Display panel and display device

Abstract

Embodiments of the present application disclose a display panel and a display device, the display panel has a display area and a non-display area, the display panel comprises: a driving chip located in the non-display area, a binding terminal located in the non-display area, the binding terminal is located on the side, away from the display area, of the driving chip, the binding terminal is electrically connected with the driving chip through a wire, a circuit board located in the non-display area, and the circuit board comprises a substrate and a packaging device located on the side, away from the binding terminal, of the substrate, the substrate comprises a pin, a first end of the pin is electrically connected with the packaging device, and a second end of the pin is electrically connected with the binding terminal, the present application sets the circuit board in the non-display area of the display panel, and the packaging device of the circuit board is electrically connected with the driving chip through the pin and the binding terminal, so that the line length between the packaging device and the driving chip is reduced, the driving chip can normally input and output signals, and the display panel can normally display.

Description

Technical Field

[0001] This invention relates to the field of displays, and more specifically to a display panel and a display device. Background Technology

[0002] Currently, such as Figure 1 As shown, the display panel 100' is electrically connected to the main body of the display device via a flexible circuit board 103'. One end of the flexible circuit board 103' is connected to the display panel 100', and the other end of the flexible circuit board 103' is connected to the main body of the display device. The components required for the operation of the driver chip 101' are all located on the flexible circuit board 103', which results in excessively long connection traces between the driver chip 101' and the components, reducing the signal quality between the driver chip 101' and the components, and potentially causing the display panel 100' to fail to display normally.

[0003] Therefore, there is an urgent need for a display panel and display device to solve the above-mentioned technical problems. Summary of the Invention

[0004] This invention provides a display panel and display device that can alleviate the technical problem that excessively long connection traces between the driver chip and the device lead to reduced signal quality and the inability of the display panel to display normally.

[0005] This invention provides a display panel having a display area and a non-display area, the display panel comprising:

[0006] The driver chip is located within the non-display area;

[0007] A bonding terminal is located within the non-display area, and the bonding terminal is located on the side of the driver chip away from the display area. The bonding terminal is electrically connected to the driver chip via a wire.

[0008] A circuit board is located in the non-display area, and the circuit board includes a substrate and a package device located on the side of the substrate away from the bonding terminal, the package device being electrically connected to the driver chip through the bonding terminal;

[0009] The substrate includes pins, a first end of which is electrically connected to the packaged device, and a second end of which is electrically connected to the bonding terminal.

[0010] Preferably, the circuit board includes a first circuit board, the first circuit board including a first substrate and a first type of packaging device located on the side of the first substrate away from the bonding terminal;

[0011] The first substrate includes a first type of pin, and the bonding terminal includes a first type of bonding terminal. The first end of the first type of pin is electrically connected to the output terminal of the first type of packaged device, and the second end of the first type of pin is electrically connected to the first type of input terminal of the driver chip through the first type of bonding terminal.

[0012] Preferably, the first type of packaged device includes a first sub-packaged device, the first substrate further includes a second type of pins, and the bonding terminal further includes a second type of bonding terminal;

[0013] The first end of the second type of pin is electrically connected to the input terminal of the first sub-package device, and the second end of the second type of pin is electrically connected to the first type of output terminal of the driver chip through the second type of bonding terminal.

[0014] Preferably, the circuit board further includes a second circuit board, the second circuit board including a second substrate and a second type of packaging device located on the side of the second substrate away from the bonding terminal;

[0015] The second substrate further includes a third type of pin, and the bonding terminal further includes a third type of bonding terminal. The first end of the third type of pin is electrically connected to the output terminal of the second type of packaged device, and the second end of the third type of pin is electrically connected to the second type of input terminal of the driver chip through the third type of bonding terminal.

[0016] Preferably, the first type of packaged device further includes a second sub-packaged device, the first substrate further includes a fourth type of pin and a fifth type of pin, and the bonding terminal further includes a fourth type of bonding terminal and a fifth type of bonding terminal;

[0017] Wherein, the first end of the fourth type of pin is electrically connected to the input end of the second sub-package device, and the second end of the fourth type of pin is electrically connected to the second end of the third type of pin through the fourth type of bonding terminal and the third type of bonding terminal;

[0018] The first end of the fifth type pin is electrically connected to the output end of the second sub-package device, and the second end of the fifth type pin is electrically connected to the second type input end of the driver chip through the fifth type bonding terminal.

