Electronic component and method of manufacturing the same

Abstract

The present application provides an electronic component that can be easily detected by a laser sensor, a camera, or the like. The electronic component includes a glass substrate having a glass main portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding crystallized portion provided to the first side surface of the glass main portion; a colored insulating layer provided to the first side surface of the glass main portion; and a through conductor provided in the glass main portion and penetrating the top surface and the bottom surface, wherein the crystallized portion extends in a first direction parallel to the bottom surface when viewed from a direction orthogonal to the first side surface, at least a portion of the colored insulating layer extends in the first direction when viewed from the direction orthogonal to the first side surface, and the portion of the colored insulating layer is disposed adjacent to the crystallized portion in a second direction orthogonal to the first direction.

Description

Technical Field

[0001] This disclosure relates to electronic components and methods of manufacturing thereof. Background Technology

[0002] Previously, as an electronic component, there was an electronic component described in Japanese Patent Application Publication No. 2013-98350 (Patent Document 1). This electronic component includes a glass body and a conductor disposed inside the glass body.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2013-98350

[0004] Glass is widely used as an insulator and structural material for electronic components due to its advantages such as insulation and physical and chemical stability. In particular, as has been the case in the past, electronic components with a structure that introduces conductors into the interior of the glass are suitable as small inductor components for high-frequency signals requiring non-magnetic structures.

[0005] On the other hand, when highly transparent glass is used, there are also issues arising from this transparency. For example, many assembly machines in recent years are equipped with functions that use laser sensors and cameras to inspect the sides of electronic components to detect their presence, thickness, and other characteristics. Furthermore, there are problems with using laser sensors and cameras on assembly machines to identify transparent electronic components made of glass. Additionally, there are difficulties with visual inspections using cameras. Summary of the Invention

[0006] Therefore, the purpose of this disclosure is to provide an electronic component and a method for manufacturing the same, which can be easily inspected by detection devices such as laser sensors and cameras.

[0007] To solve the above-mentioned problems, an electronic component according to one aspect of the present disclosure comprises:

[0008] A glass substrate has a glass body portion and a protruding crystallization portion. The glass body portion includes a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface. The crystallization portion is disposed on the first side surface of the glass body portion.

[0009] A colored insulating layer is disposed on the first side surface of the glass body; and

[0010] A through conductor is disposed within the aforementioned glass body and extends through the aforementioned top and bottom surfaces.

[0011] When viewed from a direction orthogonal to the first side surface, the crystallized portion extends along a first direction parallel to the bottom surface.

[0012] When viewed from a direction orthogonal to the first side, at least a portion of the colored insulating layer extends along the first direction and is disposed adjacent to the crystallized portion in a second direction orthogonal to the first direction.

[0013] Here, when viewed from a direction orthogonal to the first side, the extension direction of the crystallized portion need not only be completely consistent with the first direction, but only substantially consistent. For example, it is sufficient if the angle of inclination between the extension direction of the crystallized portion and the first direction is less than 10°. The same applies to the extension direction of the colored insulating layer.

[0014] According to the above method, the crystallized part and the colored insulating layer are disposed on the first side of the glass body. Therefore, when electronic components are detected from the first side of the glass body by detection devices such as laser sensors and cameras, the crystallized part and the colored insulating layer with low transparency can be easily identified, and the electronic components can be easily detected.

[0015] Furthermore, when viewed from a direction orthogonal to the first side, the crystallized portion and the colored insulating layer extend along the first direction. Therefore, when the detection device scans in the first direction to detect electronic components, the crystallized portion or the colored insulating layer can be easily identified, and electronic components can be easily detected.

[0016] In addition, since the crystallization part and the colored insulating layer are provided on the first side of the glass body, the exposure of the glass body can be reduced, and the mechanical strength of the electronic components against external forces can be improved.

[0017] In one preferred embodiment of the electronic component, the colored insulating layer is disposed on the first side surface in all areas where the crystallized portion is absent.

[0018] According to the above embodiment, the entire area of ​​the first side can be covered by the crystallized portion and the colored insulating layer. This makes it easier to inspect the electronic component using a testing device, and further improves the mechanical strength of the electronic component.

[0019] Preferably, in one embodiment of the electronic component, the thickness of the crystallized portion in the direction orthogonal to the first side surface is the same as the thickness of the colored insulating layer in the direction orthogonal to the first side surface.

[0020] Here, thickness refers to average thickness, specifically the average value measured at multiple points on a cross-section that includes the direction orthogonal to the first side and the second direction.

[0021] According to the above embodiment, the crystallized portion and the colored insulating layer can be formed into the same plane in a direction orthogonal to the first side surface. This eliminates the step difference between the crystallized portion and the colored insulating layer in the direction orthogonal to the first side surface, thereby reducing the possibility of peeling of the colored insulating layer and cracking / damage of the crystallized portion caused by contact between objects.

[0022] Preferably, in one embodiment of the electronic component, the height of the second direction of the crystallized portion is smaller than the height of the second direction of the colored insulating layer.

[0023] Here, height refers to the maximum height, specifically the maximum value measured on a cross-section that includes the direction orthogonal to the first side and the second direction.

[0024] According to the above embodiment, the crystallization portion can be reduced, thus reducing the likelihood of the object coming into contact with the crystallization portion and reducing the possibility of cracking or damage to the crystallization portion. Furthermore, the possibility of floating capacitance forming in the crystallization portion can be reduced. Additionally, since the colored insulating layer can be increased, the mechanical strength of the electronic component can be further improved.

[0025] Preferably, in one embodiment of the electronic component, the relationship between the height h1 of the crystallized portion in the second direction and the height H of the first side surface in the second direction satisfies 1 / 5 < h1 / H < 1 / 2.

[0026] According to the above embodiment, since h1 / H < 1 / 2, the crystallized portion will not be larger than required, which reduces the possibility of the object coming into contact with the crystallized portion and thus reduces the possibility of cracking or damage to the crystallized portion. In addition, it reduces the possibility of floating capacitance being generated in the crystallized portion. On the other hand, since 1 / 5 < h1 / H, the crystallized portion will not be smaller than required, which ensures the mechanical strength of the crystallized portion.

[0027] In one preferred embodiment of the electronic component,

[0028] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0029] The crystallized portion is disposed on the bottom side compared to the colored insulating layer.

[0030] According to the above embodiment, since the crystallization portion can be separated from the top surface side, the possibility of a floating capacitor being generated near the outer surface conductor can be reduced when an outer surface conductor is disposed above the top surface.

[0031] In addition, after the terminal electrodes of the electronic components are mounted on the mounting substrate so that the bottom surface of the glass body faces the mounting substrate, the object can easily come into contact with the electronic components on the top surface of the glass body. However, since the crystallization part is arranged on the bottom surface, the contact between the object and the crystallization part can be reduced, and the possibility of cracking or damage to the crystallization part can be reduced.

[0032] In one preferred embodiment of the electronic component,

[0033] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0034] The crystallized portion is disposed on the top surface side, compared to the colored insulating layer.

[0035] According to the above embodiment, since the crystallization part can be separated from the terminal electrode, the possibility of floating capacitance being generated near the terminal electrode can be reduced.

[0036] In addition, when the top surface of the glass body is held by the assembly machine and the terminal electrodes of the electronic components are mounted on the mounting substrate so that the bottom surface of the glass body is facing the mounting substrate, the object is likely to come into contact with the electronic components on the bottom surface of the glass body. However, since the crystallization part is arranged on the top surface, the contact between the object and the crystallization part can be reduced, and the possibility of cracking and damage to the crystallization part can be reduced.

[0037] In one preferred embodiment of the electronic component,

[0038] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0039] The aforementioned colored insulating layer includes: a first region disposed on the top surface side compared to the aforementioned crystallized portion, and a second region disposed on the bottom surface side compared to the aforementioned crystallized portion.

