Substrate processing method, substrate processing apparatus, and computer-readable storage medium

Abstract

The present application provides a technology capable of performing more appropriate abnormality processing. A substrate processing method has a setting step, a substrate processing step, a detection step (S1), and a first abnormality processing step (S4). In the setting step, one of a plurality of processing contents for defining a series of processes on a substrate is set as a jump destination in a manner corresponding to each of the plurality of processing contents. In the substrate processing step, the series of processes is started on the substrate. In the detection step (S1), an abnormality is detected. In the first abnormality processing step (S4), when the abnormality is detected, the series of processes is started from the jump destination set in correspondence with a processing content being executed, i.e., an execution content.

Description

Technical Field

[0001] This invention relates to a substrate processing method, a substrate processing apparatus, and a computer-readable storage medium. Background Technology

[0002] Conventionally, a substrate processing apparatus for processing substrates has been proposed (e.g., Patent Document 1). The substrate processing apparatus includes: a plurality of processing units; and a transport robot that transports the substrate to each processing unit. Each processing unit rotates the substrate in a horizontal position while sequentially supplying various processing liquids to the substrate. This allows the substrate to be processed sequentially according to the processing liquid. For example, the processing units sequentially perform chemical treatment, rinsing, and drying on the substrate.

[0003] When an anomaly is detected in the substrate processing apparatus, the processing unit stops processing the substrate and performs pre-determined anomaly handling. Specifically, the processing unit performs rinsing and drying processes as anomaly handling procedure.

[0004] Therefore, even if the processing unit is performing chemical treatment when an abnormality occurs, the substrate can be dried after the chemical solution adhering to the substrate is replaced with rinsing liquid. This helps to suppress damage to the substrate caused by neglecting to remove residual chemical solution.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2010-109347 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] However, depending on when the anomaly occurs, there may be situations where it is undesirable to handle the anomaly. For example, if an anomaly is detected during the drying process, performing a rinsing process again and treating the drying process as an anomaly would result in an unnecessary rinsing process.

[0010] Furthermore, as an exception handling measure, using a pre-determined approach is not always the best practice.

[0011] Therefore, the object of the present invention is to provide a technique that enables more appropriate exception handling.

[0012] means for solving problems

[0013] The substrate processing method of the first embodiment includes: a setting step, wherein one of the processing contents of a plurality of processing contents for defining a series of processing of the substrate is set as a jump destination in a manner corresponding to each of the processing contents of the plurality of processing contents; a substrate processing step, wherein the series of processing is started on the substrate; a detection step, wherein an abnormality is detected; and a first abnormality handling step, wherein when the abnormality is detected, the series of processing is started from the jump destination set corresponding to the processing contents being executed, i.e., the executed processing contents.

[0014] The substrate processing method of the second embodiment further includes, in the substrate processing method of the first embodiment, a second abnormality processing step, wherein when no jump destination corresponding to the execution content is set when the abnormality is detected, or when the abnormality is detected during the execution of the first abnormality processing step, a pre-set second abnormality processing independent of the execution content is performed.

[0015] The substrate processing method of the third embodiment, in the substrate processing method of the first embodiment or the second embodiment, displays a plurality of the processing contents and the jump destination on the display unit during the setting process.

[0016] The substrate processing method of the fourth embodiment, in any one of the substrate processing methods of the first to third embodiments, further includes: a continuous processing step, wherein when the execution content is a liquid treatment of supplying a liquid to the substrate, the liquid treatment is continuously performed before the first abnormal processing step.

[0017] The substrate processing method of the fifth embodiment, in the substrate processing method of the fourth embodiment, in the continuous processing step, when the remaining time to the end time of the liquid treatment is less than a threshold, the liquid treatment is continued, and when the remaining time is greater than the threshold, the liquid treatment is stopped.

[0018] A substrate processing apparatus according to one embodiment includes: a processing unit for performing a series of processes on a substrate; a sensor for detecting an abnormality; and a control unit for setting one of the processing contents of a plurality of processing contents for defining the series of processes as a jump destination in a manner corresponding to each of the plurality of processing contents, and for causing the processing unit to start the series of processes on the substrate, wherein when the sensor detects the abnormality, the processing unit causes the processing unit to start the series of processes from the jump destination set corresponding to the processing contents being executed, i.e., the execution contents.

[0019] An embodiment of a program is provided for controlling a substrate processing apparatus, the substrate processing apparatus having a processing unit for performing a series of processes on a substrate and a sensor for detecting an anomaly, wherein the program is configured to cause a computer to perform the following steps: a setting step, wherein one of the processing contents for defining the series of processes is set as a jump destination in a manner corresponding to each of the processing contents in the plurality of processing contents; a substrate processing step, wherein the processing unit is caused to begin the series of processes on the substrate; a detection step, wherein an anomaly is detected; and a first anomaly handling step, wherein when the anomaly is detected, the processing unit is caused to begin the series of processes from the jump destination set corresponding to the processing content being executed, i.e., the executed content.

[0020] Invention Effects

[0021] According to the substrate processing method of the first embodiment, the substrate processing apparatus of the embodiment, and the program of the embodiment, a portion of a series of appropriate processing of the substrate can be performed as a first anomaly processing. Therefore, more appropriate first anomaly processing can be performed on the substrate.

[0022] The substrate processing method according to the second embodiment can improve the possibility of recovering the substrate.

[0023] According to the substrate processing method of the third embodiment, the user can easily check the content of the first abnormality processing while setting the jump destination.

[0024] According to the substrate processing method of the fourth embodiment, when the chemical treatment of the substrate is completed, it is not necessary to process the substrate after the abnormal treatment. Therefore, the substrate can be directly put into the next manufacturing process.

[0025] According to the substrate processing method of the fifth embodiment, the time required for abnormal processing can be shortened. Attached Figure Description

[0026] Figure 1 This is a top view that schematically illustrates an example of the structure of a substrate processing apparatus.

[0027] Figure 2 This is a diagram that schematically illustrates an example of the structure of the control unit.

[0028] Figure 3 This is a diagram that schematically illustrates an example of the structure of a processing unit.

[0029] Figure 4 This diagram illustrates an example of substrate processing and destination switching.

[0030] Figure 5 This is a diagram that roughly shows an example of a settings screen.

[0031] Figure 6 This is a flowchart illustrating an example of the operation of a substrate processing apparatus.

[0032] Figure 7 This is a flowchart illustrating an example of the operation of a substrate processing apparatus when an abnormality occurs.

[0033] Figure 8 This is a diagram that schematically illustrates an example of the structure of the substrate processing apparatus according to the third embodiment.

[0034] Figure 9 This is a flowchart illustrating another example of the operation of the substrate processing apparatus when an abnormality occurs.

[0035] Figure 10 This is a flowchart illustrating an example of continuous processing.

[0036] Figure 11 This is a flowchart illustrating another example of continuous processing. Detailed Implementation

[0037] The following is a reference to the appendix. Figure 1 The embodiments will be described below. Furthermore, the constituent elements described in this embodiment are merely illustrative, and the purpose of this invention is not to limit the scope of the invention to these embodiments. In the accompanying drawings, for ease of understanding, the dimensions or number of components are sometimes exaggerated or simplified as needed.

[0038] Unless otherwise specified, expressions indicating relative or absolute positional relationships (e.g., "in a direction," "along a direction," "parallel," "orthogonal," "center," "concentric," and "coaxial") not only strictly indicate the positional relationship but also indicate a state of relative displacement of angles or distances within tolerance or the range that can achieve the same level of functionality. Unless otherwise specified, expressions indicating equality (e.g., "same," "equal," and "homogeneous") not only indicate a state of quantitative and strict equality but also indicate a state of having tolerances or errors that can achieve the same level of functionality. Unless otherwise specified, expressions indicating shape (e.g., "quadrilateral" or "cylindrical") not only indicate a geometrically and strictly defined shape but also indicate a shape with features such as concavity, convexity, or chamfering within the range that can achieve the same level of technical effect. Expressions such as "possessing," "having," "having," "containing," or "including" a constituent element are not exclusive expressions that exclude the existence of other constituent elements. The expression “at least one of A, B and C” includes only A, only B, only C, any two of A, B and C, and all of A, B and C.

