Hybrid optoelectronic blind-mate module
Patent Information
- Application Number
- CN202311393576.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-26
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2043-10-26
AI Technical Summary
[0003]传统的机电设备中,供电、射频、光纤、控制信号网络彼此独立安装,操作复杂
[0004] To address the technical challenges of highly integrated and rapidly installed networks, a solution was adopted that integrates modules within a modular housing, with the housing providing protection and support. This solution is applicable to scenarios involving blind mating of multiple connectors, offering advantages such as compact structure, high space utilization, and rapid interconnection with front-end and back-end devices. It also reduces the risk of damage to cables and optical fibers during installation and disassembly.
Smart Images

Figure CN117479459B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of mechanical structure design technology, and specifically relates to a blind-insertion wiring technology. Background Technology
[0002] Highly integrated electromechanical equipment, such as radar, contains multiple signal links, including power supply, radio frequency, fiber optic, and control links. These signal links consist of components such as cable assemblies, printed circuit boards, and power dividers, and connect front-end and back-end devices through various signal networks to achieve the transmission of photoelectric signals.
[0003] In traditional electromechanical equipment, power supply, radio frequency, fiber optic, and control signal networks are installed independently, making operation complex. The poor spatial coupling between network modules results in large equipment dimensions and poor space utilization. Traditional independent network architectures also struggle to meet the demands for blind-mating connectors, rapid maintenance and installation, and miniaturization and compactness. Summary of the Invention
[0004] To address the technical challenges of highly integrated and rapidly installed networks, a solution was adopted that integrates modules within a modular housing, with the housing providing protection and support. This solution is applicable to scenarios involving blind mating of multiple connectors, offering advantages such as compact structure, high space utilization, and rapid interconnection with front-end and back-end devices. It also reduces the risk of damage to cables and optical fibers during installation and disassembly.
[0005] The module includes an optoelectronic network, a low-frequency network, a power network, and a housing. The optoelectronic network, low-frequency network, and power network all adopt a modular design, are independently assembled and debugged, and are installed inside the housing. The module structure is designed in a ring shape to conform to the docking equipment, without occupying the central area of the equipment, thus saving internal space. The optoelectronic network includes optoelectronic cables, optoelectronic split connectors, and optoelectronic main port connectors. The low-frequency network includes low-frequency cables, low-frequency split connectors, and low-frequency main port connectors. The power network includes power cables, power split connectors, and power main port connectors. The housing includes a cover and cable trays. The cables of each network are clipped into the cable trays of the housing. Each split connector is installed on the cover of the housing for interconnection with the front-end equipment. Each main port connector is installed at the bottom of the cable tray of the housing for interconnection with the back-end equipment.
[0006] Furthermore, the cover has locating pins and the wiring channel has locating holes, which are positioned together and fixed with fasteners.
[0007] Preferably, the cable trays are designed according to the equipment structure and have positioning pins to connect with the equipment, ensuring the accuracy of blind-plug interconnection between the modules and the front-end and back-end equipment.
[0008] Preferably, the cable tray has a thin-walled structure, utilizing the spare space of the equipment to increase the thickness and width in certain areas as a bending area, and the internal edges and the edges of the cable tray are blunted to prevent the cables from being scratched.
[0009] Preferably, each connector has a guiding mechanism and a floating sleeve, which floats slightly in all directions along the horizontal plane to offset positional errors during blind mating and ensure the accuracy of mating interconnection.
[0010] Furthermore, the housing includes a power network cover, an optoelectronic connector cover, a low-frequency connector cover, a low-frequency main port connector cover, a power connector cover, and a low-frequency main port connector cover, with each connector cover installed between the cover and the wiring groove using fasteners.
[0011] Furthermore, the optoelectronic network also includes radio frequency power dividers and optical power dividers, providing optoelectronic signal connection and conversion for front-end and back-end equipment. The optoelectronic cables use flexible cables with small bending radii and optical fibers with built-in metal armor. The length corresponds to the installation position of the optoelectronic split connector, optoelectronic main connector, radio frequency power divider, and radio frequency power divider on the housing, connecting the optoelectronic split connector, optoelectronic main connector, radio frequency power divider, and optical power divider. The power divider printed circuit board is installed at the bottom of the cable tray, which can adapt to bending in the narrow cable tray, improve reliability, and prevent damage.
