A germanium crystal cutting and dicing jig and method

Abstract

This application discloses a germanium crystal cutting and wafer-retrieving fixture and method, comprising: a mounting base and a fixing base. The mounting base has an arc-shaped groove for placing a cylindrical crystal, one end of which is closed and the other end is open. An elastic sealing element for fixing the cylindrical crystal is detachably installed in the arc-shaped groove, and the elastic sealing element is interference-fitted with the arc-shaped groove. The fixing base includes a U-shaped base and multiple inverted U-shaped rails. The mounting base is detachably mounted on the U-shaped base, and the inverted U-shaped rails are detachably mounted on the top of the U-shaped base for fixing the top surface of the cylindrical crystal. Round-headed screws for point fixing the two sides of the inverted U-shaped rails are symmetrically threaded. This invention is easy to assemble and disassemble, effectively fixes the cylindrical crystal, and prevents the cut part from slipping and flying out, making it safer and more reliable.

Description

Technical Field

[0001] This application relates to the field of semiconductor crystal processing equipment technology, and in particular to a germanium crystal cutting and wafer picking fixture and method. Background Technology

[0002] After the high-purity germanium crystal undergoes low-temperature resistivity testing, Hall effect plates, dislocation plates, and DLTS plates are cut according to the test results. At the beginning and end of the low-temperature resistivity test, dense cutting and plate taking will be carried out, with each sample plate taken about 1-2 cm long.

[0003] Currently, in the process of intensive cutting and wafer extraction, existing technology uses adhesive to fix the crystal. However, because the crystal is round and has a smooth surface, the contact area with the adhesive is small during intensive wafer extraction. Consequently, during the cutting process, the cut portion may slip and fly out due to the rotation of the cutting line and the impact of cooling water, resulting in waste and danger. Furthermore, separating the crystal from the adhesive after cutting requires soaking it in acetic acid, and it is currently unclear whether acetic acid affects the crystal's properties. Therefore, this invention proposes a germanium crystal cutting and wafer extraction fixture and method. Summary of the Invention

[0004] This application provides a germanium crystal cutting and slicing fixture and method, which makes disassembly and assembly convenient, can effectively fix cylindrical crystals, and prevent the cut part from slipping and flying out, making it safer and more reliable.

[0005] The first aspect of this application provides a germanium crystal cutting and wafer picking fixture, including: a mounting base and a fixing base;

[0006] The mounting base has an arc-shaped groove for placing cylindrical crystals;

[0007] One end of the arc-shaped groove is closed, and the other end is open;

[0008] An elastic sealing element for fixing the cylindrical crystal can be detachably installed in the arc-shaped groove;

[0009] The elastic sealing element is interference-fitted with the arc-shaped groove;

[0010] The mounting base includes a U-shaped base and multiple inverted U-shaped rails;

[0011] The mounting base can be detachably installed on the U-shaped base;

[0012] The inverted U-shaped rail is detachably installed on the top of the U-shaped base to fix the top surface of the cylindrical crystal.

[0013] The inverted U-shaped rail is symmetrically threaded on both sides with round-headed screws for point fixing of the two sides of the cylindrical crystal.

[0014] Optionally, mounting plates are symmetrically arranged on the top of the two side plates of the U-shaped base;

[0015] The mounting plate has multiple mounting holes evenly distributed along its length.

[0016] The two ends of the inverted U-shaped rail are detachably connected to the two mounting plates by first screws.

[0017] Optionally, the base plate of the U-shaped base extends outward along its length to form a cutting machine connecting substrate.

[0018] Optionally, the inverted U-shaped rail is provided with first threaded holes symmetrically on both sides for installing the round-headed screws.

[0019] Optionally, the mounting base is tenon-and-mortise connected to the U-shaped base and secured by a second screw.

[0020] Optionally, the mounting base has symmetrical positioning grooves on both sides;

[0021] The inner side of the U-shaped base is provided with a positioning protrusion for cooperating with the positioning groove;

[0022] A second threaded hole is provided on the positioning groove;

[0023] The positioning groove is provided with a third threaded hole for cooperating with the second threaded hole.

[0024] Optionally, the lowest point of the arc-shaped groove is 3-5 cm higher than the positioning groove.

[0025] Optionally, the depth of the arc-shaped groove is less than the radius of the cylindrical crystal.

