Display panel and display terminal

Abstract

The application discloses a display panel and a display terminal. The display panel comprises a first substrate, a first metal layer and a second metal layer. The first metal layer comprises a first metal part located in a display area and a second metal part located in a non-display area. The second metal layer comprises a third metal part located in the display area and a fourth metal part located in the non-display area. The orthographic projection of the first metal part on the first substrate does not overlap with the orthographic projection of the third metal part on the first substrate. The orthographic projection of the second metal part on the first substrate at least partially overlaps with the orthographic projection of the fourth metal part on the first substrate. The second metal part and the fourth metal part are electrically connected. The second metal part and the fourth metal part are connected in parallel, so that the total sheet resistance of the second metal part and the fourth metal part is reduced. Since the second metal part is arranged in the same layer as the first metal part of the display area, and the fourth metal part is arranged in the same layer as the third metal part of the display area, the number of masks is not increased.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and a display terminal. Background Technology

[0002] To achieve narrow bezels and increase refresh rates in display panels, it is necessary to reduce the sheet resistance of the connecting leads. Since the sheet resistance of the connecting leads is smaller than that of the metal traces in the display area, the photomask in the display area cannot be shared. Related technologies require the use of an additional photomask to make the connecting leads, which increases the manufacturing cost of the display panel.

[0003] To address the aforementioned technical problems, this application proposes a technical solution to reduce the sheet resistance of the connection leads of the display panel without adding a photomask. Summary of the Invention

[0004] This application provides a display panel and a display terminal that reduces the sheet resistance of the connection leads of the display panel without adding a photomask.

[0005] To solve the above-mentioned technical problems, the technical solution provided in this application is as follows:

[0006] This application provides a display panel, the display panel including a display area and a non-display area located on at least one side of the display area, the display panel including:

[0007] First substrate;

[0008] A first metal layer is disposed on the first substrate, the first metal layer including a first metal portion located in the display area and a second metal portion located in the non-display area;

[0009] A second metal layer is disposed on the side of the first metal layer away from the first substrate, and the second metal layer includes a third metal portion located in the display area and a fourth metal portion located in the non-display area;

[0010] Wherein, the first metal layer and the second metal layer are separated by an insulating layer; the orthographic projection of the first metal portion on the first substrate does not overlap with the orthographic projection of the third metal portion on the first substrate, and the orthographic projection of the second metal portion on the first substrate at least partially overlaps with the orthographic projection of the fourth metal portion on the first substrate, and the second metal portion and the fourth metal portion are electrically connected.

[0011] In one embodiment, the display panel further includes:

[0012] A plurality of thin-film transistors are located in the display area, and each thin-film transistor includes a gate and an active portion;

[0013] The pixel electrode is spaced from one end of the active portion;

[0014] A common electrode is disposed on the side of the pixel electrode away from the first substrate, and the common electrode includes a first common portion located in the display area and a second common portion located in the non-display area;

[0015] Wherein, the gate is a first metal portion, the pixel electrode is a third metal portion, the second metal portion and the second common portion are electrically connected through a first via, and the fourth metal portion and the second common portion are electrically connected through a second via.

[0016] In one embodiment, the thin-film transistor further includes a source and a drain, the drain being contacted at one end of the active portion and the pixel electrode, and the source being electrically connected to the other end of the active portion.

[0017] The display panel further includes a fifth metal part disposed on the same layer as the drain electrode. The fifth metal part is located in the non-display area and is in contact with the fourth metal part.

[0018] In one embodiment, the orthographic projection of the fifth metal portion on the first substrate overlaps with the orthographic projection of the fourth metal portion on the first substrate.

[0019] In one embodiment, the display panel further includes a sixth metal portion located in the non-display area, the sixth metal portion being disposed on the side of the fourth metal portion away from the first substrate;

[0020] The sixth metal portion is separated from the fourth metal portion by an insulating layer; the orthographic projection of the second metal portion on the first substrate and the orthographic projection of the fourth metal portion on the first substrate form an overlapping area, the orthographic projection of the sixth metal portion on the first substrate coincides with the overlapping area, and the sixth metal portion and the second common portion are electrically connected through a third via.

[0021] In one embodiment, the second via contacts the fifth metal portion, and the orthographic projection of the second via onto the fourth metal portion is located outside the fourth metal portion.

