A manifold-microchannel type cold plate and heat dissipation method for power chip heat dissipation

Abstract

This invention discloses a manifold-microchannel type cold plate and heat dissipation method for power chip heat dissipation, comprising a cover plate, a manifold substrate, a microchannel substrate, and a base plate arranged sequentially; the cover plate has a cooling medium inlet and a cooling medium outlet; the manifold substrate has a manifold body, which includes an inlet section, a manifold section, and an outlet section; wherein, the manifold section includes several liquid inlet channels and several liquid outlet channels; one end of the inlet section is connected to the cooling medium inlet, the other end of the inlet section is connected to one end of the liquid inlet channel, the other end of the liquid inlet channel is connected to the inlet of the microchannel substrate, the outlet of the microchannel substrate is connected to one end of the liquid outlet channel, and the other end of the liquid outlet channel is connected to one end of the outlet section; the outer surface of the base plate is in close contact with the power chip to be cooled; this invention utilizes the distribution effect of the manifold body on the manifold substrate to achieve even distribution of the cooling medium into the microchannel substrate, effectively improving the heat exchange efficiency of the cold plate and exhibiting high stability.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and specifically relates to a manifold-microchannel type cold plate and heat dissipation method for power chip heat dissipation. Background Technology

[0002] With the development of power chip technology, the heat flux density of power chips has exceeded 1 kW / cm². 2 The order of magnitude; when power chips operate under high heat flux density, if they cannot be efficiently cooled, the temperature rise of the power chips will greatly exceed the allowable value during normal operation.

[0003] High temperature rise caused by poor heat dissipation of power chips under high heat flux density will damage the connection structure of power chip component nodes and circuit topology, generate thermal stress damage, and thus reduce the reliability and service life of power chip operation; and the uneven temperature distribution inside the power chip under high heat flux density will further aggravate the above effects.

[0004] In traditional electronic cooling technology, the presence of thermal interface materials between the chip and the remote heat sink increases thermal resistance, making it difficult to maintain the chip surface temperature within a safe operating range. Summary of the Invention

[0005] To address the technical problems existing in the prior art, this invention provides a manifold-microchannel cold plate and heat dissipation method for power chip heat dissipation, in order to solve the technical problem in existing electronic cooling technology where low heat exchange efficiency is caused by multi-layer thermal resistance generated by thermal interface materials, which seriously affects chip lifespan.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] This invention provides a manifold-microchannel type cold plate for heat dissipation of power chips, comprising a cover plate, a manifold substrate, a microchannel substrate and a base plate arranged sequentially from top to bottom;

[0008] The cover plate has a cooling medium inlet at one end and a cooling medium outlet at the other end; a manifold body is provided on the manifold base plate, and the manifold body includes an inlet section, a manifold section and an outlet section; wherein, the manifold section includes a plurality of liquid inlet channels and a plurality of liquid outlet channels.

[0009] One end of the inlet section is connected to the cooling medium inlet, the other end of the inlet section is connected to one end of the liquid inlet channel, the other end of the liquid inlet channel is connected to the inlet of the microchannel substrate, the outlet of the microchannel substrate is connected to one end of the liquid outlet channel, and the other end of the liquid outlet channel is connected to one end of the outlet section.

[0010] The outer surface of the base plate is in close contact with the power chip to be cooled.

[0011] Furthermore, several liquid inlet channels are spaced apart, and an outlet channel is provided between two adjacent liquid inlet channels.

[0012] Furthermore, the liquid inlet channel is a gradually narrowing flow channel structure with a wide inlet and a narrow outlet; the liquid outlet channel is a gradually expanding flow channel structure with a narrow inlet and a wide outlet.

[0013] Furthermore, the inlet section includes a liquid inlet and several liquid inlet connecting channels. The liquid inlet is disposed on the surface of the manifold substrate and is positioned directly opposite the cooling medium inlet. One end of each of the several liquid inlet connecting channels is connected to the liquid inlet, and the other end of each of the several liquid inlet connecting channels is connected to a corresponding liquid inlet channel. The liquid inlet connecting channel is a narrow-inlet, wide-outlet tapered flow channel structure.

