A silicon wafer production line

Abstract

The application discloses a silicon wafer production line, wherein, at a cutting station, the cut silicon wafer is put into a frame together with a wafer carrier, the frame is transferred to a degumming station by a transfer trolley, the wafer carrier is separated from the silicon wafer at the degumming station, a frame conveying module is arranged at a horizontal conveying station of the frame, and the frame is horizontally conveyed to a wafer separating and overturning station, a wafer separating module and an overturning conveying module are arranged at the wafer separating and overturning station, the wafer separating module is used for separating the silicon wafer in the frame and conveying the separated silicon wafer in a vertical posture, and the overturning conveying module is used for overturning the silicon wafer from the vertical posture to a horizontal posture, a horizontal conveying module is arranged at a horizontal conveying station of the silicon wafer, and the silicon wafer is conveyed to a wafer inserting station in the horizontal posture, the wafer inserting station is used for inserting the silicon wafer, and a cleaning and drying station is used for cleaning and drying the inserted silicon wafer. The production line realizes the automation of the whole wafer transfer process and improves the wafer transfer reliability and efficiency.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and more particularly to a silicon wafer production line. Background Technology

[0002] In the silicon wafer production process, silicon rods are first cut into silicon wafers using a wire cutter. The silicon wafers are then attached to the wafer holders using resin plates. The wafer holders and the cut silicon wafers are then placed together into a material frame, which transports them to the debonding station. A debonding machine separates the wafer holders from the silicon wafers. The silicon wafers are then sequentially conveyed to subsequent insertion, cleaning, and drying stations.

[0003] In existing technology, the wafer clamping frame clamps and limits the silicon wafers as a whole. Before wafer insertion, when loading the wafers into the frame, the clamping frame is released, and the wafers placed vertically in the frame are manually removed. Then, the wafers are manually rotated 90° and placed horizontally into a small tray before further loading. Because all wafers are released during loading, wafers not yet loaded are prone to tilting and being squeezed within the frame, leading to breakage or microcracks and severely damaging the quality of the wafers. Furthermore, the entire wafer transfer process requires manual operation for wafer slicing and transfer between different workstations, resulting in low reliability and low efficiency.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] In view of the problems pointed out in the background art, the present invention provides a silicon wafer production line that automates the entire silicon wafer transfer process, thereby improving the reliability and efficiency of silicon wafer transfer.

[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution:

[0007] This invention provides a silicon wafer production line, comprising:

[0008] A feed frame, used to hold diced silicon wafers;

[0009] The cutting station is equipped with a slicing device, which is used to cut silicon rods into silicon wafers. The cut silicon wafers, together with the crystal trays, are placed into a material frame, which is then transported by a transfer trolley to the debonding station.

[0010] The debonding station is equipped with debonding equipment to separate the crystal tray from the silicon wafer;

[0011] A horizontal conveying station for material frames is provided with a material frame conveying module for horizontally conveying the material frames to the slicing and flipping station;

[0012] The wafer flipping station is equipped with a wafer splitting module and a flipping conveyor module. The wafer splitting module is used to split the silicon wafers in the material frame and convey the split silicon wafers one by one in a vertical position. The flipping conveyor module is used to receive the vertical silicon wafers conveyed by the wafer splitting module and flip the silicon wafers from the vertical position to the horizontal position.

[0013] A horizontal silicon wafer conveying station is provided with a horizontal conveying module for receiving horizontally oriented silicon wafers conveyed by the flip conveying module and conveying the silicon wafers horizontally to the intercalation station.

[0014] The wafer insertion station is equipped with a flower basket for inserting silicon wafers transported by the horizontal conveyor module.

[0015] The cleaning and drying station is used to clean and dry the silicon wafers after insertion.

[0016] The material frame horizontal conveying station, the wafer flipping station, the silicon wafer horizontal conveying station, and the wafer insertion station are arranged sequentially along the same straight line.

[0017] In some embodiments, a holding space for holding silicon wafers is formed within the material frame, and the multiple silicon wafers within the material frame are divided into multiple silicon wafer groups;

[0018] The material frame is equipped with a clamping component and an unlocking trigger;

[0019] The clamping assembly includes a movable plate that extends along the length of the holding space. The movable plate has a plurality of clamping parts arranged sequentially along its length. Each of the clamping parts corresponds to a plurality of silicon wafer groups to clamp the corresponding silicon wafer groups. Each clamping part moves away from the silicon wafer to release the clamping of the corresponding silicon wafer group. The unlocking trigger is connected to the movable plate.

[0020] The transfer trolley is equipped with an unlocking part. After the material frame is placed on the transfer trolley, the unlocking part is triggered to move. Under the action of the unlocking trigger, the movable plate moves away from the holding space. The movable plate drives the multiple clamping parts on it to move synchronously away from the holding space.

[0021] The material frame is removed from the transfer trolley, the unlocking part disengages from the unlocking trigger part, and the clamping part moves toward the silicon wafer under the action of the reset member to clamp the silicon wafer.

[0022] In some embodiments, when transferring the cut silicon wafer, the material frame is first placed on the transfer trolley, the unlocking part triggers the unlocking triggering part to act, and all the clamping parts move synchronously away from the holding space under the drive of the movable plate, so that the silicon wafer can be loaded into the holding space from top to bottom;

[0023] After the transfer trolley transfers the material frame to the debonding station, the material frame is removed from the transfer trolley, the unlocking part disengages from the unlocking trigger part, and the clamping part moves toward the silicon wafer under the action of the reset member to clamp the silicon wafer.

[0024] In some embodiments, the material frame horizontal conveying station is provided with an unlocking device. When the material frame conveying module drives the material frame to move in the horizontal direction, relative movement occurs between the material frame and the unlocking device. As the material frame moves relative to the unlocking device, a plurality of clamping parts sequentially contact the unlocking device. The unlocking device applies an external force to the clamping parts to make the clamping parts move away from the corresponding silicon wafer group.

[0025] In some embodiments, the clamping part includes a second pin, which passes through the material frame and the movable plate. A first end of the second pin is provided with an unlocking block, and a second end of the second pin is provided with a clamping block. A spring is sleeved on the second pin, and the spring is located between the clamping block and the material frame.

[0026] When the movable plate moves away from the holding space, the movable plate pushes all the unlocking blocks to move synchronously away from the holding space, so that all the clamping blocks move away from the holding space;

[0027] The clamping block moves toward the silicon wafer under the restoring force of the spring to clamp the corresponding silicon wafer group;

[0028] The unlocking device applies an external force to the unlocking block to move the corresponding clamping part away from the corresponding silicon wafer group.

[0029] In some embodiments, the unlocking block includes a horizontal portion and a vertical portion, the horizontal portion being used to abut against the movable plate, and the vertical portion being used to interact with the unlocking device;

[0030] There is a certain distance between the vertical part and the movable plate. The vertical part has an inclined surface on the side facing the movable plate. Along the discharge direction of the silicon wafer, the distance between the inclined surface and the movable plate first decreases and then increases.

[0031] The unlocking device includes a first roller. When relative movement occurs between the material frame and the unlocking device, the first roller moves between the inclined surface and the movable plate and contacts the inclined surface. The relative displacement between the first roller and the inclined surface causes the second pin to move away from the silicon wafer.

[0032] In some embodiments, the material frame includes an upper frame and a lower frame, the upper frame is detachably disposed above the lower frame, the upper frame is provided with a limiting structure for limiting the crystal tray, and the clamping assembly is disposed on the lower frame;

[0033] The material frame is placed on the debonding station, the lower frame is lifted away from the upper frame to separate the crystal holder from the silicon wafer, and the material frame conveying module conveys the lower frame in the horizontal direction.

