Heat dissipation structure, and gimbal and pan-tilt and core-movement lens module with same

Abstract

The application relates to the technical field of lens anti-shake, and discloses a heat dissipation structure, a holder, a horizontal translation type and a core movement type lens module with the same, wherein the heat dissipation structure comprises: a shell, an accommodating cavity is formed in the shell, and the shell is provided with a light inlet hole position communicating with the accommodating cavity; a camera module is arranged in the accommodating cavity and connected with the shell, the camera module comprises an image chip arranged corresponding to the light inlet hole position; a light transmission sheet is arranged on the light inlet hole position and seals the accommodating cavity; and a heat dissipation medium is filled in the accommodating cavity, can quickly transfer the heat of the chip in the camera module to the shell, and discharge the heat from the lens module through the shell, the efficiency is higher, the temperature at the image chip can be effectively reduced, and the image noise is reduced.

Description

Technical Field

[0001] This invention relates to the field of lens image stabilization technology, and in particular to a heat dissipation structure and a gimbal, translational and core-driven lens module having the same. Background Technology

[0002] Currently, existing mobile cameras (such as those in smartphones and SLR cameras) are typically equipped with optical image stabilization to improve low-light shooting performance. Because these camera lenses are relatively heavy and require higher stabilization dimensions and wider angles, some cameras employ sensor-shift stabilizers (SS; or in-body image stabilizers) or gimbal stabilizers (GS) to achieve image stabilization.

[0003] Because the image chip in the mainstream chip translation motor, micro-gimbal stabilization motor, and module is located in the movable structure, the image chip cannot transfer heat to the stationary structure via a large metal structure, resulting in poor heat dissipation efficiency. The mainstream chip can only dissipate heat to the outside of the motor or the motor housing through the larger metal structure in the movable structure, primarily via thermal convection. However, thermal convection is inefficient, leading to higher image chip temperatures, increased image noise, and increased weight in the movable structure, thus affecting the image stabilization effect of the camera module. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure and a gimbal, translational and core-driven lens module having the same, which can quickly transfer the heat of the chip in the camera module to the outer casing and exhaust it through the outer casing. It has high efficiency, can effectively reduce the temperature of the image chip, ensure low image noise, and improve image quality.

[0005] To achieve the above objectives, the present invention provides a heat dissipation structure for a lens module, comprising:

[0006] The outer shell has an internal cavity, and the outer shell has a light-entry hole that communicates with the cavity;

[0007] A camera module is disposed within the receiving cavity and connected to the housing, the camera module including an image chip disposed corresponding to the light inlet hole;

[0008] A light-transmitting sheet, which covers the light-entry hole and seals the receiving cavity; and

[0009] A heat dissipation medium, which fills the cavity;

[0010] Wherein, the length direction of the outer shell is the first direction (X), the width direction of the outer shell is the second direction (Y), and the light-incoming direction of the heat dissipation structure is the third direction (Z).

[0011] Compared with existing technologies, the heat dissipation structure for a lens module according to this invention has the following advantages: the outer shell seals the light-inlet aperture through a light-transmitting sheet, forming a sealed cavity inside. By placing a heat dissipation medium in the sealed cavity, the heat from the image chip in the camera module can be quickly transferred to the outer shell and discharged from the lens module through the outer shell. This method is highly efficient, effectively reducing the temperature of the image chip and ensuring image noise reduction. The heat dissipation medium can be a liquid or a gas, which will not affect the quality of the movable structure, thus ensuring the image stabilization effect of the camera module.

[0012] The heat dissipation structure of the lens module in this embodiment of the invention uses a heat dissipation liquid as the heat dissipation medium.

[0013] The heat dissipation structure of the lens module in this embodiment of the invention includes oil as the heat dissipation liquid.

[0014] The heat dissipation structure of the lens module in this embodiment of the invention uses a heat dissipation gas as the heat dissipation medium, and the thermal conductivity of the heat dissipation gas is at least 50% higher than that of air.

[0015] The heat dissipation structure of the lens module in this embodiment of the invention includes hydrogen and / or helium as the heat dissipation gas.

[0016] The heat dissipation structure of the lens module in this embodiment of the invention includes a heat dissipation gas comprising a mixed gas composed of at least one of hydrogen and helium, wherein the content of hydrogen or helium in the mixed gas is at least greater than or equal to 1%.

[0017] In the heat dissipation structure of the lens module of this invention, the pressure of the heat dissipation gas filling the accommodating cavity is P, wherein P≤80kPa and P≥120kPa.