[0014] Furthermore, a microchannel body is disposed on the microchannel substrate, the microchannel body comprising a plurality of tapered microchannel units, the plurality of tapered microchannels being arranged in an array.

[0015] Furthermore, a limiting frame is provided on the outer surface of the base plate, and the power chip to be cooled is disposed in the limiting frame.

[0016] Furthermore, the cover plate is made of transparent acrylic sheet.

[0017] Furthermore, the manifold substrate, microchannel substrate, and base plate are all manufactured using selective laser melting forming technology.

[0018] The present invention also provides a heat dissipation method for a manifold-microchannel cold plate for power chip heat dissipation, utilizing the aforementioned manifold-microchannel cold plate for power chip heat dissipation.

[0019] The heat dissipation method includes:

[0020] The cooling medium enters through the cooling medium inlet; the cooling medium is evenly distributed onto the microchannel substrate using the manifold body; the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate; and the cooled medium after heat exchange flows out through the cooling medium outlet.

[0021] When the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate, the cooling medium forms a uniform low-temperature region on the substrate, and the power chip to be cooled can exchange heat with the uniform low-temperature region.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] This invention provides a manifold-microchannel cold plate and a heat dissipation method for power chip heat dissipation. A manifold substrate is mounted on a microchannel substrate, with its inlet section connected to a cooling medium inlet on a cover plate and its outlet section connected to a cooling medium outlet on the cover plate. The power chip to be cooled is connected to the microchannel substrate via a base plate. Utilizing the distribution effect of the manifold body on the manifold substrate, the cooling medium is evenly distributed into the microchannel substrate, ensuring a uniform heat transfer coefficient for each distribution unit. This guarantees a uniform temperature reduction on the base plate, improves the heat dissipation capacity of the power chip surface, effectively increases the heat exchange efficiency of the cold plate, and enhances stability, thereby improving the reliability and lifespan of the power chip.

[0024] Furthermore, the alternating distribution of inlet and outlet channels on the manifold substrate effectively shortens the flow path of the cooling medium in the microchannels, thereby reducing the friction between the cooling medium and the microchannels and achieving the goal of rapid discharge from the microchannels.

[0025] Furthermore, according to the law of conservation of mass, the narrower the channel cross-section, the greater the flow velocity when the flow rate is constant. Therefore, setting the inlet channel as a gradually narrowing flow channel structure with a wide inlet and a narrow outlet helps to accelerate the fluid in the microchannel and enhance convective heat transfer.

[0026] Furthermore, the microchannel body on the microchannel substrate is composed of arrayed tapered microchannel units, which helps to uniformly distribute the flow to each microchannel, thereby keeping the convective heat transfer intensity of the entire board consistent and improving temperature uniformity.

[0027] Furthermore, by setting a limiting frame on the outer surface of the base plate, the position of the heat source can be limited, the transmission of vibrations generated by fluid movement can be reduced, thereby reducing the heat exchange resistance between the heat source and the cold plate. Specifically, by using the limiting frame in conjunction with the power chip to be cooled, the area of ​​the power chip to be cooled that needs heat exchange can be brought close to and positioned in the area of ​​the base plate with the strongest heat exchange capacity.

[0028] Furthermore, the cover is made of transparent acrylic sheet, which allows for real-time observation of the flow state of the cooling medium on the manifold substrate.

[0029] Furthermore, the manifold substrate, microchannel substrate, and base plate are all manufactured using selective laser melting forming technology, which is simple to process and has high precision. Attached Figure Description

[0030] Figure 1 This is an exploded view of the manifold-microchannel cold plate described in the embodiment;

[0031] Figure 2 This is a schematic diagram of the cover plate structure in the embodiment;

[0032] Figure 3 This is a schematic diagram of the manifold substrate structure in the embodiment;

[0033] Figure 4 This is a partial structural schematic diagram of the microchannel substrate in the embodiment;

[0034] Figure 5 This is a partial structural diagram of the base plate in the embodiment;

[0035] Figure 6 This is a schematic diagram of the tapered channel unit in the embodiment;

[0036] Figure 7 This is a schematic diagram of the flow path of the cooling medium in the manifold-microchannel cold plate described in the embodiment.