[0040] According to the above embodiment, since the crystallized portion can be separated from the top and bottom surfaces, the crystallized portion can be separated from the corner of the glass substrate where stress is easily concentrated, thereby reducing the possibility of cracking or damage to the crystallized portion.

[0041] Furthermore, since the crystallization portion can be separated from the top surface side, the possibility of floating capacitance being generated near the outer surface conductor can be reduced when an outer surface conductor is placed above the top surface.

[0042] In addition, after mounting the terminal electrodes of the electronic components onto the mounting substrate so that the bottom surface of the glass body faces the mounting substrate, the object can easily come into contact with the electronic components on the top surface of the glass body. However, since the crystallized part can be separated from the top surface, the contact between the object and the crystallized part can be reduced, thereby reducing the possibility of cracking or damage to the crystallized part.

[0043] In addition, since the crystallization part can be separated from the terminal electrode, the possibility of floating capacitance being generated near the terminal electrode can be reduced.

[0044] In addition, when the top surface of the glass body is held by the assembly machine and the terminal electrodes of the electronic components are mounted on the mounting substrate so that the bottom surface of the glass body is facing the mounting substrate, the object is likely to come into contact with the electronic components on the bottom surface of the glass body. However, since the crystallized part can be separated from the bottom surface, the contact between the object and the crystallized part can be reduced, and the possibility of cracking and damage to the crystallized part can be reduced.

[0045] In one preferred embodiment of the electronic component, it further comprises:

[0046] An outer surface conductor is disposed above at least one of the top and bottom surfaces and is electrically connected to the through conductor; and

[0047] A protective layer is disposed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

[0048] According to the above embodiment, since the protective layer covers the outer surface conductor, it can protect the outer surface conductor. Furthermore, since the protective layer covers at least one surface of the top and bottom surfaces of the glass body, it can protect the glass body.

[0049] In one preferred embodiment of the method for manufacturing electronic components, the following steps are included:

[0050] Prepare a mother substrate made of photosensitive glass and including a first main surface and a second main surface;

[0051] The cut area of ​​the first main surface is irradiated with ultraviolet light, and the mother substrate is crystallized by subsequent heat treatment to form a crystallized portion that extends in a direction parallel to the first main surface and from the first main surface to the second main surface.

[0052] In the cut-off area, a portion of the crystallized portion is left, and the other portion of the crystallized portion is removed by etching to form a groove extending in a direction parallel to the first main surface.

[0053] A through conductor is formed that penetrates the first main surface and the second main surface of the mother substrate.

[0054] A colored insulating layer is embedded in the aforementioned groove to bring it into contact with the aforementioned crystallized portion; and

[0055] The mother substrate is divided by cutting the colored insulating layer and the crystallized portion along the cutting area to obtain multiple electronic components.

[0056] According to the above embodiment, since the mother substrate is divided by cutting along the cutting area to separate the colored insulating layer and the crystallized portion, it is easier to cut compared to cutting the photosensitive glass. Furthermore, since the crystallized portion is in contact with the colored insulating layer, the crystallized portion is fixed to the colored insulating layer, reducing the possibility of breakage or damage to the crystallized portion when cutting the colored insulating layer and the crystallized portion.

[0057] Furthermore, since the colored insulating layer is applied to the mother substrate, it is easier and cheaper to implement compared to coating each component with a colored insulating layer after the mother substrate has been divided. In contrast, coating each divided component with a colored insulating layer separately is cumbersome and increases operating costs.

[0058] In one preferred embodiment of the method for manufacturing electronic components,

[0059] Before the process of dividing the aforementioned mother substrate to obtain multiple electronic components, the following process is also performed:

[0060] An outer surface conductor electrically connected to the through conductor is formed above at least one of the aforementioned first main surface and the aforementioned second main surface; and

[0061] A protective layer is formed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

[0062] According to the above embodiment, since the protective layer covers the outer surface conductor, it can protect the outer surface conductor. Furthermore, since the protective layer covers at least one surface of the top and bottom surfaces of the glass body, it can protect the glass body.

[0063] According to the electronic component and its manufacturing method as described in this disclosure, it can be easily inspected by inspection devices such as laser sensors and cameras. Attached Figure Description

[0064] Figure 1 This is a perspective view showing a first embodiment of an inductor component as an electronic component.

[0065] Figure 2 This is an exploded 3D view of the inductor component.

[0066] Figure 3 This is a cross-sectional view of an inductor component.

[0067] Figure 4A This is a top view of the coil of the inductor component as seen from the top side.

[0068] Figure 4B This is a bottom view of the coil of the inductor component, viewed from the bottom side.

[0069] Figure 5A It is a three-dimensional diagram illustrating the manufacturing method of inductor components.

[0070] Figure 5B It is a three-dimensional diagram illustrating the manufacturing method of inductor components.

[0071] Figure 5C It is a three-dimensional diagram illustrating the manufacturing method of inductor components.

[0072] Figure 5D This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0073] Figure 5E This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0074] Figure 5F This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0075] Figure 5G This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0076] Figure 5H This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0077] Figure 5I This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0078] Figure 5J This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0079] Figure 5K This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0080] Figure 6 This is an enlarged cross-sectional view showing the second embodiment of the inductor component as an electronic component.

[0081] Figure 7 This is an enlarged cross-sectional view showing the third embodiment of the inductor component as an electronic component.

[0082] Figure 8A This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0083] Figure 8B This is a cross-sectional view illustrating the manufacturing method of an inductor component.

[0084] Figure 9 This is an enlarged cross-sectional view showing the fourth embodiment of the inductor component as an electronic component.

[0085] Figure 10 This is a cross-sectional view showing the fifth embodiment of the capacitor component as an electronic component.

[0086] Explanation of reference numerals in the attached figures

[0087] 1, 1A, 1B, 1C…Inductor components (electronic components), 2…Capacitor components (electronic components), 10…Glass substrate, 11b…Bottom conductor (outer surface conductor), 11t…Top conductor (outer surface conductor), 13, 23…First through conductor, 14, 24…Second through conductor, 15…First protective layer, 16…Second protective layer, 21…First plate electrode (outer surface conductor), 22…Second plate electrode (outer surface conductor), 25…Dielectric film, 30…Colored insulating layer, 31…First region, 32…Second region, 100…Glass body, 100b…Bottom surface, 100t… Top surface, 100s1~100s4…first to fourth side surfaces, 101…crystallized portion, 110…coil, 121, 221…first terminal electrode, 122, 222…second terminal electrode, 200…mother substrate, 200a…first main surface, 200b…second main surface, 201…area for forming through conductor, 202…through hole, 203…cutting area, 204…groove, 205…protective film, 300…cutting blade, AX…axis, t1…thickness of crystallized portion, t2…thickness of colored insulating layer, h1…height of crystallized portion, h2…height of colored insulating layer, H…height of first side surface. Detailed Implementation

[0088] The following is a detailed description of an electronic component and its manufacturing method as one aspect of this disclosure, illustrated in the figures. Furthermore, the figures include some schematic diagrams and may not reflect actual dimensions or proportions.

[0089] <First Implementation>

[0090] (structure)

[0091] In the first embodiment, the electronic component of the present invention will be described using an inductor component as an example. Figure 1 This is a three-dimensional view of the inductor component viewed from the top side. Figure 2 This is an exploded perspective view of the inductor component viewed from the top side. Figure 3 This is a cross-sectional view of an inductor component. Figure 4A This is a top view of the inductor coil as seen from the top side. Figure 4B This is a bottom view of the coil of the inductor component, viewed from the bottom side.

[0092] Inductor component 1 is, for example, a surface-mount inductor component used in high-frequency signal transmission circuits. Figure 1 , Figure 2 , Figure 3 , Figure 4A as well as Figure 4B As shown, the inductor component 1 includes a glass substrate 10, a coil 110 disposed on the glass substrate 10, a first protective layer 15 disposed on the top surface of the glass substrate 10 and covering a portion of the coil 110, a second protective layer 16 disposed on the bottom surface of the glass substrate 10 and covering a portion of the coil 110, a colored insulating layer 30 disposed on the side surface of the glass substrate 10, and a first terminal electrode 121 and a second terminal electrode 122 disposed on the second protective layer 16 and electrically connected to the coil 110.