[0019] Preferably, the non-display area includes a binding area corresponding to the display area and a bend area located between the binding area and the display area;

[0020] The bonding area includes a protruding sub-area on the side away from the bending area, and the second circuit board is located within the protruding sub-area.

[0021] Preferably, the display panel further includes a substrate, the substrate including a first part located in the non-display area, the circuit board being fixed to the first part, and the orthographic projection of the circuit board on the plane of the display panel being located within the orthographic projection of the first part on the plane of the display panel.

[0022] Preferably, the circuit board includes a through-hole penetrating the substrate, the pin is located in the through-hole, and a first end of the pin is located on the side of the through-hole away from the bonding terminal, and a second end of the pin is located on the side of the through-hole closer to the bonding terminal.

[0023] Preferably, the substrate includes a first side away from the bonding terminal, a second side near the bonding terminal, and a third side connecting the first side and the second side;

[0024] The pin is located on the third side, with a first end of the pin extending to the first side and a second end of the pin extending to the second side.

[0025] The present invention also provides a display device, including a display panel as described above and a device body, wherein the device body and the display panel are integrated into one unit;

[0026] The display panel is electrically connected to the main body of the device via a second type of encapsulation device.

[0027] This invention reduces the line length between the packaging device and the driver chip by placing the circuit board in the non-display area of ​​the display panel and electrically connecting the packaging device of the circuit board to the driver chip through pins and bonding terminals, thereby enabling the driver chip to input and output signals normally, and thus enabling the display panel to display normally. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an existing display panel;

[0030] Figure 2 This is a schematic diagram of the structure of the display panel provided in an embodiment of the present invention;

[0031] Figures 3A to 3C yes Figure 2 A magnified three-dimensional structural diagram of the first type in region B;

[0032] Figures 4A to 4B yes Figure 2 A schematic diagram of the second type of enlarged three-dimensional structure in region B;

[0033] Figure 5 yes Figure 2 An enlarged 3D structural diagram of region C;

[0034] Figure 6 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0036] Currently, display panels suffer from signal quality degradation between the driver chip and the components required for the driver chip to operate due to excessively long interconnection traces, which leads to the display panel failing to display properly.

[0037] Please see Figures 2 to 5 This invention provides a display panel 100, which has a display area AA and a non-display area NA. The display panel 100 includes:

[0038] The driver chip 101 is located within the non-display area NA;

[0039] The bonding terminal 102 is located within the non-display area NA, and the bonding terminal 102 is located on the side of the driver chip 101 away from the display area AA. The bonding terminal 102 and the driver chip 101 are electrically connected through wires within the non-display area NA.

[0040] The circuit board 103 is located within the non-display area NA, and the circuit board 103 includes a substrate 104 and a packaging device 105 located on the side of the substrate 104 away from the bonding terminal 102. The packaging device 105 is electrically connected to the driver chip 101 through the bonding terminal 102.

[0041] The substrate 104 includes pins 106, the first end of which is electrically connected to the package device 105, and the second end of which is electrically connected to the bonding terminal 102.

[0042] This invention reduces the line length between the packaging device and the driver chip by placing the circuit board in the non-display area of ​​the display panel and electrically connecting the packaging device of the circuit board to the driver chip through pins and bonding terminals, thereby enabling the driver chip to input and output signals normally, and thus enabling the display panel to display normally.

[0043] The technical solution of the present invention will now be described in conjunction with specific embodiments.