[0012] Furthermore, the low-frequency network also includes a low-frequency printed circuit board, which is installed at the bottom of the cable tray to provide low-frequency control signal connectivity and processing for front-end and back-end devices. The length of the low-frequency cable corresponds to the installation position of the low-frequency split connector, the low-frequency main connector, and the low-frequency printed circuit board on the housing.
[0013] Furthermore, the main power connector of the power network is a spring pin structure that floats axially, providing interconnection and distribution of power signals for front-end and back-end devices. The power cable has a sheath to protect the internal metal conductor, and its length corresponds to the installation position of the power split connector and the main power connector on the housing.
[0014] The module installation steps are as follows: Step 1: Use cable sheaths and cable ties to secure the cables of the optoelectronic network and low-frequency network in the cable tray, and use fasteners to secure the low-frequency printed circuit board and low-frequency main connector to the cable tray. Step 2: Use cable sheaths and cable ties to fix the optoelectronic cable on top of the low-frequency cable, bend it in the extra space in the cable tray, and fix the RF power divider, optical power divider, and optoelectronic main connector on the cable tray. Step 3: Install the power main connector at the bottom of the cable tray, bend the power cable along the housing and install it at the bottom of the cable tray to isolate the power network from the optoelectronic network and low frequency network to prevent strong current from interfering with high frequency signals, and install the power network protection cover. Step 4: Secure the cover to the cable tray using positioning pins, positioning holes, and fasteners; install each connector on the cover; and mate the optoelectronic cable with the optoelectronic connector. Step 5: Pass the connectors and optoelectronic cables through the cable trays of the cover, install the optoelectronic connector cover plate, mate the optoelectronic split connectors with the front-panel adapters of the cover, and mate the connectors inside the module with the front-panel adapters in the same way to achieve modular overall assembly of each network. Attached Figure Description
[0015] Figure 1 It is a module exploded diagram. Figure 2 This is a front view of the module. Figure 3 This is a view of the back of the module. Figure 4 This is the module side view. Figure 5 It is a module assembly diagram. Figure 6 This is a diagram of the cable television network structure. Figure 7 This is a low-frequency network structure diagram. Figure 8 This is a power supply network structure diagram. Implementation
[0016] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.
[0017] The housing consists of a cover 1-1 and a wiring trough 1-2. The optoelectronic network 2, low-frequency network 3, and power network 4 are installed inside the housing. Figure 1 As shown.
[0018] The cables for each network are secured within cable trays 1-2. Connectors for each network are blind-molded to both front-end and back-end devices. Optical split connectors 2-1, low-frequency split connectors 3-1, and power split connectors 4-1, which interconnect with the front-end devices, are mounted on the housing cover 1-1. Figure 2 As shown, the optoelectronic main port connector 2-5, low-frequency main port connectors 3-4 and 3-5, power main port connector 4-2, RF power divider 2-2, optical power divider 2-4, and low-frequency printed circuit board 3-2, which interconnect with the back-end equipment, are installed at the bottom of the cable tray 1-2, as shown. Figure 3 and Figure 4 As shown.
[0019] Power network cover 1-3, optoelectronic connector cover 1-4, low-frequency connector cover 1-5, low-frequency main port connector cover 1-6, power connector cover 1-7, and low-frequency main port connector cover 1-8 are installed between cover 1-1 and cable tray 1-2 using fasteners, positioned with locating pins 1-9, and installed with screws 1-10. Figure 5 As shown.
[0020] The optoelectronic network 2 adopts a modular design, allowing for independent assembly and debugging. Optoelectronic cables 2-3 utilize flexible cables with small bending radii and optical fibers with built-in metal armor. They connect optoelectronic splitter connectors 2-1, optoelectronic main connectors 2-5, RF power dividers 2-2, and optical power dividers 2-4, providing optoelectronic signal connectivity and conversion for front-end and back-end equipment. Figure 6 As shown.
[0021] The low-frequency network 3 adopts a modular design, allowing for independent assembly and debugging. The length of the low-frequency cable 3-3 corresponds to the mounting positions of the low-frequency split connector 3-1, the low-frequency printed circuit board 3-2, and the low-frequency main connectors 3-4 and 3-5 on the housing, providing connectivity and processing of low-frequency control signals for front-end and back-end equipment. Figure 7 As shown.