[0022] In one embodiment, the sixth metal part is provided with a hollow hole, the material of the second common part fills the hollow hole, and the orthographic projection of the hollow hole on the fourth metal part is located inside the fourth metal part.

[0023] In one embodiment, at least one of the second metal portion and the fourth metal portion is provided with a through hole corresponding to the cutout hole, and the orthographic projection of the cutout hole on the first substrate coincides with the orthographic projection of the through hole on the first substrate.

[0024] In one embodiment, the display panel further includes a second substrate disposed opposite to the first substrate, the second substrate being disposed on the side of the second metal layer away from the first substrate; a liquid crystal layer is disposed between the first substrate and the second substrate.

[0025] This application also provides a display terminal, which includes the display panel described above.

[0026] Beneficial Effects: This application discloses a display panel and a display terminal. The display panel includes a display area and a non-display area located on at least one side of the display area. The display panel includes a first substrate, a first metal layer, and a second metal layer. The first metal layer is disposed on the first substrate and includes a first metal portion located in the display area and a second metal portion located in the non-display area. The second metal layer is disposed on the side of the first metal layer away from the first substrate and includes a third metal portion located in the display area and a fourth metal portion located in the non-display area. The first metal layer and the second metal layer are separated by an insulating layer. The orthographic projection of the first metal portion on the first substrate does not overlap with the orthographic projection of the third metal portion on the first substrate, and the orthographic projection of the second metal portion on the first substrate at least partially overlaps with the orthographic projection of the fourth metal portion on the first substrate. The second metal portion and the fourth metal portion are electrically connected. This application reduces the total sheet resistance of the second metal portion and the fourth metal portion by connecting the second metal portion and the fourth metal portion in parallel in the non-display area. Since the second metal part is arranged on the same layer as the first metal part of the display area, and the fourth metal part is arranged on the same layer as the third metal part of the display area, the number of photomasks is not increased. Attached Figure Description

[0027] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0028] Figure 1 This is a top view of the display panel structure of this application;

[0029] Figure 2 for Figure 1 A cross-sectional structural diagram of a display panel in a computer.

[0030] Figure 3 for Figure 1 Another cross-sectional view of the display panel in the diagram;

[0031] Figure 4 for Figure 1 A partially enlarged structural diagram of the display panel in the image;

[0032] Figures 5A to 5C This is a flowchart illustrating the patterning process of a portion of the film layer in the display panel of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] Display area AA, non-display area NA, first substrate 10, connecting lead portion 12, connecting lead 121, bonding portion 13, pad 131, first metal layer 11, first metal part 111, second metal part 112, second metal layer 21, third metal part 211, fourth metal part 212, insulating layer 80, thin film transistor 40, gate 41, active part 42, pixel electrode 90, common electrode 50, first common part 51, second common part 52, first via HL1, second via HL2, third via HL3, source electrode 43, drain electrode 44, fifth metal part 61, sixth metal part 62, second substrate 20, liquid crystal layer 30, common electrode trace 113, data line 45, scan line 114, cutout hole KL, through hole TL, first photomask 11A, second photomask 21A. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. In the drawings, for clarity and better understanding and ease of description, the thickness of layers, films, plates, regions, etc., may be enlarged. It should be understood that when an element such as a layer, film, region, or substrate is referred to as "located on another element," it may be directly located on the other element or there may be inserted elements. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing direction in the drawings; while "inner" and "outer" refer to the outline of the device.

[0036] Furthermore, unless explicitly stated otherwise, the word "including" and its variations such as "comprising" or "containing" will be understood to imply the inclusion of the discussed element, but not necessarily the exclusion of other elements. Further, in the specification, the phrase "on" means placed above or below the object part, and not necessarily on the upper side of the object part based on the direction of gravity.

[0037] It will be understood that although the terms “first,” “second,” etc., may be used in this document to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another.

[0038] As used in this article, the singular forms “one,” “a,” and “the” are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0039] It will also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the said feature or component, but do not exclude the presence or addition of one or more other features or components.

[0040] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, it can be formed directly or indirectly on that other layer, region, or component. For example, intermediate layers, regions, or components may exist.

