Flexible fabric based transistor for electromechanical sensing on two and three dimensional curved surfaces

Abstract

A system of fabric-based devices designed with transistors that have a tri-modal behavior that can measure any geometry on two and three-dimensional surfaces. These devices are composed of layers of conductive material and flexible sheets that allow selective passage of signals between layers. By controlling the tension of the top and bottom lines, and interspersing conductive, semi-conductive, insulating, and semi-porous materials around the sensing layer, multiple layers of conductive signals can be achieved. These layers can be further modified to include folds and cuts that allow for two and three-dimensional bending, stretching, twisting, and bending. Large sheet devices can be organized into a grid-like matrix where the signal lines are connected in a multiplexed fashion to minimize the number of lines, simplifying the structure and device communication with a central processing unit.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Patent Application Serial No. 63 / 174,046, filed April 13, 2021, the disclosure of which is incorporated herein by reference in its entirety.

[0003] Copyright and Trade Dress Notice

[0004] This patent document contains a portion of copyrighted material. The patent document may display and / or describe content that is, or may be, the owner's trade dress. The copyright and trade dress owner does not object to any reproduction of the patent disclosure as it appears in U.S. Patent and Trademark Office documents or records, but otherwise retains all copyright and trade dress rights. Technical Field

[0005] The embodiments of the present invention belong to the field of electronic and instrumented textiles, which use a system arrangement of conductive and non-conductive wires and an algorithm for multiplexing any number of devices to monitor areas of electrical, mechanical, chemical and magnetic disturbances on various fabrics. Background Technology

[0006] Force and pressure sensitive (FPS) materials are widely used to construct sensors that help devices and machines interact with external stimuli. FPSs are typically embedded in thin or flat surfaces. FPS materials function by converting physical forces (such as pressure, bending, and stretching) into electrical outputs (such as current and / or voltage), which can be recorded by receiving devices (such as analog-to-digital converters (ADCs) or central processing units (CPUs)). Other types of FPS conversion phenomena include converting physical forces into other types of energy, such as heat, resonant energy, light energy, and ionization energy.

[0007] Commercial devices that incorporate knowledge of FPS materials and their transducer characteristics primarily use them to construct strain gauges. Strain gauges utilize physical deformation to alter the fundamental electromechanical properties of the FPS material, thereby producing a corresponding change in electrical output. Many traditional strain gauges employ specific FPS materials known as force-sensitive resistors (FSRs). FSRs can be piezoresistive and / or piezoelectric materials, which undergo physical deformation matching the applied force to change their resistivity (or conversely, their conductivity), thus altering the current and voltage output. The physical deformation is proportional to changes in the height, width, and length of the FSR material, typically following Poisson's ratio. Examples of traditional strain gauge types include linear strain gauges, membrane strain gauges, rosette strain gauges, bilinear strain gauges, quarter-bridge strain gauges, half-bridge strain gauges, full-bridge strain gauges (also known as load sensors or Wheatstone bridges), shear strain gauges, column strain gauges, displacement and beam load gauges.

[0008] Strain gauges are known to be used in applications across civil, mechanical, industrial, and robotics fields. In these fields, strain gauges are primarily used for testing and quality control, providing researchers with information about material integrity and robustness when used or misused in real-world environments. Furthermore, strain gauges can serve as feedback mechanisms, informing machines of the distance they have traveled, moved, or loaded with material. An example is a strain gauge on a robot joint, which sends feedback signals to the CPU about how the limb has moved and, if necessary, repositions itself if the signal is above or below a desired threshold.

[0009] However, it is well known that placing sensors and electromechanical components on flexible substrates (such as textiles) is extremely challenging. Reasons for the difficulty in integrating sensors and electromechanical components onto flexible substrates include: 1) the flexibility and bending properties of textiles do not conform to the flat and rigid structures of traditional electromechanical sensors and / or devices; 2) wiring for electrical connections between electromechanical devices requires planar or non-flexible surfaces; 3) electrical connections typically need to be integrated into a central processing unit (CPU) via rigid interfaces (such as integrated circuit (IC) components or transmission devices (such as WiFi, Bluetooth)); and 4) the overall assembly of devices, connections, and ICs cannot withstand tension, bending, and other mechanical deformations in the X, Y, or Z planes without damaging the components, generating noise, or otherwise harmfully altering the signal between components.

[0010] The core challenges of items 1-4 relate to the lack of flexibility in today's electronic devices. Research aimed at addressing this issue has primarily focused on using flexible printed circuit boards (PCBs) as a possible solution, allowing devices such as integrated circuits to be placed on flexible substrates with flexible copper traces. Flexible PCBs typically consist of a metal layer (usually copper) with conductive traces bonded to a dielectric layer, typically made of polyimide. The thickness of the metal layer can be made thin (<0.0001”) or thick (>0.010”), usually achieved by increasing the thickness of the dielectric layer, which can vary between 0.0005” and 0.010”. However, it is well known that flexible PCBs are more expensive to manufacture than rigid PCBs, which are made of glass fiber reinforced epoxy (also known as FR4). Furthermore, flexible PCBs still rely on placing solid components (such as resistors, capacitors, inductors, sockets, ICs, etc.) on them. Therefore, while PCBs can be flexible, attaching rigid structures to flexible PCBs hinders (e.g., reduces) flexibility and bending, especially where such rigid components are more densely positioned on the flexible PCB. Therefore, a very high degree of engineering insight is required to place, combine, and assemble rigid components onto flexible PCBs to achieve the desired flexibility. This leads to a further increase in the costs associated with using such flexible PCBs and limits their use to very specific applications.

[0011] Another area of ​​research focuses on the use of conductive inks for connecting electrical devices together. Conductive inks are typically made from emulsions of dissolved metals immersed in organic to inorganic liquids. The conductive ink is pressed onto a flexible substrate (usually a sheet of plastic or fabric) by chemical or thermodynamic means. The conductive ink acts as a coating on the flexible substrate, deposited according to a prescribed pattern that defines (e.g., at its endpoints) the conductive connections of the electronic device. Once the ink is deposited, the electronic component is attached to the designated location. One improvement of flexible substrates over flexible PCBs is that flexible substrates can be formed from a variety of materials other than polyimide or epoxy resin. However, conductive ink can only interact with the top surface of the material; therefore, flexible substrates lack many of the functional advantages associated with rigid or flexible PCBs, in which electrical connections can be fabricated in multiple layers and interconnected vias to allow for more complex circuit designs and connections. Like flexible PCBs, conductive inks are subject to similar limitations because the electrical connections formed by conductive ink are still limited by the rigid electrical components placed on top. Therefore, just like with flexible PCBs, attaching a rigid structure to a flexible substrate on which conductive ink has been deposited inevitably hinders (e.g., reduces) the flexibility and bending of the flexible substrate. Furthermore, conductive inks are known to wear down over time (e.g., corrode or otherwise degrade). When applied to fabrics, conductive inks exhibit properties similar to paint, hot-press vinyl, or molds, causing the conductive ink deposited in the conductive pattern to peel, crack, and / or detach over time and with repeated use. Consequently, the electrical connections provided by using such conductive inks will also fade, tear, or otherwise fail due to the passage of time and / or use. Therefore, the lifespan of conductive inks is significantly shorter compared to PCBs, whether rigid or flexible. Summary of the Invention

[0012] The subject matter of this disclosure will now be described more fully below, including some (but not all) embodiments thereof. In fact, the subject matter of this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to enable this disclosure to meet applicable legal requirements.

[0013] In one or more embodiments, this document describes systems, methods, and apparatuses that depict various aspects of textile-based force sensors in 2D and 3D electromechanical surfaces.

[0014] According to an example embodiment, this document discloses an apparatus (e.g., a sensing device) comprising: a passive element formed of a plurality of separate layers sequentially stacked on top of each other and comprising: a plurality of insulating layers, each insulating layer comprising an insulating material; at least one sensing layer, each sensing layer comprising a conductive or semi-conductive material; a plurality of conductive layers, each conductive layer comprising a conductive material; and at least one semi-porous layer, each semi-porous layer comprising a semi-porous material; wherein all the plurality of conductive layers are connected through one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and / or at least one semi-porous layer. The passive element comprises one or more layers separated from each other; optionally, at least some or all of the plurality of conductive layers are spaced apart from the at least one sensing layer by at least one semi-porous layer; and the passive element comprises one or more of the characteristics of resistance, capacitance and inductance; the device further comprises: a first insulating layer disposed above the top surface of the passive element; a second insulating layer disposed on the bottom surface of the passive element; and one or more conductive wires, each conductive wire being electromechanically attached to one of the plurality of conductive layers of the passive element and also exposed on and / or embedded in the first insulating layer or the second insulating layer.

[0015] In some embodiments of the device, multiple individual layers of passive components are cut and / or folded to stack on top of each other and secured together by one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling and / or casting.

[0016] In some embodiments, the device is configured to cut and / or fold to conform to irregular surface geometries, optionally including irregular surface geometries on one or more of clothing, body parts, vehicles, household appliances and / or furniture.

[0017] In some embodiments of the device, multiple insulating layers and multiple conductive layers are located on the same side as at least one sensing layer.

[0018] In some embodiments of the device, the first and second conductive layers of the plurality of conductive layers each include a pattern of conductive material to control the resistance, capacitance and / or inductance characteristics of the passive components.

[0019] In some embodiments of the device, for at least one sensing layer and / or at least some of the conductive layers, the thickness, chemical composition, porosity, area of ​​the intersection region of the top and bottom conductive layers, thickness of the trace, number of turns in the pattern, spacing between intertwined conductive traces, and / or distance from the sensitive material of the material are selected to control the device's response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0020] In some embodiments of the device, the first conductive layer and the second conductive layer are positioned opposite each other on the sensing layer; the at least one semi-porous layer includes the first semi-porous layer and the second semi-porous layer; the first semi-porous layer is disposed between the first conductive layer and the sensing layer; the second semi-porous layer is disposed between the second conductive layer and the sensing layer; the semi-porous material of each of the first and second semi-porous layers is selected to control the device's response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0021] In some embodiments, the device includes one or more additional layers bonded to the first and / or second insulation layer, the one or more additional layers including one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials and metal-like materials.

[0022] In some embodiments of the device, one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling, and casting are used to combine each of a plurality of insulating layers, at least one sensing layer, a plurality of conductive layers, and at least one semi-porous layer together.

[0023] In some embodiments of the device, the edges of the device are completed by one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, rolling, and casting.

[0024] In some embodiments of the device, the one or more conductive lines include a plurality of conductive lines configured to be arranged at any location on and / or within the device.

[0025] In some embodiments of the device, multiple conductive wires are arranged by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery.

[0026] In some embodiments of the device, multiple conductive wires are filled within the device with a porous or semi-conductive material.

[0027] In some embodiments of the device, multiple conductive lines are attached to a passive or active filter component, which is configured to perform one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

[0028] In some embodiments of the device, multiple conductive lines are terminated to a connector attached to a controller configured to assemble input data, thereby creating assembled data and transmitting the assembled data to a receiving device.

[0029] In some embodiments of the device, the area between the points where the sensing layer contacts the multiple conductive lines defines the area on which the passive element is sensitive.

[0030] In some embodiments of the device, at least one sensing layer includes multiple sensing layers configured to distinctly determine the direction of an excitation applied to the device in any one of the X, Y, and Z planes.

[0031] In some implementations, the device includes a switch configured to switch measurements of one of a plurality of sensing layers.

[0032] In some implementations, the device is configured to use logic gates, clocks, and / or a CPU to time and deconvolve output signals from multiple sensing layers.

[0033] In some embodiments of the device, one or more conductive lines include multiple conductive lines that are folded into different layers within the device.

[0034] In some embodiments, the device is configured such that, by changing the input signal on at least one conductive material of one or more conductive layers, a signal from a passive element is distinguishably switched on or off, or enters a high Z state via at least one semi-porous layer.

[0035] In some implementations, the device is configured to enter an on state, an off state, or a high Z state based on the direction of the excitation applied to the device when the direction of the excitation is the same as the direction in which at least one semi-porous layer is positioned between one of the plurality of conductive layers and at least one sensing layer.

[0036] In some embodiments of the device, passive elements are configured to cut and / or fold in any of the X, Y, and Z directions to distinguish the excitation applied to the device in any of the X, Y, and Z planes.

[0037] In some implementations, the device is configured to interact with the user for motion capture purposes.

[0038] In some implementations, the device can be folded, bent, and / or rolled up by the user.

[0039] In some implementations, the device is configured to be stored, carried, and / or transported by a user.

[0040] In some embodiments, the device is configured to be mounted on one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic materials, organic materials, and metamaterials.

[0041] In some implementations, the device is configured to connect to a receiving device for use in online, offline, cloud-based, and external storage applications.

[0042] In some implementations, the device is configured to generate data that is used by the user for algorithmic and / or computerized activities.

[0043] In some implementations, the device is configured to generate data for machine learning activities.

[0044] According to another example embodiment, a device (e.g., a sensing device) is disclosed herein, comprising: a first passive element and a second passive element, each formed of a plurality of separate layers sequentially stacked on top of each other, and comprising: a plurality of insulating layers, each insulating layer comprising an insulating material; at least one sensing layer, each sensing layer comprising a conductive material or a semi-conductive material; a plurality of conductive layers, each conductive layer comprising a conductive material; and at least one semi-porous layer, each semi-porous layer comprising a semi-porous material; wherein all of the plurality of conductive layers are separated from each other by one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and / or one or more of the at least one semi-porous layer; optionally, wherein the plurality of At least some or all of the conductive layers are spaced apart from the at least one sensing layer through the at least one semi-porous layer; and each of the first passive element and the second passive element includes one or more of resistive, capacitive, and inductive characteristics; the device further includes: a first insulating layer disposed above the top surfaces of the first passive element and the second passive element; a second insulating layer disposed above the bottom surfaces of the first passive element and the second passive element; and a plurality of conductive lines, each conductive line being electromechanically attached to, exposed to, and / or embedded in the first passive element and the second passive element and / or the first insulating layer and the second insulating layer; optionally, the first and second passive elements are arranged to form a laterally extending array of passive elements.

[0045] In some embodiments of the device, multiple individual layers of the first and / or second passive elements may be cut and / or folded to be embedded within layers of fabric material by one or more of sewing, embroidery, hot pressing, adhesive bonding, ultrasonic welding, folding, curling and / or casting.

[0046] In some embodiments, the device is configured to cut and / or fold to conform to irregular surface geometries, optionally including one or more of clothing, body parts, vehicles, household appliances, and / or furniture.

[0047] In some embodiments of the device, the first passive element and the second passive element are combined in a configuration that is located on the same surface of the fabric, on opposite surfaces of the fabric, on different surfaces of the fabric, cut and stacked on top of each other, or folded together.

[0048] In some embodiments of the device, the first passive element and the second passive element share at least one of a plurality of conductive wires.

[0049] In some embodiments of the device, the angular position of the first passive element relative to the second passive element is selected to control the directional sensitivity and / or the average sensitivity of the device.

[0050] In some embodiments of the device, the surface area of ​​a first passive element and / or a second passive element is selected to control the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0051] In some embodiments of the device, the thickness of the first passive element and / or the second passive element is selected to control the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0052] In some embodiments of the device, the spacing between the first passive element and / or the second passive element is selected to control the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0053] In some embodiments of the device, the device is configured to interpolate signals from a first passive element and signals from a second passive element to form secondary signals located within the first and second passive elements.

[0054] In some embodiments of the device, the device is configured to read signals from a first passive element and / or a second passive element distinctly via a serial communication protocol, said serial communication protocol including one or more of single-wire, two-wire, MOSI-MISO, PCI, bus, and serial peripheral interface.

[0055] In some embodiments of the device, the device is configured such that by changing the input signal on at least one conductive material of the plurality of conductive layers of the first and / or second passive elements, signals from the first and / or second passive elements are either turned on or off separately, or enter a high Z state via at least one semi-porous layer of the first and / or second passive elements respectively.

[0056] In some embodiments of the device, multiple conductive wires are shared between the first passive element and the second passive element.

[0057] In some embodiments of the device, in the first and / or second passive element, a plurality of insulating layers and a plurality of conductive layers are located on the same side as at least one sensing layer.

[0058] In some embodiments of the device, in the first and / or second passive element, the first and second conductive layers of the plurality of conductive layers each include a pattern of conductive material to control the resistance, capacitance and / or inductance characteristics of the passive element.

[0059] In some embodiments of the device, in the first and / or second passive element, for at least some of the at least one sensing layer and / or multiple conductive layers, the thickness, chemical composition, porosity, area of ​​the intersection region of the top and bottom conductive layers, trace thickness, number of turns in the pattern, spacing between intertwined conductive traces, and / or distance from the sensitive material of the material are selected to control the device's response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0060] In some embodiments of the device, a first conductive layer and a second conductive layer are positioned opposite each other on the sensing layer; at least one semi-porous layer includes a first semi-porous layer and a second semi-porous layer; the first semi-porous layer is disposed between the first conductive layer and the sensing layer; the second semi-porous layer is disposed between the second conductive layer and the sensing layer; the semi-porous material of each of the first and second semi-porous layers is selected to control the device's response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity.

[0061] In some embodiments, the device includes one or more additional layers bonded to the first and / or second insulation layer, the one or more additional layers including one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials and metal-like materials.

[0062] In some embodiments of the device, one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling, and casting are used to combine each of a plurality of insulating layers, at least one sensing layer, a plurality of conductive layers, and at least one semi-porous layer together.

[0063] In some embodiments of the device, the edges of the device are completed by one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, rolling, and casting.

[0064] In some embodiments of the device, multiple conductive wires are configured to be arranged at any location on and / or within the device.

[0065] In some embodiments of the device, multiple conductive wires are folded into different layers within the device.

[0066] In some embodiments of the device, multiple conductive wires are arranged by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery; and / or the multiple conductive wires are filled within the device with a porous or semi-conductive material.

[0067] In some embodiments of the device, multiple conductive lines are attached to a passive or active filter component, which is configured to perform one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

[0068] In some embodiments of the device, multiple conductive lines are terminated on a connector attached to a controller configured to assemble input data, thereby creating assembled data and transmitting the assembled data to a receiving device.

[0069] In some embodiments of the device, the area between the points where the sensing layer contacts the multiple conductive lines defines the area on which the passive element is sensitive.

[0070] In some embodiments of the device, at least one sensing layer includes multiple sensing layers configured to distinctly determine the direction of an excitation applied to the device in any one of the X, Y, and Z planes.

[0071] In some implementations, the device includes a switch configured to switch measurements of one of a plurality of sensing layers.

[0072] In some implementations, the device is configured to use logic gates, clocks, and / or a CPU to time and deconvolve output signals from multiple sensing layers.

[0073] In some embodiments of the device, one or more conductive wires include multiple conductive wires that are folded into different layers within the device.

[0074] In some embodiments, the device is configured such that, by changing the input signal on at least one conductive material of one or more conductive layers, a signal from a passive element is distinguishably switched on or off, or enters a high Z state via at least one semi-porous layer.

[0075] In some implementations, the device is configured to enter an on state, an off state, or a high Z state based on the direction of the excitation applied to the device when the direction of the excitation is the same as the direction in which at least one semi-porous layer is positioned between one of the plurality of conductive layers and at least one sensing layer.

[0076] In some embodiments of the device, the first passive element and the second passive element are configured to cut and / or fold in any of the X, Y, and Z directions to distinguish the excitation applied to the device in any of the X, Y, and Z planes.

[0077] In some implementations, the device is configured to interact with the user for motion capture purposes.

[0078] In some implementations, the device can be folded, bent, and / or rolled up by the user.

[0079] In some implementations, the device is configured to be stored, carried, and / or transported by a user.

[0080] In some embodiments, the device is configured to be mounted on one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic materials, organic materials, and metamaterials.

[0081] In some implementations, the device is configured to connect to a receiving device for online, offline, cloud-based, and external storage applications.

[0082] In some implementations, the device is configured to generate data that is available to a user for use in algorithmic and / or computerized activities.

[0083] In some implementations, the device is configured to generate data for machine learning activities.

[0084] In some embodiments of the device, the first passive device and the second passive device are arranged spaced apart from each other in the X direction, Y direction and / or Z direction, such that the device is configured to measure the excitation applied to the device in the X plane, Y plane and / or Z plane respectively.

