Method for manufacturing a resin molded product

Abstract

An object of the present application is to provide a molding die maintenance member which can automatically supply a molding die with a molding die maintenance member, and which can inhibit or prevent a molding die maintenance resin from remaining on the molding die maintenance member. To achieve the object, a molding die maintenance member (10) of the present application is characterized by having a support body (11) and a molding die maintenance resin (12) disposed on at least one face of the support body (11).

Description

Technical Field

[0001] This invention relates to a mold maintenance component, a resin molding apparatus, and a method for manufacturing resin molded articles. Background Technology

[0002] Resin molding technology is widely used in electronic components such as resin-sealed (resin-molded) ICs and semiconductor chips (hereinafter sometimes simply referred to as "chips"). More specifically, for example, by resin-sealing a chip, the chip can become a resin-sealed electronic component (also called a finished electronic component, or package, etc. hereinafter sometimes simply referred to as "electronic component").

[0003] The maintenance component for the molding die used in the resin molding apparatus is, for example, the cleaning component described in Patent Documents 1 and 2.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-301928

[0007] Patent Document 2: Japanese Patent Application Publication No. 2009-018431 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] Patent Document 1 does not describe automatic delivery of the cleaning component when supplying it to the molding die. That is, the cleaning component is supplied to the molding die manually. Therefore, the cleaning component must be supplied to the molding die with the interior of the resin molding apparatus open and exposed to the outside air. However, even in spaces where air cleanliness can be guaranteed, such as cleanrooms or clean booths, there is still a risk of contaminants contaminating the interior of the resin molding apparatus.

[0010] Patent Document 2 describes an automatic supply of a cleaning substrate and a cleaning resin to a molding die. However, after molding with the cleaning resin, the cleaning resin may adhere to and remain on the molding die, making it difficult to remove. Furthermore, when a release resin is used instead of the cleaning resin as the mold maintenance resin, the same possibility arises where the release resin adheres to the molding die and is difficult to remove.

[0011] Therefore, the object of the present invention is to provide a molding mold maintenance component that can automatically supply molding mold maintenance components to the molding mold and can suppress or prevent molding mold maintenance resin residue in the molding mold, a resin molding apparatus, and a method for manufacturing a resin molded article.

[0012] Problem Solution

[0013] To achieve this objective, the mold maintenance component of the present invention is characterized by:

[0014] It has a support body and a molding mold maintenance resin.

[0015] The molding mold maintenance resin is disposed on at least one surface of the support.

[0016] The resin molding apparatus of the present invention is characterized by having a molding die for resin molding and a transport mechanism for transporting the molding die maintenance component of the present invention to the molding die.

[0017] The method for manufacturing resin molded articles of the present invention is a method for manufacturing resin molded articles using a molding die.

[0018] Its features include

[0019] The molding die maintenance process involves supplying the molding die maintenance component of the present invention to the molding die to perform maintenance on the molding die;

[0020] In the resin molding process, after the mold maintenance process, the resin molding object and resin material are supplied to the mold to perform resin molding.

[0021] The effects of the invention

[0022] The present invention provides a molding mold maintenance component that can automatically supply molding mold maintenance components to the molding mold and suppress or prevent molding mold maintenance resin residue in the molding mold, a resin molding apparatus, and a method for manufacturing resin molded articles. Attached Figure Description

[0023] [ Figure 1 ] Figure 1 This is a cross-sectional view showing an example of the configuration of the molding die maintenance component of the present invention.

[0024] [ Figure 2 ] Figure 2 This is a cross-sectional view showing another example of the configuration of the molding die maintenance component of the present invention.

[0025] [ Figure 3 ] Figure 3 This is a cross-sectional view showing another example of the configuration of the molding die maintenance component of the present invention.

[0026] [ Figure 4 ] Figure 4 (a) to (d) are cross-sectional views showing an example of the shape of the concave portion in the roughened surface of the support body in the molding mold maintenance component of the present invention.

[0027] [ Figure 5 ] Figure 5This is a flowchart illustrating an example of a method for manufacturing a resin molded article according to the present invention.

[0028] [ Figure 6 ] Figure 6 This is a plan view showing an example of the overall structure of the resin molding apparatus of the present invention. Detailed Implementation

[0029] Next, the invention will be described in detail with examples. However, the invention is not limited to the following description.

[0030] In the mold maintenance component of the present invention, for example, the support body may be a support body that has undergone a bonding strength enhancement treatment to improve the bonding strength to the mold maintenance resin. The bonding strength enhancement treatment may, for example, be a roughening treatment that roughens the surface of the mold maintenance resin. The roughening treatment may, for example, be a treatment that forms a recess on the mold maintenance resin surface of the support body. Alternatively, the bonding strength enhancement treatment may, for example, be an adhesive layer forming treatment that forms an adhesive layer on the mold maintenance resin surface of the support body.

[0031] The mold maintenance component of the present invention may further have an adhesive layer, through which the mold maintenance resin is bonded to at least one side of the support.

[0032] The molding die maintenance component of the present invention may, for example, roughen at least one surface of the support and place molding die maintenance resin on the roughened surface.

[0033] In the molding die maintenance component of the present invention, for example, the roughened surface can be a surface roughened by forming a recess. Furthermore, for example, inside the recess, there may be a portion larger than the diameter of the opening of the recess.

[0034] In the mold maintenance component of the present invention, for example, the mold maintenance resin may be a cleaning resin.

[0035] In the mold maintenance component of the present invention, for example, the mold maintenance resin may be a release resin.

[0036] The method for manufacturing the resin molded article of the present invention may, for example, be as follows: in the molding mold maintenance process, the molding mold maintenance component of the present invention, in which the molding mold maintenance resin is a cleaning resin, is supplied to the molding mold to clean the molding mold; then, the molding mold maintenance component of the present invention, in which the molding mold maintenance resin is a release property restoration resin, is supplied to the molding mold to restore the release property of the molding mold.

[0037] The method for manufacturing the resin molded article of the present invention may, for example, involve supplying the mold maintenance component of the present invention, in which the mold maintenance resin is a cleaning resin, to the mold to clean the mold, and then, if the cleaning resin becomes dirty, supplying the mold maintenance component of the present invention, in which the mold maintenance resin is a cleaning resin, to the mold again to clean the mold, and if the cleaning resin does not become dirty, supplying the mold maintenance component of the present invention, in which the mold maintenance resin is a release property restoration resin, to the mold to restore the release property of the mold, or performing the resin molding process.

[0038] In this invention, "on the surface" can be configured to be in direct contact with the surface, or it can be configured via other components instead of directly contacting the surface. For example, in the molding die maintenance component of this invention, the state in which the molding die maintenance resin is disposed on the surface of the support can be either in a state where the molding die maintenance resin is in direct contact with the surface of the support, or in a state where the molding die maintenance resin is not in direct contact with the surface of the support, but is configured via other components. There are no particular limitations on the state in which the molding die maintenance resin is not in direct contact with the surface of the support, but is configured via other components; for example, the molding die maintenance resin can be bonded to the surface of the support by an adhesive layer.

[0039] In this invention, there are no special restrictions on the molding mold; for example, it can be a metal mold or a ceramic mold.

