Servers and server systems

Abstract

The embodiment of the present application provides a kind of server and server system, and the server system includes server and cooling medium distribution device.The server includes first electronic node, second electronic node and cooling connection device.The first electronic node and the second electronic node are connected with cooling medium distribution device by cooling connection device.Cooling medium distribution device transports the liquid cooling medium of same working substance to the first electronic node and the second electronic node, so that the first electronic component of the first electronic node can adopt two-phase heat dissipation mode, and the second electronic component of the second electronic node can adopt single-phase liquid cooling heat dissipation mode, so as to be thus arranged, the server can provide two heat dissipation modes and realize full liquid cooling heat dissipation, to meet the different heat dissipation needs of each electronic of the server, help to improve the heat dissipation performance of the server.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a server and server system. Background Technology

[0002] Internet service providers, enterprise platforms, and research institutions all require significant computing power. The operating platforms that support these needs, including storage, computing, and networking, are called data centers. Furthermore, with the increasing demand for information and communication technologies (ICTs) in modern society, data centers have developed rapidly. This has led to a shift in the density of ICT equipment within data centers from low to high. High-density ICT equipment generates a large amount of heat during operation, necessitating cooling systems in data centers to ensure the proper functioning of the ICT equipment.

[0003] Server systems in related technologies include heat sinks containing liquid cooling media and heat-generating components such as computing nodes, switches, battery modules, and power supply modules immersed in the cooling media. The cooling media absorbs heat generated by the heat-generating components, its temperature rises, and it enters a heat exchanger through pipes to lower the temperature of the liquid cooling media, thus providing single-phase liquid cooling for the heat-generating components. However, for some heat-generating components, liquid cooling is insufficient to meet usage requirements.

[0004] Therefore, improving the heat dissipation performance of servers has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides a server and server system. The server's heat dissipation mechanism can perform full liquid cooling of the server's electronic nodes, which helps to improve the server's heat dissipation performance.

[0006] In a first aspect, embodiments of this application provide a server, comprising at least: a cabinet, a first electronic node, a second electronic node, and a cooling connection device. The cabinet includes a receiving cavity for accommodating the first electronic node and the second electronic node. The cooling connection device includes a first pipe, a second pipe, and a third pipe. The first electronic node includes at least one first electronic component and a housing. The housing has a cavity for accommodating the first electronic component, and the housing is provided with a first liquid inlet and a gas outlet communicating with the cavity. The first liquid inlet communicates with the first pipe, and the gas outlet communicates with the second pipe. The liquid cooling medium enters the housing through the first pipe, absorbs heat from the first electronic component, and then becomes a gaseous cooling medium, which flows out of the housing through the second pipe. The second electronic node includes at least one second electronic component and at least one liquid cooling heat dissipation device, the liquid cooling heat dissipation device being provided with a second liquid inlet and a second liquid outlet. The second liquid inlet is connected to the first pipe, and the liquid outlet is connected to the third pipe. The liquid cooling medium enters the liquid cooling heat dissipation device through the first pipe, absorbs the heat of the second electronic component, and then flows out of the liquid cooling heat dissipation device through the third pipe.

[0007] The server in this embodiment works in conjunction with a cooling medium distribution device. During operation, the cooling medium distribution device delivers liquid cooling medium of the same working fluid to both the first and second electronic nodes via a first pipe. The liquid cooling medium in the first electronic node provides two-phase heat dissipation to the first electronic component, reducing its temperature. Simultaneously, the liquid cooling medium in the second electronic node provides single-phase liquid cooling to the second electronic component, reducing its temperature. Through the second pipe, the gaseous cooling medium generated in the first electronic node enters the cooling medium distribution device and is condensed into liquid cooling medium. Through the third pipe, the liquid cooling medium in the second electronic node enters the cooling medium distribution device and has its temperature reduced. Therefore, the first electronic component can employ two-phase heat dissipation, and the second electronic component can employ single-phase liquid cooling, providing two heat dissipation methods for each electronic node of the server to meet their different heat dissipation needs and improve the server's heat dissipation performance.

[0008] In one possible implementation, the first electronic node is a computing node for performing computing functions, and the first electronic component includes a processor and a memory.

[0009] In one possible implementation, the first electronic component is immersed in the liquid cooling medium inside the cavity. This arrangement allows for two-phase heat dissipation of the first electronic component and helps reduce the amount of cooling medium used while meeting the heat dissipation requirements of the first electronic component.

[0010] In one possible implementation, the housing contains at least one nozzle connected to the first liquid inlet. The nozzle is positioned above the surface of the liquid cooling medium and is used to spray the liquid cooling medium onto the first electronic component. Because the nozzle is positioned above the surface of the liquid cooling medium, the amount of cooling medium used can be reduced, thereby lowering the cooling cost of the computing node. Furthermore, the nozzle can enhance the single-point heat dissipation capability of the first electronic component to meet the high-heat-generating requirements of the computing node.

[0011] In one possible implementation, the number of the second electronic nodes is at least one, and the at least one second electronic node includes at least one of the following electronic nodes: a switching node, a power node, or a battery node. This configuration can meet different usage requirements of the server.

[0012] In one possible implementation, the second electronic node includes a switching node for performing network data transmission functions, and the second electronic component includes a switching chip.

[0013] In one possible implementation, the second electronic node includes a power node for performing power supply and / or voltage conversion functions, and the second electronic component includes a power source.

[0014] In one possible implementation, at least one of the second electronic nodes includes a battery node for performing a backup power function, and the second electronic component includes a battery.

[0015] In one possible implementation, the battery node further includes a battery frame, and the number of batteries is plurality of them. The plurality of batteries are mounted within the battery frame and contact at least one liquid-cooled heat dissipation device disposed on the battery frame. This arrangement can meet the heat dissipation requirements of the battery assembly.

[0016] In one possible implementation, the liquid cooling heat dissipation device is a cold plate assembly, the cold plate assembly including at least one cold plate having a sealed cavity containing a liquid cooling medium, and the cold plate being provided with a second liquid inlet and a liquid outlet communicating with the sealed cavity.

[0017] In one possible implementation, the cold plate is positioned above the second electronic component, which helps to improve the heat dissipation capacity of the second electronic component.

[0018] In one possible implementation, the number of cold plates is multiple, and the system further includes a fourth pipe and a fifth pipe. The second liquid inlets of all the cold plates are connected to the first pipe via the fourth pipe, and the liquid outlets of all the cold plates are connected to the third pipe via the fifth pipe. This arrangement simplifies the connection structure between the cold plates and the first and second pipes.

