With axially continuous chip removal grooves, the workpiece can partially block the groove during operation, affecting chip removal efficiency. With non-continuous spiral chip removal grooves, due to the small spiral angle and limited cross-sectional area, the axial velocity of the beads is much greater than their circumferential rotational speed, resulting in minimal circumferential chip removal. Therefore, the chip-holding capacity of the groove is far greater than its chip-removing function, but its effect still falls short of solving the problem. In summary, the chip removal effect of the aforementioned groove structures is very limited when used with cylindrical beads. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a polygonal wire saw bead chip removal structure and processing method, which optimizes the chip removal effect in the wire saw processing process.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a polygonal wire saw bead chip removal structure, comprising: a diamond working layer, a substrate, and multiple chip removal channels, wherein the diamond working layer is sintered and sleeved on the outer peripheral surface of the substrate; the diamond working layer is a tubular structure with a cross-section similar to a polygon, the diamond working layer is composed of multiple arc-shaped corner segments and multiple planar segments, the multiple arc-shaped corner segments and the multiple planar segments are alternately arranged with arc transitions, the chip removal channels are inclinedly arranged on the arc-shaped corner segments and the planar segments, when the diamond working layer is working, the end that first enters the workpiece is the front end face of the working layer, and the end that enters the workpiece later is the rear end face of the working layer, the front end face of the working layer is a planar surface, and the rear end face of the working layer is a wavy surface.

[0006] The beneficial effects of this invention are as follows: the chip removal channel helps to shorten the axial chip removal distance of the workpiece generated by bead cutting, thereby accelerating the removal of chips; it helps to reduce the difficulty of radial chip removal, that is, it facilitates the movement of chips from the arc-shaped corner section to the planar section; it helps to reduce the cutting load; it helps to make full use of the auxiliary effect of cooling water, reduce the frictional heat of chips, and thus reduce the heat loss of diamond; it helps to reduce the grinding of the binder used in the diamond working layer by chips, thereby improving the binding force of the binder on the diamond and thus improving the effective utilization rate of diamond; the improved chip removal capacity also reduces the requirement for diamond exposure height, providing space for selecting finer-grained diamonds, allowing the diamond to improve its sharpness by increasing the cutting pressure; fine-grained diamonds help to improve the self-sharpening performance of the beads, increase the space utilization rate in the thickness direction of the diamond working layer, and thus improve the life of the beads.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, the chip removal channel is an inclined groove-shaped structure. The end of the chip removal channel near the front end of the working layer is the inlet end, and the end penetrating the rear end of the working layer is the outlet end. The inlet end is located on the arc-shaped corner segment, and the outlet end is located in the middle of the end of the planar segment adjacent to the arc-shaped corner segment that penetrates the rear end of the working layer.

[0009] The beneficial effects of adopting the above-mentioned further scheme are: it helps to make full use of the axial chip removal distance of the plane section and enable the powder to be discharged quickly with the assistance of cooling water.

[0010] Furthermore, the distance between the inlet end and the front end face of the working layer is greater than one-quarter of the length of the diamond working layer and less than one-half of the length of the diamond working layer.

[0011] The beneficial effects of adopting the above-mentioned further solutions are: it helps to shorten the axial chip removal distance of the arc-shaped corner section and reduce the load on the beads; it also helps to introduce cooling water from the flat section into the arc-shaped corner section to assist in chip removal.

[0012] Furthermore, the angle between the chip removal channel and the axial direction of the diamond working layer is greater than 10 degrees and less than 60 degrees.

[0013] The beneficial effect of adopting the above-mentioned further solution is that it helps to reduce the resistance when the powder is discharged.

[0014] Furthermore, the depth of the chip removal channel is greater than the particle size of the diamond particles, and less than or equal to the thickness of the diamond working layer minus the particle size of the diamond particles.

[0015] The beneficial effect of adopting the above-mentioned further solution is that it helps to protect the consolidation strength of the diamond working layer.

[0016] Furthermore, the width of the chip removal channel is greater than 0.1 mm and less than 1 mm.

[0017] The beneficial effect of adopting the above-mentioned further solutions is that it helps to reduce processing costs while optimizing the chip removal function.

[0018] Furthermore, the axial length of the arc-shaped corner segment is greater than or equal to the axial length of the planar segment.

[0019] The beneficial effect of adopting the above-mentioned further scheme is that it helps to form a wavy surface on the rear end face of the diamond working layer, thereby shortening the path of the powder and dust in the chip removal channel and accelerating the discharge of the powder and dust.