[0040] In this invention, there are no special limitations on the resin-molded article; for example, it can be an electronic component with a chip resin-sealed. Furthermore, generally speaking, "electronic component" sometimes refers to the chip before resin sealing and sometimes to the state after resin sealing. However, in this invention, the chip is also called an "electronic element," and "electronic component" refers to an electronic component (as a finished product) with the chip resin-sealed. In this invention, "chip" and "electronic element" have the same meaning. In this invention, "chip" or "electronic element" refers to the chip before resin sealing. Specifically, examples include ICs, semiconductor chips, semiconductor elements for controlling electrical power, resistive elements, capacitor elements, etc. Additionally, "semiconductor element" refers, for example, to a circuit element made from semiconductors as raw materials. In this invention, for convenience, the chip before resin sealing is referred to as a "chip" or "electronic element" to distinguish it from the resin-sealed electronic component. However, in this invention, "chip" or "electronic element" can refer to the chip before resin sealing without special limitations, and it does not necessarily have to be in chip form.

[0041] In this invention, there are no special limitations on the resin material before molding and the resin after molding. For example, it can be a thermosetting resin such as epoxy resin or silicone resin, or a thermoplastic resin. Alternatively, it can be a composite material containing a portion of thermosetting or thermoplastic resin. In this invention, the form of the resin material before molding can include, for example, powdered resin (including granular resin), liquid resin, sheet resin, plate resin, etc. Furthermore, in this invention, liquid resin can be liquid at room temperature, or it includes molten resin that becomes liquid after heating and melting. The form of the resin is only required to be able to be supplied to the cavity or container of the molding mold, or it can be other forms.

[0042] In the method for manufacturing resin molded articles of the present invention, there are no special limitations on the resin molding method, such as compression molding, transfer molding, injection molding, etc.

[0043] The following description, based on the accompanying drawings, illustrates specific embodiments of the present invention. For ease of explanation, the drawings have been appropriately omitted or exaggerated in their schematic description.

[0044] Example

[0045] In this embodiment, examples of the molding mold maintenance component, resin molding apparatus, and method for manufacturing resin molded articles of the present invention will be described.

[0046] [1. Components for mold maintenance]

[0047] Figure 1 The cross-sectional view shows an example of the molding die maintenance component of the present invention. As shown, in this molding die maintenance component 10, molding die maintenance resin 12 is disposed on both surfaces of a plate-shaped support 11. In this figure, the molding die maintenance resin 12 is in direct contact with both surfaces of the support 11.

[0048] There are no special restrictions on the material of the support body 11; for example, a material that is not easily degraded by heat during mold maintenance is preferred. The material of the support body 11 can be, for example, metal, glass, silicon, glass epoxy, resin, ceramic, etc. There are no special restrictions on metals; for example, it can be copper. Glass epoxy is an epoxy board containing glass fibers; for example, it can be the same as the glass epoxy board used for printed circuit boards. There are no special restrictions on resin materials; for example, it can be an epoxy board, etc.

[0049] The shape of the support body 11 is not particularly limited; for example, it can be a shape corresponding to the shape of the mold cavity of the molding die. The shape of the support body 11 can be, for example, as shown in a plan view (in... Figure 1The shape of the support 11 (when viewed from the top or bottom of the paper) is circular, rectangular, etc. Furthermore, the shape of the support 11 is not limited to a plate shape; it can be a block shape, etc., but from the viewpoints of ease of use, cost, and productivity, a plate shape as in this embodiment is preferred. The thickness of the support 11 is not particularly limited; for example, it can be appropriately set considering factors such as the strength and cost of the support 11.

[0050] There are no special limitations on the resin 12 used for mold maintenance; for example, it can be a cleaning resin or a resin for restoring mold release properties. Furthermore, there are no special limitations on the thickness, shape, etc., of the resin 12 used for mold maintenance; for example, it can be appropriately set according to the thickness and shape of the mold cavity.

[0051] In this invention, there are no particular limitations on the cleaning resin; for example, conventional molding cleaning resins can be used. The cleaning resin can be, for example, melamine resin. Melamine resin may include, for example, melamine-formaldehyde resin. Only one type of cleaning resin may be used, or multiple types may be used together. Furthermore, the cleaning resin may be commercially available or homemade. When homemade, it may be manufactured, for example, using the same method as described in the embodiment of WO2005 / 115713A1, or the same method as the method for manufacturing sheet mold cleaning materials using the cleaning resin composition, or referring to therein. The method for manufacturing melamine resin or melamine-formaldehyde resin may be, for example, the same as the release property recovery resin described later.

[0052] There are no special restrictions on the color of the cleaning resin; for example, white or a light color similar to white, such as gray, is preferred. Therefore, after cleaning the molding mold, the residue (such as dirt) that has been removed from the molding mold and adhered to the cleaning resin can be easily and visually identified, making it easy to assess the surface condition of the molding mold cavity (cleanliness, dirt condition, etc.).

[0053] In this invention, there are no particular limitations on the release resin used for mold release recovery; for example, conventional release resins can be used. The release resin can be commercially available or homemade. Furthermore, only one type of release resin can be used, or multiple types can be used together. In this invention, the release resin can be, for example, the same as that described in WO2005 / 115713A1 for mold release recovery components, or a suitable selection can be made with reference to it.

[0054] In this invention, there are no particular limitations on the resin used for mold release and recovery; for example, it can be a thermosetting resin such as melamine resin, epoxy resin, or phenolic resin. Among these, melamine resin is preferred from the perspective of curability. Melamine resin is, for example, a resin obtained by hydroxymethylating melamine or other triazine compounds with formaldehyde, such as melamine-formaldehyde resin. Melamine-formaldehyde resin is prepared, for example, in an aqueous solution. Specifically, for example, the aqueous solution is dried using a spray drying method to obtain a powder, a slurry is added to the aqueous solution and then dried to obtain granules, and the powder or granules are pressed into sheets to obtain plates. Alternatively, an aqueous solution of melamine-formaldehyde resin can be immersed in a sheet substrate and dried to obtain a sheet. The sheet can be obtained, for example, by pressing the powder or granules into sheets using a tablet press. When immersing in a substrate, simply passing the substrate through the aqueous solution of melamine-formaldehyde resin and then drying it is sufficient to manufacture sheet resin. The resin impregnation rate into the substrate can be achieved by changing the type of substrate, adjusting the resin concentration, or regulating the shrinkage of the impregnated resin. Alternatively, the impregnation rate can be adjusted by regulating the curing properties or flowability of the resin. Furthermore, in this invention, the resin for restoring mold release properties can be, for example, a resin containing a release agent. There are no particular limitations on the release agent; it can be the same as conventional release agents. Examples of release agents include long-chain fatty acids such as stearic acid and benzyl acid; metal salts of long-chain fatty acids such as zinc stearate and calcium stearate; ester waxes such as palm wax, lignite wax, and partially saponified esters of lignite acid; long-chain fatty acid amides such as stearyl ethylenediamide; and paraffin waxes such as polyethylene wax. The content of these release agents is not particularly limited and can be, for example, about 0.5 to 20 parts by weight, or about 1 to 5 parts by weight, relative to 100 parts by weight of the resin (e.g., the aforementioned thermosetting resin). To improve the efficiency of mold release recovery operations, it is preferable that the amount of mold release agent is not too small. From the perspective of suppressing or preventing defects in the appearance of resin molded articles, it is preferable that the amount of mold release agent is not too large. In this invention, there are no particular limitations on the manufacturing method of the mold release recovery resin; for example, the thermosetting resin, the mold release agent, and other additives as needed (e.g., lubricants, mineral powders, curing catalysts, etc.) can be used in combination. This combination can be uniformly mixed, for example, using a kneader, belt mixer, Henschel mixer, ball mill, etc. Alternatively, for example, a mold release agent can be added to an aqueous solution of a melamine resin to manufacture the mold release recovery resin.