[0018] The heat dissipation structure of the lens module in this embodiment of the invention includes a fixed part and a movable part. The fixed part includes a magnet group fixed to the outer shell. The movable part includes a first circuit board and a second circuit board distributed along the third direction. A coil seat is provided on the first circuit board, and a coil group corresponding to the magnet group is provided on the coil seat. The second circuit board is flexibly connected to the outer shell. The fixed part also includes a first heat dissipation structure. One end of the first heat dissipation structure abuts against the outer shell, and the other end extends in the receiving cavity and is close to the image chip along a direction perpendicular to the third direction. The heat generated by the image chip can be conducted to the outer shell through the first heat dissipation structure.

[0019] The heat dissipation structure of the lens module in this embodiment of the invention further includes a third circuit board and a second heat dissipation structure in the movable part. The third circuit board is disposed between the second circuit board and the first circuit board and is electrically connected to the first circuit board and the second circuit board respectively. The second heat dissipation structure is disposed between the second circuit board and the third circuit board. A chip holder is disposed on the third circuit board, and the image chip electrically connected to the third circuit board is fixed in the chip holder. The second heat dissipation structure includes a base plate and a protrusion protruding toward the third circuit board. The base plate extends in the receiving cavity in a direction perpendicular to the third direction, and the protrusion abuts against the third circuit board in the third direction.

[0020] The heat dissipation structure of the lens module in this embodiment of the invention includes a first heat dissipation structure disposed between a second heat dissipation structure and a third circuit board. The protrusion passes through the first heat dissipation structure along the third direction and abuts against the third circuit board. The first heat dissipation structure includes an extension edge extending in a direction perpendicular to the third direction, and the extension edge extends to the space between the third circuit board and the second heat dissipation structure.

[0021] In the heat dissipation structure of the lens module of this invention, the angles between the side of the base plate facing the image chip and the side of the extended edge facing the image chip and the plane where the third circuit board is located are both less than 20°.

[0022] In the heat dissipation structure of the lens module of this embodiment, the distance between the extended edge and the base plate and the third circuit board in the third direction is less than 1mm.

[0023] The heat dissipation structure of the lens module in this embodiment of the invention includes a vibration sensor, a position sensor, and a driving chip on the coil holder.

[0024] In the heat dissipation structure of the lens module of this invention, the coil seat is further provided with a plurality of ball bearings, which can abut against the outer shell in the third direction.

[0025] The heat dissipation structure of the lens module in this embodiment of the invention includes a metal structure for the magnet assembly and the outer shell, and a heat-absorbing coating is provided on the outer surface of the magnet assembly and the outer shell to improve the heat radiation heat dissipation efficiency.

[0026] In accordance with the above-mentioned objectives, the present invention also provides a translational lens module, including a lens, a controller, and a heat dissipation structure for the lens module, wherein the lens is connected to the housing, and the controller is electrically connected to the heat dissipation structure.

[0027] Compared with existing technologies, the translational lens module of this invention has the following advantages: the lens of the translational lens module is mounted on the housing of the heat dissipation mechanism, and the controller controls the lens and the heat dissipation structure to perform image stabilization and shooting operations. The housing of the heat dissipation structure seals the light-inlet aperture through a light-transmitting sheet, forming a sealed receiving cavity inside. By setting a heat dissipation medium in the sealed receiving cavity, the heat of the chip in the camera module can be quickly transferred to the housing and discharged from the lens module through the housing. This is highly efficient and can effectively reduce the temperature of the image chip, ensuring low noise in the images captured by the lens module. The heat dissipation medium can be liquid or gas, which will not affect the quality of the movable structure and ensure the image stabilization effect of the camera module.

[0028] In accordance with the above-mentioned objectives, the present invention also provides a gimbal, including a lens, a controller, an actuator, and a heat dissipation structure for the lens module. The lens and the actuator are both disposed within the housing. The lens is connected to the camera module, and the controller is electrically connected to the actuator and the camera module. The actuator can drive the lens and the camera module to rotate together to achieve image stabilization.

[0029] Compared with existing technologies, the gimbal of this invention offers the following advantages: the controller controls the lens, actuator, and camera module for image stabilization and shooting; the heat dissipation structure's outer shell seals the light-inlet aperture through a light-transmitting sheet, forming a sealed cavity inside; by placing a heat dissipation medium within this sealed cavity, heat from the camera module's chip can be quickly transferred to the outer shell and then discharged through the lens module, resulting in high efficiency and effectively reducing the temperature of the image chip, ensuring low noise and high image quality in the images captured by the gimbal. The heat dissipation medium can be liquid or gas, without affecting the quality of the movable structure, thus ensuring the image stabilization effect of the camera module.