[0037] The components include: 1. Cover plate; 2. Manifold substrate; 3. Microchannel substrate; 4. Base plate; 101. Cooling medium inlet; 102. Cooling medium outlet; 201. Inlet section; 202. Manifold section; 203. Outlet section; 204. Liquid inlet channel; 205. Liquid outlet channel; 301. Gradient microchannel unit; 401. Limiting frame. Detailed Implementation

[0038] To make the technical problems solved by the present invention, the technical solutions, and the beneficial effects clearer, the following specific embodiments provide a further detailed description of the present invention. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of the invention.

[0039] Example

[0040] As attached Figure 1-6 As shown, this embodiment provides a manifold-microchannel type cold plate for heat dissipation of power chips; the manifold-microchannel type cold plate includes a cover plate 1, a manifold substrate 2, a microchannel substrate 3 and a base plate 4 arranged sequentially from top to bottom.

[0041] The cover plate 1 has a cooling medium inlet 101 at one end and a cooling medium outlet 102 at the other end. A manifold body is provided on the manifold base plate 2, comprising an inlet section 201, a manifold section 202, and an outlet section 203. One end of the cooling medium inlet 101 is connected to the outlet end of an external cold source, and the other end of the cooling medium inlet 101 is connected to one end of the inlet section 201. The other end of the inlet section 201 is connected to one end of the manifold section 202, and the other end of the manifold section 202 is connected to one end of the outlet section 203. The other end of the outlet section 203 is connected to one end of the cooling medium outlet 102, and the other end of the cooling medium outlet 102 is connected to the return port end of the external cold source. The external cold source stores a cooling medium, which is either a coolant or a cooling gas.

[0042] In this embodiment, the upper surface of the manifold substrate 2 is tightly fitted and fixed to the lower surface of the cover plate 1; the inlet section 201 is disposed at one end of the upper surface of the manifold substrate 2, and the inlet section 201 includes a liquid inlet and a plurality of liquid inlet connecting channels; the liquid inlet is a groove structure formed on the surface of the manifold substrate 2, the liquid inlet is positioned directly opposite the cooling medium inlet 101, and the upper end of the liquid inlet is connected to the lower end of the cooling medium inlet 101; a plurality of liquid inlet connecting channels are evenly disposed between the liquid inlet and the manifold section 202, one end of the liquid inlet connecting channel is connected to the side wall of the liquid inlet, and the other end of the liquid inlet connecting channel is connected to the inlet of the manifold section 202.

[0043] The manifold section 202 is disposed in the middle of the manifold substrate 2. The manifold section 202 includes a plurality of liquid inlet channels 204 and a plurality of liquid outlet channels 205. The plurality of liquid inlet channels 204 are spaced apart, and a liquid outlet channel 205 is disposed between two adjacent liquid inlet channels 204. One end of the plurality of liquid inlet channels 204 is connected to a plurality of liquid inlet connection channels in a one-to-one correspondence. The other end of the liquid inlet channel 204 is connected to the inlet of the microchannel substrate 3. The outlet of the microchannel substrate 3 is connected to one end of the liquid outlet channel 205. The other end of the liquid outlet channel 205 is connected to the outlet section 203.

[0044] The outlet section 203 is disposed at the other end of the upper surface of the manifold substrate 2. The outlet section 203 is located in a triangular groove structure formed on the upper surface of the manifold substrate 2. The side wall of the outlet section 203 is connected to the liquid outlet channel 205, and the upper end of the outlet section 203 is connected to the cooling medium outlet 102.

[0045] In this embodiment, the liquid inlet connection channel is a narrow-inlet, wide-outlet tapered flow channel structure, the liquid inlet channel 204 is a wide-inlet, narrow-outlet tapered flow channel structure, and the liquid outlet channel 205 is a narrow-inlet, wide-outlet tapered flow channel structure. During the liquid inlet process of the cooling medium, after the cooling medium flows into each tapered microchannel unit 301, the flow rate in the liquid inlet channel 204 will decrease accordingly. In order to maintain the remaining flow rate in the liquid inlet channel 204 in proportion to the number of other tapered microchannel units, the liquid inlet channel 204 is set as a wide-inlet, narrow-outlet tapered flow channel structure. This helps to keep the inlet velocity of all tapered microchannel units consistent, thereby ensuring that each tapered microchannel is allocated the same flow rate and velocity, thus ensuring that the heat carried away by each tapered microchannel unit is small and maintaining the temperature uniformity of the entire plate.