[0055] In the mold maintenance component of the present invention, for example as described above, the support body may be a support body that has undergone a bonding strength enhancement treatment to improve the bonding strength to the mold maintenance resin. For example, as described above, the bonding strength enhancement treatment may be a roughening treatment that roughens the surface of the mold maintenance resin, or it may be an adhesive layer forming treatment, for example, forming an adhesive layer on the surface of the mold maintenance resin on the support body. Through the aforementioned bonding strength enhancement treatment, it becomes more difficult to peel the mold maintenance component from the support body, and it is further possible to suppress or prevent the mold maintenance resin from remaining in the mold. There are no particular limitations on the support body and the mold maintenance component that have undergone this bonding strength enhancement treatment; examples will be described later. Figure 2 and 3 The example shown.

[0056] Figure 2 The cross-sectional view shows another example of the molding die maintenance component of the present invention. As shown, this molding die maintenance component 10, except that both sides of the plate-shaped support 11 are roughened surfaces 11a, is similar to... Figure 1 The mold maintenance component 10 is the same. Figure 2 In this process, the molding mold maintenance resin 12 is in direct contact with the roughened surface 11a of the support 11. The method of roughening the surface of the support 11 and the state of the roughened surface 11a will be explained in detail with examples later.

[0057] Figure 3 The cross-sectional view shows another example of the mold maintenance component of the present invention. As shown, the mold maintenance component 10 has an adhesive layer 13 through which the mold maintenance resin 12 is bonded to both sides of the support 11. In addition, Figure 3 Mold maintenance component 10 and Figure 1 The mold maintenance component 10 is the same.

[0058] The material of the adhesive layer 13 is not particularly limited, and can be formed from conventional adhesives, for example. Preferably, the material of the adhesive layer 13 is one that has sufficient adhesive strength to bond the support 11 and the molding mold maintenance resin 12. Furthermore, materials whose adhesive strength is not easily reduced by heat from the molding mold are preferred. Specifically, the material of the adhesive layer 13 can be an epoxy thermosetting resin, etc. The thickness of the adhesive layer 13 is not particularly limited, and can be appropriately set considering factors such as adhesive strength and cost. Additionally, in Figure 3 In, for example, the surface of support 11 can be with Figure 2 The same roughened surface 11a, on which the adhesive layer 13 is stacked.

[0059] exist Figure 2In this process, there are no particular limitations on the roughening treatment method used to roughen the surface of the support 11 to form a roughened surface 11a; for example, conventional roughening treatment methods can be appropriately used. The roughening treatment method can be appropriately selected based on the material of the support 11. Examples of surface roughening treatment methods for the support 11 include sandblasting, wet etching, dry etching, plasma treatment, treatment with a roughening agent, grinding, and film formation treatment by electroplating. In sandblasting, for example, an abrasive can be sprayed onto the support 11 to roughen its surface. In wet etching, for example, the support 11 can be roughened by immersing it in an etching solution. There are no particular limitations on the etching solution; for example, it can be appropriately selected based on the material of the support 11 (e.g., the aforementioned metal, glass, semiconductor, etc.). For example, when the support 11 is a silicon wafer, anisotropic etching using an alkaline aqueous solution as the etching solution can be used to form a textured surface on the silicon wafer, thus roughening it. In dry etching, for example, plasma can be irradiated onto the support 11 in a vacuum apparatus to etch, thereby roughening the surface of the support 11. Furthermore, in both wet and dry etching, etching masks (e.g., photoresist masks, metal masks, etc.) can be used, or not. In plasma processing, the support 11 can be roughened by plasma treatment, such as irradiating the support 11 with plasma under atmospheric pressure. In treatment with a roughening agent, the surface of the support 11 can be chemically roughened, for example, by coating the surface of the support 11 with a roughening agent. In grinding, for example, grinding with a grinding machine or the like can physically roughen the surface of the support 11. In a film formation process such as electroplating, a roughening layer (film) can be formed on the surface of the support 11 by electroplating, thereby roughening the surface of the support 11.

[0060] The surface shape of the roughened surface 11a of the support 11 is not particularly limited; for example, as described above, it can be roughened by forming a recess. The shape of the recess is not particularly limited; for example, it can be a groove or a hole. In addition, as described above, there can be a portion inside the recess that is larger than the diameter of the recess opening.

[0061] The following example illustrates surface roughening using an etching mask to form recesses. First, a mask with a pattern for forming recesses (e.g., grooves or holes) is placed on the upper surface of a support 11 formed of silicon or the like. There are no particular limitations on the mask; for example, as described above, a photoresist mask, a metal mask, etc., can be used. Next, the support 11 on which the mask is placed is etched. For example, dry etching can be used for etching. Here, the etching conditions can be, for example, an inverted trapezoidal (inverted conical) shape, such that, viewed in cross-section, there is a portion on the inner wall of the recess (groove or hole) that is larger than the diameter of the opening of the recess. Furthermore, there are no particular limitations on the method for controlling the recess shape; for example, a suitable recess shape can be controlled using known methods. Specifically, for example, the recess shape can be controlled by controlling the etching conditions. For example, in "Micro-machining using dry etching" (published by Hitachi, Ltd.), pages 592-597 of DENKIKAGAKU 50, No.7 (1982), it is described that by controlling the conditions of dry etching, the cross-sectional shape of the etched recess can be freely controlled to be a vertical groove, a trapezoid (cone), or an inverted trapezoid (inverted cone). The method for achieving this control is described, for example, by controlling the ratio of anisotropic etching to isotropic etching to create the desired cross-sectional shape.

