Exposure stage and exposure machine

Abstract

The embodiment of the present application discloses an exposure platform and an exposure machine; the exposure platform comprises a first light shielding part, and a second light shielding part which is vertically connected with the first light shielding part, wherein the second light shielding part is located at the first side of the first light shielding part and is arranged in a closed loop at the periphery of the first light shielding part; the first light shielding part and the second light shielding part arranged in a closed loop at the periphery of the first light shielding part are arranged, the bottom of the substrate to be exposed is shielded by the first light shielding part, and the side of the substrate to be exposed is shielded by the second light shielding part, so that the light leakage from the exposure platform and the substrate to be exposed is reduced, the stray light is reduced, the exposure precision is improved, and the lithography precision is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to an exposure stage and an exposure machine. Background Technology

[0002] In recent years, photolithography technology has been widely used in the display industry. With the development of technology, the requirements of substrates for photolithography technology are getting higher and higher. As the types of substrates become more diversified, the light transmittance of substrates is also gradually increasing. However, during the exposure process, light will pass through the substrate and generate stray light, which will affect the exposure accuracy and reduce the photolithography accuracy.

[0003] Therefore, there is an urgent need for an exposure stage and exposure machine to solve the above-mentioned technical problems. Summary of the Invention

[0004] This application provides an exposure stage and an exposure machine, which can alleviate the current technical problem of excessive stray light reducing exposure accuracy.

[0005] This application provides an exposure stage, including:

[0006] First light-shielding section;

[0007] The second light-shielding part is perpendicularly connected to the first light-shielding part;

[0008] The second light-shielding part is located on the first side of the first light-shielding part and is arranged in a closed loop around the first light-shielding part.

[0009] In some embodiments, the first light-shielding portion includes a first body and a first light-shielding material, the first light-shielding material being disposed within the first body; the second light-shielding portion includes a second body and a second light-shielding material, the second light-shielding material being disposed within the second body.

[0010] In some embodiments, the first light-shielding portion includes a first substrate and a first light-shielding layer, wherein the orthographic projection of the first light-shielding layer on the first substrate coincides with the first substrate; the second light-shielding portion includes a second substrate and a second light-shielding layer, wherein the orthographic projection of the second light-shielding layer on the second substrate coincides with the second substrate.

[0011] In some embodiments, the thickness of the second light-shielding layer in the direction perpendicular to the second substrate is greater than the thickness of the first light-shielding layer in the direction perpendicular to the first substrate.

[0012] In some embodiments, the exposure stage further includes a first adhesive layer located on the surface of the first side of the first light-shielding portion and on the surface of the second light-shielding portion on the side near the center of the exposure stage.

[0013] In some embodiments, the first adhesive layer includes an anti-adhesion material.

[0014] In some embodiments, the first light-shielding part and the second light-shielding part are detachably connected.

[0015] In some embodiments, the first light-shielding portion includes at least two detachably connected first sub-parts; the second light-shielding portion includes at least two detachably connected second sub-parts.

[0016] In some embodiments, the first sub-parts of the two connections include a first protrusion and a first recess that are connected accordingly; the second sub-parts of the two connections include a second protrusion and a second recess that are connected accordingly.

[0017] This application also provides an exposure machine, including an exposure stage and a moving device as described in any of the above.

[0018] The beneficial effects of this application are as follows: By setting a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part, the first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the first structure of the exposure stage provided in the embodiments of this application;

[0021] Figure 2 This is a top view schematic diagram of the second structure of the exposure stage provided in the embodiments of this application;

[0022] Figure 3 This is a schematic diagram of the third structure of the exposure stage provided in the embodiments of this application;

[0023] Figure 4 This is a schematic diagram of the fourth structure of the exposure stage provided in the embodiments of this application;

[0024] Figure 5 This is a top view of the structure of the first light-shielding part of the exposure stage provided in the embodiment of this application;

[0025] Figure 6This is a schematic diagram of the fifth structure of the exposure stage provided in the embodiments of this application;

[0026] Figure 7 This is a schematic diagram of the exposure machine provided in the embodiments of this application. Detailed Implementation

[0027] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only one embodiment of the light-shielding part of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0028] In recent years, photolithography technology has been widely used in the display industry. With the development of technology, the requirements of substrates for photolithography technology are getting higher and higher. As the types of substrates become more diversified, the light transmittance of substrates is also gradually increasing. However, during the exposure process, light will pass through the substrate and generate stray light, which will affect the exposure accuracy and reduce the photolithography accuracy.