[0039] <First Implementation Method>

[0040] <Overall structure of substrate processing device 100>

[0041] Figure 1 This is a top view schematically illustrating an example of the structure of a substrate processing apparatus 100 according to an embodiment. The substrate processing apparatus 100 includes: a loading port 101; an indexing robot 110; a central robot 120; and at least one processing unit 130 (in...). Figure 1 The middle section consists of 4 processing units; and a control unit 90.

[0042] Each processing unit 130 is a single-sheet device that processes substrates W one by one. Each processing unit 130 may have a chamber 1. In this case, the gas environment within the chamber 1 is controlled by the control unit 90, so that the processing unit 130 can perform substrate processing in the desired gas environment.

[0043] The control unit 90 is capable of controlling the operation of various structures of the substrate processing apparatus 100. The carrier C is a container for holding the substrate W. Furthermore, the loading port 101 is a container holding mechanism for holding a plurality of carriers C. The indexing robot 110 is capable of transporting the substrate W between the loading port 101 and the substrate placement unit 140. The central robot CR is capable of transporting the substrate W between the substrate placement unit 140 and the processing unit 130.

[0044] With the above structure, the indexing robot 110, the substrate mounting unit 140, and the central robot 120 function as a transport mechanism for moving the substrate W between each processing unit 130 and the loading port 101.

[0045] The indexing robot 110 removes the unprocessed substrate W from the carrier C. Then, the unprocessed substrate W is transferred to the central robot 120 via the substrate placement unit 140. The central robot 120 moves the unprocessed substrate W into the processing unit 130. Then, the processing unit 130 processes the substrate W.

[0046] The central robot 120 removes the substrate W, which has been processed in the processing unit 130, from the processing unit 130. Then, after passing through other processing units 130 as needed, the processed substrate W is transferred to the indexing robot 110 via the substrate placement unit 140. The indexing robot 110 moves the processed substrate W into the carrier C. The substrate W is processed in the manner described above.

[0047] Figure 2This is a block diagram that schematically illustrates an example of the structure of the control unit 90. The control unit 90 can be constructed from a general computer with circuitry. Specifically, the control unit 90 includes, for example, an arithmetic processing device 91 such as a CPU (Central Processing Unit), a non-temporary storage unit 92 such as ROM (Read Only Memory), a temporary storage unit 93 such as RAM (Random Access Memory), a storage device 94, an input unit 96, a display unit 97, a communication unit 98, and a bus 95 connecting these devices to each other.

[0048] Storage unit 92 stores the basic program. Storage unit 93 serves as the working area when the arithmetic processing unit 91 performs prescribed processing. Storage device 94 is composed of non-volatile storage devices such as flash memory and hard disk drives. Input unit 96 includes various switches or touch panels such as a mouse and keyboard, and receives various information input from the operator, such as operation recipes. Display unit 97 is composed of, for example, a liquid crystal display device and lights, and displays various information under the control of the arithmetic processing unit 91. Communication unit 98 has data communication capabilities via communication networks such as LAN (Local Area Network).

[0049] The storage device 94 stores, for example, a processing program 94P. The arithmetic processing device 91 controls various structures of the board processing device 100 by executing the processing program 94P. Alternatively, the processing program 94P can also be stored on a portable storage medium such as an optical disc. If this storage medium is used, the processing program 94P can be installed on the control unit 90. Furthermore, some or all of the functions performed by the control unit 90 do not necessarily have to be implemented by software; they can also be implemented by hardware such as dedicated logic circuits.

[0050] <Processing Unit 130>

[0051] Figure 3 This is a diagram that schematically illustrates an example of the structure of the processing unit 130. Figure 3 The illustrated processing unit 130 is an apparatus capable of performing various processes on the substrate W. Hereinafter, the series of processes performed on the substrate W by the processing unit 130 will be referred to as a series of processes. This series of processes can also be referred to as a flow recipe. A series of processes includes, for example, chemical treatment, rinsing, and drying. Furthermore, as an example, pre-treatments such as pre-dispensing performed before these processes, and post-treatments such as cleaning performed within the processing unit 130 after these processes, are not included in the series of processes.

[0052] exist Figure 3 In the example, the processing unit 130 includes a chamber 1, a substrate holding part 2, a nozzle 31, and a sensor 10.

[0053] The internal space of chamber 1 is equivalent to the processing space for processing substrate W. A transport port (not shown) and a gate (not shown) are provided on the side wall of chamber 1. The transport port is used for the transfer of substrate W with the central robot 120, and the gate is used for opening and closing the transport port.

[0054] A substrate holding part 2 is disposed within the chamber 1, holding the substrate W in a horizontal position. Here, "horizontal position" means that the thickness direction of the substrate W is along the vertical direction. Figure 3 In this example, the substrate holding part 2 includes a stage 21 and a plurality of clamping pins 22. The stage 21 is circular and is positioned vertically below the substrate W. The stage 21 is positioned with its thickness along the vertical direction. The plurality of clamping pins 22 are vertically disposed on the upper surface of the stage 21 and hold the periphery of the substrate W. Alternatively, the substrate holding part 2 does not necessarily have clamping pins 22. For example, the substrate holding part 2 can also attract the lower surface of the substrate W to hold the substrate W.

[0055] exist Figure 3 In this example, the substrate holding part 2 further includes a rotation mechanism 23, which rotates the substrate W about a rotation axis Q1. The rotation axis Q1 is an axis passing through the center of the substrate W and running vertically. The rotation mechanism 23 includes, for example, a shaft 24 and a motor 25. The upper end of the shaft 24 is connected to the lower surface of the stage 21 and extends from the lower surface of the stage 21 along the rotation axis Q1. The motor 25 rotates the shaft 24 about the rotation axis Q1, thereby rotating the stage 21. As a result, the substrate W, held by a plurality of clamping pins 22, rotates about the rotation axis Q1. Such a substrate holding part 2 can also be called a rotating clamp.

[0056] Hereinafter, the radial direction related to the axis of rotation Q1 will be referred to simply as radial.

[0057] Nozzle 31 is disposed within chamber 1. Nozzle 31 is used to supply the processing liquid to substrate W. Figure 1 In this example, nozzle 31 is connected to a processing liquid supply source (not shown) via a supply pipe 32. That is, the downstream end of the supply pipe 32 is connected to nozzle 31, and the upstream end of the supply pipe 32 is connected to the processing liquid supply source. The processing liquid supply source includes, for example, a storage tank (not shown) for storing the processing liquid and supplies the processing liquid to the supply pipe 32. For example, the processing liquid includes at least one of an etching solution or similar solution for removing objects from the substrate W, a rinsing solution such as pure water for rinsing the etchant, and a charge-removing solution for removing charge from the substrate W.

[0058] A valve 33 is provided on the liquid supply pipe 32. When the valve 33 is opened, the treatment liquid is supplied from the treatment liquid supply source to the nozzle 31 through the liquid supply pipe 32 and sprayed out from the nozzle 31. When the valve 33 is closed, the spraying of treatment liquid from the nozzle 31 stops.

[0059] like Figure 3 As illustrated, the processing unit 130 may include a plurality of nozzles 31. Different types of processing fluid may also be supplied to each nozzle 31.

[0060] exist Figure 3 In this example, nozzle 31 is disposed within chamber 1 in a manner movable via nozzle moving mechanism 4. Nozzle moving mechanism 4 moves nozzle 31 between a processing position and a standby position. The processing position is where nozzle 31 supplies processing liquid to substrate W, for example, a position vertically opposite to the center of substrate W. The standby position is where nozzle 31 does not supply processing liquid to substrate W, for example, a position radially outward from substrate holding portion 2. When nozzle 31 is in the standby position, nozzle 31 does not interfere with the transport path of substrate W between substrate holding portion 2 and central robot 120.