[0019] In one possible implementation, a quick connector is also included. The second inlet and outlet of the cold plate are both connected to the fourth and fifth pipes respectively via the quick connector. This arrangement helps to improve the docking speed between the cold plate and the fourth and fifth pipes.

[0020] In one possible implementation, it further includes a quick connector. The first liquid inlet and the air outlet of the housing are both connected to the first pipe and the second pipe, respectively, via the quick connector. The second liquid inlet and the liquid outlet of the liquid cooling device are both connected to the first pipe and the third pipe, respectively, via the quick connector. This arrangement helps to improve the docking speed between each electronic node and the cooling connection device.

[0021] In one possible implementation, the quick connector includes at least one first connector and at least one second connector that mates with the first connector. The first connector is used to communicate with the first liquid inlet, the air outlet, the second liquid inlet, or the liquid outlet, and the second connector is used to communicate with the first pipe, the second pipe, or the third pipe. Alternatively, the first connector is used to communicate with the first pipe, the second pipe, or the third pipe, and the second connector is used to communicate with the first liquid inlet, the air outlet, the second liquid inlet, or the liquid outlet. This configuration can improve the docking speed between each electronic node and the cooling connection device.

[0022] In one possible implementation, the first pipe, the second pipe, and the third pipe are all installed on the rear wall of the cabinet. This arrangement allows for the use of the space behind the cabinet for installation, thereby reducing the overall size of the server.

[0023] In one possible implementation, the inner diameter of the first pipe is larger than the inner diameter of the second pipe, and the inner diameter of the second pipe is larger than the inner diameter of the third pipe.

[0024] Secondly, embodiments of this application provide a server system, comprising at least: a cooling medium distribution device and a server as described in any one of the first aspects. A first input terminal of the cooling medium distribution device is connected to the server's air outlet via a second pipe of the server; a second input terminal of the cooling medium distribution device is connected to the server's liquid outlet via a third pipe of the server; and an output terminal of the cooling medium distribution device is connected to the server's first and second liquid inlets via a first pipe of the server. The cooling medium distribution device is used to supply a liquid cooling medium of the same working fluid to the server's cavity and liquid cooling heat dissipation device. The cooling medium distribution device is also used to reduce the temperature of the liquid cooling medium entering the cooling medium distribution device through the third pipe. The cooling medium distribution device is also used to condense the gaseous cooling medium entering the cooling medium distribution device through the second pipe into a liquid cooling medium.

[0025] In one possible implementation, the cooling medium distribution device includes a condenser, a storage tank, and a delivery pump. The input end of the condenser is connected to the server's gas outlet via a second pipe, and the output end of the condenser is connected to the first inlet end of the storage tank. The output end of the storage tank is connected to the input end of the delivery pump, and the second inlet end of the storage tank is connected to the server's liquid outlet via a third pipe. The output end of the delivery pump is connected to the server's first and second liquid inlets via the first pipe. The condenser can condense the gaseous cooling medium into a liquid cooling medium to achieve the recycling of the cooling medium. The storage tank can temporarily store the liquid cooling medium to prevent excessive liquid cooling medium in the first and / or second electronic nodes and to ensure that the total amount of cooling medium in the server remains within a predetermined range. The delivery pump can deliver the liquid cooling medium from the storage tank to each electronic node.

[0026] In one possible implementation, the cooling medium distribution device is installed on the side wall of the server cabinet. This arrangement helps to reduce the space required for the server system, thereby allowing a larger number of server systems to be installed in a unit space.

[0027] Thirdly, embodiments of this application provide a data center, which includes at least a computer room and at least one server system as described in the second aspect, disposed within the computer room.

[0028] These and other aspects, embodiments, and advantages of the exemplary embodiments will become apparent from the accompanying drawings and the examples described below. However, it should be understood that the specification and drawings are for illustrative purposes only and are not intended to limit the scope of this application; details are provided in the appended claims. Other aspects and advantages of this application will be set forth in the following description, and in part will be obvious from the description or may be learned by practice of the application. Furthermore, various aspects and advantages of this application may be realized and obtained by means and combinations particularly pointed out in the appended claims. Attached Figure Description

[0029] Figure 1 This is a three-dimensional structural diagram of the data center provided in the embodiments of this application;

[0030] Figure 2 This is a schematic diagram of the internal structure of a data center provided in an embodiment of this application;

[0031] Figure 3 This is a structural schematic diagram of a cabinet provided in an embodiment of this application;

[0032] Figure 4 This is a schematic diagram of the structure of a server system provided in an embodiment of this application;

[0033] Figure 5 This is a schematic diagram of the internal structure of a computing node provided in an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of the internal structure of a switching node provided in an embodiment of this application;

[0035] Figure 7 This is a schematic diagram of the internal structure of a power node provided in an embodiment of this application;

[0036] Figure 8 This is a top view schematic diagram of the internal structure of a power node provided in an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of the internal structure of a battery node provided in an embodiment of this application;

[0038] Figure 10 This is a three-dimensional structural diagram of a server provided in an embodiment of this application;

[0039] Figure 11 This is a rear view of the server provided in the embodiments of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10. Power node area;

[0042] 20. Battery node region;

[0043] 30. Exchange node area;

[0044] 40. Calculate the node region;

[0045] 100. Server;

[0046] 11a, First electron node; 12a, Second electron node;

[0047] 110. Computation node; 111. Housing; 112. Electronic components to be cooled; 113. Cavity; 114. Air outlet; 115. First liquid inlet; 116. Cooling medium; 117. Nozzle;

[0048] 120. Power node; 121. Power frame; 122. Power supply;

[0049] 130. Battery node; 131. Battery frame; 132. Battery;

[0050] 140. Switching node; 141. Switching electronic components;

[0051] 150. Cabinet body; 151. Cabinet door; 152. Cabinet frame;

[0052] 200. Server system;

[0053] 210. Cooling medium distribution device; 211. Condenser; 212. Liquid storage tank; 213. Transfer pump; 214. First input terminal; 215. Second input terminal;

[0054] 220. Liquid cooling heat dissipation device; 221. First cold plate; 222. Second cold plate; 223. Third cold plate; 224. Second liquid inlet; 225. Liquid outlet;

[0055] 230. First pipe; 240. Second pipe; 250. Third pipe; 260. Fourth pipe; 270. Fifth pipe;

[0056] 280. Quick coupling;

[0057] 300, computer room;

[0058] 400. Equipment cabinet;

[0059] 1000, Data Center;

[0060] X, length direction; Y, width direction; Z, height direction. Detailed Implementation

[0061] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0062] To facilitate understanding, the relevant technical terms involved in the embodiments of this application will first be explained and described.

