Imaging sensor driving device and optical module
The imaging sensor driving device, driven by a multi-layer structure and a magnet coil, solves the problem of image stabilization when the camera rotates around the Z-axis, achieving multi-directional free movement with no crosstalk and a thinner device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ALPS ALPINE CO LTD
- Filing Date
- 2022-07-22
- Publication Date
- 2026-08-04
AI Technical Summary
Existing camera devices have the problem of not being able to effectively stabilize images when rotating around the Z-axis, and there is crosstalk between swings in different directions.
An imaging sensor driving device with a multi-layer structure includes a holding plate, a first partition, a second partition, and a base. It achieves independent or linked movement around the X-axis, Y-axis, and Z-axis through the first to third driving parts, and is driven by magnets and coils, while reducing friction through balls and guide parts.
It achieves multi-directional free movement and anti-shake, with no crosstalk between actions, and can be controlled individually or in conjunction, while also being thin and compact.
Smart Images
Figure CN117471818B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an imaging sensor driving device and an optical module. Background Technology
[0002] Previously, in optical units used in imaging devices such as cameras, functions were developed to eliminate image shake by oscillating the entire optical module. For example, OIS (Optical Image Stabilizer) functionality is achieved by oscillating the entire module, including the lens, image sensor, and autofocus (AF) unit, around the X and Y axes. However, when using the same component for oscillation (i.e., yaw and pitch) around the X and Y axes, crosstalk occurs between the two directions.
[0003] Furthermore, previously disclosed technologies have employed methods to eliminate camera shake by driving lenses and / or sensors in a manner that allows horizontal movement along mutually perpendicular X, Y, and Z axes (i.e., lens optical axes) and rotation around the X and Y axes, thus achieving free movement in multiple directions. However, in actual photography, in addition to horizontal movement along the X, Y, and Z axes and rotation around the X and Y axes, rotation around the Z axis may also occur simultaneously. Therefore, conventional driving devices suffer from the following problem: even when image stabilization mode is selected, effective image stabilization is not achieved when rotation around the Z axis (lens optical axis) occurs. Regarding horizontal movement along the X, Y, and Z axes, conventional solutions have proposed driving lenses to achieve horizontal movement. However, there has been no prior documentation regarding rotation around the X, Y, and Z axes. Summary of the Invention
[0004] The present invention was made in view of the above-mentioned problems, and aims to provide an imaging sensor driving device and an optical module having the imaging sensor driving device, which achieves image stabilization through free movement in multiple directions (including at least movement around the X-axis, Y-axis and Z-axis), and the various actions do not interfere with each other and can be controlled individually or in conjunction with each other.
[0005] The imaging sensor driving device of technical solution one includes: a base; and a holding plate located above the base for holding the imaging sensor. A first partition plate opposite to the holding plate is further disposed between the holding plate and the base, and a second partition plate is disposed between the first partition plate and the base. A first driving part is disposed between the holding plate and the first partition plate, a second driving part is disposed between the first partition plate and the second partition plate, and a third driving part is disposed between the second partition plate and the base. A portion of the holding plate and a portion of the first partition plate form a first guiding part, and another portion of the first partition plate and a portion of the second partition plate form a second guiding part. The second partition and a portion of the base form a third guide section. The first drive section drives the retaining plate to swing relative to the base about a first axis. The second drive section drives the first partition to swing relative to the base about a second axis. The third drive section drives the second partition to rotate relative to the base about a third axis. The first axis and the second axis are both located above the retaining plate. The third axis is perpendicular to the center of the imaging surface of the imaging sensor. The axial directions of the first axis, the second axis and the third axis are perpendicular to each other.
[0006] According to technical solution one, the retaining plate, the first partition plate, the second partition plate, and the base form a four-layer structure stacked vertically. The retaining plate, the first partition plate, and the second partition plate are independent three-layer structures that can be driven separately without crosstalk between them. Furthermore, the retaining plate can swing around a first axis, the first partition plate can drive both the retaining plate and the first partition plate to swing together around a second axis, and the second partition plate can drive the first partition plate and the retaining plate to rotate together around a third axis. This structure allows for individual or coordinated movement around the X, Y, and Z axes, thus achieving reliable anti-shake functionality.
[0007] The imaging sensor driving device of technical solution two comprises a first driving unit consisting of a first magnet and a first coil opposed in the vertical direction, wherein the first magnet is disposed on either the holding plate or the first partition, and the first coil is disposed on the other of the holding plate and the first partition; a second driving unit consisting of a second magnet and a second coil opposed in the vertical direction, wherein the second magnet is disposed on either the first partition or the second partition, and the second coil is disposed on the other of the first partition and the second partition; and a third driving unit consisting of a third magnet and a third coil opposed in the vertical direction, wherein the third magnet is disposed on either the second partition or the base, and the third coil is disposed on the other of the second partition and the base.
[0008] According to technical solution 2, magnets and coils can be used as the driving unit, but it is not limited to this. The driving unit can also be a shape memory alloy wire, i.e., SMA wire, or a piezoelectric element.
[0009] The imaging sensor driving device of technical solution three further comprises: a first wiring substrate disposed on the upper surface of the holding plate, the first wiring substrate being electrically connected to the imaging sensor; a second wiring substrate disposed on the surface of the first partition plate opposite to the second partition plate, the upper and lower surfaces of the second wiring substrate being respectively disposed on the first coil and the second coil, the second wiring substrate being electrically connected to both the first coil and the second coil simultaneously; and a third wiring substrate disposed on the surface of the second partition plate opposite to the base, the third wiring substrate being electrically connected to the third coil, the first partition plate having an opening for the first coil to be exposed, the first coil being opposite to the first magnet disposed on the holding plate, the second coil being opposite to the second magnet disposed on the second partition plate, and the third coil being opposite to the third magnet disposed on the base.
