Diamond arrangement consistent trimmer and preparation method thereof

Abstract

The application discloses a dresser with consistent diamond arrangement and a preparation method thereof, and the preparation method comprises the following steps: spreading regular octahedral diamonds on a grid material and vibrating the diamonds so that the diamonds are clamped into the grid of the grid material; sorting out the diamonds which are not clamped into the grid; and fixing the grid material and the diamonds on a substrate by using an electroplating method. The regular octahedral diamonds with consistent size are clamped into the grid, and then the dresser is formed by fixing the grid material and the diamonds on the substrate by using the electroplating method, so that the tips of the diamonds on the dresser are consistent and upward, and the exposed heights of the diamonds are consistent. The dresser provided by the application effectively avoids the phenomenon that the diamonds are unevenly distributed in the transfer process, increases the utilization rate of the dresser, and makes the utilization rate of the diamonds on the dresser reach 80% to 98%.

Description

Technical Field

[0001] This invention relates to the field of semiconductor fabrication, and more specifically to a diamond uniformly arranged dressing device and its fabrication method. Background Technology

[0002] As IC (integrated circuit) technology nodes continue to decrease, higher demands are placed on CMP (chemical mechanical planarization) processes. The dresser, as one of the main consumables in CMP, determines the quality of the planarization effect. The dresser's application in CMP mainly involves two aspects. First, acidic or alkaline polishing slurries are often used in CMP to chemically corrode and mechanically grind the wafer surface. However, this process generates many reaction residues that adhere to the polishing pads, clogging the micro-vias and increasing wafer defects. Therefore, the dresser is needed to brush away these residues from the polishing pads, effectively removing them. Second, during in-situ conditioning CMP, the dresser continuously disperses the polishing slurry to ensure it is effectively spread evenly on the polishing pads. However, commercially available dressers typically use irregular diamond arrangements, which not only reduces their effectiveness in correcting the polishing pads but also increases the amount of diamond used, thus increasing costs. Therefore, it is essential to study dressing tools with consistent diamond arrangement. However, ensuring consistent diamond arrangement is a key challenge in the production of this type of dressing tool. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is that the existing dressing device has inconsistent diamond arrangement, poor correction effect and high cost, so as to provide a dressing device with consistent diamond arrangement and its preparation method.

[0004] Therefore, the present invention adopts the following technical solution:

[0005] This invention provides a method for preparing a dressing tool with uniform diamond arrangement, comprising the following steps:

[0006] S1: Spread diamonds onto the mesh material and vibrate it to make them snap into the mesh of the mesh material;

[0007] S2: Sorting out diamonds that are not stuck in the grid;

[0008] S3: The mesh material and diamond are fixed onto the substrate by electroplating.

[0009] Furthermore, the mesh of the mesh material is square, with a side length that is 2 / 3 the side length of a regular octahedral diamond.

[0010] The octahedral diamond has a side length of 150-300 μm, the mesh material has a mesh side length of 100-200 μm, and the gap between adjacent meshes is 450-600 μm.

[0011] The mesh material can be made of metal or non-metal, including nickel, zinc, cadmium, brass, PP, PVC, etc.

[0012] The thickness of the mesh material is 20-30 μm.

[0013] In step S4, the substrate is made of titanium alloy.

[0014] The present invention also provides a dressing tool with uniform diamond arrangement, which is prepared by the above-described method.

[0015] Furthermore, on the surface of the dressinger, the exposed height of the diamond is 53-106 μm.

[0016] The technical solution of this invention has the following advantages:

[0017] (1) The present invention provides a method for preparing a dressing device with uniform diamond arrangement. It uses regular octahedral diamonds of uniform size, which are placed in a grid and then fixed on a substrate by electroplating to form a dressing device, so that the diamonds on the dressing device all have their tips pointing upwards and their exposed height is uniform.

[0018] (2) The present invention limits the size of the diamond and the grid to avoid the diamond getting stuck in the grid and unstable, and at the same time avoids the diamond being overcrowded, which would cause the diamond to tilt or not be able to be embedded in the grid.