[0041] Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0042] To achieve narrow bezels and increase refresh rates in display panels, it is necessary to reduce the sheet resistance of the connecting leads. Since the sheet resistance of the connecting leads is smaller than that of the metal traces within the display area, they cannot share the same photomask. Related technologies require an additional photomask to fabricate the connecting leads, increasing the manufacturing cost of the display panel. This application proposes the following solution to address the aforementioned technical problems.

[0043] This application discloses a display panel. The display panel includes a display area AA and a non-display area NA located on at least one side of the display area AA. The display panel includes a first substrate 10, a first metal layer 11, and a second metal layer 21. The first metal layer 11 is disposed on the first substrate 10 and includes a first metal portion 111 located in the display area AA and a second metal portion 112 located in the non-display area NA. The second metal layer 21 is disposed on the side of the first metal layer 11 away from the first substrate 10 and includes a third metal portion 211 located in the display area AA and a fourth metal portion 212 located in the non-display area NA. The first metal layer 11 and the second metal layer 21 are separated by an insulating layer 80. The orthographic projection of the first metal portion 111 on the first substrate 10 does not overlap with the orthographic projection of the third metal portion 211 on the first substrate 10. The orthographic projection of the second metal portion 112 on the first substrate 10 at least partially overlaps with the orthographic projection of the fourth metal portion 212 on the first substrate 10. The second metal portion 112 and the fourth metal portion 212 are electrically connected.

[0044] This application reduces the total sheet resistance of the second metal portion 112 and the fourth metal portion 212 by connecting the second metal portion 112 and the fourth metal portion 212 in parallel in the non-display area NA. Since the second metal portion 112 is disposed on the same layer as the first metal portion 111 of the display area AA, and the fourth metal portion 212 is disposed on the same layer as the third metal portion 211 of the display area AA, the number of photomasks is not increased.

[0045] Please see Figures 1 to 4 , Figure 1 This is a top view of the display panel structure of this application. Figure 2 for Figure 1 A cross-sectional structural diagram of a display panel in a computer. Figure 3 for Figure 1 Another cross-sectional view of the display panel is shown in the diagram. Figure 4 for Figure 1 A partially enlarged structural diagram of the display panel.

[0046] like Figure 1 As shown, the display panel includes a display area AA and a non-display area NA located around the display area AA. The display area AA is used to display images. A bonding portion 13 is provided in the non-display area NA on one side of the display area AA. The bonding portion 13 includes multiple pads 131 and is used for bonding and connecting with external components. For example, the bonding portion 13 can be used to bond and connect with driver chips, flexible circuit boards, flip-chip films, etc.

[0047] A connection lead section 12 may also be provided in the non-display area NA, which includes multiple connection leads 121. The connection lead section 12 is located between two adjacent bonding sections 13. The connection leads 121 can be used to connect to the pads 131, or the connection leads 121 can be electrically connected to the circuit in the display area AA to provide signals to the circuit in the display area AA, or the connection leads 121 can form a sandwich capacitor. Figure 1 The diagram shows the case when the connecting lead 121 is used to connect the pad 131.

[0048] The display panel can be an LCD panel, an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0049] like Figure 2 and Figure 3 As shown in the cross-sectional structural diagram of the display panel, the display panel includes a first substrate 10, a first metal layer 11 disposed on the first substrate 10, and a second metal layer 21 disposed on the side of the first metal layer 11 away from the first substrate 10.

[0050] The first substrate 10 can be a flexible substrate or a rigid substrate, and the material of the first substrate 10 can be polyimide or glass, etc.

[0051] The first metal layer 11 may include patterned first metal portions 111 and second metal portions 112, wherein the first metal portion 111 is located in the display area AA, and the second metal portion 112 is located in the non-display area NA. The first metal portion 111 and the second metal portion 112 are spaced apart. The first metal portion 111 and the second metal portion 112 are disposed in the same layer, can be formed by the same film deposition process, and are patterned on the same photomask, thereby not increasing the number of photomasks. The first metal portion 111 and the second metal portion 112 are made of the same material. The material of the first metal layer 11 may be a single layer or multiple layers of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0052] The second metal layer 21 may include patterned third metal portions 211 and fourth metal portions 212, wherein the third metal portion 211 is located in the display area AA and the fourth metal portion 212 is located in the non-display area NA. The third metal portion 211 and the fourth metal portion 212 are spaced apart.