[0026] Optionally, the width of the inverted U-shaped rail is 5-8 mm.

[0027] The second aspect of this application provides a wafer-retrieving method based on the above-described germanium crystal cutting and wafer-retrieving fixture, the method specifically including the following steps:

[0028] S1. Based on the low-temperature resistivity test results, remove the head and tail of the crystal, leaving a carrier concentration less than 5e10cm. -3 The segment is oriented and rounded to obtain a cylindrical crystal.

[0029] S2. Place the cylindrical crystal into the arc-shaped groove of the mounting base, and position the cylindrical crystal using the elastic sealing member. Then fix the mounting base on the U-shaped base of the fixing base.

[0030] S3. Fit the inverted U-shaped railings onto the head and tail of the cylindrical crystal respectively, and fix the inverted U-shaped railings on the top of the U-shaped base so that the inverted U-shaped railings press against the top of the cylindrical crystal. Then tighten the round head screws on both sides of the inverted U-shaped railings until the round head screws contact the two sides of the cylindrical crystal.

[0031] S4. Place the inverted U-shaped frame over the area where the slice needs to be cut and taken.

[0032] S5. Fix the mounting base onto the cutting machine to cut and remove the pieces.

[0033] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: the germanium crystal cutting and slicing fixture can quickly fix the cylindrical crystal on the arc-shaped groove of the mounting base through the elastic sealing component, which is convenient for disassembly and assembly. At the same time, the cylindrical crystal is fixed at the top by the inverted U-shaped railing that is detachably installed on the top of the U-shaped base, and the cylindrical crystal is fixed at the side by the round-headed screws on both sides of the inverted U-shaped railing. This can effectively fix the cylindrical crystal and prevent the cut part from slipping and flying out, making it safer and more reliable. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure after the cylindrical crystal is placed on the mounting base in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the mounting base in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the structure of the elastic sealing element in the embodiments of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the fixing base in the embodiments of this application;

[0038] The attached figures are labeled as follows:

[0039] 1-Mounting base, 2-Elastic sealing element, 3-U-shaped base, 4-Cutter connecting base plate, 5-Mounting plate, 6-Inverted U-shaped rail, 7-Cylindrical crystal, 8-Arc-shaped groove, 9-Positioning groove, 10-Second threaded hole, 11-Positioning protrusion, 12-Third threaded hole, 13-Mounting hole, 14-First threaded hole. Detailed Implementation

[0040] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0041] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] This application provides an embodiment of a germanium crystal cutting and wafer picking fixture. Please refer to the following for details. Figures 1 to 4 .

[0044] The germanium crystal cutting and slicing fixture in this embodiment includes: a mounting base 1 and a fixing base. The mounting base 1 has an arc-shaped groove 8 for placing a cylindrical crystal 7. One end of the arc-shaped groove 8 is closed and the other end is open. An elastic sealing member 2 for fixing the cylindrical crystal 7 is detachably installed in the arc-shaped groove 8. The elastic sealing member 2 is interference-fitted with the arc-shaped groove 8. The fixing base includes a U-shaped base 3 and multiple inverted U-shaped rails 6. The mounting base 1 is detachably installed on the U-shaped base 3. The inverted U-shaped rails 6 are detachably installed on the top of the U-shaped base 3 for fixing the top surface of the cylindrical crystal 7. Round-headed screws for point fixing the two sides of the inverted U-shaped rails 6 are symmetrically threaded.

[0045] It should be noted that the germanium crystal cutting and slicing fixture can quickly fix the cylindrical crystal 7 onto the arc-shaped groove 8 of the mounting base 1 through the elastic sealing component 2, which is convenient for disassembly and assembly. At the same time, the cylindrical crystal 7 is fixed at the top by the inverted U-shaped railing 6 that is detachably installed on the top of the U-shaped base 3, and the cylindrical crystal 7 is fixed at the side by the round-headed screws on both sides of the inverted U-shaped railing 6. This can effectively fix the cylindrical crystal 7 and prevent the cut part from slipping and flying out, making it safer and more reliable.

[0046] The above is Embodiment 1 of a germanium crystal cutting and wafer-retrieving fixture provided in this application. The following is Embodiment 2 of a germanium crystal cutting and wafer-retrieving fixture provided in this application. Please refer to the following for details. Figures 1 to 4 .

