Electronic component inspection apparatus and method, and computer readable storage medium

Abstract

This invention provides an electronic component detection apparatus, an electronic component detection method, and a computer-readable storage medium with improved accuracy in determining the presence or absence of electronic components. The electronic component detection apparatus includes: a holding unit having an optical path that is blocked when holding an electronic component; a light-projecting unit that projects sensor light into the optical path; a light-receiving unit that receives the sensor light that has passed through the optical path; a driving unit that changes the relative position of the holding unit relative to the light-receiving unit; and a determination unit that determines the presence or absence of an electronic component based on the amount of light received in the light-receiving unit. The determination unit stores the relationship between changes in the amount of light received corresponding to changes in the relative position when the holding unit does not hold the electronic component, and determines a detectable position range from the relative position where the amount of light received exceeds a threshold based on the relationship, and determines the timing for determining the presence or absence of an electronic component from the determined detectable position range.

Description

Technical Field

[0001] This application relates to an electronic component testing device, an electronic component testing method, and a computer-readable storage medium. Background Technology

[0002] Devices that pick up electronic components such as silicon dies sometimes include electronic component detection devices that determine whether the electronic components have been picked up or released correctly.

[0003] For example, Patent Document 1 discloses a die bonder, which includes: a processing head including an adsorption device for adsorbing dies; an adsorption flow detection circuit including a detection flow path and a bypass flow path equipped with a flow sensor; an air suction member for drawing air via the adsorption flow detection circuit; and a control unit for determining whether the die is adsorbed onto the adsorption device based on the detection result of the flow sensor.

[0004] [Existing Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2014-179556 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] However, in the core bonding machine described in Patent Document 1, the adsorption device gradually deforms due to use, resulting in changes in the flow rate of the suction air and a decrease in the accuracy of the judgment.

[0009] This invention was made in view of this situation, and the purpose of this invention is to provide an electronic component detection device, an electronic component detection method, and a computer-readable storage medium with improved accuracy in determining the presence or absence of electronic components.

[0010] [Technical means to solve the problem]

[0011] An embodiment of the electronic component detection apparatus of this application includes: a holding unit configured to hold an electronic component and having a light path that is blocked when holding the electronic component; a light projection unit that projects sensor light into the light path of the holding unit; a light receiving unit that receives sensor light passing through the light path of the holding unit; a driving unit that causes the relative position of the holding unit relative to the light receiving unit to change; and a determination unit that determines whether there is an electronic component in the holding unit based on the amount of light received in the light receiving unit. The determination unit stores the relationship between the change in the amount of light received in the light receiving unit and the change in the relative position when the holding unit does not hold an electronic component. Based on the relationship, it determines a detectable position range from the relative position where the amount of light received in the light receiving unit exceeds a threshold, and determines the timing for determining whether there is an electronic component from the determined detectable position range.

[0012] According to the embodiment described above, the presence or absence of electronic components in the holding section is determined based on the change in the amount of light received when the light path is blocked by electronic components. Therefore, even if the holding section deteriorates over time due to deformation or other reasons, the amount of light received will change sufficiently as long as electronic components are held, thus allowing for accurate determination of the presence or absence of electronic components in the holding section. Furthermore, a detectable position range that ensures sufficient light received is determined based on the relationship between changes in relative position and changes in the amount of light received, and the timing of the determination is determined accordingly. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting and light-receiving sections, an appropriate timing of the determination can be determined, thereby suppressing detection defects.

[0013] In the embodiment described above, the determination unit may determine whether there are electronic components in the holding unit based on a comparison between the amount of light received in the light-receiving unit and a threshold value during the determination process.

[0014] According to the embodiments described, the presence or absence of electronic components can be determined at an appropriate time, thereby suppressing detection defects.

[0015] In the embodiment described above, the determination unit may store the relative position where the amount of light received in the light-receiving section changes from a state below a threshold to a state above a threshold when the holding section does not hold the electronic component as a first timing point, and store the relative position where the amount of light received in the light-receiving section changes from a state above a threshold to a state below a threshold when the holding section does not hold the electronic component as a second timing point, and calculate and store the relative position between the first timing point and the second timing point as a determination timing point.

[0016] According to the embodiment described, since the determination timing has a greater time delay than the first and second determination timings, even if the detectable position range changes after the determination timing is determined, the determination timing is unlikely to deviate from the detectable position range. Therefore, sufficient light intake can be ensured during the determination timing, suppressing detection defects.

[0017] In the embodiment described above, the determination unit may store the relative position where the amount of light received in the light-receiving unit reaches its maximum as the determination time.

[0018] According to the embodiment described, even if the detectable position range changes after the determination timing is made, the reduction in light intake can be suppressed. Therefore, sufficient light intake can be ensured at the determination timing, and poor detection can be suppressed.

[0019] In the embodiment described, the holding part may have an adsorption clamp, and the optical path may be the suction hole of the adsorption clamp.

[0020] According to the embodiment, there is no need to separate the optical path from the mechanism for holding electronic components in the holding part, thus simplifying the structure.

[0021] In the embodiment described, the retaining portion may be included in a bonding head for bonding electronic components to a substrate.

[0022] In the embodiment described above, the determination unit may determine whether there are electronic components in the holding unit during the path in which the holding unit transports the electronic components to the substrate.