[0022] The power network 4 adopts a modular design, allowing for independent assembly and debugging. The power cables are sheathed (4-3) to protect the internal metal conductors. Their length corresponds to the mounting positions of the power split connector 4-1 and the power main connector 4-2 on the housing, providing interconnection and distribution of power signals for front-end and back-end devices. Figure 8 As shown.
[0023] The above are embodiments of the present invention and do not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention are included within the protection scope of the present invention.
Claims
1. A hybrid optoelectronic blind-mating module, characterized in that, include: The optoelectronic network, low-frequency network, power network, and housing are all modularly designed, independently assembled and debugged, and installed inside the housing. The modular structure is designed in a ring shape with the docking equipment, which does not occupy the central area of the equipment and saves internal space. The optoelectronic network includes optoelectronic cables, optoelectronic split connectors, and optoelectronic main connectors; the low-frequency network includes low-frequency cables, low-frequency split connectors, and low-frequency main connectors; the power network includes power cables, power split connectors, and power main connectors; the housing includes a cover and cable trays. The cables of each network are clipped into the cable trays of the housing. Each split connector is installed on the cover of the housing and interconnects with the front-end equipment. Each main connector is installed at the bottom of the cable tray of the housing and interconnects with the back-end equipment.
2. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The cover has a positioning pin, and the wiring groove has a positioning hole, which are positioned to each other and fixed with fasteners.
3. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The cable tray is designed according to the equipment structure and has positioning pins for docking with the equipment.
4. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The cable tray has a thin-walled structure with increased thickness and width in certain areas to serve as a bending region, and the internal edges and the edges of the cable tray are blunted.
5. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, Each connector has a guiding mechanism and a floating sleeve, which allows it to float slightly in all directions along the horizontal plane.
6. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The housing also includes: a power network cover, an optoelectronic connector cover, a low-frequency connector cover, a low-frequency main port connector cover, a power connector cover, and a low-frequency main port connector cover, with fasteners used to install each connector cover between the cover and the wiring groove.
7. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The optoelectronic network also includes: radio frequency power dividers and optical power dividers, which provide optoelectronic signal connection and conversion for front-end and back-end equipment. The optoelectronic cables adopt flexible cables with small bending radius and optical fibers with built-in metal armor. The length corresponds to the installation position of the optoelectronic split connector, optoelectronic main connector, radio frequency power divider, and radio frequency power divider on the housing, connecting the optoelectronic split connector, optoelectronic main connector, radio frequency power divider, and optical power divider. The power divider printed circuit board is installed at the bottom of the cable tray to adapt to bending in the narrow cable tray.
8. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The low-frequency network also includes: a low-frequency printed circuit board, installed at the bottom of the cable tray, which provides low-frequency control signal connectivity and processing for front-end and back-end devices, and the length of the low-frequency cable corresponds to the installation position of the low-frequency split connector, the low-frequency main connector, and the low-frequency printed circuit board on the housing.
9. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The main power connector of the power network is a spring pin structure that floats along the axial direction, providing interconnection and distribution of power signals for front-end and back-end devices. The power cable has a sheath, and its length corresponds to the installation position of the power split connector and the main power connector on the housing.
10. The hybrid optoelectronic blind-mating module according to claim 1, characterized in that, The installation steps of the module include: Step 1: Use cable sheaths and cable ties to fix the cables of the optoelectronic network and low frequency network in the cable tray, and use fasteners to fix the low frequency printed circuit board and low frequency main port connector on the cable tray. Step 2: Use cable sheaths and cable ties to fix the optoelectronic cable on top of the low-frequency cable, bend it in the extra space in the cable tray, and fix the RF power divider, optical power divider, and optoelectronic main connector on the cable tray. Step 3: Install the power main connector at the bottom of the cable tray, bend the power cable along the housing and install it at the bottom of the cable tray to isolate the power network from the optoelectronic network and low frequency network, and install the power network protection cover. Step 4: Secure the cover to the cable tray using positioning pins, positioning holes, and fasteners; install each connector on the cover; and mate the optoelectronic cable with the optoelectronic connector. Step 5: Pass the connectors and optoelectronic cables through the cable trays of the cover, install the optoelectronic connector cover plate, mate the optoelectronic split connectors with the front-panel adapters of the cover, and mate the connectors inside the module with the front-panel adapters in the same way to achieve modular overall assembly of each network.
Citation Information
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