Auxiliary device for wire sawing apparatus, wire sawing apparatus and method and silicon wafer

Abstract

The embodiments of the present disclosure provide an auxiliary device for a wire cutting device, a wire cutting device and method, and a silicon wafer. The auxiliary device comprises: a base fixed to the wire cutting device and located above an array of cutting wire segments of the wire cutting device; a first connecting plate arranged to connect a silicon rod to a lower surface of the base in an axial direction along a horizontal direction; a second connecting plate connected to the silicon rod and opposite the first connecting plate in a diameter direction of the silicon rod, so that the array of cutting wire segments can cut the silicon rod, the first connecting plate and the second connecting plate by a single wire cutting operation to obtain a plurality of silicon wafers, wherein each of the plurality of silicon wafers is connected with a part of the first connecting plate and a part of the second connecting plate; and a holding module for carrying the plurality of silicon wafers by contacting the second connecting plate after wire cutting during removal of the plurality of silicon wafers from the wire cutting device.

Description

Technical Field

[0001] This disclosure relates to the field of silicon wafer processing technology, and more particularly to auxiliary devices for wire cutting equipment, wire cutting equipment and methods, and silicon wafers. Background Technology

[0002] Multi-wire dicing is a method of cutting single-crystal silicon rods in semiconductor manufacturing. As a crucial step in semiconductor manufacturing, multi-wire dicing directly impacts the quality and cost of silicon wafers, thus requiring precise control throughout the entire process.

[0003] In multi-wire cutting equipment, the cutting wires are typically wound sequentially into guide grooves formed on the circumferential surface of the spool at intervals, forming an array of cutting segments. The high-speed reciprocating motion of the cutting wires carries the abrasive into the processing area of ​​the silicon rod for grinding and cutting. The worktable drives the movement of the silicon rod relative to the array of cutting segments to achieve the feed of the wire cutting operation, thereby cutting the silicon rod into several silicon wafers of predetermined thickness in one operation.

[0004] In current multi-wire dicing processes, after a single wire dicing operation, the silicon wafer needs to be moved in the opposite direction to the feed direction using a stage. This allows the dicing segments to separate from the wafer through the gaps between adjacent wafers, facilitating the removal of the wafer from the multi-wire dicing equipment. However, during this separation process, the dicing segments inevitably cause damage to the wafer surface, creating difficulties for subsequent processing. Summary of the Invention

[0005] In view of this, the present disclosure aims to provide an auxiliary device, wire cutting equipment and method, and silicon wafer for a wire cutting equipment. This auxiliary device can prevent damage to the silicon wafer surface and destruction of the cutting wires during the removal of the silicon wafer obtained from the multi-wire-cut silicon rod from the wire cutting equipment, thus achieving safe unloading of the silicon wafer from the wire cutting equipment.

[0006] The technical solution of this disclosure embodiment is implemented as follows:

[0007] In a first aspect, embodiments of this disclosure provide an auxiliary device for a wire cutting machine, the auxiliary device comprising:

[0008] A base, the base being fixed to the wire cutting equipment and located above the array of cutting segments of the wire cutting equipment;

[0009] A first connecting plate is configured to connect a silicon rod to the lower surface of the base in a horizontal manner along the axial direction of the silicon rod.

[0010] A second connecting plate is connected to the silicon rod and is opposite to the first connecting plate in the diameter direction of the silicon rod, such that the cutting segment array can cut the silicon rod, the first connecting plate and the second connecting plate in a single wire cutting operation to obtain a plurality of silicon wafers, wherein each of the plurality of silicon wafers is connected to a portion of the first connecting plate and a portion of the second connecting plate;

[0011] A holding module is used to carry the plurality of silicon wafers by contacting the second connecting plate after wire cutting during the removal of the plurality of silicon wafers from the wire cutting equipment.

[0012] In some optional examples, the retaining module includes a base plate and a clamping member for securing the wire-cut second connecting plate to the base plate.

[0013] In some optional examples, the holding module further includes an alignment member for aligning the portions of the wire-cut second connecting plate horizontally, thereby aligning the centers of the plurality of silicon wafers horizontally.

[0014] In some optional examples, the holding module is configured to support the plurality of silicon wafers in a manner that keeps the plurality of silicon wafers in an upright position.

[0015] In some alternative examples, the first connecting plate is connected to the base plate by an adhesive, and

[0016] The auxiliary device includes a heating module, which is used to heat the connection position between the base and the first connecting plate to melt the adhesive, thereby allowing the first connecting plate to be separated from the base after wire cutting.

