High volume fraction, high thickness, large area curved surface piezoelectric ceramic composite material, preparation and application
Patent Information
- Application Number
- CN202311624182.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-30
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-11-30
AI Technical Summary
[0004]但是，上述现有技术不适用于体积分数大于70%、厚度高于2 mm、长或宽大于100mm 的大面积曲面压电陶瓷复合材料的制备：1）对于3D打印模具辅助的切割-插柱技术，大尺寸的3D模具过于柔软，插柱时容易变形；3D打印模具的精度和尺寸受到打印设备的影响，在高精度和大尺寸不能兼得；此外为了保持三维模具的结构稳定性，框架宽度一般大于0.5mm，这不适用于制备高压电相体积分数的复合材料制备；此外，3D模具价格昂贵
1）本发明方法可制备厚度高于2 mm、长或宽大于100 mm 的大面积压电复合材料，适合制作宽带多波束换能器。
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Figure CN117500360B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of curved piezoelectric composite materials technology, specifically to a high volume fraction, high thickness, large area curved piezoelectric ceramic composite material, its preparation and application. Background Technology
[0002] Underwater acoustic transducers are indispensable in underwater communication, navigation, and marine resource exploration and development. With increasingly stringent requirements for detection and positioning, the need for sensors with large detection coverage, high sound source levels, and high power is becoming increasingly urgent. Bending transducers, with their wider beamwidth, higher sound source level, and better directivity, have broad application prospects. As a key component of bending transducers, the exploration and fabrication of bending piezoelectric composite materials is a very important research topic.
[0003] Currently, the methods for preparing curved piezoelectric composite materials include: 1. 3D printing mold-assisted cutting-insertion technology, which involves inserting the cut piezoelectric pillars into a 3D printed mold, followed by resin injection, curing, and polishing (Jia N, Wang T, Duan J, et al. High-Performance Curved Piezoelectric Single-Crystal Composites via 3D-Printing-Assisted Dice and Insert Technology for Underwater Acoustic Transducer Applications[J]. ACS Applied Materials&Interfaces, 2022, 14(6):8137-8145.); 2. Flexible backing and gradient heating arrangement casting technology, where piezoelectric pillars are periodically arranged on a flexible tape, placed in the target mold, and epoxy resin is injected into the mold to fill the gaps between the piezoelectric pillars; during curing, the piezoelectric composite material is first heated at 80 °C for 1 hour, while vacuuming is performed to ensure the removal of air bubbles inside the epoxy resin; secondly, the piezoelectric composite material is heated at a rate of 3 °C / min for 2 hours, with a pressure of 5 MPa applied until 120 °C to obtain the desired piezoelectric composite material shape; then, the temperature is continuously increased to 150°C for 2 hours until the epoxy resin is completely cured; finally, the composite material is cooled to room temperature and then polished (Wang Y, Lin X, Li J, et al. Effect of structural parameters and stability of constituent materials on the performance of 1–3spherical crown piezocomposite and transducer[J]. Sensors and Actuators A:Physical, 2018, 278: 18-24.); 3. Thermoforming technology, that is, the prepared planar piezoelectric composite material is placed on the target curved surface mold and shaped by heating (Wang W, Or SW, Yue Q, et al. Cylindrically shaped ultrasonic linear array fabricated using PIMNT / epoxy 1-3 piezoelectric composite[J]. Sensors and Actuators A: Physical, 2013, 192: 69-75.).); 4. Casting method: This method softens the planar piezoelectric composite material by filling it with soft rubber, and then places the soft planar piezoelectric composite material on the target mold to form a curved piezoelectric composite material (Zhang Y, Wang L, Qin L, et al. A doubly-curved piezoelectric composite with 1–3 connectivity for underwater transducer applications[C] / / IOP Conference Series: Materials Science and Engineering.IOP Publishing, 2018, 317(1): 012041.).