[0093] The glass substrate 10 has a glass body portion 100 and a protruding crystallized portion 101 disposed on the glass body portion 100. The glass body portion 100 is a cuboid having length, width, and height. The glass body portion 100 has a first side surface 100s1 and a second side surface 100s2 located at both ends in the length direction, a third side surface 100s3 and a fourth side surface 100s4 located at both ends in the width direction, and a bottom surface 100b and a top surface 100t located at both ends in the height direction. In other words, the outer surface of the glass body portion 100 includes the first side surface 100s1 and the second side surface 100s2, the third side surface 100s3 and the fourth side surface 100s4, the bottom surface 100b, and the top surface 100t. The bottom surface 100b is the surface facing the mounting substrate when the inductor component 1 is mounted on the mounting substrate.

[0094] Furthermore, as shown in the attached figures, for ease of explanation, the length direction (long side direction) of the glass body 100, i.e., the direction from the first side surface 100s1 to the second side surface 100s2, is designated as the X direction. The width direction of the glass body 100, i.e., the direction from the third side surface 100s3 to the fourth side surface 100s4, is designated as the Y direction. The height direction of the glass body 100, i.e., the direction from the bottom surface 100b to the top surface 100t, is designated as the Z direction. The X, Y, and Z directions are orthogonal to each other, and when arranged in the order of X, Y, Z, they form a left-handed system.

[0095] In this specification, the outer surface of the glass body 100 refers not only to the surface of the glass body 100 facing outwards, but also to the surface that forms the boundary between the outer and inner sides of the glass body 100. Furthermore, "above the outer surface (top surface, bottom surface, side surface) of the glass body 100" does not refer to an absolute direction such as vertically upward as defined in the direction of gravity, but rather to the direction towards the outermost of the outer and inner sides bounded by the outer surface. Therefore, "above the outer surface" refers to a relative direction defined according to the orientation of the outer surface. Additionally, "above" relative to a certain element includes not only a position above that element (i.e., a position above that element via other objects, a position separated by a gap), but also a position directly above (on) that is in contact with that element.

[0096] The glass substrate 10 is insulating. The glass substrate 10 is preferably a photosensitive glass substrate, such as Foturan II (a registered trademark of Schott AG). In particular, it is preferable that the glass substrate 10 contains cerium oxide (CeO2), in which case the cerium oxide acts as a sensitizer, and photolithography-based processing becomes easier.

[0097] However, the glass substrate 10 can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching using photoresist and metal masks, laser processing, etc., so it can also be a non-photosensitive glass plate. In addition, the glass substrate 10 can be a substrate formed by sintering glass paste, or it can be formed by known methods such as float glass.

[0098] The glass body portion 100 is the amorphous, uncrystallized portion of the glass substrate 10. The glass body portion 100 has high transparency. The crystallized portion 101 is the crystallized portion of the glass substrate 10. The transparency of the crystallized portion 101 is lower than that of the glass body portion 100. By providing the crystallized portion 101, the effective dielectric constant of the glass substrate 10 can be adjusted. In other words, the floating capacitance formed between conductors 11b, 11t, 13, 14, terminal electrodes 121, 122, and the wiring pattern of the mounting substrate can be increased or decreased. In particular, the self-resonant frequency of the inductor component 1 can be adjusted. For example, in the case of Foturan II described above, the dielectric constant of the glass body portion 100 is 6.4; in contrast, the dielectric constant of the crystallized portion 101 can be reduced to 5.8. This reduces the floating capacitance between conductors near the crystallized portion 101.

[0099] The crystallization portion 101 is configured to surround the glass body portion 100 from the first side surface 100s1 to the fourth side surface 100s4. Specifically, when viewed from a direction orthogonal to the first side surface 100s1, the crystallization portion 101 extends along a Y direction parallel to the bottom surface 100b (an example of the "first direction" as described in the claims). Similarly, when viewed from a direction orthogonal to the second side surface 100s2, the crystallization portion 101 extends along a Y direction parallel to the bottom surface 100b. Furthermore, when viewed from a direction orthogonal to the third side surface 100s3, the crystallization portion 101 extends along an X direction parallel to the bottom surface 100b, and when viewed from a direction orthogonal to the fourth side surface 100s4, it extends along an X direction parallel to the bottom surface 100b.

[0100] Furthermore, the crystallization portion 101 may also be provided on at least one of the first side surface 100s1 to the fourth side surface 100s4. In this case, the at least one side surface corresponds to an example of the "first side surface" as described in the claims. In addition, on a side surface such as the first side surface 100s1, there may be one crystallization portion 101, but there may also be multiple crystallization portions.

[0101] Furthermore, on one side, such as the first side 100s1, the crystallized portion 101 extends continuously to both ends of the Y direction, but it may also exist partially in the Y direction (left-right direction). In other words, the length of the crystallized portion 101 in the Y direction may be shorter than the length of the left and right ends of the first side 100s1.

[0102] Furthermore, when viewed from a direction orthogonal to a side surface, such as the first side surface 100s1, the extension direction of the crystallized portion 101 is completely aligned with the Y direction, but it is sufficient that they are substantially aligned. For example, it is sufficient that the angle of inclination between the extension direction of the crystallized portion 101 and the Y direction is less than 10°.

[0103] Furthermore, while the glass body 100 can be a cuboid, it can also be a cylinder. In this case, the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. Moreover, the crystallized portion 101 is provided on at least a portion of the circumferential surface of the cylinder.

[0104] The coil 110 is wound in a spiral shape along axis AX. The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface conductors 11b, a plurality of top surface conductors 11t, a plurality of first through conductors 13, and a plurality of second through conductors 14. The bottom surface conductors 11b and the top surface conductors 11t correspond to an example of the "outer surface conductor" as described in the claims.

[0105] Multiple bottom surface conductors 11b are disposed above bottom surface 100b. The multiple bottom surface conductors 11b are connected to bottom surface 100b and arranged along axis AX. Multiple top surface conductors 11t are disposed above top surface 100t. The multiple top surface conductors 11t are connected to top surface 100t and arranged along axis AX.

[0106] A plurality of first through conductors 13 are disposed within the glass body portion 100 and penetrate the bottom surface 100b and the top surface 100t. The plurality of first through conductors 13 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along the axis AX.

[0107] A plurality of second through conductors 14 are disposed within the glass body portion 100 and penetrate the bottom surface 100b and the top surface 100t. The plurality of second through conductors 14 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along axis AX. The second through conductors 14 are positioned on the opposite side of the first through conductor 13 relative to axis AX. The bottom surface conductor 11b, the first through conductor 13, the top surface conductor 11t, and the second through conductors 14 are sequentially connected and electrically connected, forming at least a portion of a helical coil 110.

[0108] The top conductor 11t extends slightly in the X direction and then in the Y direction. All of the top conductors 11t are arranged parallel to each other along the X direction. The bottom conductor 11b is shaped to extend in the Y direction. All of the bottom conductors 11b are arranged parallel to each other along the X direction.

[0109] The first through conductor 13 is disposed within the through hole of the glass body 100 on the third side 100s3 relative to the axis AX, and the second through conductor 14 is disposed within the through hole of the glass body 100 on the fourth side 100s4 relative to the axis AX. The first through conductor 13 and the second through conductor 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. All of the first through conductor 13 and all of the second through conductor 14 are arranged parallel to each other along the X direction.