[0017] In some alternative examples, the base includes a plurality of downwardly opening grooves formed on the lower surface of the base, the plurality of grooves being arranged along the base such that each groove corresponds in the vertical direction to a cutting segment in the array of cutting segments, such that each cutting segment in the array of cutting segments enters one of the grooves after cutting the first connecting plate.

[0018] In some alternative examples, when the first connecting plate is connected to the base via adhesive, at least a portion of the plurality of grooves are filled with the adhesive.

[0019] Secondly, embodiments of this disclosure provide a wire cutting device, the wire cutting device including auxiliary devices according to the first aspect.

[0020] Thirdly, embodiments of this disclosure provide a wire cutting method, which is performed using a wire cutting device according to the second aspect, the wire cutting method comprising:

[0021] A silicon rod connected to a second connecting plate is connected to the lower surface of a base via a first connecting plate, wherein the axial direction of the silicon rod connected to the lower surface of the base is horizontal, and the second connecting plate is opposite to the first connecting plate in the diametrical direction of the silicon rod.

[0022] The silicon rod, the first connecting plate, and the second connecting plate are cut by a single wire cutting operation using the array of cutting segments to obtain a plurality of silicon wafers, wherein each of the plurality of silicon wafers is connected to a portion of the first connecting plate and a portion of the second connecting plate;

[0023] While the holding module carries the plurality of silicon wafers on the second connecting plate after contact wire cutting, the plurality of silicon wafers are removed from the wire cutting equipment.

[0024] In some optional examples, the use of the holding module to carry the plurality of silicon wafers via the second connecting plate after contact wire cutting includes: using the clamping members of the holding module to fix the wire-cut second connecting plate to the base plate of the holding module.

[0025] In some optional examples, the use of the holding module to carry the plurality of silicon wafers on the second connecting plate after wire cutting includes: aligning portions of the wire-cut second connecting plate horizontally using the alignment members of the holding module, thereby aligning the centers of the plurality of silicon wafers horizontally.

[0026] In some alternative examples, the use of a holding module to carry the plurality of silicon wafers via the second connecting plate after being cut by the contact line includes: the holding module carrying the plurality of silicon wafers in a manner that keeps the plurality of silicon wafers in an upright position.

[0027] In some optional examples, connecting the silicon rod with the second connecting plate to the substrate via the first connecting plate includes: attaching the first connecting plate to the lower surface of the substrate using an adhesive, and

[0028] The removal of the plurality of silicon wafers from the wire cutting equipment includes: using a heating module to heat the connection position between the base and the first connecting plate to melt the adhesive, thereby allowing the first connecting plate to separate from the base after wire cutting.

[0029] In some optional examples, the step of using the array of cutting segments to wire-cut the silicon rod, the first connecting plate, and the second connecting plate in a single wire-cutting operation to obtain multiple silicon wafers includes:

[0030] After each cutting segment in the cutting segment array cuts the first connecting plate, it enters one of a plurality of downwardly open grooves formed on the lower surface of the base, wherein the plurality of grooves are arranged along the base such that each groove corresponds in the vertical direction to one of the cutting segments in the cutting segment array.

[0031] In some alternative examples, connecting the silicon rod with the second connecting plate to the base via the first connecting plate includes filling at least a portion of the plurality of grooves with the adhesive.

[0032] Fourthly, embodiments of this disclosure provide a silicon wafer obtained by using a wire cutting method according to the third aspect.

[0033] This disclosure provides an auxiliary device, wire cutting equipment and method, and silicon wafers for a wire cutting machine. The auxiliary device includes a base, a first connecting plate for connecting a silicon rod to the base, a second connecting plate connected to the silicon rod, and a holding module for holding multiple silicon wafers obtained from the wire cutting operation. Because of the holding module, after the cutting line array of the wire cutting machine has wire-cut the silicon rod into multiple silicon wafers, the cutting line array can be held in the position at the end of the wire cutting operation, and the multiple silicon wafers can be removed from the wire cutting machine while the holding module holds the multiple silicon wafers. That is, it is not necessary to completely separate the silicon wafers from the wire cutting machine after the cutting line array has withdrawn from the gap between adjacent silicon wafers, thereby avoiding damage to the surface of the silicon wafers caused by the cutting wires. Furthermore, the holding module holds the silicon wafers by contacting the second connecting plate connected to the silicon wafers, without direct contact with the silicon wafers, so the holding module will not damage the silicon wafers. Attached Figure Description

[0034] Figure 1 A schematic diagram of a wire cutting device provided in an embodiment of this disclosure;

[0035] Figure 2 A schematic diagram of a wire cutting device provided for another embodiment of this disclosure;

[0036] Figure 3 A perspective view of a portion of the auxiliary device provided in an embodiment of this disclosure;

[0037] Figure 4 A perspective view of a portion of an auxiliary device provided in another embodiment of this disclosure;

[0038] Figure 5 A schematic diagram of a wire cutting device provided for yet another embodiment of this disclosure;

[0039] Figure 6 for Figure 5 A magnified view of a portion of the image;

[0040] Figure 7 A flowchart of a wire cutting method provided in an embodiment of this disclosure. Detailed Implementation

[0041] The technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings.