[0085] According to another exemplary embodiment, this document provides a method for manufacturing a sensing device, the method comprising: sequentially stacking a plurality of individual layers on top of each other to form a passive element, the passive element comprising: a plurality of insulating layers, each insulating layer comprising an insulating material; at least one sensing layer, each sensing layer comprising a conductive or semi-conductive material; a plurality of conductive layers, each conductive layer comprising a conductive material; and at least one semi-porous layer, each semi-porous layer comprising a semi-porous material; wherein all conductive layers of the plurality of conductive layers are separated from each other by one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and / or one or more of the at least one semi-porous layer; optionally, at least some or all of the plurality of conductive layers are spaced apart from the at least one sensing layer by the at least one semi-porous layer; and wherein the passive element comprises one or more of resistive, capacitive, and inductive characteristics; the method further comprising: disposing a first insulating layer above a top surface of the passive element; disposing a second insulating layer above a bottom surface of the passive element; and electromechanically attaching each of one or more conductive wires to one of the plurality of conductive layers such that each of the one or more conductive wires is exposed on and / or embedded within the first or second insulating layer.

[0086] In some embodiments, the method includes: cutting and / or folding multiple individual layers to stack on top of each other; and securing the multiple individual layers together by one or more of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling, and / or casting.

[0087] In some embodiments, the method includes cutting and / or folding the sensing device to conform to an irregular surface geometry, optionally wherein the irregular surface geometry includes one or more of clothing, body parts, vehicles, home appliances, and / or furniture.

[0088] In some embodiments of the method, multiple insulating layers and multiple conductive layers are located on the same side as at least one sensing layer.

[0089] In some embodiments of the method, the first and second conductive layers of the plurality of conductive layers each include a pattern of conductive material to control the resistance, capacitance and / or inductance characteristics of the passive element.

[0090] In some embodiments, the method includes controlling the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of a sensing device by adjusting the thickness, chemical composition, porosity, area of ​​the intersection region of the top and bottom conductive layers, thickness of the traces, number of turns in the pattern, spacing between the wound conductive traces, and / or distance from the sensitive material of at least some selected materials in at least one sensing layer and / or multiple conductive layers.

[0091] In some embodiments of the method, the first conductive layer and the second conductive layer are positioned opposite each other on the sensing layer; at least one semi-porous layer includes the first semi-porous layer and the second semi-porous layer; the method further includes: disposing the first semi-porous layer between the first conductive layer and the sensing layer; and disposing the second semi-porous layer between the second conductive layer and the sensing layer; wherein the semi-porous material of each of the first and second semi-porous layers is selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise suppression ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

[0092] In some embodiments, the method includes bonding one or more additional layers to a first and / or second insulating layer, the one or more additional layers including one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials, and metal-like materials.

[0093] In some embodiments, the method includes combining each of a plurality of insulating layers, at least one sensing layer, a plurality of conductive layers, and at least one semi-porous layer together using one or more of stitching, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling, and casting.

[0094] In some embodiments, the method includes completing the edge of the sensing device by one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, rolling, and casting.

[0095] In some embodiments of the method, one or more conductive lines include a plurality of conductive lines arranged at any location on and / or within the sensing device.

[0096] In some embodiments of the method, multiple conductive wires are arranged by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery; and / or the multiple conductive wires are filled within the device with a porous or semi-conductive material.

[0097] In some embodiments, the method includes filling a plurality of conductive lines within a sensing device with a porous or semiconductive material.

[0098] In some implementations, the method includes attaching a plurality of conductive lines to a passive or active filter component to perform one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

[0099] In some implementations, the method includes: terminating a plurality of conductive wires to a connector attached to a controller; using the controller to assemble input data to create assembled data; and transmitting the assembled data to a receiving device.

[0100] In some implementations of this method, the region between the points where the sensing layer contacts the multiple conductive lines defines the area on which the passive element is sensitive.

[0101] In some embodiments of the method, at least one sensing layer includes multiple sensing layers, and the method includes using the multiple sensing layers to distinguish the direction of an excitation applied to a sensing device in any one of the X-plane, Y-plane, and Z-plane.

[0102] In some embodiments of the method, the sensing device includes a switch, and the method includes using the switch to switch a measurement of one of a plurality of sensing layers.

[0103] In some implementations, the method includes timing and deconvolution of output signals from multiple sensing layers using logic gates, clocks, and / or a CPU.

[0104] In some embodiments of the method, one or more conductive lines include multiple conductive lines that are folded into different layers within the sensing device.

[0105] In some implementations, the method includes altering an input signal on at least one conductive material of one or more conductive layers to control signals from passive elements to be selectively turned on or off, or to enter a high Z state via at least one semi-porous layer.

[0106] In some embodiments of the method, when the direction of the excitation is the same as the positioning direction of at least one semi-porous layer between one of the plurality of conductive layers and at least one sensing layer, the sensing device enters an on state, an off state, or a high Z state based on the direction of the excitation applied to the sensing device.

[0107] In some embodiments, the method includes cutting and / or folding passive elements along any of the X, Y, and Z directions to respectively measure the excitation applied to the sensing device along any of the X, Y, and Z planes.

[0108] In some implementations of this method, the sensing device may interact with the user for motion acquisition purposes.

[0109] In some embodiments of the method, the sensing device may be folded, bent, and / or rolled up by the user.

[0110] In some embodiments of this method, the sensing device may be stored, carried, and / or transported by the user.

[0111] In some embodiments, the method includes mounting the sensing device onto one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic material, organic material, and metamaterial.

[0112] In some implementations, the method includes connecting a sensing device to a receiving device for use in online, offline, cloud-based, and external storage applications.

[0113] In some implementations of this method, sensing can generate data that is available to the user for algorithmic and / or computerized activities.

[0114] In some implementations of this method, the sensing device can generate data for machine learning activities.

[0115] In some implementations, the method includes optimizing the stitching path of one or more conductive lines to enhance the signal-to-noise ratio and / or common-mode rejection of the sensing device. Optionally, optimizing the stitching path includes using one or more search algorithms, which may include depth-first search, breadth-first search, nearest neighbor, and clustering.

[0116] According to another example embodiment, this document provides a method of manufacturing a sensing device, the method comprising: sequentially stacking a first plurality of individual layers on top of each other to form a first passive element; and sequentially stacking a second plurality of individual layers on top of each other to form a second passive element; wherein each of the first and second passive elements comprises: a plurality of insulating layers, each insulating layer comprising an insulating material; at least one sensing layer, each sensing layer comprising a conductive or semi-conductive material; a plurality of conductive layers, each conductive layer comprising a conductive material; and at least one semi-porous layer, each semi-porous layer comprising a semi-porous material; wherein all conductive layers of the plurality of conductive layers are separated from each other by one or more of the plurality of insulating layers, one or more of the at least one sensing layer, and / or one or more of the at least one semi-porous layer; optionally, at least some or all of the plurality of conductive layers are separated from each other by... The method further includes: a first insulating layer spaced apart from the at least one sensing layer via the at least one semi-porous layer; and each of the first passive element and the second passive element includes one or more of resistive, capacitive, and inductive characteristics; the method also includes: disposing a first insulating layer above the top surfaces of the first passive element and the second passive element; disposing a second insulating layer above the bottom surfaces of the first passive element and the second passive element; and electromechanically attaching each of a plurality of conductive lines to one of a plurality of conductive layers of the first and / or second passive element, such that each of the plurality of conductive lines is exposed above, and / or embedded within, one or more of the first passive element, the second passive element, and the first and second insulating layers; optionally, the first and second passive elements are arranged to form a laterally extending array of passive elements.

[0117] In some embodiments, the method includes cutting and / or folding a first plurality of separate layers of a first passive element and / or a second plurality of separate layers of a second passive element for embedding within one or more layers of fabric material by sewing, embroidery, hot pressing, adhesive bonding, ultrasonic welding, folding, curling and / or casting.

[0118] In some embodiments, the method includes cutting and / or folding the sensing device to conform to an irregular surface geometry, optionally wherein the irregular surface geometry includes one or more of clothing, body parts, vehicles, home appliances, and / or furniture.

[0119] In some embodiments, the method includes combining a first passive element and a second passive element in a configuration that is cut and stacked on top of each other, or folded together on the same surface of the fabric, on opposite surfaces of the fabric, on different surfaces of the fabric, on the cut and stacked on top of each other, or on the cut and stacked together.

[0120] In some embodiments, the method includes a first passive element and a second passive element sharing at least one of a plurality of conductive lines.

[0121] In some implementations, the method includes selecting the angular position of the first passive element relative to the second passive element to control the directional sensitivity of the sensing device and / or the average sensitivity of the sensing device.

[0122] In some implementations, the method includes selecting the surface area of ​​a first passive element and / or a second passive element to control the response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

[0123] In some implementations, the method includes selecting the thickness of a first passive element and / or a second passive element to control the response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

[0124] In some implementations, the method includes selecting the spacing between a first passive element and / or a second passive element to control the response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

[0125] In some embodiments, the method includes interpolating signals from a first passive element and signals from a second passive element to form a secondary signal located within the first and second passive elements.

[0126] In some implementations, the method includes reading signals differentially from a first passive element and / or a second passive element via a serial communication protocol, which includes one or more of single-wire, two-wire, MOSI-MISO, PCI, bus, and serial peripheral interface.

[0127] In some embodiments, the method includes altering the input signal on at least one conductive material of a plurality of conductive layers of the first and / or second passive element, such that the signal from the first and / or second passive element is selectively turned on or off, or enters a high Z state via at least one semi-porous layer of the first and / or second passive element, respectively.

[0128] In some embodiments of this method, multiple conductive lines are shared between the first passive element and the second passive element.

[0129] In some embodiments of the method, in the first passive element and / or the second passive element, a plurality of insulating layers and a plurality of conductive layers are located on the same side as at least one sensing layer.

[0130] In some embodiments of the method, in the first and / or second passive element, the first and second conductive layers of the plurality of conductive layers each include a pattern of conductive material to control the resistance, capacitance and / or inductance characteristics of the passive element.

[0131] In some embodiments of the method, in the first and / or second passive element, for at least some of the at least one sensing layer and / or multiple conductive layers, the thickness, chemical composition, porosity, area of ​​the intersection region of the top and bottom conductive layers, thickness of the trace, number of turns in the pattern, spacing between intertwined conductive traces, and / or distance from the sensitive material of the material are selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

[0132] In some embodiments of the method, for one or both of the first passive element and the second passive element: the first conductive layer and the second conductive layer are located on opposite sides of the sensing layer; at least one semi-porous layer includes the first semi-porous layer and the second semi-porous layer; the first semi-porous layer is disposed between the first conductive layer and the sensing layer; the second semi-porous layer is disposed between the second conductive layer and the sensing layer; the semi-porous material of each of the first and second semi-porous layers is selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity and / or insensitivity of the sensing device.

[0133] In some embodiments, the method includes bonding one or more additional layers to a first and / or second insulating layer, the one or more additional layers including one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials, and metal-like materials.

[0134] In some embodiments, the method includes, for one or both of the first passive element and the second passive element, combining each of a plurality of insulating layers, at least one sensing layer, a plurality of conductive layers and at least one semi-porous layer together using one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, curling and casting.

[0135] In some embodiments, the method includes completing the edge of the sensing device by one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, rolling, and casting.

[0136] In some implementations, the method includes arranging a plurality of conductive lines at any location on and / or within the sensing device.

[0137] In some implementations, the method includes folding multiple conductive wires into different layers within the sensing device.

[0138] In some embodiments, the method includes: arranging a plurality of conductive wires by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery; and / or filling the plurality of conductive wires within a device with a porous or semi-conductive material.

[0139] In some embodiments, the method includes attaching a plurality of conductive lines to a passive or active filter component, the passive or active filter component performing one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

[0140] In some implementations, the method includes: terminating a plurality of conductive lines to a connector attached to a controller; using data input to the controller to create assembled data; and transmitting the assembled data to a receiving device.

[0141] In some implementations of this method, the region between the points where the sensing layer contacts the multiple conductive lines defines the area on which the passive element is sensitive.

[0142] In some embodiments of the method, in the first and / or second passive element, at least one sensing layer includes multiple sensing layers, and the method includes: determining, via the multiple sensing layers, the direction of an excitation applied to the sensing device in any one of the X-plane, Y-plane, and Z-plane.

[0143] In some embodiments of the method, the first and / or second passive element includes a switch, and the method includes using one or more switches to switch measurements of one of a plurality of sensing layers of the first and / or second passive element.

[0144] In some implementations, the method includes timing and deconvolution of output signals from multiple sensing layers of first and / or second passive elements using logic gates, clocks, and / or a CPU.

[0145] In some implementations, the method includes folding multiple conductive lines into different layers within the sensing device.

[0146] In some embodiments, the method includes, for the first and / or second passive element, altering the input signal on at least one conductive material of one or more conductive layers such that the signal from the first and / or second passive element is respectively turned on or off, or enters a high Z state via at least one semi-porous layer.

[0147] In some embodiments, the method includes: applying an excitation to a sensing device in one direction; and, based on the direction of the excitation relative to the sensing device, when the direction of the excitation is the same as the positioning direction of at least one semi-porous layer between one of the plurality of conductive layers of the first and / or second passive element and at least one sensing layer, the first and / or second passive element enters an on state, an off state, or a high Z state.

[0148] In some embodiments, the method includes cutting and / or folding a first passive element and a second passive element along any of the X, Y, and Z directions to differentiate the excitation applied to the sensing device in any of the X, Y, and Z planes.

[0149] In some implementations of this method, the sensing device may interact with the user for motion acquisition purposes.

[0150] In some embodiments of the method, the sensing device may be folded, bent, and / or rolled up by the user.

[0151] In some embodiments of this method, the sensing device may be stored, carried, and / or transported by the user.

[0152] In some embodiments, the method includes mounting the sensing device onto one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic material, organic material, and metamaterial.

[0153] In some implementations, the method includes connecting a sensing device to a receiving device for use by online, offline, cloud-based, and external storage applications.

[0154] In some embodiments of this method, the sensing device can generate data that is available to the user for use in algorithms and / or computerized activities.

[0155] In some implementations of this method, the sensing device can generate data for machine learning activities.

[0156] In some embodiments, the method includes arranging a first passive element and a second passive element spaced apart from each other in the X direction, Y direction and / or Z direction, such that the sensing device can separately measure the excitation applied to the sensing device in the X plane, Y plane and / or Z plane.

[0157] In some implementations, the method includes optimizing the stitching path of multiple conductive lines to enhance the signal-to-noise ratio and / or common-mode rejection of the sensing device. Optionally, optimizing the stitching path includes using one or more search algorithms, which may include depth-first search, breadth-first search, nearest neighbor, and clustering.

[0158] In some embodiments, the method includes controlling one or more of the tension, pitch, duty cycle, pin width, and pin length of one or more of a plurality of conductive lines on different layers, such that a first passive element and a second passive element overlap each other and, optionally, do not intersect with the conductive lines or their connections.

[0159] In some embodiments, the method includes: folding and / or cutting layers of the sensing device; deforming the sensing device into a two-dimensional or three-dimensional geometry; wherein, by folding and / or cutting and deforming the sensing device, a first passive element and a second passive element overlap with each other with a plurality of conductive lines associated therewith, and optionally, do not intersect with the conductive lines or their connections to each other.

[0160] According to another example implementation, this document provides a sensing system comprising a plurality of devices according to the subject matter disclosed herein, wherein the plurality of devices are arranged in the form of an array or matrix of devices.

[0161] According to another example implementation, a method for manufacturing a sensing system is disclosed herein, the method comprising: providing a plurality of devices according to the subject matter disclosed herein; and arranging the plurality of devices in the form of an array or matrix of devices.

[0162] In some embodiments, the device includes a layered fabric surface comprising: a first passive element having characteristics selected from the group consisting of resistive, capacitive, or inductive properties, including: a first layer serving as a flexible substrate; a second layer serving as a conductive layer, wherein the second layer is bonded to the first layer; a third layer serving as a semiconductive layer, wherein the third layer is stacked on top of the second layer; a fourth layer serving as a conductive layer, wherein the fourth layer is stacked on top of the third layer; and a fifth layer serving as a flexible substrate, wherein the fifth layer is bonded to the fourth layer; a first insulating element, wherein the first insulating element is stacked on top of the first passive element; a second insulating element, wherein the second insulating element is stacked below the first passive element; and a plurality of conductive materials, wherein the plurality of conductive materials are electromechanically attached to the first passive element, and wherein the plurality of conductive materials are electromechanically exposed on or embedded in the first or second insulating element.

[0163] In some embodiments, the layer including the first passive element is configured to be embedded and folded within the layer, performed by a process selected from the group consisting of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding and casting.

[0164] In some implementations, the first layer and the second layer of the passive element are located on the same side as the fourth layer and the fifth layer of the passive element.

[0165] In some embodiments, the pattern of the conductive material on the second layer of the passive element and the pattern of the conductive material on the fourth layer of the passive element are configured to change the resistance, capacitance, or conductivity characteristics of the first passive element.

[0166] In some implementations, the thickness, chemical composition, porosity, area of ​​the intersection of the top and bottom conductive layers, thickness of the traces, number of turns in the pattern, spacing between the wound conductive traces, or distance from the sensitive material are configured to change the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, device sensitivity, or device insensitivity.

[0167] In some implementations, an additional layer is placed between the second and third layers of the passive element, or between the fourth and third layers of the passive element, to alter the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, device sensitivity, or device insensitivity.

[0168] In some embodiments, the additional layer is bonded to the first or second insulating layer of the device, and the material of the additional layer is selected from the group consisting of glass, wood, gravel, synthetic materials, leather, and metalloid materials.

[0169] In some implementations, the layers are combined using a combination of techniques selected from sewing, embroidery, hot pressing, adhesives, ultrasonic welding, and casting.

[0170] In some implementations, the edges of the equipment are finished using a process selected from the group consisting of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, and casting.

[0171] In some implementations, multiple conductive materials are configured to be placed at any location within the device.

[0172] In some implementations, multiple conductive materials are folded into different layers within the device.

[0173] In some embodiments, a variety of conductive materials are manufactured using a process selected from the group consisting of sewing, weaving, embroidery, bonding, hot pressing, screen printing, vinyl cutting, and inkjet printing.

[0174] In some implementations, multiple conductive materials are used to fill the device with porous or semi-conductive materials.

[0175] In some implementations, multiple conductive materials are attached to passive or active filter components, which are configured to perform operations selected from a group consisting of low-pass, high-pass, band-pass, and notch filters.

[0176] In some implementations, multiple conductive materials are terminated on a connector, which is attached to a control module configured to assemble input data and send the assembled data to a receiving device connected to the Internet.

[0177] In some embodiments, the device includes a layered fabric surface comprising: a first passive element having characteristics selected from the group consisting of resistive, capacitive, or inductive characteristics; a second passive element having characteristics selected from the group consisting of resistive, capacitive, or inductive characteristics; a first insulating element stacked on top of the first passive element; a second insulating element stacked below the first passive element; and a plurality of conductive materials, wherein the plurality of conductive materials are electromechanically attached to, exposed on, or embedded in the first and second passive elements.

[0178] In some implementations, the layer including the first passive element can be embedded and folded within an existing layer by a process selected from the group consisting of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding and casting.

[0179] In some embodiments, the first passive element and the second passive element are constructed in combination with a group of elements selected from those composed of the same surface, composed of opposite surfaces, and stacked and folded together.

[0180] In some embodiments, the first passive element and the second passive element share at least one conductive material from a variety of conductive materials.

[0181] In some implementations, the relative angular positioning of the first passive element and the second passive element alters the directional sensitivity of the device as well as the overall average sensitivity of the device.

[0182] In some implementations, the surface area of ​​the first passive element or the second passive element alters the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensor sensitivity, or device insensitivity.

[0183] In some implementations, the thickness of the first passive element or the second passive element alters the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensor sensitivity, or device insensitivity.

[0184] In some implementations, the spacing between the first passive element or the second passive element alters the device's response time, input dynamic range, output dynamic range, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensor sensitivity, or device insensitivity.

[0185] In some implementations, signals from the first passive element and signals from the second passive element are interpolated to form secondary signals located within the first and second passive elements.

[0186] In some implementations, signals from the first passive element or the second passive element are read separately using a serial communication protocol selected from the group consisting of single-wire, two-wire, MOSI-MISO, PCI, bus, and serial peripheral interface.

[0187] In some implementations, signals from a first passive element or a second passive element are turned on or off by changing the voltage on at least one of a plurality of conductive materials.

[0188] In some implementations, multiple conductive materials are shared between the first passive element and the second passive element.

[0189] In some implementations, the edges of the equipment are finished using a process selected from the group consisting of sewing, embroidery, hot pressing, adhesives, ultrasonic welding, and casting.

[0190] In some implementations, multiple conductive materials are configured to be placed at arbitrary locations within the device.

[0191] In some implementations, multiple conductive materials are folded into different layers within the device.