[0034] In some embodiments, the slicing module includes a water spraying section and a vertical conveying section. The water spraying section is used to spray water onto the unlocked silicon wafer group in the material frame to slice the multiple silicon wafers in the silicon wafer group. The vertical conveying section is used to convey the sliced ​​silicon wafers one by one in a vertical posture to the flipping conveying module.

[0035] In some embodiments, the vertical conveying unit includes a first mounting frame, on which an adsorption unit and a vertical conveyor belt are provided. The adsorption unit is used to adsorb the silicon wafers after slicing onto the vertical conveyor belt, and the vertical conveyor belt drives the silicon wafers to move upward in a vertical posture.

[0036] In some embodiments, the flipping conveyor module includes a flipping auxiliary part and a coated roller. The flipping auxiliary part includes a second mounting frame with an air blowing part located above the vertical conveyor. The air blowing part is used to blow air onto the vertical silicon wafer conveyed upward by the vertical conveyor, so that the silicon wafer tilts onto the coated roller, and the coated roller drives the silicon wafer to move to a horizontal position.

[0037] Compared with the prior art, the advantages and positive effects of the present invention are:

[0038] In the silicon wafer production line disclosed in this application, the cutting station completes the cutting of silicon rods, the debinding station completes the debinding and separation of the wafer tray and the silicon wafer, the material frame horizontal conveying station realizes the horizontal conveying of the material frame, the slitting and flipping station completes the slitting and vertical feeding conveying, the silicon wafer horizontal conveying station completes the horizontal conveying of silicon wafers, the wafer insertion station completes the wafer insertion, and the cleaning and drying station completes the cleaning and drying of silicon wafers. This silicon wafer production line realizes full-process automation of silicon wafers, improving the reliability and efficiency of silicon wafer conveying, slitting, feeding, and insertion operations.

[0039] Other features and advantages of the present invention will become clearer after reading the detailed embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a simplified structural layout diagram of a silicon wafer production line according to an embodiment;

[0042] Figure 2 This is a structural schematic diagram of the frame and material frame conveying module according to an embodiment;

[0043] Figure 3 This is a schematic diagram of the material frame conveying module according to an embodiment;

[0044] Figure 4 This is a schematic diagram of the segmentation module according to an embodiment;

[0045] Figure 5 This is a schematic diagram of the structure of the flipping auxiliary part according to an embodiment;

[0046] Figure 6 This is a schematic diagram of the slicing module and the flipping auxiliary part according to an embodiment;

[0047] Figure 7 This is a structural schematic diagram of the slicing module, the flipping conveying module, and the horizontal conveying module according to an embodiment;

[0048] Figure 8 This is a schematic diagram of the cleaning unit according to an embodiment;

[0049] Figure 9 This is a schematic diagram showing the relative positions of the cleaning section and the coated roller according to an embodiment;

[0050] Figure 10 This is a schematic diagram of the silicon wafer inspection module according to an embodiment;

[0051] Figure 11 This is one of the structural schematic diagrams of the material frame and transfer trolley according to an embodiment;

[0052] Figure 12 This is a second schematic diagram of the material frame and transfer trolley according to an embodiment;

[0053] Figure 13 for Figure 12 Enlarged view of section A in the middle;

[0054] Figure 14 This is a schematic diagram of the structure of the feed frame and silicon wafer unit according to an embodiment;

[0055] Figure 15 This is a schematic diagram of the upper frame according to an embodiment;

[0056] Figure 16 This is a schematic diagram of the lower frame structure according to an embodiment;

[0057] Figure 17 This is a schematic diagram of the clamping assembly and the lower frame according to an embodiment;

[0058] Figure 18 This is a schematic diagram of the clamping assembly according to an embodiment;

[0059] Figure 19 for Figure 18 Sectional view along line AA;

[0060] Figure 20 for Figure 18 Sectional view along the BB direction;

[0061] Figure 21 This is a schematic diagram of the clamping part according to an embodiment;

[0062] Figure 22 for Figure 14 Enlarged view of section B in the middle;

[0063] Figure 23 This is a schematic diagram of the unlocking device according to an embodiment;

[0064] Figure 24 This is a schematic diagram of the anti-tipping assembly according to an embodiment;

[0065] Figure 25 This is a schematic diagram of the transfer cart according to an embodiment;

[0066] Figure 26 This is a cross-sectional view of the transfer trolley according to an embodiment;

[0067] Figure 27 This is a schematic diagram of the structure of a silicon wafer unit according to an embodiment. Detailed Implementation

[0068] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0069] This embodiment discloses a silicon wafer production line, referring to... Figure 1 The process includes silicon wafer cutting, debinding, slitting, loading, cleaning, and drying.

[0070] The silicon wafer production line includes a cutting station 11, a debinding station 17, a material frame horizontal conveying station 12, a wafer flipping station 13, a silicon wafer horizontal conveying station 14, a wafer insertion station 15, and a cleaning and drying station 16.

[0071] Cutting station 11 completes silicon rod cutting; debinding station 17 completes the debinding and separation of crystal trays and silicon wafers; material frame horizontal conveying station 12 realizes horizontal conveying of material frames; slitting and flipping station 13 completes slitting and vertical feeding conveying; silicon wafer horizontal conveying station 14 completes horizontal conveying of silicon wafers; wafer insertion station 16 completes silicon wafer insertion; and cleaning and drying station 16 completes silicon wafer cleaning and drying.

[0072] The material frame horizontal conveying station 12, the wafer flipping station 13, the silicon wafer horizontal conveying station 14, and the wafer insertion station 15 are arranged in sequence along the same straight line and integrated into a single machine structure to realize the automatic conveying of silicon wafers.

[0073] The cutting station 11 is equipped with slicing equipment, such as a wire cutter, used to cut silicon rods into silicon wafers. After the silicon rods are cut, the silicon wafers 120 are bonded to the wafer holder 110 via resin plates, and are referred to as silicon wafer units 100. Figure 27 As shown, the multiple silicon wafers 120 are divided into multiple silicon wafer groups 121. Figure 27 The two adjacent silicon wafer groups 121 are separated by a dashed line. The wafer holder 110 and the silicon wafer 120 are loaded into the material frame, and the material frame is transferred to the debonding station 17 by a transfer trolley.

[0074] The debonding station 17 is equipped with a debonding device, which is used to separate the crystal tray and the silicon wafer. The silicon wafer remains in the material frame and is then conveyed to the next process by the material frame.

[0075] The material frame horizontal conveying station 12 is equipped with a material frame conveying module 20, which is used to horizontally convey the material frame to the wafer flipping station 13, that is, to convey the debonded silicon wafer to the next station.

[0076] The wafer slicing and flipping station 13 is equipped with a wafer slicing module 30 and a flipping conveyor module 40. The wafer slicing module 30 is used to slice the silicon wafers in the material frame and convey the sliced ​​silicon wafers one by one upward in a vertical position. The flipping conveyor module 40 is used to receive the vertical silicon wafers conveyed by the wafer slicing module 30 and flip the silicon wafers from a vertical position to a horizontal position.

[0077] The silicon wafer horizontal conveying station 14 is equipped with a horizontal conveying module 50, which is used to receive the horizontally oriented silicon wafers conveyed by the flip conveying module 40 and convey the silicon wafers to the insertion station 15 in a horizontal orientation.

[0078] The wafer insertion station 15 is equipped with a flower basket for inserting silicon wafers conveyed by the horizontal conveyor module 50.

[0079] The cleaning and drying station 16 is equipped with cleaning and drying equipment for cleaning and drying silicon wafers after insertion.

[0080] This silicon wafer production line automates the entire silicon wafer process, improving the reliability and efficiency of operations such as wafer conveying, slicing, loading, and insertion.