[0023] According to the described embodiment, the presence or absence of electronic components held for engagement can be detected. For example, if it is determined in advance that electronic components are not held during the journey, unnecessary movement of the joint can be reduced.

[0024] In the embodiment described above, the determination unit may store the relationships in the same path as the destination path and determine the timing of the determination before starting the engagement.

[0025] According to the embodiment, since the relationship between the changes in relative position and the changes in light received in the same path as the actual path is stored, the accuracy of the timing of the determination can be improved.

[0026] In the embodiment described above, the determination unit may determine whether there are electronic components in the holding unit during the return path after the holding unit has transported the electronic components to the substrate.

[0027] According to the embodiment described above, electronic components that remain in the holding section due to bonding failure can be inspected. In this case, the bonding head can either re-transfer the held electronic component to the substrate for bonding or release it into a recycling bin. Therefore, it is possible to prevent damage to electronic components caused by contact between them when picking up the next electronic component while it is still holding it.

[0028] In the embodiment described above, the determination unit may store the relationships between the electronic components in the return path after the holding unit has transported the electronic components to the substrate, and determine the timing of the determination.

[0029] According to the embodiment described above, the timing of the determination can be appropriately adjusted when the bonding process is performed continuously. Therefore, even if the detectable position range changes over time due to variations in the mounting positions and angles of the light-emitting and light-receiving parts during continuous bonding, detection defects can be suppressed.

[0030] In the embodiment described above, the determination unit may determine the threshold based on the amount of light emitted from the light-emitting unit.

[0031] According to the embodiment, even when the amount of light emitted changes, an appropriate detectable location range can be determined, and an appropriate timing for judgment can be decided.

[0032] Another embodiment of the electronic component detection method of this application is an electronic component detection method using an electronic component detection device. The electronic component detection device includes: a holding unit configured to hold an electronic component and having a light path that is blocked when holding the electronic component; a light projection unit that projects sensor light into the light path of the holding unit; a light receiving unit that receives sensor light passing through the light path of the holding unit; a driving unit that causes the relative position of the holding unit relative to the light receiving unit to change; and a determination unit that determines whether there is an electronic component in the holding unit based on the amount of light received in the light receiving unit. The electronic component detection method includes: storing the relationship between the change in the amount of light received in the light receiving unit and the change in the relative position when the holding unit does not hold the electronic component; and determining, based on the relationship, a detectable position range in which the amount of light received in the light receiving unit exceeds a threshold from the relative position, and determining the timing for determining whether there is an electronic component from the determined detectable position range.

[0033] According to the embodiment described above, the presence or absence of electronic components in the holding section is determined based on the change in the amount of light received when the light path is blocked by electronic components. Therefore, even if the holding section deteriorates over time due to deformation or other reasons, the amount of light received will change sufficiently as long as electronic components are held, thus allowing for accurate determination of the presence or absence of electronic components in the holding section. Furthermore, a detectable position range that ensures sufficient light received is determined based on the relationship between changes in relative position and changes in the amount of light received, and the timing of the determination is determined accordingly. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting and light-receiving sections, an appropriate timing of the determination can be determined, thereby suppressing detection defects.

[0034] Another embodiment of the present invention has a computer-readable storage medium storing an electronic component detection program. The electronic component detection program is an electronic component detection program that operates an electronic component detection device, which includes: a holding unit configured to hold an electronic component and having a light path that is blocked when holding the electronic component; a light-projecting unit that projects sensor light into the light path of the holding unit; a light-receiving unit that receives sensor light passing through the light path of the holding unit; a driving unit that causes a change in the relative position of the holding unit relative to the light-receiving unit; and a determination unit that determines whether an electronic component is present in the holding unit based on the amount of light received in the light-receiving unit. The electronic component detection program causes a computer to execute: storing a relationship between changes in the amount of light received in the light-receiving unit corresponding to changes in the relative position when the holding unit does not hold an electronic component; and, based on the relationship, determining a detectable position range from the relative position where the amount of light received in the light-receiving unit exceeds a threshold, and determining a determination timing for determining whether an electronic component is present from the determined detectable position range.

[0035] According to the embodiment described above, the presence or absence of electronic components in the holding section is determined based on the change in the amount of light received when the light path is blocked by electronic components. Therefore, even if the holding section deteriorates over time due to deformation or other reasons, the amount of light received will change sufficiently as long as electronic components are held, thus allowing for accurate determination of the presence or absence of electronic components in the holding section. Furthermore, a detectable position range that ensures sufficient light received is determined based on the relationship between changes in relative position and changes in the amount of light received, and the timing of the determination is determined accordingly. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting and light-receiving sections, an appropriate timing of the determination can be determined, thereby suppressing detection defects.

[0036] [The effects of the invention]

[0037] The present invention provides an electronic component detection device, an electronic component detection method, and a computer-readable storage medium with improved accuracy in determining the presence or absence of electronic components. Attached Figure Description

[0038] Figure 1 This is a diagram showing the structure of an electronic component testing device according to one embodiment.

[0039] Figure 2 This is an enlarged view showing the structure of the joint.

[0040] Figure 3 This is a flowchart illustrating the method for determining the timing of a judgment.

[0041] Figure 4 This is a flowchart illustrating the method for determining the presence or absence of electronic components.

[0042] Figure 5This is a diagram illustrating the methods used to determine the timing of a decision.

[0043] Figure 6 This diagram illustrates the method for determining the presence or absence of electronic components.