[0110] The bottom conductor 11b and the top conductor 11t are made of conductive materials such as copper, silver, gold, or their alloys. The bottom conductor 11b and the top conductor 11t can be metal films formed by electroplating, vapor deposition, sputtering, etc., or they can be sintered metal bodies coated with conductive paste and then sintered. Furthermore, the materials of the first through conductor 13 and the second through conductor 14 are the same as those of the bottom conductor 11b and the top conductor 11t.

[0111] The bottom conductor 11b and the top conductor 11t are preferably formed by a semi-additive process, thereby enabling the formation of a bottom conductor 11b and a top conductor 11t with low resistance, high precision, and high cross-sectional area. The first through conductor 13 and the second through conductor 14 can be formed in the through-holes pre-formed in the glass body portion 100 using the materials and manufacturing methods exemplified by the bottom conductor 11b and the top conductor 11t.

[0112] A first protective layer 15 is disposed above the top surface 100t to cover the top surface conductor 11t. The first protective layer 15 is in contact with both the top surface 100t and the top surface conductor 11t. By covering the top surface conductor 11t, the first protective layer 15 protects the top surface conductor 11t from external forces and prevents damage to the top surface conductor 11t. In addition, since the first protective layer 15 covers the top surface 100t of the glass body portion 100, it can protect the glass body portion 100.

[0113] The second protective layer 16 is disposed above the bottom surface 100b to cover the bottom conductor 11b. The second protective layer 16 is in contact with both the bottom surface 100b and the bottom conductor 11b. By covering the bottom conductor 11b, the second protective layer 16 protects the bottom conductor 11b from external forces and prevents damage to the bottom conductor 11b. In addition, since the second protective layer 16 covers the bottom surface 100b of the glass body portion 100, it can protect the glass body portion 100.

[0114] The first protective layer 15 and the second protective layer 16 are insulating, for example, made of resins such as epoxy resin and polyimide.

[0115] The first terminal electrode 121 is disposed above the bottom surface 100b and connected to the first end of the coil 110. The second terminal electrode 122 is disposed above the bottom surface 100b and connected to the second end of the coil 110. The first terminal electrode 121 is disposed on the second protective layer 16, with its center in the X direction relative to the glass substrate 10 on the first side surface 100s1 side. The second terminal electrode 122 is disposed on the second protective layer 16, with its center in the X direction relative to the glass substrate 10 on the second side surface 100s2 side.

[0116] The first terminal electrode 121 is connected to the bottom conductor 11b via a first through-hole conductor 121v embedded in the second protective layer 16. The second terminal electrode 122 is connected to the bottom conductor 11b via a second through-hole conductor 122v embedded in the second protective layer 16.

[0117] The first terminal electrode 121 has a base layer and a plating layer covering the base layer. The base layer contains conductive materials such as Ag and Cu. The plating layer contains conductive materials such as Ni, Sn, Pd, and Au. Similarly, the second terminal electrode 122 has a base layer and a plating layer covering the base layer. Furthermore, both the first terminal electrode 121 and the second terminal electrode 122 may be made of a single layer of conductive material.

[0118] A colored insulating layer 30 is configured to surround the glass body portion 100 from the first side surface 100s1 to the fourth side surface 100s4. Specifically, when viewed from a direction orthogonal to the first side surface 100s1, the colored insulating layer 30 extends along a Y direction parallel to the bottom surface 100b (an example of the "first direction" as stated in the claims), and is disposed adjacent to the crystallized portion 101 in a Z direction orthogonal to the Y direction (an example of the "second direction" as stated in the claims). In other words, the colored insulating layer 30 contacts the crystallized portion 101 along the Y direction. Similarly, when viewed from a direction orthogonal to the second side surface 100s2, the colored insulating layer 30 extends along a Y direction parallel to the bottom surface 100b, and is disposed adjacent to the crystallized portion 101 in a Z direction orthogonal to the Y direction.

[0119] Furthermore, when viewed from a direction orthogonal to the third side surface 100s3, the colored insulating layer 30 extends along the X direction parallel to the bottom surface 100b, and is disposed adjacent to the crystallized portion 101 in the Z direction orthogonal to the X direction. When viewed from a direction orthogonal to the fourth side surface 100s4, the colored insulating layer 30 extends along the X direction parallel to the bottom surface 100b, and is disposed adjacent to the crystallized portion 101 in the Z direction orthogonal to the X direction.

[0120] The colored insulating layer 30 has insulating properties and is made of resins such as epoxy resin and polyimide. The colored insulating layer 30 is colored, for example, green or blue, and its transparency is lower than that of the glass body 100.

[0121] Furthermore, the colored insulating layer 30 may also be disposed on at least one of the first side surface 100s1 to the fourth side surface 100s4. In this case, the at least one side surface corresponds to an example of the "first side surface" as described in the claims. In other words, at least a portion of the colored insulating layer 30 extends along a first direction parallel to the bottom surface 100b when viewed from a direction orthogonal to the first side surface, and is disposed adjacent to the crystallized portion 101 in a second direction orthogonal to the first direction. Alternatively, the colored insulating layer 30 may be divided into multiple regions on one side surface, such as the first side surface 100s1.

[0122] Furthermore, although the colored insulating layer 30 extends continuously across both ends of the Y direction on one side, such as the first side 100s1, it may also exist partially in the Y direction (left-right direction). In other words, the length of the colored insulating layer 30 in the Y direction may be shorter than the length of the left and right ends of the first side 100s1.

[0123] Furthermore, although the extension direction of the colored insulating layer 30 is exactly aligned with the Y direction when viewed from a direction orthogonal to one side, such as the first side 100s1, it is sufficient that it is substantially aligned. For example, it is sufficient that the angle of inclination between the extension direction of the colored insulating layer 30 and the Y direction is less than 10°.

[0124] Furthermore, although the glass body 100 is a cuboid, it can also be a cylinder. In this case, the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. Moreover, the colored insulating layer 30 is provided on at least a portion of the circumferential surface of the cylinder.

[0125] According to the above structure, since the crystallization part 101 and the colored insulating layer 30 are provided on the first side 100s1 of the glass body part 100, when the inductor component 1 is detected from the first side 100s1 of the glass body part 100 by a detection device such as a laser sensor or a camera, the crystallization part 101 and the colored insulating layer 30 with low transparency can be easily identified, and the inductor component 1 can be easily detected.

[0126] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 extend along the Y direction when viewed from a direction orthogonal to the first side surface 100s1, when the detection device scans in the Y direction to detect the inductor component 1, the crystallized portion 101 or the colored insulating layer 30 can be easily identified, and the inductor component 1 can be easily detected.

[0127] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 are provided on the first side 100s1 of the glass body portion 100, the exposure of the glass body portion 100 can be reduced, thereby improving the mechanical strength of the inductor component 1 against external forces. Here, the mechanical strength of crystallized glass is higher than that of uncrystallized glass.

[0128] Furthermore, the second side 100s2, the third side 100s3, and the fourth side 100s4 also have the same effect as the first side 100s1.

[0129] Preferably, in the first side surface 100s1, the colored insulating layer 30 is disposed over the entire area where the crystallized portion 101 is absent. According to this structure, the entire area of ​​the first side surface 100s1 can be covered by the crystallized portion 101 and the colored insulating layer 30. This makes it easier to inspect the inductor component 1 using a detection device, and further improves the mechanical strength of the inductor component 1. Furthermore, the same structure and effects are achieved on the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 as on the first side surface 100s1.

[0130] like Figure 3 As shown, preferably, the thickness t1 of the crystallized portion 101 in the direction orthogonal to the first side surface 100s1 (X direction) and the thickness t2 of the colored insulating layer 30 in the direction orthogonal to the first side surface 100s1 (X direction) are the same. Here, thickness refers to average thickness, specifically, the average value when multiple points are measured on a cross-section including the direction orthogonal to the first side surface 100s1 (X direction) and the second direction (Z direction).