[0029] Please see Figures 1 to 6 This application provides an exposure stage 100, comprising:

[0030] First light-shielding section 200;

[0031] The second light-shielding part 300 is perpendicularly connected to the first light-shielding part 200;

[0032] The second light-shielding part 300 is located on the first side 110 of the first light-shielding part 200 and is arranged in a closed loop around the first light-shielding part 200.

[0033] This application provides a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part. The first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0034] The technical solution of this application will now be described in conjunction with specific embodiments.

[0035] In this embodiment, please refer to Figure 1The exposure stage 100 includes a first light-shielding part 200 and a second light-shielding part 300 that is vertically connected to the first light-shielding part 200; wherein the second light-shielding part 300 is located on the first side 110 of the first light-shielding part 200 and is arranged in a closed loop around the first light-shielding part 200.

[0036] For ease of description, the horizontal direction is parallel to the X-axis, and the vertical direction is parallel to the Y-axis. The first light-shielding part 200 serves as a horizontal stage to support the substrate 600 to be exposed, while reducing the risk of light leaking from the bottom of the substrate 600. The second light-shielding part 300 is in the vertical direction to reduce the risk of light leaking from the sides of the substrate 600 to be exposed, and also serves to fix the substrate 600 to be exposed. This reduces light leakage at the junction of the exposure stage 100 and the substrate 600 to be exposed, reduces stray light, improves exposure accuracy, and improves photolithography accuracy.

[0037] In some embodiments, please refer to Figure 1 The first light-shielding part 200 includes a first main body 210 and a first light-shielding material 220, the first light-shielding material 220 being disposed within the first main body 210; the second light-shielding part 300 includes a second main body 310 and a second light-shielding material 320, the second light-shielding material 320 being disposed within the second main body 310.

[0038] By setting a light-blocking material inside the main body, a light-blocking effect is achieved. The integration of the first light-blocking part 200 and the second light-blocking part 300 is good, the light-blocking thickness can be increased, and the light-blocking effect is strong.

[0039] In some embodiments, the first light-shielding material 220 and the second light-shielding material 320 may be light-shielding materials such as chromium, iron, and carbon, and the first body 210 and the second body 310 may be load-bearing materials such as resin.

[0040] In some embodiments, please refer to Figure 2 The first light-shielding part 200 includes a first substrate 230 and a first light-shielding layer 240, and the orthographic projection of the first light-shielding layer 240 on the first substrate 230 coincides with the first substrate 230; the second light-shielding part 300 includes a second substrate 330 and a second light-shielding layer 340, and the orthographic projection of the second light-shielding layer 340 on the second substrate 330 coincides with the second substrate 330.

[0041] The first substrate 230 serves as the main support for the substrate 600 to be exposed, and the first light-shielding layer 240 serves as the light-shielding layer. The first substrate 230 and the first light-shielding layer 240 are fabricated and bonded together, which can reduce the difficulty of the process. The first light-shielding layer 240 can be located on the upper side or the lower side of the first substrate 230. Here, only the first light-shielding layer 240 can be located on the upper side of the first substrate 230 is illustrated. Similarly, the second substrate 330 and the second light-shielding layer 340 are fabricated and bonded together, which can reduce the difficulty of the process. Here, only the second light-shielding layer 340 can be located on the upper side of the second substrate 330 is illustrated.

[0042] In some embodiments, the first substrate 230 and the second substrate 330 may be a carrier material such as resin, and the first light-shielding layer 240 and the second light-shielding layer 340 may be a light-shielding material such as black ink.

[0043] In some embodiments, the OD (Optical Density) values ​​of the first light-shielding part 200 and the second light-shielding part 300 are greater than or equal to 2, which can provide a good light-shielding effect.

[0044] In some embodiments, please refer to Figure 2 The thickness of the second light-shielding layer 340 in the direction perpendicular to the second substrate 330 is greater than the thickness of the first light-shielding layer 240 in the direction perpendicular to the first substrate 230.

[0045] Generally, light is refracted and reflected in the substrate 600 to be exposed, and it is easy to escape from the side of the substrate 600. The second light-shielding layer 340 located on the side is made thicker, which helps to block the light emitted from the side of the substrate 600 to be exposed, thereby reducing light leakage from the interface between the exposure stage 100 and the substrate 600 to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0046] In some embodiments, please refer to Figure 3 The exposure stage 100 further includes a first adhesive layer 400, which is located on the surface of the first side 110 of the first light-shielding part 200 and on the surface of the second light-shielding part 300 near the center of the exposure stage 100.