[0062] Figure 4 The cross-sectional views (a) to (d) show respectively Figure 2 An example of the shape of the roughened surface 11a in the support body 11. Figure 4 (a) to (d) are all longitudinal cross-sectional views of surface 11a of support 11 (and) Figure 2 (Cross-section view viewed from the same direction). Figure 4 Examples (a) to (d) are all examples of roughening the surface by forming recesses 11b on the surface of the support 11, but the shapes of the recesses 11b are different. Figure 4 (a) is an example where the concave part 11b is an inverted trapezoid (inverted cone). Figure 4 (b) is an example of a recess 11b with a shape that narrows due to a curve between the bottom surface and the opening. Figure 4 Both (a) and (b) show portions inside the recess 11b that are larger than the diameter of the opening of the recess 11b. Additionally, Figure 4 (a) and (b) show the structures after removing the etch mask from the support 11, but it could also be as follows: Figure 4 (c) shows the structure in which the etching mask 14 is disposed on the support 11 without being removed from the support 11. Figure 4 In (c), the etching mask 14 covers the opening of the recess 11b, thereby creating a portion inside the recess 11b with a diameter larger than the opening diameter. This is used to form... Figure 4(a) to (c) The material of the support 11 and the type of etching (e.g., wet etching, dry etching, etc.) for the shape of the recess 11b are not particularly limited and can be arbitrarily selected. The method for controlling the shape of the recess 11b is not particularly limited, for example, as described above. Furthermore, for example, Figure 4 As shown in (d), the recess 11b can be a through hole extending from one side (surface) of the support 11 to the other side (back side). There are no particular limitations on the method of forming the through hole; for example, it can be formed by etching both sides using a mask disposed on the surface and back side of the support 11.

[0063] The mold maintenance component of the present invention can be disposable or reusable. When reused, for example, the used mold maintenance resin can be replaced with new mold maintenance resin, and only the support body can be reused. Therefore, for example, a release layer can be provided to facilitate the peeling of the mold maintenance resin from the support body. The release layer can, for example, be provided with... Figure 1 Between the support body 11 and the molding mold maintenance resin 12, Figure 2 Between the roughened surface 11a and the molding mold maintenance resin 12, Figure 3 Between the support 11 and the adhesive layer 13, or Figure 3The release layer is formed between the adhesive layer 13 and the molding mold maintenance resin 12. The release layer needs to be formed such that the molding mold maintenance resin 12 does not peel off from the support 11 when the molding mold maintenance component 10 is used, but can be peeled off from the support 11 after the molding mold maintenance component 10 is used. Therefore, for example, the release layer can be formed from a material that can be decomposed after the molding mold maintenance component 10 is used. There are no particular limitations on the method of decomposing the release layer; for example, UV (ultraviolet) laser irradiation, chemical treatment, and thermal demolding can be used. UV laser irradiation is preferred because it is simple and efficient. The material forming the release layer can be, for example, a photocurable resin. There are no particular limitations on the photocurable resin; it can be a resin that is cured by visible light irradiation, or a resin that is cured by invisible light irradiation such as infrared or ultraviolet light. The photocurable resin, for example, can be a resin used in FO-WLP technology, as described in JSR TECHNICAL REVIEW No. 126 / 2019, pages 18-25, "Development of UV-Laser Release Material for Fan-Out Wafer Level Package (FO-WLP)" (publisher: JSR Corporation). This book specifically describes bonding a glass carrier wafer and an EMC (Epoxy Molding Compound) wafer using an adhesive layer, with a release layer material disposed between the adhesive layer and the glass carrier wafer. The book also describes how UV laser irradiation of the release layer allows for smooth peeling of the bonded wafer without the application of heat or force. Furthermore, the book describes that the release layer material uses an aromatic polymer with functional groups exhibiting extremely high UV absorption introduced into the main chain.

[0064] [2. Manufacturing method of resin molded articles]

[0065] As described above, the method for manufacturing resin molded articles of the present invention is a method for manufacturing resin molded articles using a molding die, characterized by including a molding die maintenance step, in which the molding die maintenance component of the present invention is supplied to the molding die to maintain the molding die; and a resin molding step, in which, after the molding die maintenance step, a resin molding object and resin material are supplied to the molding die to perform resin molding.

[0066] There are no particular limitations on the method for performing the mold maintenance process. For example, the mold maintenance component of the present invention can be supplied to the mold cavity of the mold, and pre-forming can be performed within the mold cavity. There are no particular limitations on the pre-forming method; for example, it can be the same as a pre-forming method using conventional cleaning resin or release resin. Specifically, for example, pre-forming can be performed by closing the mold and heating it. This allows for mold maintenance (e.g., cleaning or release restoration of the mold). In the present invention, there are no particular limitations on the temperature of the mold during pre-forming, the pre-forming time, etc., and they can be appropriately set, for example, to be the same as or equivalent to a pre-forming method using conventional cleaning resin or release resin. However, as described above, a characteristic of the mold maintenance component of the present invention is that the support body and the mold maintenance resin are integrated. Therefore, as described above, the method for manufacturing resin molded articles of the present invention has the advantageous effect of automatically supplying the mold maintenance component to the mold and suppressing or preventing mold maintenance resin residue from remaining in the mold.

[0067] As described above, when manually supplying cleaning components to the molding die, the cleaning components must be supplied with the resin molding apparatus open and exposed to the outside air. However, even in cleanrooms or clean booths where air cleanliness can be guaranteed, there is still a risk of contaminants contaminating the inside of the resin molding apparatus. The resin molding article manufacturing method of the present invention automatically supplies molding die maintenance components to the molding die, thus solving the above-mentioned problems.

[0068] In the method for manufacturing resin molded articles of the present invention, the resin molding process, which involves supplying a resin molding object and resin material to the molding mold after the molding mold maintenance process, is not particularly limited. For example, it can be performed under the same conditions as conventional resin molding methods. The resin molding method in the resin molding process is not particularly limited; for example, as described above, it can be compression molding, transfer molding, injection molding, etc. Furthermore, the resin molding process in the method for manufacturing resin molded articles of the present invention can, for example, be resin molding without using a release film. In particular, by supplying the molding mold maintenance component of the present invention, whose molding mold maintenance resin is a release property restoration resin, to the molding mold, the release property of the molding mold is restored, the release property of the molding mold can be improved, and resin molding can be performed without using a release film. However, the resin molding process in the method for manufacturing resin molded articles of the present invention is not particularly limited; for example, resin molding using a release film can also be performed.

[0069] In the method for manufacturing resin molded articles of the present invention, the resin molding process is not particularly limited, and can be the same as or equivalent to conventional methods for manufacturing resin molded articles. In the method for manufacturing resin molded articles of the present invention, when compression molding is used as the resin molding method, the resin molding process can be performed, for example, as follows: First, while supplying a resin molding object to a molding die having an upper mold and a lower mold, resin material is supplied into the mold cavity of the molding die. The resin molding object is not particularly limited, and can be, for example, a substrate with a chip mounted on it. Next, the resin material in the mold cavity is made into a liquid or flowing state. Regarding the resin material, a resin material that is in a liquid or flowing state before being supplied to the mold cavity can be used, but it can also be melted and made into a liquid or flowing state by heating or the like within the mold cavity. Next, the upper and lower molds of the molding die are closed. Thus, for example, a chip or the like mounted on the resin molding object is immersed in the resin material within the mold cavity, and pressure can be applied to the resin material within the mold cavity. Then, the resin material is cured (e.g., by heating) within the mold cavity. Thus, a resin molded article is formed. Next, the upper and lower molds are opened, and the resin molded article is removed. Thus, the resin molding process can be performed. The above is an example of a resin molding process using compression molding; however, in this invention, the resin molding process using compression molding is not limited to this and is arbitrary, for example, it can be the same as or equivalent to a conventional compression molding method. Furthermore, in this invention, the resin molding method, as described above, is not particularly limited; for example, it can be compression molding, transfer molding, injection molding, etc. In this invention, there are no particular limitations on resin molding processes using transfer molding, injection molding, etc., for example, they can be the same as or equivalent to conventional transfer molding, injection molding, etc.