[0030] In accordance with the above-mentioned objectives, the present invention also provides a core-driven lens module, including a lens, a controller, an actuator, and a heat dissipation structure for the lens module. The actuator is disposed inside the housing, the lens is connected to the housing, the controller is electrically connected to the actuator and the camera module, and the actuator can drive the image chip to move linearly along the third direction to achieve autofocus.

[0031] Compared with existing technologies, the core-driven lens module of this invention has the following advantages: the controller controls the lens, actuator, and camera module for image stabilization and shooting. The outer shell of the heat dissipation structure seals the light-inlet aperture through a light-transmitting sheet, forming a sealed cavity inside. By placing a heat dissipation medium in the sealed cavity, the heat from the chip in the camera module can be quickly transferred to the outer shell and then discharged from the lens module. This method is highly efficient, effectively reducing the temperature of the image chip and ensuring low noise and high image quality in the images captured by the lens module. The heat dissipation medium can be liquid or gas, which will not affect the quality of the movable structure and ensure the image stabilization effect of the camera module.

[0032] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the external structure of the heat dissipation structure of the lens module according to an embodiment of the present invention;

[0034] Figure 2 This is a top view schematic diagram of the heat dissipation structure of the lens module according to an embodiment of the present invention;

[0035] Figure 3 The heat dissipation structure of the lens module in the first embodiment of the present invention is in Figure 2 Schematic diagram of the cross section at point AA;

[0036] Figure 4 The heat dissipation structure of the lens module in the second embodiment of the present invention is in Figure 2 Schematic diagram of the cross section at point AA;

[0037] Figure 5 This is an exploded view of the heat dissipation structure of the lens module according to another embodiment of the present invention;

[0038] Figure 6 This is a top view of the coil holder of the heat dissipation structure of the lens module according to an embodiment of the present invention;

[0039] Figure 7 This is a top view schematic diagram of the heat dissipation structure of the lens module according to the third embodiment of the present invention;

[0040] Figure 8 yes Figure 7 Schematic diagram at point BB;

[0041] Figure 9 This is a top view schematic diagram of the heat dissipation structure of the lens module according to the fourth embodiment of the present invention;

[0042] Figure 10 yes Figure 9Sectional view at point CC.

[0043] In the diagram, 1. Outer shell; 11. Top cover; 12. Bottom cover; 13. Light inlet hole; 2. Light-transmitting sheet; 3. Receiving cavity; 4. Fixed part; 41. Magnet group; 42. First heat dissipation structure; 421. Extended edge; 5. Stationary part; 51. First circuit board; 52. Second circuit board; 53. Coil holder; 531. Vibration sensor; 532. Position sensor; 533. Driver chip; 54. Coil group; 55. Ball bearing; 56. Second heat dissipation structure; 561. Base plate; 562. Protrusion; 57. Chip holder; 58. Image chip; 59. Third circuit board; 6. Lens; 7. Actuator; 8. Camera module. Detailed Implementation

[0044] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0045] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0046] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0047] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0048] like Figures 1-3As shown, a preferred embodiment of the heat dissipation structure for a lens module of the present invention includes a housing 1 and a light-transmitting sheet 2. The housing 1 has a first direction X, a second direction Y, and a third direction Z that intersect each other in pairs. The first direction X is the width direction of the housing 1, the second direction Y is the length direction of the housing 1, and the third direction Z is the thickness direction of the housing 1 (i.e., the light-incident direction or the optical axis direction of the lens module). Preferably, the first direction X, the second direction Y, and the third direction Z are mutually perpendicular.

[0049] In a first embodiment of the present invention, the outer casing 1 includes an upper cover 11 and a bottom cover 12, which are sealed together. A light-entry hole 13 is provided on the top surface of the upper cover 11. Light passing through the lens enters the interior of the outer casing 1 through the light-entry hole 13 and ultimately strikes the image chip 58. A camera module 8, including the image chip 58, is disposed inside the outer casing 1. A light-transmitting sheet 2 is disposed at and closes the light-entry hole 13. The light-transmitting sheet 2 is generally made of glass, allowing light to pass smoothly through it from the third direction (Z) into the light-entry hole 13. The outer casing 1 and the interior of the light-transmitting sheet 2 form a receiving cavity 3, which is filled with a heat dissipation medium. The outer casing 1 seals the light-entry hole 13 through the light-transmitting sheet 2. The outer casing 1 and the light-transmitting sheet 2 are connected by adhesive, forming a sealed receiving cavity 3 inside. By placing a heat dissipation medium in the sealed receiving cavity 3, the heat from the image chip 58 in the camera module 8 can be quickly transferred to the outer casing 1 and discharged from the lens module through the outer casing 1. This method is highly efficient and can effectively reduce the temperature of the image chip 58, ensuring image noise reduction. The heat dissipation medium can be a liquid or a gas, which will not affect the quality of the movable structure, ensuring the image stabilization effect of the camera module 8. In addition, the sealed receiving cavity 3 can prevent external dust from contaminating the image chip 58 and avoid image black spots caused by dust.