[0047] The first side 110 of the first light-shielding part 200 needs to contact the bottom of the substrate 600 to be exposed, and the side of the second light-shielding part 300 near the center of the exposure stage 100 needs to contact the side of the substrate 600 to be exposed. The first adhesive layer 400 can strengthen the adhesion between the exposure stage 100 and the substrate 600 to be exposed, thereby enhancing the stability during exposure and the fit between the substrate 600 to be exposed and the exposure stage 100.

[0048] In some embodiments, the first adhesive layer 400 can be segmented according to different setting positions.

[0049] In some embodiments, the first adhesive layer 400 includes an anti-adhesion material. Using the anti-adhesion material, adhesive force can be provided when it is necessary to bond the substrate 600 to be exposed and the exposure stage 100; when bonding between the substrate 600 to be exposed and the exposure stage 100 is not required, for example, after exposure is completed and separation of the substrate 600 to be exposed and the exposure stage 100 is required, the first adhesive layer 400 is anti-adhesion, thereby achieving separation of the substrate 600 to be exposed and the exposure stage 100.

[0050] In some embodiments, the anti-tack material can be a thermally anti-tack material, which includes a resin, a curing agent, a solvent, and a foaming agent. The resin may include one or more of acrylic resin, alkyd resin, synthetic fatty acid resin, phenolic resin, and polyvinyl chloride resin.

[0051] In some embodiments, the exposure stage 100 further includes a heat-reflective layer located between the first adhesive layer 400 and the first light-shielding portion 200, and between the first adhesive layer 400 and the second light-shielding portion 300.

[0052] By utilizing the heat-reflective layer and heat, the rate of the heat-reducing adhesive material is enhanced when the adhesion is weak, thereby accelerating the separation of the exposure stage 100 from the substrate 600 to be exposed.

[0053] In some embodiments, the anti-tack material can be a low-temperature anti-tack material, which can be a pressure-sensitive adhesive or a resin adhesive. After the temperature decreases, the adhesion of the pressure-sensitive adhesive or resin adhesive decreases.

[0054] Since the temperature may rise during exposure, the adhesiveness of the heat-resistant material may fail prematurely. The advantage of the low-temperature anti-adhesion material is that the temperature rise during exposure will not affect the adhesive effect of the low-temperature anti-adhesion material, providing stable adhesive force and strengthening the adhesive force between the exposure stage 100 and the substrate 600 to be exposed, thereby enhancing the stability during exposure and the fit between the substrate 600 to be exposed and the exposure stage 100.

[0055] In some embodiments, the anti-adhesion material can be an electro-adhesion material, which may include catechol. When the material containing catechol is energized, it will reduce the adhesion of the first adhesive layer 400, thereby achieving the effect of quickly peeling off the exposure stage 100.

[0056] In some embodiments, please refer to Figure 1 The first light-shielding part 200 and the second light-shielding part 300 are detachably connected. This detachable connection structure facilitates the disassembly and connection of the first light-shielding part 200 and the second light-shielding part 300. When it is necessary to move the first light-shielding part 200 and the second light-shielding part 300, they can be moved separately, facilitating transfer and fitting.

[0057] In some embodiments, please refer to Figure 4 The first light-shielding part 200 includes at least two detachably connected first sub-parts 201; the second light-shielding part 300 includes at least two detachably connected second sub-parts.

[0058] In the figure, only the first sub-part 201 is shown as an example. The size of the first light-shielding part 200 can be changed by splicing. The size of the second light-shielding part 300 can be changed by splicing, so as to adapt to different sizes of substrates 600 to be exposed.

[0059] In some embodiments, please refer to Figure 5 The first sub-parts 201 connected by the two parts include a first protrusion 202 and a first recess 203 connected by the two parts; the second sub-parts connected by the two parts include a second protrusion and a second recess connected by the two parts.

[0060] In the figure, only the first protrusion 202 and the first concave portion 203 of the first sub-part 201 are shown as examples. The connection is achieved through the cooperation of the protrusion and concave portions. Preferably, taking the first protrusion 202 as an example, its width gradually increases in the direction away from the first sub-part 201. Correspondingly, the width of the first concave portion 203 gradually increases in the direction from the edge of the first sub-part 201 to its center, thereby enhancing the stability of the splicing between the first sub-part 201 and the other first sub-part 201. The second protrusion of the second sub-part is similar to the second concave portion.

[0061] In some embodiments, the first protrusion 202 of the first sub-part 201 corresponds to the second recess of the second sub-part, and the first recess 203 of the first sub-part 201 corresponds to the second protrusion of the second sub-part, thereby realizing the corresponding connection between the first sub-part 201 and the second sub-part.