[0044] Figure 7 This diagram illustrates the method for determining the presence or absence of electronic components.

[0045] [Explanation of Symbols]

[0046] 1: Electronic component testing equipment

[0047] 10: Pick-up Department

[0048] 11: Chips

[0049] 12: Die (semiconductor chip, electronic component)

[0050] 20: Joining platform

[0051] 21: Lead Frame

[0052] 30: Connector (Retaining Part)

[0053] 31: Light projection department

[0054] 32: Projection Lens

[0055] 33: Adsorption chuck

[0056] 35: Optical Path

[0057] 41: Light-receiving part

[0058] 42: Light-receiving lens

[0059] 50: Drive Unit

[0060] 51: X-axis actuator

[0061] 52: Y-axis actuator

[0062] 53: Z-axis actuator

[0063] 90: Judgment Department

[0064] 91: Head Control Unit

[0065] 92: Lighting / Receiving Control Unit

[0066] 93: Light Quantity Determination Department

[0067] 94: Location Information Storage Department

[0068] 95: Timing Decision Department

[0069] S11, S12, S13, S14, S15, S21, S22, S23, S24, S25: Steps

[0070] SL: Sensor light

[0071] T1: First Opportunity

[0072] T2: Second Opportunity

[0073] TD: Determining the Timing Detailed Implementation

[0074] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The drawings in this embodiment are illustrative, and the dimensions or shapes of the parts are schematic. The technical scope of the present invention should not be limited to the described embodiments.

[0075] <Electronic Component Testing Device>

[0076] First, refer to Figure 1 and Figure 2 The structure of an electronic component testing device 1 according to one embodiment of the present invention will be described. Figure 1 This is a diagram showing the structure of an electronic component testing device according to one embodiment. Figure 2 This is an enlarged view showing the structure of the joint.

[0077] In addition, Figure 1 and Figure 2 In this diagram, for ease of explanation regarding positional relationships and directions of movement, orthogonal coordinates including the X, Y, and Z axes are used. Directions parallel to the X, Y, and Z axes are designated as the X-axis direction, Y-axis direction, and Z-axis direction, respectively. The X-axis direction is perpendicular to the paper, the Y-axis direction is the left-right direction, and the Z-axis direction is the up-down direction.

[0078] Electronic component inspection device 1 is equipped in a packaging apparatus that bonds a die (semiconductor chip) 12 to a lead frame 21, also known as a die bonding machine. Electronic component inspection device 1 inspects the die 12 being transported for bonding and determines whether it is being transported correctly. The die 12 corresponds to an example of an electronic component, and the lead frame 21 corresponds to an example of a substrate.

[0079] Furthermore, the electronic components are not limited to die 12; for example, they may be active components, passive components, or micro-electro-mechanical system (MEMS) devices. The substrate is not limited to lead frame 21; for example, it may be an interposer substrate, semiconductor substrate, or carrier plate.

[0080] The electronic component inspection device 1 includes a pickup unit 10, a bonding stage 20, a bonding head 30, a light-receiving unit 41, a driving unit 50, and a judgment unit 90.

[0081] The pick-up unit 10 transports the wafer 11, which serves as the assembly substrate for the die 12, and supplies the die 12 to the bonding head 30. The pick-up unit 10 is an example of an electronic component supply unit that supplies electronic components. The electronic component supply unit may also be, for example, a tray feeder, a parts feeder, or a tape feeder.

[0082] The bonding stage 20 supplies the lead frame 21. Furthermore, the bonding stage 20 is a platform for bonding the die 12 to the transported lead frame 21. The bonding stage 20 can also function as a moving platform for transporting the lead frame 21. The bonding stage 20 is arranged side-by-side with the pickup unit 10 in the Y-axis direction. The bonding stage 20 is an example of a bonding section that performs the bonding of electronic components to a substrate. A die bonding machine including the electronic component inspection device 1 may, for example, be configured with components not shown, such as a substrate supply unit for supplying substrates housed in a cassette, a loader for removing substrates from the cassette and transporting them to the bonding section, an unloading machine for transporting substrates containing electronic components from the bonding section and housing them in the cassette, a guide rail for sliding and transporting the substrates, or a substrate positioner for aligning the substrates.

[0083] The connector 30 is configured to pick up the die 12. Additionally, the connector 30 is configured to attach the die 12 to the lead frame 21. The connector 30 includes a light-emitting section 31, a suction clamp 33, and an optical path 35.

[0084] The projection section 31 projects sensor light SL onto the optical path 35. The projection section 31 is the sensor head on the side of a pair of sensor heads of the fiber optic sensor that is optically connected to the projection element. The projection section 31 is located at the end of the drive section 50 side of the connector 30. The projection section 31 has a projection lens 32. The projection lens 32 faces the optical path 35 in the Z-axis direction. The projection section 31 projects sensor light SL from the projection lens 32 onto the optical path 35.

[0085] In addition, the projection unit 31 may also include a projection sensor that detects the amount of light projected by the sensor light SL.

[0086] The suction chuck 33 is a holding tool that adsorbs and holds the die 12 at its front end. The suction chuck 33 is located at the end of the coupling head 30 opposite to the drive portion 50. The suction chuck 33 is an example of a holding portion configured to hold electronic components. However, the holding portion is not limited to a suction chuck as long as it can hold electronic components. For example, the holding portion can be an electrostatic chuck for electro-adsorbing electronic components, or a mechanical chuck for mechanically supporting electronic components.