[0081] Reference Figures 1 to 7 The material frame horizontal conveying station 12, the wafer flipping station 13, the silicon wafer horizontal conveying station 14, and the wafer insertion station 15 are arranged in sequence along the same straight line and integrated into a single machine structure, which is called silicon wafer feeding and conveying device 1. It consists of a frame 10, a material frame conveying module 20, a wafer splitting module 30, a flipping conveying module 40, a horizontal conveying module 50, and a wafer insertion module 60.

[0082] The frame 10 forms the framework of the entire feeding and conveying device, serving as the mounting carrier for other functional modules. The material frame conveying module 20, the wafer splitting module 30, the flipping conveying module 40, the horizontal conveying module 50, and the wafer insertion module 60 are arranged sequentially along the length of the frame 10. The linear arrangement of the functional modules facilitates the transfer of silicon wafers between modules.

[0083] The rack 10 forms a water tank with an open top. The rack 10 also serves as a water container, on the one hand, to catch the liquid dripping from the silicon wafer, and on the other hand, to provide water for functional modules that require water, such as the flip-conveyor module 40.

[0084] The structure of the material frame 200 is as follows Figure 17 As shown, the multiple silicon wafers in the material frame 200 are divided into multiple silicon wafer groups 121, and one end of the material frame 200 is provided with a discharge port 214 for discharging silicon wafers 120.

[0085] The structure of the material frame conveying module 20 is as follows: Figure 2 and Figure 3 As shown, the material frame conveying module 20 is used to convey the material frame 200 to the slicing module 30. After the silicon ingot is cut on the slicing equipment, as... Figure 27The silicon wafer 120 and the wafer holder 110 are placed together in the material frame 200. The material frame 200 is transferred from the cutting station 11 to the debonding station 17 by a transfer device (such as a transfer trolley). At the debonding station 17, the wafer holder is separated from the silicon wafer, and the silicon wafer remains in the material frame. The material frame 200 is then transported to the material frame conveying module 20 by auxiliary equipment such as a robot. The material frame conveying module 20 automatically conveys the material frame 200 to the downstream slicing module 30 to slice the silicon wafers in the material frame 200, so as to facilitate the subsequent silicon wafer loading operation.

[0086] The structure of the fragmentation module 30 is as follows: Figure 4 As shown, the slicing module 30 includes a water spraying section 31 and a vertical conveying section 32. The water spraying section 31 is used to spray water onto the silicon wafers 120 in the material frame 200 in units of silicon wafer groups 121 to slice multiple silicon wafers in the silicon wafer group 121. The vertical conveying section 32 is used to convey the slicing silicon wafers one by one in a vertical posture upward.

[0087] The structure of the flip conveyor module 40 is as follows Figures 5 to 7 As shown, the flipping conveyor module 40 is used to receive the vertically oriented silicon wafers conveyed by the vertical conveyor section 32 and flip the silicon wafers from a vertical orientation to a horizontal orientation.

[0088] Reference Figure 7 The horizontal conveying module 50 is used to receive the horizontally oriented silicon wafers conveyed by the flip conveying module 40 and convey the silicon wafers to the intercalation module 60 in a horizontal orientation.

[0089] The insertion module 60 is used to insert silicon wafers delivered by the horizontal conveying module 50.

[0090] In the silicon wafer feeding and conveying device 1 of this embodiment, the material frame conveying module 20, the wafer slicing module 30, the flipping conveying module 40, the horizontal conveying module 50, and the wafer insertion module 60 are arranged in a straight line, facilitating the automatic transfer of silicon wafers between the modules. This feeding and conveying device integrates the above functions into a single structure, which is novel and compact, realizing automatic wafer slicing, flipping, and insertion, greatly improving work efficiency and enhancing the quality and reliability of silicon wafers during operation.

[0091] Regarding the specific structure of the material frame conveying module 20, in some embodiments, refer to Figure 2 and Figure 3 The material frame conveying module 20 includes a conveying track 21, a moving frame 22, and a drive mechanism 23. The conveying track 21 is located at the bottom of the water tank and extends along the length of the water tank. The drive mechanism 23 is used to drive the moving frame 22 to move along the length of the water tank. The moving frame 22 is connected to the material frame 200 to drive the material frame 200 to move synchronously.

[0092] The material frame 200 is located on the conveying track 21. The drive mechanism 23 is started, driving the moving frame 22 to move along the length of the water tank. The moving frame 22 drives the material frame to move synchronously with it.

[0093] Furthermore, there are two conveying tracks 21, which are arranged opposite to each other. Each conveying track 21 includes a transverse bearing portion 2101 and a vertical limiting portion 2102. The material frame 200 is located on the transverse bearing portion 2101 and moves along the transverse bearing portion 2101. The vertical limiting portion 2102 is located on the side of the material frame 200 and limits the material frame 200 to prevent it from falling off the transverse bearing portion 2101.

[0094] Furthermore, a roller 2103 is provided on the transverse bearing part 2101. The roller 2103 makes rolling contact with the bottom of the material frame 200, thereby reducing the moving friction of the material frame 200.

[0095] Furthermore, the distance between the two vertical limiting parts 2102 is adjustable to accommodate material frames 200 of different widths.

[0096] The adjustment structure between the two vertical limiting parts 2102 can be implemented using common mechanical structures such as lead screws and bolts, and this embodiment does not impose specific limitations.

[0097] Furthermore, the drive mechanism 23 includes a drive motor 2301, which drives the drive shaft 2303 to rotate via a first drive belt 2302. The drive shaft 2303 drives the second drive belt 2304 to rotate. The second drive belt 2304 extends along the length of the water tank, and the movable frame 22 is connected to the second drive belt 2304.

[0098] When the drive motor 2301 starts, it drives the first transmission belt 2302 to rotate, which in turn drives the transmission shaft 2303 to rotate. The transmission shaft 2303 then drives the second transmission belt 2304 to rotate, which in turn drives the movable frame 22 to move synchronously. The movable frame 22 then drives the material frame 200 to move synchronously.

[0099] Furthermore, there are two second transmission belts 2304, each of which is located on the top of the corresponding side of the frame 10. The movable frame 22 has a U-shaped frame structure, including a movable horizontal part 2201 and a movable vertical part 2202. The movable vertical part 2202 is provided at both ends of the movable horizontal part 2201, and the top of the movable vertical part 2202 is fixedly connected to the second transmission belt 2304 on the corresponding side.

[0100] from Figure 2As can be seen, the drive motor 2301, the first transmission belt 2302, the transmission shaft 2303, and the second transmission belt 2304 are located outside the frame 10 and do not occupy the internal space of the frame 10 or the placement space of the material frame 200. The moving frame 22 is located inside the frame 10, which facilitates connection with the material frame 200 to drive the material frame to move synchronously.

[0101] Furthermore, the moving transverse part 2201 is provided with a limiting structure for limiting the material frame 200. The detachable connection between the limiting structure and the material frame 200 facilitates the connection between the material frame 200 and the limiting structure so that the material frame 200 moves synchronously with the moving frame 22, and also facilitates the separation of the material frame 200 from the limiting structure.

[0102] In one specific embodiment, reference is made to Figure 3 The limiting structure is a protruding column 2203 provided on the moving horizontal part 2201, and correspondingly, refer to Figure 14 The outer side of one end of the material frame is provided with a mating hole. When the material frame is placed into the frame 10 from top to bottom, the protruding column 2203 is inserted into the mating hole 216 to realize the connection and mating between the material frame 200 and the moving frame 22.

[0103] For the specific structure of the segmentation module 30, refer to... Figure 4 The vertical conveying unit 32 includes a first mounting frame 3201, on which an adsorption part and a vertical conveyor belt 3202 are provided. The adsorption part is used to adsorb the silicon wafers after slicing onto the vertical conveyor belt 3202, and the vertical conveyor belt 3202 drives the silicon wafers to move upward in a vertical posture.