[0042] See Figure 1 This illustrates a schematic diagram of a wire cutting apparatus 1 provided in some embodiments of the present disclosure. It will be understood that... Figure 1 The structure shown is for illustrative purposes only and does not imply that those skilled in the art will not be able to apply it to specific implementations. Figure 1 The present disclosure does not impose specific limitations on the addition or reduction of components in the illustrated composition structure.

[0043] Depend on Figure 1 As shown, the wire cutting device 1 may include a wire cutting unit 11 and a support unit 12. In some embodiments of this disclosure, the wire cutting unit 11 may be located below the support unit 12 in the vertical direction. The wire cutting unit 11 may also be located above the support unit 12 in the vertical direction, which will not be elaborated here.

[0044] The wire cutting unit 11 may include a plurality of spools 111 and cutting wires 112, the cutting wires 112 being wound around the spools 111 to form an array of mutually parallel cutting segments. (See below for reference.) Figure 1 The following explanation uses two spools 111 as an example. The reciprocating motion directions of the spools 111 and the cutting wire 112 towards and away from the bearing unit 12 are as follows: Figure 1 As shown by the solid arrow in the diagram, the reciprocating speed can be, for example, 10 m / s to 15 m / s. The support unit 12 is used to load and fix the silicon rod S to be processed. Figure 1 and Figure 2 In the example shown, the support unit 12 may include a worktable 121 and an intermediate component 122. The silicon rod to be processed S can be fixed to the worktable 121 via the intermediate component 122, for example, the silicon rod to be processed can be fixed to the worktable by bonding its circumferential surface to the lower surface of the worktable.

[0045] for Figure 1The wire cutting device 1 shown can bring the silicon rod to be processed closer to the cutting line array by moving the support unit 12 vertically toward the cutting line array. After the cutting line array comes into contact with the silicon rod to be processed, the silicon rod to be processed is cut by the movement of each cutting line array along its extension direction and the continued feed movement of the support unit 12 vertically toward the cutting line array. It should be noted that the movement of the wire support unit 12 is achieved by a lifting device (not shown in the figure) in this embodiment. It is understood that those skilled in the art can also achieve the movement of the support unit 12 in other ways according to actual needs and implementation scenarios, which will not be described in detail in this embodiment.

[0046] In order to cut the silicon ingot S into multiple independent silicon wafers, at least a portion of the intermediate piece 122 will continue to be cut after the dicing line array has finished cutting the silicon ingot. Therefore, after a single wire cutting operation is completed, the dicing line array is located in the intermediate piece 122, and may even be located in the worktable 121 due to cutting into the worktable 121, while the silicon wafers obtained by wire cutting are respectively fixed to the worktable 121 via the intermediate piece 122.

[0047] After the silicon ingot S is cut into multiple silicon wafers, the wafers need to be removed from the wire cutting equipment 1 to perform subsequent operations on them. Given the above, the dicing line array needs to be separated from the wafers, the worktable 121, and the intermediate component 122 before removing the wafers.

[0048] Since the dicing wires are typically used in subsequent wire cutting operations, the dicing wire array is usually not destroyed. Instead, the supporting unit 12 moves the silicon wafer away from the dicing wire array in the opposite direction to the feed direction, allowing each dicing wire segment in the array to gradually separate from the silicon wafer, the stage 121, and the intermediate piece 122 through the gaps between adjacent silicon wafers formed by its cutting. However, during this separation process, the dicing wire segments inevitably damage the surface of the adjacent silicon wafers, which may directly lead to the scrapping of some silicon wafers in severe cases, increasing processing and material costs. In addition, the dicing wire segments may also be sandwiched between adjacent silicon wafers. If this situation is not detected in time, further separation may cause the dicing wire segment to break, ultimately causing the entire dicing wire array to fail and making it impossible to continue subsequent wire cutting operations.

[0049] In view of the above, the present disclosure aims to provide an auxiliary device, wire cutting equipment and method, and silicon wafer for a wire cutting equipment. With this auxiliary device, damage to the silicon wafer surface and destruction of the cutting wires can be avoided during the removal of the silicon wafer obtained from the multi-wire-cut silicon rod from the wire cutting equipment, thus achieving safe unloading of the silicon wafer from the wire cutting equipment.