[0087] The optical path 35 is a through hole extending along the Z-axis through at least the suction chuck 33 in the joint 30. The optical path 35 is the suction hole of the suction chuck 33, connected to a suction tool that creates negative pressure in the optical path 35 by suctioning air. Figure 2 As shown, when the die 12 is held in the suction chuck 33, the optical path 35 is blocked. That is, when the die 12 is held in the suction chuck 33, the sensor light SL will not be emitted from the front end of the suction chuck 33; when the die 12 is not held in the suction chuck 33, the sensor light SL will be emitted from the front end of the suction chuck 33.

[0088] In addition, although the illustration is omitted, the connector 30 may also include a suction tool for drawing air from the optical path 35, a heating tool for heating the die 12, a cooling tool for cooling the die 12, and a purge gas supply tool for supplying purge gas to form a non-oxidizing atmosphere.

[0089] The light-receiving unit 41 receives the sensor light SL that has passed through the optical path 35. The light-receiving unit 41 is the sensor head on the side of a pair of sensor heads of the fiber optic sensor that is optically connected to the light-receiving element. The light-receiving element is a photoelectric sensor that outputs an electrical signal of intensity corresponding to the amount of light received. The light-receiving unit 41 has a light-receiving lens 42. In the transport path of the connector 30 and the die 12, the light-receiving lens 42 faces the projection lens 32 in the Z-axis direction, separated by the optical path 35. The light-receiving unit 41 receives the sensor light SL within the light-receiving lens 42.

[0090] The drive unit 50 is an orthogonal robot that moves the coupling head 30 along the X-axis, Y-axis, and Z-axis directions. The drive unit 50 has an X-axis actuator 51, a Y-axis actuator 52, and a Z-axis actuator 53. The X-axis actuator 51 moves the coupling head 30 along the X-axis direction, the Y-axis actuator 52 moves the coupling head 30 along the Y-axis direction, and the Z-axis actuator 53 moves the coupling head 30 along the Z-axis direction.

[0091] When the connector 30 picks up the die 12, the drive unit 50 moves the connector 30 along the X-axis, Y-axis, and Z-axis directions. When the connector 30 transports the die 12 from the pick-up unit 10 to the bonding stage 20, the drive unit 50, for example, fixes the connector 30 in the X-axis direction and moves it along the Y-axis and Z-axis directions. At this time, the drive unit 50 moves the connector 30 along a consistent transport path above the light-receiving unit 41. When the connector 30 bonds the die 12 to the lead frame 21, the drive unit 50 moves the connector 30 along the X-axis, Y-axis, and Z-axis directions.

[0092] Furthermore, the drive unit is not limited to orthogonal robots; for example, it can also be a robotic manipulator. Additionally, the drive unit can move the light-receiving part, or both the light-projecting and light-receiving parts, simply by changing the relative position of the light-projecting part with respect to the light-receiving part.

[0093] When the connector 30 without holding the die 12 is moved, the determination unit 90 determines the position on the Y-axis of the connector 30 as the detectable position range where the light received in the light-receiving section 41 exceeds a threshold. Furthermore, the determination unit 90 determines the timing for determining whether the die 12 is present or absent from the detectable position range. When the connector 30 with the die 12 is moved, the determination unit 90 determines whether the die 12 is present or absent based on a comparison between the light received at the timing of the determination and the threshold. Specifically, when the light received is less than the threshold, the determination unit 90 determines that the die 12 is held in the connector 30; when the light received is greater than the threshold, it determines that the die 12 is not held in the connector 30.

[0094] The determination unit 90 includes a head control unit 91, a light projection / receiving control unit 92, a light intensity determination unit 93, a position information storage unit 94, and a timing determination unit 95. Each part of the determination unit 90 includes computer hardware, software, or a combination thereof. That is, the determination unit 90 is executed by the cooperation of computer hardware, software, or the like. The computer includes a central processing unit (CPU) and a memory. The program of the present invention is stored in the memory. The CPU is configured to implement the functions of the head control unit 91, the light projection / receiving control unit 92, the light intensity determination unit 93, the position information storage unit 94, and the timing determination unit 95 by executing the program stored in the memory.

[0095] The head control unit 91 controls the drive unit 50 to move the coupling head 30 along the X-axis, Y-axis, and Z-axis. In addition, the head control unit 91 can also control the suction tool, heating tool, cooling tool, and purging gas supply tool of the coupling head 30 to enable the coupling head 30 to perform the picking up, releasing, and coupling of the die 12.

[0096] The light-emitting / receiving control unit 92 controls the light-emitting unit 31 and the light-receiving unit 41. For example, when the connector 30 moves along the transport path of the die 12, the light-emitting / receiving control unit 92 keeps the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41 in an on state. When the connector 30 moves outside the transport path of the die 12, or when the connector 30 stops, the light-emitting / receiving control unit 92 keeps the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41 in an off state. In addition, the light-emitting / receiving control unit 92 can also keep the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41 always in an on state while the electronic component inspection device 1 is powered on.

