Display module

Abstract

The application provides a display module, which comprises a display panel, an integrated circuit chip and a flexible circuit board. The display panel comprises a display area and a terminal area located on one side of the display area. A plurality of first terminals are arranged in the terminal area. The flexible circuit board is electrically connected with the first terminals. The flexible circuit board is extended from the side of the integrated circuit chip close to the first part to the side of the integrated circuit chip away from the first part, so as to increase the overlapping part of the flexible circuit board and the terminal area, reduce the module space occupied by the flexible circuit board after being bent to the back of the display panel, and thus more space can be saved for placing a battery, thereby improving the endurance of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module. Background Technology

[0002] In recent years, with the technological development of smart terminal devices and wearable devices, the demand for flat panel displays has become increasingly diversified. Organic light-emitting diode (OLED) display technology, for example, has self-emissive properties and, compared to liquid crystal display technology, eliminates the need for a backlight module, making it more energy-efficient.

[0003] Currently, the bottom bezel of existing organic light-emitting diode (OLED) display modules contains integrated circuit chips and flexible circuit boards. When the bottom bezel, integrated circuit chips, and flexible circuit boards of the OLED display module are bent to the back of the OLED display module, the flexible circuit boards will occupy a large amount of module space.

[0004] Therefore, it is necessary to provide a display module to improve this deficiency. Summary of the Invention

[0005] The embodiments of this application provide a display module that can increase the overlap between the flexible circuit board and the terminal area, and reduce the module space occupied by the flexible circuit board after the terminal area is bent to the back of the display panel, thereby saving more space for placing the battery and improving the battery life of the display module.

[0006] Embodiments of this application provide a display module, including: The display panel includes a display area and a terminal area located on one side of the display area, wherein a plurality of first terminals are provided in the terminal area; An integrated circuit chip is disposed in the terminal area and located on the side of the first terminal closer to the display area; and A flexible circuit board, electrically connected to the first terminal, the flexible circuit board extending from the side of the integrated circuit chip near the first terminal to the side of the integrated circuit chip away from the first terminal.

[0007] According to one embodiment of this application, the flexible circuit board includes: The first part has multiple second terminals, which are electrically connected to the first terminal. The first part is disposed on the side of the integrated circuit chip near the first terminal. The second part is disposed on the side of the first part away from the integrated circuit chip, and the second part is connected to the first part. The second part has a greater number of metal film layers than the first part. The third part is connected to the first part and extends from the first part to the side of the integrated circuit chip away from the first terminal. The number of metal film layers in the third part is the same as the number of metal film layers in the first part.

[0008] According to one embodiment of this application, the second part includes at least one first bonding metal layer, at least one first signal transmission metal layer located above the first bonding metal layer, and at least one second signal transmission metal layer located below the first bonding metal layer. The first part has the same number of second bonding metal layers as the first bonding metal layers, and each second bonding metal layer is disposed in the same layer as a corresponding first bonding metal layer. The third part has the same number of third signal transmission metal layers as the second bonding metal layers, and each third signal transmission metal layer is disposed in the same layer as a corresponding second bonding metal layer.

[0009] According to one embodiment of this application, the flexible circuit board further includes a transition portion with a corner, one end of the transition portion is connected to the second portion, and the other end of the transition portion is connected to an adapter for connecting other devices externally. The number of metal film layers in the transition portion is the same as the number of metal film layers in the third portion.

[0010] According to one embodiment of this application, the adapter has at least one fourth signal transmission metal layer, and each of the fourth signal transmission metal layers is disposed on the same layer as the corresponding second signal transmission metal layer.

[0011] According to one embodiment of this application, the flexible circuit board further includes: A fourth part is disposed on the side of the second part away from the first part, the fourth part is connected to the second part, and the number of metal film layers in the fourth part is the same as the number of metal film layers in the third part; and The adapter has a corner, one end of which is connected to the fourth part, and the other end of which is connected to an adapter for connecting other devices. The number of metal film layers in the adapter is the same as the number of metal film layers in the fourth part.

[0012] According to one embodiment of this application, the fourth part has at least one fifth signal transmission metal layer, each of the fifth signal transmission metal layers is disposed on the same layer as a corresponding second signal transmission metal layer, and the transition part has the same number of fourth signal transmission metal layers as the fifth signal transmission metal layers, each of the fourth signal transmission metal layers is disposed on the same layer as a corresponding fifth signal transmission metal layer.