[0061] exist Figure 3 In this example, the nozzle moving mechanism 4 includes an arm 41, a support column 42, and a rotating mechanism 43. The arm 41 has a rod-like shape extending horizontally, and its top end is connected to the nozzle 31. The base end of the arm 41 is connected to the support column 42. The support column 42 is positioned radially outward compared to the baffle 7 described later, and extends vertically. The rotating mechanism 43 causes the support column 42 to rotate about its central axis Q2. The rotating mechanism 43 includes, for example, a motor. By rotating the support column 42 through the rotating mechanism 43, the arm 41 and the nozzle 31 rotate about their central axis Q2. The support column 42 is positioned at a predetermined location within the chamber 1 so that the processing position and the standby position are located on the movement path of the nozzle 31.

[0062] exist Figure 3 The system includes a plurality of nozzle moving mechanisms 4, each of which moves one or more nozzles 31. Figure 3 In this example, a plurality of nozzles 31 (two in this case) are coupled to an arm 41. Thus, by rotating the arm 41 via a rotating mechanism 43, the plurality of nozzles 31 mounted on the arm 41 move integrally. Although in Figure 3 In the example, two nozzle moving mechanisms 4 are provided, but three or more nozzle moving mechanisms 4 can also be provided. Furthermore, the number of nozzles 31 moved by each nozzle moving mechanism 4 can be appropriately varied. In other words, the number of nozzles 31 coupled with the arm 41 can be appropriately varied.

[0063] The processing unit 130 sequentially sprays processing liquid from each nozzle 31 onto the rotating substrate W, enabling sequential processing based on each processing liquid (chemical treatment and rinsing). For example, when performing chemical treatment, the processing unit 130 uses the nozzle moving mechanism 4 to move the nozzle 31 capable of spraying the chemical liquid to the processing position and opens the valve 33 corresponding to the nozzle 31, thereby supplying the chemical liquid to the rotating substrate W. Thus, chemical treatment can be performed on the substrate W.

[0064] exist Figure 3 In this example, a fixed nozzle 51 is also disposed within the chamber 1. The fixed nozzle 51, fixed within the chamber 1, is used to supply the rinsing fluid to the substrate W. Figure 3 In this example, the fixed nozzle 51 is positioned radially outward compared to the substrate holding portion 2, releasing the rinsing liquid onto the upper surface of the substrate W. Figure 3 In this example, the nozzle 51 has its outlet facing the center of the upper surface of the substrate W. As a result, the rinsing liquid sprayed from the nozzle 51 adheres to the center of the upper surface of the substrate W.

[0065] The fixed nozzle 51 is connected to a flushing fluid supply source (not shown) via a supply pipe 52. Specifically, the downstream end of the supply pipe 52 is connected to the fixed nozzle 51, and the upstream end is connected to the flushing fluid supply source. The flushing fluid supply source may include, for example, a storage tank (not shown) for storing the flushing fluid, which supplies the flushing fluid to the supply pipe 52. The flushing fluid may be, for example, pure water or isopropanol.

[0066] A valve 53 is provided on the supply pipe 52. When the valve 53 is opened, the flushing fluid is supplied from the treatment fluid supply source through the supply pipe 52 to the fixed nozzle 51 and sprayed out from the fixed nozzle 51. When the valve 53 is closed, the flushing fluid spraying from the fixed nozzle 51 stops.

[0067] The processing unit 130 can rinse the substrate W by spraying rinsing liquid from the fixed nozzle 51 toward the rotating substrate W. Since the fixed nozzle 51 will not be displaced by a drive mechanism such as the nozzle moving mechanism 4, there will be no abnormality in the drive system, resulting in high reliability.

[0068] exist Figure 3 In this example, a blocking plate 6 is also provided inside the chamber 1. The blocking plate 6 is positioned vertically above the substrate W held by the substrate holding part 2, and is opposite to the substrate W in the vertical direction. The blocking plate 6 is a circular plate-shaped component with a diameter approximately the same as or slightly larger than the diameter of the substrate W. The blocking plate 6 is positioned horizontally above the substrate holding part 2, with its central axis aligned with the rotation axis Q1. The lower surface of the blocking plate 6 is flat and is opposite to the substrate W held by the substrate holding part 2.

[0069] Furthermore, a through hole penetrating vertically through the center of the blocking plate 6 is formed. The lower end of the through hole opens at the center of the lower surface of the blocking plate 6. A support shaft 60 is mounted on the upper surface of the blocking plate 6. The support shaft 60 is hollow, and its internal space communicates with the through hole. A liquid supply pipe 61 is inserted into the hollow portion of the support shaft 60 in a non-contact state. The lower end of the liquid supply pipe 61 reaches the through hole of the blocking plate 6.

[0070] A nozzle 61b is formed at the lower end of the supply pipe 61, and the nozzle 61b has an outlet 61a for spraying processing liquid into the center of the upper surface of the substrate W. The downstream end of the supply pipe 62 is connected to the upstream end of the supply pipe 61, and processing liquid (medicinal solution or rinsing solution) from a processing liquid supply source (not shown) is supplied through the supply pipe 62. The processing liquid supplied to the supply pipe 61 is sprayed downward from the outlet 61a of the nozzle 61b. A valve 63 is provided on the supply pipe 62, which is used to switch between supplying and stopping the supply of processing liquid to the supply pipe 61.

[0071] Furthermore, a gas supply path 64 surrounding the liquid supply pipe 61 is formed between the support shaft 60 and the liquid supply pipe 61. A gas supply pipe 65 is connected to the gas supply path 64. Gas from a gas supply source (not shown) is supplied to the gas supply path 64 via the gas supply pipe 65. The gas supplied to the gas supply path 64 flows downward within the gas supply path 64 and is ejected downward through the through-hole of the blocking plate 6. A gas outlet 66 for ejecting gas from the gas supply path 64 is located between the inner circumferential surface of the blocking plate 6 (the surface dividing the through-hole) and the outer circumferential surface of the nozzle 61b. An inert gas, such as nitrogen, is used as the gas supplied to the gas supply path 64. Furthermore, a valve 67 is provided on the gas supply pipe 65, which is used to switch between supplying gas to the gas supply path 64 and stopping the supply.

[0072] Furthermore, the lifting mechanism 68 and the rotating mechanism 69 are integrated with the support shaft 60. By inputting the driving force of the lifting mechanism 68 to the support shaft 60, the support shaft 60 and the blocking plate 6 move together between an approach position and a standby position. The approach position is where the lower surface of the blocking plate 6 is close to the upper surface of the substrate W, and the standby position is a position further vertically above the approach position. The lifting mechanism 68 may include, for example, a ball screw mechanism or a cylinder mechanism including a motor. Figure 2 The image shows the support shaft 60 and the blocking plate 6 in the standby position.

[0073] By inputting the driving force of the rotating mechanism 69 to the support shaft 60, the support shaft 60 and the blocking plate 6 rotate together about the rotation axis Q1. The rotating mechanism 69 includes, for example, a motor.

[0074] With the blocking plate 6 lowered to its near position, the volume of the space between the blocking plate 6 and the substrate W can be reduced. This makes it easier to control the gas environment of that space. For example, by opening valve 67 and spraying nitrogen gas from gas outlet 66, the proportion of nitrogen in that space can be increased, thereby reducing the proportion of oxygen. Furthermore, by controlling the gas environment of that space while opening valve 63 to spray processing liquid from nozzle 61b, the substrate W can be processed under a specified gas environment.

[0075] Alternatively, the blocking plate 6 can also be used in the drying process. For example, while the blocking plate 6 is lowered to a near position, nitrogen gas is ejected from the gas outlet 66, and the substrate holding part 2 rotates the substrate W at high speed (rotation drying). As a result, the processing liquid can be pressed by the nitrogen gas and moved toward the periphery of the substrate W, or the evaporation of the processing liquid can be promoted, thus enabling the substrate W to be dried more effectively.