[0046] The upper surface of the microchannel substrate 3 is tightly attached to the lower surface of the manifold substrate 2, and a microchannel body is disposed on the microchannel substrate 3. The microchannel body is disposed in the middle of the microchannel substrate 3 and located directly below the manifold segment 202. Specifically, the microchannel body includes a plurality of tapered microchannel units 301, and the plurality of tapered microchannels 301 are arranged in an array.

[0047] The upper surface of the base plate 4 is tightly attached to the lower surface of the microchannel substrate 3, and the lower surface of the base plate 4 is in close contact with the power chip to be cooled. A limiting frame 401 is provided on the lower surface of the base plate 4. The limiting frame 401 is a groove structure opened in the middle of the lower surface of the base plate 4, and the limiting frame 401 is located directly below the microchannel body. The shape of the limiting frame 401 matches the shape of the power chip to be cooled, and the power chip to be cooled is fitted and disposed within the limiting frame 401.

[0048] In this embodiment, the cover plate 1 is made of transparent acrylic sheet, which allows for real-time observation of the flow state of the cooling medium on the manifold substrate; the cover plate 1, the manifold substrate 2, the microchannel substrate 3 and the base plate 4 are all made using selective laser melting (SLM) in additive manufacturing.

[0049] Working principle and heat dissipation method:

[0050] In this embodiment, the manifold-microchannel type cold plate for power chip heat dissipation is used by connecting the cooling medium inlet 101 on the cover plate 1 to the outlet end of the external cold source, and connecting the cooling medium outlet 102 on the cover plate 1 to the return port end of the external cold source.

[0051] The cooling medium from the external cold source enters through the cooling medium inlet 101; the cooling medium is evenly distributed to the tapered microchannel units 301 on the microchannel substrate 3 using several liquid inlet channels 204 on the manifold body; the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate 3 through the base plate 4; the cooled medium after heat exchange flows out through the cooling medium outlet, completing one cooling cycle, as shown in the attached diagram. Figure 7 As shown.

[0052] In this embodiment, when the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate 3, the cooling medium forms a uniform low-temperature region on the base plate 4, and the power chip to be cooled can exchange heat with the uniform low-temperature region.

[0053] In this embodiment, a manifold substrate 2 and a microchannel substrate 3 are sequentially arranged between the cover plate 1 and the base plate 4 to form a manifold-microchannel combined structure. From the perspective of the cooling medium flow path, by setting a plurality of tapered microchannel units 301 on the microchannel substrate 3, the plurality of tapered microchannel units 301 can accelerate the speed of the cooling medium in the flow length direction, improve the cooling capacity of the cooling medium, and thus reduce the average temperature of the base plate 4. The distribution effect of the plurality of liquid inlet channels spaced apart on the manifold substrate 2 is used to evenly distribute the inflow, so that the heat transfer coefficient of each tapered microchannel unit is more uniform, the average temperature of the base plate 4 is reduced, the heat dissipation capacity of the chip surface is improved, and thus the reliability and service life of the power chip can be improved.

[0054] The manifold-microchannel cold plate for power chip heat dissipation described in this invention includes a cover plate 1, a manifold substrate 2, a microchannel substrate 3, and a base plate 4 arranged sequentially from top to bottom; the cover plate 1 is provided with a cooling medium inlet 101 and a cooling medium outlet 102; the manifold substrate 2 is provided with an inlet section 201, a manifold section 202, and an outlet section 203; the microchannel substrate 3 is provided with a plurality of tapered microchannel units arranged in an array, and the power chip to be cooled is arranged on the surface of the base plate 4.