[0050] See Figure 2 This disclosure provides an auxiliary device 2 for a wire cutting equipment 1. The auxiliary device 2 includes a base 21, a first connecting plate 22, a second connecting plate 23, and a holding module 24. The base 21 is fixed to the wire cutting equipment 1 and is located above the cutting segment array AR of the wire cutting equipment 1. The first connecting plate 22 is configured to connect a silicon rod S to the lower surface of the base in a horizontal manner along the axial direction of the silicon rod S. The second connecting plate 23 is connected to the silicon rod S and is opposite to the first connecting plate 22 in the diametrical direction of the silicon rod S, such that the cutting segment array AR can wire cut the silicon rod S, the first connecting plate 22, and the second connecting plate 23 in a single wire cutting operation to obtain a plurality of silicon wafers W, wherein each of the plurality of silicon wafers W is connected to a portion of the first connecting plate 22 and a portion of the second connecting plate 23. The holding module 24 is used to carry the plurality of silicon wafers by contacting the wire-cut second connecting plate 23 during the removal of the plurality of silicon wafers W from the wire cutting equipment 1.

[0051] It should be noted that in the various embodiments of this disclosure, the term "horizontal direction" refers to a direction parallel to the ground, and the term "vertical direction" refers to a direction perpendicular to the ground.

[0052] like Figure 2 As shown, the wire EDM apparatus 1 includes a cutting segment array AR formed by winding a cutting wire 112 onto a spool 111. A base 21 is detachably fixed to a lifting device (not shown) of the wire EDM apparatus 1 by means of, for example, threaded fasteners, and can always be positioned above the cutting segment array AR. The base 21 can be moved downwards toward the cutting segment array AR under the drive of the lifting device to perform the cutting operation.

[0053] Before being loaded into the wire cutting equipment 1, the silicon rod S can be connected to the first connecting plate 22 and the second connecting plate 23 respectively. The lengths of the first connecting plate 22 and the second connecting plate 23 are greater than or equal to the axial length of the silicon rod S, and both are connected to the outer peripheral surface of the silicon rod S in a manner parallel to the central axis of the silicon rod S. When connected to the silicon rod S, the first connecting plate 22 is on one side of the silicon rod S in the diametrical direction, and the second connecting plate 23 is on the other side of the silicon rod S in the diametrical direction.

[0054] One side of the first connecting plate 22 is connected to the silicon rod S, and the opposite side is connected to the lower surface of the base 21. Thus, the assembly consisting of the silicon rod S, the first connecting plate 22, and the second connecting plate 23 is connected to the base 21 and is thus loaded onto the wire cutting equipment 1. After being loaded onto the wire cutting equipment 1, the second connecting plate 23 can be positioned directly below the silicon rod S.

[0055] When wire cutting equipment 1 is used to wire cut silicon rod 1, as silicon rod S moves vertically downward toward the cutting segment array AR, the cutting segment array AR will first contact the second connecting plate 23. That is, the second connecting plate 23 is in the cutting position. After the cutting segment array AR cuts through the second connecting plate 23 vertically, the cutting segment array AR begins to cut silicon rod S. As the cutting of silicon rod S nears completion, the cutting segment array AR begins to contact the first connecting plate 22 and cuts the first connecting plate 22. Until the first connecting plate 22 is cut through by each cutting segment in the cutting segment array AR, the lifting device can stop working, the cutting line 112 can also stop moving, and the single wire cutting operation ends. At this time, silicon rod S has been completely cut into multiple silicon wafers W. Similarly, the first connecting plate 22 is cut into multiple segments equal to the number of silicon wafers, and the second connecting plate 23 is also cut into multiple segments equal to the number of silicon wafers. Since the lengths of the first connecting plate 22 and the second connecting plate 23 are both greater than or equal to the circumferential length of the silicon rod S, after all three are cut, each silicon wafer W is connected to a portion of the first connecting plate 22 and a portion of the second connecting plate 23 at two opposite positions in the diametrical direction on its outer periphery.

[0056] Figure 2 The image shows the state of wire EDM equipment 1 at the end of a single wire EDM operation. (Example:) Figure 2 As shown, the silicon rod S, the first connecting plate 22, and the second connecting plate 23 are all cut through in the vertical direction, and the cutting segment array AR has at least partially entered the base 21. At this time, the cutting segment array AR is still wound on the spool 111 in preparation for the next wire cutting operation. For clarity, only one spool 111 is shown in the figure. It will be understood that the wire cutting device 1 includes at least two spools 111.