[0076] As described above, since the processing unit 130 exemplified above includes nozzle 31, fixed nozzle 51, and nozzle 61b, various processes can be performed. Furthermore, in a series of processes (process schemes) performed on the substrate W, the processing unit 130 does not necessarily need to use all the nozzles. Since the series of processes performed on the substrate W varies depending on the type of substrate W and the manufacturing stage, only the required nozzles need to be used in that series of processes.

[0077] In addition, Figure 3 In this example, a baffle 7 is also provided inside the chamber 1. The baffle 7 has a cylindrical shape that surrounds the substrate W held by the substrate holding part 2. The baffle 7 catches the processing liquid that splashes from the periphery of the substrate W.

[0078] exist Figure 3 In this example, a plurality of baffles 7 (three in the diagram) are provided. Hereinafter, the three baffles 7 may be referred to as baffle 71, baffle 72, and baffle 73 as needed. The plurality of baffles 7 are arranged concentrically. Figure 3 In this example, baffles 71, 72, and 73 are arranged sequentially from the radially inner side to the radially outer side. Furthermore, each baffle 7 is configured to be raised and lowered using a lifting mechanism 74. The lifting mechanism 74 may be, for example, a ball screw mechanism or a cylinder mechanism including a motor.

[0079] When the lifting mechanism 74 raises all the baffles 7 to the upper position, the inner baffle 71 catches the processing liquid splashed from the substrate W and guides the processing liquid to the recovery pipe 81. When the lifting mechanism 74 lowers only the inner baffle 71 to the lower position, the baffle 72 catches the processing liquid and guides the processing liquid to the recovery pipe 82. When the lifting mechanism 74 raises only the outer baffle 73 to the upper position, the baffle 73 catches the processing liquid and guides the processing liquid to the recovery pipe 83.

[0080] As described above, the lifting mechanism 74 raises and lowers each baffle 7 according to the type of treatment liquid, thereby guiding the treatment liquid to the recovery pipes 81 to 83 that correspond to the type of treatment liquid. The supply destination of each recovery pipe can be a storage tank of the treatment liquid supply source corresponding to the type of treatment liquid, or an external waste liquid section.

[0081] Sensor 10 detects various abnormalities in processing unit 130. For example, sensor 10 includes at least one of the following: a sensor for detecting abnormalities in the rotation mechanism 23 of substrate holding part 2, a sensor for detecting leakage abnormalities in each processing liquid, a sensor for detecting abnormalities in nozzle moving mechanism 4, a sensor for detecting abnormalities in lifting mechanism 74, a sensor for detecting abnormalities in lifting mechanism 68, and a sensor for detecting abnormalities in rotation mechanism 69.

[0082] Furthermore, the anomalies detected by sensor 10 are not limited to those described above, and can also be other types of anomalies. For example, when an exhaust mechanism (not shown) for discharging gas from chamber 1 is provided, sensor 10 can also detect anomalies in the exhaust mechanism. Additionally, when chamber 1 is provided with a removable cover (not shown) for maintenance, sensor 10 can also detect the installation or removal status of the removable cover. Since the removable cover is removed during maintenance and the user performs maintenance on chamber 1, when the removable cover is removed during substrate processing, sensor 10 detects the removal of the removable cover as an anomaly.

[0083] <Substrate processing and troubleshooting>

[0084] Next, an example of substrate processing (a series of processes) and abnormal handling performed by each processing unit 130 will be described. Abnormal handling, as mentioned here, refers to the processing used to remedy the substrate W when an abnormality occurs in the substrate processing apparatus 100.

[0085] <Substrate Processing>

[0086] The details of the series of processes applied to the substrate W can be set by the user, as described later. Here, as an example, the series of processes is set to sequentially perform chemical treatment, rinsing treatment, and drying treatment. Furthermore, here, as an example, the nozzle 61b is not used and the fixed nozzle 51 is set to be fixed.

[0087] As described below, processes such as drug treatment, rinsing, and drying (i.e., process recipes) are defined by more detailed processing steps. That is, a series of processes is defined by a plurality of process recipes, and each process recipe is defined by a plurality of process steps.

[0088] Figure 4 This is a diagram illustrating an example of a series of processes, with each step of the solution defined in a diagram. Figure 4 The first column of the table shows the execution order of the steps in the solution, and the second column shows the content of each step. Figure 4 In this example, "preparing the chemical solution for processing" is set as the first solution step. This solution step specifies the preparation process for chemical solution processing. For example, the movement of arm 41 and baffle 7 is specified. Here, in the chemical solution processing, chemical solution is sprayed from nozzle 31 of one of the arms 41, and the baffle 72 catches the chemical solution that splashes from the substrate W. In this case, this solution step specifies that arm 41 moves to the processing position and baffles 72 and 73 rise to the upper position.

[0089] exist Figure 4 In the example, "starting chemical treatment" is set as the second solution step. Furthermore, although the illustration is omitted, "chemical treatment" is set as the third and fourth solution steps, and "ending chemical treatment" is set as the fifth solution step. In these solution steps, for example, the rotational speed of the substrate W, the flow rate of the chemical solution, and the required time are specified. When multiple nozzles 31 are combined with the arm 41, the nozzles among the nozzles 31 used to spray the chemical solution are also specified. The required time refers to the time required for each solution step. In addition, in the solution step corresponding to "ending chemical treatment," the arm 41 is specified to move to the standby position as needed. Specifically, in the next process (here, rinsing treatment), when rinsing liquid is sprayed from the nozzle 31 of the same arm 41, the movement of the arm 41 to the standby position is not specified; when rinsing liquid is sprayed from the nozzle 31 of other arms 41, the arm 41 is specified to move to the standby position. Here, it is set that the rinsing liquid is sprayed from the nozzle 31 of the same arm 41.

[0090] exist Figure 4In this example, "start rinsing process" is set as the sixth step. Here, during the rinsing process, baffle 71 is used to catch the rinsing fluid splashing from the substrate W. In this case, in the "start rinsing process" step, baffles 71 to 73 are raised to the upper position. Furthermore, although not shown in the diagram, "rinsing process" is set as the seventh step, and "end rinsing process" is set as the eighth step. In these steps, for example, the rotational speed of the substrate W, the nozzle in nozzle 31 for spraying the rinsing fluid, the flow rate of the rinsing fluid, and the required time are specified. Additionally, in the "end rinsing process" step, arm 41 is moved to the standby position as needed.

[0091] exist Figure 4 In the example, "start drying process" is set as the ninth step. Furthermore, although the illustration is omitted, "drying process" is set as the tenth and eleventh steps, and "end drying process" is set as the twelfth step. In these steps, for example, the rotational speed of the substrate W and the required time are specified. The rotational speed in this step is set to a value higher than that in the chemical treatment and rinsing processes. Additionally, in the "end drying process" step, the baffle 7 is lowered to the lower position as needed.

[0092] exist Figure 4 In the example, "End Solution Processing" is set as the thirteenth solution step. In this solution step, various structures are moved to their starting positions as needed.

[0093] Information defining the process flow described above is stored as setting information D1 in the storage device 94. Hereinafter, the information defining the process flow will also be referred to as process scheme information. The control unit 90 controls the operation of various structures of the substrate processing apparatus 100 based on the setting information D1. Therefore, the substrate processing apparatus 100 is able to perform a series of processes on the substrate W.

[0094] <Exception Handling>

[0095] <First Exception Handling>

[0096] When any sensor 10 detects an abnormality during the operation of the substrate processing apparatus 100, the control unit 90 causes each processing unit 130 to perform a first abnormality handling corresponding to the processing content being processed (equivalent to the processing content). Specifically, the control unit 90 causes the processing unit 130 to perform a series of processes starting from a jump destination set corresponding to the processing content being processed as the first abnormality handling.