[0131] According to the above structure, the crystallized portion 101 and the colored insulating layer 30 can be formed into the same plane in a direction orthogonal to the first side surface 100s1. This eliminates the step difference between the crystallized portion 101 and the colored insulating layer 30 in the direction orthogonal to the first side surface 100s1, reducing the possibility of peeling of the colored insulating layer 30 and breakage of the crystallized portion 101 caused by contact between objects. Furthermore, the same structure and effect as described above are achieved on the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4.

[0132] like Figure 3 As shown, preferably on the first side surface 100s1, the height h1 of the crystallized portion 101 in the second direction (Z direction) is smaller than the height h2 of the colored insulating layer 30 in the second direction (Z direction). Here, height refers to the maximum height, specifically the maximum value measured on a cross-section including the direction orthogonal to the first side surface 100s1 and the second direction (Z direction).

[0133] According to the above structure, the crystallization portion 101 can be reduced in size, thus reducing the likelihood of an object coming into contact with the crystallization portion 101 and reducing the possibility of breakage or damage to the crystallization portion 101. Furthermore, the possibility of floating capacitance forming in the crystallization portion 101 can be reduced. Additionally, the colored insulating layer 30 can be increased in size, thus further improving the mechanical strength of the inductor component 1. Moreover, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 also have the same structure and effects as the first side surface 100s1.

[0134] like Figure 3 As shown, preferably on the first side surface 100s1, the relationship between the height h1 of the crystallized portion 101 in the second direction (Z direction) and the height H of the first side surface 100s1 in the second direction (Z direction) satisfies 1 / 5 < h1 / H < 1 / 2.

[0135] According to the above structure, since h1 / H < 1 / 2, the crystallized portion 101 is not required to be larger than necessary, which reduces the possibility of the object coming into contact with the crystallized portion 101 and thus reduces the possibility of breakage or damage to the crystallized portion 101. In addition, it reduces the possibility of floating capacitance being generated in the crystallized portion 101. On the other hand, since 1 / 5 < h1 / H, the crystallized portion 101 is not required to be smaller than necessary, which ensures the mechanical strength of the crystallized portion 101. Furthermore, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 also have the same structure and effects as the first side surface 100s1.

[0136] like Figure 2 and Figure 3 As shown, preferably on the first side surface 100s1, the crystallized portion 101 is disposed on the bottom surface 100b side compared to the colored insulating layer 30.

[0137] According to the above structure, the crystallization section 101 can be separated from the top surface 100t side, so the possibility of floating capacitance being generated near the top surface conductor 11t disposed on the top surface 100t can be reduced.

[0138] Furthermore, the terminal electrodes 121 and 122 of the inductor component 1 are mounted on a mounting substrate such that the bottom surface 100b side of the glass body 100 faces the mounting substrate. In this state, although an object can easily come into contact with the inductor component 1 on the top surface 100t side of the glass body 100, since the crystallized portion 101 is disposed on the bottom surface 100b side, the contact between the object and the crystallized portion 101 can be reduced, thereby reducing the possibility of breakage or damage to the crystallized portion 101. Moreover, the structure and effects on the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 are the same as those on the first side surface 100s1.

[0139] like Figure 3As shown, preferably on the first side surface 100s1, the first protective layer 15 contacts the colored insulating layer 30, and the second protective layer 16 contacts the crystallized portion 101. Specifically, when viewed from the upper side in the Z direction, the first protective layer 15 covers the colored insulating layer 30. The side surface of the first protective layer 15 located in the direction orthogonal to the Z direction is on the same plane as the side surface of the colored insulating layer 30 located in the direction orthogonal to the Z direction. When viewed from the lower side in the Z direction, the second protective layer 16 covers the crystallized portion 101. The side surface of the second protective layer 16 located in the direction orthogonal to the Z direction is on the same plane as the side surface of the crystallized portion 101 located in the direction orthogonal to the Z direction.

[0140] According to the above structure, the colored insulating layer 30 and the crystallized portion 101 are fixed to the first protective layer 15 and the second protective layer 16. When the colored insulating layer 30 and the crystallized portion 101 are cut, the possibility of peeling of the colored insulating layer 30 and breakage of the crystallized portion 101 can be reduced. Furthermore, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same structure and effect as the first side surface 100s1. It is also possible to make the first protective layer 15 and the second protective layer 16 contact one of the colored insulating layer 30 and the crystallized portion 101.

[0141] Preferably, at least one of the first protective layer 15 and the second protective layer 16 is colored, the same as the colored insulating layer 30. Accordingly, when the inductor component 1 is detected from the top surface 100t side or the bottom surface 100b side of the glass body 100 using a detection device such as a laser sensor or a camera, the protective layers 15 and 16 can be easily identified, and the inductor component 1 can be easily detected.

[0142] (Manufacturing method of inductor component 1)

[0143] like Figure 5A As shown, a mother substrate 200, made of photosensitive glass, is prepared, comprising a first main surface 200a and a second main surface 200b. The first main surface 200a corresponds to the top surface 100t, and the second main surface 200b corresponds to the bottom surface 100b. For example, Foturan II can be used as the mother substrate 200. Generally, the mother substrate 200 contains oxides of silicon, lithium, aluminum, cerium, etc., so it can be compatible with high-precision photolithography.

[0144] The through-conductor forming region 201 of the first main surface 200a is irradiated with ultraviolet light, and the mother substrate 200 is crystallized by subsequent heat treatment (e.g., firing), forming a crystalline portion from the first main surface 200a to the second main surface 200b. The through-conductor forming region 201 refers to the region where the through-conductor is formed. Figure 5AThe image is shown in shaded lines. Specifically, ultraviolet light with a wavelength of approximately 310 nm is irradiated onto the mother substrate 200. Upon irradiation with this ultraviolet light, metal ions, such as cerium ions in photosensitive glass, are oxidized by light energy, releasing electrons. Here, the final processing depth obtained in the mother substrate 200 can be controlled by adjusting the amount of ultraviolet light irradiated according to the thickness of the mother substrate 200.

[0145] As the exposure apparatus used for the aforementioned ultraviolet light irradiation, a contact aligner or a step-out exposure apparatus that obtains ultraviolet light with a wavelength of approximately 310 nm can be used. Alternatively, a laser irradiation apparatus containing a femtosecond laser can be used as the light source. Furthermore, when using a femtosecond laser, by focusing the laser beam inside the mother substrate 200, electrons can be released from the metal oxide only at the focusing area. That is, the surface of the laser-irradiated portion of the mother substrate 200 can be photosensitive, but only the interior can be photosensitive.

[0146] like Figure 5B As shown, in the through conductor forming region 201, all of the crystallized portion is removed by etching, forming a through hole 202 extending in the Z direction and penetrating the first main surface 200a and the second main surface 200b. For example, an aqueous hydrofluoric acid solution is used for etching. Preferably, the concentration of the aqueous hydrofluoric acid solution is, for example, 5-10%. In the etching process, the entire mother substrate 200 is immersed in the aqueous hydrofluoric acid solution. As a result, only the crystalline phase within the substrate is etched, forming the through hole 202.

[0147] Subsequently, ultraviolet light is irradiated onto the cut area 203 of the first main surface 200a, and the mother substrate 200 is crystallized through subsequent heat treatment (e.g., firing), forming a crystalline portion from the first main surface 200a to the second main surface 200b. The cut area 203 is the area where the groove is formed. Figure 5B The cut area 203 is indicated by a shadow line. The cut line is consistent with the cut line when the mother substrate 200 is divided into individual pieces.

[0148] like Figure 5C and Figure 5D As shown, in the cutting area 203, a portion of the crystallized portion is left, and the remaining portion is removed by etching, forming a groove 204 extending in a direction parallel to the first main surface 200a. The remaining crystallized portion 101 is located on the second main surface 200b side, forming the bottom of the groove 204. The portion of the mother substrate 200 other than the crystallized portion 101 corresponds to... Figure 1 The glass body 100. Figure 5C In the middle, the crystallization part 101 is represented by a dotted line. Figure 5D yes Figure 5C Sectional view A-A. Below, Figures 5E to 5H Similarly with Figure 5C Corresponding to the A-A section.

