Semiconductor structure processing methods, processing devices and processing systems
By detecting and etching away the locations of photoresist layer protrusions, the problems of equipment contamination and high maintenance costs caused by protrusions in the photolithography process are solved, thereby improving the product yield of DRAM manufacturing processes.
CN117497435BActive Publication Date: 2026-05-26CHANGXIN MEMORY TECH INC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2022-07-21
- Publication Date
- 2026-05-26
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Figure CN117497435B_ABST
Abstract
This disclosure relates to the field of semiconductor technology, specifically a method, apparatus, and system for processing semiconductor structures. The processing method includes providing a semiconductor substrate; forming a photoresist layer on the semiconductor substrate, the photoresist layer including adjacent edge regions and a central region, the edge regions including protrusions; detecting the position information of the protrusions and determining a target etching region based on the position information, the protrusions being located within the target etching region; and etching the photoresist layer located within the target etching region. This processing method can reduce equipment maintenance costs and improve product yield.
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