[0020] Furthermore, during the operation of the wire saw, multiple base bodies are spaced and fitted onto the steel wire.

[0021] The beneficial effect of adopting the above-mentioned further scheme is that it facilitates the cutting of the workpiece by the diamond working layer on the substrate as the steel wire moves.

[0022] Another technical solution of the present invention to solve the above-mentioned technical problems is as follows: a polygonal wire saw beaded chip removal structure, the processing method of which includes the following steps:

[0023] S1: Clamping the diamond working layer;

[0024] S2: Adjust the power and path of the laser generator;

[0025] S3: Using laser cutting, chip removal channels are cut out on the arc-shaped corner sections and flat sections;

[0026] S4: Stress relief;

[0027] S5: Remove the oxide film from the surface of the chip removal channel after laser cutting.

[0028] The beneficial effects of this invention are: the chip removal channel is simple and easy to process using laser cutting, which solves the problem of difficulty in using a pre-set inclined chip removal channel in the mold, and facilitates batch processing of beads, making it suitable for intelligent implementation and low cost. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure provided in Embodiment 1 of the present invention;

[0030] Figure 2 This is a front view of the overall structure provided in Embodiment 1 of the present invention;

[0031] Figure 3 This is a side view of the overall structure provided in Embodiment 1 of the present invention;

[0032] Figure 4 This is a cross-sectional view of the beads provided in Embodiment 1 of the present invention;

[0033] Figure 5 This is a schematic diagram of the overall structure provided in Embodiment 2 of the present invention;

[0034] Figure 6 This is a front view of the overall structure provided in Embodiment 2 of the present invention;

[0035] Figure 7 This is a side view of the overall structure provided in Embodiment 2 of the present invention;

[0036] Figure 8 This is a schematic diagram of the overall structure provided in Embodiment 3 of the present invention;

[0037] Figure 9 This is a front view of the overall structure provided in Embodiment 3 of the present invention;

[0038] Figure 10 This is a side view of the overall structure provided in Embodiment 3 of the present invention;

[0039] Figure 11 This is a schematic diagram of the overall structure provided in Embodiment 4 of the present invention;

[0040] Figure 12 This is a front view of the overall structure provided in Embodiment 4 of the present invention;

[0041] Figure 13 This is a side view of the overall structure provided in Embodiment 4 of the present invention;

[0042] Figure 14 A flowchart of the processing method provided in an embodiment of the present invention.

[0043] in, Figure 1 , Figure 5 , Figure 8 and Figure 11 The arrows in the diagram indicate the processing direction of the wire saw; Figure 2 In this context, L represents the axial length of the diamond working layer, and L1 represents the distance between the inlet end and the rear end face of the working layer. Figure 4 In this context, t represents the depth of the chip removal channel, and b represents the width of the chip removal channel.

[0044] The attached diagram lists the components represented by each number as follows:

[0045] 1. Diamond working layer; 2. Matrix; 3. Steel wire; 4. Chip removal channel; 11. Rounded corner section; 12. Planar section; 13. Front face of working layer; 14. Rear face of working layer; 41. Inlet end; 42. Outlet end. Detailed Implementation

[0046] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0047] like Figures 1 to 13 As shown, a polygonal wire saw bead chip removal structure includes: a diamond working layer 1, a substrate 2, and multiple chip removal channels 4. The diamond working layer 1 is sintered and sleeved on the outer peripheral surface of the substrate 2. The diamond working layer 1 is a tubular structure with a cross-section similar to a polygon. The diamond working layer 1 is composed of multiple arc-shaped corner segments 11 and multiple planar segments 12. The multiple arc-shaped corner segments 11 and multiple planar segments 12 are alternately arranged with arc transitions. The chip removal channels 4 are inclinedly arranged on the arc-shaped corner segments 11 and the planar segments 12. When the diamond working layer 1 is working, the end that first enters the workpiece is the front end face 13 of the working layer, and the end that enters the workpiece later is the rear end face 14 of the working layer. The front end face 13 of the working layer is planar, and the rear end face 14 of the working layer is wavy.

[0048] It should be noted that: the alternating circular arc corner segments 11 and the multiple planar segments 12 mean that the two ends of the circular arc corner segment 11 are respectively arranged with two planar segments 12 in a circular arc transition, and the two ends of the planar segment 12 are respectively arranged with two circular arc corner segments 11 in a circular arc transition.