[0044] Please see Figure 2 , Figures 3A to 3C as well as Figures 4A to 4B , Figure 3A for Figure 2 A first schematic diagram of the first circuit board 103a in region B. Figure 3B for Figure 2 A second schematic diagram of the first circuit board 103a in region B. Figure 3C for Figure 2 A schematic diagram of the bonding terminal 102 in region B; Figure 4A for Figure 2 A third schematic diagram of the first circuit board 103a in region B. Figure 4B for Figure 2 A fourth schematic diagram of the first circuit board 103a in region B. In this embodiment, the circuit board 103 includes a first circuit board 103a, which includes a first substrate 104a and a first type of packaging device 105a located on the side of the first substrate 104a away from the bonding terminal 102.

[0045] The first substrate 104a includes a first type of pin, the bonding terminal 102 includes a first type of bonding terminal, the first end of the first type of pin is electrically connected to the output terminal of the first type of packaged device 105a, and the second end of the first type of pin is electrically connected to the first type of input terminal of the driver chip 101 through the first type of bonding terminal.

[0046] In some embodiments, the driver chip 101 includes a first type of input terminal, and the first type of bonding terminal is electrically connected to the first type of input terminal.

[0047] The first type of pins are connected to the first type of packaged device 105a, the first type of pins are connected to the first type of bonding terminals one by one, and the first type of bonding terminals are connected to the first type of input terminals one by one.

[0048] The first type of packaged device 105a may include a capacitor for regulating or boosting voltage for the driver chip 101, a functional resistor, and a protection diode for protecting the driver chip 101.

[0049] In some embodiments, the first type of package device 105a includes a first sub-package device, the first substrate 104a further includes a second type of pin, and the bonding terminal 102 further includes a second type of bonding terminal.

[0050] The first end of the second type of pin is electrically connected to the input end of the first sub-package device, and the second end of the second type of pin is electrically connected to the first type of output end of the driver chip 101 through the second type of bonding terminal.

[0051] In some embodiments, the driver chip 101 includes a first type of output terminal and a second type of bonding terminal electrically connected to the first type of output terminal.

[0052] The second type of pins are connected to the first type of packaged device 105a, the second type of pins are connected to the second type of bonding terminals one by one, and the second type of bonding terminals are connected to the first type of output terminals one by one.

[0053] That is, the signal output by the driver chip 101 is output through the first type of output terminal, transmitted through the first type of bonding terminal to the first type of pin, reaches the input terminal of the first sub-package device, and then, after passing through the output terminal of the first sub-package device, is transmitted through the second type of pin to the second type of bonding terminal, and finally transmitted to the first type of output terminal through the wire connected to the first type of output terminal via the second type of bonding terminal. Therefore, the first sub-package device realizes functions such as voltage boost, voltage regulation, and protection. The first sub-package device may include the capacitor and the resistor, etc.

[0054] In some embodiments, the first sub-package device can be connected one-to-one with the first type of pins, and the first sub-package device can be connected one-to-one with the second type of pins.

[0055] Alternatively, multiple first sub-package devices can be connected in series or in parallel to form a first sub-package device group, with each first sub-package device group connected to a first type of pin and each first sub-package device group connected to a second type of pin.

[0056] Please see Figure 5 , Figure 5 for Figure 2A schematic diagram of the structure of the second circuit board 103b in region C. In some embodiments, the circuit board 103 further includes a second circuit board 103b, which includes a second substrate 104b and a second type of packaging device 105b located on the side of the second substrate 104b away from the bonding terminal 102.

[0057] The second substrate 104b further includes a third type of pin, and the bonding terminal 102 further includes a third type of bonding terminal. The first end of the third type of pin is electrically connected to the output terminal of the second type of packaged device 105b, and the second end of the third type of pin is electrically connected to the second type of input terminal of the driver chip 101 through the third type of bonding terminal.

[0058] The second type of packaged device 105b can be a first type of connection device, used to connect the display panel 100 and the display device body and transmit the information of the display device body to the driver chip 101.

[0059] In some embodiments, the driver chip 101 includes a second type of input terminal, and the third type of bonding terminal is connected to the second type of input terminal of the driver chip 101.

[0060] The third type of pin is connected to the second type of packaged device 105b, the third type of pin is connected to the third type of bonding terminal, and the third type of bonding terminal is connected to the second type of input terminal.

[0061] In some embodiments, the second type of packaged device 105b can be connected one-to-one with the third type of pins.