[0062] In some embodiments, the exposure stage 100 further includes a second adhesive layer disposed between two adjacent first sub-parts 201 and between two adjacent second sub-parts.

[0063] The second adhesive layer is used to bond the first sub-part 201 and to bond the second sub-part.

[0064] In some embodiments, the second adhesive layer may include a non-adhesive material to facilitate separation. The specific properties and materials of the non-adhesive material may be found in embodiments where the first adhesive layer 400 includes a non-adhesive material, and will not be described in detail here.

[0065] In some embodiments, please refer to Figure 6 The exposure stage 100 further includes a connecting component 500, which is disposed on the second side of the first light-shielding part 200 and on the side of the second light-shielding part 300 away from the center of the exposure stage 100.

[0066] The second side is the opposite side of the first side 110. The connecting member 500 is used to connect with the moving device 20 of the exposure machine 10 to move the first light-shielding part 200 and / or the second light-shielding part 300.

[0067] This application provides a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part. The first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0068] Please see Figure 7 This application also provides an exposure machine 10, including an exposure stage 100 and a moving device 20 as described above.

[0069] In some embodiments, the exposure machine 10 further includes an exposure lamp 30.

[0070] This application provides a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part. The first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0071] This application embodiment also provides an exposure method for an exposure machine 10, including:

[0072] S100, provides a substrate 600 to be exposed.

[0073] S200, provides any of the exposure machines 10 as described above.

[0074] S300: The first light-shielding part 200 of the exposure stage 100 is correspondingly set to the bottom of the substrate 600 to be exposed, and the second light-shielding part 300 of the exposure stage 100 is correspondingly set to the side of the substrate 600 to be exposed.

[0075] S400, Expose the substrate 600 to be exposed.

[0076] This application provides a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part. The first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0077] In this embodiment, the exposure method of the exposure machine 10 includes:

[0078] S100, provides a substrate 600 to be exposed.

[0079] In some embodiments, the substrate 600 to be exposed can be a glass substrate or a substrate of other materials. The exposure stage 100 of this application can use a first light-shielding part 200 to shield the bottom of the substrate 600 to be exposed and a second light-shielding part 300 to shield the side of the substrate 600 to be exposed, thereby reducing light leakage from the interface between the exposure stage 100 and the substrate 600 to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0080] S200, provides any of the exposure machines 10 as described above.

[0081] In some embodiments, the exposure stage 100 includes a first light-shielding part 200 and a second light-shielding part 300 that is vertically connected to the first light-shielding part 200; wherein the second light-shielding part 300 is located on a first side 110 of the first light-shielding part 200 and is arranged in a closed loop around the first light-shielding part 200.

[0082] In some embodiments, the first light-shielding portion 200 includes a first substrate 230 and a first light-shielding layer 240, wherein the orthographic projection of the first light-shielding layer 240 onto the first substrate 230 coincides with the first substrate 230; the second light-shielding portion 300 includes a second substrate 330 and a second light-shielding layer 340, wherein the orthographic projection of the second light-shielding layer 340 onto the second substrate 330 coincides with the second substrate 330.

[0083] In some embodiments, the thickness of the second light-shielding layer 340 in the direction perpendicular to the second substrate 330 is greater than the thickness of the first light-shielding layer 240 in the direction perpendicular to the first substrate 230.

[0084] In some embodiments, the exposure stage 100 further includes a first adhesive layer 400, which is located on the surface of the first side 110 of the first light-shielding portion 200 and on the surface of the second light-shielding portion 300 on the side near the center of the exposure stage 100.

[0085] In some embodiments, the first adhesive layer 400 includes an anti-adhesion material. Using the anti-adhesion material, adhesive force can be provided when it is necessary to bond the substrate 600 to be exposed and the exposure stage 100; when bonding between the substrate 600 to be exposed and the exposure stage 100 is not required, for example, after exposure is completed and separation of the substrate 600 to be exposed and the exposure stage 100 is required, the first adhesive layer 400 is anti-adhesion, thereby achieving separation of the substrate 600 to be exposed and the exposure stage 100.

[0086] In some embodiments, the first light-shielding part 200 and the second light-shielding part 300 are detachably connected. This detachable connection facilitates the disassembly and connection of the first light-shielding part 200 and the second light-shielding part 300. When it is necessary to move the first light-shielding part 200 and the second light-shielding part 300, they can be moved separately, facilitating transfer and fitting.