[0063] Liquid cooling: a method that does not rely on any fans or chillers, but relies entirely on liquid to carry heat to the cooling tower for heat dissipation.

[0064] Cold plate: A sealed heat sink that can accommodate liquid flow. It is usually attached to the heat-generating element through a thermally conductive interface material, thereby removing the heat from the heat-generating element.

[0065] Two-phase heat dissipation: The same working fluid changes from liquid to gas, absorbing a large amount of heat. This heat dissipation method utilizes the phase change between gas and liquid.

[0066] A data center is a globally collaborative network of specific devices used to transmit, accelerate, display, compute, and store data information over the Internet infrastructure. This application provides a data center embodiment; see [link to related documentation]. Figure 1 As shown, a data center may include a server room of 300, see [link / reference]. Figure 2 As shown, the computer room 300 is equipped with at least one equipment cabinet 400. The number of equipment cabinets 400 may include, but is not limited to, the three shown in the figure, for example, 50-100 equipment cabinets 400. The computer room 300 is equipped with a cooling system. In this embodiment, the specific structure and working principle of the cooling system in the computer room 300 are not described in detail.

[0067] The equipment cabinet 400 can be a communication cabinet, a power supply cabinet, or a rack server 100, including at least one computing node 110. Alternatively, the equipment cabinet 400 can be a cooling cabinet for dissipating heat from the server 100. Each server 100 can have one cooling cabinet, or multiple servers 100 can share one cooling cabinet. It should be noted that the cooling cabinet can include a frame and a heat dissipation device. The frame houses the heat dissipation device, which dissipates heat from the server 100. The frame can be the server cabinet 150, thus the heat dissipation device can be integrated onto the server 100.

[0068] In related technologies, heat dissipation devices include heat sinks and coolant supply systems. The heat sink comprises a cover and a housing; the cover seals the housing and is detachably connected to it. Furthermore, the server's computing nodes, switches, power supplies, and battery packs, among other heat-generating components, are immersed in a liquid cooling medium within the housing. Therefore, the heat dissipation device uses single-phase liquid cooling to dissipate heat from these components. However, because the heat output of computing nodes, switches, power supplies, and battery packs varies, single-phase liquid cooling is ineffective for components with high heat output, affecting their performance. Additionally, due to the large size of the housing, server maintenance requires specialized equipment to open the cover to replace or repair heat-generating components. For example, replacing a power supply or switch necessitates using a crane or robotic arm to lift the cover. Therefore, limitations imposed by the heat dissipation device result in high maintenance difficulty and costs.

[0069] Figure 3 This is a structural schematic diagram of a cabinet provided in an embodiment of this application.

[0070] In the embodiments of this application, such as Figure 3 As shown, the inner wall of the cabinet 150 of server 100 defines a receiving cavity, which can be divided into multiple areas according to the different functions of the configured nodes, for example... Figure 3As shown, the cavity includes: a power node region 10, a battery node region 20, a computing node region 40, and a switching node region 30. The power node region 10 includes at least one power node 120, which performs power supply and / or voltage conversion functions. It can supply power to the nodes of the server 100 from the power grid and convert the voltage on the power grid to the voltage required by each node. The battery node region 20 includes at least one battery node 130, which performs backup power supply functions. In the event of a power grid failure, the battery node 130 discharges to provide emergency power to the server 100. The switching node region 30 includes at least one switching node 140, which performs network data transmission functions. For example, the switching node 140 connects multiple computing nodes 110, aggregating network data generated by the multiple computing nodes 110 and sending it to a terminal connected to the server. The computing node region 40 includes at least one computing node 110, which meets corresponding usage requirements, such as performing computing functions. Different nodes can be equipped with electronic components of different functions to perform the functions of each node. For example, computing node 110 can be equipped with electronic components such as processors and memory to perform computing functions, while power node 120 can be equipped with power supply 122 to supply power to other components in server 100. Different nodes can also be equipped with heat dissipation devices to reduce the temperature of the electronic components during operation. Furthermore, different heat dissipation devices can be used in different nodes to specifically cool the electronic components in different nodes and improve heat dissipation efficiency.

[0071] In view of this, this application provides a server 100, which includes a cabinet 150, a first electronic node 11a, a second electronic node 12a, and a cooling connection device. The cabinet 150 includes a cavity for accommodating multiple nodes, including the first electronic node 11a and the second electronic node 12a, with different nodes located in different areas. The cooling connection device includes a first pipe 230, a second pipe 240, and a third pipe 250. The first electronic node 11a includes at least one first electronic component and a housing 111. The housing 111 has a cavity 113 for accommodating the first electronic component. The housing 111 has a first liquid inlet 115 and an outlet 114: the first liquid inlet 115 is connected to the first pipe 230, through which liquid cooling medium 116 can be input to the two-phase heat dissipation device; the outlet 114 is connected to the second pipe 240, through which gaseous cooling medium 116 can be output. The second electronic node 12a includes at least one second electronic component and at least one liquid cooling device 220. The liquid cooling device 220 is provided with a second liquid inlet 224 and a liquid outlet 225. The second liquid inlet 224 is connected to a first pipe 230, through which liquid cooling medium 116 can be input into the liquid cooling device 220. The liquid outlet 225 is connected to a third pipe 250, through which liquid cooling medium 116 can be output. With this configuration, the first electronic component can use a two-phase heat dissipation method, and the second electronic component can use a single-phase liquid cooling method. The cooling connection device can provide the same working fluid liquid cooling medium 116 to various areas of the server 100, and the server 100 can provide two heat dissipation methods to meet the different heat dissipation needs of various areas of the server 100, which helps to improve the heat dissipation performance of the server 100.

[0072] It should be noted that the electronic node can be a switching node 140, a battery node 130, a power node 120, a computing node 110, or other nodes in server 100. Furthermore, the node types of the first electronic node 11a and the second electronic node 12a can be the same or different, without specific limitations. For example, in this embodiment, the first electronic node 11a and the second electronic node 12a are of different types. Specifically, the first electronic node 11a can be a computing node 110, and the second electronic node 12a can be any one of the following electronic nodes: switching node 140, battery node 130, or power node 120. Alternatively, there can be multiple second electronic nodes 12a, and each second electronic node 12a can be at least one of the following electronic nodes: switching node 140, battery node 130, or power node 120. For example, some second electronic nodes 12a are switching nodes 140, and some are battery nodes 130.

[0073] The server system 200 provided in this application embodiment will be described in detail below with reference to specific embodiments.

[0074] Figure 4 This is a schematic diagram of the structure of a server system provided in an embodiment of this application.