[0049] The diamond working layer 1 is prepared by metallurgy using diamond particles and a binder.

[0050] The planar front end face 13 of the working layer helps to prevent the diamond working layer 1 from cracking due to impact when the beads enter the workpiece.

[0051] The wavy rear end face 14 of the working layer is beneficial in two ways: firstly, it helps to ensure the bonding strength between the diamond working layer 1 and the substrate 2 when under stress; secondly, it helps to collect cooling water in the wavy concave surface during processing, so as to cool the arc-shaped corner section 11 that performs the main grinding and the planar section 12 that assists in grinding; at the same time, when the grinding dust moves with the beads, it will shorten the movement path of the dust and speed up the discharge of the dust as it moves from the front end face 13 of the working layer to the rear end face 14 of the working layer.

[0052] The design principle of this invention is as follows: When the wire saw beads with a cross-section resembling a polygon are working, there is a phase difference between adjacent beads, and each bead is in a random position. Therefore, it is highly likely that the arc-shaped corner segment 11 cuts the workpiece before the flat segment 12, while the flat segment 12 participates in the cutting later or even less. As a result, a gap easily forms between the flat segment 12 and the workpiece, creating a natural channel for chip removal and water flow. When the wire saw beads are cutting, the chips generated by the arc-shaped corner segment 11, which plays the main cutting role, are mainly carried out by axial movement. Introducing these chips into the gap between the flat segment 12 and the workpiece can significantly increase the chip removal speed of the arc-shaped corner segment 11, and the friction of the chips will also be greatly reduced, which helps to increase the processing speed of the wire saw. By tilting the chip removal channel 4 onto the arc-shaped corner section 11 and the flat section 12, it is beneficial to bring the chips generated by the arc-shaped corner section 11 and the workpiece during cutting into the chip removal channel 4 through a shorter path, and then discharge them along the chip removal channel 4 with the assistance of cooling water.

[0053] The beneficial effects of this invention are as follows: the chip removal channel helps to shorten the axial chip removal distance of the chips generated during bead cutting, thereby accelerating the removal of chips; it helps to reduce the difficulty of radial chip removal, that is, it facilitates the movement of chips from the arc-shaped corner section to the planar section; it helps to reduce the cutting load; it helps to make full use of cooling water to assist chip removal, reduce the frictional heat of chips, and thus reduce the heat loss of diamond; it helps to reduce the grinding of the binder used in the diamond working layer by chips, thereby improving the binding force of the binder on the diamond and thus improving the effective utilization rate of diamond; the improved chip removal capacity also reduces the requirement for diamond exposure height, providing space for selecting finer-grained diamonds, allowing the diamond to improve its sharpness by increasing the cutting pressure; fine-grained diamonds help to improve the self-sharpening performance of the beads, increase the space utilization rate in the thickness direction of the diamond working layer, and thus improve the life of the beads.

[0054] Preferred, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8 , Figure 9 , Figure 11 and Figure 12 As shown, the chip removal channel 4 is an inclined groove-shaped structure. The end of the chip removal channel 4 near the front end face 13 of the working layer is the inlet end 41, and the end that penetrates the rear end face 14 of the working layer is the outlet end 42. The inlet end 41 is located on the arc-shaped corner segment 11, and the outlet end 42 is located in the middle of the end of the planar segment 12 adjacent to the arc-shaped corner segment 11 that penetrates the rear end face 14 of the working layer.

[0055] The advantages of adopting the above preferred scheme are: it helps to make full use of the axial chip removal distance of the plane section and enable the powder to be discharged quickly with the assistance of cooling water.

[0056] Preferred, such as Figure 1 and Figure 2 As shown, the distance L-L1 between the inlet end 41 and the front end face 13 of the working layer is greater than one-quarter of the length L of the diamond working layer 1, and less than one-half of the length L of the diamond working layer 1.

[0057] It should be noted that, regarding a single chip removal channel 4, since the chip removal channel 4 is processed by laser cutting, the laser generated by the laser generator moves along a pre-set path during laser cutting. Furthermore, there is a certain angle between the arc-shaped corner segment 11 and the flat segment 12. Therefore, even if the laser moves to the inlet end 41 position on the arc-shaped corner segment 11, the laser will still leave a certain mark on the flat segment 12 adjacent to the arc-shaped corner segment 11, which does not have the outlet end 42. Figure 1 and Figure 2 As shown.