[0055] In this invention, the cooling medium inlet 101 on the cover plate 1 serves as the inflow channel for the cooling medium, and the cooling medium outlet 102 serves as the outlet channel for the cooling medium after heat exchange. The inlet section 201 on the manifold substrate 2 is used to distribute the cooling medium flowing in from the cooling medium inlet, so that the flow rate entering the manifold section 202 is evenly distributed. The outlet section 203 is used to guide the cooling medium after heat exchange to flow to the cooling medium outlet 102. The cover plate 1, the manifold substrate 2, the microchannel substrate 3, and the base plate 4 are all manufactured by selective laser melting molding process, realizing integrated printing, taking into account both manufacturing efficiency and cost. The liquid inlet channel on the manifold substrate 2 has a wide inlet and narrow outlet flow channel structure, which can accelerate the fluid. The higher the speed of the fluid flowing through the solid region, the better the heat exchange effect. The tapered microchannel units on the microchannel substrate 3 are arranged in an array, which helps to accelerate the fluid in the microchannel and enhance the heat dissipation effect. The limiting frame on the base plate 4 is used to place the power chip to be cooled, and it is integrally formed directly on the surface of the base plate 4.

[0056] The above embodiments are merely one of the implementation methods for achieving the technical solution of the present invention. The scope of protection claimed by the present invention is not limited to this embodiment, but also includes any variations, substitutions and other implementation methods that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention.

Claims

1. A manifold-microchannel cold plate for heat dissipation of a power chip, characterized in that, It includes a cover plate (1), a manifold substrate (2), a microchannel substrate (3), and a base plate (4) arranged from top to bottom. The cover plate (1) has a cooling medium inlet (101) at one end and a cooling medium outlet (102) at the other end; the manifold base plate (2) is provided with a manifold body, which includes an inlet section (201), a manifold section (202) and an outlet section (203); wherein the manifold section (202) includes a plurality of liquid inlet channels and a plurality of liquid outlet channels; One end of the inlet section (201) is connected to the cooling medium inlet (101), the other end of the inlet section (201) is connected to one end of the liquid inlet channel, the other end of the liquid inlet channel is connected to the inlet of the microchannel substrate (3), the outlet of the microchannel substrate (3) is connected to one end of the liquid outlet channel, and the other end of the liquid outlet channel is connected to one end of the outlet section (203). The outer surface of the base plate (4) is in close contact with the power chip to be cooled; Several liquid inlet channels are spaced apart, and an outlet channel is provided between two adjacent liquid inlet channels; The liquid inlet channel is a gradually narrowing flow channel structure with a wide inlet and a narrow outlet; the liquid outlet channel is a gradually expanding flow channel structure with a narrow inlet and a wide outlet. The inlet section (201) includes a liquid inlet and several liquid inlet connecting channels. The liquid inlet is disposed on the surface of the manifold substrate and is positioned directly opposite the cooling medium inlet (101). One end of each of the several liquid inlet connecting channels is connected to the liquid inlet, and the other end of each of the several liquid inlet connecting channels is connected to the several liquid inlet channels one by one. The liquid inlet connecting channel is a narrow-inlet, wide-outlet tapered flow channel structure.

2. A manifold-microchannel type cold plate for heat dissipation of power chips according to claim 1, characterized in that, The microchannel substrate (3) is provided with a microchannel body, which includes a plurality of tapered microchannel units, and the plurality of tapered microchannels are arranged in an array.

3. A manifold-microchannel type cold plate for heat dissipation of power chips according to claim 1, characterized in that, A limiting frame (401) is provided on the outer surface of the base plate (4), and the power chip to be cooled is disposed in the limiting frame (401).

4. A manifold-microchannel type cold plate for heat dissipation of power chips according to claim 1, characterized in that, The cover plate (1) is made of transparent acrylic sheet.

5. A manifold-microchannel cold plate for heat dissipation of power chips according to claim 1, characterized in that, The manifold substrate (2), microchannel substrate (3) and base plate (4) are all manufactured using selective laser melting molding process.

6. A heat dissipation method for a manifold-microchannel cold plate for power chip heat dissipation, characterized in that, Using the manifold-microchannel cold plate for heat dissipation of power chips as described in any one of claims 1-5; The heat dissipation method includes: The cooling medium enters from the cooling medium inlet (101); the cooling medium is evenly distributed to the microchannel substrate (3) by the manifold body; the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate (3); the cooling medium after heat exchange flows out through the cooling medium outlet. When the cooling medium exchanges heat with the power chip to be cooled on the microchannel substrate (3), the cooling medium forms a uniform low-temperature region on the base plate (4), and the power chip to be cooled can exchange heat with the uniform low-temperature region.

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