[0019] (3) The dressing device provided by the present invention effectively avoids the uneven distribution of diamonds during the transfer process, increases the utilization rate of the dressing device, and makes the utilization rate of diamonds on the dressing device reach 80%-98%. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a partial structural diagram of the distribution of octahedral diamonds on a grid structure in step (2) of Embodiment 1 of the present invention;

[0022] Figure 2This is a partial structural schematic diagram of the trimmer obtained in Embodiment 1 of the present invention, wherein (a) is a top view and (b) is a side view;

[0023] Figure 3 This is a schematic diagram of the structure of a regular octahedral diamond in Embodiment 1 of the present invention.

[0024] Figure label:

[0025] 1-Octahedral diamond; 2-Mesh material; 3-Electroplated substrate. Detailed Implementation

[0026] The following embodiments are provided to better understand the present invention and are not limited to the preferred embodiments described. They do not constitute a limitation on the content and scope of protection of the present invention. Any product that is the same as or similar to the present invention, derived by any person under the guidance of the present invention or by combining the features of the present invention with other prior art, falls within the protection scope of the present invention.

[0027] Where specific experimental steps or conditions are not specified in the embodiments, they can be performed according to the conventional experimental steps or conditions described in the literature in this field.

[0028] The following specific embodiments further illustrate the present invention. The examples given do not represent all embodiments of the present invention; only some embodiments are described as examples. Specific embodiments are as follows:

[0029] Example 1

[0030] This embodiment describes a dressing tool with uniform diamond arrangement, and the specific preparation method is as follows:

[0031] (1) Select a regular octahedral diamond 1 with a side length of 150 μm;

[0032] Select a brass mesh material 2 with a size of 15cm×15cm, a thickness of 20μm, a mesh side length of 100μm, and a gap of 450μm between adjacent meshes;

[0033] (2) Figure 1 As shown, octahedral diamond 1 is spread on grid material 2 and vibrated horizontally to make it snap into the grid of the grid material;

[0034] (3) Use an optical microscope to inspect and sort out the octahedral diamonds 1 that are not stuck in the grid;

[0035] (4) A 3cm thick titanium alloy was selected as the substrate. The mesh material 2 and the octahedral diamond 1 were electroplated onto the substrate. The specific electroplating method was roller electroplating, resulting in the trimmer as shown in the figure. Figure 2 As shown. For regular octahedral diamond 1, as Figure 3 As shown, the exposed height of the octahedral diamond 1 on the surface of the electroplated substrate 3 is 55 μm.

[0036] Comparative Example 1

[0037] The M4 model trimmer from SAESOL, a South Korean company.

[0038] Experimental Example 1

[0039] Using DuPont IC series polishing pads and D2000E polishing slurry, under conditions of 3-6 psi pressure, 120 ml / L slurry flow rate, and polishing disc and head rotation speeds of 93 / 87 rpm, the dressing device obtained in Example 1 was used to polish OX (silica) material, achieving a removal rate of [missing information]. Non-uniformity can be reduced to less than 3%. This result is superior to the removal rate of the trimmer in Comparative Example 1. And non-uniformity within 5%.

[0040] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A method for preparing a dressing device with uniform diamond arrangement, characterized in that, Includes the following steps: S1: Spread octahedral diamonds onto the mesh material and vibrate them to make them snap into the mesh of the mesh material; S2: Sorting out diamonds that are not stuck in the grid; S3: The mesh material and diamond are fixed onto the substrate by electroplating; The mesh material has a square mesh with a side length of 2 / 3 to 3 / 4 of the side length of a regular octahedral diamond. The octahedral diamonds are all the same size with a side length of 150-300 μm; the mesh material has a mesh side length of 100-200 μm and a gap of 450-600 μm between adjacent meshes; The thickness of the mesh material is 20-30 μm; The exposed height of diamond on the surface of the dressing tool is 53-106 μm.

2. The preparation method according to claim 1, characterized in that, The mesh material can be made of metal or non-metal.

3. The preparation method according to claim 1, characterized in that, In step S3, the substrate is a titanium alloy substrate.

4. A dressing tool with uniform diamond arrangement, characterized in that, Prepared by the preparation method according to any one of claims 1-3.

Images