[0075] This application provides a server system 200, which is referenced in the embodiments of this application. Figure 4 The server system 200 may include a cooling medium distribution device 210 and a server 100. The server 100 includes a first conduit 230, a second conduit 240, a third conduit 250, a power node area 10, a battery node area 20, a switching node area 30, and a computing node area 40. The number of each area can be determined based on the number and location of nodes, and is not specifically limited here. For example, in this embodiment, there are two computing node areas 40, which can be arranged adjacently or spaced apart. The number of nodes in each area can also be determined according to actual conditions, and is not specifically limited here. Figure 4 In this example, each region includes only one node. For instance, power node region 10 includes a power node 120, battery node region 20 includes a battery node 130, computing node region 40 includes a computing node 110, and switching node region 30 includes a switching node 140.

[0076] The cooling medium distribution device 210 can correspond one-to-one with one server 100, or one cooling medium distribution device 210 can correspond to multiple servers 100. The cooling medium distribution device 210 can be integrated with the server 100, for example, the cooling medium distribution device 210 can be hung on the side wall of the cabinet 150 of the server 100, or the cooling medium distribution device 210 can be set up separately from the server 100.

[0077] Specifically, on the one hand, the output end of the cooling medium distribution device 210 can be connected to the second liquid inlet 224 of the power node 120, battery node 130, and switching node 140, and the first liquid inlet 115 of the computing node 110 through the first pipe 230. The air outlet 114 of the computing node 110 is connected to the first input end 214 of the cooling medium distribution device 210 through the second pipe 240, so that the cooling medium distribution device 210 can deliver the same working fluid liquid cooling medium 116 to nodes in multiple regions. On the other hand, the liquid outlet 225 of the power node 120, battery node 130, and switching node 140 is connected to the second input end 215 of the cooling medium distribution device 210 through the third pipe 250, so as to perform single-phase liquid cooling for the power node 120, battery node 130, and switching node 140, and two-phase cooling for the computing node 110.

[0078] It should be noted that power node 120, battery node 130, and switching node 140 can employ single-phase liquid cooling. For specific configuration details, please refer to [link / reference needed]. Figures 6-9 At least one liquid cooling device 220 can be provided in each of the power node 120, battery node 130, and switching node 140. Second liquid inlets 224 are respectively provided on the liquid cooling devices 220 of different nodes. A first pipe 230 is connected to the second liquid inlet 224 in the node; in fact, the first pipe 230 is connected to the second liquid inlet 224 on the liquid cooling device 220 in the node, so that the cooling medium distribution device 210 can input liquid cooling medium 116 into the liquid cooling devices 220 of the power node 120, battery node 130, and switching node 140 respectively to dissipate heat from the electronic components. Similarly, outlets 225 are also respectively provided in the liquid cooling devices 220 of different nodes and are connected to a third pipe 250, so that the liquid cooling devices 220 of the power node 120, battery node 130, and switching node 140 can output liquid cooling medium 116 to the cooling medium distribution device 210 respectively. A two-phase heat dissipation method can be used in the computing node 110, such as... Figure 4 As shown, please refer to the following for specific setup instructions. Figure 5 The computing node 110 is provided with a housing 111. The electronic components of the computing node 110 to be cooled are located in the housing 111. A first liquid inlet 115 is provided on the housing 111 and is connected to a first pipe 230 so that the cooling medium distribution device 210 can input liquid cooling medium 116 into the housing 111 of the computing node 110. Similarly, an air outlet 114 is also provided on the housing 111 and is connected to a second pipe 240 so that the computing node 110 can output gaseous cooling medium 116 to the cooling medium distribution device 210.

[0079] It is understood that the outer casing 111 of the computing node 110 can be provided with multiple first liquid inlets 115, which can be connected to a first pipe 230. Alternatively, the server 100 can also include multiple first pipes 230, which can be connected to a first liquid inlet 115 via quick connectors 280. Or, multiple first liquid inlets 115 and multiple first pipes 230 can be connected via quick connectors 280. In other words, the correspondence between the first liquid inlets 115 and the first pipes 230 can be set according to actual conditions, and this application does not impose any limitations. Similarly, the correspondence between the second liquid inlet 224 and the first pipe 230, the liquid outlet 225 and the third pipe 250, and the air outlet 114 and the second pipe 240 can also be set according to actual conditions, and this application does not impose any limitations. Similarly, in order to improve the connection speed between the liquid cooling heat dissipation device 220 and the first pipe 230 and the third pipe 250, the second liquid inlet 224 and the liquid outlet 225 of the liquid cooling heat dissipation device 220 can be connected to the first pipe 230 and the third pipe 250 respectively through quick connectors 280.

[0080] The cooling medium 116 can be a low-boiling-point, non-conductive liquid, such as a fluorinated liquid. In addition, the atmospheric pressure boiling point of the cooling medium 116 can be 30° to 60°. Of course, the specific type of cooling medium 116 is not specifically limited here.

[0081] Specifically, the cooling medium distribution device 210 may include a condenser 211, a liquid storage tank 212, and a delivery pump 213. The input end of the condenser 211 is connected to the outlet 114 of the computing node 110 via a second pipe 240, and the output end of the condenser 211 is connected to the first inlet end of the liquid storage tank 212. The condenser 211 is used to condense the vaporized cooling medium 116 into a liquid cooling medium 116. The first input end 214 of the cooling medium distribution device 210 is the input end of the condenser 211.

[0082] The liquid storage tank 212 has an output end that connects to the input end of the transfer pump 213. Its second inlet end connects to the outlets 225 of the power node 120, battery node 130, and exchange node 140 via a third pipe 250. The liquid storage tank 212 is used to temporarily store liquid cooling medium 116. The second input end 215 of the cooling medium distribution device 210 is the second inlet end of the liquid storage tank 212.

[0083] The output end of the delivery pump 213 is connected via a first pipe 230 to the first liquid inlet 115 of the power node 120, the battery node 130, the exchange node 140, and the second liquid inlet 224 of the computing node 110, respectively, to deliver the same liquid cooling medium 116 to each area. The output end of the cooling medium distribution device 210 is the output end of the delivery pump 213.

[0084] Therefore, refer to Figure 4 During the heat dissipation process, the delivery pump 213 delivers liquid cooling medium 116 along the first pipe 230 into the power node 120, battery node 130, switching node 140, and computing node 110, respectively. The liquid cooling medium 116 entering the computing node absorbs heat and vaporizes. The gaseous cooling medium 116 then enters the condenser 211 along the second pipe 240. The condenser 211 condenses the gaseous cooling medium 116 into liquid cooling medium 116, which then enters the storage tank 212. The liquid cooling medium 116 entering the power node 120, battery node 130, and switching node 140 absorbs heat and then enters the storage tank 212 along the third pipe 250, thus carrying away the heat generated by the electronic components within these nodes.