[0057] For the wire cutting equipment 1 including the auxiliary device 2 provided in the embodiments of this disclosure, all silicon wafers W obtained through a single wire cutting operation can be unloaded from the wire cutting equipment 1 at once by separating the first connecting plate 22 from the base 21. Specifically, before performing the unloading operation, the silicon wafers W can be supported from below by the holding module 24. Since each silicon wafer W is connected to a portion of the second connecting plate 23 below, the holding module 24 only contacts the second connecting plate 23 and does not contact any of the silicon wafers W, thus avoiding damage to the silicon wafers W caused by the holding module 24 directly applying stress to the silicon wafers W.

[0058] Once the silicon wafer W is reliably held by the holding module 24, the wafer unloading operation can be performed. Specifically, the upper surface of the first connecting plate 22 can be separated from the lower surface of the base 21. During the unloading operation, the spool 111 and the cutting segment array AR remain stationary. That is, at least a portion of each cutting segment in the cutting segment array AR remains within the base 21. However, this does not affect the wafer unloading operation. Once the upper surface of the first connecting plate 22 separates from the lower surface of the base 21, the assembly consisting of the silicon wafer W, the first connecting plate 22, the second connecting plate 23, and the holding module 24 is separated from the other components of the wire cutting equipment 1 and can be moved away from the other components of the wire cutting equipment 1.

[0059] Until the silicon wafer W is completely unloaded from the wire cutting equipment 1, at least a portion of each diced segment remains in the base 21. At this point, the base 21 can be driven vertically upwards away from the diced segment array AR by a lifting device, allowing the diced segment array AR to separate from the base 21. Since the diced segment array AR does not cut too deeply into the base 21, the base 21 does not exert much resistance on the diced segments during the separation process, thus greatly reducing the risk of damage or breakage of the diced wire. Furthermore, and more importantly, by using the auxiliary device 2 provided in this embodiment, unlike conventional unloading methods, the diced wire does not need to exit through the narrow gap between the suspended silicon wafers. Instead, after a single wire cutting operation, the diced wire will no longer have any contact with the silicon wafer, thus preventing any damage to the silicon wafer.

[0060] This disclosure provides an auxiliary device 2 for a wire cutting equipment. The auxiliary device 2 includes a base 21, a first connecting plate 22 for connecting a silicon rod S to the base 21, a second connecting plate 23 connected to the silicon rod S, and a holding module 24 for holding a plurality of silicon wafers W obtained from the wire cutting operation. Because of the holding module 24, after the cutting line array AR of the wire cutting equipment wire-cuts the silicon rod S into a plurality of silicon wafers W, the cutting line array AR can be held at the position at the end of the wire cutting operation, and the plurality of silicon wafers W can be removed from the wire cutting equipment while the holding module 24 holds the plurality of silicon wafers W. That is, it is not necessary to completely separate the silicon wafers W from the silicon wafers W after the cutting line array AR has withdrawn from the gap between adjacent silicon wafers W, thereby avoiding damage to the surface of the silicon wafers W by the cutting wire. Furthermore, the holding module 24 holds the silicon wafers W by contacting the second connecting plate 23 connected to the silicon wafers W, without direct contact with the silicon wafers W, therefore the holding module 24 will not cause damage to the silicon wafers W.

[0061] As explained above, since the first connecting plate 22 and the second connecting plate 23 are also cut into multiple segments during the wire cutting operation, after the silicon wafer W is unloaded from the wire cutting equipment 1, and even at the moment the first connecting plate 22 separates from the base 21, the silicon wafer W is no longer connected to each other, but can move relative to each other. Therefore, the difficulty of holding the silicon wafer W in subsequent transfer operations increases.

[0062] The desired outcome is that during transport, the set of silicon wafers obtained from cutting individual silicon rods can maintain a relatively neat arrangement. Damage to the silicon wafer surface due to friction between wafers should be avoided, and individual wafers should not fall off.

[0063] In this regard, according to some embodiments of this disclosure, such as Figure 3 As shown, the retaining module 24 may include a base plate 241 and a clamping member 242 for fixing the wire-cut second connecting plate 23 to the base plate 241.

[0064] When silicon wafer W is unloaded from wire cutting equipment 1, retaining module 24 contacts second connecting plate 23 through its upper surface to carry the wire-cut first connecting plate 22 and second connecting plate 23, as well as silicon wafer W. Figure 3 As shown, for example, four clamping members 242 can be provided, wherein two clamping members are located on one side of a set of silicon wafers W in the axial direction, and the other two clamping members are located on the other side of this set of silicon wafers W in the axial direction. The clamping members 242 can be configured to be connected to the base plate 241 and are movable relative to the base plate 241 in the horizontal direction, while being fixed relative to the base plate 241 in other directions.