[0097] exist Figure 4In the example, the third column of the table shows the jump destinations corresponding to each protocol step. As a specific example, the thirteenth protocol step is set as the jump destination corresponding to the first protocol step. That is, in this example, when an anomaly is detected during the execution of the protocol step "Prepare drug solution processing", the processing unit 130 executes a series of processes starting from the protocol step "End protocol processing" as the first anomaly handling.

[0098] Therefore, when an abnormality is detected during the execution of the "preparation solution treatment" step where the substrate W is not treated with the processing solution, the processing solution treatment (processing solution treatment and rinsing treatment) is not performed, and instead the "final solution treatment" step after drying is performed. This reduces the consumption of processing solution. Furthermore, since drying is not performed, the power consumption of the substrate processing apparatus 100 can be reduced.

[0099] exist Figure 4 In this example, the sixth step is set as the jump destination corresponding to the second through fifth steps. In this example, when an anomaly is detected during the execution of the drug solution treatment, the processing unit 130 executes a series of processes starting from the "Start Rinse Processing" step as the first anomaly handling. That is, the processing unit 130 sequentially executes the steps from "Start Rinse Processing" to the final "End Processing".

[0100] Therefore, in the first abnormality handling, the processing unit 130 washes away the drug solution on the substrate W based on the drug solution treatment by rinsing and dries the substrate W by drying. This suppresses damage to the substrate W caused by the drug solution.

[0101] In addition, Figure 4 In this example, the sixth step is set as the jump destination corresponding to steps six through eight. In this example, when an anomaly is detected during the rinsing process, the processing unit 130 executes a series of processes starting from the "Start Rinsing Process" step as the first anomaly handling. That is, the processing unit 130 sequentially executes the steps from "Start Rinsing Process" to the final "End Process" step.

[0102] Therefore, in the first abnormality handling, since the processing unit 130 restarts the rinsing process of the substrate W from the beginning, the rinsing process of the substrate W can be completed more reliably. As a result, the residue of the chemical solution on the substrate W can be appropriately suppressed.

[0103] In addition, Figure 4In this example, the ninth step is set as the jump destination corresponding to steps nine through twelfth. In this example, when an anomaly is detected during the drying process, the processing unit 130 executes a series of processes starting from the "Start Drying Process" step as an anomaly handling procedure. That is, the processing unit 130 sequentially executes the steps from "Start Drying Process" to the final "End Process" step.

[0104] Therefore, since the processing unit 130 does not perform rinsing during the first abnormality handling, the consumption of rinsing fluid can be reduced. Furthermore, in the first abnormality handling, the processing unit 130 restarts the drying process of the substrate W from scratch, thus enabling more reliable completion of the drying process of the substrate W. Consequently, rinsing fluid residue on the substrate W can be appropriately suppressed.

[0105] In addition, Figure 4 In this example, the thirteenth solution step is set as the jump destination corresponding to the thirteenth solution step. In this example, when an exception is detected in the execution of the processing related to "ending solution processing", the processing unit 130 executes a series of processes starting from the solution step of "ending solution processing" as the first exception handling.

[0106] When an abnormality occurs in the substrate processing apparatus 100, the plurality of processing units 130 perform first abnormality processing. For example, when the abnormality occurs in one of the processing units 130, the plurality of processing units 130 perform first abnormality processing in response to detecting the abnormality.

[0107] However, in this processing unit 130, there is a high probability that the same exception will occur again during the execution of the first exception handling. When an exception still occurs during the execution of the first exception handling, the processing unit 130 may terminate the operation without re-performing the first exception handling. Alternatively, the processing unit 130 may execute a second exception handling that is different from the first exception handling. The second exception handling will be described in detail later.

[0108] On the other hand, there is a high probability that other processing units 130 can complete the first anomaly handling. Therefore, other processing units 130 can appropriately remedy the substrate W.

[0109] As described above, since all processing units 130 perform first abnormality processing and stop operation in response to the detection of abnormalities in the substrate processing apparatus 100, the user can quickly respond to abnormalities.

[0110] <Method for setting up the first exception handling>

[0111] Next, an example of a method for setting the jump destination will be described. For example, the user inputs to the input unit 96 to instruct the display of the settings screen SS1. In response to this input, the control unit 90 causes the display unit 97 to display the settings screen SS1.

[0112] Figure 5 This is a diagram that roughly illustrates an example of the settings screen SS1. Figure 5 The illustrated setup screen SS1 includes a table ST1 that displays the processing content (in this case, the scheme steps) in execution order. The first column of table ST1 shows numbers used to identify the processing content in each row, and the numbers in the first column indicate the execution order of the processing content.

[0113] The (N-1)th column from the second column in Table ST1 shows the procedure steps specified in each row. As a specific example, the procedure steps include items “AP1” to “AP3”. “AP1” to “AP3” are markings used to identify arm 41. That is, here, the processing unit 130 includes three nozzle moving mechanisms 4.

[0114] The items “AP1” through “AP3” represent the arm status. The arm status includes, for example, the position of arm 41 and the ejection status of each nozzle 31 from arm 41. The solution steps may also appropriately include information such as the position of baffle 7, the rotational speed of substrate W, and the flow rate of the processing liquid.

[0115] The user inputs information to the input unit 96 to specify the processing details. As a more specific example, the user inputs various information from the second column to the (N-1)th column into the input unit 96 line by line (i.e., according to each scheme step). In response to this input, the control unit 90 sets a series of processes to be executed by the processing unit 130 and displays the set information on the display unit 97. The display unit 97 shows each scheme step in Table ST1 on the setting screen SS1.

[0116] Additionally, the user inputs information into the input unit 96 to specify the jump destination corresponding to each step of the solution. The control unit 90 responds to this input by setting the jump destination for each step of the solution and displays the set information on the display unit 97. The display unit 97 shows the jump destination in Table ST1 on the setting screen SS1. Figure 5 In the example, the item "RSC" in column N is the item that indicates the jump destination.

[0117] The control unit 90 stores information representing a series of processing schemes set by the user and information representing jump destinations as setting information D1 into the storage device 94. Figure 5In the example, a "Save" button B1 is displayed on the settings screen SS1. The user operates the input unit 96 and selects (clicks) button B1. The control unit 90 responds to this input and causes the storage device 94 to store the settings information D1.

[0118] When the sensor 10 detects an anomaly in the substrate processing apparatus 100, the control unit 90 determines a jump destination corresponding to the processing content being executed based on the setting information D1. Furthermore, the control unit 90 causes the processing unit 130 to perform a series of processes starting from the processing content of the specific jump destination as a first anomaly handling.

[0119] <Second Exception Handling>

[0120] Next, the second exception handling will be explained. The second exception handling is executed when an exception is detected during the execution of the first exception handling. The order of this second exception handling is predetermined and is not affected by the processing content being executed when the exception is detected. However, the processing conditions in the second exception handling (e.g., the flow rate of the processing fluid and the rotational speed of the substrate W) can be arbitrarily changed by the user. In other words, the input unit 96 accepts input of the processing conditions for the second exception handling.

[0121] The second abnormality treatment includes, for example, a rinsing process using a predetermined nozzle and a drying process. As a specific example, the rinsing process of the second abnormality treatment is a rinsing process using a fixed nozzle 51.

[0122] Therefore, even if the processing unit 130 is unable to complete the first exception handling, it may still be able to complete the second exception handling. For example, in one processing unit 130, when an exception occurs related to the processing fluid using the nozzle 31, the same exception may occur during the execution of the first exception handling in that processing unit 130. However, since the nozzle 31 is not used in the second exception handling, the same exception will not occur during the execution of the second exception handling. Therefore, the processing unit 130 is able to complete the second exception handling.

[0123] Therefore, even if the first abnormality handling cannot be performed, the solution in the substrate W can be replaced with rinsing solution through the second abnormality handling, thus suppressing the damage to the substrate W caused by the solution.

[0124] <logo>

[0125] The control unit 90 can store a first flag F1 in the storage device 94. This first flag F1 is used to set whether the first exception handling is valid or invalid. For example, the input unit 96 accepts input specifying whether the first exception handling is valid or invalid. The control unit 90 sets or removes the first flag F1 in response to this input. Here, when the first flag F1 is set, the first exception handling is set to valid; when the first flag F1 is removed, the first exception handling is set to invalid.