[0013] According to one embodiment of this application, the third part has an opening that penetrates the third part in the thickness direction, and the integrated circuit chip is located within the opening.

[0014] According to one embodiment of this application, there is a gap between the integrated circuit chip and the edge of the opening.

[0015] According to one embodiment of this application, an adhesive layer is provided between the third part and the terminal area, the adhesive layer being used to bond the third part to the terminal area.

[0016] The beneficial effects of the embodiments of this application are as follows: The embodiments of this application provide a display module, which includes a display panel, an integrated circuit chip, and a flexible circuit board. The display panel includes a display area and a terminal area located on one side of the display area. A plurality of first terminals are disposed in the terminal area. The integrated circuit chip is disposed in the terminal area and located on the side of the first terminals close to the display area. The flexible circuit board is electrically connected to the first terminals. By extending the flexible circuit board from the side of the integrated circuit chip close to the first terminal to the side of the integrated circuit chip away from the first terminal, the overlap between the flexible circuit board and the terminal area of ​​the display panel is increased, and the module space occupied by the flexible circuit board after bending to the back of the display panel is reduced. This saves more space for placing the battery and improves the battery life of the display module. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the display module before bending, as provided in the first embodiment of this application; Figure 2 for Figure 1 The diagram shows a cross-sectional view of the display module along the A-A' direction; Figure 3 for Figure 1 The diagram shows a cross-sectional view of the display module along the B-B' direction; Figure 4 This is a schematic diagram of the bent structure of the display module provided in the first embodiment of this application; Figure 5 for Figure 4 The diagram shows a cross-sectional view of the display module along the C-C' direction; Figure 6 A schematic diagram of the film layer structure of the flexible circuit board provided in the first embodiment of this application; Figure 7 This is a schematic diagram of the structure of the display module before bending, as provided in the second embodiment of this application. Figure 8 for Figure 7 The diagram shows a cross-sectional view of the display module along the D-D' direction; Figure 9This is a schematic diagram of the structure of the display module after bending, as provided in the second embodiment of this application; Figure 10 A schematic diagram of the film layer structure of the flexible circuit board provided in the second embodiment of this application; Figure 11 This is a schematic diagram of the structure of the display module before bending, provided in the third embodiment of this application; Figure 12 for Figure 11 The diagram shows a cross-sectional view of the display module along the E-E' direction. Detailed Implementation

[0018] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative and understanding purposes and not for limiting the application. In the figures, structurally similar units are represented by the same reference numerals.

[0019] The present application will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] The embodiments of this application provide a display module that can increase the overlap between the flexible circuit board and the terminal area, and reduce the module space occupied by the flexible circuit board after the terminal area is bent to the back of the display panel, thereby saving more space for placing the battery and improving the battery life of the display module.

[0021] Please see Figure 1 The display module 100 includes a display panel 1, an integrated circuit chip 2, and a flexible circuit board 3. The display panel 1 may include a display area AA and a non-display area NA on its front surface, which is the display surface of the display panel. The display area AA is provided with multiple pixels arranged in an array. The non-display area NA may be an area without pixels, or it may be provided with virtual pixels (i.e., pixels that are not lit up when the display panel is working). The non-display area NA may be provided with driving circuits and signal lines.

[0022] The non-display area NA may include a terminal area PA, which is located on one side of the display area AA. The terminal area PA may have multiple terminals, and the integrated circuit chip 2 and the flexible circuit board 3 may be bonded and connected to the corresponding terminals in the terminal area PA.

[0023] In this embodiment, please refer to Figure 1Before the terminal area PA of the display panel is bent to the back surface of the display panel, the terminal area PA is located below the display area AA, and the area where the terminal area PA is located can be regarded as the bottom bezel of the display panel. In the final finished structure of the display panel, the terminal area PA can be bent to the back surface of the display panel 1, which can reduce the width of the bottom bezel of the display panel and achieve a narrow bezel effect. The back surface is the non-display surface of the display panel that is opposite to the display surface, and can also be referred to as the back of the display panel.

[0024] In this embodiment, the display panel 1 is a flexible organic light-emitting diode display panel. The display panel 1 can be bent and has a bending area BA, which is located between the display area AA and the terminal area PA.