[0010] According to technical solution three, by arranging the first coil and the second coil on the upper and lower surfaces of the second wiring substrate respectively, the first coil is exposed from the opening of the first partition and faces the first magnet on the holding plate, and the second coil is facing the second magnet on the second partition. By mounting the wiring substrate on both sides, components can be saved and the imaging sensor driving device can be made thinner.
[0011] The imaging sensor driving device of technical solution four includes a plurality of first balls between the holding plate and the first partition plate. These first balls are housed within a plurality of strip-shaped first guide portions and can roll along the first guide portions. Each first guide portion is an arc-shaped groove centered on the first axis, formed by an upper rail on the holding plate and a lower rail on the first partition plate. A plurality of second balls are also present between the first partition plate and the second partition plate. These second balls are housed within the strip-shaped second guide portions and can roll along the second guide portions. Each second guide portion is an arc-shaped groove centered on the second axis, formed by an upper rail on the first partition plate and a lower rail on the second partition plate. Finally, a plurality of third balls are present between the second partition plate and the base. These third balls are housed within the strip-shaped third guide portions and can roll along the third guide portions. Each third guide portion is an arc-shaped groove centered on the third axis, formed by an upper rail on the second partition plate and a lower rail on the base plate.
[0012] According to technical solution four, the multiple balls are used to reduce sliding friction, thereby enabling relatively easy movement between the layers of the structure.
[0013] The imaging sensor driving device of technical solution five has a positioning part at the intersection of the third axis and the base for determining the relative position of the second partition and the base.
[0014] According to technical solution five, by setting a positioning part, it is helpful to conveniently position the components during assembly.
[0015] The imaging sensor driving device of technical solution six has a magnetic plate disposed at the bottom of the base, opposite to the first magnet and the second magnet respectively. The magnetic plate provides an attractive force to attract the first magnet and the second magnet in the direction along the third axis. The first magnet and the second magnet are both within the attraction range of the magnetic plate in the direction along the third axis.
[0016] According to technical solution six, by setting a magnetic plate on the base, which serves as a fixed side component, at a position opposite to the first and second magnets, a magnetic force is generated between the first and second magnets and the magnetic plate. This magnetic force can press the retaining plate, the first partition, and the second partition downwards to press multiple balls, making the structure between the retaining plate and the base more stable and able to resist external impacts to a certain extent.
[0017] In the imaging sensor driving device of technical solution seven, a pair of leaf springs are provided between the base and the retaining plate, one end of the leaf spring is fixed to the base and the other end is fixed to the retaining plate.
[0018] According to technical solution seven, the base and the retaining plate can be reliably connected, and the retaining plate can be restored to its initial position when it is displaced.
[0019] The imaging sensor driving device of technical solution eight has a V-shaped cross-section in the direction orthogonal to the extension direction of the lower rail of the arc-shaped groove, and the upper rail of the arc-shaped groove includes two types of upper rails with different cross-sections in the direction orthogonal to the extension direction, namely a V-shaped cross-section with the opening facing downward and a U-shaped cross-section with the opening facing downward.
[0020] According to technical solution eight, by setting the cross-section of the arc-shaped groove to different shapes, different functions can be performed. Among them, the arc-shaped grooves with V-shaped cross-sections of the upper and lower rails play a positioning role, while the arc-shaped grooves with U-shaped cross-sections of the upper rail and V-shaped cross-sections of the lower rail play a position adjustment role.
[0021] The imaging sensor driving device of technical solution nine, wherein the positioning part is composed of a fourth ball, a downward-facing V-shaped groove located at the center of the lower surface of the second partition, and a V-shaped groove located at the center of the upper surface of the base.
[0022] According to technical solution nine, the positioning part is constructed by ball bearings and V-shaped grooves on both the top and bottom, which can reliably achieve the positioning function.
[0023] The optical module of technical solution ten includes: an imaging sensor driving device as described in any one of technical solutions one to nine; a lens driving device disposed above the imaging sensor driving device; and a housing covering the base, wherein the imaging sensor driving device and the lens driving device are housed within the space formed by the base and the housing.
[0024] According to technical solution ten, since the optical module includes the imaging sensor driving device described in any one of technical solutions one through nine, the optical module can achieve the functions of the imaging sensor driving devices described in technical solutions one through nine, namely, free movement around the X-axis, Y-axis, and Z-axis. Furthermore, the lens driving device can be configured to enable the lens to move horizontally in the X-axis, Y-axis, and Z-axis directions, thereby enabling the optical module equipped with such a lens driving device and the imaging sensor driving device described in technical solutions one through nine to achieve free movement in six directions.
[0025] Invention Effects
[0026] It can achieve anti-shake through free movement in multiple directions (including at least movement around the X, Y, and Z axes), and there is no crosstalk between the movements, which can be controlled individually or in conjunction with each other. Attached Figure Description
[0027] Figure 1 A three-dimensional view of the imaging sensor driving device.
[0028] Figure 2 An exploded stereo view of the imaging sensor driving device.
[0029] Figure 3 This is a three-dimensional view of the first wiring substrate.
[0030] Figure 4 This is a top view of the imaging sensor driving device with the first wiring substrate omitted.
[0031] Figure 5 A schematic diagram showing the first, second, and third axes.
[0032] Figure 6A A three-dimensional diagram showing the retaining plate when viewed from a slightly downward angle. Figure 6BA bottom view showing the retaining plate with the leaf spring and the first magnet installed.
[0033] Figure 7A A three-dimensional view of the first partition as seen from an obliquely upward perspective. Figure 7B A three-dimensional view of the first partition when viewed from a slightly downward angle.
[0034] Figure 8A A three-dimensional view of the second partition when viewed from an obliquely upward angle. Figure 8B This shows the bottom view of the second partition.