[0050] The light-transmitting element 2 is an infrared filter that blocks infrared light while allowing visible light to pass through. Since the infrared filter is located in the housing 1, i.e., the stationary structure of the lens module, the weight of the movable structure can be reduced, improving the high-frequency performance and power consumption of image stabilization, as well as the size of the camera module.

[0051] In some embodiments of the present invention, the heat dissipation medium includes a heat dissipation liquid or a heat dissipation gas. The gas or liquid fills the receiving cavity 3, so that the space within the receiving cavity 3 can serve as a heat transfer channel. Heat can be transferred to the outer shell 1 in multiple directions through the heat dissipation medium filling the receiving cavity 3, and all-round heat dissipation prevents heat from accumulating in one area. This heat dissipation method can quickly transfer the heat of the image chip 58 in the camera module 8 to the outer shell 1, effectively reducing the temperature of the image chip 58 and ensuring image quality. Specifically, the heat dissipation liquid includes a non-conductive liquid, such as oil. Since the thermal conductivity of oil is much higher than that of air, it can effectively reduce the temperature of the image chip 58 and image noise. In addition, oil can increase the damping coefficient of the movable structure, which is beneficial for closed-loop image stabilization control and suppressing high-frequency shaking. Furthermore, the thermal conductivity of the heat dissipation gas is at least 50% higher than that of air, thereby improving the heat dissipation efficiency of the image chip 58. Specifically, the heat dissipation gas in this embodiment includes hydrogen or helium, etc. Since the thermal conductivity of hydrogen or helium is much higher than that of air by at least 50%, using a heat dissipation gas containing hydrogen and / or helium can significantly improve the thermal conductivity in the cavity 3, effectively reducing the temperature of the image chip 58 and image noise.

[0052] It should be noted that the thermal conductivity of the heat dissipation gas and the thermal conductivity of air mentioned in this embodiment are measured and compared under the same temperature and pressure conditions. For example, both are measured and compared under normal temperature and pressure conditions. The thermal conductivity of air under normal temperature and pressure conditions is 0.026 W / m·K. Therefore, the thermal conductivity of the selected heat dissipation gas under normal temperature and pressure conditions is at least 0.039 W / m·K, thereby effectively improving the heat dissipation efficiency of the image chip 58 during operation. In this embodiment, the thermal conductivity of hydrogen under normal temperature and pressure conditions is 0.18 W / m·K, and the thermal conductivity of helium under normal temperature and pressure conditions is 0.15 W / m·K, both of which are much higher than that of air, thereby effectively improving the heat dissipation efficiency of the image chip 58 during operation.

[0053] It is understandable that the heat dissipation medium filling the cavity 3 can not only improve the heat dissipation efficiency of the image chip 58, enabling the heat generated by the image chip 58 to be quickly conducted to the outer shell 1 through the heat dissipation medium, but also conduct the heat generated by other electronic components in the camera module 8 to the outer shell 1 and conduct it to the outside, thereby improving the heat dissipation efficiency of the entire cavity 3.

[0054] In some embodiments of the present invention, the heat dissipation medium is specifically a heat dissipation gas, wherein the pressure of the heat dissipation gas filling the cavity 3 is lower than 80 kPa or higher than 120 kPa. Since the camera module 8 undergoes relative motion with the gas in the cavity 3 during image stabilization, different Reynolds numbers will occur in the gas environment within the cavity 3. Let the pressure of the heat dissipation gas filling the cavity 3 be P, where P ≤ 80 kPa and P ≥ 120 kPa; when the pressure of the heat dissipation gas is not greater than 80 kPa or not less than 120 kPa, a suitable Reynolds number can be obtained, improving the thermal convection efficiency in the cavity 3, effectively promoting heat dissipation of the image chip 58, and reducing the temperature of the image chip 58 and image noise. Preferably, the pressure of the heat dissipation gas is selected from 80 kPa, 75 kPa, 70 kPa, 120 kPa, 125 kPa, or 130 kPa, etc.