[0004] However, the aforementioned existing technologies are not suitable for the preparation of large-area curved piezoelectric ceramic composites with a volume fraction greater than 70%, a thickness greater than 2 mm, and a length or width greater than 100 mm: 1) For the 3D printing mold-assisted cutting-and-insertion technique, large-sized 3D molds are too flexible and easily deformed during insertion; the accuracy and size of 3D printing molds are affected by the printing equipment, and high accuracy and large size cannot be achieved simultaneously; in addition, to maintain the structural stability of the three-dimensional mold, the frame width is generally greater than 0.5 mm, which is not suitable for the preparation of composites with a high piezoelectric phase volume fraction; furthermore, 3D molds are expensive. 2) Flexible backing and gradient heating arrangement casting techniques and thermoforming techniques both carry the risk of depolarization and are prone to generating mechanical and thermal stresses during heating and bending, reducing the fatigue resistance of the components. 3) For flexible backing and gradient heating arrangement casting techniques, piezoelectric ceramic pillars with a thickness exceeding 2 mm are prone to tilting or moving, resulting in poor periodicity. 4) In the casting process, the soft polymer provides little support, which can easily cause deformation of the curved composite material, especially high volume fraction (up to 90%) curved piezoelectric composite materials. Summary of the Invention
[0005] In order to overcome the shortcomings of the prior art, the present invention aims to provide a high volume fraction, high thickness, large area curved surface piezoelectric ceramic composite material, its preparation and application, which eliminates the risks of depolarization, deformation and poor periodicity of piezoelectric composite materials. The composite material is not easily deformed, has stable performance and good consistency.
[0006] To achieve the above objectives, the present invention provides the following technical solution: A high volume fraction, high thickness, and large area curved piezoelectric ceramic composite material, with a volume fraction greater than 70%, a thickness greater than 2 mm, and a length or width greater than 100 mm; including type 1-3 curved piezoelectric composite material and type 2-2 curved piezoelectric composite material; the structure of type 1-3 curved piezoelectric composite material is that curved piezoelectric ceramic pillars are arranged in a three-dimensional interconnected epoxy resin colloid; the structure of type 2-2 curved piezoelectric composite material is that curved piezoelectric ceramic plates are arranged alternately with epoxy resin colloid to form a laminated structure.
[0007] A method for preparing a high-volume-fraction, high-thickness, large-area curved piezoelectric ceramic composite material includes the following steps: Step 1, Ceramic Cutting: The thickness of the composite material is determined by simulation. After grinding the large ceramic block to the target thickness, the large ceramic block is cut into smaller pieces by wire cutting. Step 2, one-time cutting: Use a dicing machine to cut the small ceramic pieces obtained in Step 1 into a ceramic column array, leaving the ceramic substrate to form a ceramic column skeleton. After cutting, ultrasonically clean the ceramic column array and dry it. Step 3, one-time potting: First, mix the silicone and the corresponding type and amount of curing agent evenly to obtain a silicone solution. Then, pour the silicone solution into the ceramic column array prepared in step 2 to fill the cut gaps once. After vacuum degassing, cure at room temperature. Step 4, Secondary Cutting: Invert the ceramic sample that was potted in Step 3, and precisely cut the ceramic base along the groove between the ceramic pillars. Then, ultrasonically clean and dry it. Step 5, Arrangement: Arrange multiple ceramic blocks that were cut twice in Step 4 along the length on the tape. The ceramic pillars of the front ceramic block are connected to the secondary cutting gaps of the rear ceramic block. The silicone in the secondary cutting gaps ensures the periodicity of the spacing between the ceramic pillars. Step 6, Place into the mold of the target shape: Place the tape and the arranged ceramic blocks into the mold of the target shape; Step 7, Secondary potting: First, mix epoxy resin and corresponding type and amount of curing agent evenly to obtain epoxy resin colloid. Then, pour the epoxy resin colloid into the ceramic column array in step 6 to fill the secondary cutting gaps. Vacuum the vacuum chamber to remove microbubbles. After curing at room temperature, the composite material of the target shape is obtained. Step 8, Peel off the silicone: After completely peeling off the silicone, ultrasonically clean and dry it; Step 9, three-stage potting: Place the ceramic composite material from step 8 into the mold of the target shape, pour in the mixed epoxy resin again, vacuum in a vacuum chamber to remove microbubbles, and cure at room temperature. Step 10, Grinding: Grind off excess epoxy resin colloid on the surface to obtain a large-area, high-volume-fraction, curved piezoelectric ceramic composite material.
[0008] In step 1, the ceramic pieces are cut into smaller sizes than the cutting stroke of the dicing machine.
[0009] In step 7, apply the release agent to the mold and wrap it with aluminum foil.
[0010] In steps 7 and 9, the curing process is carried out at room temperature for more than 24 hours.