[0104] The adsorption unit adsorbs the slicing silicon wafers 120 from the material frame 200 and places them onto the vertical conveyor belt 3202. The vertical conveyor belt 3202 then drives the silicon wafers 120 to move upward. Through the cooperation between the adsorption unit and the vertical conveyor belt 3202, the silicon wafers in the material frame 200 are conveyed upward one by one.

[0105] Furthermore, the adsorption section includes an adsorption region 3203 and an auxiliary conveying region 3204. The auxiliary conveying region 3204 is located above and below the adsorption region 3203. The adsorption region 3203 is used to provide adsorption force to the silicon wafer to adsorb the silicon wafer onto the vertical conveyor belt 3202. The auxiliary conveying region 3204 makes rolling contact with the silicon wafer to assist the silicon wafer in moving upward in a vertical posture.

[0106] The adsorption area 3203 is directly opposite the silicon wafer to smoothly adsorb the silicon wafer in the material frame 200 onto the vertical conveyor belt 3202. The auxiliary conveying areas 3204, which are arranged at intervals, roll in contact with the upper and lower parts of the silicon wafer, and play an auxiliary role in the vertical upward movement of the silicon wafer.

[0107] Furthermore, the adsorption area 3203 is a water absorption plate 3205, and the water absorption plate 3205 is provided with a plurality of spaced water absorption holes 3206. The water absorption plate 3205 is connected to a water absorption channel (not shown). Under the suction force of the water absorption channel, the liquid on the silicon wafer is drawn into the water absorption channel through the water absorption holes 3206, and the silicon wafer is adsorbed onto the surface of the vertical conveyor belt 3202.

[0108] Furthermore, the vertical conveyor belt 3202 is positioned directly opposite the adsorption region 3203, which facilitates the direct adsorption of the silicon wafer onto the surface of the vertical conveyor belt 3202 under the action of the adsorption region 3203.

[0109] Furthermore, the auxiliary conveying area 3204 includes multiple follower rollers 3207, which make rolling contact with the silicon wafer.

[0110] Furthermore, the vertical conveyor belt 3202 is driven by the drive mechanism 23, which includes a motor 3208, a synchronous belt 3209, and a rotating shaft 3210. The synchronous belt 3209 is connected between the power output end of the motor 3208 and the rotating shaft 3210, and the rotating shaft 3210 is connected to the vertical conveyor belt 3202 to drive the vertical conveyor belt 3202 to rotate.

[0111] The motor 3208 and the synchronous belt 3209 are located beside the adsorption area 3203 and the auxiliary conveying area 3204, and do not interfere with the upward transport of the silicon wafer.

[0112] Furthermore, there are multiple vertical conveyor belts 3202, such as two, arranged at intervals along the width direction of the adsorption section. These multiple vertical conveyor belts 3202 are driven by the same rotating shaft 3210, ensuring the consistency of their movement. The spaced arrangement of the multiple vertical conveyor belts 3202 helps improve the reliability of upward transport of the silicon wafers.

[0113] Furthermore, the first mounting bracket 3201 is provided with a water spraying section 31, which is located on opposite sides of the vertical conveying section 32. Water is sprayed simultaneously from both sides of the silicon wafer to improve the reliability of silicon wafer slicing.

[0114] Furthermore, two water spray sections 31 are arranged vertically and horizontally on each side of the vertical conveying section 32 to spray water on both the upper and lower parts of the silicon wafer, thereby further improving the reliability of silicon wafer slab separation.

[0115] Regarding the specific structure of the flipping conveyor module 40, in some embodiments, refer to Figures 5 to 7 The flipping conveyor module 40 includes a flipping auxiliary part 41 and a rubber-coated roller 42.

[0116] Flipping auxiliary part 41 Figure 5As shown, it includes a second mounting bracket 4101, on which an air blowing part 4102 is provided, and then combined with Figure 6 The air blowing section 4102 is located above the vertical conveying section 32. The air blowing section 4102 is used to blow air onto the vertical silicon wafer that is conveyed upward by the vertical conveying section 32, so that the silicon wafer tilts onto the adhesive roller 42, and the adhesive roller 42 drives the silicon wafer to move to a horizontal position.

[0117] The air blowing unit 4102 and the adhesive-coated roller 42 work together to change the vertical upward conveying of silicon wafers to horizontal conveying. The air blowing unit 4102 tilts the silicon wafers onto the adhesive-coated roller 42, and the rotation of the adhesive-coated roller 42 then moves the tilted silicon wafers to a horizontal position.

[0118] The rubber-coated roller 42 can be a metal roller with a rubber-coated structure, or it can be a metal roller and a non-metal roller nested with a circular rubber sleeve.

[0119] Furthermore, the second mounting frame 4101 is also provided with a sub-frame 4105, and a pressure roller 4106 is provided on the sub-frame 4105. The pressure roller 4106 is located in front of the vertical conveying section 32 and is used to press the silicon wafer against the vertical conveying section 32 to prevent the silicon wafer from tilting backward and to ensure that the silicon wafer is reliably tilted onto the adhesive-coated roller 42.

[0120] Furthermore, the sub-frame 4105 is rotatably connected to the mounting frame, and the pressure roller 4106 is a floating roller to prevent the pressure roller 4106 from damaging the silicon wafer.

[0121] Furthermore, there are multiple pressure rollers 4106, which are arranged at intervals in the horizontal direction to apply a uniform force to the silicon wafer.

[0122] Furthermore, the air blowing section 4102 includes an air blowing plate 4103, on which a plurality of air blowing holes 4104 are arranged at intervals, and the air blowing plate 4103 is connected to an air blowing passage (not shown).

[0123] Furthermore, the flipping conveyor module 40 also includes a cleaning unit 43, which is used to periodically clean the rubber-coated rollers 42. (See reference...) Figure 8 and Figure 9 Along the horizontal conveying direction of the silicon wafer, the cleaning section 43 is located behind the adhesive-coated roller 42 and below the horizontal conveying module 50.

[0124] The cleaning unit 43 includes a cylinder 4303, a cleaning frame 4302, and a sponge block 4301. The cleaning frame 4302 is located at the power output end of the cylinder 4303, and the sponge block 4301 is located on the cleaning frame 4302. When the coated roller 42 needs to be cleaned, the cylinder 4303 is activated, driving the cleaning frame 4302 to move towards the coated roller 42 until the sponge block 4301 contacts the coated roller 42. As the coated roller 42 rotates, the sponge block 4301 cleans the coated roller 42 in its entire circumference. After cleaning, the sponge block 4301 retracts away from the coated roller 42.

[0125] Regarding the specific structure of the horizontal conveying module 50, in some embodiments, refer to... Figure 7 The horizontal conveying module 50 includes a horizontal conveyor belt group 51. The drive mechanism 23 of the horizontal conveyor belt group 51 is not shown. The horizontally oriented silicon wafers, which are conveyed by the adhesive-coated rollers 42, move onto the horizontal conveyor belt group 51 and are then carried by the horizontal conveyor belt group 51 to continue to be conveyed horizontally to the subsequent insertion station.

[0126] The coated roller 42 has an annular groove 4201 along its circumference. The horizontal conveyor belt 51 has a portion extending into the groove 4201 to receive the horizontally oriented silicon wafers conveyed by the coated roller 42, thereby achieving smooth transmission of the silicon wafers between the coated roller 42 and the horizontal conveyor belt 51.

[0127] Further, continue to refer to Figure 7 The horizontal conveying module 50 also includes two opposing baffles 52. The baffles 52 extend along the horizontal conveying direction of the silicon wafer. One end of the baffle 52 is located next to the adhesive-coated roller 42, which plays a left and right limiting role in the horizontal conveying of the silicon wafer.