[0062] Alternatively, multiple second-type packaged devices 105b may be connected in series or in parallel to form a second-type packaged device group, with each second-type packaged device group corresponding to a third-type pin.

[0063] In some embodiments, the third type of bonding terminal is directly connected to the second type of input terminal via a wire.

[0064] That is, after the signal passes through the output terminal of the second type of packaged device 105b, it is transmitted directly to the second type of input terminal of the driver chip 101 via the third type of pin and the third type of bonding terminal, so that the driver chip 101 receives the corresponding signal.

[0065] In some embodiments, the first type of package device 105a further includes a second sub-package device, the first substrate 104a further includes a fourth type of pin and a fifth type of pin, and the bonding terminal 102 further includes a fourth type of bonding terminal and a fifth type of bonding terminal.

[0066] The first end of the fourth type of pin is electrically connected to the input end of the second sub-package device, and the second end of the fourth type of pin is electrically connected to the second end of the third type of pin through the fourth type of bonding terminal and the third type of bonding terminal.

[0067] The first end of the fifth type pin is electrically connected to the output end of the second sub-package device, and the second end of the fifth type pin is electrically connected to the second type input end of the driver chip 101 through the fifth type bonding terminal.

[0068] That is, after the signal is output from the output terminal of the second type of package device 105b, it passes through the third type of pin and the third type of bonding terminal, and then through the fourth type of bonding terminal and the fourth type of pin to the input terminal of the second sub-package device. After passing through the second sub-package device, the signal is transmitted from the output terminal of the second sub-package device to the fifth type of pin and the fifth type of bonding terminal, and reaches the second type of input terminal of the driver chip 101, thereby transmitting the corresponding signal to the driver chip 101.

[0069] The second sub-package device can be a first type of protection diode device, used to protect the driver chip 101 during the transmission of signals from the main body of the display device to the display panel 100.

[0070] In some embodiments, the second sub-package device can be connected one-to-one with the fourth type of pins, and the second sub-package device can be connected one-to-one with the fifth type of pins.

[0071] Alternatively, multiple second sub-package devices can be connected in series or in parallel to form a second sub-package device group, with each second sub-package device group connected to a corresponding fourth type pin and each second sub-package device group connected to a corresponding fifth type pin.

[0072] In some embodiments, the circuit board 103 further includes a third type of packaging device located on the side of the second substrate 104b away from the bonding terminal 102.

[0073] The second substrate 104b further includes a sixth type of pin, and the bonding terminal 102 further includes a sixth type of bonding terminal. The first end of the sixth type of pin is electrically connected to the input terminal of the third type of packaged device, and the second end of the sixth type of pin is electrically connected to the second type of output terminal of the driver chip 101 through the sixth type of bonding terminal.

[0074] The third type of packaging device can be a second type of connection device, used to connect the display panel 100 to the display device body and transmit the information of the display panel 100 to the display device body.

[0075] In some embodiments, the driver chip 101 includes a second type of output terminal, and the sixth type of bonding terminal is connected to the second type of output terminal of the driver chip 101.

[0076] The sixth type of pin is connected to the third type of packaged device, the sixth type of pin is connected to the sixth type of bonding terminal, and the sixth type of bonding terminal is connected to the second type of output terminal.

[0077] In some embodiments, the third type of packaged device can be connected one-to-one with the sixth type of pins.

[0078] Alternatively, multiple third-type packaged devices may be connected in series or in parallel to form a third-type packaged device group, with each third-type packaged device group corresponding to a sixth-type pin.

[0079] In some embodiments, the sixth type of bonding terminal is directly connected to the second type of output terminal via a wire.

[0080] That is, after the signal passes through the second type of input terminal of the driver chip 101, it is directly transmitted to the sixth type of bonding terminal through the wire, then transmitted to the input terminal of the third type of packaged device through the sixth type of pin, and finally output to the main body of the display device through the output terminal of the third type of packaged device.