[0025] Combination Figure 4 and Figure 5 As shown, when the display panel 1 is in a bent state, the bending area BA can have a predetermined curvature, and the terminal area PA can be bent from the front surface of the display panel 1 to the rear surface of the display panel 1.

[0026] The integrated circuit chip 2 is disposed in the terminal area PA. The terminal area PA may have multiple terminals, and the integrated circuit chip 2 is bonded and connected to the terminals in the terminal area PA.

[0027] Please see Figure 2 The terminal area PA may have multiple first terminals 11, and the integrated circuit chip 2 is located on the side of the first terminal 11 close to the display area AA.

[0028] It should be noted that the integrated circuit chip 2 being located on the side of the first terminal 11 closest to the display area AA refers to, for example... Figure 1 The diagram shows the relative positions of the integrated circuit chip 2, the first terminal 11, and the display area AA when the display module is in an unbent state.

[0029] The flexible circuit board 3 is electrically connected to the first terminal 11. The flexible circuit board 3 extends from the side of the integrated circuit chip 2 near the first terminal 11 to the side of the integrated circuit chip 2 away from the first terminal 11. With this structure, the overlap between the flexible circuit board 3 and the terminal area PA can be increased, and the module space occupied by the flexible circuit board 3 after bending to the back of the display panel can be reduced, thereby saving more space for placing the battery and improving the battery life of the display module.

[0030] Furthermore, the flexible circuit board 3 includes a first portion 31, which is disposed on the side of the integrated circuit chip 2 near the first terminal 11. The first portion 31 partially overlaps with the terminal area PA in the thickness direction of the display panel. The first portion 31 has a plurality of second terminals 310, which are disposed opposite to and connected to the first terminal 11.

[0031] Please see Figure 2 The terminal area PA has a plurality of first terminals 11 on the side near the flexible circuit board 3, and the first part 31 of the flexible circuit board 3 has a plurality of second terminals 310 on the side near the terminal area PA. The first terminals 11 and the second terminals 310 overlap in the thickness direction of the display panel, and the first terminals 11 and the second terminals 310 can be connected by soldering.

[0032] It should be noted that the first direction X in this article can refer to, for example, Figure 1 The horizontal direction shown in the image, the second direction Y can refer to, for example, the horizontal direction. Figure 1 The vertical direction shown in the image, the third direction Z can refer to the direction perpendicular to the plane containing the first direction X and the second direction Y. The third direction Z can also be regarded as the thickness direction of the display panel.

[0033] The flexible circuit board 3 also includes a second part 32, which is located on the side of the first part 31 away from the integrated circuit chip 2. The second part 32 is connected to the first part 31, and the second part 32 does not overlap with the terminal area PA in the thickness direction of the display panel. The second part 32 has a device area 320, in which components can be disposed. There can be one or more components, which can be, but are not limited to, electrical components such as capacitors and resistors. Other signal transmission lines can also be disposed in the device area 320.

[0034] The flexible circuit board 3 also includes a third part 33, which is disposed on the side of the first part 31 near the integrated circuit chip 2. The third part 33 is connected to the first part 31 and extends from the first part 31 (i.e. the side of the integrated circuit chip 2 near the first part 31) to the side of the integrated circuit chip 2 away from the first part 31. The third part 33 overlaps with the terminal area PA in the thickness direction of the display panel.

[0035] Combination Figure 1 As shown, the dashed box below the second part 32 represents the original location of the third part 33. In this embodiment, by moving the third part to the side of the first part 31 closer to the integrated circuit chip 2, and distributing the third part 33 from the side of the integrated circuit chip 2 closest to the first part 31 to the side of the integrated circuit chip 2 furthest from the first part 31, the overlap between the flexible circuit board 3 and the terminal area PA of the display panel is increased. This reduces the space occupied by the flexible circuit board 3 along the second direction Y. The reduced space is... Figure 1 The area shown by the dashed box below section 32 in the second part.

[0036] Combination Figure 5 As shown, when the terminal area PA is bent to the back of the display panel 1, the space reduced by the flexible circuit board 3 (i.e., Figure 5The area within the dashed box shown on the right side of section 32 in the second part can be used to place batteries or other components. For example, without changing the overall size of the display module, if the space reduced by the flexible circuit board 3 is used to place the battery, the display module can have more space to accommodate a larger battery, thereby improving the battery life of the display module.