[0192] In some embodiments, multiple conductive materials are manufactured using a process selected from the group consisting of sewing, weaving, embroidery, bonding, hot pressing, screen printing, vinyl cutting, and inkjet printing.

[0193] In some implementations, multiple conductive materials are filled within the device with porous or semi-conductive materials.

[0194] In some implementations, multiple conductive materials are attached to passive or active filter components, which are configured to perform operations selected from a group consisting of low-pass, high-pass, band-pass, and notch filters.

[0195] In some implementations, multiple conductive materials are terminated on a connector, which is attached to a control module configured to assemble input data and send the assembled data to a receiving device connected to the Internet.

[0196] In some implementations, the device includes a layered fabric surface configured for handheld use by a user for motion acquisition purposes.

[0197] In some implementations, the user can fold, bend, or roll up the device.

[0198] In some implementations, users are able to store, carry, or transport the device.

[0199] In some implementations, the user can mount the device onto a surface selected from the group consisting of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic materials, and metamaterials.

[0200] In some implementations, the device can be connected to a receiving device for use in a group selected from online, offline, cloud, and external storage.

[0201] In some implementations, users are able to use the data for algorithms and computerized activities.

[0202] In some implementations, users are able to use the data for machine learning activities. Attached Figure Description

[0203] The accompanying drawings illustrate several exemplary embodiments and are part of the specification. These drawings, together with the following description, illustrate and explain various principles of this disclosure.

[0204] Figure 1A This is a schematic diagram of an example implementation of a computer numerical control (CNC) multi-needle embroidery machine.

[0205] Figure 1B This is a cross-sectional view of an example embodiment of a stitched pattern, in which the thread is stitched into a flexible material.

[0206] Figure 1C yes Figure 1B An isometric view of the stitching pattern shown.

[0207] Figure 2A-2C It is a cross-sectional view showing how different pin lengths affect the number of lines exposed on the surface of the flexible material between the pins when the top and bottom pins have equal tension, when the top pin has higher tension than the bottom pin, and when the top pin has lower tension than the bottom pin.

[0208] Figure 2B This is a cross-sectional view illustrating an exemplary embodiment of a stitching pattern with high tension in the top thread.

[0209] Figure 2C This is a cross-sectional view illustrating an exemplary embodiment of a stitching pattern with low tension in the top thread.

[0210] Figure 3 This is a cross-sectional view of an example embodiment of a sewn pattern, wherein the top and bottom threads are sewn to the top or bottom surface of a layer of multilayer fabric by controlling the tension of the top and bottom threads.

[0211] Figure 4This is a cross-sectional view of another example implementation of the sewn pattern, in which the top and bottom lines are sewn together to have intersections embedded within designated layers of multi-layered fabric.

[0212] Figure 5A This is a schematic diagram illustrating how thread tension can be used to control the surface exposure of the top and bottom threads of a stitch pattern when two or more stitches intersect each other in a two-dimensional plane.

[0213] Figure 5B yes Figure 5A The schematic diagram shown is a cross-sectional view at the intersection of the two suture lines.

[0214] Figure 6 This is an exploded view of an exemplary embodiment of a multilayer fabric formed by layers with applied thread stitching patterns.

[0215] Figure 7A This is a schematic diagram illustrating how a complex sewing pattern can be broken down into individual sequences of smaller suture lines using an algorithm.

[0216] Figure 7B This is a schematic diagram of an example implementation of a complex sewing pattern.

[0217] Figure 7C An example implementation is shown, wherein Figure 7B The nodes of the complex sewing pattern shown are joined together, for example, using a sewing machine.

[0218] Figures 8A-8F These are cross-sectional views of various example embodiments, in which conductive lines are assembled in multiple conductive layers to form an electrode system for signal transmission.

[0219] Figure 9 This is a cross-sectional schematic diagram, in which Figure 8C The electrode system shown is integrated into clothing or the final product.

[0220] Figure 10A This is a schematic diagram of various example implementations for electrically connecting a touch-sensitive device to two electrodes.

[0221] Figure 10B These are schematic diagrams of various example implementations of touch-sensitive devices of various shapes and / or sizes connected between two electrodes.

[0222] Figure 10C This is a schematic diagram of an example implementation of the electrical connections between multiple touch-sensitive devices and corresponding electrodes for monitoring in the X, Y, and Z directions.

[0223] Figure 11A and Figure 11B These are sectional views and top views, where folding and / or cutting can be used. Figures 8A-8CIn the device shown in Figure 9, enhanced functionality is provided.

[0224] Figure 12A This is an electrical schematic diagram of an example implementation of a dual-electrode touch-sensitive device.

[0225] Figure 12B This is an electrical schematic diagram of an example implementation of a dual-electrode touch-sensitive device, wherein the pull-up resistors are equal to each other.

[0226] Figure 12C This is a schematic diagram of an example implementation of a touch-sensitive device made of fabric, constructed from electrodes, connectors, and resistors.

[0227] Figure 13A This is a schematic diagram of an example implementation of a touch-sensitive device made of fabric, which incorporates a pressure-sensitive material to detect touch and the magnitude of the force applied as a result of the touch.

[0228] Figure 13B This is an example implementation of an electrical schematic diagram forming a circuit, which includes Figure 13A The touch-sensitive device shown.

[0229] Figure 14A This is a schematic diagram of an example implementation of the system, in which multiple devices are connected in series or parallel between the input and output electrodes.

[0230] Figure 14B This is a schematic diagram of an example implementation of a system comprising multiple devices, wherein they share a common input, but the output signals from the multiple touch-sensitive devices are connected independently to each other.

[0231] Figure 14C This is a schematic diagram of an example implementation of a system comprising multiple devices, wherein power, ground, input and / or output signals are connected in a grid pattern on different layers of a multilayer fabric.

[0232] Figure 15A Various example implementations of electrical connections between electrodes of multiple electromechanical sensitive devices are shown.

[0233] Figure 15B An example implementation of a fabric-based system is shown, in which multiple electromechanical sensitive devices are connected via Charlieplexing.

[0234] Figure 15C yes Figure 15B A cross-sectional view of an example embodiment of a fabric-based transistor device is shown.

[0235] Figure 16 This is a flowchart illustrating the steps of a method for manufacturing or constructing a touch-sensitive device disclosed herein, according to an example embodiment.

[0236] Figure 17 This is a flowchart illustrating the steps of a method for data collection using a touch-sensitive device disclosed herein, according to an example implementation.

[0237] Figure 18 This is a flowchart illustrating the steps of a method for a user to interact with an electromechanically sensitive device disclosed herein, according to an example implementation. Detailed Implementation

[0238] The subject matter of this disclosure will now be described more fully below, including some (but not all) embodiments thereof. In fact, the subject matter of this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to enable this disclosure to meet applicable legal requirements.

[0239] The terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the subject matter currently disclosed.

[0240] While it is believed that those skilled in the art will readily understand the following terms, the following definitions are set forth for the purpose of explaining the subject matter currently disclosed.

[0241] Unless otherwise defined below, all technical and scientific terms used herein are intended to have the same meaning as commonly understood by one of ordinary skill in the art. References to techniques used herein are intended to refer to the art as commonly understood in the art, including variations or equivalents of those techniques that would be obvious to one of ordinary skill in the art. While it is believed that one of ordinary skill in the art will have a good understanding of the following terms, the following definitions are set forth for the purpose of explaining the subject matter currently disclosed.

[0242] In describing the currently disclosed subject matter, it should be understood that many techniques and steps are disclosed. Each of these has its own advantages, and each can also be used in combination with one or more, or in some cases all, other disclosed techniques.

[0243] Therefore, for clarity, this specification will avoid unnecessarily repeating every possible combination of the steps. However, upon reading the specification and claims, it should be understood that such combinations are fully within the scope of the invention and the claims.

[0244] According to long-standing patent law practice, the terms "a" and "the" are used in this application (including the claims) to mean "one or more". Thus, for example, a reference to "a cell" includes multiple such cells, and so on.

[0245] Unless otherwise stated, all figures representing amounts of components, reaction conditions, etc., used in the specification and claims should be understood to be modified by the term "about" in all cases. Therefore, unless indicated to the contrary, the numerical parameters set forth in this specification and the appended claims are approximate values ​​that may vary depending on the desired properties sought to be obtained from the subject matter currently disclosed.

[0246] As used herein, when referring to the value or amount of a composition, dosage, sequence identity, mass, weight, temperature, time, volume, concentration, percentage, etc., the term “about” is intended to cover such variation from the specified amount as: ±20% in some embodiments, ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, ±0.5% in some embodiments, and ±0.1% in some embodiments, because such variation is suitable for performing the disclosed method or using the disclosed composition.

[0247] The term “comprising,” synonymous with “including,” “containing,” or “characterized in,” is inclusive or open-ended and does not exclude additional, unlisted elements or method steps. “Comprising” is a technical term used in the language of claims, meaning that the specified element is essential, but other elements may be added and still form a construction within the scope of the claims.

[0248] As used herein, the phrase “consisting of” excludes any element, step, or component not specified in the claim. When the phrase “consisting of” appears in a clause of the body of a claim, rather than immediately following the preamble, it limits only the element set forth in that clause; other elements are not excluded from the claim as a whole.

[0249] As used herein, the phrase “consistent essentially of…” limits the scope of the claim to the specified material or step, plus those that do not substantially affect the essential and novel features of the claimed subject matter.

[0250] Regarding the terms “comprising,” “consisting of,” and “substantially composed of,” when one of these three terms is used herein, the currently disclosed and claimed subject matter may include the use of any of the other two terms.

[0251] As used herein, the term “and / or” when used in the context of an entity list refers to entities that exist individually or in combination. Thus, for example, the phrase “A, B, C and / or D” includes A, B, C, and D individually, but also any and all combinations and subcombinations of A, B, C, and D.

[0252] Sewing, embroidery, overlocking, and similar sewing and threading techniques require an interlocking mechanism between the top thread (also called the carrier thread) and the bottom thread (also called the bobbin thread). The terms "top thread" and "carrier thread" are used interchangeably herein. Similarly, the terms "bottom thread" and "bobbin thread" are used interchangeably herein. Multiple top threads can be used in a sewing machine, which requires an equal number of sewing needles (e.g., four top threads require four sewing needles). Multiple top threads allow for more complex sewing patterns; for example, they can be used to reinforce or strengthen sewing threads, seams, pleats, and embroidery patterns, and / or add new mechanical properties to the material in which the thread is sewn, including, for example, alterations (e.g., increasing and / or decreasing elasticity, stretchability, torsion, bending, etc.) in different areas.

[0253] For fabric-based devices to be manufactured, at least one thread (e.g., top thread and / or bottom thread) must be conductive (e.g., having a conductivity greater than about 1 Siemens / meter), while the remaining threads are electrically insulating (e.g., possessing the properties of an electrical insulator, having a conductivity less than about 1 Siemens / meter). For n>2 and n>m, where n is the number of sewing needles and top thread, and m is the number of conductive threads, the number of conductive threads versus insulating threads follows a specific relationship. Various combinations of threads are possible. Individually, the bottom thread can be either conductive or non-conductive, thus doubling the number of threads that can be arranged. Typically, the bottom and top threads are applied from opposite sides of the fabric (e.g., sewn onto it). The exposure of the top and bottom threads is controlled by the sewing pitch, the tension applied to each thread during sewing, and the physical properties of the threads themselves. Under user control, the tension of one or more threads can be adjusted to expose the top and bottom threads on the same surface of the fabric (e.g., the top surface). When the bottom and top threads are exposed on the same surface, the sewing pitch and sewing pattern can be adjusted to expose the bottom thread or cover it with an interlocking top thread to minimize contact with adjacent threads. By reversing the tension (e.g., by decreasing the top thread tension and increasing the bottom thread tension, or vice versa), both the bottom and top threads can be exposed on another surface of the fabric (e.g., the bottom surface); however, when the corresponding thread tensions are reversed, the bottom thread is not covered by the top thread but overlaps with it. In this setting, the top thread can be either exposed or covered by the bottom thread.

[0254] Therefore, using this stitching principle, fabric-based semiconductive devices can be constructed by strategically or selectively stitching conductive wires or fibers (used interchangeably herein) onto a flexible surface. These conductive wires can be routed within / above the top, bottom, or middle (e.g., central) layers of the stitched flexible surface. When forming such fabric-based semiconductive devices, it is advantageous to minimize electrical interference between the conductive wires, thereby avoiding short circuits and parasitic signal crosstalk. Parameters that can guide the design of fabric-based devices using multiple conductive wires have been identified, including, for example, the following:

[0255] 1. The required quantity of conductive and insulated wires.

[0256] 2. Sew the pattern.

[0257] 3. Width of the sewn pattern,

[0258] 4. The length of each stitch in the sewing path, also known as the pitch,

[0259] 5. Number of sewn layers,

[0260] 6. Which layers will be conductive, semi-conductive, and / or insulating, and / or which layers will be stitched together with conductive, semi-conductive, and / or insulating threads?

[0261] 7. Tension between conductive and non-conductive (insulated) wires.

[0262] In one example implementation, the device uses two sewing needles formed in a multilayer material (e.g., fabric), one providing a top thread and the other a bottom thread (the bottom thread being conductive). The relative tension between the top and bottom threads determines which layer of the multilayer material the top and bottom threads are positioned in. The pitch of the sewing pattern is selected to determine the length of the exposed top and / or bottom threads; the width of the pattern (e.g., a zigzag pattern) is selected to determine the area of ​​the exposed conductive region.

[0263] When equal (e.g., identical) tension is applied to the top and bottom threads, they are independently exposed on their respective layers. When the tension applied to the top thread is greater than that applied to the bottom thread, the top thread applies a relatively higher tension to the bottom thread at the seam joint. The bottom thread is correspondingly pulled along the direction of the top thread (e.g., toward the top surface) by this relatively higher tension and exposed on the top surface of the multilayer material, while a correspondingly smaller amount of bottom thread is exposed on the bottom surface. The increase in relative tension between the top and bottom threads results in an increase in the amount of bottom thread exposed on the top layer of the multilayer material.

[0264] When the tension applied to the top thread is lower than the tension applied to the bottom thread, the bottom thread applies a relatively higher tension to the top thread at the seam joint. The top thread is correspondingly pulled along the direction of the bottom thread (e.g., towards the bottom surface) by the relatively higher tension of the bottom thread and exposed on the bottom surface of the multilayer material. This decrease in relative tension between the top and bottom threads results in an increase in the amount of top thread exposed on the bottom layer of the multilayer material.

[0265] As used herein, the term "pitch" can be defined as the distance from where the needle pierces the multilayer material to where the needle will pierce the multilayer material again; in other words, sewing "pitch" is the distance between the interlocking stitches of the top and bottom threads. When the sewing pitch increases, the amount (e.g., length) of the top and / or bottom threads exposed on the top and / or bottom surfaces increases. When the sewing pitch decreases, the amount (e.g., length) of the top and / or bottom threads exposed on the top and / or bottom surfaces decreases. Several exemplary sewing scenarios involving variations in relative tension and sewing pitch are described below.

[0266] When a neutral or substantially equal tension is applied to the top and bottom threads, the top thread is sewn to be exposed (e.g., only on the top surface of the multilayer material), and the bottom thread is sewn to be exposed (e.g., only on the bottom surface of the multilayer material). When a neutral tension is applied and the pitch increases, the exposed length of the top thread on the top surface increases, and the exposed length of the bottom thread on the bottom surface increases. When a neutral tension is applied and the pitch decreases, the exposed length of the top thread on the top surface decreases, and the exposed length of the bottom thread on the bottom surface decreases.

[0267] When the tension applied to the top thread is greater or higher than the tension applied to the bottom thread, the top thread is sewn to be exposed (e.g., only on the top surface of the multilayer material), and the bottom thread is sewn to be intermittently exposed on the top surface of the multilayer material. The portion of the bottom thread not exposed on the top surface of the multilayer material is exposed on the bottom surface. When the tension applied to the top thread is greater than the tension applied to the bottom thread and the sewing pitch is increased, the exposed length of the bottom thread on the bottom surface increases, while the exposed length of the bottom thread on the top surface decreases; therefore, the relative proportion of exposed bottom thread on the bottom surface relative to exposed bottom thread on the top surface increases, and the exposed length of the top thread on the top surface increases. When the tension applied to the top thread is greater than the tension applied to the bottom thread and the sewing pitch is decreased, the exposed length of the bottom thread on the bottom surface decreases, and the exposed length of the bottom thread on the top surface increases; therefore, the relative proportion of exposed bottom thread on the top surface relative to exposed bottom thread on the bottom surface increases, and the exposed length of the top thread on the top surface decreases.

[0268] When the tension applied to the top thread is smaller or lower than the tension applied to the bottom thread, the bottom thread is sewn to expose (e.g., only) the bottom surface of the multilayer material, and the top thread is sewn to be intermittently exposed on the bottom surface of the multilayer material. The portion of the top thread not exposed on the bottom surface of the multilayer material is exposed on the top surface. When the tension applied to the top thread is less than the tension applied to the bottom thread and the sewing pitch increases, the exposed length of the top thread on the top surface increases, and the exposed length of the top thread on the bottom surface decreases; therefore, the relative proportion of the top thread exposed on the top surface relative to the exposed top thread on the bottom surface increases, and the exposed length of the bottom thread on the bottom surface increases. When the tension applied to the top thread is less than the tension applied to the bottom thread and the sewing pitch decreases, the exposed length of the top thread on the top surface decreases, and the exposed length of the top thread on the bottom surface increases; therefore, the relative proportion of the top thread exposed on the top surface relative to the exposed top thread on the bottom surface decreases, and the exposed length of the bottom thread on the bottom surface decreases.

[0269] Another term used in this document is “duty cycle,” which can be defined as the ratio of the length of a thread (e.g., top thread and / or bottom thread) exposed on the surface of a multilayer material (e.g., top surface and / or bottom surface) to the length of a thread (e.g., top thread and / or bottom thread) penetrating the surface of the multilayer material (e.g., top surface and / or bottom surface) or exposed on another surface (e.g., opposite surface). The duty cycle, along with relative tension and sewing pitch, can be selected to control the amount (e.g., length) of threads (e.g., top thread and / or bottom thread) on the surface of the multilayer material (e.g., top surface and / or bottom surface).

[0270] Top and / or bottom lines are exposed on the bottom, top, or inner layers of multilayer materials. This is particularly advantageous for determining how multiple conductive lines carrying electrical signals (also known as signal lines) are stitched into the material without overlapping or crosstalk between them. As disclosed herein, the electrical signals between components and layers of the control circuit are similar to the design of circuits in conventional printed circuit boards, where signals are transmitted between wirings, gating gates, vias, etc.

[0271] According to an example embodiment, a first thread of conductive material can be sewn together to form a first thread in a horizontal direction relative to the sewn (e.g., multilayer) material, and a second thread of conductive material can be sewn together to form a second thread in a vertical direction perpendicular to the first thread. Both the first and second threads have conductive wires on the bobbin thread base, and the top thread contains non-conductive insulating wires. At the point where the first and second threads intersect, the tension of one or two threads forming the first and second threads is adjusted to avoid overlap and short circuits between the first and second threads. For example, the thread group forming the horizontally sewn first thread can maintain a neutral tension between the top and bottom threads, such that the top thread remains exposed on the top surface and the bottom thread remains exposed on the bottom surface; however, in such an example, a vertically sewn second thread can be sewn at the intersection to apply higher tension to the top thread, such that the conductive second bottom thread is pulled to the top surface. Furthermore, the pitch and duty cycle of the first and second threads are coordinated so that the exposed conductive wires of the first thread do not overlap with the exposed conductive wires of the second thread on the top or bottom surface of the sewn material at the intersection. In another example, applying higher tension to the top line than the bottom line when forming the first line, and applying neutral tension when forming the second line, would also be sufficient.

[0272] In an example implementation such as those described above, where the orientation of the conductive wires is reversed, such that the top wire forming the first and second wires is conductive and the bottom wires forming the first and second wires are non-conductive, the opposite tension application / control described above will be required. In such an example implementation, the first or second wire will require a lower tension applied to its top wire than its bottom wire, while the other of the first or second wires will apply neutral tension to its associated top and bottom wires.

[0273] According to another exemplary embodiment, the top wire of the first thread is formed of a conductive wire, and the bottom wire of the first thread is a non-conductive wire, while the top wire of the second thread is formed of a non-conductive wire, and the bottom wire of the second thread is a conductive wire. In such an embodiment, it is not necessary to apply differential tension between the top and bottom wires in the first or second thread; however, the pitch and duty cycle values ​​of the first and second threads must be coordinated with each other so that the exposed conductive wires of the first and second threads do not overlap each other at intersections (i.e., where the first and second threads intersect each other) on the top or bottom surface of the stitching material. Although this is the simplest scenario, it may not be logically feasible to have one or more machines with different bottom or top wire types (e.g., conductive or non-conductive).