[0011] The center of the secondary cutting slit is aligned with the center of the primary cutting slit.
[0012] The application of a high volume fraction, high thickness, and large area curved piezoelectric ceramic composite material is to fabricate broadband multibeam transducers, or to apply it to underwater acoustic transducers, or to the fabrication of high sound source level and high power sensors.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1) The method of the present invention can prepare large-area piezoelectric composite materials with a thickness greater than 2 mm and a length or width greater than 100 mm, which is suitable for fabricating broadband multi-beam transducers.
[0014] 2) The method of the present invention can prepare composite materials with a kerf width (i.e., the width of epoxy resin colloid) of less than 0.25 mm and a piezoelectric phase volume fraction of more than 70%, which makes up for the structural defects of current curved composite materials with low volume fraction, generally 30%-70%, and easy deformation; and the high piezoelectric phase volume fraction makes the piezoelectric composite material have high piezoelectric and dielectric properties, which is beneficial to improving the sensitivity and electrical matching of the transducer when applied to underwater acoustic transducers.
[0015] 3) The double-sided cutting method of the present invention solves the problem of limited cutting depth of thin blades when the thickness of piezoelectric ceramic is higher than 2 mm.
[0016] 4) The arc-shaped piezoelectric ceramic composite material prepared by the method of the present invention does not require grinding of the piezoelectric phase. Only the epoxy resin on the surface of the composite material needs to be removed. The flatness of the ceramic block ensures the uniformity of the thickness of the arc-shaped piezoelectric composite material and good frequency consistency.
[0017] In summary, compared with the prior art, the present invention uses a mold-assisted cutting and filling method to achieve the preparation of large-area curved piezoelectric ceramic composite materials with a volume fraction greater than 70%, a thickness greater than 2 mm, and a length or width greater than 100 mm, providing a material basis for the preparation of sensors with large detection range, high sound source level and high power. Attached Figure Description
[0018] Figure 1 The diagram shows the structure of the curved piezoelectric ceramic composite material of the present invention, wherein (a) is a schematic diagram of the structure of the 1-3 type curved piezoelectric ceramic composite material, and (b) is a schematic diagram of the structure of the 2-2 type curved piezoelectric ceramic composite material.
[0019] Figure 2 This is a flowchart of the preparation method of the curved piezoelectric ceramic composite material of the present invention.
[0020] Figure 3 The images are optical images of curved piezoelectric ceramic composite materials of types 1-3 and 2-2 in embodiments of the present invention, wherein (a) and (c) are optical images of curved piezoelectric ceramic composite materials of type 1-3, and (b) and (d) are optical images of curved piezoelectric ceramic composite materials of type 2-2.
[0021] Figure 4 Impedance diagrams of curved piezoelectric ceramic composite materials of Embodiment 1-3 of the present invention.
[0022] Figure 5 To demonstrate the performance consistency of the 1-3 type curved piezoelectric ceramic composite material in Embodiment 1 of the present invention, (a) is an optical image of the large-area 1-3 type curved piezoelectric ceramic composite material after electrode segmentation, (b) is a characteristic frequency change diagram of each part after electrode segmentation, and (c) is a diagram of the electromechanical coupling performance and dielectric performance change of each part after electrode segmentation.
[0023] Figure 6 The impedance diagram of the piezoelectric ceramic composite material in Embodiment 2-2 of the present invention is shown. Detailed Implementation
[0024] The technical solution of the present invention is described below through embodiments and accompanying drawings. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic solution of the present invention. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0025] Example 1, referring to Figure 1 In (a), a type 1-3 high volume fraction, high thickness, large area curved piezoelectric ceramic composite material, the structure of which is a curved distribution of piezoelectric ceramic pillars arranged in a three-dimensional interconnected epoxy resin colloid.