[0128] In some embodiments, the silicon wafer feeding and conveying device 1 further includes a silicon wafer detection module 70, such as... Figure 10 As shown, it includes a lifting frame 71, a tilting frame 72, and a lifting drive unit 75. The lifting drive unit 75 drives the lifting frame 71 to move up and down. The tilting frame 72 is rotatably connected to the lifting frame 71. The bottom of the tilting frame 72 is provided with a rolling wheel 73. The lifting frame 71 is provided with a sensor 74, such as a photoelectric sensor.

[0129] The silicon wafer detection module 70 is located in front of the slicing module 30. The material frame conveying module 20 horizontally conveys the material frame 200 towards the slicing module 30 until the silicon wafer in the material frame 200 touches the rolling wheel 73 on the silicon wafer detection module 70. As the material frame 200 continues to move forward, the flipping frame 72 flips. At this time, the sensor 74 will detect the flipping action of the flipping frame 72. The system knows that the silicon wafer has been conveyed to the correct position. Then, the lifting drive unit 75 drives the lifting frame 71 to rise. The lifting frame 71 drives the flipping frame 72 and the rolling wheel 73 to rise synchronously to the top of the silicon wafer so as not to affect the subsequent slicing and loading operations of the silicon wafer. The slicing module 30 is started to spray water and vertically convey the silicon wafer.

[0130] Regarding the specific structure of the material frame 200, in some embodiments, refer to Figures 14 to 17 The frame 210 of the material frame 200 includes an upper frame 211 and a lower frame 212, and the upper frame 211 and the lower frame 212 are detachably connected. Figure 15 The image shows the upper frame 211. Figure 16 The lower frame 212 is shown. Figure 17 The structure shown is that the clamping assembly 220 and the anti-tipping assembly 240 are mounted on the lower frame 212.

[0131] The lower frame 212 forms a holding space 213 for holding silicon wafers 120. The top of the holding space 213 is open, and one end of the lower frame 212 is provided with a discharge port 214 that communicates with the holding space 213.

[0132] The upper frame 211 is detachably mounted on top of the lower frame 212. The upper frame 211 has an opening 2113 that communicates vertically with the holding space 213. The silicon wafer unit 100 is inserted into the holding space 213 below through the opening 2113. The upper frame 211 has a limiting structure for limiting the position of the crystal holder 110, ensuring the stability of the silicon wafer unit 100 within the material frame 200. The lower frame 212 has a clamping assembly 220 for limiting the position of the silicon wafer 120.

[0133] The upper frame 211 is moved away from the lower frame 212 to separate the crystal tray 110 from the silicon wafer 120. The silicon wafer 120 remains in the lower frame 212. The material frame conveying module 20 conveys the lower frame 212 to the slitting module 30. Specifically, after the material frame 200 reaches the debonding station 17, the upper frame 211 is moved away from the lower frame 212 by the debonding equipment. Since there is a limiting connection between the upper frame 211 and the crystal tray 110, and the silicon wafer 120 below is clamped by the clamping component 220, when the upper frame 211 moves away from the lower frame 212, the upper frame 211, along with the crystal tray 110, detaches from the silicon wafer 120, thus achieving the debonding and separation of the crystal tray 110 and the silicon wafer 120.

[0134] In this embodiment, the upper and lower split structure of the material frame 200, combined with the clamping component 220 in the lower frame 212 clamping the silicon wafer 120 and the upper frame 211 limiting and fixing the crystal holder 110, can achieve the separation of the crystal holder 110 and the silicon wafer 120 by separating the upper frame 211 and the lower frame 212.

[0135] Furthermore, refer to Figure 14 , Figure 15 as well as Figure 27 The front and rear ends of the crystal holder 110 unit are respectively provided with extensions 111, and the upper frame 211 is provided with two spaced protrusions 2115 on the corresponding side. The extensions 111 are engaged between the two protrusions 2115 to limit and fix the crystal holder 110.

[0136] Furthermore, the upper frame 211 includes two opposing upper frame first supports 2111 and two opposing upper frame second supports 2112. The upper frame first supports 2111 extend along the length direction L of the material frame 200, and the upper frame second supports 2112 extend along the width direction W of the material frame 200. Two spaced-apart support frames 2114 are provided between the two upper frame first supports 2111, and there is a certain distance between the support frames 2114 and the corresponding upper frame second supports 2112. The support frames 2114 are provided with protrusions 2115.

[0137] Furthermore, the lower frame 212 includes two oppositely arranged lower frame first supports 2121 and two oppositely arranged lower frame second supports 2122. The lower frame second supports 2122 include a lower frame transverse frame 2123. The lower frame transverse frame 2123 is provided with a lower frame vertical frame 2124 at opposite ends. The lower frame first supports 2121 extend along the length direction K of the material frame 200, the lower frame transverse frame 2123 extends along the width direction W of the material frame 200, and the lower frame vertical frame 2124 extends along the height direction of the material frame 200.

[0138] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to achieve a detachable connection between the upper frame 211 and the lower frame 212.

[0139] Furthermore, refer to Figures 14 to 16 The upper frame 211 has an upper limit block 2116 at its bottom, and the lower frame vertical frame 2124 has a lower limit block 2126 at its top. The upper limit block 2116 and the lower limit block 2126 are fitted together by a concave-convex structure to achieve the cooperation between the upper frame 211 and the lower frame 212. For example, the upper limit block 2116 has a concave shape, and the lower limit block 2126 has a convex shape, with the concave shape and the convex shape fitting together.

[0140] In other embodiments, the upper frame 211 and the lower frame 212 can be detachably connected by bolts, pins, or other means.

[0141] Furthermore, refer to Figure 15 The outer side of the upper frame 211 is provided with an upper gripping part 2117, which is used by external force to grip and separate the upper frame 211 from the lower frame 212.

[0142] Reference Figure 16 The outer side of the lower frame 212 is provided with a lower gripping part 2127, which is used by external force to grip and transfer the material frame 200.

[0143] Furthermore, the bottom of the lower frame 212 is provided with support rollers 215, which are spaced apart along the width direction W of the material frame 200, and the support rollers 215 abut against the bottom of the silicon wafer 120.

[0144] The gap between two adjacent support rollers 215 allows water on the silicon wafer 120 to drip downwards.

[0145] In some embodiments, refer to Figure 14 , Figure 17 and Figure 18 The clamping assembly 220 is used to clamp the silicon wafer unit 100. On the one hand, the clamping assembly 220 can clamp the entire silicon wafer unit 100 at the same time; on the other hand, the clamping assembly 220 can independently unlock each silicon wafer group 121.

[0146] Two clamping assemblies 220 are located on opposite sides of the housing space 213 to clamp opposite sides of the silicon wafer unit 100.

[0147] The clamping assembly 220 includes a plurality of clamping portions 222 arranged sequentially along the length direction of the holding space 213 (i.e., the length direction L of the material frame 200). Each clamping portion 222 corresponds to a plurality of silicon wafer groups 121 to clamp the corresponding silicon wafer group 121. Each clamping portion 222 moves away from the silicon wafer 120 to release the clamping of the corresponding silicon wafer group 121.

[0148] In other words, each silicon wafer group 121 is clamped by a corresponding clamping part 222. When all clamping parts 222 clamp the corresponding silicon wafer group 121, the entire silicon wafer unit 100 is clamped. When it is necessary to load the silicon wafer unit 100 in units of silicon wafer group 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in units of silicon wafer group 121, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. This ensures the stability of the remaining unloaded silicon wafer groups 121 within the material frame 200, prevents the silicon wafers 120 from tipping over or squeezing each other, avoids damage to the silicon wafers 120, and ensures the quality of the silicon wafers 120.