[0274] The sewing strategies discussed above can be applied to multi-layered fabrics that can be stacked, folded, or sewn together. Each layer is sewn with conductive threads before such stacking, folding, or sewing. To layer multiple fabrics with conductive threads sewn therein, the area of ​​the conductive threads exposed on all mating surfaces must be controlled so that no two adjacent or neighboring conductive threads come into contact with each other, forming a short circuit. As described elsewhere herein, controlling the relative tension between the top and bottom threads can be used to move the conductive threads to unmatting layers; similarly, when stacking multiple layers of sewn material, variations in pitch and / or duty cycle can be used to help conceal the conductive threads in or on another surface of the sewn material at such intersections. In another exemplary embodiment, the material layers can be stacked together before any conductive threads are sewn into them, and then the conductive threads can be sewn into the material layers.

[0275] In another example implementation, a single conductive pattern is sewn or stitched into / on a single piece of material (e.g., fabric). In such an implementation, there exists an optimal sewing path where the sewing needle and its associated thread (e.g., top or bottom thread) do not need to rise and move to another location on the material to start or resume another (e.g., a second, different) conductive pattern. "The sewing needle and its associated thread rising and moving to another location on the material" is commonly referred to as skipped stitches; skipped stitches between conductive patterns on the material can cause short circuits in the resulting circuit. To optimize the planning of the conductive pattern within / on the material and reduce the number of skipped stitches, an algorithm (e.g., method) for performing this optimization is disclosed herein, referred to herein as depth-first search. The depth-first search algorithm analyzes the nearest sewing node (e.g., where the stitch will branch, forming more than one conductive path, as may occur when parts are connected in parallel) and recursively follows the planned sewing path until a final node (where there are no branches) is reached. The algorithm then queues the electrical routes with the longest node sequence and recursively (e.g., sequentially) traverses all remaining nodes until all electrical routes are queued. The algorithm then programs the machine using this sequence of electrical routes to sew a pattern connecting all the nodes, starting with the route with the longest node chain. When a node route is complete, the machine is configured to cut the thread and resume sewing to the next node. Otherwise, the machine continues sewing to the next node, creating unwanted skipped stitches between nodes.

[0276] The depth-first search algorithm recursively traverses the edges of each stitching path (referred to as nodes in this paper) until the final node in the stitching path is reached. At this point, the algorithm reverses and searches for adjacent terminating nodes, iteratively forming the edges of each stitching path branching from them; this process is repeated to complete the stitching path with no nodes remaining. Depth-first search, rather than breadth-first search (which is a complementary algorithm), allows for (e.g., advance) planning of stitching patterns or circuits so that, during stitching, the stitching pattern can be performed without backstitches or skipped stitches, or at least with minimal backstitches or skipped stitches, which increase the amount of time spent forming the stitching pattern and the costs associated with post-processing labor.

[0277] In some aspects, fabric-based mechanical sensors include conductive inputs and conductive outputs, also referred to herein as electrodes. These electrodes are connected to an electromechanical sensitive region, which may possess inherently resistive, capacitive, and / or inductive properties. The conductive input and conductive output interfaces may be located on the same or opposite sides of a layer typically made of a flexible material (e.g., fabric). The conductive input and output interfaces cannot overlap or cross each other, as this would result in a short circuit and necessarily render the sensor inoperable. Devices including such fabric-based mechanical sensors may include conductive inputs, conductive outputs, layers disposed therein and on top of the conductive inputs and outputs, and the electromechanical sensitive region. These layers may be stacked vertically or horizontally. The conductive inputs and conductive outputs are configured to receive, for example, power, ground, digital, and analog (frequency-modulated) signals. In some embodiments, the conductive inputs and outputs may enter a “high Z” state, meaning that the conductive inputs and outputs exhibit a high-resistance state simulating an open-circuit or disconnected signal. In this high Z state, no input or output signals can be received or transmitted at and / or through the inputs and / or outputs. In some implementations, the conductive input or output can be entered into a high-Z state using a switch before the signal is transmitted. In another implementation, the conductive input and / or output can be entered into a high-Z state using an operational amplifier exhibiting high input impedance. In yet another implementation, the conductive input and / or output can be entered into a high-Z state using a MOSFET, BJT, or similar transistor that exhibits high-Z behavior when powered by a specific voltage or current. In yet another implementation, the conductive input and / or output can be entered into a high-Z state using a combination of resistors, capacitors, inductors, and / or similar passive components to create high, low, notch, or bandpass filters to exhibit high input or output impedance at different frequency bands.

[0278] To electromechanically achieve a high Z-state within conductive, non-conductive, and semi-conductive fabrics, a semi-porous layer is incorporated between the electrodes and the electromechanically sensitive region. The semi-porous layer is configured to prevent signals (e.g., electrons) from flowing from the electrodes to the electromechanically sensitive region when no input excitation is applied. However, when an electrical, mechanical, chemical, and / or magnetic change is applied to the device, the semi-porous layer electrically, mechanically, chemically, and / or magnetically expands its associated pores, or otherwise increases its conductivity, such that the signal applied to the electrodes is transmitted to the electromechanically sensitive region. As an example where the device is mechanically responsive, mechanical changes (e.g., bending, torsion, tension, and / or pressure) mechanically deform the pores of the semi-porous layer, thereby allowing physical contact between the electrodes and the electromechanically sensitive region (e.g., in the form of a conductive path or circuit), which can, for example, lead to the activation (e.g., turning on) of the device.

[0279] In addition to the on, off, and high Z states, sensors can also stabilize to controlled current or voltage levels by being in a pull-up or pull-down state. A pull-up or pull-down state occurs when the electrodes have default voltage or current values ​​without external excitation. Typically, the default value is high (VCC) or low (ground). A pull-up state is achieved by connecting a strong resistor (e.g., in the range of approximately 1kΩ to approximately 1MΩ, including the terminal value) to the digital high value and the electrode. A pull-down state is achieved by connecting a resistor to the digital low value (e.g., ground) and the electrode. In the pull-up state, this resistor is called a pull-up resistor. In the pull-down state, this resistor is called a pull-down resistor. When an external signal is supplied to the device, the resistance of the pull-up or pull-down resistor is so high that the connection is treated as a shunt or open circuit. Therefore, when the electrode is not in a high Z state, an external signal can be transmitted to the electrode.

[0280] In fabrics, pull-up or pull-down states can be achieved, for example, by using a combination of conductive, semi-conductive, and non-conductive fabrics. Pull-up or pull-down resistors are woven, sewn, and / or layered onto electrodes respectively connected to the high or low states. Such fabric-based pull-up or pull-down resistors can be manufactured to provide, for example, high impedance (e.g., in the range of about 1 kΩ to about 1 MΩ, including terminal values). Parameters that can be modified to control the resistance of the fabric resistor may include, for example, width, length, cross-stitch density, thickness, and / or the inherent conductivity of the material.

[0281] In some implementations, a system comprising multiple sensors is provided; some or all of these sensors may be connected to a common or shared conductive input or electrode. In some implementations, the common electrode is connected to a power source shared among some or all of the multiple devices. Layering, stitching, or weaving multiple input sources can be tedious, time-inefficient, or mechanically challenging (e.g., difficult to the point of being impossible). To minimize the number of branches of the conductive path to the multiple electrodes, in some implementations, a single thread, stitch, fold, or monolithic conductive fabric may be provided to act as a bus for merging signals before branching to the desired / designated electrodes of the multiple devices. In conventional PCB designs, a “bus” is implemented by forming a thicker conductive trace that passes between each device before branching a shorter trace toward the corresponding electrode of the device. Another method of implementing a “bus” in conventional PCB designs is to use an entire layer (called a gating or plane) that acts as an isotropic sheet of the same signal and is placed in or on the PCB layer providing the device; such devices can be connected to the signal layer by forming vias in the signal layer.

[0282] Based on the subject matter disclosed herein, a fabric-based bus can be implemented, for example, by stitching discrete lines, embroidered areas, or the entire surface of a conductive material (e.g., thread). These conductive material areas can then be designed to branch and connect to multiple devices using a depth-first search. This document will now describe exemplary implementations of such fabric-based devices using the concepts of conductive input and output electrodes, the states in which such electrodes can operate, and how they are directed toward such device bus signals. In particular, input and output conductive lines, as well as sensitive areas and semi-porous layers, can be considered according to several different examples of circuit architectures, which will be described below.

[0283] In example embodiments, multiple sensors are electrically connected via discrete conductive inputs and outputs. In some such embodiments, the conductive input and output electrodes are disposed on the same side / surface (e.g., in the same layer, both located on the top or bottom surface), and then the sensitive region is stacked on the electrode layer (e.g., above / below); thus, each sensor comprises two (2) layers: an electrode layer (e.g., a layer in which the first and second electrodes are provided) and a layer in which the sensitive region is provided. In some other such embodiments, the conductive input and output electrodes are disposed on opposite side / surfaces (e.g., one on the top surface and the other on the bottom surface), and the sensitive region is disposed between the layers in which the respective electrodes are disposed; thus, each sensor comprises three (3) layers: a first electrode layer, a second electrode layer, and a layer in which the sensitive region is disposed in contact (e.g., in direct contact) with the first and second electrode layers.

[0284] In another example implementation, multiple sensors are electrically connected by forming an electrical bus or “bus” that transmits input or output signals to / from the sensors. In some such implementations, conductive input and output electrodes are disposed on the same side / surface (e.g., in the same layer, both on the top or bottom surface); the input electrode is connected to a separate layer with a signal bus, the output electrode layer is connected to another separate layer with a signal bus, and the sensitive area is connected to the input and output electrodes (e.g., on the same side); thus, each sensor comprises four (4) layers: an electrode layer (e.g., a layer providing the first and second electrodes), a bus layer connected to the first electrode, a bus layer connected to the second electrode, and a layer in which the sensitive area is disposed. In some other such embodiments, conductive input and output electrodes are disposed on separate or independent layers (e.g., one on the top surface and the other on the bottom surface); the input electrode is connected to a separate layer with a signal bus, the output electrode layer is connected to another separate layer with a signal bus, and the sensitive region is connected to the input and output electrodes (e.g., connected between the input and output electrodes as an intermediate layer); thus, each sensor comprises five (5) layers: a first electrode layer, a bus layer connected to the first electrode, a second electrode layer, a bus layer connected to the second electrode, and a layer in which the sensitive region is disposed in contact with (e.g., in direct contact with) the first and second electrode layers.

[0285] In another example embodiment, multiple sensors are electrically connected via electrodes having a high Z-state and by forming an electrical bus or “bus” that transmits input or output signals to / from the sensors. In some such embodiments, conductive input and output electrodes are disposed on the same side / surface (e.g., in the same layer, both on the top or bottom surface); the input electrode is connected to a separate layer having a signal bus, the output electrode layer is connected to another separate layer having a signal bus, the layers in which the first and second electrodes are disposed are stacked on a semi-porous material as a high Z-state material, and the sensitive region is connected to the input and output electrodes (e.g., on the same side); thus, each sensor comprises five (5) layers: an electrode layer (e.g., a layer in which the first and second electrodes are provided), a bus layer connected to the first electrode, a bus layer connected to the second electrode, a layer comprising a semi-porous material, and a layer in which the sensitive region is disposed. In some other such embodiments, conductive input and output electrodes are disposed on separate or independent layers (e.g., one on the top surface and the other on the bottom surface); the input electrode is connected to a separate layer having a signal bus, wherein the layer in which the first electrode is disposed is stacked on a semi-porous material as a high-Z material; the output electrode layer is connected to another separate layer having a signal bus, wherein the layer in which the first electrode is disposed is optionally (although only one layer of high-Z material is required to put the device into a high-Z state, but more than one layer of high-Z material may be used as needed) stacked on a semi-porous material as a high-Z material; and the sensitive region is connected to the input and output electrodes (e.g., as an intermediate layer between them); thus, each sensor comprises six (6) layers or optionally seven (7) layers: a first electrode layer, a bus layer connected to the first electrode, a first high-Z layer on the first electrode layer, a second electrode layer, a bus layer connected to the second electrode, an optional second high-Z layer on the second electrode layer, and a layer in which the sensitive region is disposed in contact with (e.g., in direct contact with) the first and second electrode layers.

[0286] The device can be manufactured using any of the example architectures described herein, but is not limited thereto, and those skilled in the art will understand that other, unlisted circuit architectures may be used without departing from the scope of the subject matter currently disclosed. Additional layers may be added to the exterior of the device (e.g., to provide additional aesthetic and / or functional characteristics). Examples of such additional layers include, for instance, layers formed of materials (e.g., textiles, fabrics, etc.) that differ in color and / or texture from the device, and layers that are more flame-retardant, heat-resistant, and / or waterproof than the device's layers (e.g., the outermost layer) to provide additional environmental protection for the device. Therefore, the number of layers used in a device may be greater than the number explicitly disclosed herein, depending on the intended use of the device and the preferences of the device designer.

[0287] In some embodiments, the fabric device or system includes one or more (e.g., multiple) sensors that respond to mechanical changes. Such mechanical changes can be, for example, bending and / or twisting about an axis in the x (tension), y (compression), and z (pressure) directions. Thus, the sensors are advantageously capable of bending, twisting, and / or warping in three dimensions. To further design fabric devices with embedded sensors that can deform in three-dimensional space, in some embodiments, selective cutting and / or folding along, for example, crease lines, fold lines, and / or curves is advantageous. Such cutting and / or folding can allow a material sheet (e.g., a single-layer sheet) comprising multiple fabric-based sensors embedded in and / or formed therein or on a two-dimensional plane (e.g., when the sheet is in an folded / uncut state, the sensors are arranged coplanarly to each other) to deform in three-dimensional space. Specific cutting and folding patterns can be selected from, for example, paper cutting, origami, and curves and folds found in nature, such as bonded atoms or cells in tissue.

[0288] As disclosed elsewhere herein, fabric-based sensors include conductive input electrodes and conductive output electrodes, each respectively connected (e.g., electrically connected) to a sensitive region. Regions outside the electrode areas are non-sensitive compared to the sensitive regions. Both sensitive and non-sensitive regions can be folded and repeated using valley folds, mountain folds, pumpkin folds, inward folds, outward folds, petal folds, book folds, concave folds, and triangular folds to create wrinkles and curls. In some embodiments, non-sensitive regions can be cut to allow the material to stretch or bend around the cut area. Additionally, in some embodiments, repeated cuts can be made in such non-sensitive regions to create paper-cut patterns that systematically expand or contract in a particular direction (e.g., in the x-direction). In some embodiments, such cuts (e.g., in non-sensitive regions) can penetrate the entire fabric (e.g., through all layers of the fabric) or only in / above specific layers of the fabric. In some embodiments, such cuts can be made shallowly, such that only some layers (e.g., only the first few layers) are cut, while all layers of the fabric are left uncut, punctured, etc. In some implementations, the sheet can be cut into individual layers, which are then stacked on top of each other in a prescribed order to form a multilayer material in which multiple sensors are embedded; prior to such cutting and stacking, cutting and stacking fabric sheets in which sensors have already been formed will produce a multilayer material (e.g., fabric) device that includes an intermediate (e.g., inner) layer that may have cuts formed therein and an outer layer, for example, that does not have such cuts.

[0289] In some embodiments, some of the sensors disclosed herein can be configured as touch sensors. Therefore, in some embodiments, a fabric-based touch sensor according to the subject matter of this disclosure may include, for example, conductive input electrodes, conductive output electrodes, and a sensitive region that is electromechanically sensitive to mechanical deformation. Examples of materials exhibiting this property are piezoelectric and / or piezoresistive materials. Further examples of such materials include capacitive and / or inductive materials. Further examples of such materials include electromechanical and / or magnetically sensitive materials, wherein mechanical changes (e.g., deformation) cause changes in the magnetic field generated by such layers. Further examples of such materials include electromechanical and chemically sensitive materials, wherein mechanical changes (e.g., deformation) cause physical or chemical reactions.

[0290] In some embodiments, one or more electrodes of such a touch sensor comprise a semi-porous material stacked (e.g., provided in layers) between the respective electrode and the sensitive region. This semi-porous layer is configured to serve as a high Z-state material. Due to the high Z-state of the semi-porous layer, when no input force is applied (e.g., when not contacting with even minimal force) to the touch sensor, the input electrode, output electrode, or both input and output electrodes do not contact the sensitive region (e.g., are electrically disconnected from the sensitive region). When a force is applied (e.g., when in direct contact) to the touch sensor, the input electrode, output electrode, or both input and output electrodes are in electrical or mechanical contact with the sensitive region. For example, when the input electrode contacts the sensitive layer due to the application of force (e.g., by touch) to the touch sensor, the input electrode is configured to transmit a power supply (e.g., VCC) or other electrical signal, which is configured to activate (or turn on) the touch sensor when received in the sensitive region.

[0291] In some embodiments, such touch sensors include one or more layers that are in contact (e.g., direct contact) with a sensitive layer, and such layers are resistive materials or comprise resistive materials. The resistive material has, for example, two resistors at its opposite ends (e.g., edges). Depending on the specific application, these two resistors are configured and electrically connected to function as pull-up or pull-down resistors. The combination of the resistive material and the pull-up or pull-down resistors forms two voltage dividers at opposite ends of the resistive material. In some such embodiments, the contact points between the resistive material and one or more (e.g., all) of the pull-up or pull-down resistors have embedded or sewn conductive material configured to function as separate (e.g., third and / or fourth) electrodes. The third electrode is connected to the resistive layer and the pull-up or pull-down resistor associated with the third electrode, and / or the fourth electrode is connected to the resistive layer and the pull-up or pull-down resistor associated with the fourth electrode. Such embodiments of the touch sensor are configured to determine signals from the third and / or fourth electrodes to measure the amount (e.g., magnitude) of current transmitted between the left and right voltage dividers.

[0292] In such an example of a touch sensor including first, second, third, and fourth electrodes, when force is applied to the touch sensor (e.g., at its surface), the first electrode electrically and / or mechanically contacts (e.g., directly contacts) the sensitive layer. The sensitive layer is electrically connected to the first electrode and configured to receive a signal from the first electrode, which is segmented between the third and fourth electrodes. The third and fourth electrodes are then measured to detect the magnitude of the voltage and current segmentation between their associated pull-up or pull-down resistors, respectively. The signal segmentation ratio between the third and fourth electrodes is used to determine the relative positioning or location of a touch on the touch sensor in the direction of physical separation (e.g., left and right) between the third and fourth electrodes. For example, when the pull-up or pull-down resistors associated with the third and fourth electrodes, respectively, are in a pulled-down state, a touch on the side of the touch sensor where the third electrode is located (e.g., the left side) records a lower signal on the third electrode than one recorded on the side of the touch sensor where the fourth electrode is located (e.g., the right side). When the pull-up or pull-down resistors associated with the third and fourth electrodes are in the pull-up state, a touch on the side of the touch sensor where the third electrode is located (e.g., the left side) records a higher signal on the third electrode than on the side of the touch sensor where the fourth electrode is located (e.g., the right side). The signal ratio or segmentation between the third and fourth electrodes can be used to determine the distance ratio (e.g., relative position) of a touch between opposite sides of the touch sensor. For example, a 40% / 60% segmentation between the third and fourth electrodes may indicate that the touch occurred at a distance of 40% between the third and fourth electrodes, while a 20% / 80% segmentation may indicate that the touch occurred at a distance closer to the third electrode than in the 40% / 60% segmentation example.

[0293] In some embodiments, the touch sensor is configured to detect (e.g., measured in the x and y directions) the touch location and (e.g., measured in the z direction) the magnitude of the touch pressure or force. In such an example embodiment, a second electrode is located between a layer having a sensitive region and a layer having a resistive material; wherein the layer having the resistive material has a third and a fourth electrode connected to its opposite sides. The second electrode is connected to a pull-up or pull-down resistive material, which, together with the sensitive region, forms another voltage divider. When a force is applied to the touch sensor, this voltage divider can measure changes in the resistance, capacitance, inductance, or voltage of the sensitive layer. In some embodiments, such as Figure 13A As shown, the intersection of the second electrode and its associated pull-up or pull-down resistor includes an embedded or sewn conductive material that serves as the fifth electrode. The signal from the fifth electrode is used to determine the amount of relative twist (e.g., deformation) in the sensitive region.

[0294] In some implementations, a system or device may include multiple sensors (e.g., touch sensors). According to such implementations, each sensor has dedicated (e.g., separate, independent) conductive input and output electrodes. However, as the number of sensors increases, the number of required electrical connections increases accordingly, leading to complex circuit designs that require overlapping lines and / or wires and are logically and / or mechanically cumbersome to manufacture. To reduce the number of required electrical connections, sensors may share (e.g., in parallel or series) the same input and / or output electrodes. Considerations for shared electrical connections include, for example, impedance matching, frequency matching, voltage and power matching, and / or mechanical and material matching at the connection interface.