[0126] The validity or invalidation of the first exception handling can be set according to each processing unit 130, or it can be set jointly for two or more processing units 130.

[0127] The control unit 90 may also store a second flag F2 in the storage device 94. This second flag F2 is used to set whether the second exception handling is valid or invalid. For example, the input unit 96 accepts an input specifying whether the second exception handling is valid or invalid. The control unit 90 sets or removes the second flag F2 in response to this input. Here, when the second flag F2 is set, the second exception handling is set to valid; when the second flag F2 is removed, the second exception handling is set to invalid.

[0128] The validity or invalidation of the second exception handling can be set for each processing unit 130, or it can be set for two or more processing units 130 together.

[0129] <An example of the operation of the substrate processing apparatus 100>

[0130] Figure 6 This is a flowchart illustrating an example of the processing of the substrate processing apparatus. First, the user sets various information (step S10: setting process). Specifically, the user inputs information to the input unit 96 to specify a series of processing steps and jump destinations. As a specific example, in this setting process, as described above, the display unit 97 displays the process steps and jump destinations. While checking the display unit 97, the user inputs a series of processing steps and jump destinations to the input unit 96. Through this setting process, the setting information D1, including process plan information and jump destination information, is stored in the storage device 94. By displaying the process steps and jump destinations on the display unit 97, the user can easily check the content of the first abnormal processing and set the jump destination.

[0131] Furthermore, during the setup process, the user inputs whether the first exception handling is valid or invalid, and whether the second exception handling is valid or invalid, to the input unit 96. In response to this input, the control unit 90 stores the first flag F1 and the second flag F2 in the storage device 94.

[0132] Next, the substrate processing apparatus 100 processes the substrate W (step S11: substrate processing step). Specifically, the control unit 90 controls each structure of the substrate processing apparatus 100 based on the setting information D1. As a result, the substrate W in the carrier C is sequentially transported to the processing unit 130, and a series of processes are performed in each processing unit 130. When all the substrates W have been processed by the processing unit 130 and transported to the carrier C without any abnormality occurring in the substrate processing apparatus 100, the substrate processing apparatus 100 ends the processing.

[0133] Figure 7 This is a flowchart illustrating an example of the operation of the substrate processing apparatus 100 when an abnormality occurs. Figure 7 The process flow for processing a single processing unit 130 is shown. Hereinafter, this single processing unit 130 will also be referred to as the self-processing unit 130. First, any sensor 10 in the substrate processing apparatus 100 detects an anomaly and outputs the detection result to the control unit 90 (step S1: detection process). The anomalies referred to here include: the baffle 7 not moving to the predetermined position, the substrate holding part 2 not rotating, the removable cover being removed from the chamber 1 during the processing of the substrate W, the processing liquid leaking in the path of the processing liquid to each nozzle 31, and the exhaust pressure from the processing unit 130 being outside the predetermined range, etc.

[0134] When an anomaly is detected, the control unit 90 determines whether the first anomaly handling is valid or invalid (step S2). Specifically, the control unit 90 determines whether the first flag F1 stored in the storage device 94 is being set.

[0135] When the first flag F1 is set, the control unit 90 determines whether a jump destination corresponding to the processing content being executed is set based on the setting information D1 (step S3). Specifically, the control unit 90 confirms the setting information D1 stored in the storage device 94. The case where no jump destination is set as described herein includes the case where the information itself is not set for a jump destination, and the case where information such as a symbol unrelated to a jump destination is set.

[0136] When a jump destination is set, the control unit 90 causes the self-processing unit 130 to execute a series of processes starting from the processing content of the jump destination (step S4: first exception handling process). That is, the self-processing unit 130 does not directly continue a series of processes, but executes a series of processes starting from the processing content of the jump destination (first exception handling).

[0137] Next, during the execution of the first exception handling, the control unit 90 determines whether the sensor 10 within the self-processing unit 130 has detected an exception (step S5). That is, the control unit 90 determines whether an exception preventing the execution of the first exception handling has been detected. The control unit 90 continues to monitor the exception obtained by the sensor 10 at least until the first exception handling ends. When no exception occurs, the self-processing unit 130 can complete the first exception handling. For example, if the exception in step S1 occurs in another processing unit 130, the self-processing unit 130 can complete a more appropriate first exception handling.

[0138] On the other hand, when an anomaly is detected by sensor 10 during the execution of the first anomaly handling, control unit 90 determines whether the second anomaly handling is effective (step S6). Specifically, control unit 90 determines whether the second flag F2 stored in storage device 94 is set.

[0139] When the second flag F2 is set, the control unit 90 causes the self-processing unit 130 to perform a second abnormality processing (step S7: second abnormality processing step). The second abnormality processing includes, for example, a rinsing process in which rinsing liquid is sprayed from the fixed nozzle 51, followed by a drying process. Therefore, even if there is liquid on the substrate W, the substrate W can be dried after the liquid is replaced with rinsing liquid. This helps to suppress damage to the substrate W caused by the liquid.

[0140] Furthermore, if an exception occurs in the self-processing unit 130 during the execution of the second exception handling, the control unit 90 may also terminate the second exception handling midway through the self-processing unit 130. Alternatively, the control unit 90 may also cause the self-processing unit 130 to re-perform the second exception handling a predetermined number of times. If an exception occurs during all the second exception handling processes that have been re-performed from the beginning, the control unit 90 may also terminate the second exception handling midway through the self-processing unit 130.

[0141] When the first exception handling is set to invalid (step S2: No), the control unit 90 determines whether the second exception handling is valid (step S6). Furthermore, when no jump destination corresponding to the processing content being executed is set (step S3: No), the control unit 90 determines whether the second exception handling is valid (step S6).

[0142] When the second abnormality handling is set to invalid (step S6: No), the control unit 90 stops the operation of the self-processing unit 130. That is, the self-processing unit 130 stops operating and does not perform abnormality handling on the substrate W.

[0143] <Processing Example>

[0144] The following describes a specific processing example. Unless otherwise specified, all steps in the process are configured with corresponding jump destinations, first exception handling, and second exception handling enabled.

[0145] <Exhaust system malfunction>

[0146] The following describes a situation where the exhaust mechanism of the substrate processing apparatus 100 malfunctions. When such a malfunction occurs, the pressure inside chamber 1 will change. However, even if the pressure inside chamber 1 changes, each drive mechanism in each processing unit 130 can operate normally, thus enabling the first malfunction handling to be performed.

[0147] Therefore, when such an anomaly occurs during the execution of a series of processes, each processing unit 130 can complete the first anomaly handling (steps S1 to S5). In addition, although an anomaly in the exhaust mechanism can be detected during the execution of the first anomaly handling, the control unit 90 does not hinder the continued execution of the first anomaly handling, so the first anomaly handling continues.

[0148] <Exception handling unit 130>

[0149] Next, a scenario in which a malfunction occurs in the processing unit 130 will be described. This malfunction could be, for example, a malfunction in the drive system of the nozzle moving mechanism 4.

[0150] Since such an anomaly also occurs during the execution of the first anomaly handling based on the processing unit 130, the processing unit 130 performs a second anomaly handling (steps S1 to S7) in response to the detection of the anomaly.

[0151] On the other hand, since no abnormality occurred in the other processing units 130, the other processing units 130 were able to complete the first abnormality handling (steps S1 to S5).

[0152] <No redirect destination set>

[0153] In addition, there may be cases where the redirect destination is not properly set to correspond to some of the processing content in a series of processing. Figure 8 This diagram illustrates an example of substrate processing and jump destination. In Figure 8 In the example, no jump destination was set corresponding to the processing content of the drug solution. Specifically, no jump destination was set corresponding to steps two through five of the scheme.