[0081] In some embodiments, the first circuit board 103a further includes a fourth type of packaged device located on the side of the first substrate 104a away from the bonding terminal 102, the first substrate 104a further includes a seventh type of pin and an eighth type of pin, and the bonding terminal 102 further includes a seventh type of bonding terminal and an eighth type of bonding terminal.

[0082] The first end of the seventh type pin is electrically connected to the output end of the fourth type packaged device, and the second end of the seventh type pin is electrically connected to the second end of the sixth type pin through the seventh type bonding terminal and the sixth type bonding terminal.

[0083] The first end of the eighth type pin is electrically connected to the input end of the fourth type packaged device, and the second end of the eighth type pin is electrically connected to the second type output end of the driver chip 101 through the eighth type bonding terminal.

[0084] That is, after the signal is output from the second type of output terminal of the driver chip 101, it is transmitted to the input terminal of the fourth type of packaged device through the eighth type of bonding terminal and the eighth type of pin. Then, it is transmitted to the sixth type of bonding terminal and the sixth type of pin through the seventh type of pin and the seventh type of bonding terminal, and reaches the input terminal of the third type of packaged device. Finally, it is output to the main body of the display device through the output terminal of the third type of packaged device.

[0085] The fourth type of packaged device can be a second type of protection diode device, used to protect the driver chip 101 during the transmission of signals from the display panel 100 to the main body of the display device.

[0086] In some embodiments, the fourth type of packaged device can be connected one-to-one with the seventh type of pins, and the fourth type of packaged device can be connected one-to-one with the eighth type of pins.

[0087] Alternatively, multiple fourth-type packaged devices may be connected in series or in parallel to form a fourth-type packaged device group, with each fourth-type packaged device group corresponding to a seventh-type pin and each fourth-type packaged device group corresponding to an eighth-type pin.

[0088] In some embodiments, the first circuit board 103a includes a first sub-circuit board and a second sub-circuit board, the first sub-circuit board including a first sub-substrate, and the second sub-circuit board including a second sub-substrate. The first type of package device 105a and / or the fourth type of package device are located on the side of the first sub-substrate and the second sub-substrate away from the bonding terminal 102.

[0089] In some embodiments, the first sub-package device is located on the side of the first sub-substrate away from the bonding terminal 102, and the second sub-package device is located on the side of the second sub-substrate away from the bonding terminal 102. This facilitates the reasonable arrangement of the wires connecting the bonding terminals 102 of the first and second sub-package devices to the driver chip 101. The fourth type of package device is located on the side of the second sub-substrate away from the bonding terminal 102.

[0090] The arrangement of the first sub-circuit board and the second sub-circuit board facilitates the reasonable arrangement of the first type of packaged device 105a and / or the fourth type of packaged device. Furthermore, when there are many first type of packaged devices 105a and / or fourth type of packaged devices, the first circuit board 103a may also include a third sub-circuit board, a fourth sub-circuit board, ..., an Nth sub-circuit board, in order to achieve a reasonable arrangement of the first type of packaged device 105a and / or the fourth type of packaged device.

[0091] Meanwhile, by replacing the original flexible circuit board with the first circuit board 103a and the second circuit board 103b, the material used for the flexible circuit board is saved in the production process, reducing the manufacturing cost. In addition, since various functional devices, such as the first type of packaged device 105a and the second type of packaged device 105b, are packaged and integrated on the first circuit board 103a and the second circuit board 103b, they can be directly applied to different types of display panels, saving the cost of adapting different flexible circuit boards to different types of display panels. Finally, since the circuit board 103 is directly located in the non-display area NA of the display panel 100, the overall thickness of the display panel 100 is reduced.

[0092] In some embodiments, the non-display area NA includes a binding area corresponding to the display area AA and a bend area located between the binding area and the display area AA.

[0093] The bonding area includes a protruding sub-area on the side away from the bending area, and the second circuit board 103b is located within the protruding sub-area.

[0094] In some embodiments, the display panel 100 further includes a substrate 107, the substrate 107 including a first portion located within the non-display area NA, and the orthographic projection of the circuit board 103 on the plane of the display panel 100 is located within the orthographic projection of the first portion on the plane of the display panel 100, which helps to save materials and reduce the thickness of the display panel 100.