[0097] The light intensity determination unit 93 compares the received light intensity with a threshold. Specifically, the light intensity determination unit 93 determines whether the received light intensity is less than or greater than the threshold. When the connector 30, which does not hold the die 12, is moved, the light intensity determination unit 93 compares the received light intensity with the threshold over approximately the entire area of ​​the transport path of the connector 30 to the die 12. Furthermore, when the connector 30, whose presence or absence of the die 12 is unclear, is moved, the light intensity determination unit 93 compares the received light intensity with the threshold at a determination time determined by the timing determination unit 95. Additionally, the light intensity determination unit 93 may also determine the threshold based on the minimum, maximum, or average value of the received light intensity.

[0098] Furthermore, the light intensity determination unit 93 can also determine the light intensity based on the amount of light emitted. Specifically, it can determine whether the difference or ratio between the emitted light intensity and the received light intensity is less than or greater than a threshold. Additionally, the light intensity determination unit 93 can determine the threshold based on the amount of light emitted, or it can determine the threshold based on the minimum, maximum, or average value of the difference or ratio between the emitted light intensity and the received light intensity. The amount of light emitted can be, for example, a set value of the light-emitting element, but it can also be a detected value obtained by the light-emitting sensor.

[0099] The position information storage unit 94 stores the position information of the connector 30 in the X-axis, Y-axis, and Z-axis directions. At this time, the position information storage unit 94 stores the determination result of the light intensity determination unit 93 in association with the position information. Specifically, it stores the relationship between the change in light intensity corresponding to the change in the position of the connector 30 when the connector 30 does not hold the die 12.

[0100] The timing determination unit 95 determines a detectable position range based on the interrelationships stored in the position information storage unit 94, specifying a range where the light received when the connector 30, which does not hold the die 12, moves, is at least at a threshold level. The timing determination unit 95 then determines a determination timing from this determined detectable position range. The determination timing is the position at which the presence or absence of the die 12 is determined when the connector 30, which holds the die 12, moves. The connector 30 moves along a consistent transport path above the light-receiving section 41 while transporting the die 12. Therefore, a determination timing can be set at a position where sufficient light received can be guaranteed even when the connector 30 does not hold the die 12. Thus, in this determination timing, the light received is less than a threshold level when the connector 30 holds the die 12, and the light received is at least at a threshold level when the connector 30 does not hold the die 12.

[0101] The determination timing is, for example, determined to be the center of the detectable position range. If the connector 30 moves along the Y-axis direction above the light-receiving part 41, the determination timing is determined to be the middle position in the Y-axis direction within the detectable position range. Specifically, the determination timing is determined to be the middle position between the position where the light received changes from a state below the threshold to a state above the threshold when the connector 30 is not holding the die 12 and the position where the light received changes from a state above the threshold to a state below the threshold.

[0102] Furthermore, the timing of the determination is not limited to the middle position. The timing of the determination can be appropriately determined from the range of detectable positions, for example, it can be determined to be the position where the amount of light received is the maximum when the connector 30 does not hold the die 12.

[0103] <Electronic Component Testing Methods>

[0104] Next, refer to Figures 3-7 An electronic component inspection method using an electronic component inspection apparatus 1 according to an embodiment of the present invention will be described. Figure 3 This is a flowchart illustrating the method for determining the timing of a judgment. Figure 4 This is a flowchart illustrating the method for determining the presence or absence of electronic components. Figure 5 This is a diagram illustrating the methods used to determine the timing of a decision. Figure 6 and Figure 7 This diagram illustrates the method for determining the presence or absence of electronic components. Figures 5-6 The horizontal axis of the timing diagram shown at the bottom represents the position of the projection unit 31 in the Y-axis direction.

[0105] First, refer to Figure 3 The method for determining the timing of the judgment is explained. First, it is confirmed that the die 12 is not held in the connector 30 (S11), and the operation of the light-emitting section 31 and the light-receiving section 41 begins (S12). Light is emitted from the light-emitting element of the light-emitting section 31, and the light-receiving element of the light-receiving section 41 is set to a state where it can receive light. Step S12 is executed by the light-emitting / light-receiving control unit 92 of the judgment unit 90.

[0106] Next, the connector 30 is moved along the path it traveled during the engagement operation (S13). When the connector 30 engages the die 12, it moves along the travel path of the transport path while holding the die 12, releasing the die 12 to the lead frame 21, and then moves along the transport path without holding the die 12 along the return path that travels in the opposite direction of the travel path. In step S13, the connector 30, without holding the die 12, is moved along the same path as the travel path. Step S13 is executed by the head control unit 91 of the determination unit 90.

[0107] Next, the relationship between the change in the position of the storage connector 30 and the change in the amount of light received is analyzed (S14). For example... Figure 5 As shown, when the connector 30 holds the die 12 and moves along the path, the amount of light received is above the threshold value within the position range where the light-receiving lens 42 of the light-receiving section 41 is located on the extension line of the optical path 35. Before and after the position range where the light-receiving lens 42 of the light-receiving section 41 is located on the extension line of the optical path 35, the amount of light received is less than the threshold value. The position where the amount of light received changes from below the threshold value to above the threshold value is stored as the first timing T1, and the position where the amount of light received changes from above the threshold value to below the threshold value is stored as the second timing T2. The interval between the first timing T1 and the second timing T2 is approximately equal to the dimension of the light-receiving lens 42 in the Y-axis direction. Step S14 is performed by the light amount determination unit 93 and the position information storage unit 94 of the determination unit 90.