[0085] For the server system 200 of this application embodiment, the server system 200 uses the same liquid cooling medium 116 to perform full liquid cooling of the server 100, which can simplify the structural complexity of the server 100 and help reduce costs. In addition, the full liquid cooling method can eliminate components such as server 100 fans, air conditioners in the computer room 300, and chiller units in the computer room 300, which helps improve the energy efficiency of the server system 200. Furthermore, since two-phase heat dissipation and single-phase liquid cooling can coexist, the heat dissipation requirements of different heat-generating components can be met, which helps improve the heat dissipation performance of the server 100.

[0086] It should be noted that, Figure 4 The server 100, comprising power node area 10, battery node area 20, switching node area 30, and compute node area 40, is merely an example. In practical applications, server 100 may include only a portion of these areas, or may include other possible areas. Figure 4The example shown uses liquid cooling for nodes in power node region 10, battery node region 20, and switching node region 30, and two-phase cooling for computing node 110. In practical applications, different cooling methods can be adopted depending on the heat dissipation needs of the electronic components within the nodes. For instance, liquid cooling can be used for nodes in power node region 10 and battery node region 20, while two-phase cooling can be used for switching node region 30 and computing node region 40. Furthermore, different nodes within the same region can also use different cooling devices.

[0087] The following section uses liquid cooling for power node region 10, battery node region 20, and switching node region 30, and two-phase cooling for computing node 110 as examples to introduce the specific structure within each node.

[0088] First, taking a computing node 110 included in the computing node region 40 as an example, the specific structure of the computing node 110 is described. The computing node 110 can use a two-phase heat dissipation method to dissipate heat from the electronic component 112 within the computing node 110. It is understood that since the electronic component 112 is dissipated using a two-phase heat dissipation method, in this embodiment, the electronic component 112 is the first electronic component of the first electronic node 11a. Figure 5 This is a schematic diagram of the internal structure of a computing node provided in an embodiment of this application, as shown below. Figure 5 As shown:

[0089] The computing node 110 includes a housing 111 and an electronic component 112 to be cooled. The housing 111 has a cavity 113 and an air outlet 114 and a first liquid inlet 115 communicating with the cavity 113. The electronic component 112 to be cooled is located in the cavity 113. The air outlet 114 is connected to the first input terminal 214 of the cooling medium distribution device 210 through a second pipe 240, and the first liquid inlet 115 is connected to the output terminal of the cooling medium distribution device 210 through a first pipe 230. In addition, the electronic component 112 to be cooled is located in the cavity 113 and is immersed in the liquid cooling medium 116 within the cavity 113. During the heat dissipation process, the heat generated by the electronic component 112 to be cooled is absorbed by the liquid cooling medium 116, thereby turning the liquid cooling medium 116 into a gaseous cooling medium 116. Subsequently, the vaporized cooling medium 116 enters the cooling medium distribution device 210 from the gas outlet 114, and then the cooling medium distribution device 210 condenses the vaporized cooling medium 116 into a liquid cooling medium 116.

[0090] When electronic components to be cooled are immersed in liquid cooling medium 116, it can be understood that: along the height direction of computing node 110 (e.g., Figure 5In the Z direction, a portion of the electronic components 112 to be cooled is immersed in the cooling medium 116, while another portion of the electronic components 112 to be cooled is located above the liquid surface of the cooling medium 116, or all of the electronic components 112 to be cooled are immersed in the cooling medium 116.

[0091] When a portion of the electronic components 112 to be cooled is immersed in the cooling medium 116, and another portion of the electronic components 112 to be cooled is located above the surface of the cooling medium 116, the amount of cooling medium 116 used for cooling the electronic components 112 to be cooled can be reduced, thereby reducing cooling costs.

[0092] It should be noted that the term "electronic component to be cooled 112" is a general term for all heat-generating devices, which may include circuit boards, resistors, central processing units, graphics processing units, heat sinks, capacitors, power supplies 122, memory, storage devices, etc. Furthermore, the number of each type of heat-generating device can be one or more, without specific limitations.

[0093] In the embodiments of this application, reference is made to Figure 5 The computing node 110 may also include at least one nozzle 117. Each cavity 113 contains at least one nozzle 117, which can be used to spray liquid cooling medium 116 onto the electronic component 112 to be cooled, thereby improving the heat dissipation capacity of the computing node 110. The nozzle 117 can be connected to the output of the cooling medium distribution device 210 through an air outlet 114, allowing the cooling medium distribution device 210 to supply liquid cooling medium 116 to the nozzle 117.

[0094] The nozzle 117 can spray liquid cooling medium 116 onto the electronic component 112 to be cooled, which is located below the surface of the cooling medium 116; or, the nozzle 117 can spray liquid cooling medium 116 onto the electronic component 112 to be cooled, which is located above the surface of the cooling medium 116; or, there can be multiple nozzles 117, which can simultaneously spray liquid cooling medium 116 onto the electronic component 112 to be cooled, which is located both below and above the surface of the liquid.

[0095] When the liquid cooling medium 116 sprayed by the nozzle 117 directly impacts the surface of the electronic component 112 to be cooled, it can improve the single-point heat dissipation capacity of the electronic component 112. In addition, it can also increase the speed at which the gaseous cooling medium 116 leaves the liquid cooling medium 116. Here, the single-point heat dissipation capacity refers to the heat dissipation capacity of the area on the electronic component 112 that cooperates with the nozzle 117, specifically, it refers to the heat-generating devices at different locations in the electronic component 112.

[0096] Because the nozzle 117 can continuously spray liquid cooling medium 116 jets onto the electronic component 112 to be cooled, or the nozzle 117 can spray liquid cooling medium 116 jets onto the electronic component 112 to be cooled at preset intervals, the cooling medium 116 jets impact the surface of the electronic component 112 to be cooled. On the one hand, this allows the gaseous cooling medium 116 formed near the impact point to quickly separate from the liquid cooling medium 116, so that the gaseous cooling medium 116 enters the cooling medium distribution device 210 through the air outlet 114, thus avoiding a decrease in the phase change rate of the liquid cooling medium 116 due to the high ambient temperature near the impact point. On the other hand, the cooling medium 116 jets can increase the replenishment rate of the liquid cooling medium 116 near the impact point, thereby increasing the replacement rate of the liquid cooling medium 116 and improving the single-point heat dissipation capacity of the electronic component 112 to be cooled.