[0149] When etching leaves a portion of the crystallized area (crystallized area 101), for example, a protective film 205 resistant to hydrofluoric acid aqueous solution can be applied to the portion of the crystallized area 101 from the second main surface 200b side to prevent the hydrofluoric acid aqueous solution from impregnating the crystalline phase. Figure 5D In the middle, the protective film 205 is shown with a double-dotted line.

[0150] Furthermore, the through-conductor forming region 201 and the cutting region 203 can be crystallized simultaneously, with a protective film 205 applied only to the crystallized portion 101, while the unwanted crystallized portions are etched. This allows for the simultaneous formation of the through-hole 202 and the trench 204.

[0151] like Figure 5E As shown, through conductors 13 and 14 are formed on the first main surface 200a and the second main surface 200b of the mother substrate 200. Specifically, for example, the first through conductor 13 and the second through conductor 14 are formed in the through hole 202 by a half-addition process. The through conductors 13 and 14 can be formed from a single seed layer or through different processes.

[0152] like Figure 5F As shown, a colored insulating layer 30 is embedded in the groove 204 so that the colored insulating layer 30 comes into contact with the crystallized portion 101. Specifically, for example, the colored insulating layer 30 is formed in the groove 204 by spin coating. Alternatively, the colored insulating layer 30 may be disposed in the groove 204 and on a first main surface 200a, and then the colored insulating layer 30 on the first main surface 200a may be removed by grinding or the like.

[0153] like Figure 5G As shown, a top surface conductor 11t, electrically connected to the through conductors 13 and 14, is formed on the first main surface 200a, and a bottom surface conductor 11b, electrically connected to the through conductors 13 and 14, is formed on the second main surface 200b. The top surface conductor 11t and the bottom surface conductor 11b are formed, for example, by a half-addition process, similar to the through conductors 13 and 14.

[0154] like Figure 5H As shown, a first protective layer 15 is formed above the first main surface 200a to cover the top conductor 11t, and a second protective layer 16 is formed above the second main surface 200b to cover the bottom conductor 11b. Specifically, the first protective layer 15 and the second protective layer 16 are formed by laminating a resin film or by coating a paste-like resin and then thermosetting it.

[0155] like Figure 5IAs shown, a through-hole is formed in the second protective layer 16, and a first through-hole conductor 121v is formed in the through-hole. A first terminal electrode 121 connected to the first through-hole conductor 121v is formed above the second protective layer 16. The first through-hole conductor 121v and the first terminal electrode 121 can be formed simultaneously or independently. The first through-hole conductor 121v and the first terminal electrode 121 are formed, for example, by a half-addition process. Figure 5I and Figure 5C Corresponding to the B-B section. Below, Figure 5J and Figure 5K Similarly with Figure 5C Corresponding to the B-B section.

[0156] like Figure 5J As shown, the colored insulating layer 30 and the crystallized portion 101 are cut along the cutting region 203, as follows: Figure 5K As shown, the mother substrate 200 is divided to obtain Figure 1 The multiple inductor components 1 are shown. Specifically, the cutting blade 300 is moved from the first protective layer 15 toward the second protective layer 16 and along the groove 204. Alternatively, a laser can be used instead of the cutting blade 300 for cutting.

[0157] Accordingly, since the mother substrate 200 is divided by cutting the colored insulating layer 30 and the crystallized portion 101 along the cutting region 203, it is easier to cut compared to cutting the photosensitive glass. In addition, since the crystallized portion 101 is in contact with the colored insulating layer 30, the crystallized portion 101 is fixed to the colored insulating layer 30, and the possibility of breakage or damage to the crystallized portion 101 can be reduced when cutting the colored insulating layer 30 and the crystallized portion 101.

[0158] Furthermore, since the colored insulating layer 30 is provided on the mother substrate 200, it is easier and cheaper to achieve this compared to coating each component with the colored insulating layer 30 after dividing the mother substrate 200. In contrast, coating each component with the colored insulating layer 30 separately is cumbersome and increases operating costs.

[0159] <Second Implementation>

[0160] Figure 6 This is an enlarged cross-sectional view showing the second embodiment of the inductor component as an electronic part. The position of the crystallization portion differs between the second embodiment and the first embodiment. This difference in structure will be described below. The other structures are the same as those in the first embodiment, and their descriptions are omitted.

[0161] like Figure 6As shown, in the inductor component 1A of the second embodiment, on the first side surface 100s1, the crystallized portion 101 is disposed on the top surface 100t side compared to the colored insulating layer 30.

[0162] According to the above structure, the crystallization section 101 can be separated from the terminal electrodes 121 and 122 disposed on the bottom surface 100b side, so the possibility of floating capacitance being generated near the terminal electrodes 121 and 122 can be reduced.

[0163] Furthermore, when the top surface 100t side of the glass body 100 is held by the assembly machine and the terminal electrodes 121 and 122 of the inductor component 1A are mounted on the mounting substrate so that the bottom surface 100b side of the glass body 100 faces the mounting substrate, the object is likely to come into contact with the inductor component 1A on the bottom surface 100b side of the glass body 100. However, since the crystallization part 101 is disposed on the top surface 100t side, the contact between the object and the crystallization part 101 can be reduced, thereby reducing the possibility of cracking or damage to the crystallization part 101.

[0164] Furthermore, the second side 100s2, the third side 100s3, and the fourth side 100s4 also have the same structure and effect as the first side 100s1. In addition, it is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above-described structure.

[0165] <Third Implementation Method>

[0166] Figure 7 This is an enlarged cross-sectional view showing the third embodiment of the inductor component as an electronic component. The position of the crystallization portion differs from that of the first embodiment. This difference in structure will be described below. The other structures are the same as those in the first embodiment, and their descriptions are omitted.

[0167] like Figure 7 As shown, in the inductor component 1B of the third embodiment, on the first side surface 100s1, the colored insulating layer 30 includes a first region 31 disposed on the top surface 100t side compared to the crystallized portion 101, and a second region 32 disposed on the bottom surface 100b side compared to the crystallized portion 101. Figure 3 The height h2 in the Z direction of the colored insulating layer 30 shown refers to the sum of the height in the Z direction of the first region 31 and the height in the Z direction of the second region 32.

[0168] According to the above structure, the crystallization portion 101 can be separated from the top surface 100t side and the bottom surface 100b side, so the crystallization portion 101 can be separated from the corner of the glass substrate 10 where stress is easily concentrated, thereby reducing the possibility of cracking and damage to the crystallization portion 101.

[0169] Furthermore, since the crystallization section 101 can be separated from the top surface 100t side, the possibility of floating capacitance being generated near the top surface conductor 11t disposed above the top surface 100t can be reduced.

[0170] Furthermore, after mounting the terminal electrodes 121 and 122 of the inductor component 1B onto the mounting substrate so that the bottom surface 100b side of the glass body 100 faces the mounting substrate, the object can easily come into contact with the inductor component 1B on the top surface 100t side of the glass body 100. However, since the crystallized portion 101 is separated from the top surface 100t side, the contact between the object and the crystallized portion 101 can be reduced, thereby reducing the possibility of cracking or damage to the crystallized portion 101.

[0171] In addition, since the crystallization section 101 is separated from the terminal electrodes 121 and 122, the possibility of floating capacitance being generated near the terminal electrodes 121 and 122 can be reduced.

[0172] Furthermore, when the top surface 100t side of the glass body 100 is held by the assembly machine and the terminal electrodes 121 and 122 of the inductor component 1B are mounted on the mounting substrate so that the bottom surface 100b side of the glass body 100 faces the mounting substrate, the object is likely to come into contact with the inductor component 1B on the bottom surface 100b side of the glass body 100. However, since the crystallized portion 101 is separated from the bottom surface 100b side, the contact between the object and the crystallized portion 101 can be reduced, thereby reducing the possibility of cracking or damage to the crystallized portion 101.