[0108] Next, the determination timing TD (S15) is determined from the detectable location range. For example... Figure 5 As shown, the range of positions from the first timing T1 to the second timing T2 is determined as the detectable position range where the light received exceeds the threshold. Next, the midpoint between the first timing T1 and the second timing T2 is calculated and stored as the determination timing TD. That is, the determination timing TD is calculated using the following formula: TD = (T1 + T2) / 2. Step S15 is executed by the timing determination unit 95 of the determination unit 90.

[0109] Furthermore, the timing of the decision TD is not limited to TD = (T1 + T2) / 2 as long as the relationship T1 < TD < T2 is satisfied. It can be T1 < TD < (T1 + T2) / 2 or (T1 + T2) / 2 < TD < T2.

[0110] Next, refer to Figure 4 The method for determining the presence or absence of electronic components will be explained. First, the die 12 is picked up from the pickup unit 10 (S21), and the die 12 is transported by the connector 30 (S22). Steps S21 and S22 are executed by the head control unit 91 of the determination unit 90.

[0111] Next, during the path determination time TD, the presence or absence of die 12 is determined (S23). For example... Figure 6As shown, the arrival of the connector 30 at the determination time TD is used as a trigger event, and a determination process comparing the light received amount with a threshold is executed. When the light received amount is lower than the threshold during the determination process, it is determined that the die 12 is present in the connector 30, that is, the pickup of the die 12 is performed normally, and the process proceeds to the next step. If the light received amount exceeds the threshold during the determination process, it is determined that the die 12 is not present in the connector 30, that is, the pickup of the die 12 is not performed normally, and the process restarts from step S21. At this time, the connector 30 is returned to the position of the pickup unit 10, and the die 12 is picked up from the pickup unit 10. Step S23 is executed by the light quantity determination unit 93 and the head control unit 91 of the determination unit 90.

[0112] If it is determined that the die 12 is present in the connector 30, the die 12 is connected to the lead frame 21 (S24), and the presence or absence of the die 12 is determined in the return path determination time TD (S25). Figure 7 As shown, similar to step S23, the arrival of the connector 30 at the determination time TD is used as a trigger event, and a determination process comparing the amount of light received with a threshold is executed. When the amount of light received exceeds the threshold during the determination process, it is determined that there is no die 12 in the connector 30, that is, the release of die 12 is performed normally, and the determination of the presence or absence of electronic components ends. If the amount of light received is lower than the threshold during the determination process, it is determined that there is die 12 in the connector 30, that is, the release of die 12 is not performed normally, and the process restarts from step S24. At this time, the connector 30 is returned to the position of the bonding stage 20, and the die 12 is bonded to the lead frame 21. Step S24 is executed by the head control unit 91 of the determination unit 90, and step S25 is executed by the light amount determination unit 93 and the head control unit 91 of the determination unit 90.

[0113] Furthermore, if it is determined in step S25 that the release of die 12 has not been performed correctly, die 12 held at the connector 30 can be released into a recycling bin (not shown). This recycling bin is, for example, located between the pick-up section 10 and the light-receiving section 41 in the transport path of the connector 30. Accordingly, after the determination in step S25, die 12 can be released without disengaging the connector 30 from the return path. Therefore, the pick-up of the next die 12 can begin immediately, thereby improving manufacturing efficiency.

[0114] As described above, an electronic component inspection apparatus 1 according to one embodiment of the present invention includes: an adsorption chuck 33 having a light path 35 that is blocked when holding a die 12; a light-projecting unit 31 that projects sensor light SL into the light path 35; a light-receiving unit 41 that receives the sensor light SL that has passed through the light path 35; a driving unit 50 that moves a connector 30; and a determination unit 90 that determines whether a die 12 is present or absent based on the amount of light received. Furthermore, the determination unit 90 stores the relationship between changes in the amount of light received corresponding to changes in the position of the connector 30, determines a detectable position range where the amount of light received exceeds a threshold based on the relationship, and determines a determination timing TD from within the detectable position range.

[0115] Accordingly, the presence or absence of the die 12 in the adsorption chuck 33 is determined based on the change in the amount of light received when the light path 35 is blocked by the die 12. Therefore, even if the adsorption chuck 33 deteriorates over time due to deformation, as long as the die 12 is present, the amount of light received will change sufficiently, thus allowing for accurate determination of the presence or absence of the die 12 in the adsorption chuck 33. Furthermore, the detectable position range that ensures sufficient light received is determined based on the relationship between the change in the position of the connector 30 and the change in the amount of light received, and the timing of the determination is determined accordingly. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting part 31 and the light-receiving part 41, an appropriate timing of determination TD can be determined, thereby suppressing detection defects.

[0116] As one embodiment, the determination unit 90 determines whether there is a core 12 in the adsorption clamp 33 based on the comparison between the amount of light received and the threshold during the determination time TD.

[0117] Therefore, the presence or absence of the die 12 can be determined at the appropriate time of TD, thus suppressing detection failures.

[0118] As one embodiment, the determination unit 90 stores a first timing T1 when the amount of light received changes from a state below a threshold to a state above a threshold, and a second timing T2 when the amount of light received changes from a state above a threshold to a state below a threshold. It calculates the midpoint between the first timing T1 and the second timing T2 and stores it as the determination timing TD.

[0119] Therefore, since the determination time TD has a large time delay compared to the first time TD and the second time TD, even if the detectable position range changes after the determination time TD is determined, the determination time TD is not likely to deviate from the detectable position range. Therefore, sufficient light intake can be ensured during the determination time TD, which can suppress detection defects.