[0295] Depending on the type and location of the sensors used in such devices and / or systems, electrical connections can be reduced using any of a variety of different methods. Examples of such methods are disclosed herein, but the subject matter disclosed herein is not limited to the example methods explicitly described herein, and includes other methods that will be understood by those skilled in the art.

[0296] According to the example method, the signal can be frequency-modulated, allowing all connections to be shared among the devices. The frequency of the signal transmission determines which device and / or sensor can be communicated with. Frequency modulation and bit-controlled communication (e.g., I2C, SPI, and SWI) require a certain number of 1-4 wires (including end values). These wires can be connected to each sensor via a bus. Another example involves using a technique called daisy-chaining (e.g., a series electrical connection type), where the output electrode of one sensor is connected to the input electrode of an adjacent or next-nth sensor. Thus, the sensors can be organized in a row, with conductive lines or wires intersecting the input and output electrodes of all sensors. In this first method, the number of conductive lines or wires required to connect n sensors can be between 1 and 4 (including end values).

[0297] According to another example method, the input and output electrodes of each sensor are electrically connected independently of the input and output electrodes of all other sensors. Therefore, each sensor is electrically connected to a dedicated (e.g., separate, independent, discrete) pair of conductive wires or cables. This method can be advantageous when designing prototype devices or systems, or when the number of sensors is limited. However, the number of wires or cables required according to this method increases accordingly with the number of sensors in the system or device. Therefore, the number of conductive wires or cables required to connect n sensors is twice the number of sensors (e.g., 2*n).

[0298] According to another exemplary method, all sensors of the device or system are electrically connected (e.g., for power and / or communication) to the same input, such that all input electrodes of the sensors can be electrically connected together (e.g., by a single conductive wire or wire bus). According to this example method, the output electrodes of each sensor are electrically connected independently to each other. Therefore, each sensor includes its own output electrode, and the number of conductive wires or wires required to connect n sensors is defined as n+1.

[0299] According to another example method, the sensors of a device or system are arranged in a row and column grid-like matrix or array. According to this method, the number of sensors per row is defined as n, and the number of sensors per column is defined as m; therefore, the minimum number of conductive wires or cables required to connect n*m sensors is defined as n+m. In an implementation of a system or device using this example method, firmware control is necessary to systematically activate (e.g., turn on) or deactivate (e.g., turn off) one or more sensors in the array of n*m sensors. In one example implementation, the rows of the array are input connections that determine whether a sensor is operational / idle by transmitting a zero (0) or high signal, and the columns of the array are output connections that connect to a measurement system that determines the values ​​of the sensors in the grid. In the firmware, the rows are connected to bi-state logic, which can be assigned to transmit low or high values; these are typically referred to as digital pins. These columns are connected to analog-to-digital converters (ADCs) that measure the signal output; the output of each ADC can be selectively read. The sensor output of a particular sensor within the measurement array is set to a low state (e.g., receiving a 0 signal), except for the row where that particular sensor is located (which is set to a high state (e.g., receiving a high signal)). In other words, all inputs are turned off except for the input of the specific sensor. After selecting the row of the specific sensor and transmitting the corresponding low / high signal to the input, the specific column of the array where the specific sensor is located can be read using an ADC connected to that column of the array. By coordinating the opening or closing of rows and the reading of the output from the ADC connected to the column of the specific sensor, a specific device can be selected at a specified row and column (e.g., coordinates) within the sensor array. For example, in an example implementation of a system or device comprising 2 rows and 2 columns (e.g., n=2 and m=2) of sensors (e.g., four sensors in total), measuring the sensor at coordinate {1,1} requires turning on row 1, turning off row 2, and measuring the output from the ADC connected to column 1. Measuring the output of the ADC connected to column 2 will result in measuring the sensor at coordinate {1,2}, since the sensor in row 1 and column 2 is also turned on. Depending on the design and level of sensor crosstalk, in some implementations, {1,1} and {1,2} can be measured simultaneously. However, if there is crosstalk or signal distortion between adjacent sensors in the same row, it is advantageous to completely convert the ADC value at {1,1} before measuring the output of the ADC connected to the 2nd column to read the value at {1,2}.

[0300] According to another example method, the sensors of a device or system are connected via Charlie multiplexing, where tri-state input and output logic is used to turn the sensors in the matrix on or off. The tri-state logic is the ability to change the signal between an "on" state, an "off" state, or a "high Z" state. According to this implementation, the sensor must have signal polarity, meaning the signal can only flow in one direction and not the other. In other words, the signal can only travel through the sensor from the input electrode to the output electrode, and not from the output electrode to the input electrode. When the signal reaches the output electrode, the sensor enters a high Z state. Therefore, the number of conductive wires or cables required to connect n sensors is determined according to the equation... Definition. According to this exemplary implementation, signals that switch between low, high, or high Z signals are provided to the input electrodes, and the output electrodes of each sensor are received sequentially to measure a specific sensor in a matrix of n*m sensors. Particularly important is that each input electrode has an accompanying resistor to buffer any leakage current when the sensor is turned on or enters a high Z state. When starting with a known set or number of available electrical connectors or terminals, the above equation can be reversed to determine the number of sensors that can be connected. If the number of connections is known in advance (e.g., with N wires), the number of sensors that can be connected according to this method is determined by equation N. 2 -N is confirmed.

[0301] For multiple sensors, driving a specific sequence of input and output states can be time-consuming and power-intensive. Therefore, optimizing the set or sequence of inputs and outputs to be switched is advantageous. In such implementations, the "nearest neighbor" algorithm can be used to cluster groups of input and output channels, allowing clusters of input and output channels to be switched together. Determining which inputs and outputs to switch and at what intervals the merging occurs can advantageously minimize firmware redundancy, time consumption, and power consumption. If the matrix of resistors and sensors is to be infinitely extended in the x and y directions, it is necessary to determine how to deconvolve the signals from specific coordinates {n, m}. For example, if each sensor is simply a wire (effectively implying unity gain), and each sensor is connected to a resistor R in the x and y directions, the equivalent resistance at each node or coordinate is determined as follows:

[0302]

[0303]

[0304] The resistance of each node is actually the same.

[0305] In each implementation where the sensor is not a wire but one of the sensors disclosed herein, if the sensor has a non-negative impedance, or uses a pull-up or pull-down resistor (R... senseIf the overall impedance of the sensor can be estimated using a first-order approximation, then:

[0306] R total =R n,m +R sense

[0307] R sense =R total -R n，m

[0308] Using this relationship, the sensor signal can be deconvolved at specific coordinates by applying Kirchhoff's laws and Ohm's law. Furthermore, the basic voltage divider equation can help extract the specific voltage and current output of the sensor at those particular coordinates.

[0309] Figure 1A A computer numerical control (CNC) multi-needle sewing machine 10 is shown, comprising a plurality of sewing needles 20A-20D. Each of the sewing needles 20A-20D holds a different thread 2A-2D. The threads 2A-2D may have the same or different electrical conductivity, weight, density, number of strands, elasticity, and / or color. Each thread 2A-2D is sewn together with a bobbin 30 of the sewing machine 10 to ensure a stitch (e.g., a cross or interlocking engagement) between the thread 2A-2D from one of the sewing needles 20A-20D and the thread 1 provided by the bobbin 30. The sewing needles 20A-20D may contain conductive or non-conductive thread. The bobbin 30 may contain conductive or non-conductive thread. In the example embodiment shown, the thread 1 of the bobbin 30 is conductive, and the threads 2A-2D of each of the sewing needles 20A-20D are non-conductive (e.g., insulated) thread.

[0310] Figure 1BA cross-sectional view of a stitch formed in a flexible material 5 (e.g., fabric) is shown, in which top threads 2A-2D and bobbin thread 1 are sewn into the flexible material 5. In this example, thread 1 of the bobbin 30 is a conductive thread. The bobbin thread 1 is exposed on the underside of the flexible material 5, determined by tension and stitch length, which are controlled by the sewing machine 10 and set by the operator or controller. When the bobbin thread 1 is exposed on the top surface of the flexible material 5, the top threads 2A-2D serve to insulate the bobbin thread 1. The top threads 2A-2D are also advantageously used to pattern a specific sequence of threads 2A-2D to add mechanical features to the flexible material 5. Examples of such stitching may include stitching a zigzag pattern to allow the flexible material 5 to stretch additionally in the stitching direction, stitching offset stitches (wherein this stretching is controlled in a specific x-direction, y-direction, or angle). In some embodiments, some or all of the top threads 2A-2D may contain conductive threads to expose more conductive material. Examples include mechanically reinforcing conductive areas, exposing enough area to allow another pin or electromechanical device to access the area, and / or creating specific patterns that alter the resistivity, capacitance, and / or inductance of the area.

[0311] Figure 1C yes Figure 1B An isometric view of the stitching pattern is shown. The bobbin thread 1 is shown intermittently exposed on the top or bottom side of the flexible material 5, controlled by the machine tension and stitch length (also known as pitch). The top threads 2A-2D are sewn into a zigzag pattern 100 with two straight stitches at the furthest edge of each zigzag to visually show the covered area and mechanically reinforce the edges of the stitch 100. Some or all of the top threads 2A-2D may also consist of conductive wire to electromechanically enhance the conductivity contributed by the bobbin thread 1, for example, to increase the surface area of ​​the conductive material used for connection purposes and / or to control the resistivity, capacitance, and / or inductance of the stitched area.

[0312] Figure 2A -C indicates how the tension between the top thread 2 and the bottom thread 1 determines which layer, side, or surface of threads 1 and 2 are located within the stitching pattern 100. The sewing machine 10 can be, for example, an embroidery machine, a straight-stitch machine, an overlock machine, or any other suitable machine type with a sewing mechanism.

[0313] Figure 2A The stitching patterns 100A-100C are shown, which are created when the tension between the top thread 2 and the bottom thread 1 is substantially equal. The top thread 2 and the bottom thread 1 intersect each other within a flexible material 5 (e.g., stitching material) (e.g., forming an interlocking connection). Figure 2AEach of the stitch patterns 100A-100C illustrates how different stitch lengths alter the amount of top thread exposed on the top surface 5T of the flexible material 5 and the amount of bobbin thread 1 exposed on the bottom surface 5B of the flexible material 5 between the individual stitches. The ratio of the exposed top and bottom threads 1, 2 on the corresponding top or bottom surfaces 5T, 5B to the total stitch length is referred to herein as the duty cycle of such top or bottom threads 1, 2, as appropriate. Stitch pattern 100B has a high duty cycle. Stitch pattern 100C has a low duty cycle. Stitch pattern 100A has a medium or intermediate duty cycle.

[0314] Figure 2B The stitching patterns 100D-100F are shown, which are produced when the top thread 2 has a higher tension than the bottom thread 1. The top thread 2 and the bottom thread 1 intersect each other (e.g., form an interlocking connection) at the top surface 5T of the flexible material 5 (e.g., the sewing material). In this case, the mechanical force applied to the top thread 2 and the associated sewing needle is greater than that applied to the bobbin thread 1, which pulls both the top thread 2 and the bottom thread 1 upwards to the top surface 5T. This high tension applied to the top thread 2 causes both the top thread 2 and the bobbin thread 1 to be exposed on the top surface 5T (e.g., at least partially outside the top surface 5T). The exposure of the bobbin thread 1 on the top surface 5T is minimal only when the sewing needle 20 pierces the flexible material 5.

[0315] Figure 2C A stitching pattern 100G-100I is shown, which is produced when the bobbin thread 1 has a higher tension than the top thread 2. The top thread and bobbin threads 1, 2 intersect each other at the bottom surface 5B of the flexible material 5 (e.g., the stitching material) (e.g., forming an interlocking connection). In this case, the mechanical force applied to the bobbin thread 1 is greater than that applied to the top thread 2, which pulls both the top thread and bobbin threads 1, 2 down to the bottom surface 5B. This low tension applied to the top thread 2 results in the top thread and bobbin threads 1, 2 being exposed on the bottom surface 5B (e.g., at least partially outside the bottom surface 5B). The exposure of the top thread 2 on the bottom surface 5B is minimal only when the sewing needle 20 pierces the flexible material 5.

[0316] Figure 3 This is a cross-sectional view of an example embodiment of the stitched pattern, showing a multilayer flexible material 5 (e.g., fabric). The flexible material 5 includes a first layer 5L1, a second layer 5L2, and a third layer 5L3. The top surface 5T of the flexible material 5 is the exposed surface or outermost surface of the first layer 5L1. The bottom surface 5B of the flexible material 5 is the exposed surface or outermost surface of the third layer 5L3. Figure 3In this process, by controlling the relative tension applied to the top thread and bobbin threads 1 and 2, the top thread 2 and bobbin threads 1 are sewn or stitched into, above, and / or through the first, second, and / or third layers 5L1-5L3, respectively. For illustrative and discussion purposes, the flexible material 5 is laterally divided into six (6) different regions or sections, which in Figure 3 The top of each section is marked with Roman numerals I-VI. In section I, substantially equal tension is applied to the top thread and bobbin threads 1, 2, such that the top thread and bobbin threads 1, 2 are located at / above the top surface 5T and bottom surface 5B of the flexible material 5, respectively. In section II, the top thread and bobbin threads 1, 2 are located at, in, and / or above the top and bottom surfaces (e.g., on opposite surfaces) of the second layer 5L2, respectively. In section III, the top thread 2 is located at, in, and / or above the top surface of the first layer 5L1 (e.g., on the top surface 5T), and the bobbin thread 1 is located at, in, and / or above the bottom surface of the second layer 5L2. In section IV, the top thread 2 has been pulled inward from the top surface 5T such that the top thread 2 is located at, in, and / or above the top surface of the second layer 5L2, and the bobbin thread 1 has been pulled outward from the position shown in section III such that the bobbin thread 1 is located at, in, and / or above the bottom surface 5B. In part V, a higher tension is applied to the top thread 2 than to the bobbin thread 1, causing the bobbin thread 1 to follow the top thread 2 to the top surface 5T, such that the top thread and bobbin threads 1 and 2 are both at, in, and / or above the top surface 5T. In part VI, a lower tension is applied to the top thread 2 than to the bobbin thread 1, causing the top thread 2 to follow the bobbin thread 1 to the bottom surface 5B, such that the top thread and bobbin threads 1 and 2 are both at, in, and / or above the bottom surface 5B.

[0317] Figure 4 This is a cross-sectional view of an example embodiment of the stitched pattern, showing a multilayer flexible material 5 (e.g., fabric). The flexible material 5 includes a first layer 5L1, a second layer 5L2, and a third layer 5L3. The top surface 5T of the flexible material 5 is the exposed surface or outermost surface of the first layer 5L1. The bottom surface 5B of the flexible material 5 is the exposed surface or outermost surface of the third layer 5L3. Figure 3 In this process, by controlling the relative tension applied to the top thread and bobbin threads 1 and 2, the top thread 2 and bobbin threads 1 are sewn or stitched into, above, and / or through the first, second, and / or third layers 5L1-5L3, respectively. For illustrative and discussion purposes, the flexible material 5 is laterally divided into six (6) different regions or sections, which in Figure 3The top of each section is marked with the Roman numeral IV. In section I, substantially equal tension is applied to the top thread and bobbin threads 1 and 2, such that the intersection of the top thread and bobbin threads 1 and 2 is located within the second layer 5L2 inside the flexible material 5. In section II, a lower tension is applied to the top thread 2 than to the bobbin thread 1, such that the intersection of the top thread and bobbin threads 1 and 2 is located within the third layer 5L3 inside the flexible material 5. In section III, a higher tension is applied to the top thread 2 than to the bobbin thread 1, such that the intersection of the top thread and bobbin threads 1 and 2 is located within the first layer 5L1 inside the flexible material 5. In section IV, compared to section II, the tension applied to the top thread 2 is lower than that to the bobbin thread 1, causing the top thread 2 to follow the bottom thread 1 to the bottom surface 5B, such that the intersection of the top thread 2 and the bobbin thread 1 is located at the bottom surface 5B of the flexible material 5. In part V, compared to part III, the tension applied to the top thread 2 is higher than the tension applied to the bobbin thread 1, which causes the bobbin thread 1 to follow the top thread 2 to the top surface 5T, such that the intersection of the top thread and the bobbin threads 1 and 2 is located at the top surface 5T of the flexible material 5.

[0318] Figure 5A Two exemplary embodiments are shown, in which tension engineering (e.g., selectively controlling the tension between one or more top threads and one or more bottom threads) is used to control the amount of top and bottom threads 1, 2 exposed on the top and / or bottom surfaces of the flexible material 5 when two or more stitches or stitch patterns intersect each other in a two-dimensional plane. Figure 5A In the illustrated example embodiment, there are two stitching patterns, one extending along the x-direction and the other extending along the y-direction perpendicular to the x-direction. In this exemplary embodiment, the top wire 2 is a conductive wire and is exposed on the top surface of the flexible material 5 during neutral tension stitching (e.g., Figure 5AOn the surface shown. When a stitching pattern extending in the x-direction intersects with a stitching pattern extending in the y-direction, one of the stitching patterns must change the relative tension between the top and bottom threads 1, 2 forming such a stitching pattern, such that the conductive line (e.g., top thread 2) of the first stitching pattern (e.g., the pattern extending in the x-direction) is pulled toward the bottom surface of the flexible material 5. This allows the conductive line (e.g., top thread 2) of the second stitching pattern (e.g., the pattern extending in the y-direction) to be exposed on the top surface of the flexible material 5 in the intersection area. In some embodiments, the relative tension between the top thread and the bobbin threads 1, 2 forming the second stitching pattern can be modified (e.g., increased so that the tension applied to the top thread 2 is greater than the tension applied to the bobbin thread 1), such that both the top and bottom threads 1, 2 of this second stitching pattern are pulled toward the top surface of the flexible material 5. When the relative tension between the top line and bobbin threads 1, 2 forming the first stitching pattern is reduced compared to the relative tension between the top line and bobbin threads 1, 2 forming the second stitching pattern (e.g., when the relative tension in the first stitching pattern is less than the relative tension in the second stitching pattern), in the intersection area, the conductive lines of the corresponding first and second stitching patterns are located on opposite sides (e.g., at, in, or above the top and bottom surfaces, respectively), thereby avoiding collisions and / or short circuits between the conductive lines of the first and second stitching patterns.

[0319] Figure 5B It shows the intersection area located between the first and second stitching patterns. Figure 5A An example embodiment of a cross-sectional view of one of the flexible materials 5 shown. A first stitch pattern includes a top line 2 and a bobbin thread 1; the bobbin thread 1 is a conductive wire. A second stitch pattern includes a top line 2' and a bobbin thread 1'; the top line 2' is a conductive wire. The conductive top line 2' is pulled upwards to the top surface 5T in the intersection region, while the conductive bobbin thread 1 of the first stitch pattern and the conductive top line 2' of the second stitch pattern are spaced apart in the intersection region (e.g., inside the flexible material 5). Furthermore, the pitch of the first and second stitch patterns alternates in the intersection region, such that when a conductive wire is exposed on the top surface 5T, the conductive wire of the other stitch pattern is either exposed on the opposite surface (e.g., on the bottom surface 5B) or interlocked within the flexible material 5. Thus, at each intersection region where stitch patterns containing one or more conductive patterns intersect each other, each conductive wire of each intersecting stitch pattern is advantageously located at, within, or above a different layer or surface of the flexible material 5 to avoid collisions and short circuits between such conductive wires of different stitch patterns.

[0320] Figure 6 An exploded view of a multilayer flexible fabric is shown, where each layer is shown spaced apart from each other but stacked vertically on top of each other. Figure 6In the illustrated embodiment, the top thread 2 of each stitch pattern within layers 5L1-5L3 comprises a conductive thread, and the bobbin thread 1 of each stitch pattern within layers 5L1-5L3 comprises a non-conductive or insulated thread. The top threads 2 are controlled to be exposed on the top surface of each layer in layers 5L1-5L3. When layers 5L1-5L3 are stacked on top of each other, the top threads 2 are aligned (e.g., along...). Figure 6 (shown in the lateral or horizontal direction) to form a continuous stitch. In another exemplary embodiment, the top line 2 of each stitch pattern within layers 5L1-5L3 can be stitched together such that when layers 5L1-5L3 are stacked, the top line 2 in each layer 5L1-5L3 forms an independent path (e.g., a conductive path) and does not overlap with conductive lines from any other layer 5L1-5L3. For example, once the first, second, and third layers 5L1-5L3 are stacked together, the conductive top lines 2 in each of regions I, II, and III can form a continuous conductive stitch pattern (e.g., a stitch), or they can form independent conductive stitch patterns (e.g., stitches) that do not intersect or (e.g., directly) contact each other. Providing conductive paths between layers 5L1-5L3 of a multilayer flexible material using conductive lines can be considered conceptually similar to creating vias and routes in a conventional printed circuit board.