[0055] More specifically, the heat dissipation gas includes a mixture of at least one of hydrogen and helium, with the content of hydrogen or helium in the mixture being at least 1%. When nitrogen and helium are mixed, because the density of nitrogen (1.25 g / L @ 25℃ & 1 bar) is at least 100% higher than the density of helium (0.18 g / L @ 25℃ & 1 bar), and the two gases are immiscible due to their significant density difference, when the camera changes direction during use, some of the nitrogen may first be carried to the upper part of the receiving cavity 3, and then flow downwards, causing gas movement within the outer casing 1, thus improving heat dissipation efficiency.

[0056] like Figures 4-6 As shown, in some embodiments of the present invention, the camera module 8 includes a fixed part 4 and a movable part 5. The movable part 5 moves relative to the fixed part 4 in multiple degrees of freedom, in order to reduce image jitter and blurring caused by the overall shaking of the housing 1.

[0057] The fixing part 4 includes a magnet group 41 fixed to the outer casing 1. Each magnet group 41 contains at least one magnet. Multiple magnet groups 41 and multiple magnets can be provided. The magnet groups 41 are arranged in the first direction X and the second direction Y.

[0058] The movable part 5 includes a first circuit board 51 and a second circuit board 52 connected to each other. A coil holder 53 is provided on the first circuit board 51, and the coil holder 53 is located on the side of the first circuit board 51 facing the magnet group. The middle part of the coil holder 53 and the first circuit board 51 form a through hole for light to pass through. A coil group 54 corresponding to the magnet group 41 is provided on the coil holder 53. Each coil group 54 includes at least one coil. The number of coil groups 54 corresponds to the number of magnet groups 41, and the number of coils also corresponds to the number of magnets. The second circuit board 52 is flexibly connected to the outer shell 1 or a relatively fixed structure outside, providing a fulcrum for the flexible second circuit board 52. The deformable part of the second circuit board 52 is located in the same plane.

[0059] The coil holder 53 is also provided with a plurality of balls 55, which abut against the top plate of the housing 1 in a third direction. The first circuit board 51 is provided with a magnetic structure, which is attracted by at least one magnet group 41 to generate a magnetic attraction force; the magnetic attraction force presses the first circuit board 51 and the coil holder 53 tightly against the housing 1 or the magnet group 41 through the balls 55, providing multi-axis degrees of freedom in a plane of motion; by changing the direction and magnitude of the current in the coil, the magnetic thrust of the coil can be changed, realizing two-axis anti-shake motion of the image chip 58 in the plane of motion.

[0060] As a second embodiment of the present invention, the fixing part 4 further includes a first heat dissipation structure 42, which abuts against the outer shell 1. The first heat dissipation structure 42 abuts against the upper cover 11 of the outer shell 1 in the third direction Z, and abuts against the bottom cover 12 of the outer shell 1 in the first direction X and the second direction Y. The first heat dissipation structure 42 extends in the receiving cavity 3 and is close to the image chip 58 in the direction perpendicular to the third direction Z. The heat generated by the image chip 58 can be quickly transferred to the outer shell 1 through the first heat dissipation structure 42.

[0061] The movable part 5 also includes a second heat dissipation structure 56, which is disposed between the first circuit board 51 and the second circuit board 52. The second heat dissipation structure 56 has a portion that abuts against the third circuit board 59 below the image chip 58, which can quickly dissipate the heat from the image chip. The additional first heat dissipation structure 42 and the second heat dissipation structure 56, together with the heat dissipation medium in the sealed space, can further increase the heat dissipation area of ​​the image chip 58, significantly reduce the temperature of the image chip 58 and image noise, and ensure image quality. Specifically, the first heat dissipation structure 42 and the second heat dissipation structure 56 are made of metal materials to ensure effective heat transfer.

[0062] like Figures 4-6As shown, in some embodiments of the present invention, the third circuit board 59 is fixedly connected and electrically connected to the second circuit board 52; the third circuit board 59 is disposed between the second circuit board 52 and the first circuit board 51, and a chip holder 57 is disposed on the third circuit board 59. An image chip 58 is fixed in the chip holder 57. The second heat dissipation structure 56 includes a base plate 561 and a protrusion 562 protruding toward the third circuit board 59. The base plate 561 extends in the receiving cavity 3 in a direction perpendicular to the third third direction Z. The top of the protrusion 562 abuts against the third circuit board 59. The protrusion 562 can receive the heat in the third circuit board 59 carrying the image chip 58 and transfer this heat from the base plate 561 to the heat dissipation medium, which then further transfers the heat outward.