[0035] Figure 9 This is a three-dimensional view of the second wiring substrate.
[0036] Figure 10 This is an exploded perspective view showing the first partition, the second wiring substrate, and the second partition.
[0037] Figure 11A This shows a top view of the base. Figure 11B This shows a bottom view of the base.
[0038] Figure 12 Indicates along Figure 4 A cross-sectional view along line AA in the diagram.
[0039] Figure 13 Indicates along Figure 4 A cross-sectional view along the BB line.
[0040] Figure 14 Indicates along Figure 4 A cross-sectional view of the CC line in the diagram, and Figure 14 This is a schematic diagram showing the first drive unit and the second drive unit.
[0041] Figure 15 This is a schematic diagram showing the third drive unit.
[0042] Figure 16 An exploded 3D view of the optical module.
[0043] Explanation of reference numerals in the attached figures
[0044] 1 Optical Module 10 Imaging Sensor Drive Unit 20 Lens Drive Unit 30 Housing FPC1 First Wiring Substrate FPC2 Second Wiring Substrate 13 Holding Plate 14 First Separator 15 Second Separator 16 Base AX1 First Axis AX2 Second Axis AX3 Third Axis DR1 First Drive Unit DR2 Second Drive Unit DR3 Third Drive Unit GD1 First Guide Unit GD2 Second Guide Unit GD3 Third Guide Unit PP Positioning Unit BA1 First Ball BA2 Second Ball BA3 Third Ball BA4 Fourth Ball C1 First Coil C2 Second Coil C3 Third Coil M1 First Magnet M2 Second Magnet M3 Third Magnet SP Leaf Spring SE Imaging Sensor 131 First Guide Section First Upper Rail 132 First Guide Section Second Upper Rail 133 First Magnet Holding Section 134 First Recess 141 First Guide Section Lower Rail 142 Opening 143 Second Guide Section First Upper Rail 144 Second Guide Section Second Upper Rail 145 Second Recess 146 Second Wiring Board Holding Section 151 Second Guide Section Lower Rail 152 Second Magnet Holding Section 153 Third Guide Section Upper Rail 154 First Groove 161 Third Guide Section Lower Rail 162 Second Groove 163 Magnetic Plate Holding Section 164 Third Magnet Holding Section MG Magnetic Plate Detailed Implementation
[0045] Hereinafter, with reference to the accompanying drawings, the imaging sensor driving device of this embodiment and the optical module equipped with the imaging sensor driving device will be described.
[0046] Imaging sensor driving device
[0047] Figure 1 A three-dimensional view of the imaging sensor driving device. Figure 2 This is an exploded perspective view of the imaging sensor driving device. For ease of explanation, the direction perpendicular to the plane containing the imaging sensor SE will be referred to as the vertical direction; the side of the imaging sensor SE closest to the lens will be called "up" or "above"; and the side opposite to the lens side of the imaging sensor SE will be called "down" or "below". The vertical direction described here may not necessarily be the same as the actual direction used in practice.
[0048] like Figure 1 and Figure 2As shown, the imaging sensor driving device 10 comprises, from top to bottom, a first wiring substrate FPC1, a holding plate 13, a first partition 14, a second partition 15, and a base 16. The first wiring substrate FPC1, holding plate 13, first partition 14, second partition 15, and base 16 are each formed into approximately quadrilateral shapes; however, this quadrilateral shape is merely an example and not a limitation. The imaging sensor SE, as the driving object of the imaging sensor driving device 10, is disposed on the first wiring substrate FPC1 in this embodiment. The first wiring substrate FPC1 is bonded to the upper surface of the holding plate 13, thereby integrating the imaging sensor SE with the holding plate 13. However, this is only one example; for instance, the imaging sensor SE can also be directly disposed on the holding plate 13, as long as the imaging sensor SE and the holding plate 13 are integrated and can move together in a coaxial manner.
[0049] A first driving part consisting of a first coil C1 and a first magnet M1 is provided between the retaining plate 13 and the first partition 14. A second driving part consisting of a second coil C2 and a second magnet M2 is provided between the first partition 14 and the second partition 15. A third driving part consisting of a third coil C3 and a third magnet M3 is provided between the second partition 15 and the base 16. A part of the retaining plate 13 and a part of the first partition 14 form a first guiding part. Another part of the first partition 14 and a part of the second partition 15 form a second guiding part. Another part of the second partition 15 and a part of the base 16 form a third guiding part.
[0050] The first drive unit, second drive unit, third drive unit, first guide unit, second guide unit, and third guide unit are in Figure 2 It is not marked in the text, but will be explained in detail later.
[0051] Furthermore, a plurality of first ball bearings BA1 are provided between the lower rail of the retaining plate 13 and the upper rail of the first partition plate 14, in other words, in the first guide section; a plurality of second ball bearings BA2 are provided between the lower rail of the first partition plate 14 and the upper rail of the second partition plate 15, in other words, in the second guide section; a plurality of third ball bearings BA3 are provided between the lower rail of the second partition plate 15 and the upper rail of the base 16, in other words, in the third guide section; and a fourth ball bearing BA4 is provided between the first groove on the lower surface of the second partition plate 15 and the second groove on the upper surface of the base 16. The detailed structure described above will be explained later.
[0052] Below, refer to Figures 3 to 15 This section provides a detailed description of the structure of each part of the imaging sensor driving device.
[0053] Figure 3This is a perspective view of the first wiring substrate. The first wiring substrate FPC1 consists of a base plate and sidewalls extending upward from and surrounding the base plate. An imaging sensor SE is mounted on the base plate of the first wiring substrate FPC1, and the first wiring substrate FPC1 can be electrically connected to and power the imaging sensor SE. The imaging sensor SE protrudes from the first wiring substrate FPC1 and is disposed opposite to a lens driving device (not shown) located above the imaging sensor driving device 10. The lower surface of the first wiring substrate FPC1 is fixed to the upper surface of the retaining plate 13, for example, by adhesive.