[0120] As one implementation, the determination unit 90 stores the position where the light received reaches its maximum as the determination time TD.

[0121] Therefore, even if the detectable position range changes after the determination time (TD) is set, the reduction in light intensity can be suppressed. Thus, sufficient light intensity can be ensured during the determination time (TD), suppressing detection defects.

[0122] As one implementation, the optical path 35 is the suction hole of the adsorption clamp 33.

[0123] Accordingly, since the optical path 35 does not need to be set separately from the mechanism holding the die 12, the structure of the connector 30 can be simplified.

[0124] As one embodiment, the adsorption clamp 33 is included in the joint for attaching the die 12 to the lead frame 21.

[0125] As one embodiment, the determination unit 90 determines whether there is a die 12 in the adsorption clamp 33 during the path in which the adsorption clamp 33 moves the die 12 to the lead frame 21.

[0126] Accordingly, it is possible to detect whether or not the die 12 is held for engagement. For example, if it is determined in advance that the die 12 is not held during the journey, unnecessary movements of the engagement head 30 can be reduced.

[0127] As one implementation, the determination unit 90 stores the mutual relationships in the same path as the destination path before starting the engagement, and determines the determination time TD.

[0128] Therefore, due to the relationship between the changes in the position of the connector 30 on the same path as the actual path and the changes in the amount of light received, the accuracy of the timing TD can be improved.

[0129] In one embodiment, the determination unit 90 determines whether there is a die 12 in the adsorption chuck 33 during the return path after the adsorption chuck 33 has transported the die 12 to the lead frame 21.

[0130] Accordingly, the die 12 that remains in the adsorption chuck 33 due to bonding failure can be inspected. At this time, the bonding head can either transfer the held die 12 back to the substrate for bonding or release it into the recycling bin. Therefore, the following situation can be prevented: when picking up the next die 12 while holding the die 12, the dies 12 come into contact with each other, causing damage to the dies 12, etc.

[0131] As one implementation, the determination unit 90 stores the interrelationships in the return path after the adsorption chuck 33 moves the die 12 to the lead frame 21, and determines the determination timing TD.

[0132] Accordingly, the timing of the determination (TD) can be appropriately adjusted during continuous bonding. Therefore, even if the detectable position range changes over time due to the installation position and angle of the light-emitting part 31 and the light-receiving part 41 during continuous bonding, detection defects can be suppressed.

[0133] As one implementation, the determination unit 90 determines the threshold based on the amount of light emitted.

[0134] Therefore, even if the amount of light emitted changes, the appropriate range of detectable locations can be determined, thereby allowing for the appropriate timing of the judgment.

[0135] Another embodiment of the present invention is an electronic component inspection method using an electronic component inspection device 1. The electronic component inspection method includes: storing the relationship between changes in light intensity and changes in the position of the connector 30; and determining a detectable position range where the light intensity exceeds a threshold based on the relationship, and determining a judgment timing TD from the detectable position range.

[0136] Accordingly, the presence or absence of the die 12 in the adsorption chuck 33 is determined based on the change in the amount of light received when the light path 35 is blocked by the die 12. Therefore, even if the adsorption chuck 33 deteriorates over time due to deformation, as long as the die 12 is present, the amount of light received will change sufficiently, thus allowing for accurate determination of the presence or absence of the die 12 in the adsorption chuck 33. Furthermore, based on the relationship between the change in the position of the connector 30 and the change in the amount of light received, a detectable position range that ensures sufficient light received is determined, and the determination timing TD is determined from within this range. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting part 31 and the light-receiving part 41, an appropriate determination timing TD can be determined, thereby suppressing detection defects.

[0137] In another embodiment of the present invention, a computer-readable storage medium stores an electronic component inspection program. The electronic component inspection program is an electronic component inspection program that enables the electronic component inspection device 1 to operate. The electronic component inspection program causes a computer to perform: storing the relationship between changes in light intensity corresponding to changes in the position of the connector 30; determining, based on the relationship, a detectable position range where the light intensity exceeds a threshold, and determining a judgment timing TD from within the detectable position range.

[0138] Accordingly, the presence or absence of the die 12 in the adsorption chuck 33 is determined based on the change in the amount of light received when the light path 35 is blocked by the die 12. Therefore, even if the adsorption chuck 33 deteriorates over time due to deformation, as long as the die 12 is present, the amount of light received will change sufficiently, thus allowing for accurate determination of the presence or absence of the die 12 in the adsorption chuck 33. Furthermore, based on the relationship between the change in the position of the connector 30 and the change in the amount of light received, a detectable position range that ensures sufficient light received is determined, and the determination timing TD is determined from within this range. Therefore, even if the detectable position range changes due to variations in the mounting position and angle of the light-emitting part 31 and the light-receiving part 41, an appropriate determination timing TD can be determined, thereby suppressing detection defects.

[0139] Furthermore, the electronic component inspection apparatus, electronic component inspection method, and computer-readable storage medium of one embodiment of the present invention can also be applied to packaging apparatuses other than die bonding machines, such as flip chip bonding machines. When the electronic component inspection apparatus is provided in a flip chip bonding machine, the inspection of the electronic component can be performed in a pick-up head that reverses the electronic component, or in a flux supply section that transfers flux to the bump electrodes of the electronic component. Alternatively, the inspection of the electronic component can be performed between the electronic component supply section and the flux supply section, or between the flux supply section and the substrate supply section. The electronic component inspection apparatus, electronic component inspection method, and computer-readable storage medium of one embodiment of the present invention can also be provided in various apparatuses other than packaging apparatuses, such as conveying devices or resin sealing devices.