[0070] The method for manufacturing resin molded articles of the present invention, as described above, may, in the molding mold maintenance process, supply the molding mold maintenance component of the present invention, which is a cleaning resin for molding mold maintenance, to the molding mold to clean the molding mold, and then supply the molding mold maintenance component of the present invention, which is a release property restoration resin for molding mold maintenance, to the molding mold to restore the release property of the molding mold.

[0071] Furthermore, in the method for manufacturing resin molded articles of the present invention, as described above, in the molding mold maintenance process, the molding mold maintenance component of the present invention, which is a cleaning resin for molding mold maintenance, is supplied to the molding mold to clean the molding mold. Then, if the cleaning resin becomes dirty, the molding mold maintenance component of the present invention, which is a cleaning resin for molding mold maintenance, is supplied to the molding mold again to clean the molding mold. If the cleaning resin does not become dirty, the molding mold maintenance component of the present invention, which is a release resin for molding mold maintenance, is supplied to the molding mold to restore the release properties of the molding mold, or the resin molding process is performed. Figure 5The flowchart illustrates an example of a method for manufacturing such a resin molded article. First, as shown in step S1 of the figure, the mold maintenance component of the present invention, which is a cleaning resin for mold maintenance, is supplied to the mold to clean it. This step S1 corresponds to the "mold maintenance step" in the method for manufacturing the resin molded article of the present invention. Then, after step S1, if the cleaning resin becomes dirty, step S1 is performed again. After step S1, if the cleaning resin does not become dirty, as shown in step S2, the "resin molding step" in the method for manufacturing the resin molded article of the present invention is performed. Thus, the method for manufacturing the resin molded article of the present invention can be implemented to manufacture a resin molded article. At this time, for example, as described above, it is preferable that the color of the cleaning resin is white or a light color such as a near-white gray. Thus, as described above, after cleaning the mold, the deposits (e.g., dirt) removed from the mold and adhering to the cleaning resin can be easily and visually identified, and therefore, for example, the surface condition (cleanliness, dirt condition, etc.) of the mold cavity can be easily evaluated. Furthermore, in this invention, there are no particular limitations on the method for determining whether the cleaning resin is "dirty" or "not dirty." For example, it can be determined visually, or by photographing the cleaning component, performing image processing, and determining whether it is "dirty" or "not dirty" based on the amount of attached material, the presence or absence of foreign matter transfer marks, etc. From the perspective of being able to observe the cleaning resin without entering the resin molding apparatus and from the perspective of judgment accuracy, it is preferable to determine by photographing rather than by visual inspection.

[0072] If the presence of foreign matter (such as dirt) inside the molding mold is checked by direct visual inspection, it may be difficult to confirm due to the limited space within the mold. In contrast, by observing the residue on the cleaning resin and the transfer marks of foreign matter to determine if there is any residue inside the mold, this problem can be solved. Furthermore, when the workpiece (the object to be molded in resin molding) is a delicate workpiece such as a wafer, it is fragile and can be damaged even by the presence of minute foreign matter inside the molding mold. However, with this invention, the presence of foreign matter inside the molding mold can be determined not only by observing the residue on the cleaning resin but also by observing the transfer marks of foreign matter. Therefore, this invention can, for example, remove minute foreign matter inside the molding mold and reduce damage to delicate workpieces. Additionally, as described above, this invention automatically supplies molding mold maintenance components to the molding mold instead of manually, thus preventing the mold interior from being exposed to external air. Therefore, this invention can suppress or prevent foreign matter such as contaminants from entering the molding mold.

[0073] In addition, Figure 5The flowchart shows an example of performing step S2 (resin molding process) immediately after step S1 (cleaning the molding die). However, it is not limited to this. For example, as mentioned above, mold release recovery of the molding die (pre-molding using resin for mold release recovery) can be performed after cleaning the molding die and before performing the resin molding process.

[0074] [3. Resin Molding Device]

[0075] The resin molding apparatus of the present invention, as described above, is characterized by having a molding die for resin molding and a transport mechanism for transporting the molding die maintenance component of the present invention to the molding die. Furthermore, the resin molding apparatus of the present invention is not particularly limited, for example as described below.

[0076] (1) Overall structure of the resin molding device

[0077] Figure 6 The plan view schematically illustrates an example of the configuration of the resin molding apparatus of the present invention. This resin molding apparatus is used for manufacturing electronic components (resin molded articles). As shown, in this apparatus, the release film cutting module (release film cutting mechanism) 1010, the discharge module 1020, the compression molding module (compression molding mechanism) 1030, the transport module (transport mechanism) 1040, and the control unit 1050 are arranged side-by-side from the right side of the figure in the order described above. Each module is separate, but they can also be mounted and dismounted relative to adjacent modules. The discharge module 1020, as described later, includes a discharge mechanism that discharges resin material for resin molding into the discharge area on the release film (discharge target). Furthermore, the resin material is not particularly limited; for example, it can be liquid resin or particulate resin.

[0078] The release film cutting module (release film cutting mechanism) 1010 can cut and separate a circular release film from a long strip of release film. As shown in the figure, the release film cutting module 1010 includes a film fixing platform mounting mechanism 1011, a roll of release film 1012, and a film clamp 1013. A worktable (not shown) is mounted on the upper surface of the film fixing platform mounting mechanism 1011. The worktable is a fixing platform for fixing the release film 100 and can be called a "film fixing platform". As shown in the figure, the front end of the release film can be pulled out from the roll of release film 1012 and covered on the upper surface of the worktable mounted on the film fixing platform mounting mechanism 1011, thus fixing the release film on the worktable. The film clamp 1013 can fix the front end of the release film pulled out from the roll of release film 1012 to the side opposite to the roll of release film 1012 as viewed from the film fixing platform mounting mechanism 1011, while simultaneously pulling the release film out from the roll of release film 1012. On the film fixing platform mounting mechanism 1011, the release film can be cut into circular release films 100 by a cutter (not shown). Further, the release film cutting module 1010 includes a waste disposal mechanism (not shown) for processing the remaining release film (waste) after cutting and separating the circular release film 100.

[0079] The discharge module 1020 includes a discharge mechanism, a resin loader (resin conveying mechanism) 1021, and a post-processing mechanism 1022. The discharge mechanism includes, for example, a release film 100, a worktable (fixed table, not shown), and a distributor 200 equipped with nozzles for discharging resin material. Additionally, because... Figure 6 This is a plan view (viewed from above). The worktable is obscured by the release film 100 and is therefore not shown. Additionally, in... Figure 6 In the middle, the nozzle is obscured by the dispenser 200 and is therefore not shown. Additionally, in... Figure 6 In the figure, the discharge mechanism further includes a film fixing table moving mechanism 1023. A worktable and a release film 100 are mounted on the film fixing table moving mechanism 1023. By moving or rotating the film fixing table moving mechanism 1023 horizontally, the worktable mounted thereon, along with the release film 100, can be moved or rotated together. In this figure, the film fixing table moving mechanism 1023 is the same as the film fixing table mounting mechanism 1011, and can move between the release film cutting module 1010 and the discharge module 1020. Additionally, the resin loader 1021 and the post-processing mechanism 1022 are integrally formed. The resin loader 1021 is used to load resin material (… Figure 6 In the state where the resin is supplied to the release film 100 (resin storage part) that is adsorbed and fixed on the lower end face of the frame member (circular frame), the frame member (circular frame) and the release film 100 can be engaged. Then, in this state, the resin material can be supplied to the lower mold cavity for compression molding (described later) in the compression molding module 1030 in the state of being discharged into the release film 100.