[0065] Before carrying this set of silicon wafers, the four clamping members 242 can be adjusted horizontally relative to the base plate to surround a predetermined carrying area, thereby pre-defining a larger carrying position. When the holding module 24 carries this set of silicon wafers at the predetermined carrying position on the base plate 241, the clamping members 242 can be brought closer to the silicon wafers. When the clamping members 242 are moved to contact the two silicon wafers located at the two ends of the axial direction of this set of silicon wafers and apply an axial force to these two silicon wafers to bring the set of silicon wafers together, the clamping members 242 can be kept fixed relative to the base plate 241, thereby preventing mutual damage between the silicon wafers and accidental drop of the silicon wafers during transport.

[0066] It is understood that other methods can be used to hold the silicon wafer, and the clamping device is not limited to the above embodiments.

[0067] To further prevent damage to the silicon wafers during transport, see [link / reference]. Figure 4The retaining module 24 also includes an alignment member 243, which is used to align the various portions of the wire-cut second connecting plate 23 in the horizontal direction, thereby aligning the centers of the plurality of silicon wafers W in the horizontal direction.

[0068] exist Figure 4 In the embodiment shown, the alignment member 243 is rod-shaped and two alignment members 243 are provided. Each alignment member 243 can penetrate through various portions of the second connecting plate 23 in the axial direction. In this case, a through hole can be pre-formed on the second connecting plate 23, and the alignment member 243 is passed through the through hole when the holding module 24 begins to carry the silicon wafer W. The diameter of the through hole can be slightly larger than the outer diameter of the alignment member 243 to facilitate the passage of the alignment member 243.

[0069] By using the alignment member 243, the various parts of the second connecting plate 23 can be directly aligned, thereby assembling the second connecting plate 23 into its shape before wire cutting. Given the connection relationship between the second connecting plate 23 and the silicon rod S, when the various parts of the second connecting plate 23 are aligned and assembled into its shape before wire cutting, the centers of each silicon wafer W can also be aligned along the axial direction, thereby assembling into the shape of the silicon rod S. In other words, during the transfer of silicon wafers W, each silicon wafer W can be arranged in a neat, center-aligned state. This not only better prevents the silicon wafers from rubbing against each other and accidentally falling off, but also facilitates subsequent operations such as debonding and cleaning of the silicon wafers.

[0070] It is understood that the alignment member 243 may also take other forms, and is not limited to the above embodiments.

[0071] According to some embodiments of this disclosure, the holding module 24 is configured to support the multiple silicon wafers W in a way that keeps the multiple silicon wafers W in an upright position, thereby making it easier to avoid contact between adjacent silicon wafers.

[0072] To facilitate the unloading of the silicon wafer, according to some embodiments of this disclosure, see [link to relevant documentation]. Figure 5 and Figure 6 The first connecting plate 22 is connected to the base 21 by an adhesive, and the auxiliary device 2 includes a heating module 25, which is used to heat the connection position between the base 21 and the first connecting plate 22 to melt the adhesive, thereby allowing the first connecting plate 22 to be separated from the base 21 after wire cutting.

[0073] As an example, the heating module 25 can be disposed within the base 21, near the surface of the base 21 used for connection with the first connecting plate 22. Of course, the heating module 25 can also be disposed in other locations relative to the base 21. When the unloading operation begins and the silicon wafer is already supported by the holding module 24, the heating module 25 can be activated, the adhesive melts upon heating, causing the connection between the first connecting plate 22 and the base 21 to fail. Ultimately, the first connecting plate 22 is completely separated from the base 21.

[0074] By using adhesive to connect the first connecting plate 22 and the base 21 and adding a heating module 25, no additional operations need to be performed on the first connecting plate 22 and the base 21, which not only improves the silicon wafer unloading efficiency but also saves labor costs. In addition, the heating module 25 is built into the base 21, which also avoids interference from other components of the wire cutting equipment with the unloading operation.

[0075] As mentioned above, in order for each dicing segment in the dicing segment array AR to cut through the first connecting plate 22, the dicing segment array AR inevitably cuts into the base 21. In order to support the silicon rod, the base 21 is usually made of metal, and the cutting of the base 21 by the dicing segment array AR often encounters great resistance, which may even cause the dicing lines to break.

[0076] In this regard, such as Figure 6 As shown, according to some embodiments of the present disclosure, the base 21 may include a plurality of downwardly open grooves 211 formed on the lower surface of the base 21. The plurality of grooves 211 are arranged along the base 21 such that each groove 211 corresponds in the vertical direction to a cutting segment in the cutting segment array AR, such that each cutting segment in the cutting segment array AR enters one of the grooves 211 after cutting the first connecting plate 22.