[0026] Reference Figure 2 A method for preparing a type 1-3 high volume fraction, high thickness, large area curved piezoelectric ceramic composite material includes the following steps: Step 1, Ceramic Cutting: The thickness of the composite material was determined through simulation. The large ceramic block was ground to 4.3 mm and then cut into 115 * 80 mm pieces using wire cutting. 2 This makes its size smaller than the cutting stroke of the dicing machine; Step 2, One-time cutting: Use a dicing machine to cut the ceramic into pieces with a single-cut kerf width of 0.2mm, and the ceramic column width is 1.7*1.7mm. 2 A ceramic column array with a base thickness of 2.2 mm and a transverse period of 1.9 mm was formed, leaving the ceramic base to form a ceramic column skeleton. After cutting, it was ultrasonically cleaned, arranged, and dried. Step 3, one-time potting: First, mix the A phase silicone and B phase curing agent of Eco flex 00-30 two-component silicone at a 1:1 ratio to obtain a silicone solution, and then vacuum to remove air bubbles; then pour the silicone solution into the ceramic column array prepared in step 2 to fill the cut gaps once; after vacuum degassing, cure at room temperature. Step 4, Secondary Cutting: Invert the ceramic sample that was potted in Step 3, and precisely cut the ceramic base along the groove between the ceramic pillars. Then, ultrasonically clean and dry it. Step 5, Arrangement: Arrange the three ceramic blocks from Step 4 along the length on the tape. Connect the ceramic pillars of the front ceramic block with the cut seams of the rear ceramic block. The silicone in the secondary cut seams can ensure the periodicity of the spacing between the ceramic pillars. Step 6, Place into the target shape mold: Place the tape and the arranged ceramic blocks together into the target shape mold with an inner arc of 190.6 mm, an outer arc of 194.9 mm, and a central angle of 102°. Step 7, Secondary potting: First, mix the A-phase resin and B-phase curing agent of Epo-Tek 301 two-component epoxy resin evenly in a 4:1 mass ratio to obtain epoxy resin colloid, and then vacuum to remove air bubbles; then pour the epoxy resin colloid into the ceramic column array in step 6 to fill the secondary cutting gaps; vacuum in a vacuum chamber to remove microbubbles, and after curing at room temperature for 24 hours, obtain the composite material of the target shape; applying release agent to the mold and wrapping it with tin foil will prevent adhesion. Step 8, peel off the silicone: The silicone in step 7 has low adhesion and is easy to peel off. After the silicone is completely peeled off, it is ultrasonically cleaned and dried. Step 9, three-stage potting: Place the ceramic composite material from step 8 into a mold with an inner arc of 190.6 mm, an outer arc of 194.9 mm, and a central angle of 102°. Pour in the Epo-Tek 301 epoxy resin colloid mixed in proportion, and vacuum to remove air bubbles. Vacuum the mixed epoxy resin colloid in a vacuum chamber to remove microbubbles, and cure at room temperature for 24 hours. Step 10, Grinding: Grind off excess epoxy resin colloid on the surface to obtain a piezoelectric phase with a volume fraction of 80%, a thickness of 4.3 mm, and an area of 340 * 77 mm. 2 High volume fraction, high thickness, large area curved surface type 1-3 piezoelectric ceramic composite materials with a bending angle of 100°, such as... Figure 3 As shown in (a) and (c).
[0027] The impedance spectrum of the piezoelectric ceramic composite material prepared in Example 1 was measured using an impedance analyzer (E4990a, Agilent, USA). The electromechanical coupling coefficient of the measured embodiment can be calculated. (Refer to...) Figure 4 ,exist Figure 4 In the impedance spectrum, the vibration modes of the type 1-3 piezoelectric composite material are pure, with no stray modes appearing. The electromechanical coupling coefficient is calculated to be 62%. In addition, the dielectric and piezoelectric properties of PZT4 ceramic and type 1-3 piezoelectric composite material are measured, as shown in Table 1. Due to the high volume fraction of the piezoelectric phase, the dielectric and piezoelectric properties of type 1-3 piezoelectric composite material are comparable to those of its piezoelectric phase itself - PZT4 ceramic.
[0028] Table 1 Performance parameters of PZT4 ceramic and type 1-3 piezoelectric composite material
[0029] To test the performance consistency of high volume fraction, high thickness, and large area curved surface piezoelectric composite materials of types 1-3, the electrodes were divided into 5 independent electrodes, such as... Figure 5 As shown in (a), Figure 5 Tables (b) and (c) show the performance of the five independent units after the partitioning, and the detailed performance parameters are shown in Table 2. f r and f a They fluctuate within small ranges of 3 kHz and 10.5 kHz, respectively. f r The relative deviation is less than 1%. Thickness coupling coefficient k t The relative constant stress dielectric constant is 60% to 62%. The values are 783 to 801. The excellent performance consistency indicates that the high volume fraction, high thickness, and large area curved piezoelectric ceramic composite materials of types 1-3 are suitable for fabricating broadband multi-beam transmission transducers, which is beneficial for reducing the difference in transmittance between channels and improving the efficiency of the entire transmission system.