[0037] It should be noted that, Figures 1 to 5 This illustration only shows the structure of the flexible circuit board 3 and its relative position to the display panel 1, and does not represent the actual structure of the flexible circuit board 3 in practical applications. Figures 1 to 5 The area shown in the dashed box below or to the right of the second part 32 is only for illustration of the space reduction occupied by the flexible circuit board 3, and does not represent the actual structure of the flexible circuit board 3.

[0038] Further, please refer to Figure 1 The flexible circuit board 3 also includes a corner-shaped adapter 35. The adapter 35 is "L"-shaped. One end of the adapter 35 is connected to the second part 32, and the other end of the adapter 35 is connected to an adapter 36 for connecting other devices. The adapter 36 can be an adapter, and the other devices can be a control board or a power supply.

[0039] Furthermore, the number of metal film layers in the second part 32 is different from the number of metal film layers in the first part 31, and the number of metal film layers in the third part 33 is different from the number of metal film layers in the second part 32.

[0040] It should be noted that flexible circuit boards are typically composed of a substrate, an adhesive layer, and a metal layer. In this embodiment, the number of metal film layers in the first part 31 refers to the number of metal layers in the first part 31.

[0041] Furthermore, the number of metal film layers in the first part 31 is less than the number of metal film layers in the second part 32, the number of metal film layers in the third part 33 is less than the number of metal film layers in the second part 32, and the number of metal film layers in the first part 31 is the same as the number of metal film layers in the third part 33.

[0042] like Figure 2 As shown, the first part 31 overlaps with the terminal area PA of the display panel in the third direction Z, and the second part 32 overlaps with the terminal area PA in the third direction Z. By making the number of metal film layers in the first part 31 less than the number of metal film layers in the second part 32, and the number of metal film layers in the third part 33 less than the number of metal film layers in the second part 32, the number and thickness of film layers in the first part 31 and the second part 32 are reduced, thereby reducing the thickness of the display module in the terminal area PA, and avoiding the influence of the large number and thickness of metal film layers in the first part 31 and the second part 32 on the bending process of the terminal area of ​​the display module.

[0043] In some embodiments, the second part 32 includes at least one first bonding metal layer 323, at least one first signal transmission metal layer 321 located above the first bonding metal layer 323, and at least one second signal transmission metal layer 322 located below the first bonding metal layer 323. The first part 31 has the same number of second bonding metal layers 311 as the first bonding metal layers 323, and each second bonding metal layer 311 is disposed in the same layer as a corresponding first bonding metal layer 323. The third part 33 has the same number of third signal transmission metal layers 331 as the second bonding metal layers 311, and each third signal transmission metal layer 331 is disposed in the same layer as a corresponding second bonding metal layer 311.

[0044] In one embodiment, such as Figure 6 As shown, the first part 31 has two second bonding metal layers 311, multiple first substrates 312, and multiple first adhesive layers 313. The second bonding metal layers 311 can be used to form the second terminal 310 and the signal trace connected to the second terminal 310. The first substrates 312 are disposed on opposite sides of the second bonding metal layers 311. The first adhesive layers 313 are located between the first substrates 312 and the second bonding metal layers 311 and are used to attach the first substrates 312 to the surface of the second bonding metal layers 311.

[0045] The second part 32 has two first bonding metal layers 323, a first signal transmission metal layer 321 located above the first bonding metal layers 323, and three second signal transmission metal layers 322 located below the first bonding metal layers 323. A second substrate 324 and a second adhesive layer 325 may be disposed between adjacent metal layers of the second part 32. Each first bonding metal layer 323 is disposed on the same layer as a corresponding second bonding metal layer 311. The first bonding metal layer 323 has multiple signal traces, which are used to electrically connect with the second terminal 310 in the second bonding metal layer 311. Both the first signal transmission metal layer 321 and the second signal transmission metal layer 322 have multiple signal traces. The signal traces in the first signal transmission metal layer 321 and the second signal transmission metal layer 322 can be used to transmit display signals or touch signals. The signal traces in the first signal transmission metal layer 321 and / or the second signal transmission metal layer 322 can be electrically connected to the signal traces in the first bonding metal layer 323 through vias between the film layers.