[0080] As shown in the figure, the compression molding module 1030 includes a molding mold 1031. The molding mold 1031 is not particularly limited and can be, for example, a metal mold. The main components of the molding mold 1031 are an upper mold and a lower mold (not shown). The lower mold cavity 1032, as shown, is circular. The molding mold 1031 further includes an upper mold substrate mounting portion (not shown) and a lower mold cavity bottom surface component (not shown) for resin pressurization. In the compression molding module 1030, a chip (e.g., a semiconductor chip) mounted on a resin-sealed pre-molding substrate (pre-molding substrate, described later) can be resin-sealed within a sealing resin (resin encapsulation) within the lower mold cavity to form a resin-sealed post-molding substrate (post-molding substrate). The compression molding module 1030 may, for example, include a compression molding mechanism.

[0081] in addition, Figure 6 The resin molding apparatus has two compression molding modules 1030, which are arranged adjacent to each other between the discharge module 1020 and the transport module 1040. Additionally, in Figure 6 In the resin molding apparatus, the conveying module 1040 and the adjacent molding module 1030 are detachable, or the discharge module 1020 and the adjacent molding module 1030 are detachable, or both are detachable. Furthermore, the two molding modules 1030 can be detached from each other. However, the resin molding apparatus of the present invention is not limited to this; for example, the compression molding module 1030 can be only one, or it can be three or more.

[0082] The transport mechanism (transport module) 1040 can transport the chip (resin-sealed object) before resin sealing, along with the substrate, and transport the electronic component (resin-molded article) after resin sealing. As shown, the transport mechanism (transport module) 1040 includes a substrate loader 1041, a track 1042, and a robotic arm 1043. The track 1042 protrudes from the transport mechanism (transport module) 1040 and reaches the area of ​​the compression molding module 1030 and the discharge module 1020. The substrate loader 1041 can hold a substrate 1044. The substrate 1044 can be a substrate before resin sealing (pre-molding substrate) 1044a or a substrate after resin sealing (post-molding substrate) 1044b. The substrate before resin sealing (pre-molding substrate) 1044a corresponds to the "resin-molded object" in the resin molding process of the resin-molded article manufacturing method of the present invention. The substrate loader 1041 and resin loader 1021 (post-processing mechanism 1022) can move on track 1042 between the discharge module 1020, the compression molding module 1030, and the transport module 1040. Additionally, as shown, the transport module 1040 includes a substrate receiving section that can receive the pre-sealment substrate (pre-molding substrate) 1044a and the post-sealment substrate (post-molding substrate) 1044b, respectively. A chip (not shown, e.g., a semiconductor chip) is mounted on the pre-sealment substrate 1044a. In the post-molding substrate 1044b, the chip is sealed with resin (sealing resin) cured from the resin material to form an electronic component (resin molded article). A robotic arm 1043 can, for example, support and transport the substrate 1044 from below. The robotic arm 1043 can be used, for example, in the following manner. Specifically, firstly, the front and back sides of the pre-molding substrate 1044a, which has been removed from the storage portion of the pre-molding substrate 1044a, can be flipped so that the chip mounting surface side faces downwards when placed on the substrate loader 1041. Secondly, the post-molding substrate 1044b can be removed from the substrate loader 1041, its front and back sides flipped so that the sealing resin side faces upwards, and the post-molding substrate 1044b can be stored in the storage portion of the post-molding substrate. Additionally, the robotic arm 1043, for example as described later, can also support and transport molding mold maintenance components from below.

[0083] The control unit 1050 controls the cutting of the release film, the discharge of resin material, the transport of the pre-sealing substrate and the post-sealing substrate, the transport of resin material, the transport of the release film, the heating of the molding die, and the closing and opening of the molding die. In other words, the control unit 1050 controls each action in the release film cutting module 1010, the discharge module 1020, the molding module 1030, and the transport module 1040. Therefore, the resin molding apparatus of the present invention can function as a fully automatic machine by controlling each component through the control unit. Alternatively, the resin molding apparatus of the present invention can also function as a manual machine without relying on the control unit, but controlling each component through the control unit is more efficient. Furthermore, the control unit 1050 includes a calculation unit and a storage unit (not shown).

[0084] The location of the control unit 1050 is not limited to... Figure 6 The positions shown are arbitrary; for example, they can be configured on at least one of the modules 1010, 1020, 1030, and 1040, or they can be configured outside of each module. Furthermore, the control unit 1050 can also be configured as multiple control units, each partially separated, depending on the action of the controlled object.

[0085] exist Figure 6 In the resin molding apparatus described above, the substrate delivery module 1040 and the discharge module 1020, which discharges resin material onto the release film, are arranged opposite each other across the compression molding module 1030. Furthermore, the release film cutting module 1010, which forms a circular release film, is arranged outside the discharge module 1020. This resin molding apparatus is a separate-type resin molding apparatus with the modules separately configured. Additionally, the configuration of the modules in the resin molding apparatus of the present invention is not particularly limited and can be combined with... Figure 6 The configurations differ. For example, a configuration in which the required number of compression molding modules can be detachably configured can be used. Alternatively, the release film cutting module (circular release film forming module), the ejection module, and the transport module (substrate module) can be positioned close to the compression molding module. In this case, the release film module, ejection module, and substrate module become the parent module, and the compression molding module becomes the child module (parent-child type). In this case, the required number of compression molding modules can be arranged side-by-side sequentially. Furthermore, the release film cutting module, ejection module, and transport module (substrate module) can be integrated. Alternatively, the release film cutting module, ejection module, and transport module (substrate module) can be integrated with a single molding module, or the integrated components can function independently as a resin molding apparatus (e.g., a compression molding apparatus).

[0086] Furthermore, when multiple compression molding modules are arranged between the transport module (substrate module) and the discharge module, and when multiple compression molding modules are arranged sequentially relative to the parent module, it is preferable to arrange them in the following manner: that is, the molding modules are arranged side by side along the extension direction of the track used to move the constituent components including the substrate loader, resin loader, and post-processing mechanism. Additionally, the modules of the resin molding apparatus of the present invention can be detached from each other, for example, using connection mechanisms such as bolts and nuts or using suitable positioning mechanisms. Alternatively, it can be configured such that other compression molding modules can be detached relative to the compression molding module. Thus, compression molding modules can be added or removed afterward.

[0087] (2) Manufacturing method of resin molded articles

[0088] Next, instructions on using Figure 6 An example of a method for manufacturing resin-molded articles using a compression molding apparatus.