[0149] The clamping part 222 unlocks the silicon wafer assembly 121 through the interaction between the unlocking device 300 and the clamping part 222. Specifically, the unlocking device 300 is located on the inner side wall of the frame 10, close to the slitting module 30. When the material frame conveying module 20 conveys the lower frame 212 horizontally toward the unlocking device 300, multiple clamping parts 222 sequentially contact the unlocking device 300 as the material frame 200 and the unlocking device 300 move relative to each other. The unlocking device 300 applies external force to the clamping part 222 to move the clamping part 222 away from the corresponding silicon wafer assembly 121, thus releasing the clamping of the silicon wafer assembly 121.

[0150] In this embodiment, the material frame 200 simultaneously clamps the corresponding silicon wafer groups 121 through multiple clamping parts 222 on the clamping assembly 220 to achieve clamping of all silicon wafers. At the same time, the unlocking of each clamping part 222 on the silicon wafer group 121 is independent of each other. The unlocking device 300 unlocks each clamping part 222 sequentially, that is, the unlocking of each silicon wafer group 121 is independent of each other. In this way, when it is necessary to load the silicon wafer unit 100 in units of silicon wafer groups 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in units of silicon wafer groups 121, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. This can ensure the stability of the remaining unloaded silicon wafer groups 121 in the material frame 200, prevent the silicon wafers 120 from tilting or squeezing each other, avoid damage to the silicon wafers 120, and ensure the quality of the silicon wafers 120.

[0151] In some embodiments, refer to Figure 20 The clamping part 222 includes a second pin 2221, which passes through the frame 210 and can move in the direction of passing through the frame 210. The first end of the second pin 2221 is provided with an unlocking block 2223, and the second end of the second pin 2221 is provided with a clamping block 2222. A spring 2229 is sleeved on the second pin 2221 and is located between the clamping block 2222 and the frame 210.

[0152] Under the action of the unlocking device 300, each unlocking block 2223 moves away from the silicon wafer unit 100, causing the corresponding clamping block 2222 to move away from the corresponding silicon wafer group 121, thereby unlocking the corresponding silicon wafer group 121.

[0153] The clamping block 2222 moves toward the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0154] In some embodiments, the cooperation structure between the unlocking device 300 and the clamping part 222 is as follows, see reference Figures 20 to 23 :

[0155] The unlocking block 2223 includes a horizontal portion 2225 and a vertical portion 2226, which are integrally structured. The horizontal portion 2225 is used to abut against the movable plate 221, and the vertical portion 2226 is used to interact with the unlocking device 300. Specifically, one end of the horizontal portion 2225 is connected to the second pin 2221, and a step portion 2228 is formed between the horizontal portion 2225 and the second pin 2221. The other end of the horizontal portion 2225 is connected to the vertical portion 2226.

[0156] There is a certain distance between the vertical part 2226 and the movable plate 221. The vertical part 2226 has an inclined surface 2227 on the side facing the frame 210. Along the discharge direction of the silicon wafer 120, the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0157] The unlocking device 300 includes a first roller 320. When relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves to the space between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin 2221 moves away from the silicon wafer 120.

[0158] Specifically, the unlocking device 300 is located on the horizontal conveying station 12 of the material frame, specifically fixed on the inner side wall of the frame 10. Two clamping components 220 are provided on the corresponding material frame 200, and two unlocking devices 300 are also provided. Each unlocking device 300 is used to interact with the clamping component 220 on the corresponding side. When the silicon wafers 120 in the material frame 200 need to be slicing into wafer groups 121, the material frame 200 moves horizontally under the action of the material frame conveying module 20. The material frame 200 and the unlocking device 300 generate relative movement. Along the movement direction of the material frame 200, each clamping part 222 contacts the unlocking device 300 one by one. The first roller 320 moves to the space between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin 2221 moves away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, so that the device at the subsequent station can perform slicing operation on the unlocked silicon wafer group 121.

[0159] Furthermore, the vertical portion 2226 is provided with two inclined surfaces 2227, one of which is located above the horizontal portion 2225, and the other is located below the horizontal portion 2225. The unlocking device 300 also includes a U-shaped first mounting bracket 310, with first rollers 320 respectively provided on its upper and lower walls. The first rollers 320 contact the inclined surfaces 2227 on the corresponding sides. This improves the unlocking effect of the unlocking device 300 on the clamping portion 222 and enhances the reliability of unlocking.

[0160] In some embodiments, the clamping assembly 220 further includes a movable plate 221 that extends along the length of the holding space 213, and a plurality of clamping parts 222 are arranged sequentially along the length of the movable plate 221.

[0161] When the movable plate 221 moves away from the container space 213 under the action of external force, the movable plate 221 drives all the clamping parts 222 on it to move away from the container space 213 in a synchronous manner, thereby increasing the distance between the two clamping components 220, which makes it easier for the silicon wafer to be installed into the container space 213 from top to bottom.

[0162] Furthermore, the movable panel 221 is located on the outside of the frame 210, specifically, see [reference needed]. Figure 16 and Figure 20 The lower frame 212 includes two opposing transverse frames 2125, which extend along the length of the holding space 213. A movable plate 221 is located outside the transverse frames 2125, and a second pin 2221 passes through the transverse frames 2125 and the movable plate 221. When the movable plate 221 moves away from the holding space 213 under external force, it pushes all the unlocking blocks 2223 to move synchronously away from the holding space 213, causing all the clamping blocks 2222 to move away from the holding space 213. Specifically, a step 2228 is formed between the unlocking block 2223 and the second pin 2221. When the movable plate 221 moves away from the holding space 213, the movable plate 221 abuts against the step 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin 2221 and the clamping block 2222 to move synchronously away from the holding space 213, and the spring 2229 is compressed.

[0163] After the external force on the movable plate 221 disappears, the clamping block 2222 moves toward the silicon wafer 120 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0164] Furthermore, the transverse frame 2125 is provided with a second limiting shaft 223, and the second pin 2221 is provided with a second elongated through hole 2224. The second limiting shaft 223 passes through the second elongated through hole 2224 and plays a role in preventing the second pin 2221 from rotating.

[0165] In some embodiments, refer to Figure 14 and Figure 24 The material frame 200 also includes an anti-tipping component 240, which is used to abut and support the silicon wafer 120. The anti-tipping component 240 is located at the end away from the discharge port 214. When the transfer trolley 400 pushes the material frame 200 forward, the silicon wafer 120 has a tendency to tilt backward (i.e., in the opposite direction to the movement of the material frame 100). By abutting the silicon wafer 120 with the anti-tipping component 240, the silicon wafer 120 is prevented from tilting.

[0166] The anti-tipping assembly 240 includes a second mounting bracket 241 and second rollers 242 mounted on the second mounting bracket 241. The second mounting bracket 241 is mounted on the frame 210, and the second rollers 242 are used to abut against the silicon wafer 120. Multiple second rollers 242 are spaced apart in the vertical direction, such as two, providing multiple points of contact with the silicon wafer 120 in the vertical direction, thereby improving the reliability of the anti-tipping mechanism.

[0167] Furthermore, the second mounting frame 241 includes a fixed frame 2411 and a movable frame 2412. The fixed frame 2411 is fixedly mounted on the frame 210, and the movable frame 2412 is rotatably connected to the fixed frame 2411. A torsion spring 2413 is provided between the movable frame 2412 and the fixed frame 2411, and a second roller 242 is mounted on the movable frame 2412. The rotation of the movable frame 2412 relative to the fixed frame 2411 accommodates the bumps generated during the transportation of the material frame 200 and prevents the second roller 242 from rigidly pressing the silicon wafer 120.