[0047] The germanium crystal cutting and slicing fixture in this embodiment includes: a mounting base 1 and a fixing base. The mounting base 1 has an arc-shaped groove 8 for placing a cylindrical crystal 7. One end of the arc-shaped groove 8 is closed, and the other end is open. An elastic sealing member 2 for fixing the cylindrical crystal 7 is detachably installed in the arc-shaped groove 8. The elastic sealing member 2 is interference-fitted with the arc-shaped groove 8. Specifically, in order to ensure the fixing effect of the elastic sealing member 2, the height of the elastic sealing member 2 should be higher than that of the cylindrical crystal 7. The fixing base includes a U-shaped base 3 and multiple inverted U-shaped rails 6. The mounting base 1 is detachably installed on the U-shaped base 3, and the inverted U-shaped rails 6 are detachably installed on the top of the U-shaped base 3 for fixing the top surface of the cylindrical crystal 7. The two sides of the inverted U-shaped rails 6 are symmetrically threaded with round-headed screws for point fixing on both sides of the cylindrical crystal 7. The round head design will not scratch the crystal.

[0048] Understandably, one end of the arc-shaped groove 8 is closed, while the other end is open. The opening is sealed by the elastic sealing element 2 to fix the cylindrical crystal 7 placed inside the arc-shaped groove 8. This design can fix cylindrical crystals 7 of different lengths, preventing them from slipping during movement and facilitating the subsequent detachable installation of the mounting base 1 onto the U-shaped base 3. The upper and lower fixing surfaces of the cylindrical crystal 7 are in surface contact, while the two side fixing surfaces are in point contact, resulting in a relatively secure fit.

[0049] The top of the two side plates of the U-shaped base 3 are symmetrically provided with mounting plates 5. Multiple mounting holes 13 are evenly opened along the length direction on the mounting plates 5. The two ends of the inverted U-shaped rail 6 are detachably connected to the two mounting plates 5 by first screws. Specifically, the bottom of the inverted U-shaped rail 6 is provided with bottom screw holes for matching the mounting holes 13. The first screw can be an internal hex screw for easy bottom operation.

[0050] The base plate of the U-shaped base 3 extends outward along the length direction to form a cutting machine connecting base plate 4.

[0051] The inverted U-shaped column 6 has symmetrical first threaded holes 14 on both sides for installing round-headed screws.

[0052] Mounting base 1 can be mortised and tenoned with U-shaped base 3 and secured with a second screw. The mortise and tenon connection prevents mounting base 1 from sliding during insertion into U-shaped base 3, thus facilitating its secure fixation.

[0053] Specifically, the mounting base 1 has symmetrically provided positioning grooves 9 on both sides, and the U-shaped base 3 has a corresponding positioning protrusion 11 for cooperating with the positioning grooves 9 on the inner side. The positioning grooves 9 have a second threaded hole 10, and the positioning protrusion 11 has a corresponding third threaded hole 12 for cooperating with the second threaded hole 10.

[0054] The lowest point of the arc-shaped groove 8 is 3-5cm higher than the positioning groove 9 to prevent cutting the positioning groove 9 and the fixing seat when cutting the cylindrical crystal 7. This allows the mounting seat 1 to be used multiple times, while the fixing seat can be used permanently. Specifically, the mounting seat 1 can be made of plastic.

[0055] The depth of the arc-shaped groove 8 is slightly less than the radius of the cylindrical crystal 7, so that the round-headed screws on both sides of the inverted U-shaped rail 6 can just contact the outermost side of the cylindrical crystal 7 (the fixing points of the round-headed screws on both sides are on the same straight line and on the diameter of the cylindrical crystal 7), which is beneficial to fixing the cylindrical crystal 7.

[0056] The width of the inverted U-shaped rail 6 is 5-8mm. It is understandable that, since at least one 1mm Hall plate and one 2mm dislocation plate are taken every 1cm, the width of the inverted U-shaped rail 6 cannot be more than 1cm, as this would affect the plate taking. If the width is too low, the contact surface with the cylindrical crystal 7 will be too small, and the fixation will be poor. Therefore, the width of the inverted U-shaped rail 6 is set to 5-8mm.