[0030] Table 2 Performance of each unit after electrode segmentation
[0031] Example 2: A 2-2 type high volume fraction, high thickness, large area curved piezoelectric ceramic composite material, the structure of which is a layered structure formed by the alternating arrangement of curved piezoelectric ceramic plates and epoxy resin colloid.
[0032] Reference Figure 2 A method for preparing a 2-2 type high volume fraction, high thickness, large area curved piezoelectric ceramic composite material includes the following steps: Step 1, Ceramic Block Cutting: The thickness of the composite material is determined through simulation. 0.47Pb(Mg) 1 / 3 Nb 2 / 3O3-0.18PbZrO3-0.35PbTiO3 (Sm-PMN-PZT) ceramic was ground to 5 mm, and the large ceramic block was cut into 88 * 20 mm pieces using wire cutting. 2 This makes its size smaller than the cutting stroke of the dicing machine; Step 2, One-time cutting: Use a dicing machine to cut the ceramic into pieces with a single-cut kerf width of 0.2mm and a ceramic column width of 20 * 1.7 mm. 2 A ceramic column array with a base thickness of 2.5 mm and a transverse period of 1.9 mm was formed, leaving the ceramic base to form a ceramic skeleton. After cutting, it was ultrasonically cleaned, arranged, and dried. Step 3, one-time potting: First, mix the A phase silicone and B phase curing agent of Eco flex 00-30 two-component silicone at a 1:1 ratio to obtain a silicone solution, and then vacuum to remove air bubbles; then pour the silicone solution into the ceramic column array prepared in step 2 to fill the cut gaps once; after vacuum degassing, cure at room temperature. Step 4, Secondary Cutting: Invert the ceramic sample that was potted in Step 3, and precisely cut the ceramic base along the groove between the ceramic pillars. Then, ultrasonically clean and dry it. Step 5, Arrangement: Arrange the three ceramic blocks from Step 4 along the length on the tape. Connect the ceramic pillars of the front ceramic block with the cut seams of the rear ceramic block. The silicone in the secondary cut seams can ensure the periodicity of the spacing between the ceramic pillars. Step 6, Place into the target shape mold: Place the tape and the arranged ceramic blocks together into the target shape mold with an inner arc of 145 mm, an outer arc of 150 mm, and a central angle of 102°. Step 7, Secondary potting: First, mix the A-phase resin and B-phase curing agent of the Epo-Tek 301 two-component epoxy resin at a mass ratio of 4:1 to obtain an epoxy resin colloid. Vacuum the mixture to remove air bubbles. Then, pour the epoxy resin colloid into the ceramic column array from Step 6 to fill the secondary cutting gaps. Vacuum the mixture in a vacuum chamber to remove microbubbles. After curing at room temperature for 24 hours, the composite material of the target shape is obtained. Applying a release agent to the mold and wrapping it with aluminum foil will prevent adhesion. Step 8, peel off the silicone: The silicone in step 7 has low adhesion and is easy to peel off. After the silicone is completely peeled off, it is ultrasonically cleaned and dried. Step 9, three-stage potting: Place the ceramic composite material from step 8 into a mold with an inner arc of 145 mm, an outer arc of 150 mm, and a central angle of 102°. Pour in the Epo-Tek 301 epoxy resin colloid mixed in proportion, and vacuum to remove air bubbles. Vacuum the mixed epoxy resin colloid in a vacuum chamber to remove microbubbles, and cure at room temperature for 24 hours. Step 10, Grinding: Grind off excess epoxy resin colloid on the surface to obtain a piezoelectric phase with a volume fraction of 89.5%, a thickness of 5 mm, and an area of 262 * 20 mm. 2 High volume fraction, high thickness, large area curved surface type 2-2 piezoelectric ceramic composite materials with a bending angle of 100°, such as... Figure 3 As shown in (b) and (d) in the middle.