[0046] The third part 33 has two third signal transmission metal layers 331, multiple third substrates 332, and multiple third adhesive layers 333. The third substrates 332 are disposed on opposite sides of the third conductive layer 331, and the third adhesive layers 333 are located between the third substrates 332 and the third conductive layer 331, for bonding the third substrates 332 to the surface of the third conductive layer 331. Each third signal transmission metal layer 331 is disposed in the same layer as a corresponding second bonding metal layer 311. The third signal transmission metal layer 331 may have multiple signal traces, and the signal traces in the third signal transmission metal layer 331 may be electrically connected to the second terminal 310 or the signal traces in the first part.

[0047] It should be noted that if the second bonding metal layer 311 of the first part 31 and the third signal transmission metal layer 331 of the third part 33 are arranged on the same layer as the second signal transmission metal layer 322 of the second part 32 located below, that is, the bottom of the first part 31 and the third part 33 are flush with the bottom of the first part 31, when the third part 33 is subsequently bonded to the terminal area PA with adhesive, the bottom surface of the second part 32 will extend far beyond the surface of the terminal area PA, resulting in a lack of support on the bottom surface of the second part 32, affecting the flatness of the flexible circuit board. If the second bonding metal layer 311 of the first part 31 and the third signal transmission metal layer 331 of the third part 33 are arranged on the same layer as the first signal transmission metal layer 321 of the second part 32 located above, that is, the top of the first part 31 and the third part 33 are flush with the top of the first part 31, the difference between the bottom surface of the first part 31 and the bottom surface of the second part 32 will be large, which will also affect the flatness of the flexible circuit board.

[0048] In this embodiment, by setting the second bonding metal layer 311 of the first part 31 and the third signal transmission metal layer 331 of the third part 33 in the same layer as the first bonding metal layer 323 of the second part 32, it can not only reduce the thickness of the display module in the terminal area PA, and avoid the bending process of the terminal area of ​​the display module being affected by the large number and thickness of the film layers of the first part 31 and the third part 33, but also prevent the bottom surface of the second part 32 from exceeding the surface of the terminal area PA. The second part 32 can be supported by the back of the display panel, thereby ensuring the flatness of the flexible circuit board.

[0049] In this embodiment, the first part 31 and the third part 33 can be an integral structure, that is, any one of the substrates in the first part 31 and the third part 33 can be a complete substrate, rather than two substrates spliced ​​together. The second bonding metal layer 311 in the first part 31 and the third signal transmission metal layer 331 in the third part 33 can be etched from the same copper foil, rather than two copper foils spliced ​​together.

[0050] In this embodiment, the second bonding metal layer 311 in the first part 31 and the third signal transmission metal layer 331 in the third part 33 can both be led out from the first bonding metal layer 323 in the second part 32 that is disposed in the same layer as the second bonding metal layer 311. That is, the second bonding metal layer 311, the third signal transmission metal layer 331 and the first bonding metal layer 323 in the second part 32 that is disposed in the same layer as the second bonding metal layer 311 can be etched from the same layer of copper foil. Other adjacent film layers in the first part 31 and the second part 32 can be fixed into a whole by pressing. The first bonding metal layer 323 and the first signal transmission metal layer 321 and the second signal transmission metal layer 322 located in different layers can be electrically connected by conductive pillars 326 formed in the vias.

[0051] In practical applications, the number of metal layers in the first part 31, the second part 32, and the third part 33 can be set according to actual needs. If the display panel has a high resolution and there are many circuits in the flexible circuit board, the number of the second bonding metal layer 311 in the first part 31 can be 2 layers, and the number of metal layers in the second part 32 can be 6 or 8 layers or more. If the display panel has a low resolution and there are few circuits in the flexible circuit board, the number of the second bonding metal layer 311 in the first part 31 can also be 1 layer, and the number of metal layers in the second part 32 can also be 2 or 4 layers.

[0052] In some embodiments, the adapter 35 has at least one fourth signal transmission metal layer 350, and each fourth signal transmission metal layer 350 is disposed on the same layer as a corresponding second signal transmission metal layer 322.