[0058] The advantages of adopting the above preferred scheme are: it helps to shorten the axial chip removal distance of the arc corner section and reduce the load on the beads; it also helps to introduce cooling water from the flat section into the arc corner section to assist in chip removal.

[0059] Preferred, such as Figure 1 and Figure 2 As shown, the angle between the chip removal channel 4 and the axial direction of the diamond working layer 1 is greater than 10 degrees and less than 60 degrees.

[0060] It should be noted that, in a preferred embodiment of the present invention, the included angle between the chip removal channel 4 and the axial direction of the diamond working layer 1 is greater than 20 degrees and less than 45 degrees.

[0061] The beneficial effect of adopting the above preferred solution is that it helps to reduce the resistance when the powder is discharged.

[0062] Preferred, such as Figure 4As shown, the depth t of the chip removal channel 4 is greater than the particle size of the diamond particles, and less than or equal to the thickness of the diamond working layer 1 minus the particle size of the diamond particles.

[0063] The beneficial effect of adopting the above preferred scheme is that it helps to protect the consolidation strength of the diamond working layer.

[0064] Preferred, such as Figure 4 As shown, the width b of the chip removal channel 4 is greater than 0.1 mm and less than 1 mm.

[0065] The advantages of adopting the above-mentioned preferred solution are: it helps to reduce processing costs while optimizing the chip removal function.

[0066] Preferred, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8 , Figure 9 , Figure 11 and Figure 12 As shown, the axial length of the arc-shaped corner segment 11 is greater than the axial length of the planar segment 12.

[0067] The advantages of adopting the above-mentioned preferred scheme are: it helps to form a wavy surface on the rear end face of the diamond working layer, thereby shortening the path of the powder and dust in the chip removal channel and accelerating the discharge of the powder and dust.

[0068] Preferably, when the wire saw is in operation, multiple base bodies 2 are spaced out and sleeved on the steel wire 3.

[0069] The beneficial effect of adopting the above preferred scheme is that it facilitates the cutting of the workpiece by the diamond working layer on the substrate as the steel wire moves.

[0070] like Figure 14 As shown, another technical solution of the present invention to solve the above-mentioned technical problem is as follows: a polygonal wire saw beaded chip removal structure, the processing method of which includes the following steps:

[0071] S1: Clamping diamond working layer 1;

[0072] S2: Adjust the power and path of the laser generator;

[0073] S3: Using laser cutting, chip removal channels 4 are cut out on the arc-shaped corner segment 11 and the flat segment 12;

[0074] S4: Stress relief;

[0075] S5: Remove the oxide film from the surface of chip removal channel 4 after laser cutting.

[0076] It should be noted that in other preferred embodiments of the present invention, the material can also be processed by electrical discharge machining or laser engraving, but the cost will be significantly higher than that of laser cutting.

[0077] In step S3, the chip removal channel 4 cut by laser needs to meet the following conditions: the distance L-L1 between the inlet end 41 and the front end face 13 of the working layer is greater than one-quarter of the length L of the diamond working layer 1 and less than one-half of the length L of the diamond working layer 1; the depth t of the chip removal channel 4 is greater than the particle size of the diamond particles and less than or equal to the thickness of the diamond working layer 1 minus the particle size of the diamond particles; the width b of the chip removal channel 4 is greater than 0.1 mm and less than 1 mm; the angle between the chip removal channel 4 and the axial direction of the diamond working layer 1 is greater than 10 degrees and less than 60 degrees.

[0078] In step S4, since the materials of the arc-shaped corner segment 11 and the planar segment 12 will be stressed after laser cutting, it is necessary to eliminate these stresses to prevent the chip removal channel 4 from deforming.

[0079] In step S5, after laser cutting, the surface of the chip removal channel 4 may be oxidized under high temperature, so it is necessary to remove the oxide film on the surface of the chip removal channel 4.

[0080] The beneficial effects of this invention are: the use of laser cutting to process the chip removal channel is efficient and easy, which solves the problem of difficulty in using a pre-set inclined chip removal channel in the mold, and facilitates batch processing of beads, making it suitable for intelligent implementation and low cost.

[0081] The present invention will be further illustrated by the following four embodiments.

[0082] Example 1.

[0083] like Figures 1 to 4 As shown, the arc-shaped corner segment 11 has an outwardly convex conical structure on the rear end face 14 of the working layer, the planar segment 12 has an inwardly concave conical structure on the rear end face 14 of the working layer, and the wavy surface is an axially wavy surface.