[0033] The beneficial effects of this embodiment are as follows: The dielectric and piezoelectric properties of Sm-PMN-PT ceramic and the 2-2 type high volume fraction, high thickness, large area curved surface piezoelectric composite material were measured, as detailed in Table 3. Due to the high volume fraction of the piezoelectric phase, the dielectric and piezoelectric properties of the 2-2 type piezoelectric composite material are comparable to those of its piezoelectric phase, Sm-PMN-PT ceramic. (Refer to...) Figure 6 ,exist Figure 6 In the impedance spectrum, due to the influence of structural parameters, stray modes appear near the thickness vibration of the 2-2 type high volume fraction, high thickness, large area curved piezoelectric composite material; the electromechanical coupling coefficient is calculated to be 56%.
[0034] Table 3 Performance parameters of Sm-PMN-PT ceramics and type 2-2 piezoelectric composites
Claims
1. A method for preparing a high-volume-fraction, high-thickness, large-area curved piezoelectric ceramic composite material, characterized in that: The aforementioned high volume fraction, high thickness, and large area curved piezoelectric ceramic composite material has a volume fraction greater than 70%, a thickness greater than 2 mm, and a length or width greater than 100 mm; it includes type 1-3 curved piezoelectric composite material and type 2-2 curved piezoelectric composite material; the structure of type 1-3 curved piezoelectric composite material is that curved piezoelectric ceramic pillars are arranged in a three-dimensional interconnected epoxy resin colloid; the structure of type 2-2 curved piezoelectric composite material is that curved piezoelectric ceramic plates are arranged alternately with epoxy resin colloid to form a laminated structure; The method for preparing a high-volume-fraction, high-thickness, large-area curved piezoelectric ceramic composite material includes the following steps: Step 1, Ceramic Cutting: The thickness of the composite material is determined by simulation. After grinding the large ceramic block to the target thickness, the large ceramic block is cut into smaller pieces by wire cutting. Step 2, one-time cutting: Use a dicing machine to cut the small ceramic pieces obtained in Step 1 into a ceramic column array, leaving the ceramic substrate to form a ceramic column skeleton. After cutting, ultrasonically clean the ceramic column array and dry it. Step 3, one-time potting: First, mix the silicone and the corresponding type and amount of curing agent evenly to obtain a silicone solution. Then, pour the silicone solution into the ceramic column array prepared in step 2 to fill the cut gaps once. After vacuum degassing, cure at room temperature. Step 4, Secondary Cutting: Invert the ceramic sample that was potted in Step 3, and precisely cut the ceramic base along the groove between the ceramic pillars. Then, ultrasonically clean and dry it. Step 5, Arrangement: Arrange multiple ceramic blocks that were cut twice in Step 4 along the length on the tape. The ceramic pillars of the front ceramic block are connected to the secondary cutting gaps of the rear ceramic block. The silicone in the secondary cutting gaps ensures the periodicity of the spacing between the ceramic pillars. Step 6, Place into the mold of the target shape: Place the tape and the arranged ceramic blocks into the mold of the target shape; Step 7, Secondary potting: First, mix epoxy resin and corresponding type and amount of curing agent evenly to obtain epoxy resin colloid. Then, pour the epoxy resin colloid into the ceramic column array in step 6 to fill the secondary cutting gaps. Vacuum the vacuum chamber to remove microbubbles. After curing at room temperature, the composite material of the target shape is obtained. Step 8, Peel off the silicone: After completely peeling off the silicone, ultrasonically clean and dry it; Step 9, three-stage potting: Place the ceramic composite material from step 8 into the mold of the target shape, pour in the mixed epoxy resin again, vacuum in a vacuum chamber to remove microbubbles, and cure at room temperature. Step 10, Grinding: Grind off excess epoxy resin colloid on the surface to obtain a large-area, high-volume-fraction, curved piezoelectric ceramic composite material.
2. The preparation method according to claim 1, characterized in that: In step 1, the ceramic pieces are cut into smaller sizes than the cutting stroke of the dicing machine.
3. The preparation method according to claim 1, characterized in that: In step 7, apply the release agent to the mold and wrap it with aluminum foil.
4. The preparation method according to claim 1, characterized in that: In steps 7 and 9, cure at room temperature for more than 24 hours.
5. The preparation method according to claim 1, characterized in that: The center of the secondary cutting slit is aligned with the center of the primary cutting slit.
6. The application of a high-volume-fraction, high-thickness, large-area curved piezoelectric ceramic composite material prepared by the preparation method according to any one of claims 1-5, characterized in that: To fabricate broadband multibeam transducers, or underwater acoustic transducers, or high-sound-level and high-power sensors.