[0097] Therefore, the computing node 110 adopts a two-phase heat dissipation method, which allows the electronic component 112 with high heat generation to be directly immersed in the cooling medium 116. The cooling medium 116 absorbs heat through vaporization, thereby removing most of the heat from the electronic component 112 and improving heat dissipation efficiency.

[0098] The following section uses a switching node 140 within a switching node region 30 as an example to illustrate the specific structure of the switching node 140. The switching node 140 can utilize liquid cooling to dissipate heat from the switching electronic components 141 within it. Figure 6 This is a schematic diagram of the internal structure of a switching node provided in an embodiment of this application, as shown below. Figure 6 As shown.

[0099] The switching node 140 may include a liquid cooling device 220 and a switching electronic component 141 to be cooled. Specifically, the liquid cooling device 220 may include a cold plate assembly for single-phase liquid cooling of the switching node 140. Specifically, the cold plate assembly may include multiple first cold plates 221, which are in contact with the heat-generating devices of the switching electronic component 141. The heat-generating devices exchange heat with the liquid cooling medium 116 within the first cold plate 221 to remove heat from the switching electronic component 141. For example, in this embodiment, the first cold plate 221 is located above the switching electronic component 141 and in contact with the top surfaces of all heat-generating devices in the switching node 140, which helps to improve the heat dissipation speed of the switching electronic component 141.

[0100] The first cold plate 221 has a liquid outlet 225 and a first liquid inlet 115. The second liquid inlet 224 of the first cold plate 221 is connected to the output end of the cooling medium distribution device 210 through a first pipe 230, and the liquid outlet 225 of the first cold plate 221 is connected to the second input end 215 of the cooling medium distribution device 210 through a third pipe 250. Furthermore, each switching electronic component 141 may correspond to at least one first cold plate 221, without specific limitations. For example, in the embodiments of this application, each switching electronic component 141 corresponds to one first cold plate 221, and the first cold plate 221 is in contact with all heat-generating devices of each switching electronic component 141.

[0101] The first cold plate 221 can be securely connected to the switching electronic component 141, for example, by means of snap-fit ​​or threaded connection. Of course, the first cold plate 221 can also be installed on the cabinet 150 of the server 100.

[0102] It is understood that since the switching electronic component 141 is cooled by single-phase liquid cooling through the liquid cooling heat dissipation device 220, the switching node 140 is equivalent to the second electronic node 12a, and the switching electronic component 141 is equivalent to the second electronic component. In addition, the switching electronic component 141 may include a switching chip, so that the switching node 140 can provide high-performance and low-latency switching.

[0103] The following description uses a power node 120 within power node region 10 as an example to illustrate the specific structure of power node 120. Power node 120 can utilize liquid cooling to dissipate heat from its power electronic components. These power electronic components may include a power supply 122. Figure 7 This is a schematic diagram of the internal structure of a power node provided in an embodiment of this application, as shown below. Figure 7 As shown.

[0104] Power node 120 may include a liquid cooling device 220 and a power supply 122 to be cooled. Specifically, the liquid cooling device 220 may include a cold plate assembly for single-phase liquid cooling of the power node 120. Specifically, the cold plate assembly may include multiple second cold plates 222. Similar to the first cold plate 221, the second cold plates 222 can be used for heat exchange with the power supply 122 within the power node 120. The second cold plates 222 contact the heat-generating components within the power supply 122, thereby exchanging heat between the liquid cooling medium 116 within the second cold plates 222 and the heat-generating components. The liquid cooling medium 116 within the second cold plates 222 carries away the heat generated by the power supply 122, thus lowering the temperature of the power node 120.

[0105] The second cold plate 222 has a first liquid inlet 115 and a liquid outlet 225. The second liquid inlet 224 of the second cold plate 222 is connected to the output end of the cooling medium distribution device 210 through the first pipe 230. The liquid outlet 225 of the second cold plate 222 is connected to the second input end 215 of the cooling medium distribution device 210 through the third pipe 250. Thus, the liquid cooling medium 116 can circulate between the second cold plate 222 and the cooling medium distribution device 210, so that the temperature of the power node 120 is always maintained within a predetermined range.

[0106] The power node 120 may include at least one second cold plate 222. The number of second cold plates 222 may be determined according to the number of power supplies 122, and no specific limitation is made here. Figure 8 This is a top view schematic diagram of the internal structure of a power node provided in an embodiment of this application. (Reference) Figure 8 The power node 120 also includes a power frame 121, which contains three power supplies 122. Correspondingly, there are three second cold plates 222, with each power supply 122 corresponding to one second cold plate 222. (See reference...) Figure 7 Each second cold plate 222 is in contact with all the heat-generating components of the power supply 122 corresponding to that second cold plate 222. When viewed from above, since the second cold plate 222 is located above the power supply 122, the power supply 122 is blocked by the second cold plate 222 in the figure and is not marked.

[0107] Optionally, when there are multiple second cold plates 222, refer to Figure 8 The server 100 also includes a fourth pipe 260 and a fifth pipe 270. The second liquid inlets 224 of all the second cold plates 222 are connected to the first pipe 230 through the fourth pipe 260, so that the cooling medium distribution device 210 delivers liquid cooling medium 116 to all the second cold plates 222. The liquid outlets 225 of all the second cold plates 222 are connected to the third pipe 250 through the fifth pipe 270, so that the liquid cooling medium 116 in all the second cold plates 222 can enter the cooling medium distribution device 210.

[0108] To improve the connection speed between the second cold plate 222 and the fourth pipe 260 and the fifth pipe 270, refer to Figure 7 and Figure 8 The server 100 also includes a quick connector 280, through which the first liquid inlet 115 and the liquid outlet 225 of the second cold plate 222 can be connected to the fourth pipe 260 and the fifth pipe 270. For example, the quick connector 280 includes a first connector and a second connector, the first connector being connected to the liquid outlet 225 or the first liquid inlet 115 of the second cold plate 222, and the second connector being connected to the fourth pipe 260 or the fifth pipe 270.

[0109] Optionally, refer to Figure 8 Multiple power supplies 122 are detachably connected to the power supply frame 121, and each power supply 122 corresponds to a second cold plate 222, and the second cold plate 222 is in contact with all the heat-generating components of the power supply 122.

[0110] Additionally, the fourth conduit 260 and the fifth conduit 270 can also be mounted on the power supply frame 121 to improve the compactness of the power supply node 120.

[0111] The following section uses a battery node region 20, which includes a battery node 130, as an example to illustrate the specific structure of battery node 130. Battery node 130 can utilize liquid cooling to dissipate heat from the battery electronic components within it. The battery electronic components include a battery 132. Figure 9 This is a schematic diagram of the internal structure of a battery node provided in an embodiment of this application, as shown below. Figure 9 As shown.