[0054] Figure 4 This is a top view of the imaging sensor driving device with the first wiring substrate omitted. (Example:) Figure 4 As shown, both the retaining plate 13 and the base 16 are generally quadrilateral in shape. The size of the retaining plate 13 is smaller than that of the base 16. The upper surface of the retaining plate 13 is flat and serves as the mounting surface for the first wiring substrate FPC1. The retaining plate 13 and the base 16 are connected by a pair of leaf springs SP. Figure 4 and Figure 6A , Figure 11A As shown, two protrusions are provided at the center of each of the two opposite sides of the lower surface of the retaining plate 13, and two protrusions are also provided at the center of each of the two opposite sides of the upper surface of the base 16. A pair of leaf springs SP are connected between the opposite sides of the retaining plate 13 and the base 16, for example by adhesive. Thus, the retaining plate 13, the base 16 and the leaf springs SP form a receiving space for receiving the first partition 14 and the second partition 15. In addition, by providing a pair of leaf springs SP, the base 16 and the retaining plate 13 can be reliably connected, and a restoring force is provided to restore the retaining plate 13 to its initial position when it is displaced.
[0055] Figure 5 This diagram illustrates the first, second, and third axes. The retaining plate 13, first partition 14, second partition 15, and base 16 form a four-layer structure stacked vertically. When the first partition 14 and second partition 15 are housed within the receiving space formed by the retaining plate 13 and base 16, the base 16 functions as a fixed-side component, while the retaining plate 13, first partition 14, and second partition 15 function as movable-side components. The retaining plate 13, first partition 14, and second partition 15 are independent three-layer structures that can be driven independently without crosstalk. Furthermore, the retaining plate 13 can be positioned relative to the base 16 along the first axis (i.e.,... Figure 5 The first partition 14 can drive the retaining plate 13 relative to the base 16 about a second axis (i.e., AX1). Figure 5The first partition 14 and the retaining plate 13 can swing together around the base 16 around the third axis (AX2). While both are swinging around the AX2 axis, they can also simultaneously swing around the AX1 axis. The second partition 15 can drive the first partition 14 and the retaining plate 13 relative to the base 16 around the third axis (i.e., AX2). Figure 5 The three axes (AX1, AX2, and AX3) rotate together around the third axis AX3. Furthermore, while rotating together around the third axis AX3, they can simultaneously oscillate around the first axis AX1 and / or the second axis AX2. This structure allows for individual or coordinated movement around these three axes, AX1, AX2, and AX3. The arrows in the figure indicate the oscillation (rotation) directions around the first axis AX1, second axis AX2, and third axis AX3, respectively. The dashed lines in the figure represent the first axis AX1, second axis AX2, and third axis AX3, respectively. The first axis AX1 and second axis AX2 are both located above the holding plate 13. The third axis AX3 is perpendicular to the center of the imaging plane of the imaging sensor SE (not shown). The axes of the first axis AX1, second axis AX2, and third axis AX3 are perpendicular to each other.
[0056] Furthermore, in order to ensure that both the first axis AX1 and the second axis AX2 are located above the retaining plate 13, the radii of curvature of the first guide portion and the second guide portion (described later) can be set as needed. Figure 5 This is merely a schematic diagram; the positions of the first axis AX1 and the second axis AX2 in the diagram may not correspond to the radii of curvature shown. Furthermore, for ease of explanation, the extension directions of the first axis AX1, the second axis AX2, and the third axis AX3 will be referred to as the X direction, Y direction, and Z direction, respectively. The plane formed by the X and Y directions will be called the XY plane, the plane formed by the X and Z directions will be called the XZ plane, and the plane formed by the Y and Z directions will be called the YZ plane.
[0057] Figure 6A A three-dimensional diagram showing the retaining plate when viewed from a slightly downward angle. Figure 6B A bottom view showing the retaining plate with the leaf spring and the first magnet installed.
[0058] A first magnet retaining portion 133, recessed inwards, is formed at the center of the lower surface of the retaining plate 13, such as... Figure 6BAs shown, the first magnet holding portion 133 extends along the X direction to hold the first magnet M1. On both sides of the first magnet holding portion 133 in the X direction, there are strip-shaped recesses extending along the Y direction. These strip-shaped recesses are elongated when viewed from the front and are arc-shaped that protrudes from both ends towards the center when viewed from the side. Furthermore, the two strip-shaped recesses on the lower surface of the holding plate 13, together with the recesses on the upper surface of the first partition plate 14 (described later), form the arc-shaped groove of the first guide portion GD1 (described later). Therefore, the two strip-shaped recesses formed on the lower surface of the holding plate 13 will be referred to below as the first guide portion first upper rail 131 and the first guide portion second upper rail 132.
[0059] The cross-sections of the first upper rail 131 and the second upper rail 132 of the first guide section in the direction orthogonal to the extension direction (XZ plane) are different. The cross-section of the first upper rail 131 of the first guide section is a V-shaped cross-section with the opening facing downwards, while the cross-section of the second upper rail 132 of the first guide section is a U-shaped cross-section with the opening facing downwards. The positions of the first upper rail 131 and the second upper rail 132 of the first guide section shown in the figure are only one example, and their positions can be interchanged.
[0060] In addition, such as Figure 6A and Figure 6B As shown, first recesses 134 are formed at both ends of the lower surface of the retaining plate 13 in the Y direction, and the leaf spring SP overlaps with the first recesses 134 in the Z direction.
[0061] Figure 7A A three-dimensional view of the first partition as seen from an obliquely upward perspective. Figure 7B A three-dimensional view of the first partition when viewed from a slightly downward angle.
