Chip removal device

Abstract

This invention discloses a chip removal device, including a fixture mechanism and a removal mechanism. The fixture mechanism is used to fix a carrier board. The removal mechanism includes a base, a movable part movably connected to the base, a pusher head rotatably connected to the movable part, and a drive part for driving the movable part. The pusher head has a pushing state and a releasing state. In the releasing state, the carrier board can be loaded and unloaded from the fixture mechanism. In the pushing state, the pusher head faces the chip on the fixing seat, and the drive part drives the pusher head to move towards the fixture mechanism. This removal device is designed with a flip-up pusher head, which can quickly remove the chip. First, the pusher head is rotated to the releasing state to fix the carrier board, then the pusher head is rotated to the pushing state near the chip side to remove the chip, and then the pusher head is rotated to the releasing state to remove the substrate, completing the chip removal. The loading and unloading time of the carrier board is greatly shortened, thereby improving the chip removal speed, facilitating chip recycling, and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip recycling, and more particularly to a chip disassembly device. Background Technology

[0002] In the electronics industry, chips are essential components, and chip recycling and reuse can significantly reduce production costs. For example, in optical modules, optical devices account for more than 70% of the module's cost, with optical emitting and receiving components accounting for more than 80% of the cost of optical devices. Among these, the laser chip, as the core component of the optical emitting component, directly determines the transmission rate of the optical module. Therefore, recycling chips from optical modules can greatly reduce the production cost of optical modules.

[0003] Laser chips in optical modules often employ a chip-on-ceramic (COC) packaging design. Recycling these chips requires steps such as installation, positioning, and disassembly. Since recycled chips are mostly removed from faulty optical modules, and the number of faulty modules is relatively small (not mass-produced), developing dedicated automated disassembly equipment would result in low utilization and high cost. Furthermore, optical module models vary, with differences in internal support mechanisms (heat sinks, etc.) and COC arrangements, requiring different disassembly devices for each model, further hindering cost reduction. Moreover, current manual disassembly jigs use a lead screw to rotate and push a pusher forward and backward. This pusher must pass through the module's internal support mechanisms (heat sinks, etc.) to reach the optoelectronic chip on the COC, resulting in a lengthy lead screw rotation process and prolonged disassembly time, impacting recycling efficiency and increasing production costs. Summary of the Invention

[0004] To address the problems in the prior art, the present invention aims to provide a chip disassembly device that allows for faster chip recycling.

[0005] To achieve the above-mentioned objective, one embodiment of the present invention provides a chip removal device for removing a chip fixed on a carrier board, the chip removal device comprising:

[0006] A fixture mechanism used to hold the carrier board containing the chip to be removed; A disassembly mechanism is provided on one side of the fixture mechanism in a first direction. The disassembly mechanism includes a movable part, a driving part, and a pusher rotatably connected to the movable part. The driving part is used to drive the movable part to slide along the first direction to drive the pusher to slide. The pusher has a pushing state and a releasing state. The pusher can reciprocate around the movable part between the pushing state and the releasing state. In the released state, the carrier plate can be loaded and unloaded from the fixture mechanism; In the pushing state, the pusher head is directed toward the chip to be disassembled on the fixture mechanism, and the drive unit drives the pusher head to move toward the fixture mechanism to push the chip to separate from the carrier board.

[0007] As a further improvement of the present invention, the chip removal device further includes a stage, and the fixture mechanism and the removal mechanism are detachably mounted on the stage along the first direction.

[0008] As a further improvement of the present invention, the disassembly mechanism further includes a base, which is mounted on the platform, and the movable part is slidably connected to the base along the first direction.

[0009] As a further improvement of the present invention, the base is mounted on the platform via a first adjustment structure, the first adjustment structure being used to adjust the position of the base on the platform and fix the base on the platform.

[0010] As a further improvement of the present invention, the driving part includes a fixed frame and an adjusting rod. The fixed frame is fixed relative to the base. The adjusting rod passes through the fixed frame and is threadedly connected to the fixed frame. One end of the adjusting rod is a free end, and the other end is connected to the movable part.

[0011] As a further improvement of the present invention, the movable part includes a sliding seat, a rotating frame, and a support frame. The rotating frame and the support frame are disposed on the sliding seat. The sliding seat is slidably connected to the base, and the pusher head is rotatably connected to the rotating frame. The support frame is used to limit the position of the pusher head rotation to support the pusher head in the pushing state.

[0012] As a further improvement of the present invention, a third fixing member for fixing the push head is provided on the support frame.

[0013] As a further improvement of the present invention, the movable part further includes a lifting seat and a lifting part, the lifting seat being connected to the sliding seat through the lifting part, and the rotating frame and the support frame being mounted on the lifting seat.