[0112] Battery node 130 may include a liquid cooling device 220 and a battery 132 to be cooled. Specifically, the liquid cooling device 220 may include a cold plate assembly for single-phase liquid cooling of the battery node 130. Specifically, the cold plate assembly may include multiple third cold plates 223. Similar to the first cold plate 221, the third cold plates 223 can be used for single-phase liquid cooling of the battery 132 within the battery node 130. The liquid cooling medium 116 within the third cold plate 223 exchanges heat with the battery 132, carrying away the heat generated by the battery 132 and maintaining the temperature of the battery 132 within a predetermined range.

[0113] The third cold plate 223 has a liquid outlet 225 and a second liquid inlet 224. The second liquid inlet 224 of the third cold plate 223 is connected to the output end of the cooling medium distribution device 210 through the first pipe 230, and the liquid outlet 225 of the third cold plate 223 is connected to the second input end 215 of the cooling medium distribution device 210 through the third pipe 250.

[0114] The battery node 130 includes at least one third cold plate 223. For example, in this embodiment, the battery node 130 includes a third cold plate 223, which is in contact with all the heat-generating parts of the battery 132.

[0115] Among them, reference Figure 9 The battery node 130 may include a battery frame 131 and a plurality of batteries 132. The plurality of batteries 132 are located within the battery frame 131 and are in contact with a third cold plate 223, thereby the third cold plate 223 exchanges heat with all the batteries 132.

[0116] It should be noted that multiple batteries 132 may correspond to one or more third cold plates 223. For example, in the embodiments of this application, refer to Figure 9 Multiple batteries 132 correspond to a third cold plate 223, which is located above the multiple batteries 132 and in contact with the heating surfaces of all batteries 132.

[0117] Understandably, because server 100 contains battery node 130 and power node 120, data centers can flexibly deploy server 100 in data centers without the need for additional voltage conversion and uninterruptible power supply 122 backup power configuration.

[0118] For nodes that use liquid cooling, on the one hand, single-phase liquid cooling can be performed, and on the other hand, the electronic components inside the node can be prevented from directly contacting the liquid cooling medium 116, which helps to reduce the maintenance difficulty of the server 100. For example, maintenance personnel can directly manually remove or plug in the power supply 122 in the power node 120.

[0119] Figure 10 This is a three-dimensional structural diagram of a server provided in an embodiment of this application. Figure 11 This is a rear view of the server provided in the embodiments of this application.

[0120] Among some possible implementations, refer to Figure 10 The server 100 also includes at least one cabinet 150, which has a receiving cavity for accommodating compute nodes 110, power nodes 120, battery nodes 130, and switching nodes 140. Additionally, the cabinet 150 may include a cabinet body 152 and cabinet doors 151. The number of cabinet doors 151 can be one, or two, and the two cabinet doors 151 can be arranged opposite each other. For example, one cabinet door 151 can be located at the front of the cabinet 150 (e.g.,...). Figure 10 As shown), another cabinet door 151 can be located at the rear of the cabinet body 150. It should be noted that in some examples, the cabinet body 150 may not have a cabinet door 151. For example, the front and back of the cabinet body 150 may be open structures, or the front, back, left and right sides of the cabinet body 150 may all be open structures.

[0121] The inner wall of the cavity is provided with a support structure for supporting the battery node 130, power node 120, switching node 140 and computing node 110. For example, along the height direction of the cabinet 150, multiple support plates are provided at intervals on the side wall of the cabinet 150, or multiple support rings are provided at intervals on the side wall of the cabinet 150.

[0122] In this embodiment, the shape and structure of the cabinet 150 are not specifically limited. Furthermore, the shape of the cabinet 150 can be determined based on the shape of the computation node 110. For example, the shape of the cabinet 150 can be a cuboid (see reference). Figure 10 This reduces the size of a single server system 200, allowing multiple server systems 200 to be installed within the server room 300. Additionally, it is understood that the inner wall of the cabinet 150 defines a cavity to accommodate multiple computing nodes 110 and a cooling medium distribution device 210. Furthermore, the cabinet 150 is provided with a support structure (not shown in the figure) to support the computing nodes 110. For example, along the height direction of the cabinet 150, multiple support plates are spaced apart on the side walls of the cabinet 150, or multiple support rings are spaced apart on the side walls of the cabinet 150.

[0123] It is understood that the cavity contains at least one power node region 10, at least one battery node region 20, at least one switching node region 30, and at least one computing node region 40, for example, Figure 3 As shown in this embodiment, along the height direction of the cabinet 150, from top to bottom, there are a power node area 10, a battery node area 20, a computing node area 40, a switching node area 30, and another computing node area 40. Furthermore, the power node area 10 includes at least one power node 120, the battery node area 20 includes at least one battery node 130, the switching node area 30 includes at least one switching node 140, and the computing node area 40 includes at least one computing node 110. For example, in this embodiment, as... Figure 10 As shown, each power node region 10 includes a power node 120, each battery node region 20 includes a battery node 130, each computing node region 40 includes multiple computing nodes 110, and each switching node region 30 includes a switching node 140.

[0124] It should be noted that each cooling medium distribution device 210 may correspond to at least one cabinet 150. For example, each cabinet 150 may correspond to one cooling medium distribution device 210, or each cooling medium distribution device 210 may correspond to two or three cabinets 150.

[0125] In this embodiment, the cooling connection device includes a first pipe 230, a second pipe 240, and a third pipe 250, all of which can be installed on the cabinet 150. For example, the first pipe 230, the second pipe 240, and the third pipe 250 can all be installed on the side wall of the cabinet 150. The side wall of the cabinet 150 can be the rear wall, front wall, left side wall, or right side wall; no specific limitation is made here. When the first pipe 230, the second pipe 240, and the third pipe 250 are located on the rear wall of the cabinet 150, it helps to reduce the size of the cabinet 150.

[0126] by Figure 10 For example, in this embodiment of the application, when the accommodating cavity is arranged from top to bottom along the height direction of the cabinet 150 as follows: power node area 10, battery node area 20, computing node area 40, switching node area 30, and computing node area 40, refer to... Figure 11 The length of the first pipe 230 is greater than the length of the second pipe 240, and the length of the second pipe 240 is greater than the length of the third pipe 250. This arrangement can reduce the cost of the pipes.

[0127] In some possible implementations, the inner diameters of the first pipe 230, the second pipe 240, and the third pipe 250 can be different from each other, for example, referring to... Figure 11 The inner diameter of the second pipe 240 is larger than that of the first pipe 230, and the inner diameter of the first pipe 230 is larger than that of the third pipe 250. This arrangement can reduce the cost of the first pipe 230, the second pipe 240, and the third pipe 250.