[0095] The driver chip 101, the bonding terminal 102, and the circuit board 103 are all fixed to the first part.

[0096] The substrate 107 includes a second part located within the display area AA, and the display panel 100 also includes a display functional device located within the display area AA. The display functional device is located in the second part and is electrically connected to the driver chip 101 via a wire.

[0097] In some embodiments, the circuit board 103 includes a through hole penetrating the substrate 104, the pin 106 is located in the through hole, and the first end of the pin 106 is located on the side of the through hole away from the bonding terminal 102, and the second end of the pin 106 is located on the side of the through hole close to the bonding terminal 102.

[0098] The first end of the pin 106 is electrically connected to the package device 105 via a line on the substrate 104. Alternatively, the first end of the pin 106 is electrically connected to the package device 105 by directly contacting it.

[0099] The second end of the pin 106 extends to the second side and makes direct contact with the bonding terminal 102 to achieve an electrical connection with the bonding terminal 102.

[0100] In some embodiments, the substrate 104 includes a first side away from the bonding terminal 102, a second side near the bonding terminal 102, and a third side connecting the first side and the second side.

[0101] The pin 106 is located on the third side, with a first end of the pin 106 extending to the first side and a second end of the pin 106 extending to the second side.

[0102] The first end of the pin 106 extends to the first side and is electrically connected to the package device 105 via a line on the substrate 104. Alternatively, the first end of the pin 106 extends to the first side and is electrically connected to the package device 105 by directly contacting it.

[0103] The second end of the pin 106 extends to the second side and makes direct contact with the bonding terminal 102 to achieve an electrical connection with the bonding terminal 102.

[0104] The circuit board 103 is fixed to the substrate 107 through the connection of the pin 106 to the bonding terminal 102. The display panel 100 also includes conductive adhesive located between the second end of the pin 106 and the bonding terminal 102. The pin 106 and the bonding terminal 102 are electrically connected and fixed through the conductive adhesive.

[0105] In this embodiment of the invention, the circuit board 103 is placed in the non-display area NA of the display panel 100, and the packaging device 105 of the circuit board 103 is electrically connected to the driver chip 101 through the pin 106 and the bonding terminal 102. This reduces the line length between the packaging device 105 and the driver chip 101, so that the driver chip 101 can input and output signals normally, thereby enabling the display panel 100 to display normally.

[0106] Please see Figure 6 The present invention also provides a display device 10, including a display panel 100 as described above and a device body 200, wherein the device body 200 and the display panel 100 are combined into one unit.

[0107] The display panel 100 is electrically connected to the device body 200 via a second type of encapsulation device 105b.

[0108] The main body 200 of the device includes a motherboard, and the second type of packaged device 105b is electrically connected to the motherboard.

[0109] The display device 10 provided in this embodiment of the invention reduces the line length between the package device 105 and the driver chip 101 by placing the circuit board 103 in the non-display area NA of the display panel 100 and electrically connecting the package device 105 of the circuit board 103 to the driver chip 101 through the pins 106 and the bonding terminal 102, so that the driver chip 101 can normally input and output signals, thereby enabling the display panel 100 to display normally.

[0110] This invention discloses a display panel and a display device. The display panel has a display area and a non-display area. The display panel includes: a driver chip located in the non-display area; a bonding terminal located in the non-display area, the bonding terminal being located on the side of the driver chip away from the display area, and the bonding terminal being electrically connected to the driver chip via wires; and a circuit board located in the non-display area. The circuit board includes a substrate and a package device located on the side of the substrate away from the bonding terminal. The substrate includes pins, a first end of which is electrically connected to the package device, and a second end of which is electrically connected to the bonding terminal. By placing the circuit board in the non-display area of ​​the display panel, and having the package device of the circuit board electrically connected to the driver chip via pins and bonding terminals, this invention reduces the line length between the package device and the driver chip, enabling the driver chip to input and output signals normally, thereby allowing the display panel to display normally.