[0321] The advantage of guiding conductive lines between layers is that it reduces the number of intersections on the surface of a multilayer flexible material with high-density conductive material. Additionally, embedding conductive lines within specific layers can advantageously add additional properties to such lines, which derive from the inherent properties of the materials used to form such layers. For example, some layers of such a multilayer flexible material can be selected to provide RF and / or EMF / EMI protection characteristics that allow higher currents, voltages, and / or frequencies to pass through. Materials providing such RF and / or EMF / EMI protection characteristics can also be used to provide signals transmitted by such conductive lines disposed therein and / or on the conductors, including resistance to external RF, EMF, and / or EMI noise injection. As a further example, some layers of such a multilayer flexible material can be selected to provide additional mechanical advantages, such as tensile strength, moisture absorption, tear resistance, etc. Furthermore, some layers of such a multilayer flexible material can be selected to provide additional chemical advantages, such as flame retardant, antifouling, and / or antimicrobial properties.

[0322] Figures 7A-7C This illustrates how complex suture patterns are algorithmically broken down into a series of smaller suture lines to reduce suturing speed, the number of lines that must be stitched to form the complex suture pattern, and the number of skipped stitches and / or thread intersections. Figure 7A The diagram shows node 50 and the sequentially executed stitching action 40. Figure 7B This is an illustration of an exemplary implementation of a complex stitching pattern, generally specified as 60. Figure 7C It shows the nodes 50 of the complex stitching pattern 60 through a sewing machine (e.g., performing sequential stitching actions 40) that executes sequential stitching actions 40. Figure 1A Example implementation of the connection order of 10). Nearest neighbor combined with depth-first search is an algorithmic technique suitable for deconstructing a complex stitching pattern 60 into multiple adjacent nodes 50. Each node 50 is searched and sorted by a depth-first search algorithm. First, the node 50 at the bottom of a single branch (e.g., stitching path) of the complex stitching pattern 60 is stitched; adjacent nodes 50 with lengths between them are recursively found by the nearest neighbor algorithm, which are arranged in the stitching order, which includes multiple stitching actions 40. After the depth-first search algorithm is completed, the complex stitching pattern 60 is vectorized and converted into machine coordinates represented as vectors, Gerber, and / or gcode. At each non-child (e.g., end) node 50, the intersection between the top thread and the bobbin thread is cut before making adjacent stitches. If no cut is made between stitches, a skipped stitch is generated. A skipped stitch occurs when the previous stitch is electrically connected to another node 50, where a non-connected stitch will be performed at that other node 50 to form another part of the complex stitching pattern. When the sewing machine is unable to cut the thread at a non-child node 50 before sewing another part of the complex stitch pattern 60 from another node 50, the machine performs post-processing (e.g., by another machine or manually) on the device in which the complex stitch pattern is formed by cutting (e.g., slicing) this skipped point.

[0323] Figures 8A-8F An example implementation is shown in which multiple conductive lines in multiple conductive layers are constructed to form devices 300A-300F, which include electrodes, for example, for signal transmission purposes.

[0324] Figure 8AA first exemplary embodiment of a device generally designated 300A is shown, comprising an input electrode E1 and an output electrode E2 sewn into and / or on the same layer of a flexible material 5. Electrodes E1 and E2 are sewn in such a manner that they are exposed on a surface of the device 300A, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this exemplary embodiment, electrodes E1 and E2 have a high-density conductive material sewn onto the bottom surface of the layer of flexible material 5, which interacts with a sensitive layer 6 beneath the layer of flexible material 5. The layer of flexible material 5 on which electrodes E1 and E2 are disposed has conductive lines 1 sewn through the same layer of flexible material 5 to other portions of the device 300A for electrical communication (e.g., for signal transmission). According to the configuration of device 300A, input electrode E1 is configured to provide an input signal to sensitive layer 6, which then converts the input signal into an output signal. The output signal is then transmitted to output electrode E2, and can then be transmitted to a receiving device via conductive line 1 connected to output electrode E2. According to this example embodiment, the surface sensitivity of sensitive layer 6 can be measured and / or determined.

[0325] Figure 8BAn exemplary embodiment of a device generally designated 300B is shown, comprising an input electrode E1 and an output electrode E2 sewn into and / or on a separate (e.g., different, discrete, independent) layer of flexible material 5. In device 300B, the layer of flexible material 5 on which the input electrode E1 is disposed is located on the side of the sensing layer 6 opposite to the layer of flexible material 5 on which the output electrode E2 is disposed. Thus, the layer of flexible material 5 on which the input electrode E1 is disposed is located at the top surface of the sensing layer 6 (e.g., directly abutting, directly contacting), and the layer of flexible material 5 on which the output electrode E2 is disposed is located at the bottom surface of the sensing layer 6 (e.g., directly abutting, directly contacting). In another example embodiment, the layer of flexible material 5 on which the input electrode E1 is disposed may alternatively be located at (e.g., directly abutting, directly contacting) the bottom surface of the sensing layer 6, and the layer of flexible material 5 on which the output electrode E2 is disposed may be located at (e.g., directly abutting, directly contacting) the top surface of the sensing layer 6. Electrodes E1 and E2 are stitched together such that they are exposed on the surface of device 300B, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this exemplary embodiment, electrodes E1 and E2 have a high-density conductive material stitched onto the surface of a layer of flexible material 5 adjacent to (e.g., in direct contact with, closest to) the sensing layer 6 to interact with it. The corresponding layer of flexible material 5, where one of electrodes E1 and E2 is disposed, has a conductive line 1 stitched through the same layer of flexible material 5 to other parts of device 300A for electrical communication (e.g., signal transmission). Regardless of which side of the sensing layer 6 the layer of flexible material 5 where the input or output electrodes E1 and E2 are disposed, the input signal is received at the input electrode E1 and transmitted through the sensing layer 6. The input signal is converted into an output signal in the sensing layer 6, and the output signal is transmitted from the sensing layer 6 to the output electrode E2, which is located on the side of the sensing layer 6 opposite to the input electrode E1. According to this example implementation, the internal sensitivity of the sensitive layer 6 can be measured and / or determined.

[0326] Figure 8CAn exemplary embodiment of a device generally designated 300C is shown, comprising an input electrode E1 and an output electrode E2 sewn into and / or on the same layer of a flexible material 5. Electrodes E1 and E2 are sewn in such a manner that they are exposed on a surface of the device 300C, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this exemplary embodiment, electrodes E1 and E2 have a high-density conductive material sewn onto the bottom surface of the layer of flexible material 5, which interacts with a sensitive layer 6 beneath the layer of flexible material 5. The device 300C includes a conductive wire 1 sewn in a signal transmission line into and / or on a separate (e.g., different, discrete, independent) layer of flexible material 5, which is stacked on top of the layer of flexible material 5 on which electrodes E1 and E2 are disposed. A corresponding layer of flexible material 5 in which one of the conductive lines 1 is arranged (e.g., embedded and / or on its outer surface, in, or above) is disposed on the same side of the sensitive layer 6 as a layer of flexible material 5 in which electrodes E1, E2 are disposed. According to the configuration of the device 300C, the input electrode E1 is configured to provide an input signal to the sensitive layer 6, which then converts the input signal into an output signal. The output signal is then transmitted to the output electrode E2, which can then be transmitted to a receiving device via the conductive lines 1 connected to the output electrode E2. According to this example embodiment, the surface sensitivity of the sensitive layer 6 can be measured and / or determined. In some embodiments, the conductive lines 1 from electrodes E1, E2 are configured to provide an electrical "bus" to transmit signals to other parts of the device 300C.

[0327] Figure 8DAn exemplary embodiment of a device generally designated 300D is shown, comprising an input electrode E1 and an output electrode E2 sewn into and / or on a separate (e.g., different, discrete, independent) layer of flexible material 5. In device 300D, the layer of flexible material 5 where the input electrode E1 is disposed and the layer of flexible material 5 where the output electrode E2 is disposed are located on opposite sides of a sensing layer 6. Thus, the layer of flexible material 5 where the input electrode E1 is disposed is located at the top surface of the sensing layer 6 (e.g., directly abutting, directly contacting), and the layer of flexible material 5 where the output electrode E2 is disposed is disposed at (e.g., directly abutting, directly contacting) the bottom surface of the sensing layer 6. In another example embodiment, the layer of flexible material 5 where the input electrode E1 is disposed may alternatively be located at (e.g., directly abutting, directly contacting) the bottom surface of the sensing layer 6, and the layer of flexible material 5 where the output electrode E2 is disposed may be located at (e.g., directly abutting, directly contacting) the top surface of the sensing layer 6. Electrodes E1 and E2 are stitched together such that they are exposed on the surface of device 300D, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this exemplary embodiment, electrodes E1 and E2 have a high-density conductive material stitched onto the surface of a layer of flexible material 5, which is adjacent to (e.g., in direct contact, closest to) the sensitive layer 6 to interact with it. Device 300D includes conductive wires 1 stitched as signal transmission lines into and / or on top of separate (e.g., different, discrete, independent) layers of flexible material 5, which are stacked on top of the layers of flexible material 5 in which electrodes E1 and E2 are disposed. The corresponding layer of flexible material 5 in which one of the conductive wires 1 is disposed (e.g., embedded and / or located on its outer surface, in, or on) is disposed on the same side of the sensitive layer 6 as the layer of flexible material 5 in which electrodes E1 and E2 are disposed and connected to such conductive wires 1. Regardless of which side of the sensing layer 6 the flexible material 5 layer with input or output electrodes E1 and E2 is on, the input signal is received at the input electrode E1 and transmitted through the sensing layer 6, where the input signal is converted into an output signal. The output signal is transmitted from the sensing layer 6 to the output electrode E2, which is located on the opposite side of the sensing layer 6 to the input electrode E1. According to this exemplary embodiment, the internal sensitivity of the sensing layer 6 can be measured and / or determined.

[0328] Figure 8E An example implementation of a device generally designated as 300E is shown, which is based on Figure 8CThe device 300C is shown. Device 300C includes an input electrode E1 and an output electrode E2 sewn into and / or on the same layer of a flexible material 5. Electrodes E1 and E2 are sewn in such a way that they are exposed on a surface of device 300C, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this example embodiment, electrodes E1 and E2 have a high-density conductive material sewn onto the bottom surface of the layer of flexible material 5, which interacts with a sensitive layer 6 beneath the layer of flexible material 5. Device 300E includes a conductive wire 1 sewn in a signal transmission line into and / or on a separate (e.g., different, discrete, independent) layer of flexible material 5, which is stacked on top of the layer of flexible material 5 in which electrodes E1 and E2 are disposed. A corresponding layer of flexible material 5 in which one of the conductive wires 1 is arranged (e.g., embedded and / or on, within, or above its outer surface) is disposed on the same side of the sensitive layer 6 as a layer of flexible material 5 in which electrodes E1, E2 are disposed. A layer of semi-porous material 7 is disposed between the sensitive layer 6 and the layer of flexible material 5 in which electrodes E1, E2 are disposed (e.g., directly between them, as if in direct contact with each layer). The semi-porous material 7 may be an electrically, mechanically, magnetically, and / or chemically porous material that opens or closes its pores or changes its electromechanical, chemical, or magnetic state upon deformation to allow the layer of flexible material 5 (located on the top surface of the layer of semi-porous material 7 (e.g., directly thereon, as if in direct contact)) and the sensitive layer (located on the bottom surface of the layer of semi-porous material 7 (e.g., directly thereon, as if in direct contact)) to interact with each other (e.g., electrically). According to this exemplary embodiment, the external stimulus received by device 300E will cause deformation of the layer of semi-porous material 7, which will then allow an electrical connection between the layer of flexible material 5 in which electrodes E1, E2 are disposed and the sensitive layer 6. Alternatively, in some embodiments, the semi-porous material 7 may be electrically, mechanically, magnetically, and / or chemically induced to become electrostatically (rather than mechanically) highly conductive to allow signal flow between the layer of flexible material 5 in which electrodes E1, E2 are disposed and the sensitive layer 6 without any mechanical alteration to the pore size of the semi-porous material 7. According to the configuration of device 300E, input electrode E1 is configured to provide an input signal to the sensitive layer 6, which then converts the input signal into an output signal, which is then transmitted to output electrode E2, and can then be transmitted to a receiving device via a conductive line 1 connected to output electrode E2. According to this exemplary embodiment, the surface sensitivity of the sensitive layer 6 can be measured and / or determined. In some embodiments, the conductive line 1 from electrodes E1 and E2 is configured to provide an electrical "bus" to transmit signals to other parts of the device 300C.

[0329] Figure 8FAn exemplary embodiment of a device generally designated 300F is shown, comprising an input electrode E1 and an output electrode E2 sewn into and / or on a separate (e.g., different, discrete, independent) layer of flexible material 5. In device 300F, the layer of flexible material 5 where the input electrode E1 is disposed and the layer of flexible material 5 where the output electrode E2 is disposed are located on opposite sides of a sensing layer 6. Thus, the layer of flexible material 5 where the input electrode E1 is disposed is located (e.g., directly abutting, directly contacting) the top surface of the sensing layer 6, and the layer of flexible material 5 where the output electrode E2 is disposed is located (e.g., directly abutting, directly contacting) the bottom surface of the sensing layer 6. In another example embodiment, the layer of flexible material 5 where the input electrode E1 is disposed may alternatively be located (e.g., directly abutting, directly contacting) the bottom surface of the sensing layer 6, and the layer of flexible material 5 where the output electrode E2 is disposed may be located (e.g., directly abutting, directly contacting) the top surface of the sensing layer 6. Electrodes E1 and E2 are sewn together such that they are exposed on the surface of device 300F, which is configured to interact with adjacent surfaces having electrical, mechanical, magnetic, and / or chemical sensing properties. In this exemplary embodiment, electrodes E1 and E2 have a high-density conductive material sewn onto the surface of a layer of flexible material 5, which is adjacent to (e.g., in direct contact, closest to) the sensitive layer 6 to interact with it. Device 300F includes conductive wires 1 sewn in a signal transmission manner into and / or onto separate (e.g., different, discrete, independent) layers of flexible material 5, which are stacked on top of the layers of flexible material 5 in which electrodes E1 and E2 are disposed. The corresponding layer of flexible material 5 in which one of the conductive wires 1 is disposed (e.g., embedded and / or located on, in, or on the outer surface) is disposed on the same side of the sensitive layer 6 as the layer of flexible material 5 in which electrodes E1 and E2 are disposed and connected to such conductive wires 1. A layer of semi-porous material 7 is disposed between the sensitive layer 6 and the layer of flexible material 5 in which the input electrode E1 is arranged (e.g., directly between them, as if in direct contact with each layer), and also between the sensitive layer 6 and the layer of flexible material 5 in which the output electrode E2 is arranged (e.g., directly between them, as if in direct contact with each layer). The semi-porous material 7 may be an electrically, mechanically, magnetically, and / or chemically porous material that opens or closes its pores upon deformation, or changes its electromechanical, chemical, or magnetic state to allow the corresponding layers of flexible material 5 in which one of the electrodes E1, E2 is arranged and spaced apart from the sensitive layer 6 by the layer of semi-porous material 7 to interact with each other (e.g., electrically). According to this exemplary embodiment, an external stimulus received by the device 300F will cause deformation of the layer of semi-porous material 7, which will subsequently allow an electrical connection between the corresponding layer of flexible material 5 in which one of the electrodes E1, E2 is arranged and the sensitive layer 6.Alternatively, in some embodiments, the semi-porous material 7 can be induced by electrical, mechanical, magnetic, and / or chemical means to become highly conductive electrostatically (rather than mechanically) to allow signal flow between a corresponding layer of the flexible material 5 in which one of the electrodes E1, E2 is disposed and the sensitive layer 6, without requiring any mechanical alteration to the pore size of the semi-porous material 7 positioned therebetween. Regardless of which side of the sensing layer 6 the layer of flexible material 5 in which the input or output electrodes E1, E2 are disposed is located, the input signal is received at the input electrode E1 and transmitted through the sensitive layer 6, where it is converted into an output signal. The output signal is transmitted from the sensing layer 6 to the output electrode E2, which is located on the opposite side of the sensing layer 6 from the input electrode E1. According to this example embodiment, the internal sensitivity of the sensitive layer 6 can be measured and / or determined. Device 300F is particularly advantageous for providing differential control of the activation of the input and output electrodes E1, E2, for example, by controlling the excitation provided to one or both of the layers of the semi-porous material 7, which is bonded between one of the electrodes E1, E2 and the sensitive layer 6.

[0330] Figure 9 This is shown in the general background within garment 400 or the final product. Figure 8F The device 300F. The first and second electrodes are further sewn with conductive wires 1 (e.g., in the manner of signal transmission lines), the conductive wires 1 being directed toward the top and bottom layers of garment 400. The conductive wires 1 may be exposed on the top and / or bottom surfaces of garment 400 or the final product (e.g., at one of the terminals 410). Exposure of the signal transmission wires on the top or bottom surface can be accomplished by various electromechanical means, such as crimping, hook-and-loop fabric, welding, adhesives, wires, etc. In some embodiments, additional conductive wires 1 may be sewn together from existing conductive wires 1 to increase the number of connections to the corresponding input or output electrodes to which such conductive wires 1 are attached. Garment 400 may also include additional top and / or bottom layers 420 for aesthetic or electrochemical-mechanical purposes. Examples of such additional top and / or bottom layers 420 may include shielding device 300F from RF and / or EMF / EMI signals, protecting device 300F from chemical interference (e.g., sweat and / or light), and / or increasing the mechanical stability of device 300F by adding denser and / or abrasion-resistant materials.

[0331] Folding can include mechanically moving one side of material to the other. One example objective is to enable a layer with conductive material to interact with other conductive materials on the same layer that are far apart from each other or located on opposing layers. Another example objective is to form crease marks that preferentially bend when an external force is applied. Yet another example objective is to allow actuation of a device, where folding can open or close the device by connecting conductive materials from different parts of the device. Examples of folding include, but are not limited to, mountain folds, valley folds, linear and non-linear creases, roll-in folds, pleats, flips, pumpkin folds, push-ins, and inward or outward reversals. Folding and 3D processes can be derived from origami structures.

[0332] Folding discovered in nature, particularly atomic bonds and biological networks, can serve as a general basis for more complex folded architectures capable of realizing 3D folded patterns, but are not limited to such naturally derived folding. Folded patterns typically follow rational values ​​of π (π / 2, π / 3, π / 4). These folds allow 2D organized devices to form 3D structures.

[0333] Folding and cutting can be used to create 3D and scalable structures. In some cases, folds and cuts can be nested within matrices to allow for bending and folding of the device. Asymmetric folding and cutting can be used to create edges, islands, or structures that can be adjacent between two or more folding and cutting matrices. A non-limiting example is cutting between two separate areas of a cutting and folding pattern to separate folded structures that fold or interact with each other. Folding and 3D cutting can be derived from, for example, paper-cut structures, but are not limited to them.

[0334] In some cases, folding and / or cutting on a single piece of fabric can be used to design garments (e.g., for human wear). Folding and / or cutting can also be used to allow for scalability for different body sizes, enabling sizes such as small, medium, and large to be made on the same garment, stretched or expanded to fit the desired body size. Garments with universal sizing will advantageously allow for improved manufacturing and retail efficiency, while also allowing people with different body sizes to share the same clothing. Furthermore, for aesthetic and / or functional purposes, folding and cutting repeating patterns can be used to allow garments to be worn in different directions and / or angles.