[0062] On the upper surface of the first partition plate 14, at a position opposite to the first upper guide rail 131 and the second upper guide rail 132 of the retaining plate 13, there are multiple lower guide rails 141 extending along the Y direction with the same radius of curvature as the first upper guide rail 131 and the second upper guide rail 132. The cross-sections of the multiple lower guide rails 141 in the direction orthogonal to the extending direction (XZ plane) have the same shape, all being V-shaped cross-sections with the opening facing upwards. Thus, a portion of the multiple lower guide rails 141, together with the first upper guide rail 131, constitutes a first guide section GD1 with a cross-section of inverted V + upright V, and another portion of the multiple lower guide rails 141, together with the second upper guide rail 132, constitutes a first guide section GD1 with a cross-section of inverted U + upright V. By setting different cross-sectional shapes, different functions can be performed. The first guide section GD1 with a cross-section of inverted V + upright V can perform a positioning function, and the first guide section GD1 with a cross-section of inverted U + upright V can perform a position adjustment function.
[0063] An opening 142, extending from the surface to the back, is provided in the center of the first partition 14 for the first coil C1 (described later) to pass through. The size of the opening 142 can be set according to the size of the first coil C1.
[0064] At both ends of the upper surface of the first partition plate 14 in the Y direction, there are second recesses 145 opposite to the first recesses 134 of the retaining plate 13. The leaf spring SP is sandwiched between the first recesses 134 and the second recesses 145 in the Z direction. By providing the first recesses 134 and the second recesses 145, the leaf spring SP obtains space to deform in the Z direction.
[0065] At the center of the lower surface of the first partition 14 in the Y direction, a second wiring substrate holding portion 146, which is opposite to and shaped to the second wiring substrate FPC2 described later, and recessed inward from the lower surface, is provided throughout the entire X direction. The second wiring substrate FPC2 can be held on the lower surface of the first partition 14, for example, by being fixed to the second wiring substrate holding portion 146 with an adhesive.
[0066] On both sides of the lower surface of the first partition 14 in the Y direction, there are strip-shaped recesses extending in the X direction. When viewed from the front, these strip-shaped recesses are elongated, and when viewed from the side, they are arc-shaped, protruding from both ends towards the center. Furthermore, the two strip-shaped recesses on the lower surface of the first partition 14, together with the recesses on the upper surface of the second partition 15 (described later), constitute the arc-shaped groove of the second guide section GD2 (described later). Therefore, the two strip-shaped recesses formed on the lower surface of the first partition 14 will be referred to below as the first upper rail 143 and the second upper rail 144 of the second guide section.
[0067] The cross-sections of the first upper rail 143 and the second upper rail 144 of the second guide section are different in the direction orthogonal to the extension direction (YZ plane). The cross-section of the first upper rail 143 of the second guide section is a V-shaped cross-section with the opening facing downwards, while the cross-section of the second upper rail 144 of the second guide section is a U-shaped cross-section with the opening facing downwards. The positions of the first upper rail 143 and the second upper rail 144 of the second guide section shown in the figure are only one example, and their positions can be interchanged.
[0068] Figure 8A A three-dimensional view of the second partition when viewed from an obliquely upward angle. Figure 8B This shows the bottom view of the second partition.
[0069] On the upper surface of the second partition 15, opposite to the first upper guide rail 143 and the second upper guide rail 144 of the first partition 14, there are multiple lower guide rails 151 extending in the X direction with the same radius of curvature as the first upper guide rail 143 and the second upper guide rail 144. The cross-sections of the multiple lower guide rails 151 in the direction orthogonal to the extending direction (YZ plane) are all of the same shape, a V-shaped cross-section with the opening facing upwards. Thus, a portion of the multiple lower guide rails 151, together with the first upper guide rail 143, forms a second guide section GD2 with a cross-section of inverted V + upright V, and another portion of the multiple lower guide rails 151, together with the second upper guide rail 144, forms a second guide section GD2 with a cross-section of inverted U + upright V. By setting different cross-sectional shapes, different functions can be performed. The second guide section GD2 with an inverted V + upright V cross-section can perform a positioning function, while the second guide section GD2 with an inverted U + upright V cross-section can perform a position adjustment function.
[0070] The upper surface of the second partition 15 has two ends in the X direction, which are provided with second magnet holding portions 152 extending in the Y direction for arranging the second magnet M2. The second magnet M2 is fixed in the second magnet holding portions 152, for example, by means of adhesive.
[0071] On the lower surface of the second partition 15, i.e., the surface opposite to the base 16, a third wiring substrate FPC3 is provided. The third wiring substrate FPC3 can be electrically connected to the third coil C3 to provide power to the third coil C3. Figure 8B As shown, the third coil C3 is arranged, for example, via FPC3 at the four corners of the second partition 15 in pairs along the diagonal.
[0072] Additionally, a first groove 154 is provided in the center of the lower surface of the second partition 15. The first groove 154 is a conical groove with a V-shaped cross-section opening downwards. The first groove 154, together with the second groove 162 of the base 16 and the fourth ball bearing BA4 (described later), serves as the positioning part PP (described later).
[0073] Additionally, on the lower surface of the second partition 15, i.e., on the XY plane, multiple ( ) are formed discontinuously and at equal intervals around the first groove 154 with the same radius. Figure 8BThere are four strip-shaped recesses in the middle, which, when viewed from the front, form an arc shape centered on the first groove 154. Furthermore, the four strip-shaped recesses on the lower surface of the second partition 15, together with the four strip-shaped recesses on the upper surface of the base 16 (described later), constitute the arc-shaped groove of the third guide section GD3 (described later). Therefore, the four strip-shaped recesses formed on the lower surface of the second partition 14 will be referred to below as the upper rail 153 of the third guide section. The cross-section of the upper rail 153 of the third guide section, in the direction orthogonal to the extending direction, is formed as a U-shaped cross-section with the opening facing downwards.