[0154] In this case, when an abnormality occurs during the execution of the drug solution treatment, the processing unit 130 performs a second abnormality handling (steps S1 to S3, step S6 and step S7) instead of performing the first abnormality handling.

[0155] <Technical Effects of the First Embodiment>

[0156] As described above, when an anomaly occurs in the substrate processing apparatus 100, each processing unit 130 does not continue performing a series of processes as usual, but instead performs a first anomaly handling (step S4). Specifically, each processing unit 130 performs a series of processes starting from the jump destination corresponding to the processing content being executed at the time the anomaly occurred, as the first anomaly handling. That is, the first anomaly handling is equivalent to a series of processes. Since the series of processes is defined by processing content suitable for the substrate W, the first anomaly handling is also a process suitable for the substrate W.

[0157] For example, in a series of processes, in the rinsing process performed after the chemical treatment, a rinsing solution suitable for the type of chemical solution is used, and the flow rate and treatment time of the rinsing solution are appropriately set. Therefore, the chemical solution on the substrate W can be appropriately replaced with rinsing solution in the series of processes. Furthermore, according to this embodiment, when an abnormality occurs during the execution of the chemical treatment, a rinsing process identical to the series of processes is performed in the first abnormality handling. Therefore, the chemical solution on the substrate W can also be appropriately replaced with rinsing solution in the first abnormality handling.

[0158] Furthermore, for example, for substrate W where the pattern is prone to collapse during drying, the process is designed to prevent the pattern from collapsing during a series of processes. As a specific example, processing unit 130 sequentially performs a series of processes including chemical treatment, a first rinsing process, a hydrophobication process, a second rinsing process, and a drying process. The hydrophobication process involves supplying a hydrophobic solution to substrate W to form a hydrophobic film on the surface of the pattern on substrate W. The second rinsing process replaces the hydrophobic solution on substrate W with a rinsing solution. By performing the hydrophobication process in this manner, pattern collapse during the drying process can be suppressed.

[0159] In this case, the user can set the procedure steps corresponding to the start of the first rinsing process as the jump destination corresponding to the chemical solution treatment. Therefore, when an abnormality occurs during the execution of the chemical solution treatment, the processing unit 130 executes a series of processes that began with the first rinsing process as the first abnormality handling. That is, the processing unit 130 sequentially performs the first rinsing process, the hydrophobication process, the second rinsing process, and the drying process as the first abnormality handling. Thus, pattern collapse can be more reliably suppressed even in the first abnormality handling.

[0160] As described above, since the first abnormality treatment is the same as part of a series of treatments, a more appropriate abnormality treatment for the substrate W can be performed. Therefore, various defects that may occur on the substrate W can be suppressed or avoided.

[0161] Furthermore, since the input unit 96 accepts input of jump destinations corresponding to the processing contents of each of the series of processes, the user can set a more appropriate first exception handling. For example, the user can set the processing contents of the drying process as the jump destination corresponding to the processing contents of the drying process (see also...). Figure 4 In this case, when an abnormality occurs during the drying process, the processing unit 130 performs a series of processes starting from the drying process as a first abnormality handling. In other words, the processing unit 130 does not perform rinsing during the first abnormality handling. As a result, the consumption of rinsing fluid and the power consumption of the substrate processing apparatus 100 can be reduced.

[0162] Furthermore, for example, the user can simply set the dried processing content (e.g., "end of process processing") to the corresponding jump destination for the processing content in the condition where the processing liquid has not yet been sprayed and has not adhered to the substrate W (e.g., "preparation of solution processing") (see also [reference]). Figure 4 In this case, when an abnormality occurs during the execution of the processing content before the processing liquid is ejected, the processing unit 130 performs a series of processes starting from the processing content after the drying process. In other words, the processing unit 130 does not perform rinsing and drying processes during the first abnormality handling. As a result, the consumption of rinsing liquid can be reduced, and the power consumption of the substrate processing apparatus 100 can be further reduced.

[0163] Furthermore, in the above example, when an exception occurs during the execution of the first exception handling in the processing unit 130, the processing unit 130 that experienced the exception does not re-perform the first exception handling, but instead performs a second exception handling (steps S5 and S6) that is different from the first exception handling. In the second exception handling, a rinsing process using a pre-set nozzle (e.g., fixed nozzle 51) and a drying process following the rinsing process are performed.

[0164] Furthermore, if no abnormality occurs during the second abnormality handling, the processing unit 130 can complete the second abnormality handling. For example, even if the nozzle movement mechanism 4 experiences a driving abnormality during the first abnormality handling, rinsing processing using the fixed nozzle 51 can still be performed during the second abnormality handling. Therefore, even if the first abnormality handling cannot be performed, the processing liquid on the substrate W can be removed and the substrate W dried through the second abnormality handling. As a result, damage to the substrate W caused by the chemical solution can be suppressed.

[0165] Furthermore, in the example above, a first flag F1 is set to indicate the distinction between valid and invalid first exception handling. This improves usability.

[0166] Furthermore, in the example above, a second flag F2 is set to indicate the distinction between valid and invalid exception handling. This improves usability.

[0167] <Other examples of redirection destination settings>

[0168] In the above example, the jump destination corresponding to the "prepare the solution treatment" step is the "end the treatment" step (see [reference]). Figure 4 However, users can also set the "Preparation of Medicine Solution Treatment" procedure steps as the corresponding jump destination. Therefore, when an exception occurs during the execution of the "Preparation of Medicine Solution Treatment" procedure steps, the processing unit 130 executes a series of processes starting from the "Preparation of Medicine Solution Treatment" procedure steps as the first exception handling.

[0169] In this case, although the "preparation of chemical solution treatment" step can be repeated, since this step does not supply chemical solution to the substrate W, there will be no problem even if the operation is repeated. Furthermore, the processing unit 130 sequentially performs chemical solution treatment, rinsing treatment, and drying treatment as a first abnormality treatment. Therefore, if no abnormality occurs in the first abnormality treatment, the processing unit 130 can complete a substantial series of treatments. Thus, the substrate W can be salvaged without discarding it, and the substrate W can proceed to the next manufacturing process as usual.

[0170] On the other hand, if an abnormality occurs during the execution of the first abnormality handling, the processing unit 130 performs a second abnormality handling. This allows damage to the substrate W caused by the liquid medicine to be suppressed.

[0171] Furthermore, in the above example, the blocking plate 6 was not used in the series of processes, but it could also be used. For example, in the chemical treatment and drying processes, the blocking plate 6 could also be stopped at the approach position. In this case, the protocol step of "preparing for chemical treatment" specifies that the blocking plate 6 is lowered to the approach position, and the protocol step of "ending the protocol treatment" specifies that the blocking plate 6 is raised to the initial position.

[0172] In this case, it is also possible to... Figure 4 In this way, the "end procedure processing" step is set as the jump destination corresponding to the "prepare solution processing" step. When an abnormality occurs during the execution of "prepare solution processing," the processing unit 130 performs a series of processes starting from the "end procedure processing" step, thus enabling the blocking plate 6 to rise to its initial position. Furthermore, in this case, since rinsing and drying processes are not performed, the consumption of processing fluid and power consumption can be reduced.

[0173] <Automatic setting of jump destination>

[0174] In the example above, the user sets all the jump destinations. However, it is not necessarily limited to this. The control unit 90 can also automatically set jump destinations for some or all of the steps in a series of processing steps.

[0175] For example, the control unit 90 may automatically set the jump destination corresponding to the procedure step before the supply of the treatment liquid (e.g., "preparing for treatment") to the procedure step after the drying process (e.g., "ending the procedure"). The procedure steps after the drying process include the procedure steps in which the moving object is moved to the standby position by various drive mechanisms (nozzle moving mechanism 4, lifting mechanism 68, and lifting mechanism 74).

[0176] When the user inputs the redirection destination into the input unit 96, the control unit 90 only needs to update the redirection destination in response to the input. That is, the control unit 90 only needs to update the automatically set redirection destination to the redirection destination input by the user.