[0053] In one embodiment, such as Figure 6 As shown, the adapter 35 has two fourth signal transmission metal layers 350. The two fourth signal transmission metal layers 350 are disposed on the same layer as the bottommost second signal transmission metal layer 322. That is, the bottom of the adapter 35 is flush with the bottom of the second part 32. Neither the adapter 35 nor the second part 32 overlaps with the terminal area PA. This ensures the flatness of the bottom of the part of the flexible circuit board that does not overlap with the terminal area PA.

[0054] Furthermore, the flexible circuit board 3 also includes a multilayer conductive plating layer 301, which is disposed between the adhesive layer and the conductive layer.

[0055] like Figure 6 As shown, taking the second part 32 as an example, the second part 32 includes four conductive plating layers 301, which are disposed between adjacent metal layers and the second adhesive layer 325.

[0056] In this embodiment, the conductive layers in the flexible circuit board are made of the same material as the conductive plating layer 301 and the conductive pillars 326, which is copper.

[0057] Furthermore, the flexible circuit board 3 also includes an electromagnetic shielding layer 302, which is provided on the opposite side surfaces of the first part 31, the second part 32 and the third part 33.

[0058] In one embodiment, such as Figure 1 As shown, the third part 33 has an opening 334 that penetrates the third part 33 in the thickness direction, which is the Z-direction. The integrated circuit chip 2 is located within the opening 334, and the third part 33 does not cover the integrated circuit chip 2. This not only facilitates the heat dissipation of the integrated circuit chip 2, but also reduces the signal interference of the flexible circuit board 3 to the integrated circuit chip 2.

[0059] The shape and size of the opening 334 are adapted to the shape of the integrated circuit chip 2. For example, the shape of the orthographic projection of the integrated circuit chip 2 onto the terminal area PA is rectangular, and the shape of the orthographic projection of the opening 334 onto the third direction Z is also rectangular.

[0060] Furthermore, there is a gap between the integrated circuit chip 2 and the edge of the opening 334.

[0061] like Figure 1 As shown, there are gaps between the integrated circuit chip 2 and the edge of the opening 334 in both the first direction X and the second direction Y. This can prevent interference between the integrated circuit chip 2 and the flexible circuit board 3 during the bonding process, and also prevent water vapor and salt spray from entering the integrated circuit chip 2 during the bonding process due to the small distance between the flexible circuit board 3 and the integrated circuit chip 2, which could cause damage to the chip.

[0062] Furthermore, the distance between the integrated circuit chip 2 and the edge of the opening 334 is greater than or equal to 0.5 mm and less than or equal to 1 mm.

[0063] like Figure 1 As shown, in the first direction X, the distance between the edge of the opening 334 and the integrated circuit chip 2 is 0.5 mm; in the second direction Y, the distance between the edge of the opening 334 and the integrated circuit chip 2 is 0.5 mm.

[0064] In practical applications, in the first direction X, the distance between the edge of the opening 334 and the integrated circuit chip 2 is not limited to 0.5 mm as in the above embodiment, but can also be 0.6, 0.8, or 1 mm. Similarly, in the second direction Y, the distance between the edge of the opening 334 and the integrated circuit chip 2 is not limited to 0.5 mm as in the above embodiment, but can also be 0.6, 0.8, or 1 mm. The distance between the edge of the opening 334 and the integrated circuit chip 2 in the first direction X and the distance between the edge of the opening 334 and the integrated circuit chip 2 in the second direction Y can be equal or unequal; no limitation is made here.

[0065] Furthermore, an adhesive layer 4 is provided between the third part 33 and the terminal area PA, and the adhesive layer 4 is used to bond the third part 33 to the terminal area PA.

[0066] like Figure 2 As shown, the adhesive layer 4 is disposed on the side of the integrated circuit chip 2 away from the first terminal 11, and the third part 33 is fixed to the terminal area PA of the display panel 1 by the adhesive layer 4.

[0067] In one embodiment, the adhesive layer 4 is a double-sided adhesive, with both its upper and lower surfaces being adhesive. One side of the adhesive layer 4 is adhered to the surface of the terminal area PA of the integrated circuit chip 2 near the display area AA, and the other side of the adhesive layer 4 is adhered to the surface of the third part 33 of the flexible circuit board 3 near the terminal area PA. The third part 33 is fixed to the terminal area PA of the display panel 1 by the adhesive layer 4. In practical applications, the adhesive layer 4 can be, but is not limited to, pressure-sensitive adhesive.