[0074] Figure 9 This is a three-dimensional view of the second wiring substrate. Figure 10 This is an exploded perspective view showing the first partition, the second wiring substrate, and the second partition.
[0075] like Figure 9 As shown, the second wiring substrate FPC2 is formed in a roughly dumbbell shape. A first coil C1 is disposed on the upper surface of the second wiring substrate FPC2, and two second coils C2 are disposed on the lower surface. The second wiring substrate FPC2 can be electrically connected to both the first coil C1 and the second coil C2 simultaneously, and supply power to them. The first coil C1 and the second coil C2 are respectively positioned on the second wiring substrate FPC2 opposite to the first magnet M1 and the second magnet M2.
[0076] like Figure 7B and Figure 10 As shown, on the lower surface of the first partition 14 opposite to the second partition 15, a second wiring substrate holding portion 146 matching the shape of the second wiring substrate FPC is provided. An opening 142 for the first coil C1 to be exposed is provided in the center of the first partition 14. Thus, with the second wiring substrate FPC held in the first partition 14, the first coil C1 is exposed through the opening 142 and positioned opposite the first magnet M1 provided on the holding plate 13. Since the second wiring substrate FPC is disposed on the first partition 14 via adhesive or the like, it can also be considered that the first coil C1 and the second coil C2 are disposed on the first partition 14.
[0077] In this embodiment, the first coil C1 is disposed on the first partition 14 and the first magnet M1 is disposed on the holding plate 13. However, this is not a limitation; the first magnet M1 may also be disposed on the first partition 14 and the first coil C1 on the holding plate 13. The first magnet M1 and the first coil C1, which are positioned opposite each other in the vertical direction, constitute the first driving unit GD1, which will be described later.
[0078] In this embodiment, the second coil C2 is described as being disposed on the first partition 14 and the second magnet M2 on the second partition 15. However, this is not a limitation; the second magnet M2 may also be disposed on the first partition 14 and the second coil C2 on the second partition 15. The second magnet M2 and the second coil C2, which are positioned vertically opposite each other, constitute the second drive unit GD2, which will be described later.
[0079] Figure 11A This shows a top view of the base. Figure 11B This shows a bottom view of the base.
[0080] A second groove 162 is provided in the center of the upper surface of the base 16. The second groove 162 is a conical groove with a cross-section forming an upward-opening V-shape. The second groove 162 is disposed opposite to the first groove 154 of the second partition plate 15.
[0081] On the upper surface of the base 16, i.e., the XY plane, multiple grooves are formed discontinuously and at equal intervals around the second groove 162 with the same radius. Figure 11A The base 16 has four strip-shaped recesses, which, when viewed from the front, form an arc shape centered on the second groove 162. Furthermore, the four strip-shaped recesses on the upper surface of the base 16 and the four strip-shaped recesses on the lower surface of the second partition 15 together form an arc-shaped groove, which will be described later as the third guide section GD3. Therefore, the four strip-shaped recesses on the upper surface of the base 16 will be referred to below as the lower guide rail 161 of the third guide section. The cross-section of the lower guide rail 161 in the direction orthogonal to the extending direction is formed as an upward-opening V-shaped cross-section. The multiple lower guide rails 161 and the multiple upper guide rails 151 of the second partition 15 are positioned opposite each other, and together they form an arc-shaped groove with an inverted U + positive V cross-section, serving as the third guide section GD3. The third guide section GD3 will be described later.
[0082] Additionally, each of the four corners of the upper surface of the base 16 has an inwardly recessed third magnet holding portion 164. The third magnet holding portion 164 is formed opposite to the third coil C3 on the lower surface of the second partition 15 and is used to hold the third magnet M3. The third magnet M3 is fixed in the third magnet holding portion 164, for example, by adhesive.
[0083] In this embodiment, the third coil C3 is provided on the second partition 15 and the third magnet M3 is provided on the base 16. However, this is not a limitation; the third magnet M3 may also be provided on the second partition 15 and the third coil C3 on the base 16. However, it is preferable to provide the third magnet M3 on the base 16 (which is a fixed-side component) and the third coil C3 on the second partition 15 (which is a movable-side component), thereby reducing the weight of the movable part. The third magnet M3 and the third coil C3, which are positioned vertically opposite each other, constitute the third drive unit GD3, which will be described later.
[0084] On the bottom surface of the base 16, there is an inwardly recessed magnetic plate holding portion 163 for arranging the magnetic plate MG. The magnetic plate holding portion 163 is positioned opposite the first magnet M1 and the second magnet M2, respectively. Thus, the magnetic plate MG, which is fixed in the magnetic plate holding portion 163 by an adhesive or the like, is opposite the first magnet M1 and the second magnet M2, respectively, and provides an attractive force in the Z direction (along the direction of the third axis AX3) to attract the first magnet M1 and the second magnet M2. The first magnet M1 and the second magnet M2 are both within the attraction range of the magnetic plate MG in the Z direction (along the direction of the third axis AX3).
[0085] As mentioned earlier, the first guide section GD1, the second guide section GD2, and the third guide section GD3 are all formed as strip-shaped and arc-shaped grooves, but the axial directions of the arc-shaped grooves formed by the three guide sections are different. Furthermore, in order to reduce sliding friction during movement and facilitate relatively easy movement between the layers, multiple ball bearings can be provided in the arc-shaped grooves. Below, refer to... Figures 12 to 14 To illustrate the specific structure.
[0086] Figure 12 Indicates along Figure 4 A cross-sectional view along line AA in the diagram. Figure 13 Indicates along Figure 4 A cross-sectional view along the BB line. Figure 14 Indicates along Figure 4 A cross-sectional view of the CC line.