[0177] Therefore, usability can be further improved because users can more easily set the redirect destination.

[0178] <Second Implementation Method>

[0179] The structure of the substrate processing apparatus 100 in the second embodiment is the same as that in the first embodiment. Figure 9 This is a flowchart illustrating an example of the operation of the substrate processing apparatus 100 according to the second embodiment.

[0180] In the second embodiment, when the first exception handling is valid (step S2: yes), the control unit 90 performs continuous processing (step S8: continuous processing process). Figure 10 This is a flowchart illustrating a specific example of continuous processing. First, the control unit 90 determines whether the processing being performed in the event of an abnormality is the processing content specified in the process plan (step S81). If the processing being performed is not the processing content specified in the process plan, the control unit 90 terminates the continuous processing. If the processing being performed is the processing content specified in the process plan, the control unit 90 determines whether the processing being performed is chemical liquid treatment (step S82). If the processing being performed is not chemical liquid treatment, the control unit 90 terminates the continuous processing.

[0181] When the process being performed is liquid medicine treatment, the control unit 90 continues the liquid medicine treatment (step S83). In addition, if an abnormality occurs during the continuous liquid medicine treatment and the liquid medicine treatment cannot continue, the control unit 90 may also terminate the liquid medicine treatment.

[0182] Next, after continuous processing (step S8), the control unit 90 executes the steps following step S3 in the same manner as in the first embodiment (see reference). Figure 9 ).

[0183] As described above, in the second embodiment, when an malfunction occurs in the substrate processing apparatus 100 during the execution of the liquid treatment in the processing unit 130, the processing unit 130 continues to perform the liquid treatment. Thus, for example, when an malfunction occurs in another processing unit 130, the processing unit 130 can complete the liquid treatment.

[0184] Furthermore, after the drug treatment is completed, the processing unit 130 performs either a first abnormality handling or a second abnormality handling, similar to the first embodiment. Therefore, drug treatment can be completed even if drug treatment is not set at the jump destination during the first abnormality handling. Additionally, since drug treatment is performed repeatedly during the first abnormality handling, continuous processing can be limited to situations where drug treatment is not set at the jump destination.

[0185] As described above, in the second embodiment, when an abnormality occurs during the execution of the chemical solution treatment, the chemical solution treatment continues during the ongoing process (step S83). Furthermore, when the chemical solution treatment can be completed without any abnormality during the continuous period of the chemical solution treatment, the substrate W after the abnormal treatment can still proceed to the next manufacturing process.

[0186] Figure 11 This is a flowchart illustrating another example of continuous processing. Figure 11 In the example, when the processing in progress during an exception is liquid medicine processing (step S82: Yes), the control unit 90 obtains the remaining time for liquid medicine processing (step S84). The remaining time is the time remaining from the current moment to the end moment of liquid medicine processing. Specifically, the control unit 90 calculates the remaining time based on the processing time of liquid medicine processing specified in the process plan information and the elapsed time since the start of liquid medicine processing. The elapsed time is measured, for example, by a timer circuit.

[0187] Next, the control unit 90 determines whether the remaining time is below a threshold (step S85). The threshold is, for example, preset and stored in the storage device 94. When the remaining time is below the threshold, the drug treatment can be completed in a short time, so the control unit 90 continues the drug treatment (step S83). On the other hand, when the remaining time is greater than the threshold, the control unit 90 stops the drug treatment and ends the continuous treatment.

[0188] In the example above, when the remaining time for drug treatment is short, the control unit 90 continues drug treatment; when the remaining time is long, drug treatment is not continued. This prevents the time required for the first abnormality handling in case of an abnormality from becoming too long. In other words, abnormality handling can be completed in a shorter time.

[0189] As described above, the substrate processing apparatus 100 has been explained in detail, but the above description is illustrative in all respects, and the substrate processing apparatus 100 and the substrate processing method are not limited thereto. It should be understood that numerous variations not illustrated are conceivable without departing from the scope of the invention. The structures described in the above embodiments and variations can be appropriately combined or omitted without contradicting each other.

[0190] Explanation of reference numerals in the attached figures:

[0191] 10 sensors

[0192] 90 Control Department

[0193] 100 Substrate Processing Apparatus

[0194] 130 processing units

[0195] 97 Display Department

[0196] S1 Inspection Procedure (Steps)

[0197] S10 Setting the process (steps)

[0198] S11 Substrate Processing Steps

[0199] S4 First Abnormal Handling Procedure (Steps)

[0200] S7 Second Abnormal Handling Procedure (Steps)

[0201] S8 Continuous processing steps

[0202] W substrate

Claims

1. A substrate processing method, wherein, have: In the setting process, the input unit accepts input from the operator who sets one of the processing contents used to define a series of processing on the substrate as the jump destination in a manner corresponding to at least one of the processing contents. Based on the input of the input unit, setting information for defining the jump destination is stored in the storage unit. In the substrate processing step, a plurality of processing units of the substrate processing apparatus respectively begin the series of processes on the substrate; The inspection process involves detecting abnormalities in the substrate processing apparatus. as well as In the first anomaly handling step, upon detecting the anomaly, each of the plurality of processing units performs the series of processes on the substrate based on the set information, starting from the jump destination set corresponding to the processing content being executed, i.e., the execution content. The substrate processing method further includes: a continuous processing step, wherein, when the abnormality is detected, and the execution content of each of the plurality of processing units is liquid treatment to supply liquid to the substrate, before the first abnormality processing step, each of the plurality of processing units continuously performs the liquid treatment, and when there is an abnormality that the liquid treatment cannot be continued, the liquid treatment is terminated.

2. The substrate processing method as described in claim 1, wherein, The substrate processing method further includes: a second abnormality handling step, wherein when no jump destination corresponding to the execution content is set in the case of detecting the abnormality, or when the abnormality is detected during the execution of the first abnormality handling step, a pre-set second abnormality handling independent of the execution content is performed.

3. A substrate processing apparatus, wherein, have: Multiple processing units perform a series of processes on the substrate; The sensor detects anomalies in the substrate processing apparatus; The input unit accepts input from an operator who sets one of the plurality of processing contents used to define the series of processing contents as the jump destination in a manner corresponding to at least one of the plurality of processing contents. Storage Department; as well as The control unit, based on the input from the input unit, stores setting information for specifying the jump destination in the storage unit, and causes the processing unit to begin the series of processes on the substrate. If the sensor detects the abnormality, each of the plurality of processing units, based on the setting information, performs the series of processes on the substrate, starting from the jump destination set corresponding to the processing content being executed. The control unit is configured such that, when the abnormality is detected, if the execution content of each of the plurality of processing units is a drug processing that supplies drug solution to the substrate, the drug processing is continuously performed by each of the plurality of processing units before the series of processes performed on the substrate starting from the jump destination, and the drug processing is terminated when there is an abnormality that the drug processing cannot be continued.

4. A computer-readable storage medium storing a program for controlling a substrate processing apparatus, the substrate processing apparatus having a plurality of processing units performing a series of processes on a substrate, and sensors for detecting anomalies, wherein, When the program is executed by the computer, the following steps are performed: In the setting process, the input unit accepts input from the operator who sets one of the processing contents used to define the series of processing on the substrate as the jump destination in a manner corresponding to at least one of the processing contents. Based on the input of the input unit, setting information for defining the jump destination is stored in the storage unit. The substrate processing step involves having a plurality of the processing units respectively begin the series of processes on the substrate; The inspection process involves detecting the abnormality in the substrate processing apparatus. In the first exception handling step, upon detecting the exception, each of the plurality of processing units performs the series of processes on the substrate based on the set information, starting from the jump destination set corresponding to the processing content being executed. In the continuous processing step, when the abnormality is detected, if the execution content of each of the plurality of processing units is liquid treatment to supply liquid medicine to the substrate, before the first abnormality handling step, each of the plurality of processing units continuously performs liquid treatment, and if the abnormality makes it impossible to continue liquid treatment, the liquid treatment is terminated.

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