[0077] The number of grooves 211 can be the same as the number of cutting segments. When both the cutting line and the base are installed on the wire cutting equipment 1, the grooves 211 correspond one-to-one with the cutting segments in the vertical direction. This ensures that when a cutting segment cuts through the first connecting plate 22, each segment can enter its corresponding groove 211 without requiring the base 21 to be cut. This significantly reduces the load on the cutting segments at the end of the cutting operation, accelerates the wire cutting process, and improves wire cutting efficiency.

[0078] The grooves 211 are designed to facilitate both wire cutting and wafer unloading operations. According to some embodiments of this disclosure, when the first connecting plate 22 is connected to the base 21 by adhesive, at least a portion of the grooves 211 are filled with adhesive. According to other embodiments of this disclosure, when the first connecting plate 22 is connected to the base 21 by adhesive, each of the grooves 211 is filled with adhesive.

[0079] Filling the groove 211 with adhesive improves the reliability of the connection between the first connecting plate 22 and the base 21. In addition, the adhesive filling the groove 211 can also melt under the heating action of the heating module 25, without causing additional operations for unloading the silicon wafer.

[0080] Embodiments of this disclosure also provide a wire cutting device 1, which includes auxiliary devices 2 as described above.

[0081] Some embodiments of this disclosure also provide a wire cutting method, which is performed using the wire cutting equipment 1 described above, see [link to previous document]. Figure 7 Wire cutting methods include:

[0082] S01: The silicon rod S connected to the second connecting plate 23 is connected to the lower surface of the base 21 via the first connecting plate 22, wherein the axial direction of the silicon rod S connected to the lower surface of the base 21 is horizontal, and the second connecting plate 23 is opposite to the first connecting plate 22 in the diameter direction of the silicon rod S.

[0083] S02: Using the cutting line segment array AR, a silicon rod S, a first connecting plate 22 and a second connecting plate 23 are cut by a single line cutting operation to obtain a plurality of silicon wafers W, wherein each of the plurality of silicon wafers W is connected to a part of the first connecting plate 22 and a part of the second connecting plate 23.

[0084] S03: While the holding module 24 carries the plurality of silicon wafers W through the second connecting plate 23 after contact wire cutting, the plurality of silicon wafers W are removed from the wire cutting equipment.

[0085] According to some embodiments of this disclosure, the method of using the holding module 24 to support the plurality of silicon wafers W via the second connecting plate 23 after contact wire cutting includes: using the clamping member 242 of the holding module 24 to fix the wire-cut second connecting plate 23 to the base plate 241 of the holding module 24.

[0086] According to some embodiments of this disclosure, the method of using the holding module 24 to carry the plurality of silicon wafers W through the second connecting plate 23 after contact wire cutting includes: aligning the various parts of the second connecting plate 23 after wire cutting in the horizontal direction by the alignment member 243 of the holding module 24, thereby aligning the centers of the plurality of silicon wafers W in the horizontal direction.

[0087] According to some embodiments of this disclosure, the use of the holding module 24 to support the plurality of silicon wafers W via the second connecting plate 23 after contact wire cutting includes: the holding module 24 supporting the plurality of silicon wafers W in a manner that keeps the plurality of silicon wafers W in an upright state.

[0088] According to some embodiments of this disclosure, connecting the silicon rod S, to the base 21 via the first connecting plate 22 and the second connecting plate 23, includes: connecting the first connecting plate 22 to the lower surface of the base 21 using an adhesive, and

[0089] The removal of the plurality of silicon wafers W from the wire cutting equipment includes: using a heating module to heat the connection position between the base plate 21 and the first connecting plate 22 to melt the adhesive, thereby allowing the first connecting plate 22 to separate from the base plate 21 after wire cutting.

[0090] According to some embodiments of this disclosure, the method of using a cutting segment array AR to wire cut a silicon rod S, a first connecting plate 22, and a second connecting plate 23 in a single wire cutting operation to obtain multiple silicon wafers W includes:

[0091] After each cutting segment in the cutting segment array AR cuts the first connecting plate 22, it enters one of a plurality of downwardly open grooves formed on the lower surface of the base 21, wherein the plurality of grooves are arranged along the base 21 such that each groove corresponds in the vertical direction to one of the cutting segments in the cutting segment array AR.

[0092] According to some embodiments of this disclosure, connecting the silicon rod S connected to the second connecting plate 23 to the base 21 via the first connecting plate 22 includes: filling at least a portion of the plurality of grooves with an adhesive.

[0093] Some embodiments of this disclosure also provide a silicon wafer W obtained by using a wire cutting method as described above.

[0094] It should be noted that the technical solutions described in the embodiments of this disclosure can be combined arbitrarily without conflict.