[0087] like Figure 12 As shown, the first upper guide rail 131 of the first guide portion and the two lower guide rails 141 opposite it in the vertical direction (Z direction) together constitute the first guide portion GD1. The first guide portion GD1 is an arc-shaped groove that extends along the Y direction and bends, and its axis is the first axis AX1 located above the retaining plate 13 along the X direction. The second upper guide rail 132 of the first guide portion is not shown in the figure. The second upper guide rail 132 of the first guide portion is the only difference from the first upper guide rail 131 of the first guide portion in terms of cross-sectional shape. Otherwise, the two are the same, so the description is omitted.
[0088] In addition, a plurality of first balls BA1 are housed in a first guide portion GD1 formed in an arc-shaped groove, and can roll along the first guide portion GD1, thereby reducing the sliding friction between the retaining plate 13 and the first partition 14.
[0089] like Figure 13 As shown, the first upper rail 143 of the second guide portion and the two lower rails 151 of the second guide portion opposite it in the vertical direction (Z direction) together constitute the second guide portion GD2. The second guide portion GD2 is an arc-shaped groove that extends along the X direction and bends, and its axis is the second axis AX2 along the Y direction located above the retaining plate 13. The second upper rail 144 of the second guide portion is not shown in the figure. The second upper rail 144 of the second guide portion is the only difference from the first upper rail 143 of the second guide portion. Otherwise, the two are the same, so the description is omitted.
[0090] In addition, a plurality of second balls BA2 are housed in a second guide portion GD2 formed in an arc-shaped groove, and can roll along the second guide portion GD2, thereby reducing the sliding friction between the first partition 14 and the second partition 15.
[0091] like Figure 14 As shown, the upper rail 153 of the third guide section and the lower rail 161 of the third guide section opposite it in the vertical direction, i.e. the Z direction, together constitute the third guide section GD3. The third guide section GD3 is an arc-shaped groove with the center of the base 16 as the center, and its axis is the third axis AX3 passing through the center of the base 16.
[0092] In addition, multiple third balls BA3 are housed in a third guide portion GD3 formed as an arc-shaped groove, and can roll along the third guide portion GD3, thereby reducing the sliding friction between the second partition 15 and the base 16.
[0093] Additionally, at the intersection of the third axis AX3 and the base 16, there is a positioning part PP for determining the relative position of the second partition 15 and the base 16. The positioning part PP is composed of a fourth ball bearing BA4, a downward-facing V-shaped groove (i.e., a first groove 154) located at the center of the lower surface of the second partition 15, and a V-shaped groove (i.e., a second groove 162) located at the center of the upper surface of the base 16. By providing the positioning part PP, it is helpful to conveniently position the components during assembly. However, this is just one example; as long as the positioning function can be achieved, it can also be achieved in other ways, such as by providing a rod-shaped insertion part in the base 16 and a corresponding insertion part in the second partition 15.
[0094] in addition, Figure 14 The first drive unit DR1 and the second drive unit DR2 of this embodiment are also shown.
[0095] The first drive unit DR1 consists of a first magnet M1 disposed on the holding plate 13 and a first coil C1 disposed on the first partition plate 14. When the first coil C1 is energized, the first coil C1 is subjected to a force that causes it to move under the action of the first magnet M1. However, since the first partition plate 14, on which the first coil C1 is disposed, is engaged in the base 16 via the second partition plate 15, the first partition plate 14 does not move. Instead, the holding plate 13, on which the first magnet M1 is disposed, swings relative to the base 16 about the first axis AX1 under the drive of the first drive unit DR1.
[0096] The second drive unit DR2 consists of a second coil C2 disposed on the first partition 14 and a second magnet M2 disposed on the second partition 15. When the second coil C2 is energized, under the action of the second magnet M2, the second coil C2 is subjected to a force that causes it to move. As a result, the first partition 14, on which the second coil C2 is disposed, moves together with the holding plate 13 relative to the base 16 about the second axis AX2 under the drive of the second drive unit DR2. In addition, while the second drive unit DR2 drives the first partition 14 and the holding plate 13 to move together about the second axis AX2, the first drive unit DR1 can drive the holding plate 13 to move about the first axis AX1. Thus, they can be controlled individually or in conjunction.
[0097] Figure 15 This is a schematic diagram showing the third drive unit. Figure 15 For ease of explanation, the illustration of the second partition 15 is omitted, but the third coil C3 in the figure should be placed on the surface of the second partition 15 opposite to the base 16.
[0098] The third drive unit DR3 consists of a third coil C3 disposed on the second partition 15 and a third magnet M3 disposed on the base 16. When the third coil C3 is energized, under the action of the third magnet M3, the third coil C3 is subjected to a force that causes it to move. As a result, the second partition 15, on which the third coil C3 is disposed, drives the holding plate 13 and the first partition 14 to swing together relative to the base 16 about the third axis AX3 under the drive of the third drive unit DR3. In addition, while the third drive unit DR3 drives the second partition 15, the first partition 14, and the holding plate 13 to rotate together about the third axis AX3, the second drive unit DR2 can drive the first partition 14 and the holding plate 13 to swing together about the second axis AX2, and the first drive unit DR1 can drive the holding plate 13 to swing about the first axis AX1. Thus, each part can be controlled individually or in conjunction with the others.
[0099] [Optical Module]
[0100] Figure 16 An exploded 3D view of the optical module.
[0101] like Figure 16As shown, the optical module 1 includes: an imaging sensor driving device 10 as described above, a housing 30 covering the base 16 of the imaging sensor driving device 10, and a lens driving device 20 disposed between the imaging sensor driving device 10 and the housing 30. The imaging sensor driving device 10 and the lens driving device 20 are housed within the space formed by the base 16 and the housing 30.