[0168] In some embodiments, the material frame 200 further includes an unlocking trigger 230, which includes a first pin 231 that passes through a transverse frame 2125. The first end of the first pin 231 is fixedly connected to a movable plate 221, and the second end of the first pin 231 is used to receive external force so that the first pin 231 moves along its passing direction in the transverse frame 2125, thereby driving the movable plate 221 to move synchronously away from the holding space 213. The movable plate 221 then drives all clamping parts 222 to move synchronously away from the holding space 213. In this way, the distance between the two clamping components 220 arranged opposite to each other increases, making it easier for the silicon wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0169] In some embodiments, the material frame 200 is transferred between the cutting station 11 and the degumming station 17 by a transfer trolley 400. (Refer to...) Figure 11 and Figure 12First, place the material frame 200 on the transfer trolley 400, then place the cut silicon wafer unit 100 into the material frame 200, and the transfer trolley 400 will transfer the material frame 200 to the debonding station 17.

[0170] Structural reference of transfer trolley 400 Figure 25 and Figure 26 The 400 transfer trolleys and 200 material frames serve functions such as storage, limiting, and transportation.

[0171] The transfer trolley 400 is equipped with an unlocking part 410, which interacts with the unlocking trigger part 230 on the material frame 200 to provide external force to the unlocking trigger part 230. Specifically, after the material frame 200 is placed on the transfer trolley 400, the unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to move. Under the action of the unlocking trigger part 230, the movable plate 221 moves away from the holding space 213. The movable plate 221 drives the multiple clamping parts 222 provided on it to move synchronously away from the holding space 213.

[0172] In application, before placing the silicon wafer unit 100 into the material frame 200, the material frame 200 is first placed on the transfer trolley 400. At this time, the unlocking part 410 contacts the unlocking trigger part 230. The effect achieved is that the movable plate 221 moves away from the holding space 213 under the action of the unlocking trigger part 230. The movable plate 221 drives the multiple clamping parts 222 provided on it to move away from the holding space 213 in a synchronized manner. That is, the distance between the two relative clamping components 220 increases, which makes it easier for the silicon wafer unit 100 to be loaded into the holding space 213 from top to bottom.

[0173] The material frame 200 is provided with a limiting structure to limit the crystal holder 110. By limiting the crystal holder 110 by the material frame 200, the stability of the silicon wafer unit 100 in the material frame 200 is ensured, and the silicon wafer 120 is prevented from tilting or shifting.

[0174] After the silicon wafer unit 100 is placed into the material frame 200, the transfer trolley 400 transports the material frame 200 to the next work station, specifically the debonding station. Upon arrival at the debonding station, the material frame 200 is removed from the transfer trolley 400 by a robotic arm or other equipment. At this time, the unlocking part 410 separates from the unlocking trigger part 230, and the clamping assembly 220 automatically moves towards the silicon wafer unit 100 under the reset force of the reset component, clamping the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be debonded at the debonding station. At this time, the silicon wafer 120 is clamped by the clamping assembly 220, which facilitates the smooth separation of the crystal holder 110 and the silicon wafer 120.

[0175] After the silicon wafer unit 100 is debonded, it is transferred by the material frame 200 to the next work station, where the silicon wafer 120 is slicing into wafer groups 121. The sliced ​​silicon wafers 120 are then easier to insert into subsequent wafers. When slicing the silicon wafer 120 into wafer groups 121, the clamping part 222 releases the clamp on the corresponding wafer group 121. After the unlocked wafer group 121 is slicing and loading, the remaining wafer groups 121 are still clamped by their corresponding clamping parts 222. During this process, the unlocking device 300 and the clamping part 222 work together to unlock the wafer group 121.

[0176] According to the silicon wafer production process, the silicon wafer transfer device, consisting of a material frame and a transfer trolley, is used as follows:

[0177] When transferring the cut silicon wafer unit 100, the material frame 200 is first placed on the transfer trolley 400. The unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to act. All clamping parts 222 move synchronously away from the holding space 213 under the drive of the movable plate 221, so that the silicon wafer unit 100 can be loaded into the holding space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafer 120.

[0178] The material frame 200 is provided with a limiting structure to limit the position of the crystal holder 110, so as to ensure the stability of the silicon wafer unit 100 within the material frame 200.

[0179] After the transfer trolley 400 transfers the material frame 200 to the next work station, the material frame 200 is removed from the transfer trolley 400, the unlocking part 410 and the unlocking trigger part 230 are disengaged, and all clamping parts 222 move toward the direction close to the silicon wafer unit 100 under the action of the reset member to clamp the silicon wafer 120, so as to facilitate the debonding and separation of the crystal holder 110 and the silicon wafer 120.

[0180] The material frame 200 transfers the silicon wafer 120 to the next work station and divides the silicon wafer 120 in the material frame 200 into wafer groups 121 as units. At this time, relative movement occurs between the material frame 200 and the unlocking device 300. Multiple clamping parts 222 come into contact with the unlocking device 300 in sequence as the material frame 200 and the unlocking device 300 move relative to each other. The unlocking device 300 applies external force to the clamping parts 222 to move the clamping parts 222 away from the corresponding wafer groups 121 and release the clamping of the wafer groups 121.

[0181] In this embodiment, the cooperation structure between the transfer trolley 400 and the material frame 200 triggers the clamping mechanism on the material frame 200. On the one hand, when the material frame 200 and the transfer trolley 400 are in cooperation, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafer 120 into the material frame 200. On the other hand, when the material frame 200 and the transfer trolley 400 are separated, the clamping mechanism automatically clamps the silicon wafer 120 as a whole, improving the placement reliability of the silicon wafer 120 during the transfer process and facilitating the subsequent debonding and separation of the crystal tray 110 and the silicon wafer 120. When the silicon wafer 120 is being slab-loaded, the material frame 200 can independently release the clamping of each silicon wafer group 121 through the unlocking device 300, thereby avoiding damage to the silicon wafer 120, reducing manual intervention, and improving work efficiency.

[0182] In some embodiments, a roller (denoted as a third roller 232) is provided at the second end of the first pin 231. See also... Figure 13 , Figure 25 and Figure 26 The unlocking part 410 is a column on the transfer trolley 400. The column has a guide contact surface 411 on the upper end of the side facing the third roller 232. When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guide contact surface 411 to drive the first pin 231 to move away from the holding space 213. Since the first pin 231 is fixedly connected to the movable plate 221, it also drives the movable plate 221 to move away from the holding space 213 in a synchronous manner.

[0183] Furthermore, refer to Figure 26 The guide contact surface 411 includes a first contact surface 4111, a second contact surface 4112, and a third contact surface 4113 from top to bottom. The second contact surface 4112 extends vertically. The first contact surface 4111 extends obliquely from the top of the second contact surface 4112 toward the direction away from the third roller 232. The third contact surface 4113 extends obliquely from the bottom of the second contact surface 4112 toward the direction close to the third roller 232.

[0184] When the material frame 200 is placed onto the transfer trolley 400 from top to bottom, the third roller 232 first contacts the first contact surface 4111. The inclined first contact surface 4111 plays a preliminary positioning role for the placement of the material frame 200. As the material frame 200 continues to fall, the third roller 232 gradually pushes the first pin 231 away from the holding space 213 as it moves along the inclined first contact surface 4111. When the third roller 232 moves to the second contact surface 4112, the outward movement of the first pin 231 stops. As the material frame 200 continues to fall, when the third roller 232 moves to the lower end of the second contact surface 4112, the third contact surface 4113 stops the movement of the third roller 232, and the material frame 200 is placed in place.

[0185] Furthermore, each movable plate 221 is equipped with two unlocking triggers 230, which are located at opposite ends of the movable plate 221. That is, each material frame 200 is equipped with four unlocking triggers 230, and correspondingly, the transfer trolley 400 is equipped with four unlocking triggers 410. Figure 25 As shown. The four unlocking parts 410 serve two purposes: firstly, to contact the corresponding unlocking trigger part 230; and secondly, to guide and pre-position the placement of the material frame 200.

[0186] Furthermore, the transverse frame 2125 is provided with a first limiting shaft 233, and the first pin 231 is provided with a first elongated through hole 234. The first limiting shaft 233 passes through the first elongated through hole 234 and plays a role in preventing the first pin 231 from rotating.