[0068] Please see Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the display module before bending, provided in the second embodiment of this application. Figure 7 The display module structure of the second embodiment shown is similar to... Figure 1 The display module of the first embodiment shown has a similar structure, except that the flexible circuit board 3 further includes a fourth part 34, which is disposed on the side of the second part 32 away from the first part 31 and connected to the second part 32. One end of the adapter part 35 is connected to the fourth part 34, and the number of film layers in the fourth part 34 is less than the number of film layers in the second part 32.

[0069] For display modules where the space in the terminal area PA along the second direction Y is insufficient, a portion of the circuit below the second part 32 (i.e., the third part 33) can be moved to the side of the first part 31 closer to the integrated circuit chip 2, while a portion of the circuit below the second part 32 (i.e., the fourth part 34) can be retained. This can also reduce the module space occupied by the flexible circuit board to a certain extent; the reduced space is... Figure 7The area shown by the dashed box below the fourth part 34. In some embodiments, the number of metal film layers in the fourth part 34 and the number of metal film layers in the transition part 35 are the same as the number of metal film layers in the first part 31 and / or the second part 32, that is, both the fourth part 34 and the transition part 35 contain two metal layers. In some other embodiments, when the number of film layers in the first part 31 and the second part 32 is the same, the number of film layers in the fourth part 34 is the same as the number of film layers in the first part 31 and the second part 32; when the number of film layers in the first part 31 and the second part 32 is different, the fourth part 34 may have the same number of film layers as either the first part 31 or the second part 32.

[0070] In some embodiments, the fourth part 34 has at least one fifth signal transmission metal layer 340, each fifth signal transmission metal layer 340 is disposed on the same layer as the corresponding second signal transmission metal layer 322, and the transition part 35 has the same number of fourth signal transmission metal layers 350 as the fifth signal transmission metal layers 340, each fourth signal transmission metal layer 350 is disposed on the same layer as the corresponding fifth signal transmission metal layer 340.

[0071] In one embodiment, please refer to Figure 10 The fourth part 34 has two fifth signal transmission metal layers 340, and the adapter part 35 has two fourth signal transmission metal layers 350. The two fifth signal transmission metal layers 340 and the two fourth signal transmission metal layers 350 are arranged on the same layer as the bottommost second signal transmission metal layer 322. That is, the bottom of the fourth part 34 and the adapter part 35 are flush with the bottom of the second part 32. The fourth part 34, the adapter part 35 and the second part 32 do not overlap with the terminal area PA. This can ensure the flatness of the bottom of the part of the flexible circuit board that does not overlap with the terminal area PA.

[0072] like Figure 9 As shown, when the terminal area PA is bent to the back of the display panel, the entire flexible circuit board 3 can be bent to the back of the display panel along with the terminal area PA, and the first part 31, the second part 32, the third part 33, the fourth part 34, the adapter part 35 and the adapter 36 of the flexible circuit board 3 can be bent without bending. Figure 9 The area shown by the dashed box above part 34 in the middle is the space reduced by the flexible circuit board 3, and this area can be used to place the battery.

[0073] Please see Figure 11 , Figure 11 This is a schematic diagram of the structure of the display module before bending, as provided in the third embodiment of this application. Figure 11 The structure of the display module shown in the third embodiment is similar to... Figure 1The display module of the first embodiment shown has a similar structure, except that the third part 33 of the flexible circuit board 3 does not have an opening 334. On the front surface of the display panel, the third part 33 of the flexible circuit board 3 covers the integrated circuit chip 2 in the thickness direction of the display panel. Figure 11 The part shown in the dashed box in the third part 33 is the integrated circuit chip 2.

[0074] like Figure 12 As shown, the third part 33 has a recessed groove 335 formed in the area near the terminal area PA and opposite to the integrated circuit chip 2. The groove 335 does not penetrate the third part 33 in the thickness direction. The shape and size of the groove 335 are adapted to the shape and size of the integrated circuit chip 2. The integrated circuit chip 2 is located in the groove 335.

[0075] In one embodiment, there is a gap between the integrated circuit chip 2 and the groove wall and bottom of the groove 335. On the one hand, this can avoid interference between the flexible circuit board 3 and the integrated circuit chip 2. On the other hand, it can prevent the third part 33 of the flexible circuit board 3 from directly contacting the integrated circuit chip 2 and affecting the heat dissipation of the integrated circuit chip 2. It can also reduce the signal interference of the flexible circuit board 3 to the integrated circuit chip 2.