[0063] In some embodiments of the present invention, a first heat dissipation structure 42 is disposed between a second heat dissipation structure 56 and a third circuit board 59. A protrusion 562 passes through the first heat dissipation structure 42 along the third direction Z and abuts against the third circuit board 59. The first heat dissipation structure 42 has an extension edge 421 extending in a direction perpendicular to the third direction Z. The extension edge 421 can receive heat from the heat dissipation medium in the receiving cavity 3 and directly transfer this heat to the outer shell 1. The extension edge 421 extends between the third circuit board 59 and the second heat dissipation structure 56. The third circuit board 59 and the second heat dissipation structure 56 may be displaced during the image stabilization process. During the displacement, they may approach the first heat dissipation structure 42. At this time, the heat in the third circuit board 59 and the second heat dissipation structure 56 can be transferred to the first heat dissipation structure 42, and the first heat dissipation structure 42 can then directly transfer this heat to the outer shell 1. The provision of the first heat dissipation structure 42 accelerates the speed of heat transfer to the outer shell 1, further improves the heat dissipation effect of the image chip 58, and ensures the imaging quality of the image chip 58.

[0064] In some embodiments of the present invention, the angles between the side of the base plate 561 facing the image chip 58 and the side of the extension edge 421 facing the image chip 58 and the plane where the third circuit board 59 is located are both less than 20°. This arrangement ensures that the average distance between the first heat dissipation structure 42 and the second heat dissipation structure 56 and the third circuit board 59 is small during the image stabilization process, which is beneficial for the uniform and rapid heat dissipation of the image chip 58. Specifically, the angles between the three components in the first direction X and the second direction Y are selected as 18°, 10°, and 0°, etc. Specifically, in this embodiment, the plane where the third circuit board 59 is located can be the plane where the side of the third circuit board 59 facing away from the image chip 58 is located.

[0065] In some embodiments of the present invention, the distance between the extended edge 421 and the base plate 561 and the third circuit board 59 in the third direction Z is less than 1 mm. This setting makes the first heat dissipation structure 42 very close to the second heat dissipation structure 56 and the third circuit board 59 in the third direction Z during the anti-shake process, which is beneficial to the heat conduction of the image chip 58 and improves the heat dissipation effect of the image chip 58.

[0066] like Figure 6 As shown, in some embodiments of the present invention, the coil holder 53 is further provided with a vibration sensor 531, a position sensor 532, and a drive chip 533. The drive chip 533 can directly connect all coil groups 54 and position sensors 532 in the movable structure, significantly reducing the number of lines in the second circuit board 52, simplifying the design of the second circuit board, reducing the cost and size of the second circuit board 52, and improving the economic efficiency of the product. Multiple position sensors 532 and vibration sensors 531 can be provided. By continuously detecting their own positions, closed-loop control can be achieved, resulting in better multi-axis anti-shake effect. Specifically, the position sensor 532 is a magnetic sensor (e.g., a tunnel magnetoresistive or Hall sensor) and is arranged opposite to the magnet group 41; the drive chip 533 can calculate the three-axis position of the movable structure by reading the data of multiple position sensors 532, providing continuous closed-loop anti-shake control.

[0067] In some embodiments of the present invention, the magnet assembly 41 and the outer shell 1 include a metal structure, and the outer surface of the magnet assembly 41 and the outer shell 1 is provided with a heat-absorbing coating, which can improve the heat radiation heat dissipation efficiency of the magnet assembly 41 and the outer shell 1, absorb some of the heat in the heat dissipation medium and transfer it to the outside, further reduce the temperature of the image chip 58 and the image noise, and ensure the imaging quality of the image chip 58.