[0087] In some embodiments, the first light-shielding portion 200 includes at least two detachably connected first sub-parts 201; the second light-shielding portion 300 includes at least two detachably connected second sub-parts.

[0088] In some embodiments, the first sub-parts 201 connected by the two connections include a first protrusion 202 and a first recess 203 connected by the corresponding connections; the second sub-parts connected by the two connections include a second protrusion and a second recess connected by the corresponding connections.

[0089] In some embodiments, the first protrusion 202 of the first sub-part 201 corresponds to the second recess of the second sub-part, and the first recess 203 of the first sub-part 201 corresponds to the second protrusion of the second sub-part, thereby realizing the corresponding connection between the first sub-part 201 and the second sub-part.

[0090] In some embodiments, the exposure stage 100 further includes a connecting member 500, which is disposed on a second side of the first light-shielding portion 200 and on a side of the second light-shielding portion 300 away from the center of the exposure stage 100.

[0091] S300: The first light-shielding part 200 of the exposure stage 100 is correspondingly set to the bottom of the substrate 600 to be exposed, and the second light-shielding part 300 of the exposure stage 100 is correspondingly set to the side of the substrate 600 to be exposed.

[0092] In some embodiments, the first light-shielding part 200 and the second light-shielding part 300 may be configured sequentially to enhance the bonding effect with the substrate 600 to be exposed, reduce light leakage, reduce stray light, improve exposure accuracy, and improve photolithography accuracy.

[0093] In some embodiments, the first light-shielding part 200 and the second light-shielding part 300 in step S400 can be moved by the moving device 20, which can be a robotic arm or the like.

[0094] S400, Expose the substrate 600 to be exposed.

[0095] In some embodiments, the exposure lamp 30 is used to expose the substrate 600 to be exposed.

[0096] In some embodiments, the substrate 600 to be exposed may include a substrate and a mask disposed on the substrate.

[0097] This application provides a first light-shielding part and a second light-shielding part arranged in a closed loop around the first light-shielding part. The first light-shielding part blocks the bottom of the substrate to be exposed, and the second light-shielding part blocks the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0098] This application discloses an exposure stage and an exposure machine. The exposure stage includes a first light-shielding part and a second light-shielding part perpendicularly connected to the first light-shielding part. The second light-shielding part is located on a first side of the first light-shielding part and is arranged in a closed loop around the first light-shielding part. By setting the first light-shielding part and the second light-shielding part arranged in a closed loop around the first light-shielding part, this application uses the first light-shielding part to block the bottom of the substrate to be exposed and the second light-shielding part to block the side of the substrate to be exposed, thereby reducing light leakage from the interface between the exposure stage and the substrate to be exposed, reducing stray light, improving exposure accuracy, and improving photolithography accuracy.

[0099] The above provides a detailed description of an exposure stage and exposure machine provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An exposure stage, characterized in that, include: First light-shielding section; The second light-shielding part is perpendicularly connected to the first light-shielding part; The second light-shielding part is located on the first side of the first light-shielding part and is arranged in a closed loop around the first light-shielding part; the exposure stage further includes a first adhesive layer, which is located on the surface of the first side of the first light-shielding part and on the surface of the second light-shielding part near the center of the exposure stage. The first adhesive layer includes an anti-adhesion material. The first light-shielding part and the second light-shielding part are detachably connected. The first light-shielding part includes at least two detachably connected first sub-parts. The second light-shielding part includes at least two detachably connected second sub-parts. The two connected first sub-parts include a first protrusion and a first concave part that are connected to each other. The two connected second sub-parts include a second protrusion and a second concave part that are connected to each other.

2. The exposure stage according to claim 1, characterized in that, The first light-shielding part includes a first main body and a first light-shielding material, wherein the first light-shielding material is disposed within the first main body; The second light-shielding part includes a second main body and a second light-shielding material, wherein the second light-shielding material is disposed within the second main body.

3. The exposure stage according to claim 1, characterized in that, The first light-shielding part includes a first substrate and a first light-shielding layer, wherein the orthographic projection of the first light-shielding layer on the first substrate coincides with the first substrate; The second light-shielding part includes a second substrate and a second light-shielding layer, and the orthographic projection of the second light-shielding layer on the second substrate coincides with the second substrate.

4. The exposure stage according to claim 3, characterized in that, The thickness of the second light-shielding layer in the direction perpendicular to the second substrate is greater than the thickness of the first light-shielding layer in the direction perpendicular to the first substrate.

5. An exposure machine, characterized in that, It includes the exposure stage and the moving device as described in any one of claims 1 to 4.

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