[0076] The beneficial effects of the embodiments of this application are as follows: The embodiments of this application provide a display module, which includes a display panel, an integrated circuit chip, and a flexible circuit board. The display panel includes a display area and a terminal area located on one side of the display area. A plurality of first terminals are disposed in the terminal area. The integrated circuit chip is disposed in the terminal area and located on the side of the first terminals close to the display area. The flexible circuit board is electrically connected to the first terminals. By extending the flexible circuit board from the side of the integrated circuit chip close to the first terminal to the side of the integrated circuit chip away from the first terminal, the overlap between the flexible circuit board and the terminal area of ​​the display panel is increased, and the module space occupied by the flexible circuit board after bending to the back of the display panel is reduced. This saves more space for placing the battery and improves the battery life of the display module.

[0077] In summary, although the present application discloses the preferred embodiments as described above, the above preferred embodiments are not intended to limit the present application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a terminal area located on one side of the display area, wherein a plurality of first terminals are provided in the terminal area; An integrated circuit chip is disposed in the terminal area and located on the side of the first terminal closer to the display area; as well as A flexible circuit board electrically connected to the first terminal, the flexible circuit board extending from the side of the integrated circuit chip near the first terminal to the side of the integrated circuit chip away from the first terminal; The flexible circuit board includes: The first part has multiple second terminals, which are electrically connected to the first terminal. The first part is disposed on the side of the integrated circuit chip near the first terminal. The second part is disposed on the side of the first part away from the integrated circuit chip, and the second part is connected to the first part. The second part has a greater number of metal film layers than the first part. The third part is connected to the first part and extends from the first part to the side of the integrated circuit chip away from the first terminal. The number of metal film layers in the second part is greater than the number of metal film layers in the third part.

2. The display module as described in claim 1, characterized in that, The number of metal film layers in the third part is the same as the number of metal film layers in the first part.

3. The display module as described in claim 2, characterized in that, The second part includes at least one first bonding metal layer, at least one first signal transmission metal layer located above the first bonding metal layer, and at least one second signal transmission metal layer located below the first bonding metal layer; The first part has the same number of second bonding metal layers as the first bonding metal layers, and each second bonding metal layer is disposed on the same layer as a corresponding first bonding metal layer. The third part has the same number of third signal transmission metal layers as the second bonding metal layers, and each third signal transmission metal layer is disposed on the same layer as a corresponding second bonding metal layer.

4. The display module as described in claim 3, characterized in that, The flexible circuit board also includes a corner-shaped adapter, one end of which is connected to the second part, and the other end of which is connected to an adapter for connecting other devices. The number of metal film layers in the adapter is the same as the number of metal film layers in the third part.

5. The display module as described in claim 4, characterized in that, The adapter has at least one fourth signal transmission metal layer, and each of the fourth signal transmission metal layers is disposed on the same layer as the corresponding second signal transmission metal layer.

6. The display module as described in claim 3, characterized in that, The flexible circuit board also includes: A fourth part is disposed on the side of the second part away from the first part, the fourth part is connected to the second part, and the number of metal film layers in the fourth part is the same as the number of metal film layers in the third part; and The adapter has a corner, one end of which is connected to the fourth part, and the other end of which is connected to an adapter for connecting other devices. The number of metal film layers in the adapter is the same as the number of metal film layers in the fourth part.

7. The display module as described in claim 6, characterized in that, The fourth part has at least one fifth signal transmission metal layer, and each fifth signal transmission metal layer is disposed on the same layer as a corresponding second signal transmission metal layer. The transition part has the same number of fourth signal transmission metal layers as the fifth signal transmission metal layers, and each fourth signal transmission metal layer is disposed on the same layer as a corresponding fifth signal transmission metal layer.

8. The display module as described in claim 2, characterized in that, The third part has an opening that extends through the third part in the thickness direction, and the integrated circuit chip is located within the opening.

9. The display module as described in claim 8, characterized in that, There is a gap between the integrated circuit chip and the edge of the opening.

10. The display module as described in claim 2, characterized in that, An adhesive layer is provided between the third part and the terminal area, and the adhesive layer is used to bond the third part to the terminal area.

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