[0111] The above provides a detailed description of a display panel and display device provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area, and the display panel includes: The driver chip is located within the non-display area; A bonding terminal is located within the non-display area, and the bonding terminal is located on the side of the driver chip away from the display area. The bonding terminal is electrically connected to the driver chip via a wire. A circuit board, located within the non-display area, includes a substrate and a packaged device located on the side of the substrate away from the bonding terminals. The packaged device is electrically connected to the driver chip via the bonding terminals. The packaged device includes capacitors, resistors, connectors, and protection diodes. The substrate includes a first part located within the non-display area, the driving chip, the bonding terminal, and the circuit board are all fixed to the first part, and the orthographic projection of the circuit board on the plane where the display panel is located is located within the orthographic projection of the first part on the plane where the display panel is located; The substrate includes pins, a first end of which is electrically connected to the packaged device, and a second end of which is electrically connected to the bonding terminal. The circuit board includes a second circuit board, which includes a second substrate and a second type of packaged device located on the side of the second substrate away from the bonding terminal, and the second type of packaged device includes the connecting device; the second substrate includes a third type of pin, and the bonding terminal includes a third type of bonding terminal, the first end of the third type of pin being electrically connected to the output terminal of the second type of packaged device, and the second end of the third type of pin being electrically connected to the second type of input terminal of the driver chip through the third type of bonding terminal; the connecting device is configured to connect the display panel and the display device body and transmit information of the display device body to the driver chip.

2. The display panel according to claim 1, characterized in that, The circuit board further includes a first circuit board, the first circuit board including a first substrate and a first type of packaged device located on the side of the first substrate away from the bonding terminal, the first type of packaged device including the capacitor, the resistor and the protection diode; The first substrate includes a first type of pin, and the bonding terminal includes a first type of bonding terminal. The first end of the first type of pin is electrically connected to the output terminal of the first type of packaged device, and the second end of the first type of pin is electrically connected to the first type of input terminal of the driver chip through the first type of bonding terminal.

3. The display panel according to claim 2, characterized in that, The first type of packaged device includes a first sub-packaged device, the first substrate further includes a second type of pins, and the bonding terminal further includes a second type of bonding terminal; the first sub-packaged device includes the capacitor and the resistor. The first end of the second type of pin is electrically connected to the input terminal of the first sub-package device, and the second end of the second type of pin is electrically connected to the first type of output terminal of the driver chip through the second type of bonding terminal.

4. The display panel according to claim 2, characterized in that, The first type of packaged device further includes a second sub-packaged device; the first substrate further includes a fourth type of pin and a fifth type of pin; the bonding terminal further includes a fourth type of bonding terminal and a fifth type of bonding terminal; the second sub-packaged device includes the protection diode device; Wherein, the first end of the fourth type of pin is electrically connected to the input end of the second sub-package device, and the second end of the fourth type of pin is electrically connected to the second end of the third type of pin through the fourth type of bonding terminal and the third type of bonding terminal; The first end of the fifth type pin is electrically connected to the output end of the second sub-package device, and the second end of the fifth type pin is electrically connected to the second type input end of the driver chip through the fifth type bonding terminal.

5. The display panel according to claim 1, characterized in that, The non-display area includes a binding area corresponding to the display area and a bend area located between the binding area and the display area; The bonding area includes a protruding sub-area on the side away from the bending area, and the second circuit board is located within the protruding sub-area.

6. The display panel according to claim 1, characterized in that, The circuit board includes a through-hole penetrating the substrate, the pin is located in the through-hole, and the first end of the pin is located on the side of the through-hole away from the bonding terminal, and the second end of the pin is located on the side of the through-hole closer to the bonding terminal.

7. The display panel according to claim 1, characterized in that, The substrate includes a first side away from the bonding terminal, a second side close to the bonding terminal, and a third side connecting the first side and the second side; The pin is located on the third side, with a first end of the pin extending to the first side and a second end of the pin extending to the second side.

8. A display device, characterized in that, Includes a display panel as described in any one of claims 1 to 7 and a device body, wherein the device body and the display panel are integrated into one unit; The display panel is electrically connected to the main body of the device via the second type of packaging device.

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