[0128] It is understandable that the inner diameters of the first pipe 230, the second pipe 240, and the third pipe 250 can all be the same, and no specific restrictions are imposed here.

[0129] In some possible implementations, the cooling connection device may further include multiple liquid inlet pipes, multiple air outlet pipes, and multiple liquid outlet pipes (not shown in the figure). Some liquid inlet pipes connect the first liquid inlet 115 of the computing node 110 to the first pipe 230, and some liquid inlet pipes connect the second liquid inlet 224 of the liquid cooling device 220 to the first pipe 230. Air outlet pipes connect the air outlet 114 of the computing node 110 to the second pipe 240. Liquid outlet pipes connect the liquid outlet 225 of the liquid cooling device 220 to the third pipe 250.

[0130] In some possible implementations, the quick connector 280 includes at least one first connector and at least one second connector that mates with the first connector. The first connector is used to communicate with a first liquid inlet 115, an air outlet 114, a second liquid inlet 224, or a liquid outlet 225, and the second connector is used to communicate with a first conduit 230, a second conduit 240, or a third conduit 250. Alternatively, the first connector is used to communicate with the first conduit 230, the second conduit 240, or the third conduit 250, and the second connector is used to communicate with the first liquid inlet 115, the air outlet 114, the second liquid inlet 224, or the liquid outlet 225.

[0131] It is understood that the server system 200 provided in this application embodiment can be set up in the computer room 300 of the data center. Of course, in some examples, the server system 200 provided in this application embodiment can also be set up separately.

[0132] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0133] The devices or elements referred to in this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0134] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0135] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A server, characterized in that, include: Cabinet, first electronic node, second electronic node, and cooling connection device; The cabinet includes a receiving cavity for accommodating the first electronic node and the second electronic node; The cooling connection device includes a first pipe, a second pipe, and a third pipe; The first electronic node includes at least one first electronic component and a housing. The housing has a cavity for accommodating the first electronic component. The housing is provided with a first liquid inlet and a gas outlet communicating with the cavity. The first liquid inlet is connected to a first pipe, and the gas outlet is connected to a second pipe. Liquid cooling medium enters the housing through the first pipe, absorbs heat from the first electronic component, and then becomes gaseous. The gaseous cooling medium flows out of the housing through the second pipe. At least one nozzle is provided inside the housing. The nozzle is connected to the first liquid inlet and is located above the surface of the liquid cooling medium. The nozzle is used to spray the liquid cooling medium onto the first electronic component so that the cooling medium jet impacts the surface of the first electronic component. The second electronic node includes at least one second electronic component and at least one liquid cooling device, wherein the liquid cooling device is provided with a second liquid inlet and a liquid outlet; wherein the second liquid inlet is connected to the first pipe and the liquid outlet is connected to the third pipe; the liquid cooling medium enters the liquid cooling device through the first pipe, absorbs the heat of the second electronic component, and then flows out of the liquid cooling device through the third pipe. The cooling medium flowing through the first electronic node and the second electronic node is the same working fluid. The inner diameter of the first pipe is larger than the inner diameter of the second pipe, and the inner diameter of the second pipe is larger than the inner diameter of the third pipe.

2. The server according to claim 1, characterized in that, The first electronic node is a computing node, which is used to perform computing functions. The first electronic component includes a processor and a memory.

3. The server according to claim 1 or 2, characterized in that, The second electronic node includes a switching node for performing network data transmission functions, and the second electronic component includes a switching chip.

4. The server according to claim 1 or 2, characterized in that, The second electronic node includes a power node for performing power supply and / or voltage conversion functions, and the second electronic component includes a power source.

5. The server according to claim 1 or 2, characterized in that, At least one of the second electronic nodes includes a battery node for performing a backup power function, and the second electronic component includes a battery.

6. The server according to claim 1 or 2, characterized in that, The liquid cooling heat dissipation device is a cold plate assembly, which includes at least one cold plate. The cold plate has a sealed cavity for containing liquid cooling medium, and the cold plate is provided with a second liquid inlet and a liquid outlet communicating with the sealed cavity.

7. The server according to claim 6, characterized in that, The cold plate is located above the second electronic component.

8. The server according to any one of claims 1, 2, and 7, characterized in that, Also includes: Quick connectors; The first liquid inlet and the air outlet of the outer casing are respectively connected to the first pipe and the second pipe through the quick connector; The second inlet and the outlet of the liquid cooling heat dissipation device are both connected to the first pipe and the third pipe respectively through the quick connector.

9. The server according to claim 8, characterized in that, The quick connector includes at least one first connector and at least one second connector that mates with the first connector; The first connector is used to communicate with the first liquid inlet, the air outlet, the second liquid inlet, or the liquid outlet; the second connector is used to communicate with the first pipe, the second pipe, or the third pipe; or... The first connector is used to communicate with the first pipe, the second pipe or the third pipe, and the second connector is used to communicate with the first liquid inlet, the air outlet, the second liquid inlet or the liquid outlet.

10. The server according to any one of claims 1, 2, 7, and 8, characterized in that, The first pipe, the second pipe, and the third pipe are all installed on the rear wall of the cabinet.

11. A server system, characterized in that, include: Cooling medium distribution device and server as described in any one of claims 1-10; The first input end of the cooling medium distribution device is connected to the air outlet of the server through the second pipe of the server, the second input end of the cooling medium distribution device is connected to the liquid outlet of the server through the third pipe of the server, and the output end of the cooling medium distribution device is connected to the first liquid inlet and the second liquid inlet of the server through the first pipe of the server. The cooling medium distribution device is used to deliver the same liquid cooling medium to the server's cavity and liquid cooling heat dissipation device. The cooling medium distribution device is also used to reduce the temperature of the liquid cooling medium that enters the cooling medium distribution device through the third pipe; The cooling medium distribution device is also used to condense the gaseous cooling medium that enters the cooling medium distribution device through the second pipe into a liquid cooling medium.

12. The server system according to claim 11, characterized in that, The cooling medium distribution device includes a condenser, a storage tank, and a delivery pump; The input end of the condenser is connected to the air outlet of the server through the second pipe, and the output end of the condenser is connected to the first inlet end of the liquid storage tank. The output end of the storage tank is connected to the input end of the delivery pump, and the second inlet end of the storage tank is connected to the outlet of the server through the third pipe. The output end of the delivery pump is connected to the first liquid inlet and the second liquid inlet of the server through the first pipe.

13. The server system according to claim 11 or 12, characterized in that, The cooling medium distribution device is installed on the side wall of the server cabinet.

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