[0053] The third metal layer 211 and the fourth metal layer 212 are disposed on the same layer, can be formed by the same film deposition process, and are patterned on the same photomask, thereby not increasing the number of photomasks. The third metal layer 211 and the fourth metal layer 212 are made of the same material. The material of the second metal layer 21 is a transparent conductive material, such as one or more of the following stacks: ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), and IGZTO (indium gallium zinc tin oxide).

[0054] Wherein, the orthographic projection of the first metal part 111 on the first substrate 10 and the orthographic projection of the third metal part 211 on the first substrate 10 do not overlap, that is, the orthographic projections of the first metal part 111 and the third metal part 211 on the substrate are staggered.

[0055] The orthographic projection of the second metal portion 112 on the first substrate 10 at least partially overlaps with the orthographic projection of the fourth metal portion 212 on the first substrate 10, thereby allowing the second metal portion 112 and the fourth metal portion 212 to be connected in parallel through vias to form a connecting lead 121. By connecting multiple metal layers in parallel, the sheet resistance of the connecting lead 121 can be reduced, enabling narrow bezels and increasing the refresh rate of the display panel.

[0056] It should be noted that the first metal layer 11 and the second metal layer 21 can be any metal layer within the display area AA, as long as the orthographic projections of the film patterns of the first metal layer 11 and the second metal layer 21 on the first substrate 10 do not overlap. This application does not limit the film positions of the first metal layer 11 and the second metal layer 21.

[0057] The insulating layer 80 can be a single layer or a stack of silicon nitride, silicon nitride, silicon oxynitride, etc., but is not limited to this.

[0058] The technical solution of this application will now be described in conjunction with specific embodiments.

[0059] like Figure 4 As shown, Figure 4 A partially enlarged view of a display area AA of a display panel is shown. The display area AA of the display panel includes multiple scan lines 114 extending in one direction and multiple data lines 45 extending in another direction. The scan lines 114 and data lines 45 intersect to form multiple pixel regions. Each pixel region is provided with a corresponding pixel electrode 90, and each pixel region is provided with at least one thin-film transistor 40.

[0060] like Figure 2 and Figure 3 As shown, the thin-film transistor 40 includes a gate 41, an active portion 42, a source 43, and a drain 44. The gate 41 is located on the side of the active portion 42 closest to the first substrate 10, and an insulating layer 80 is provided between the gate 41 and the active portion 42. The source 43 and the drain 44 are located on the side of the active portion 42 away from the first substrate 10, and the source 43 and the drain 44 are electrically connected to one end of the active portion 42, respectively. The source 43 and the drain 44 are disposed in the same layer, and the source 43 and the drain 44 can be formed by the same film deposition process and patterned on the same photomask, thereby not increasing the number of photomasks. The source 43 and the drain 44 are made of the same material. The material of the source 43 and the drain 44 can be a single layer or multiple layers of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0061] It should be noted that, Figure 4 The illustration shows one pixel structure; the technical solution of this application can be applied to other pixel structures, and is not limited to them. Figure 4 The pixel structure in the text.

[0062] The pixel electrode 90 can be disposed on the same layer as the active part 42. The material of the active part 42 can be monocrystalline silicon, polycrystalline silicon, etc., but is not limited to these. One end of the drain 44 is in contact with the active part 42, and the other end of the drain 44 is in contact with the pixel electrode 90, so that the driving signal can be transmitted to the pixel electrode 90 via the thin film transistor 40.

[0063] In one embodiment, the gate 41 is a first metal portion 111, and the pixel electrode 90 is a third metal portion 211. For example... Figure 4 As shown, the gate 41 is integrally disposed with the scan line 114, and the gate 41 overlaps with the active part 42. Figure 3 The gate electrode 41 is located below the active portion 42 and is shielded by the active portion 42. The source electrode 43 is integrally disposed with the data line 45, and the drain electrode 44 is connected to the active portion 42 and the pixel electrode 90. The orthographic projection of the gate electrode 41 on the first substrate 10 does not overlap with the orthographic projection of the pixel electrode 90 on the first substrate 10.

[0064] Please see again Figure 2 and Figure 3 The second metal portion 112 is disposed on the same layer as the gate 41. The second metal portion 112 and the gate 41 can be formed by the same film deposition process and patterned on the same photomask, thereby not increasing the number of photomasks. The gate 41 and the second metal portion 112 are made of the same material.