[0068] like Figures 1-6As shown, this invention provides a translational lens module, including a lens, a controller, and a heat dissipation structure for the lens module in the above embodiment. The lens is connected to the housing 1, and the controller is electrically connected to the heat dissipation structure. The lens of the translational lens module is mounted on the housing 1 of the heat dissipation mechanism. The controller controls the lens and the heat dissipation structure to perform image stabilization and shooting operations. The controller can also adjust the drive chip 533 according to the information from the vibration sensor 531 and the position sensor 532. The drive chip 533 adjusts the current in the coil group 54, which works in conjunction with the magnet group 41 to achieve the image stabilization effect. The housing 1 of the heat dissipation structure seals the light-entry hole 13 through the light-transmitting sheet 2, forming a sealed receiving cavity 3 inside. By setting a heat dissipation medium in the sealed receiving cavity 3, the heat of the chip in the camera module 8 can be quickly transferred to the housing 1 and discharged from the lens module through the housing 1. This has high efficiency and can effectively reduce the temperature of the image chip 58, ensuring that the image captured by the lens module has low noise. The heat dissipation medium can be liquid or gas, which will not affect the quality of the movable structure, ensuring the image stabilization effect of the camera module 8 and reducing the power consumption of image stabilization.

[0069] like Figure 7 and Figure 8 As shown in the third embodiment of the present invention, the present invention provides a gimbal, including a lens 6, an actuator 7, a controller, and a heat dissipation structure for the lens module in some embodiments described above. The actuator 7 is disposed inside the housing 1, the lens 6 is connected to the actuator 7, and the controller is electrically connected to the actuator 7. The lens 6 of the gimbal is installed inside the housing 1 of the heat dissipation mechanism, and the controller controls the lens 6, the actuator 7, and the heat dissipation structure to perform image stabilization and shooting operations. Specifically, the actuator 7 can be a voice coil motor, a brushless motor, a memory metal motor, or a piezoelectric motor, etc. The housing 1 of the heat dissipation structure seals the light-entry hole 13 through a light-transmitting sheet 2, forming a sealed receiving cavity 3 inside. By setting a heat dissipation medium in the sealed receiving cavity 3, the heat of the chip in the camera module 8 can be quickly transferred to the housing 1 and discharged from the lens module through the housing 1. This has high efficiency and can effectively reduce the temperature of the image chip 58, ensuring low noise and high image quality in the images captured by the gimbal. The heat dissipation medium can be a liquid or a gas, which will not affect the quality of the movable structure, ensuring the image stabilization effect of the camera module 8 and reducing the power consumption of image stabilization.

[0070] like Figure 9 and 10As a fourth embodiment of the present invention, this invention provides a core-driven lens module, including a lens 6, a controller, an actuator 7, and a heat dissipation structure of the lens module in some of the above embodiments. The actuator 7 is disposed inside the housing 1. The lens 6 is connected to the housing 1. The controller is electrically connected to the actuator 7 and the camera module 8. The actuator 7 can drive the image chip 58 to move linearly along the third direction Z to achieve autofocus. The controller controls the actuator 7 and the image chip 58 to perform image stabilization and shooting operations. The housing 1 of the heat dissipation structure seals the light-entry hole 13 through a light-transmitting sheet 2, forming a sealed receiving cavity 3 inside. By placing a heat dissipation medium in the sealed receiving cavity 3, the heat of the image chip 58 can be quickly transferred to the housing 1 and discharged through the housing 1 to the lens module. This method is highly efficient and can effectively reduce the temperature of the image chip 58, ensuring low noise and high image quality in the images captured by the lens module. The heat dissipation medium can be liquid or gas, which will not affect the quality of the movable structure and ensure the image stabilization effect of the camera module.

[0071] The working process of this invention is as follows: a receiving cavity 3 is formed inside the outer shell 1 and the light-transmitting sheet 2, and the receiving cavity 3 contains a heat dissipation medium. During the shooting process, the image chip 58 generates heat, which is transferred to the outer shell 1 through the liquid or gas heat dissipation medium in the sealed receiving cavity 3; furthermore, the heat generated by the image chip 58 can be quickly conducted to the outer shell 1 through the first heat dissipation structure 42 and the second heat dissipation structure 56 provided in the receiving cavity 3, further improving the efficiency of heat conduction and improving the imaging quality of the image chip 58.

[0072] In summary, the embodiments of the present invention provide a gimbal, a translational lens module, a core-driven lens module, and a heat dissipation structure thereof, which can quickly transfer the heat of the chip in the camera module 8 to the outer casing 1 and exhaust it from the lens module through the outer casing 1. It has high efficiency and can effectively reduce the temperature of the image chip 58, thus ensuring image noise.