[0173] Furthermore, the structure and effects on the second side 100s2, the third side 100s3, and the fourth side 100s4 are the same as those on the first side 100s1. In addition, it is sufficient that the above structure is satisfied on at least one of the first to fourth side surfaces 100s1 to 100s4.

[0174] The manufacturing method of inductor component 1B is described.

[0175] First, through the first embodiment Figure 5A and Figure 5B The same manufacturing method as shown is used for manufacturing. Subsequently, as... Figure 8A As shown, no settings are configured. Figure 5D The protective film 205 shown is etched from the first main surface 200a and the second main surface 200b of the mother substrate 200. This allows the remaining crystallized portion 101, which was not removed, to be located at the center of the Z-direction between the first main surface 200a and the second main surface 200b. In other words, grooves 204 can be provided on both sides of the crystallized portion 101 in the Z-direction.

[0176] Subsequently, as Figure 8B As shown, a first through conductor 13 and a second through conductor 14 are formed in the through-hole 202 of the mother substrate 200, and a colored insulating layer 30 is embedded in the groove 204 so that the colored insulating layer 30 contacts the crystallized portion 101. Subsequently, by... Figures 5G to 5K The inductor component 1B is manufactured using the same method as shown in the diagram.

[0177] <Fourth Implementation>

[0178] Figure 9 This is an enlarged cross-sectional view showing a fourth embodiment of the inductor component as an electronic part. The fourth embodiment differs in the size of the first and second protective layers from the first embodiment. This difference in structure will be described below. The other structures are the same as in the first embodiment, and their descriptions are omitted.

[0179] like Figure 9 As shown, in the inductor component 1C of the fourth embodiment, on the first side surface 100s1, the first protective layer 15 does not overlap with the colored insulating layer 30 when viewed from the Z direction, and the second protective layer 16 does not overlap with the crystallized portion 101 when viewed from the Z direction. Specifically, when viewed from the upper side in the Z direction, the first protective layer 15 is separated from the colored insulating layer 30. There is a step difference between the side surface of the first protective layer 15 located in the direction orthogonal to the Z direction and the side surface of the colored insulating layer 30 located in the direction orthogonal to the Z direction. When viewed from the lower side in the Z direction, the second protective layer 16 is separated from the crystallized portion 101. There is a step difference between the side surface of the second protective layer 16 located in the direction orthogonal to the Z direction and the side surface of the crystallized portion 101 located in the direction orthogonal to the Z direction.

[0180] Based on the above structure, in the manufacturing of inductor component 1C, such as Figure 5J As shown, when the colored insulating layer 30 and the crystallized portion 101 are cut along the cutting region 203 (groove 204), since the first protective layer 15 and the second protective layer 16 do not overlap with the colored insulating layer 30 and the crystallized portion 101 when viewed from the Z direction, the cutting blade 300 does not contact the first protective layer 15 and the second protective layer 16. Therefore, it is possible to suppress the first protective layer 15 and the second protective layer 16 from peeling off from the glass substrate 10 (mother substrate 200) when cutting with the cutting blade 300.

[0181] Furthermore, the second side 100s2, the third side 100s3, and the fourth side 100s4 also have the same structure and effect as the first side 100s1. Additionally, it is also possible to configure one of the first protective layer 15 and the second protective layer 16 to overlap with the colored insulating layer 30 and the crystallized portion 101 when viewed from the Z direction. Furthermore, it is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above-described structure.

[0182] <Fifth Implementation>

[0183] In the fifth embodiment, the electronic component of the present invention will be described using a capacitor component as an example. Figure 10 This is a cross-sectional view of a capacitor component. Capacitor component 2 is, for example, a surface-mount capacitor component used in a high-frequency signal transmission circuit.

[0184] like Figure 10 As shown, the capacitor component 2 includes a glass substrate 10, a first plate electrode 21 and a second plate electrode 22 disposed on the glass substrate 10, a first protective layer 15 disposed on the glass substrate 10 and covering the first plate electrode 21 and the second plate electrode 22, a colored insulating layer 30 disposed on the side surface of the glass substrate 10, and a first terminal electrode 221 and a second terminal electrode 222 disposed on the glass substrate 10. The first plate electrode 21 and the second plate electrode 22 correspond to an example of the "outer surface conductor" as described in the claims.

[0185] The glass substrate 10 is made of the same material as the glass substrate 10 of the first embodiment. In other words, the glass substrate 10 has a glass body portion 100 and a crystallized portion 101. The material of the first protective layer 15 is the same as the material of the first protective layer 15 of the first embodiment. The material of the colored insulating layer 30 is the same as the material of the colored insulating layer 30 of the first embodiment. The materials of the first plate electrode 21 and the second plate electrode 22 are the same as the materials of the top surface conductor 11t and the bottom surface conductor 11b of the first embodiment. The materials of the first terminal electrode 221 and the second terminal electrode 222 are the same as the materials of the first terminal electrode 121 and the second terminal electrode 122 of the first embodiment.

[0186] A first plate electrode 21 and a second plate electrode 22 are disposed on the top surface 100t of the glass substrate 10. The first plate electrode 21 is in contact with the top surface 100t of the glass substrate 10, and the second plate electrode 22 is located above the first plate electrode 21. A dielectric film 25 is disposed between the first plate electrode 21 and the second plate electrode 22. The first plate electrode 21, the second plate electrode 22, and the dielectric film 25 constitute a capacitor element.

[0187] The first terminal electrode 221 and the second terminal electrode 222 are in contact with the bottom surface 100b of the glass substrate 10. The first terminal electrode 221 and the second terminal electrode 222 are separated from each other.

[0188] The capacitor component 2 also has a first through conductor 23 and a second through conductor 24 that pass through the glass substrate 10. The first through conductor 23 is connected between the first terminal electrode 221 and the first plate electrode 21. The second through conductor 24 is connected between the second terminal electrode 222 and the second plate electrode 22.

[0189] The crystallization portion 101 and the colored insulating layer 30 are respectively disposed on the first side surface 100s1 to the fourth side surface 100s4 of the glass body portion 100, as in the first embodiment. Alternatively, the crystallization portion 101 and the colored insulating layer 30 may be disposed on at least one of the first side surface 100s1 to the fourth side surface 100s4.

[0190] According to the above structure, the crystallization part 101 and the colored insulating layer 30 are disposed on the first side 100s1 of the glass body part 100. Therefore, when the capacitor component 2 is detected from the first side 100s1 of the glass body part 100 by a detection device such as a laser sensor or a camera, the crystallization part 101 and the colored insulating layer 30 with low transparency can be easily identified, and the capacitor component 2 can be easily detected.

[0191] Furthermore, when viewed from a direction orthogonal to the first side surface 100s1, the crystallized portion 101 and the colored insulating layer 30 extend along the Y direction. Therefore, when the detection device scans in the Y direction to detect the capacitor component 2, the crystallized portion 101 or the colored insulating layer 30 can be easily identified, and the capacitor component 2 can be easily detected.

[0192] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 are disposed on the first side 100s1 of the glass body portion 100, the exposure of the glass body portion 100 can be reduced, thereby improving the mechanical strength of the capacitor component 2 against external forces. Here, the mechanical strength of crystallized glass is higher than that of uncrystallized glass.

[0193] Furthermore, the second side 100s2, the third side 100s3, and the fourth side 100s4 also have the same structure and effect as the first side 100s1. In addition, it is sufficient that the above structure is satisfied on at least one of the first to fourth side surfaces 100s1 to 100s4.

[0194] Furthermore, this disclosure is not limited to the embodiments described above, and design changes can be made without departing from the spirit of this disclosure. For example, various combinations of the feature points of each of the first to fifth embodiments can be made. Although inductor components are used as electronic components in the first to fourth embodiments and capacitor components are used as electronic components in the fifth embodiment, other electronic components such as resistor components can also be used, or composite components combining these components can also be used.