[0065] The fourth metal part 212 is disposed on the same layer as the pixel electrode 90. The fourth metal part 212 and the pixel electrode 90 can be formed by the same film deposition process and patterned on the same photomask, thereby not increasing the number of photomasks. The fourth metal part 212 and the pixel electrode 90 are made of the same material.

[0066] Continue reading Figure 2 and Figure 3 The display panel also includes a common electrode 50, which includes a first common portion 51 located in the display area AA and a second common portion 52 located in the non-display area NA, with the first common portion 51 and the second common portion 52 spaced apart. The display area AA also includes a common electrode trace 113, which may be located in the first metal layer 11. The common electrode trace 113 is connected to the common electrode 50 through a via, and the common electrode trace 113 provides a voltage signal to the common electrode 50. The material of the common electrode 50 is a transparent conductive material, such as one or more of the following stacks: ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), and IGZTO (indium gallium zinc tin oxide).

[0067] The second metal part 112 is electrically connected to the second common part 52 via the first via HL1, and the fourth metal part 212 is electrically connected to the second common part 52 via the second via HL2. It should be noted that... Figure 2 and Figure 3The diagram also shows a fifth metal portion 61, which may be omitted in one embodiment. That is, the second common portion 52 and the fourth metal portion 212 are directly electrically connected via a second via HL2. With this configuration, the connecting lead 121 can be formed by three parallel layers: the second metal portion 112, the fourth metal portion 212, and the second common portion 52, thereby reducing the sheet resistance of the connecting lead 121.

[0068] Furthermore, in one embodiment, such as Figure 2 and Figure 3 As shown, the non-display area NA also includes a fifth metal portion 61, which is disposed on the same layer as the drain electrode 44. The fifth metal portion 61 and the drain electrode 44 can be formed by the same film deposition process and patterned on the same photomask, thus not increasing the number of photomasks. The fifth metal portion 61 and the drain electrode 44 are made of the same material. The material of the fifth metal portion 61 can be a single layer or multiple layers of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0069] With the above configuration, the connecting lead 121 can be made of four metal layers connected in parallel: the second metal part 112, the fourth metal part 212, the fifth metal part 61, and the second common part 52. The fifth metal part 61 and the fourth metal part 212 are in direct contact, which further reduces the sheet resistance of the connecting lead 121.

[0070] like Figure 2 As shown, based on all the embodiments described above, the display panel may further include a sixth metal portion 62 of the non-display area NA. The sixth metal portion 62 is located on the side of the fourth metal portion 212 away from the first substrate 10, and an insulating layer 80 is provided between the sixth metal portion 62 and the fourth metal portion 212. The orthographic projection of the second metal portion 112 on the first substrate 10 and the orthographic projection of the fourth metal portion 212 on the first substrate 10 form an overlapping area, and the orthographic projection of the sixth metal portion 62 on the first substrate 10 coincides with the overlapping area. That is to say, the orthographic projection pattern of the sixth metal portion 62 is the intersection of the orthographic projection patterns of the second metal portion 112 and the fourth metal portion 212. A common portion of the sixth metal portion 62 is electrically connected through a third via HL3.

[0071] With the above configuration, the connecting lead 121 can be made of five metal layers connected in parallel: the second metal part 112, the fourth metal part 212, the fifth metal part 61, the sixth metal part 62, and the second common part 52, which further reduces the sheet resistance of the connecting lead 121.

[0072] It should be noted that since the orthographic pattern of the sixth metal part 62 is the intersection of the orthographic patterns of the second metal part 112 and the fourth metal part 212, the photomasks of the second metal part 112 and the sixth metal part 62 can be used for two exposures to obtain the pattern of the sixth metal part 62. Therefore, it is not necessary to add a photomask, and the sheet resistance of the connecting lead 121 is reduced.

[0073] Specifically, please refer to Figures 5A to 5C , Figures 5A to 5C This is a flow chart illustrating the patterning process of a portion of the film layers in the display panel of this application. Figures 5A to 5C This describes how to form the sixth metal part 62 without adding a photomask. The patterning process includes first forming a full-layer metal film, then coating a photoresist, exposing and developing the photoresist using a photomask, and finally etching to complete the patterning of the metal film.