[0073] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a lens module, characterized in that, include: The outer shell has an internal cavity, and the outer shell has a light-entry hole that communicates with the cavity; A camera module is disposed within the receiving cavity and connected to the housing, the camera module including an image chip disposed corresponding to the light inlet hole; A light-transmitting sheet is disposed on the light-inlet hole and seals the receiving cavity; as well as A heat dissipation medium, which fills the cavity; Wherein, the length direction of the outer shell is the first direction (X), the width direction of the outer shell is the second direction (Y), and the light-incoming direction of the heat dissipation structure is the third direction (Z). The camera module includes a fixed part and a movable part. The fixed part includes a magnet group fixed to the housing. The movable part includes a first circuit board and a second circuit board distributed along the third direction. A coil holder is provided on the first circuit board, and a coil group corresponding to the magnet group is provided on the coil holder. The second circuit board is flexibly connected to the housing. The fixed part also includes a first heat dissipation structure. One end of the first heat dissipation structure abuts against the housing, and the other end extends into the receiving cavity and is close to the image chip along a direction perpendicular to the third direction. The heat generated by the image chip can be conducted to the housing through the first heat dissipation structure. The movable part further includes a third circuit board and a second heat dissipation structure. The third circuit board is disposed between the second circuit board and the first circuit board and is electrically connected to the first circuit board and the second circuit board respectively. The second heat dissipation structure is disposed between the second circuit board and the third circuit board. A chip holder is disposed on the third circuit board. The image chip electrically connected to the third circuit board is fixed in the chip holder. The second heat dissipation structure includes a base plate and a protrusion protruding toward the third circuit board. The base plate extends in the receiving cavity in a direction perpendicular to the third direction. The protrusion abuts against the third circuit board in the third direction. The first heat dissipation structure is disposed between the second heat dissipation structure and the third circuit board. The protrusion passes through the first heat dissipation structure along the third direction and abuts against the third circuit board. The first heat dissipation structure includes an extension edge extending in a direction perpendicular to the third direction, and the extension edge extends to the space between the third circuit board and the second heat dissipation structure.

2. The heat dissipation structure of the lens module according to claim 1, characterized in that: The heat dissipation medium is a heat dissipation liquid.

3. The heat dissipation structure of the lens module according to claim 2, characterized in that: The cooling fluid includes oil.

4. The heat dissipation structure of the lens module according to claim 1, characterized in that: The heat dissipation medium is a heat dissipation gas, and the thermal conductivity of the heat dissipation gas is at least 50% higher than that of air.

5. The heat dissipation structure of the lens module according to claim 4, characterized in that: The heat dissipation gas includes hydrogen and / or helium.

6. The heat dissipation structure of the lens module according to claim 5, characterized in that: The heat dissipation gas includes a mixture of at least one of hydrogen and helium, wherein the content of hydrogen or helium in the mixture is at least 1%.

7. The heat dissipation structure of the lens module according to claim 4, characterized in that: The pressure of the heat dissipation gas filling the cavity is P, where P≤80kPa and P≥120kPa.

8. The heat dissipation structure of the lens module according to claim 1, characterized in that: The angle between the side of the base plate facing the image chip and the side of the extended edge facing the image chip and the plane where the third circuit board is located is less than 20°.

9. The heat dissipation structure of the lens module according to claim 1, characterized in that: The distance between the extended edge and the base plate and the third circuit board in the third direction is less than 1 mm.

10. The heat dissipation structure of the lens module according to claim 1, characterized in that: The coil holder is also equipped with a vibration sensor, a position sensor, and a drive chip.

11. The heat dissipation structure of the lens module according to claim 1, characterized in that: The coil holder is also provided with a plurality of balls, which can abut against the outer shell in the third direction.

12. The heat dissipation structure of the lens module according to claim 1, characterized in that: The magnet assembly and the outer shell comprise a metal structure, and the outer surfaces of the magnet assembly and the outer shell are provided with a heat-absorbing coating.

13. A translational lens module, characterized in that: The device includes a lens, a controller, and a heat dissipation structure for the lens module as described in any one of claims 1-12, wherein the lens is connected to the housing, and the controller is electrically connected to the heat dissipation structure.

14. A gimbal, characterized in that: The device includes a lens, a controller, an actuator, and a heat dissipation structure for the lens module as described in any one of claims 1-7. The lens and the actuator are both disposed within the housing. The lens is connected to the camera module. The controller is electrically connected to the actuator and the camera module. The actuator can drive the lens and the camera module to rotate together to achieve image stabilization.

15. A core-driven lens module, characterized in that: The device includes a lens, a controller, an actuator, and a heat dissipation structure for the lens module as described in any one of claims 1-7. The actuator is disposed inside the housing, the lens is connected to the housing, the controller is electrically connected to the actuator and the camera module, and the actuator can drive the image chip to move linearly along the third direction to achieve autofocus.

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