[0102] Figure 16 The lens driving device 20 shown in the figure has a lens, but the lens is not a component of the lens driving device 20.
[0103] Figure 16 The lens driving device 20 can be a lens driving device in the prior art, preferably a lens driving device that can move horizontally in the X, Y and Z directions. If the optical module has such a lens driving device and the imaging sensor driving device of this embodiment, it can realize six degrees of freedom of movement in the X, Y and Z directions and rotation around the X, Y and Z axes.
[0104] While several embodiments of the present invention have been described above, these embodiments are provided as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are also included in the scope of the invention as described in the claims and its equivalents.
Claims
1. An imaging sensor driving device, characterized in that: have: Base; A holding plate located above the base for holding the imaging sensor; A first partition plate, opposite to the retaining plate, is disposed between the retaining plate and the base; as well as A second partition is disposed between the first partition and the base. A first driving unit is disposed between the retaining plate and the first partition plate; a second driving unit is disposed between the first partition plate and the second partition plate; a third driving unit is disposed between the second partition plate and the base; a portion of the retaining plate and a portion of the first partition plate form a first guiding unit; another portion of the first partition plate and a portion of the second partition plate form a second guiding unit; and another portion of the second partition plate and a portion of the base form a third guiding unit. The first driving unit drives the retaining plate to swing relative to the base about a first axis; the second driving unit drives the first partition to cause the retaining plate to swing relative to the base about a second axis; and the third driving unit drives the second partition to cause the first partition and the retaining plate to rotate relative to the base about a third axis. The first axis and the second axis are both located above the holding plate, and the third axis is perpendicular to the center of the imaging surface of the imaging sensor. The axial directions of the first axis, the second axis and the third axis are perpendicular to each other.
2. The imaging sensor driving device according to claim 1, characterized in that: The first driving unit comprises a first magnet and a first coil positioned opposite each other in the vertical direction. The first magnet is disposed on either the holding plate or the first partition, and the first coil is disposed on the other of the holding plate and the first partition. The second driving unit consists of a second magnet and a second coil positioned opposite each other in the vertical direction. The second magnet is disposed on either the first partition or the second partition, and the second coil is disposed on the other partition. The third driving unit consists of a third magnet and a third coil that are opposed to each other in the vertical direction. The third magnet is disposed on either the second partition or the base, and the third coil is disposed on the other of the second partition and the base.
3. The imaging sensor driving device according to claim 2, characterized in that: It also has: A first wiring substrate is disposed on the upper surface of the holding plate, and the first wiring substrate is electrically connected to the imaging sensor; A second wiring substrate is provided on the surface of the first partition opposite to the second partition. The upper and lower surfaces of the second wiring substrate are respectively provided with the first coil and the second coil. The second wiring substrate can be electrically connected to the first coil and the second coil simultaneously. as well as A third wiring substrate is disposed on the surface of the second partition plate opposite to the base, and the third wiring substrate is electrically connected to the third coil. The first partition has an opening for the first coil to be exposed. The first coil is opposite to the first magnet disposed on the retaining plate. The second coil is opposite to the second magnet disposed on the second partition. The third coil is opposite to the third magnet disposed on the base.
4. The imaging sensor driving device according to claim 1, characterized in that: A plurality of first ball bearings are provided between the retaining plate and the first partition plate. The plurality of first ball bearings are housed within a plurality of first guide portions formed in the shape of strips and can roll along the first guide portions. The first guide portion is an arc-shaped groove with the first shaft as its axis, and is composed of an upper rail provided on the retaining plate and a lower rail provided on the first partition plate. A plurality of second ball bearings are provided between the first partition and the second partition. The plurality of second ball bearings are housed within a plurality of second guide portions formed in the shape of strips and can roll along the second guide portions. The second guide portions are arc-shaped grooves with the second shaft as the axis, and are composed of an upper rail provided on the first partition and a lower rail provided on the second partition. There are multiple third balls between the second partition and the base. The multiple third balls are housed in multiple third guide portions formed in the shape of strips and can roll along the third guide portions. The third guide portions are arc-shaped grooves with the third axis as the axis and are composed of an upper rail provided on the second partition and a lower rail provided on the base.
5. The imaging sensor driving device according to claim 1, characterized in that: At the intersection of the third axis and the base, there is a positioning part for determining the relative position of the second partition and the base.
6. The imaging sensor driving device according to claim 2, characterized in that: At the bottom of the base, a magnetic plate is provided at a position opposite to the first magnet and the second magnet, respectively. The magnetic plate provides an attractive force to attract the first magnet and the second magnet in the direction along the third axis. The first magnet and the second magnet are both within the attraction range of the magnetic plate in the direction along the third axis.
7. The imaging sensor driving device according to claim 1, characterized in that: A pair of leaf springs are provided between the base and the retaining plate, with one end of the leaf spring fixed to the base and the other end fixed to the retaining plate.
8. The imaging sensor driving device according to claim 4, characterized in that: The lower rail of the arc-shaped groove has a V-shaped cross section in the direction orthogonal to the extension direction. The upper rail of the arc-shaped groove includes two types of upper rails with different cross sections in the direction orthogonal to the extension direction. The two types of upper rails have a V-shaped cross section with the opening facing downward and a U-shaped cross section with the opening facing downward.
9. The imaging sensor driving device according to claim 5, characterized in that: The positioning part consists of a fourth ball bearing, a downward-facing V-shaped groove located at the center of the lower surface of the second partition, and a V-shaped groove located at the center of the upper surface of the base.
10. An optical module, characterized in that: have: The imaging sensor driving device according to any one of claims 1 to 9; A lens driving device disposed above the imaging sensor driving device; as well as The housing covering the base, The imaging sensor drive device and the lens drive device are housed within the space formed by the base and the housing.