[0074] Please refer to the following first. Figure 5A , Figure 5A The process for forming the first metal layer 11 is illustrated. First, a solid-layer first metal layer 11 is formed, and then photoresist is coated onto the surface of the first metal layer 11. A first photomask 11A is a photomask that patterns the first metal layer 11. The first photomask 11A includes an exposure area and a light-blocking area (the black square area in the figure), and light (…). Figure 5A (As indicated by the middle arrow) The photoresist (not shown) is irradiated from the exposure area, and the first metal layer 11 of the exposure area is etched in the subsequent etching process, leaving the first metal part 111 and the second metal part 112.

[0075] like Figure 5B As shown, Figure 5B The process for forming the second metal layer 21 is illustrated. First, a solid second metal layer 21 is formed, and then photoresist is coated onto the surface of the second metal layer 21. The second photomask 21A is a photomask that patterns the second metal layer 21. The second photomask 21A includes an exposure area and a light-blocking area (the black square area in the figure), and light (…). Figure 5B (As indicated by the middle arrow) The photoresist (not shown) is irradiated by the exposure area, and the second metal layer 21 of the exposure area is etched in the subsequent etching process, leaving the third metal part 211 and the fourth metal part 212.

[0076] like Figure 5C As shown, Figure 5CThe process for forming the sixth metal part 62 is shown. First, a full-layer metal layer (not shown) is formed, and then photoresist (not shown) is coated on the surface of the metal layer. The photoresist is first exposed once using a first photomask 11A. The pattern corresponding to the exposed area of ​​the first photomask 11A can be etched in subsequent processes after exposure. Then, the photoresist is exposed again using a second photomask 21A. The pattern corresponding to the exposed area of ​​the second photomask 21A can be etched in subsequent processes after exposure. It should be noted that in the display area AA, since the patterns of the first photomask 11A and the second photomask 21A do not overlap, the metal layer of the display area AA is exposed in both exposures, and therefore can be etched in the subsequent etching process.

[0077] In the non-display area NA, since the light-shielding areas of the first photomask 11A and the second photomask 21A overlap, the pattern in the overlapping area is not exposed and can be retained in the subsequent etching process to form the sixth metal part 62. That is to say, the orthographic projection of the second metal part 112 on the first substrate 10 and the orthographic projection of the fourth metal part 212 on the first substrate 10 form an overlapping area, and the orthographic projection of the sixth metal part 62 on the first substrate 10 coincides with this overlapping area.

[0078] In one embodiment, such as Figure 2 As shown, the orthographic projection of the fifth metal portion 61 on the first substrate 10 overlaps with the orthographic projection of the fourth metal portion 212 on the first substrate 10, and the orthographic projection of the fourth metal portion 212 on the first substrate 10 is located within the orthographic projection of the fifth metal portion 61 on the first substrate 10. One end of the second via HL2 is electrically connected to the second common portion 52, and the other end is electrically connected to the fifth metal portion 61. With the above arrangement, the electrical connection between the second common portion 52 and the fourth metal portion 212 can be achieved through the fifth metal portion 61 and the second via HL2, further reducing the sheet resistance of the connection lead 121.

[0079] In one embodiment, such as Figure 3 As shown, the sixth metal part 62 has a perforated hole KL, and the material of the second common part 52 fills the perforated hole KL. The orthographic projection of the perforated hole KL onto the fourth metal part 212 is located within the fourth metal part 212. With the above arrangement, the second through hole HL2 can be located within the sixth metal part 62, thereby saving through hole space.

[0080] Furthermore, at least one of the second metal portion 112 and the fourth metal portion 212 is provided with a through hole TL corresponding to the cutout hole KL. Since the sixth metal portion 62 is formed using the first photomask 11A and the second photomask 21A, when it is necessary to form the cutout hole KL on the sixth metal portion 62, the through hole TL can be formed in the corresponding area of ​​at least the first photomask 11A and the second photomask 21A. Therefore, since at least one of the second metal portion 112 and the fourth metal portion 212 is formed with a through hole TL corresponding to the cutout hole KL, the sixth metal portion 62 can be formed using the first photomask 11A and the second photomask 21A. At this time, the orthographic projection of the cutout hole KL on the first substrate 10 coincides with the orthographic projection of the through hole TL on the first substrate 10. Therefore, it is not necessary to add a photomask to form the second via HL2.

[0081] It should be noted that in all the above embodiments, the first via HL1, the second via HL2, and the third via HL3 are formed via the same photomask, thus not increasing the number of photomasks.