[0187] In some embodiments, refer to Figure 25 and Figure 26 The transfer trolley 400 is provided with a limiting part 420. The limiting part 420 is a limiting protrusion arranged around the material frame 200. The limiting part 420 is used to limit the material frame 200 and ensure the stability of the material frame 200 on the transfer trolley 400.

[0188] Furthermore, the transfer trolley 400 is equipped with a liquid collection tank 430, which is located below the material frame 200. The liquid collection tank 430 is used to collect liquid dripping from the silicon wafer 120. A drain port 440 and a drain valve 450 are provided at the lower part of the liquid collection tank 430 to facilitate liquid drainage.

[0189] Furthermore, the moving front end of the transfer trolley 400 is provided with a positioning unit 460, which is used for positioning the transfer trolley 400 when it moves to a designated position.

[0190] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A silicon wafer production line, characterized in that, include: A material frame is used to hold diced silicon wafers; the material frame includes an upper frame and a lower frame, the upper frame is detachably mounted on top of the lower frame, the upper frame is provided with a limiting structure for limiting the position of the crystal holder, and the lower frame is provided with a clamping assembly for limiting the position of the silicon wafers. The cutting station is equipped with a slicing device, which is used to cut silicon rods into silicon wafers. The cut silicon wafers, together with the crystal trays, are placed into a material frame, which is then transported by a transfer trolley to the debonding station. The debonding station is equipped with debonding equipment for separating the crystal holder from the silicon wafer; A horizontal conveying station for material frames is provided with a material frame conveying module for horizontally conveying the material frames to the slicing and flipping station; The wafer flipping station is equipped with a wafer splitting module and a flipping conveyor module. The wafer splitting module is used to split the silicon wafers in the material frame and convey the split silicon wafers one by one in a vertical position. The flipping conveyor module is used to receive the vertical silicon wafers conveyed by the wafer splitting module and flip the silicon wafers from the vertical position to the horizontal position. A horizontal silicon wafer conveying station is provided with a horizontal conveying module for receiving horizontally oriented silicon wafers conveyed by the flip conveying module and conveying the silicon wafers horizontally to the intercalation station. The wafer insertion station is equipped with a flower basket for inserting silicon wafers transported by the horizontal conveyor module. The cleaning and drying station is used to clean and dry the silicon wafers after insertion. The material frame horizontal conveying station, the wafer flipping station, the silicon wafer horizontal conveying station, and the wafer insertion station are arranged sequentially along the same straight line. The upper frame is moved away from the lower frame to separate the crystal holder from the silicon wafer, with the silicon wafer remaining in the lower frame. The material frame conveying module then conveys the lower frame to the slitting module.

2. The silicon wafer production line according to claim 1, characterized in that, The material frame forms a holding space for holding silicon wafers, and the multiple silicon wafers in the material frame are divided into multiple silicon wafer groups; The material frame is equipped with a clamping component and an unlocking trigger; The clamping assembly includes a movable plate that extends along the length of the holding space. The movable plate has a plurality of clamping parts arranged sequentially along its length. Each of the clamping parts corresponds to a plurality of silicon wafer groups to clamp the corresponding silicon wafer groups. Each clamping part moves away from the silicon wafer to release the clamping of the corresponding silicon wafer group. The unlocking trigger is connected to the movable plate. The transfer trolley is equipped with an unlocking part. After the material frame is placed on the transfer trolley, the unlocking part is triggered to move. Under the action of the unlocking trigger, the movable plate moves away from the holding space. The movable plate drives the multiple clamping parts on it to move synchronously away from the holding space. The material frame is removed from the transfer trolley, the unlocking part disengages from the unlocking trigger part, and the clamping part moves toward the silicon wafer under the action of the reset member to clamp the silicon wafer.

3. The silicon wafer production line according to claim 2, characterized in that, When transferring the cut silicon wafers, the material frame is first placed on the transfer trolley. The unlocking part triggers the unlocking trigger, and all the clamping parts move synchronously away from the holding space under the drive of the movable plate, so that the silicon wafers can be loaded into the holding space from top to bottom. After the transfer trolley transfers the material frame to the debonding station, the material frame is removed from the transfer trolley, the unlocking part disengages from the unlocking trigger part, and the clamping part moves toward the silicon wafer under the action of the reset member to clamp the silicon wafer.

4. The silicon wafer production line according to claim 2, characterized in that, The material frame is equipped with an unlocking device at the horizontal conveying station. When the material frame conveying module drives the material frame to move in the horizontal direction, a relative movement occurs between the material frame and the unlocking device. As the material frame moves relative to the unlocking device, multiple clamping parts sequentially contact the unlocking device. The unlocking device applies an external force to the clamping parts to move the clamping parts away from the corresponding silicon wafer group.

5. The silicon wafer production line according to claim 4, characterized in that, The clamping part includes a second pin, which passes through the material frame and the movable plate. The first end of the second pin is provided with an unlocking block, and the second end of the second pin is provided with a clamping block. A spring is sleeved on the second pin, and the spring is located between the clamping block and the material frame. When the movable plate moves away from the holding space, the movable plate pushes all the unlocking blocks to move synchronously away from the holding space, so that all the clamping blocks move away from the holding space; The clamping block moves toward the silicon wafer under the restoring force of the spring to clamp the corresponding silicon wafer group; The unlocking device applies an external force to the unlocking block to move the corresponding clamping part away from the corresponding silicon wafer group.

6. The silicon wafer production line according to claim 5, characterized in that, The unlocking block includes a horizontal portion and a vertical portion. The horizontal portion is used to abut against the movable plate, and the vertical portion is used to interact with the unlocking device. There is a certain distance between the vertical part and the movable plate. The vertical part has an inclined surface on the side facing the movable plate. Along the discharge direction of the silicon wafer, the distance between the inclined surface and the movable plate first decreases and then increases. The unlocking device includes a first roller. When relative movement occurs between the material frame and the unlocking device, the first roller moves between the inclined surface and the movable plate and contacts the inclined surface. The relative displacement between the first roller and the inclined surface causes the second pin to move away from the silicon wafer.

7. The silicon wafer production line according to claim 2, characterized in that, The material frame includes an upper frame and a lower frame. The upper frame is detachably disposed above the lower frame. The upper frame is provided with a limiting structure for limiting the crystal tray. The clamping assembly is disposed on the lower frame. The material frame is placed on the debonding station, the lower frame is lifted away from the upper frame to separate the crystal holder from the silicon wafer, and the material frame conveying module conveys the lower frame in the horizontal direction.

8. The silicon wafer production line according to any one of claims 1 to 7, characterized in that, The slicing module includes a water spraying section and a vertical conveying section. The water spraying section is used to spray water onto the unlocked silicon wafer group in the material frame to slice the multiple silicon wafers in the silicon wafer group. The vertical conveying section is used to convey the slicing silicon wafers one by one in a vertical posture to the flipping conveying module.

9. The silicon wafer production line according to claim 8, characterized in that, The vertical conveying unit includes a first mounting frame, on which an adsorption unit and a vertical conveyor belt are provided. The adsorption unit is used to adsorb the silicon wafers after slicing onto the vertical conveyor belt, and the vertical conveyor belt drives the silicon wafers to move upward in a vertical posture.

10. The silicon wafer production line according to claim 8, characterized in that, The flipping conveyor module includes a flipping auxiliary part and a coated roller. The flipping auxiliary part includes a second mounting frame with an air blowing part located above the vertical conveyor. The air blowing part is used to blow air onto the vertical silicon wafer conveyed upward by the vertical conveyor, so that the silicon wafer tilts onto the coated roller. The coated roller drives the silicon wafer to move to a horizontal position.

Images