[0140] As described above, according to one embodiment of the present invention, an electronic component detection device, an electronic component detection method, and a computer-readable storage medium with improved accuracy in determining the presence or absence of electronic components can be provided.

[0141] The embodiments described above are for the purpose of facilitating understanding of the present invention and are not intended to limit the scope of the invention. The components included in the embodiments, as well as their configuration, materials, conditions, shapes, and dimensions, are not limited to those illustrated and can be appropriately modified. Furthermore, the structures shown in different embodiments can be partially substituted for or combined with each other.

Claims

1. An electronic component testing device, comprising: The holding part is configured to hold electronic components and has an optical path that is blocked when the electronic components are held. The light-projecting part projects sensor light into the optical path of the holding part; The light-receiving part receives the sensor light that has passed through the optical path of the holding part; The driving unit causes the relative position of the holding unit with respect to the light-receiving unit to change; as well as The determination unit determines whether the electronic component is present in the holding unit based on the amount of light received in the light-receiving unit. The determination unit The storage unit stores the relationship between the change in the amount of light received in the light-receiving unit and the change in the relative position when the holding unit does not hold the electronic component. Based on the aforementioned interrelationship, a detectable position range in which the amount of light received in the light-receiving part exceeds a threshold is determined from the relative positions, and the timing for determining whether or not the electronic component is present is determined from the determined detectable position range.

2. The electronic component testing device according to claim 1, wherein... The determination unit determines whether the electronic component is present in the holding unit based on a comparison between the amount of light received in the light-receiving unit and the threshold value during the determination time.

3. The electronic component testing device according to claim 1, wherein... The determination unit The relative position at which the amount of light received in the light-receiving part changes from a state below the threshold to a state above the threshold when the holding part is not holding the electronic component is stored as a first opportunity. The relative position at which the amount of light received in the light-receiving part changes from a state exceeding the threshold to a state below the threshold when the holding part does not hold the electronic component is stored as a second timing. The relative position between the first timing point and the second timing point is calculated and stored as the determination timing point.

4. The electronic component testing device according to claim 1, wherein... The determination unit stores the relative position where the amount of light received in the light-receiving unit reaches its maximum as the determination time.

5. The electronic component testing device according to claim 1, wherein... The retaining part has an adsorption clamp. The optical path is the suction hole of the adsorption clamp.

6. The electronic component testing device according to claim 1, wherein... The retaining portion is included in the bonding head for bonding the electronic component to the substrate.

7. The electronic component testing device according to claim 6, wherein... The determination unit determines whether the electronic component is present in the holding unit during the path in which the holding unit transports the electronic component to the substrate.

8. The electronic component testing apparatus according to claim 7, wherein... Before initiating engagement, the determination unit stores the interrelationships in the same path as the destination path and determines the timing of the determination.

9. The electronic component testing device according to claim 6, wherein... The determination unit determines whether the electronic component is present in the holding unit during the return path after the holding unit has transported the electronic component to the substrate.

10. The electronic component testing apparatus according to claim 6, wherein... The determination unit stores the interrelationships in the return path after the holding unit moves the electronic component to the substrate, and determines the timing of the determination.

11. The electronic component testing apparatus according to claim 1, wherein... The determination unit determines the threshold based on the amount of light emitted from the light-emitting unit.

12. A method for inspecting electronic components, comprising an electronic component inspection device, wherein the electronic component inspection device includes: The holding part is configured to hold electronic components and has an optical path that is blocked when the electronic components are held. The light-projecting part projects sensor light into the optical path of the holding part; The light-receiving part receives the sensor light that has passed through the optical path of the holding part; The driving unit causes the relative position of the holding unit with respect to the light-receiving unit to change; as well as The determination unit determines whether the electronic component is present in the holding unit based on the amount of light received in the light-receiving unit. The electronic component testing method includes: The relationship between the changes in the amount of light received in the light-receiving part and the changes in the relative position when the holding part does not hold the electronic component is stored. as well as Based on the aforementioned interrelationship, a detectable position range in which the amount of light received in the light-receiving part exceeds a threshold is determined from the relative positions, and the timing for determining whether or not the electronic component is present is determined from the determined detectable position range.

13. A computer-readable storage medium storing an electronic component testing program, wherein the electronic component testing program is for operating an electronic component testing apparatus, the electronic component testing apparatus comprising: The holding part is configured to hold electronic components and has an optical path that is blocked when the electronic components are held. The light-projecting part projects sensor light into the optical path of the holding part; The light-receiving part receives the sensor light that has passed through the optical path of the holding part; The driving unit causes the relative position of the holding unit with respect to the light-receiving unit to change; as well as The determination unit determines whether the electronic component is present in the holding unit based on the amount of light received in the light-receiving unit. The electronic component testing program is executed by a computer: The relationship between the changes in the amount of light received in the light-receiving part and the changes in the relative position when the holding part does not hold the electronic component is stored. as well as Based on the aforementioned interrelationship, a detectable position range in which the amount of light received in the light-receiving part exceeds a threshold is determined from the relative positions, and the timing for determining whether or not the electronic component is present is determined from the determined detectable position range.

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