[0082] In one embodiment, such as Figure 2 and Figure 3 As shown, the display panel also includes a second substrate 20 disposed opposite to the first substrate 10. The second substrate 20 is located on the side of the second metal layer 21 away from the first substrate 10, and a liquid crystal layer 30 is disposed between the first substrate 10 and the second substrate 20. The pixel electrode 90 and the common electrode 50 on the first substrate 10 form an electric field, driving the liquid crystal in the liquid crystal layer 30 to deflect.

[0083] The display panel also includes a backlight module located on the side of the first substrate 10 away from the second substrate 20, the backlight module being used to provide a white light source. The liquid crystal layer 30 can control the transmittance of the light source emitted from the backlight module, thereby enabling image display.

[0084] This application also provides a display terminal, which includes the display panel described above.

[0085] In some embodiments, the display terminal can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0086] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0087] The above provides a detailed description of a display panel and display terminal provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area located on at least one side of the display area. First substrate; A first metal layer is disposed on the first substrate, the first metal layer including a first metal portion located in the display area and a second metal portion located in the non-display area; A second metal layer is disposed on the side of the first metal layer away from the first substrate, and the second metal layer includes a third metal portion located in the display area and a fourth metal portion located in the non-display area; A common electrode is disposed on the side of the second metal layer away from the first substrate, and the common electrode includes a first common portion located in the display area and a second common portion located in the non-display area; Wherein, the first metal layer and the second metal layer are separated by an insulating layer; the orthographic projection of the first metal portion on the first substrate does not overlap with the orthographic projection of the third metal portion on the first substrate, and the orthographic projection of the second metal portion on the first substrate at least partially overlaps with the orthographic projection of the fourth metal portion on the first substrate; the second metal portion and the fourth metal portion are electrically connected; the second metal portion and the second common portion are electrically connected through a first via; and the fourth metal portion and the second common portion are electrically connected through a second via.

2. The display panel according to claim 1, characterized in that, The display panel also includes: Multiple thin-film transistors are located in the display area, and each thin-film transistor includes a gate and an active portion; The pixel electrode is spaced from one end of the active portion; A common electrode is disposed on the side of the pixel electrode away from the first substrate; The gate is a first metal part, and the pixel electrode is a third metal part.

3. The display panel according to claim 2, characterized in that, The thin-film transistor further includes a source and a drain, the drain being contacted at one end of the active portion and the pixel electrode, and the source being electrically connected to the other end of the active portion; The display panel further includes a fifth metal part disposed on the same layer as the drain electrode. The fifth metal part is located in the non-display area and is in contact with the fourth metal part.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the fifth metal part on the first substrate overlaps with the orthographic projection of the fourth metal part on the first substrate.

5. The display panel according to claim 3 or 4, characterized in that, The display panel further includes a sixth metal portion located in the non-display area, the sixth metal portion being disposed on the side of the fourth metal portion away from the first substrate; The sixth metal portion is separated from the fourth metal portion by an insulating layer; the orthographic projection of the second metal portion on the first substrate and the orthographic projection of the fourth metal portion on the first substrate form an overlapping area, the orthographic projection of the sixth metal portion on the first substrate coincides with the overlapping area, and the sixth metal portion and the second common portion are electrically connected through a third via.

6. The display panel according to claim 5, characterized in that, The second via is in contact with the fifth metal part, and the orthographic projection of the second via on the fourth metal part is located outside the fourth metal part.

7. The display panel according to claim 5, characterized in that, The sixth metal part is provided with a hollow hole, and the material of the second common part fills the hollow hole. The orthographic projection of the hollow hole on the fourth metal part is located inside the fourth metal part.

8. The display panel according to claim 7, characterized in that, At least one of the second metal part and the fourth metal part is provided with a through hole corresponding to the hollow hole, and the orthographic projection of the hollow hole on the first substrate coincides with the orthographic projection of the through hole on the first substrate.

9. The display panel according to claim 1, characterized in that, The display panel further includes a second substrate disposed opposite to the first substrate, the second substrate being disposed on the side of the second metal layer away from the first substrate; a liquid crystal layer is disposed between the first substrate and the second substrate.

10. A display terminal, characterized in that, The display terminal includes a display panel as described in any one of claims 1 to 9.

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