[0084] Example 2.

[0085] like Figures 5 to 7 As shown, the arc-shaped segment 11 has an outwardly convex arc structure on the rear end face 14 of the working layer, the planar segment 12 has an inwardly concave arc structure on the rear end face 14 of the working layer, and the wavy surface is an axially wavy surface.

[0086] Example 3.

[0087] like Figures 8 to 10As shown, an arc-shaped groove is provided on the outer peripheral surface of the planar segment 12, and the wavy surface is a circumferential wavy surface.

[0088] Example 4.

[0089] like Figures 11 to 13 As shown, a conical groove is provided on the outer peripheral surface of the planar segment 12, and the wavy surface is a circumferential wavy surface.

[0090] In the above embodiments, the axial wavy surface refers to a wavy structure formed by a plurality of arc-shaped corner segments 11 and a plurality of planar segments 12 along the axial direction of the diamond working layer 1; the circumferential wavy surface refers to a wavy structure formed on the rear end face 14 of the working layer when viewed along the processing direction of the diamond working layer 1.

[0091] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0093] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0094] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0096] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A polygonal wire saw beaded chip removal structure, characterized in that, include: The diamond working layer (1), the substrate (2), and multiple chip removal channels (4) are provided, wherein the diamond working layer (1) is sintered and fitted onto the outer peripheral surface of the substrate (2); The diamond working layer (1) is a tubular structure with a cross-section resembling a polygon. The diamond working layer (1) consists of multiple arc-shaped corner segments (11) and multiple planar segments (12) for forming channels for chip removal and water passage. The multiple arc-shaped corner segments (11) and the multiple planar segments (12) are arranged with alternating arc transitions in the circumference. The chip removal channel (4) is inclinedly arranged on the arc-shaped corner segments (11) and the planar segments (12) to facilitate the removal of chips generated during workpiece cutting by the arc-shaped corner segments (11) along a shorter path. The chip is introduced into the chip removal channel (4) and discharged along the chip removal channel (4) with the assistance of cooling water. When the diamond working layer (1) is working, the end that first enters the workpiece is the front end face (13) of the working layer, and the end that enters the workpiece later is the rear end face (14) of the working layer. The front end face (13) of the working layer is a plane, and the rear end face (14) of the working layer is a wavy surface, which is used to gather cooling water in the wavy concave surface to cool the arc corner section (11) and the plane section (12), while shortening the movement path of the powder.

2. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, The chip removal channel (4) is an inclined groove-shaped structure. The end of the chip removal channel (4) near the front end face (13) of the working layer is the inlet end (41), and the end that passes through the rear end face (14) of the working layer is the outlet end (42). The inlet end (41) is located on the arc-shaped corner section (11), and the outlet end (42) is located in the middle of the end of the planar section (12) adjacent to the arc-shaped corner section (11) that passes through the rear end face (14) of the working layer.

3. The polygonal wire saw beaded chip removal structure according to claim 2, characterized in that, The distance between the inlet end (41) and the front end face (13) of the working layer is greater than one-quarter of the length of the diamond working layer (1) and less than one-half of the length of the diamond working layer (1).

4. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, The angle between the chip removal channel (4) and the diamond working layer (1) is greater than 10 degrees and less than 60 degrees.

5. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, The depth of the chip removal channel (4) is greater than the particle size of the diamond particles, and less than or equal to the thickness of the diamond working layer (1) minus the particle size of the diamond particles.

6. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, The width of the chip removal channel (4) is greater than 0.1 mm and less than 1 mm.

7. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, The axial length of the arc-shaped corner segment (11) is greater than the axial length of the planar segment (12).

8. The polygonal wire saw beaded chip removal structure according to claim 1, characterized in that, When the wire saw is in operation, multiple bases (2) are spaced out on the wire (3).

9. A method for processing a polygonal wire saw beaded chip removal structure, characterized in that, The method for processing the polygonal wire saw beaded chip removal structure according to any one of claims 1-8 includes the following steps: S1: Clamping the diamond working layer (1); S2: Adjust the power and path of the laser generator; S3: Using laser cutting, chip removal channels (4) are cut out on the arc corner section (11) and the flat section (12). S4: Stress relief; S5: Remove the oxide film on the surface of the chip removal channel (4) after laser cutting.

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