[0335] exist Figure 10A The image shows several different example arrangements of electrodes E1 and E2 for sensor 300. Figure 10AIn this configuration, each sensor 300 requires at least two electrodes E1 and E2. Electrode E1 is the input electrode and is configured to allow input signals to be transmitted to the sensor 300; electrode E2 is the output electrode and is configured to allow output signals to be transmitted from the sensor 300 to, for example, a receiving unit, a central processing unit (CPU), another sensor 300, and / or, for example, a receiving unit, a central processing unit (CPU), another sensor 300, and / or, for example, a receiving unit, a central processing unit (CPU), a central processing unit (CPU), a receiving ... or The module's transmission device (e.g., for wired and / or wireless transmission). Sensor 300 can be manufactured in any shape, with electrodes E1 and E2 connected relative to sensor 300 in any arrangement to allow signal input and output. Signals input to and from sensor 300 travel the shortest distance between electrodes E1 and E2. Therefore, electrodes E1 and E2 connected to sensor 300 at corresponding locations further apart from each other capture (e.g., measure) a larger portion of the sensing area of ​​sensor 300 (e.g., in...). Figures 8A-8F In the sensing layer 6). Conversely, electrodes E1, E2 connected to the sensor 300 at corresponding positions closer to each other capture (e.g., measure) a smaller portion of the sensing area of ​​the sensor 300 (e.g., in the sensing layer 6). Figures 8A-8F (In the sensing layer 6). However, as the distance between the locations of electrodes E1 and E2 on sensor 300 increases, the sensitivity of the sensing area decreases. For example, electrodes E1 and E2 connected to sensor 300 at locations closer to each other are more sensitive to input signals than electrodes E1 and E2 connected to sensor 300 at locations further apart; such electrodes E1 and E2 connected to sensor 300 with increased distance between them may require more (e.g., a higher number or amplitude) of excitation (e.g., input signal) to generate a reading. This is due to impedance matching, signal attenuation through more sensing material, and increased parasitic capacitance and resistive noise from exposure to the environment.

[0336] exist Figure 10B The diagram illustrates that the sensing area of ​​sensor 300 can be cut, folded, twisted, repeated, and generally deformed in any 2D or 3D topology to best cover the target sensing area. In some example embodiments shown, the sensor is cut or otherwise branched into two sensor areas 300A, 300B, which are connected together by a highly conductive wire 301 (e.g., a conductive wire). Electrodes E1, E2 can intersect any sensing area or connector between sensing areas.

[0337] exist Figure 10CThe diagram illustrates an example implementation of a system generally designated 500A-500C, comprising a combination of sensors 300. The sensors in this system 500A-500C can be organized such that connectors and electrodes (e.g., E1-E6) can be shared among the sensors 300. Additionally, the sensors 300 can be arranged to allow signal fusion to be performed to measure the overall signal input of this system 500A-500C. For example, system 500A includes a grid of sensors 300, which can be used to generate a 2D representation of the signal on a plane; applications may include, for example, touch sensing or ground mapping. Figure 10C Another example implementation shown is system 500B, in which sensors 300 are angled, tilted, and / or tilted relative to each other, making it possible to determine the direction of signals affecting the system (e.g., 500B, 500C); applications may include, for example, swiping on a screen, or devices that need to distinguish how signals cross and / or pass through a device. Figure 10C Another example implementation shown is system 500C, in which sensors 300 are stacked relative to each other in an angled, tilted, and / or warped arrangement; in such an example implementation, system 500C can measure the vertical characteristics of a signal, such as the magnitude and rate of signal variation, and the direction and angle at which the signal is received by system 500C. In such systems 500A-500C, the inter-sensor spacing determines the voxel resolution of the sensor matrix. Orientation and inter-sensor layout determine the sensing direction and angle. Sensors 300 distributed or arranged in horizontal and vertical rows and columns can measure variations in the XY directions as defined in a Cartesian coordinate system. Sensors 300 distributed or positioned in a radial pattern can measure variations in angular directions as defined in a polar coordinate system. Sensors 300 overlapping each other (e.g., vertically stacked on top of each other) can measure minute variations in the vertical direction (e.g., the thickness direction, the direction in which such sensors 300 are stacked) and can correct for mechanical, thermal, and / or non-conformal defects.

[0338] Figure 11A and Figure 11B The illustration schematically shows how to use folding and / or cutting to... Figures 8A-8F , Figure 9 The sensor shown in Figure 10 adds flexibility, scalability, and 3D curvature. To illustrate this, an example implementation including a 2×2 sensor matrix (shown as sensing layers 6A-6D) is provided, which uses four (4) input electrodes (e.g., E1-E4) and four (4) output electrodes (e.g., E5-E8) connected to different sides of sensing layers 6A-6D. Signal transmission lines from the electrodes are bus-connected on a different layer than electrodes E1-E8. Arrows pointing to the layers indicate areas to be folded or cut. Figure 11AThis is a cross-sectional view of a device including multiple sensors 300, formed by folding and / or cutting. Figure 11B This is a top view, where solid lines indicate locations where cutting has already occurred, and dashed lines indicate locations where folding is to be performed. Cutting is carried out in layers without any electrodes or conductive lines. Folding occurs between electrodes E1 and E2 within the same layer to delineate the area of ​​the sensitive region. Figure 11A and Figure 11B The device shown is configured to stretch in the x and y directions and bend in the z direction. Example applications of such a device may include, but are not limited to, applying such a device to joints of the human body (e.g., shoulder, elbow, knee, ankle, hip, wrist, fingers and toes, chest, and / or neck) to measure compressive force, tension, tensile force, and compressive stress. Other example sensing features may include skin voltage pickup and physiological measurements such as temperature, humidity, and / or sweat sensing.

[0339] Figure 12A -C shows an electrical schematic or diagram illustrating the construction of such a touch-sensitive device disclosed herein. Figure 12A A dual-electrode touch device is shown. This device uses two resistors R. L and R R The voltage divider mechanism. The force caused by the touch generates a signal connection in the resistive region R. The touch completes the circuit by grounding the resistive region R. The location of the touch divides the resistive region R into two parts, one facing left and one facing right towards the voltage divider R. L R R The left and right sides. The two regions of the resistor region R can be divided from left to right. Left and right voltage divider R L R R These are pull-up resistors, all connected to V. cc From the left voltage divider R L And right voltage divider R R Read the left and right signals (e.g., at electrodes E1 and E2). The signals on the left and right sides of the resistive region R are V. cc The ratio of the left and right signals is equal to 1. The ratio of the left and right signals corresponds to the relative distances to the left and right sides of the touch distance resistive region R.

[0340] Figure 12B A dual-touch-sensitive device is shown, its construction being similar to Figure 12A The device shown has pull-up resistors R on both sides. L R R Equal. Applying two touch points to the resistive region R will create three grounded resistor segments. Represented as R LS and R RSThe right and left segments are used to calculate the signal ratio on the right and left electrodes. However, the middle portion of resistor segment R is not used, and this middle portion is not needed for dual-touch position calculation. The formula for the left voltage divider ratio is R. LS / (R LS +R L The formula for the right voltage divider ratio is R. RS / (R RS +R R If the touch connection is grounded, and the left and right pull-up resistors R L R R Connect to V cc If the connection is reversed, then the equation holds. When the connection is reversed, the equation follows R for the ratios on the left and right sides, respectively. L / (R LS +R L ) and R R / (R RS +R R Furthermore, the middle portion of the resistive region R (e.g., the portion between two touch points) can be indirectly derived as R. TOT -R LS -R RS , where R TOT This is the total resistance of the resistive region. From the left voltage divider R L And right voltage divider R R Read the left and right signals (e.g., at electrodes E1 and E2). The signals on the left and right sides of the resistive region R are the ratio of Vcc, and their combined ratio equals 1. The ratio of the left and right signals corresponds to the relative distances of the touch distance from the left and right sides of the resistive region R. Therefore, the relative left and right touch positions on the resistive region can be determined.

[0341] Figure 12C An example embodiment of the construction of a touch sensor made of fabric using electrodes, connectors, and resistors is shown. The first electrode E1 is a stitched area on a semi-porous material 7, preventing contact with (e.g., direct contact) a first layer of resistive or piezoresistive material 9. The resistive material 9 comprises a semi-conductive fabric, the number of stitches, weight, density, and thickness of which are chosen to customize a specific resistivity following the equation R = ρt / A, where t is the thickness of the fabric layer, and A is the length and width of the fabric layer. ρ is the resistivity of the fabric, determined by its mechanical and chemical composition. Variations in fabric thickness, area, and resistivity give it mechanical and tactile responsiveness.

[0342] The second and third electrodes E2 and E3 are connected to the ends of the layers of resistive material 9. The second and third electrodes E2 and E3 are sewn to the second and third resistive fabric layers (e.g., each resistive fabric layer includes a resistor R), leading to a shared connector that can be connected to electrical ground or a power supply (e.g., V). ccThe second and third resistive fabric layers have equal resistance values. In this example, the signal connected to the shared connector is grounded. To complete the circuit, the first electrode E1 that activates the touch signal is connected to V. cc If the signal direction is reversed, such that the first electrode E1 is electrically grounded and the second and third resistive fabric layers are connected to V... cc When the device is not touched and therefore no signal flow occurs, the V on the second and third resistive fabric layers... cc It will accumulate charge, leading to static electricity, heat dissipation, or other adverse effects. If V cc When connected to the first electrode E1, the charge can dissipate in the semi-porous material layer 7 when the device is not touched, without affecting other parts of the device.

[0343] When the device is not touched, the first electrode E1 does not contact the resistive material 9 due to the semi-porous material 7. Therefore, the device is not turned on (e.g., inactive). When the device is touched, the first electrode E1 penetrates the semi-porous material 7 and induces a voltage divider between its left and right sides in the resistive material 9. Figure 12A and Figure 12B The equation described herein can be used to calculate the signal ratio between the second electrode E2 and the third electrode E3. This signal ratio is then used to calculate the relative position of the touch distance to the left and right sides of the device.

[0344] Figure 13A and Figure 13B Another example implementation of the touch sensor is shown, which is from Figure 12A The implementation shown in -C is a modification. Figure 13A and Figure 13B The modification to the device shown is achieved by adding a pressure-sensitive material to sense the touch location and the magnitude of the force applied by the touch. This pressure sensor can, for example, be implemented via a resistance region to V... CC This is achieved using an additional voltage divider. This additional voltage divider uses a pressure-sensitive material R... P It changes its impedance according to changes in pressure. The device includes two switches SW, which are toggled to selectively measure the left and right voltage dividers used to calculate the touch position and the voltage divider used to measure the pressure. One switch SW is connected in series with V. cc Between the left and right pull-up resistors, the second switch SW is connected to V. cc R P Series connection. Only one switch SW is activated during a given measurement period. When a touch occurs, the switches SW to the left and right pressure dividers are activated to measure the location of the touch. Then, the switch SW on the pressure divider opens, allowing the measurement to proceed according to equation R. P / (R P +R Δ Pressure measurements are performed, where RΔ This refers to the change in the resistance of the sensitive layer. These calculations must be performed sequentially, not concurrently (e.g., not simultaneously), because the touch voltage divider and the pressure voltage divider can interfere with the readings obtained from each other. If the electrodes are connected to a microcontroller or processor, the firmware can determine when and how quickly to switch between touch and pressure measurements.

[0345] Figure 13A This is a cross-sectional view of a fabric-based touch sensor device. In this example embodiment, a first electrode E1 is embedded in or connected to a semi-porous material 7. The semi-porous material 7 is bonded to a sensitive layer 6 comprising a pressure-sensitive material. A layer of resistive material 9 for touch measurement is stacked on the opposite side of the pressure-sensitive material to the semi-porous material 7. The arrangement order of the pressure-sensitive material 6 and the resistive material 9 can be... Figure 13A The order shown is reversed. Resistive material 9 is also connected to the third and fourth electrodes E2 and E3 on their opposite sides. The third and fourth electrodes E2 and E3 are used to measure touch signals on the left and right sides, respectively. The third and fourth electrodes E2 and E3 are also connected to additional left and right resistive materials R (which can be configured as pull-up or pull-down resistors). The left and right resistive materials R are connected to V... cc Previously, each electrode was connected in series with a corresponding switch SW. The device also includes a second electrode E2, which is embedded in a layer of flexible material 5 between the piezoresistive material 6 and the resistive material 9. The second electrode E2 is connected to a fifth electrode E5, which is exposed on an external component of the device for external measurement. The fifth electrode E5 is connected to another resistive element R. P In series connection, the resistive element is configured as either a pull-up resistor or a pull-down resistor. The fifth electrode E5 is connected to the resistive element R. P It was previously connected in series with switch SW.

[0346] When pressure exceeding a specific threshold (e.g., mechanical, chemical, electromechanical, and / or magnetic threshold) is applied to the device, the first electrode E1 makes electrical contact with the pressure-sensitive material 6 and the resistive material 9. For touch sensing, the signal is transmitted to the left and right sides of the resistive material 9 (labeled R1 and R2 respectively). A and R B The electrode is divided into two parts. Simultaneously, the fourth electrode E4 is electrically connected to the first electrode E1, and the compressive force causes a change in the impedance R of the sensitive material. Δ Its in R P The area is divided. Touch pressure corresponds to a calculated value of R. P / (R P +R Δ The pressure ratio of the touch force. The device may need to be calibrated to measure the touch force between the minimum and maximum values. The ratio determined by the touch pressure corresponds to a specific value between the maximum and minimum values, which is calculated as (maximum - minimum) x R. P / (RP +R Δ )Sure.

[0347] The switches SW connected to the touch-sensitive circuit and the pressure-sensing circuit must alternately switch between each other. Switching can be done mechanically or via firmware control (e.g., via a microcontroller or CPU), with the first switch SW on and the second switch SW off to measure touch. Then, the first switch SW must be off and the second switch SW on to measure the pressure applied to the device by touch.

[0348] Figure 13B It shows Figure 13A The block diagram illustrates an operational amplifier (typically designated OP-AMP) used as a signal buffer between voltage dividers for touch sensing and pressure sensing. In this embodiment, an OP-AMP is used instead of a switch. The advantage of using an operational amplifier is that switching between the touch sensing and pressure sensing circuits can be performed without external commands. Due to its high input impedance and low output impedance, the operational amplifier can control the signal flow. Furthermore, the operational amplifier can be configured as a voltage follower in a negative feedback loop to further isolate input and output signals between different segments of the circuit. Additionally, the operational amplifier can be configured as a non-inverting or inverting amplifier to modulate signal variations. In some embodiments, MOSFETs, BJTs, diodes, and other transistors with tri-state logic and high impedance logic control can be used instead of the OP-AMP.

[0349] Figure 14A -C illustrates multiple connection schemes for routing input and output signals from a chain or array of sensors 300. Figure 14A A daisy-chain strategy is illustrated, where the output of one sensor is used as the input of an adjacent sensor. These wires can be power lines, ground lines, or signal lines. Examples of such connections are I2C, SPI, and SWI communication, which require a minimum of one wire and a maximum of four wires. The wires can transmit frequency-modulated signals so that a specific frequency is matched to a specific sensor on the chain. Each sensor has its own signature, allowing specific and controlled device-to-device communication. Situations where daisy-chain communication may not be suitable include situations where some sensors cannot adapt to high-frequency communication. Another example where daisy-chain communication may not be suitable is when sensors cannot receive or share power or ground sources from adjacent sensors due to the risk of power incompatibility, impedance mismatch, and / or signal degradation caused by signal crosstalk. Daisy-chaining is a method of limiting the number of connectors by propagating the same signal in a sensor chain or sensor array. Input and output electrodes (in Figure 14AThe lines (represented by + and -) are applied to the sensor and then connected to adjacent sensors via a bus. Connectors can be connected in series (solid lines) or in parallel (dashed lines) via the bus, with connectors branching or forking to connect to adjacent sensors.

[0350] Figure 14B Another example implementation of the connection scheme is shown, in which a single wire is shared among multiple sensors, but either their input or output signals are independently wired. The shared wire is typically a power or ground source, or an input signal. Each sensor's output signal is typically wired separately. In such a scheme, the number of connections is at least n+1, where n is the number of sensors. The advantage of this wiring configuration is that it is compatible with virtually all types of sensors, unaffected by their frequency requirements, power compatibility, impedance matching, or signal crosstalk. Furthermore, by connecting independently to each sensor without requiring modulation and deconvolution of the frequency signals, firmware and CPU setup are significantly simpler. Figure 14B As shown, the array of sensors 300 can share the same input signal, provided that the sensors 300 are of the same type or have similar electrical characteristics. The input signal can be VCC, GND, a digital signal, or a frequency-dependent analog signal. The output of each sensor is independently connected.

[0351] Figure 14C Another example implementation of the connection scheme is shown, in which power, ground, or input and output signals are wired in a grid pattern on a separate layer connected to the sensor. In this example implementation, the power lines are wired on the top layer, and the output signal lines are wired on the bottom layer. The power lines are wired along... Figure 14C The vertical wiring runs from top to bottom, while the output wire runs along... Figure 14C The wiring runs horizontally from left to right. The wires are then bent to converge at the central CPU connection (represented as an electrode). The number of intersections on the grid determines the number of devices or sensors that can be mounted. Therefore, if there are n rows and m columns, there are at least n x m connected sensors. Firmware control is needed to determine when power and signal lines are turned on, off, or enter a high Z state for individual communication with each sensor.

[0352] To measure the sensor at (1,1) (i.e., the sensor in the first row and first column), the power line to column 1 needs to be turned on, all other power lines turned off, and the signal from row 1 needs to be read. In this state, the sensor at (2,1), which is the second row sensor with the first power column line turned on, can also be measured. To measure the sensor at (1,2), the power line to column 2 needs to be turned on, all other power lines turned off, and the signal from row 1 needs to be read. Similarly, the sensor at (2,2) can be read because it shares the same power line in column 2. This selective switching of the power lines can be performed quickly, allowing the entire map of sensors to be measured within a single CPU cycle.

[0353] for Figure 14C Several example design considerations exist for minimizing stray signal quantity and crosstalk. One such consideration is the size of the stray capacitance between the sensor and the signal line, which determines the speed at which the CPU moves to read adjacent sensors. This stray capacitance must be completely dissipated before reading adjacent sensors. Another such consideration is the isolation layer between the power and signal lines, preventing power lines from crossing and dissipating into adjacent power lines. Yet another such consideration is the travel distance of the power and signal lines; the longer the lines, the more susceptible they are to signal attenuation, noise injection, and crosstalk. To minimize these problems, amplifiers may need to be added within the device (e.g., if it includes multiple sensors) to amplify or sustain the signal along long wire paths.

[0354] like Figure 14C As shown, the sensor matrix is ​​connected in such a configuration that there are planes for vertical connectors and planes for horizontal connectors, such that at the intersections of the connectors are sensors connected to input and output signals. In some embodiments, the vertical or horizontal connectors may be coplanar with each other, provided they do not intersect, or otherwise have a covering layer to prevent electrical short circuits between the connectors; a simple example is insulated wire. The vertical connectors can be either input or output signal carriers; the horizontal connectors will be complementary signal carrier types. At each intersection of the vertical and horizontal connectors, there is a sensor where the sensor can display the signal pattern connected to the vertical or horizontal connector. The signal pattern determines the size and sensitivity of the sensor at that intersection.

[0355] The example connector configuration shown in Figure 14 can be applied to a monolithic sensing layer. The monolithic sensing layer can be divided into coordinates of sensitive regions determined by the number of vertical or horizontal connectors. The intersections of the vertical and horizontal connectors determine the sensitive location of the sensor layer. The signal pattern at the intersections determines the sensitive region and the sensitivity level. This can be advantageous because it eliminates the need to first cut or distribute the sensor layer into discrete units; in such an implementation, a single sensor plane can be used, and it can be electrically partitioned by the intersections of the vertical and horizontal connectors. In such an example implementation, the number of connectors is n+m, where n is the number of vertical sensors in the matrix and m is the number of horizontal sensors in the matrix.

[0356] exist Figure 14C In the example implementation shown, the size of the pattern and the spacing between patterns are determined by the surface coverage and surface resolution. The number of turns and the amount of surface covered by the conductive traces are used to determine the dynamic range and sensitivity of the sensitive area. However, the more complex the pattern, the more effort is required to manufacture such a design, and the cost of using conductive lines increases, thereby increasing the costs associated with assembly or manufacturing. Furthermore, the pattern must be continuous and constructed from single lines without overlap so that adjacent patterns can be formed during the same run. Although patterns can be manufactured individually, additional steps must be taken to combine adjacent patterns using additional sewing, embroidery, adhesives, ultrasonic welding, or similar methods, which increases the complexity of the construction. Figure 14C This illustrates a representative method of trace routing, where rows or columns are connected together and terminate at an easily accessible edge. Figure 14C An exemplary surface for forming a sensor is shown, illustrating how two layers can be stacked. An example use case for separating the sensitive areas is for monitoring steps, or distant objects and / or motion. Utilizing multiple separate conductive areas, a single layer can contain all rows or columns connected and terminating at the same lead.

[0357] Figure 15A -C illustrates another connection scheme where sensor 300 is multiplexed using as few wires as possible. The shown connection configuration is suitable for sensors capable of tri-state operation, meaning the sensor can be in an on, off, or high Z state. Similarly, the CPU of the control device must also have tri-state control. Furthermore, the device must exhibit signal polarity, meaning the signal can only flow from input to output. Voltage or current flowing from output to input will put the device in a high Z state. Each wire may also require a resistor to control current flow and minimize signal interference between connected sensors.