[0089] The method for manufacturing resin molded articles of the present invention, as described above, is a method for manufacturing resin molded articles using a molding die. It is characterized by including a molding die maintenance step, which involves supplying the molding die maintenance component of the present invention to the molding die to maintain the molding die, and a resin molding step, which involves supplying a resin molding object and resin material to the molding die after the molding die maintenance step to perform resin molding.

[0090] In the method for manufacturing resin molded articles of the present invention, there are no particular limitations on the resin molding process of supplying the resin molding object and resin material to the molding die after the molding die maintenance process for resin molding, but in the use of Figure 6 When using a resin molding apparatus, it can be performed, for example, in the following manner. Furthermore, the mold maintenance process performed before the resin molding process will be described later.

[0091] In use Figure 6 In the resin molding process of the resin molding apparatus, for example, firstly, in the release film cutting module (release film cutting mechanism) 1010, as described above, the front end of the release film is pulled out from the roll release film 1012 by the film clamp 1013. Then, the pulled-out release film covers the upper surface of the worktable placed on the film fixing table placement mechanism 1011, and the release film is fixed on the worktable. In this state, as described above, the release film is cut using a cutter (not shown) to cut into circular release films 100. The remaining release film (waste) after cutting and separating the circular release films 100 is processed by a waste disposal mechanism (not shown).

[0092] Next, the film fixing platform mounting mechanism 1011 (film fixing platform moving mechanism 1023), together with the worktable (not shown) and the release film 100 mounted thereon, is moved to a position below the resin supply port of the nozzle (not shown) within the discharge module 1020. In this state, the resin material is discharged by the dispenser 200 into the discharge area on the release film 100 (discharge process). At this time, for example, the resin discharge position can be moved by moving (or rotating) the film fixing platform moving mechanism 1023 together with the worktable and the release film 100 mounted thereon.

[0093] Next, the release film 100 and the resin material discharged to the discharge area thereon are moved from the film fixing table moving mechanism 1023 and held by the resin loader (resin transport mechanism) 1021. The release film 100 can be held by the holding mechanism (not shown) of the resin loader 1021 and moved from the film fixing table moving mechanism 1023 to the resin loader 1021.

[0094] Next, the pre-molding substrate 1044a, housed in the storage portion of the pre-molding substrate (resin molding object) 1044a, is supported from below and removed by the robotic arm 1043. Then, as described above, the front and back sides of the pre-molding substrate 1044a removed from the storage portion are flipped by the robotic arm 1043. Thus, with the chip mounting surface facing downwards, the pre-molding substrate 1044a is placed in the substrate loader 1041 and transported into the compression molding module 1030. At this time, the pre-molding substrate 1044a is supplied to the mold surface of the upper mold (molding mold 1031). Next, the resin loader 1021, which holds the release film 100 and resin material, along with the post-processing mechanism 1022 integrated with the resin loader 1021, moves on the track 1042 and is transported into the compression molding module 1030 (transportation process). At this time, by placing the release film 100 on the mold surface of the lower mold, the release film 100 and resin material can be supplied into the lower mold cavity 1032 with a circular opening.

[0095] Next, the resin material is heated within the lower mold cavity 1032. Heating reduces the viscosity of the liquid resin (e.g., when using a liquid resin that is liquid at room temperature), and melts the granular resin into a liquid resin (when using a powdered resin). Further, in the compression molding module 1030, the molding molds 1031 (upper and lower molds) are closed. The chip mounted on the pre-molding substrate 1044a provided in the upper mold is thus immersed in the resin material within the lower mold cavity 1032, and pressure can be applied to the resin material within the lower mold cavity 1032 by the bottom component of the mold cavity. Then, the resin material is cured (e.g., by heating) within the molding mold 1031 (lower mold cavity 1032), and the electronic component is sealed with the cured resin (sealing resin) 20. This forms the resin-sealed substrate 1044b (molded substrate, electronic component). Next, the molding molds 1031 (upper and lower molds) are opened. Then, the resin-sealed substrate 1044b is removed from the substrate loader 1041 and transported to the transport module 1040 for storage. Additionally, after removing the resin-sealed substrate (molded substrate, electronic component) 1044b from the molding mold 1031 using the substrate loader 1041, the substrate mounting section of the upper mold is cleaned using the upper mold surface cleaner (not shown) of the post-processing mechanism 1022. Simultaneously or at staggered times, the release film removal mechanism (not shown) of the post-processing mechanism can be used to remove any unwanted release film from the lower mold surface.

[0096] Alternatively, the substrate loader 1041, which holds the resin-sealed substrate 1044b (electronic component), can be moved from the compression molding module 1030 to the transport module 1040. In this case, as described above, the resin-sealed substrate (molded substrate, electronic component) 1044b is removed from the substrate loader 1041 by the robotic arm 1043, and its front and back sides are flipped. Thus, with the resin-sealed side facing upwards, the resin-sealed substrate (molded substrate, electronic component) 1044b is stored in the storage section of the resin-sealed substrate (molded substrate, electronic component). As described above, a resin molding process can be performed to manufacture the electronic component (resin-molded article).

[0097] In use Figure 6 The molding die maintenance process performed before the resin molding process of the resin molding apparatus can be performed, for example, in the following manner.

[0098] First, in the mold maintenance process, unlike the resin molding process, the release film and the resin material discharged to it in the discharge area are not used. That is, the release film and the resin material discharged to it in the discharge area are not supplied to the mold 1031 and the lower mold cavity 1032. Furthermore, a mold maintenance component (not shown) replaces the pre-molding substrate 1044a and is housed in the housing of the pre-molding substrate 1044a; the mold maintenance component replaces the pre-molding substrate 1044a. There are no special limitations on the mold maintenance component; for example, it can be... Figures 1-3 The molding die maintenance component 10 is described in the text. Additionally, regarding... Figures 1-3 The mold maintenance component 10 shows an example where the mold maintenance resin 12 is disposed on both sides of the support 11, but is not limited thereto. For example, the mold maintenance resin 12 may be disposed on only one side of the support 11.

[0099] Next, the molding die maintenance component, stored in the storage section of the pre-molding substrate 1044a, is supported from below and removed by the robotic arm 1043. Then, the molding die maintenance component removed from the storage section of the pre-molding substrate 1044a is placed in the substrate loader 1041 by the robotic arm 1043 and transported into the compression molding module 1030. At this time, the molding die maintenance component is supplied to the mold surface of the upper mold (molding mold 1031).

[0100] Next, in the compression molding module 1030, the molding molds 1031 (upper and lower molds) are closed. Then, the molding mold maintenance resin for the molding mold maintenance components is pre-molded by heating the molding mold 1031, thereby maintaining the molding mold. For example, a cleaning resin can be used as the molding mold maintenance resin to clean the inside of the lower mold cavity 1032. Alternatively, a release resin can be used as the molding mold maintenance resin to restore the release properties inside the lower mold cavity 1032. Next, the molding molds 1031 (upper and lower molds) are opened. Then, the used molding mold maintenance components (not shown) are removed using the substrate loader 1041 and further transported to the transport module 1040 for storage.