[0095] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An auxiliary device for wire EDM equipment, characterized in that, The auxiliary device includes: A base, the base being fixed to the wire cutting equipment and located above the array of cutting segments of the wire cutting equipment; A first connecting plate is configured to connect a silicon rod to the lower surface of the base in a horizontal manner along the axial direction of the silicon rod. A second connecting plate is connected to the silicon rod and is opposite to the first connecting plate in the diameter direction of the silicon rod, such that the cutting segment array can cut the silicon rod, the first connecting plate and the second connecting plate in a single wire cutting operation to obtain a plurality of silicon wafers, wherein each of the plurality of silicon wafers is connected to a portion of the first connecting plate and a portion of the second connecting plate; A holding module is configured to support the plurality of silicon wafers by contacting the second connecting plate after wire cutting during the removal of the plurality of silicon wafers from the wire cutting equipment. The retaining module includes a base plate and a clamping member for fixing the wire-cut second connecting plate to the base plate. The holding module further includes an alignment member for aligning the portions of the wire-cut second connecting plate horizontally, thereby aligning the centers of the plurality of silicon wafers horizontally. The first connecting plate is connected to the base plate by an adhesive. The auxiliary device also includes a heating module for melting the adhesive, thereby allowing the first connecting plate after wire cutting to separate from the base.

2. The auxiliary device according to claim 1, characterized in that, The holding module is configured to support the plurality of silicon wafers in an upright position.

3. The auxiliary device according to claim 1, characterized in that, The heating module is used to heat the connection point between the base and the first connecting plate to melt the adhesive.

4. The auxiliary device according to claim 3, characterized in that, The base includes a plurality of downwardly opening grooves formed on the lower surface of the base. The plurality of grooves are arranged along the base such that each groove corresponds in the vertical direction to a cutting segment in the cutting segment array, such that each cutting segment in the cutting segment array enters one of the grooves after cutting the first connecting plate.

5. The auxiliary device according to claim 4, characterized in that, When the first connecting plate is connected to the base via adhesive, at least a portion of the plurality of grooves are filled with the adhesive.

6. A wire cutting device, characterized in that, The wire cutting equipment includes an auxiliary device according to any one of claims 1 to 5.

7. A wire cutting method, characterized in that, The wire cutting method is performed using the wire cutting equipment according to claim 6, the wire cutting method comprising: A silicon rod connected to a second connecting plate is connected to the lower surface of a base via a first connecting plate, wherein the axial direction of the silicon rod connected to the lower surface of the base is horizontal, and the second connecting plate is opposite to the first connecting plate in the diametrical direction of the silicon rod. The silicon rod, the first connecting plate, and the second connecting plate are cut by a single wire cutting operation using the array of cutting segments to obtain a plurality of silicon wafers, wherein each of the plurality of silicon wafers is connected to a portion of the first connecting plate and a portion of the second connecting plate; While the holding module carries the plurality of silicon wafers on the second connecting plate after contact wire cutting, the plurality of silicon wafers are removed from the wire cutting equipment. The step of using the holding module to support the plurality of silicon wafers via the second connecting plate after contact wire cutting includes: using the clamping components of the holding module to fix the wire-cut second connecting plate to the base plate of the holding module. The method of using the holding module to support the plurality of silicon wafers on the second connecting plate after wire cutting further includes: aligning the various parts of the wire-cut second connecting plate horizontally using the alignment components of the holding module, thereby aligning the centers of the plurality of silicon wafers horizontally. The first connecting plate is connected to the lower surface of the base plate by an adhesive, and The adhesive is melted by a heating module, thereby allowing the first connecting plate after wire cutting to separate from the base.

8. The wire cutting method according to claim 7, characterized in that, The method of using the holding module to support the multiple silicon wafers via the second connecting plate after being cut by the contact line includes: the holding module supporting the multiple silicon wafers in a way that keeps the multiple silicon wafers in an upright state.

9. The wire cutting method according to claim 7, characterized in that, The heating module is used to heat the connection point between the base and the first connecting plate to melt the adhesive.

10. The wire cutting method according to claim 9, characterized in that, The step of using the array of cutting segments to wire-cut the silicon rod, the first connecting plate, and the second connecting plate in a single wire-cutting operation to obtain multiple silicon wafers includes: After each cutting segment in the cutting segment array cuts the first connecting plate, it enters one of a plurality of downwardly open grooves formed on the lower surface of the base, wherein the plurality of grooves are arranged along the base such that each groove corresponds in the vertical direction to one of the cutting segments in the cutting segment array.

11. The wire cutting method according to claim 10, characterized in that, The step of connecting the silicon rod, which is connected to the second connecting plate, to the base via the first connecting plate includes: filling at least a portion of the plurality of grooves with the adhesive.

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