[0358] In a two-device configuration, the input of the first sensor 300 is connected to the first electrode, and its output is connected to the second electrode. The second sensor 300 is connected in the opposite way, with its input connected to the second electrode and its output connected to the first electrode. If the first electrode sends a signal, the first sensor 300 turns on, and the second sensor 300 enters a high Z-state. The second electrode will then read the signal from the first sensor 300. If the second electrode sends a signal, the first sensor 300 enters a high Z-state, and the second sensor 300 turns on. The first electrode will then read the signal from the second sensor 300. This principle can be extended to multiple sensors 300. When multiple sensors 300 are connected, the polarity between the input and output signals is switched to measure the signal of the connected sensor 300. To eliminate crosstalk between adjacent sensors 300, all other electrodes must enter a high Z-state to disconnect non-measuring sensors 300.

[0359] Figure 15B A fabric-based Charlie multiplexing system is shown. This configuration is linearized for visual purposes but can also be configured as a grid. Each signal line / electrode is connected in series with a resistor. Each resistor has the same resistance value. Each sensor is shown as a square with a bar at one end and a dot at the other. The bar represents the sensor's input signal, and the dot represents the sensor's output signal. The signal can only move from the bar to the dot. A signal traveling from the dot to the bar will put the sensor in a high Z state. A signal traveling from the bar to the dot must exceed a certain threshold to activate the sensor and turn it on. In some sensors, this might mean mechanical force (e.g., touch) or voltage. Sensors with switching and signal polarity behavior can also be described as transistors.

[0360] Due to the signal polarity of the sensors, two sensors with opposite directions can be connected to the same pair of electrodes. For the example of electrodes 1 and 2 (also referred to as electrodes 1 and 2), power is sent through signal line 1, thus turning on the first sensor and forcing the second sensor into a high Z state. The output of the first sensor is then measured using electrode 2. If power is sent through electrode 2, the second sensor turns on, and the first sensor enters a high Z state. The signal from the second sensor is then measured using electrode 1. During these measurements, the remaining electrode 3 is placed in a high Z state, effectively disconnecting all sensors not connected to the pins of electrodes 1 and 2. This pattern of measuring sensor pairs on a pair of electrode pins can cycle through all electrode combinations. The first cycle will cycle through pins 1 to N, and the second cycle will cycle through pins 2 to N. Examples of pairs are (1,2), (1,3), (1,4)... and (2,1), (2,3), (2,4) and (3,1), (3,2), (3,4)... to all possible positions of pins N. Therefore, given N pins, there can be at most N... 2-N connectable sensors. If the number of sensors is given in advance (n sensors in this example), then the number of pins required to connect them all together will be...

[0361] Figure 15C It shows Figure 15B The diagram shows a cross-sectional view of a fabric-based transistor sensor. The bar indicating the sensor input is a schematic diagram of layer 5 containing a first electrode E1 made of stitched or braided conductive wires. The first electrode E1 is in contact with a second layer composed of a semi-porous material 7, which prevents electromechanical contact with a third layer that acts as a sensing layer 6. The sensing layer 6 may be made of a semi-conductive fabric with electro-chemical-magnetic-mechanical sensing properties. Below the sensing layer 6 is a fourth layer in which a second electrode E2, made of stitched or braided conductive wires, is embedded. Due to the semi-porous material 7, the signal flows only from the first electrode E1 to the second electrode E2. No signal can flow from the second electrode E2 to the first electrode E1. Therefore, the sensor has a signal polarity from the first electrode E1 to the second electrode E2. When no external stimulus is applied, the device is in a high Z state. If a ground signal is connected to the first electrode E1, the sensor is off. If an external stimulus, such as a power source or pressure, is applied to the first electrode E1, the electrical or mechanical change deforms the semi-porous layer 7, allowing the first electrode E1 to contact the sensing layer 6, thereby allowing signal flow. The signal stream then exits the sensor as an output signal from the second electrode E2. Since the sensor can enter on, off, and high-Z states, and can be turned on due to external excitation, it can be considered a transistor with tri-state behavior. To reverse the signal polarity, the sensor structure can be changed from... Figure 15C The structure shown is reversed, or the semi-porous material 7 can be stacked between the sensitive layer 6 and the second electrode E2.

[0362] Figure 16This is a flowchart illustrating the steps of a method for manufacturing or constructing a touch-sensitive device disclosed herein, according to an example embodiment. In a first step, the method includes constructing a first layer having a repeating pattern of conductive material in a series of rows and / or columns. Next, the method includes constructing a second layer having a repeating pattern of conductive material in a series of rows and / or columns, the second layer alternating with the first layer (e.g., the arrangement alternates with the first layer). Next, the method includes stacking a third layer on top of the first and second layers (e.g., between them, on the same side, etc.), the third layer comprising a sensing material. Next, the method includes combining the first, second, and third layers to form an assembly (e.g., having a single or monolithic structure). Next, the method includes covering the bottom and top sides of the assembly with fourth and fifth layers of material (e.g., the fourth and fifth layers are of the same material), respectively. Next, the method includes combining the fourth and fifth layers to the top and bottom sides of the assembly, respectively, to form a single, uniform assembly (e.g., having a single or monolithic structure). Next, the method includes the step of combining terminating conductive materials from the first and second layers with connecting conductive materials configured to connect to a receiving device.

[0363] Figure 17 This is a flowchart illustrating the steps of a method for data collection using a touch-sensitive device disclosed herein, according to an example implementation. First, the method includes numbering and assigning GPIO pins on a column or row vector as outputs. Next, the method includes the steps of: assigning corresponding columns or rows not assigned as GPIO pins as analog inputs; then, setting an analog-to-digital converter (ADC) to a specific conversion speed and voltage reference. Next, the method includes the steps of: routing GPIO pins or analog inputs to a multiplexer to increase the number of pin outputs; then, arranging the GPIO pins according to the multiplexer's specifications to perform digital logic. Next, the method includes the steps of: sequentially transitioning GPIO pins to a high state while keeping other GPIO pins low; corresponding analog pins recording incoming data and performing digital conversion and any filtering steps. Next, the method includes the steps of: reading analog data and converting it to a machine-readable format via a CPU, then storing it in memory; this step also includes retrieving a data matrix and assembling it into a byte array, which is transmitted via an external communication protocol. Next, the method includes the following steps: the receiving device unpacks the transmitted data into bytes, and the receiving device organizes the decomposed bytes into a matrix that matches the matrix in the sensor; the step also includes visualizing the data.

[0364] Figure 18This is a flowchart illustrating the steps of a method for a user to interact with a touch-sensitive device disclosed herein, according to an example embodiment. In the first step, the method includes: providing the device (e.g., a sensor) to a desired location; the device may be rolled up, folded, and / or carried to the desired location by the user. Next, the method includes the step of arranging (e.g., by the user) the device on a platform (e.g., a floor, a seat, etc.); in some embodiments, multiple such devices may be assembled (e.g., by the user) to form a larger, single, integrated device and / or system. Next, the method includes the steps of: turning on (e.g., by the user) one or more devices and connecting such devices to a receiving device (e.g., through which the one or more devices communicate electronically); in embodiments where no receiving device is available (e.g., due to lack of electrical communication, lack of system resources, or other reasons), the device itself may be allocated to internally store data (e.g., in a memory provided with the one or more devices). Next, the method includes the step of the user interacting with the device through physical activity or by applying force to the device; this force may be applied to the device by the user via a device or other machine. The method then includes the following steps: the captured data is visualized, stored, and / or processed locally and / or via a cloud with machine learning capabilities to evaluate and respond to incoming data.

[0365] It should be understood that various details of the currently disclosed subject matter may be changed without departing from the scope of the subject matter. Furthermore, the foregoing description is for illustrative purposes only and not for limiting purposes.

Claims

1. A sensing device, comprising: A passive component, formed of multiple individual layers stacked sequentially on top of each other, and comprising: Multiple insulating layers, each of which contains insulating material; At least one sensing layer, each of which contains a conductive or semiconductive material; Multiple conductive layers, each of which contains a conductive material; and At least one semi-porous layer, each of the semi-porous layers comprising a semi-porous material; At least some or all of the plurality of conductive layers are separated from each other by one or more of a plurality of insulating layers, one or more of at least one sensing layer, and / or one or more of at least one semi-porous layer; and Among them, passive components include one or more of the characteristics of resistance, capacitance and inductance; The first insulating layer is disposed above the top surface of the passive component; A second insulating layer is disposed above the bottom surface of the passive component; and One or more conductive wires, each of which is electromechanically connected to one of a plurality of conductive layers of a passive element, and is also exposed on and / or embedded in a first or second insulating layer.

2. The sensing device of claim 1, wherein the plurality of individual layers of the passive element are cut and / or folded to stack on top of each other and secured together by one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, curling and / or casting.

3. The sensing device of claim 1, wherein the sensing device is configured to cut and / or fold to conform to an irregular surface geometry, wherein the irregular surface geometry includes one or more of clothing, body parts, vehicles, household appliances and / or furniture.

4. The sensing device according to any one of claims 1 to 3, wherein a plurality of insulating layers and a plurality of conductive layers are located on the same side as at least one sensing layer.

5. The sensing device according to claim 1, wherein the first conductive layer and the second conductive layer of the plurality of conductive layers each comprise a pattern of conductive material to control the resistance, capacitance and / or inductance characteristics of the passive element.

6. The sensing device according to claim 1, wherein, For at least one sensing layer and / or at least some of the plurality of conductive layers, the thickness, chemical composition, porosity, area of ​​the intersection region of the top conductive layer and the bottom conductive layer, thickness of the trace, number of turns in the pattern, spacing between the wound conductive traces and / or distance from the sensitive material of the material are selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common noise rejection ratio, signal gain, sensitivity and / or insensitivity of the sensing device.

7. The sensing device according to claim 5, wherein: The first conductive layer and the second conductive layer are located on opposite sides of the sensing layer; At least one semi-porous layer includes a first semi-porous layer and a second semi-porous layer; The first semi-porous layer is disposed between the first conductive layer and the sensing layer; The second semi-porous layer is disposed between the second conductive layer and the sensing layer; and The semiporous material of each of the first and second semiporous layers is selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

8. The sensing device of claim 1, comprising one or more additional layers bonded to the first insulating layer and / or the second insulating layer, said one or more additional layers comprising one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials and metal-like materials.

9. The sensing device of claim 1, wherein each of the plurality of insulating layers, the at least one sensing layer, the plurality of conductive layers and the at least one semi-porous layer is combined together using one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, curling and casting.

10. The sensing device of claim 1, wherein the edge of the sensing device is accomplished by one or more of sewing, embroidery, hot pressing, adhesive bonding, ultrasonic welding, folding, curling, and casting.

11. The sensing device of claim 1, wherein the one or more conductive lines comprise a plurality of conductive lines configured to be disposed at any location on and / or within the sensing device.

12. The sensing device of claim 11, wherein the plurality of conductive lines are disposed by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery.

13. The sensing device according to claim 11 or 12, wherein the plurality of conductive lines are filled within the sensing device with a porous material or a semi-conductive material.

14. The sensing device of claim 11, wherein the plurality of conductive lines are connected to a passive or active filtering component, the passive or active filtering component being configured to perform one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

15. The sensing device of claim 11, wherein the plurality of conductive lines are terminated on a connector, the connector being connected to a controller configured to assemble input data, thereby creating assembled data and transmitting the assembled data to a receiving device.

16. The sensing device of claim 11, wherein the region between the points where the sensing layer contacts the plurality of conductive lines determines the sensitive region thereon of the passive element.

17. The sensing device according to any one of claims 1 or 16, wherein the at least one sensing layer comprises a plurality of sensing layers configured to distinctly determine the direction of an excitation applied to the sensing device in any of the X, Y, and Z planes.

18. The sensing device of claim 17, wherein the sensing device includes a switch configured to switch a measurement of one of the plurality of sensing layers.

19. The sensing device of claim 17, wherein the sensing device is configured to use logic gates, clocks, and / or a CPU to time and deconvolve output signals from the plurality of sensing layers.

20. The sensing device of claim 1, wherein the one or more conductive lines comprise a plurality of conductive lines folded into separate layers within the sensing device.

21. The sensing device of claim 1, wherein the sensing device is configured such that, by changing the input signal on at least one conductive material of the one or more conductive layers, a signal from the passive element is distinguishably turned on or off, or enters a high Z state via at least one semi-porous layer.

22. The sensing device according to claim 1 or claim 6, wherein the sensing device is configured to: when the direction of excitation is the same as the direction in which at least one semi-porous layer is positioned between one of the plurality of conductive layers and the at least one sensing layer, the sensing device enters an on state, an off state, or a high Z state based on the direction of excitation applied to the sensing device.

23. The sensing device according to claim 1 or claim 2, wherein the passive element is configured to cut and / or fold in any of the X, Y, and Z directions to distinguish the excitation applied to the sensing device in any of the X, Y, and Z planes.

24. The sensing device of claim 1, wherein the sensing device is configured to interact with a user for motion acquisition purposes.

25. The sensing device of claim 24, wherein the sensing device can be folded, bent, and / or rolled by a user.

26. The sensing device of claim 24, wherein the sensing device is configured to be stored, carried, and / or transported by a user.

27. The sensing device of claim 24, wherein the sensing device is configured to be mounted on one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic material, organic material, and metamaterial.

28. The sensing device of claim 24, wherein the sensing device is configured to connect to a receiving device for use in online, offline, cloud-based, and external storage applications.

29. The sensing device of claim 24, wherein the sensing device is configured to generate data for use by a user in algorithmic and / or computerized activities.

30. The sensing device of claim 24, wherein the sensing device is configured to generate data for machine learning activities.

31. A method for manufacturing a sensing device, the method comprising: Multiple individual layers are stacked sequentially on top of each other to form a passive element, the passive element comprising: Multiple insulating layers, each of which contains insulating material; At least one sensing layer, each of the at least one sensing layer comprising a conductive or semiconductive material; Multiple conductive layers, each of which comprises a conductive material; and At least one semi-porous layer, each of the at least one semi-porous layer comprising a semi-porous material; At least some or all of the plurality of conductive layers are separated from each other by one or more of a plurality of insulating layers, one or more of at least one sensing layer, and / or one or more of at least one semi-porous layer; and The passive component includes one or more of the following characteristics: resistance, capacitance, and inductance. A first insulating layer is disposed on the top surface of the passive component; A second insulating layer is disposed on the bottom surface of the passive component; and Each of one or more conductive wires is electromechanically connected to one of a plurality of conductive layers, such that each of the one or more conductive wires is exposed on and / or embedded in a first insulating layer or a second insulating layer.

32. The method of claim 31, comprising cutting and / or folding the plurality of individual layers to stack them on top of each other; and Multiple individual layers are held together by one or more of the following methods: sewing, embroidery, hot pressing, adhesives, ultrasonic welding, folding, curling, and / or casting.

33. The method of claim 31, comprising cutting and / or folding the sensing device to conform to an irregular surface geometry, wherein the irregular surface geometry includes one or more of clothing, body parts, vehicles, household appliances and / or furniture.

34. The method according to any one of claims 31 to 33, wherein the plurality of insulating layers and the plurality of conductive layers are located on the same side as the at least one sensing layer.

35. The method of claim 31, wherein the first conductive layer and the second conductive layer of the plurality of conductive layers each comprise a pattern of the conductive material to control the resistance, capacitance and / or inductance characteristics of the passive element.

36. The method of claim 31, comprising selecting the thickness, chemical composition, porosity, area of ​​the intersection region of the top conductive layer and the bottom conductive layer, trace thickness, number of turns in the pattern, spacing between the wound conductive traces and / or distance from the sensitive material of at least some of the at least one sensing layer and / or the plurality of conductive layers, to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity and / or insensitivity of the sensing device.

37. The method of claim 35, wherein: The first conductive layer and the second conductive layer are located on opposite sides of the sensing layer; and The at least one semi-porous layer includes a first semi-porous layer and a second semi-porous layer; The method includes: The first semi-porous layer is disposed between the first conductive layer and the sensing layer; The second semi-porous layer is disposed between the second conductive layer and the sensing layer; and The semi-porous material of each of the first and second semi-porous layers is selected to control the response time, input dynamic range, output dynamic range, bandwidth, signal-to-noise ratio, common-noise rejection ratio, signal gain, sensitivity, and / or insensitivity of the sensing device.

38. The method of claim 31, further comprising bonding one or more additional layers to the first and / or second insulating layer, said one or more additional layers comprising one or more of fabric, glass, wood, gravel, synthetic materials, leather, organic-like materials, and metal-like materials.

39. The method of claim 31, comprising using one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, curling and casting to combine each of the plurality of insulating layers, at least one sensing layer, plurality of conductive layers and at least one semi-porous layer together.

40. The method of claim 31, comprising completing the edge of the sensing device via one or more of sewing, embroidery, hot pressing, adhesive, ultrasonic welding, folding, curling, and casting.

41. The method of claim 31, wherein the one or more conductive lines comprise a plurality of conductive lines disposed at any location above and / or within the sensing device.

42. The method of claim 41, wherein: The plurality of conductive wires are disposed by one or more of sewing, weaving, knitting, bundling, deposition, and embroidery; and / or Multiple conductive wires are filled with porous or semi-conductive materials within the sensing device.

43. The method according to any one of claims 41 and 42, comprising filling the plurality of conductive lines within the sensing device with a porous material or a semiconductive material.

44. The method of claim 41, further comprising connecting the plurality of conductive lines to a passive or active filter component to perform one or more operations including low-pass, high-pass, band-pass, and / or notch filtering.

45. The method of claim 41, comprising: Connect multiple conductive wires to the connector that connects to the controller; Use the controller to assemble the input data to create the assembled data; and The assembled data is sent to the receiving device.

46. ​​The method of claim 41, wherein the region between the points where the sensing layer contacts the plurality of conductive lines defines the sensitive region of the passive element thereon.

47. The method of any one of claims 31 or 46, wherein the at least one sensing layer comprises a plurality of sensing layers, the method comprising using the plurality of sensing layers to distinguishably determine the direction of an excitation applied to the sensing device in any plane of the X-plane, Y-plane, and Z-plane.

48. The method of claim 47, wherein the sensing device includes a switch, and the method includes using the switch to switch a measurement of one of the plurality of sensing layers.

49. The method of claim 47, further comprising timing and deconvolution of the output signals from the plurality of sensing layers using logic gates, clocks, and / or a CPU.

50. The method of claim 31, wherein the one or more conductive lines comprise a plurality of conductive lines folded into separate layers within the sensing device.

51. The method of claim 31, further comprising altering an input signal on at least one conductive material of the one or more conductive layers to control a signal from the passive element to be selectively switched on or off, or to enter a high Z state through at least one semi-porous layer.

52. The method of claim 31 or claim 36, wherein when the direction of the excitation is the same as the direction in which at least one semi-porous layer is positioned between one of the plurality of conductive layers and at least one sensing layer, the sensing device enters an on state, an off state, or a high Z state based on the direction of the excitation applied to the sensing device.

53. The method of claim 31 or claim 32, comprising cutting and / or folding the passive element along any of the X, Y, and Z directions to separately measure the excitation applied to the sensing device in any of the X, Y, and Z planes.

54. The method of claim 31, wherein the sensing device is capable of interacting with the user for motion acquisition purposes.

55. The method of claim 54, wherein the sensing device may be folded, bent, and / or rolled up by a user.

56. The method of claim 54, wherein the sensing device may be stored, carried, and / or transported by a user.

57. The method of claim 54, further comprising mounting the sensing device onto one or more of wood, metal, ceramic, glass, plastic, foam, turf, gravel, carpet, synthetic material, organic material, and metamaterial.

58. The method of claim 54, further comprising connecting the sensing device to a receiving device for online, offline, cloud-based, and external storage applications.

59. The method of claim 54, wherein the sensing is capable of generating data for a user to use in algorithms and / or computerized activities.

60. The method of claim 54, wherein the sensing device is capable of generating data for machine learning activities.

61. The method of claim 31, further comprising optimizing the stitching path of the one or more conductive lines to enhance the signal-to-noise ratio and / or common-mode rejection of the sensing device, wherein optimizing the stitching path includes using one or more search algorithms, wherein the one or more search algorithms include depth-first search, breadth-first search, nearest neighbor, and clustering.

62. A sensing system comprising a plurality of sensing devices according to any one of claims 1-30, wherein the plurality of sensing devices are arranged in the form of an array or matrix of sensing devices.

63. A method of manufacturing a sensing system, the method comprising: Provide a plurality of sensing devices according to any one of claims 1-30; and Multiple sensing devices are arranged in the form of an array or matrix of sensing devices.

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