[0101] Alternatively, the substrate loader 1041, which carries the used mold maintenance component, can be moved from the compression molding module 1030 to the transport module 1040. At this time, for example, the used mold maintenance component is removed from the substrate loader 1041 by the robotic arm 1043, and its front and back sides are flipped over. Thus, the used mold maintenance component is stored in the storage section of the resin-sealed substrate (molded substrate, electronic component) 1044b. As described above, a mold maintenance process can be performed. As part of such a series of mold maintenance processes, for example, after performing one or more mold maintenance processes using a cleaning resin as the mold maintenance resin, a mold maintenance process using a release properties recovery resin as the mold maintenance resin can be performed.

[0102] Furthermore, the above description illustrates an example where the mold maintenance component is housed in the storage portion of the pre-molding substrate 1044a, and the used mold maintenance component is housed in the storage portion of the resin-sealed substrate 1044b. However, the present invention is not limited to this. The storage portion for the mold maintenance component can be provided separately from the storage portion of the pre-molding substrate 1044a, or the storage portion for the used mold maintenance component can be provided separately from the storage portion of the resin-sealed substrate 1044b. In this case, the pre-molding substrate 1044a can be housed in the storage portion of the pre-molding substrate 1044a, and the resin-sealed substrate 1044b can be housed in the storage portion of the resin-sealed substrate 1044b. Furthermore, when the storage portion for the mold maintenance component is provided separately from the storage portion of the pre-molding substrate 1044a, the position of the storage portion is not particularly limited and is arbitrary. The location of the storage portion for the mold maintenance component can be, for example, near the storage portion of the pre-molding substrate 1044a, or it can be located in a part of the transport module 1040, or it can be located in a part of the control unit 1050. Similarly, when the storage portion for the used mold maintenance component is provided separately from the storage portion of the resin-sealed substrate 1044b, the location of the storage portion for the used mold maintenance component is not particularly limited and is arbitrary. The location of the storage portion for the used mold maintenance component can be, for example, near the storage portion of the resin-sealed substrate 1044b, or it can be located in a part of the transport module 1040, or it can be located in a part of the control unit 1050.

[0103] In addition, Figure 6The illustration shows an example where only the lower mold of the molding die has a cavity, and a molding die maintenance component is supplied to the mold surface of the upper mold. In this case, for example as described above, the molding die maintenance component can be used to apply molding die maintenance resin to only one surface of the support body, and the lower mold cavity can be maintained using this molding die maintenance resin. However, the invention is not limited to this. For example, when only the lower mold of the molding die has a cavity, or when both the upper and lower molds of the molding die have cavities, a molding die maintenance component with molding die maintenance resin applied to both surfaces of the support body can be used to maintain both the upper and lower molds using this molding die maintenance resin.

[0104] In addition, Figure 6 The invention describes an example of using a release film in the resin molding process of a method for manufacturing resin molded articles. However, the invention is not limited thereto, and a release film may not be used in the resin molding process.

[0105] In addition, Figure 6 The example described is a substrate transport mechanism (transport module 1040) that also serves as a transport mechanism for mold maintenance components. However, the resin molding apparatus of the present invention is not limited to this; for example, the transport mechanism for mold maintenance components may be provided separately from the substrate transport mechanism.

[0106] In addition, Figure 6 The invention describes an apparatus for manufacturing electronic components and a method for manufacturing electronic components using the same. However, the invention is not limited to electronic components, but can also be applied to the manufacture of any other resin molded articles. For example, the invention can be applied when manufacturing optical components such as lenses, optical modules, and light guide plates, or other resin articles by compression molding.

[0107] Furthermore, the present invention is not limited to the above embodiments. Without departing from the spirit of the present invention, it can be used in any appropriate combination, modification or selection as needed.

[0108] This application claims priority based on Japanese Patent Application No. 2021-099001, filed on June 14, 2021, the disclosure of which is incorporated herein by reference.

[0109] Explanation of reference numerals in the attached figures

[0110] 10. Parts for mold maintenance

[0111] 11 Support body

[0112] 11a Roughened surface of support 11

[0113] 11b Recessed portion of support 11

[0114] 12 Resin for mold maintenance

[0115] 13 Adhesive layer

[0116] 14 Mask

[0117] 20 Sealing Resin

[0118] 100 Release film (for expelling the object)

[0119] 200 Distributor

[0120] 1000 Resin Molding Device

[0121] 1010 Release Film Cutting Module (Release Film Cutting Mechanism)

[0122] 1011 Membrane Fixing Platform Placement Mechanism

[0123] 1012 Roll Release Film

[0124] 1013 Membrane clamp

[0125] 1020 Discharge Module (Discharge Mechanism)

[0126] 1021 Resin Loader

[0127] 1022 Post-processing unit

[0128] 1023 Membrane Fixing Stage Moving Mechanism

[0129] 1030 Compression Molding Module (Compression Molding Mechanism)

[0130] 1031 Molding mold

[0131] 1032 Lower mold cavity

[0132] 1040 Delivery Module (Delivery Mechanism)

[0133] 1041 Baseboard Loader

[0134] 1042 orbit

[0135] 1043 Robotic Arm

[0136] 1044a resin-sealed substrate (pre-molding substrate)

[0137] 1044b resin-sealed substrate (pre-formed substrate)

[0138] 1050 Control Department

Claims

1. A method for manufacturing a resin molded article, comprising: The transport step involves a transport mechanism that transports a mold maintenance component from a general storage section that houses the mold maintenance component and a substrate to a resin molding mold having an upper mold and a lower mold. The mold maintenance component has a plate-shaped support and sheet-shaped or plate-shaped mold maintenance resin disposed on both sides of the support. The step of closing the mold is performed with the mold maintenance component positioned between the upper mold and the lower mold of the mold. After the mold is closed, the maintenance step is performed by heating the mold maintenance component; The step of the conveying mechanism conveying the mold maintenance component from the mold; The step of the conveying mechanism conveying the substrate from the receiving part to the molding die; The step of closing the mold is performed with the substrate positioned between the upper mold and the lower mold of the molding die.

2. The method for manufacturing a resin molded article according to claim 1, wherein... The support body is a support body that has undergone a bonding strength enhancement treatment to improve the bonding strength with the resin used for mold maintenance.

3. The method for producing a resin-molded article according to claim 1 or 2, wherein The mold maintenance component further includes an adhesive layer. The molding mold maintenance resin is bonded to at least one side of the support through the adhesive layer.

4. The method for manufacturing a resin molded article according to claim 1 or 2, wherein... At least one surface of the support is roughened. A molding mold maintenance resin is disposed on the roughened surface.

5. The method for manufacturing a resin molded article according to claim 4, wherein... The roughened surface is a surface roughened by forming concave portions. Inside the recess, there exists a portion whose diameter is larger than that of the opening of the recess.

6. The method for manufacturing a resin molded article according to claim 1 or 2, wherein... The resin used for mold maintenance is a cleaning resin.

7. The method for manufacturing a resin molded article according to claim 1 or 2, wherein... The resin used for mold maintenance is a resin for restoring mold release properties.

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