[0057] This application also provides a wafer-retrieving method based on the above-mentioned germanium crystal cutting and wafer-retrieving fixture, which specifically includes the following steps:

[0058] S1. Based on the low-temperature resistivity test results, remove the head and tail of the crystal, leaving a carrier concentration less than 5e10cm. -3 The segment is oriented and rounded to obtain a cylindrical crystal 7;

[0059] S2. Place the cylindrical crystal 7 into the arc-shaped groove 8 of the mounting base 1, and position the cylindrical crystal 7 using the elastic sealing member 2. Then fix the mounting base 1 onto the U-shaped base 3 of the fixing base.

[0060] S3. Fit the inverted U-shaped railings 6 of the corresponding size onto the head and tail of the cylindrical crystal 7, and fix the inverted U-shaped railings 6 on the top of the U-shaped base 3 so that the inverted U-shaped railings 6 press against the top of the cylindrical crystal 7. Then tighten the round head screws on both sides of the inverted U-shaped railings 6 until the round head screws contact both sides of the cylindrical crystal 7.

[0061] S4. Place the inverted U-shaped column 6 at the position where the slice needs to be cut (the operation method is the same as S3);

[0062] S5. Fix the mounting base onto the cutting machine to cut and remove the pieces.

[0063] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A germanium crystal cutting and wafer-taking fixture, characterized in that, include: Mounting brackets and mounting brackets; The mounting base has an arc-shaped groove for placing cylindrical crystals; One end of the arc-shaped groove is closed, and the other end is open; An elastic sealing element for fixing the cylindrical crystal can be detachably installed in the arc-shaped groove; The elastic sealing element is interference-fitted with the arc-shaped groove; The mounting base includes a U-shaped base and multiple inverted U-shaped rails; The mounting base can be detachably installed on the U-shaped base; The inverted U-shaped rail is detachably installed on the top of the U-shaped base to fix the top surface of the cylindrical crystal. The inverted U-shaped rail is symmetrically threaded on both sides with round-headed screws for point fixing of the two sides of the cylindrical crystal.

2. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, Mounting plates are symmetrically arranged on the top of the two side plates of the U-shaped base; The mounting plate has multiple mounting holes evenly distributed along its length. The two ends of the inverted U-shaped rail are detachably connected to the two mounting plates by first screws.

3. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, The base plate of the U-shaped base extends outward along its length to form a cutting machine connecting substrate.

4. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, The inverted U-shaped rail has symmetrical first threaded holes on both sides for installing the round-headed screws.

5. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, The mounting base is mortised and tenoned with the U-shaped base and secured with a second screw.

6. The germanium crystal cutting and wafer-taking fixture according to claim 5, characterized in that, The mounting base has symmetrical positioning grooves on both sides; The inner side of the U-shaped base is provided with a positioning protrusion for cooperating with the positioning groove; A second threaded hole is provided on the positioning groove; The positioning groove is provided with a third threaded hole for cooperating with the second threaded hole.

7. The germanium crystal cutting and wafer-taking fixture according to claim 6, characterized in that, The lowest point of the arc-shaped groove is 3-5 cm higher than the positioning groove.

8. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, The depth of the arc-shaped groove is less than the radius of the cylindrical crystal.

9. The germanium crystal cutting and wafer-taking fixture according to claim 1, characterized in that, The width of the inverted U-shaped railing is 5-8mm.

10. A method for retrieving germanium crystals based on the germanium crystal cutting and retrieving fixture according to any one of claims 1-9, characterized in that, The method includes the following steps: S1. Based on the low-temperature resistivity test results, remove the head and tail of the crystal, leaving a carrier concentration less than 5e10cm. -3 The segment is oriented and rounded to obtain a cylindrical crystal. S2. Place the cylindrical crystal into the arc-shaped groove of the mounting base, and position the cylindrical crystal using the elastic sealing member. Then fix the mounting base on the U-shaped base of the fixing base. S3. Fit the inverted U-shaped railings onto the head and tail of the cylindrical crystal respectively, and fix the inverted U-shaped railings on the top of the U-shaped base so that the inverted U-shaped railings press against the top of the cylindrical crystal. Then tighten the round head screws on both sides of the inverted U-shaped railings until the round head screws contact the two sides of the cylindrical crystal. S4. Place the inverted U-shaped frame over the area where the slice needs to be cut and taken. S5. Fix the mounting base onto the cutting machine to cut and remove the pieces.

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