[0195] In the first to fourth embodiments described above, outer surface conductors (bottom surface conductor and top surface conductor) are respectively provided on the top and bottom surfaces of the glass body, and protective layers (first protective layer and second protective layer) are respectively provided on the top and bottom surfaces to cover the outer surface conductors. However, it is also possible to provide an outer surface conductor on at least one surface of the top and bottom surfaces of the glass body, and to provide a protective layer on at least one surface to cover the outer surface conductor. Alternatively, protective layers may not be provided on the top and bottom surfaces respectively.

[0196] This disclosure includes the following methods.

[0197] <1>

[0198] An electronic component, comprising:

[0199] A glass substrate has a glass body portion and a protruding crystallization portion. The glass body portion includes a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface. The crystallization portion is disposed on the first side surface of the glass body portion.

[0200] A colored insulating layer is disposed on the first side surface of the glass body; and

[0201] A through conductor is disposed within the aforementioned glass body and extends through the aforementioned top and bottom surfaces.

[0202] When viewed from a direction orthogonal to the first side surface, the crystallized portion extends along a first direction parallel to the bottom surface.

[0203] When viewed from a direction orthogonal to the first side, at least a portion of the colored insulating layer extends along the first direction and is disposed adjacent to the crystallized portion in a second direction orthogonal to the first direction.

[0204] <2> According to the electronic component described in <1>, wherein,

[0205] On the aforementioned first side, the aforementioned colored insulating layer is disposed in all areas where the aforementioned crystallized portion does not exist.

[0206] <3> The electronic component according to <1> or <2>, wherein,

[0207] The thickness of the crystallized portion in the direction orthogonal to the first side surface is the same as the thickness of the colored insulating layer in the direction orthogonal to the first side surface.

[0208] <4> The electronic component according to any one of <1> to <3>, wherein,

[0209] The height of the second direction of the crystallized portion is smaller than the height of the second direction of the colored insulating layer.

[0210] <5> The electronic component according to any one of <1> to <4>, wherein,

[0211] The relationship between the height h1 of the crystallized portion in the second direction and the height H of the first side surface in the second direction satisfies 1 / 5 < h1 / H < 1 / 2.

[0212] <6> The electronic component according to any one of <1> to <5>, wherein,

[0213] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0214] The crystallized portion is disposed on the bottom side compared to the colored insulating layer.

[0215] <7> The electronic component according to any one of <1> to <5>, wherein,

[0216] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0217] The crystallized portion is disposed on the top surface side, compared to the colored insulating layer.

[0218] <8> The electronic component according to any one of <1> to <5>, wherein,

[0219] It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor.

[0220] The aforementioned colored insulating layer includes: a first region disposed on the top surface side compared to the aforementioned crystallized portion, and a second region disposed on the bottom surface side compared to the aforementioned crystallized portion.

[0221] <9> The electronic component according to any one of <1> to <8>, further comprising:

[0222] An outer surface conductor is disposed above at least one of the top and bottom surfaces and is electrically connected to the through conductor; and

[0223] A protective layer is disposed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

[0224] <10> A method for manufacturing an electronic component, comprising the following steps:

[0225] Prepare a mother substrate made of photosensitive glass and including a first main surface and a second main surface;

[0226] The cut area of ​​the first main surface is irradiated with ultraviolet light, and the mother substrate is crystallized by subsequent heat treatment to form a crystallized portion that extends in a direction parallel to the first main surface and from the first main surface to the second main surface.

[0227] In the cut-off area, a portion of the crystallized portion is left, and the other portion of the crystallized portion is removed by etching to form a groove extending in a direction parallel to the first main surface.

[0228] A through conductor is formed that penetrates the first main surface and the second main surface of the mother substrate.

[0229] A colored insulating layer is embedded in the aforementioned groove to bring it into contact with the aforementioned crystallized portion; and

[0230] The mother substrate is divided by cutting the colored insulating layer and the crystallized portion along the cutting area to obtain multiple electronic components.

[0231] <11> The manufacturing method of the electronic component according to <10>, wherein,

[0232] Before the process of dividing the aforementioned mother substrate to obtain multiple electronic components, the following process is also performed:

[0233] An outer surface conductor electrically connected to the through conductor is formed above at least one of the aforementioned first main surface and the aforementioned second main surface; and

[0234] A protective layer is formed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

Claims

1. An electronic component, comprising: A glass substrate has a glass body portion and a protruding crystallization portion. The glass body portion includes a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface. The crystallization portion is disposed on the first side surface of the glass body portion. A colored insulating layer is disposed on the first side surface of the glass body; and A through conductor is disposed within the aforementioned glass body and extends through the aforementioned top and bottom surfaces. When viewed from a direction orthogonal to the first side surface, the crystallized portion extends along a first direction parallel to the bottom surface. When viewed from a direction orthogonal to the first side, at least a portion of the colored insulating layer extends along the first direction and is disposed adjacent to the crystallized portion in a second direction orthogonal to the first direction.

2. The electronic component according to claim 1, wherein, On the aforementioned first side, the aforementioned colored insulating layer is disposed in all areas where the aforementioned crystallized portion does not exist.

3. The electronic component according to claim 1 or 2, wherein, The thickness of the crystallized portion in the direction orthogonal to the first side surface is the same as the thickness of the colored insulating layer in the direction orthogonal to the first side surface.

4. The electronic component according to claim 1 or 2, wherein, The height of the second direction of the crystallized portion is smaller than the height of the second direction of the colored insulating layer.

5. The electronic component according to claim 1 or 2, wherein, The relationship between the height h1 of the crystallized portion in the second direction and the height H of the first side surface in the second direction satisfies 1 / 5 < h1 / H < 1 / 2.

6. The electronic component according to claim 1 or 2, wherein, It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor. The crystallized portion is disposed on the bottom side compared to the colored insulating layer.

7. The electronic component according to claim 1 or 2, wherein, It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor. The crystallized portion is disposed on the top surface side, compared to the colored insulating layer.

8. The electronic component according to claim 1 or 2, wherein, It also includes terminal electrodes disposed above the aforementioned bottom surface and electrically connected to the aforementioned through conductor. The aforementioned colored insulating layer includes: a first region disposed on the top surface side compared to the aforementioned crystallized portion, and a second region disposed on the bottom surface side compared to the aforementioned crystallized portion.

9. The electronic component according to claim 1 or 2, wherein, It also has: An outer surface conductor is disposed above at least one of the top and bottom surfaces and is electrically connected to the through conductor; and A protective layer is disposed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

10. A method for manufacturing an electronic component, comprising the following steps: Prepare a mother substrate made of photosensitive glass and including a first main surface and a second main surface; The cut area of ​​the first main surface is irradiated with ultraviolet light, and the mother substrate is crystallized by subsequent heat treatment to form a crystallized portion that extends in a direction parallel to the first main surface and from the first main surface to the second main surface. In the cut-off area, a portion of the crystallized portion is left, and the other portion of the crystallized portion is removed by etching to form a groove extending in a direction parallel to the first main surface. A through conductor is formed that penetrates the first main surface and the second main surface of the mother substrate. A colored insulating layer is embedded in the aforementioned groove, so that the colored insulating layer contacts the aforementioned crystallized portion; and The mother substrate is divided by cutting the colored insulating layer and the crystallized portion along the cutting area to obtain multiple electronic components.

11. The method for manufacturing an electronic component according to claim 10, wherein, Before the process of dividing the aforementioned mother substrate to obtain multiple electronic components, the following process is also performed: An outer surface conductor electrically connected to the through conductor is formed above at least one of the aforementioned first main surface and the aforementioned second main surface; and A protective layer is formed above at least one of the aforementioned surfaces to cover the aforementioned outer surface conductor.

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