[0014] As a further improvement of the present invention, the base includes a first slide groove extending along a first direction, the sliding seat is slidably connected to the first slide groove, and the driving part drives the sliding seat to move along the first direction to drive the push head to move forward or backward along the first direction.

[0015] As a further improvement of the present invention, the fixture mechanism includes a fixed seat, one of the fixed seat or the platform is provided with a second sliding groove, and the other is provided with a limiting member. The second sliding groove extends along a second direction, and the limiting member protrudes into the second sliding groove to guide the fixed seat to move along the second direction on the platform. The second direction is perpendicular to the first direction.

[0016] As a further improvement of the present invention, the chip disassembly device further includes a quick positioning part, the quick positioning part including a first blocking member and a second blocking member, the first blocking member and the second blocking member being disposed opposite to each other along the second direction, the fixture mechanism being disposed between the first blocking member and the second blocking member, the fixture mechanism having a first position close to the first blocking member and / or a second position close to the second blocking member.

[0017] As a further improvement of the present invention, the first blocking member includes a first fixing member, and the second blocking member includes a second fixing member, both of which are used to fix the fixing base.

[0018] As a further improvement of the present invention, the quick positioning part further includes an adjustment groove located on the platform, wherein the first blocking member and the second blocking member can be fixedly or slidably connected to the adjustment groove, and the adjustment groove extends along the second direction.

[0019] To achieve the above-mentioned objective, one embodiment of the present invention provides a chip removal device for removing a chip fixed on a carrier board, the chip removal device comprising: Platform; A disassembly mechanism is mounted on the carrier platform. The disassembly mechanism includes a pusher and a drive unit. The drive unit is used to drive the pusher to push the chip to separate from the carrier board. A fixture mechanism is mounted on the platform and is disposed opposite to the pusher head. The fixture mechanism includes a fixed base, a baffle wall on the fixed base, and a movable limiting structure disposed opposite to the baffle wall. The baffle wall and the movable limiting structure are used to accommodate the carrier plate, and the movable limiting structure is used to abut the carrier plate against the baffle wall.

[0020] As a further improvement of the present invention, the fixed base includes a fourth sliding groove, the movable limiting structure includes a push block and a width driving member, the push block is slidably connected to the fourth sliding groove, and the width driving member drives the push block to move along the fourth sliding groove toward the direction close to the baffle wall, and the baffle wall and the push block are used to accommodate the carrier plate.

[0021] As a further improvement of the present invention, the carrier plate is provided with a pad, the chip is fixedly connected to the pad, the fixture mechanism includes a limiting part, the limiting part includes a bracket and a stop bar, the stop bar is rotatably connected to the bracket, the stop bar has a blocking state and an avoidance state, and the stop bar reciprocates around the bracket between the blocking state and the avoidance state; In the blocked state, the stop bar is located on the side of the pad block that is relatively far away from the disassembly mechanism to restrict the movement of the pad block; In the avoidance state, the carrier plate can be loaded and unloaded between the barrier and the movable limiting structure.

[0022] As a further improvement of the present invention, the bracket is mounted on the fixed base by a second adjustment structure, the second adjustment structure being used to adjust the position of the bracket on the fixed base and fix the bracket on the fixed base.

[0023] As a further improvement of the present invention, the fixing base also includes a top wall, which is disposed on the side of the fixing base that is relatively far away from the push head, and blocks the movement of the carrier board of the chip to be removed in a first direction; the baffle and the movable limiting structure are disposed opposite to each other in a second direction, and the first direction and the second direction are perpendicular to each other.

[0024] Compared with the prior art, the present invention has the following beneficial effects: The disassembly device is designed with a flip-up pusher head, which can quickly disassemble the chip. First, the pusher head is rotated to the release state, and the carrier board is fixed by the jig mechanism. Then, the pusher head is rotated to the pushing state. In the pushing state, the pusher head is close to the end face of the chip. Then, the drive unit drives the pusher head to disassemble the chip. After the disassembly is completed, the pusher head is rotated to the release state. The above steps can be repeated to complete the chip disassembly. The time for loading and removing the carrier board is greatly shortened, thereby improving the chip disassembly speed, facilitating chip recycling, and improving production efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the disassembly device in the released state according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the disassembly device in the pushing state according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the disassembly device according to an embodiment of the present invention after the jig mechanism has been displaced; Figure 4 This is a cross-sectional view of a disassembly device according to an embodiment of the present invention; Figure 5 yes Figure 4 A magnified view of a section at point A in the middle; Figure 6 This is a schematic diagram of another embodiment of the disassembly mechanism of one embodiment of the present invention; Figure 7 This is a side view of another embodiment of the disassembly mechanism of one embodiment of the present invention; Figure 8 This is a side view of another embodiment of the disassembly mechanism of the present invention after height adjustment; Figure 9 This is a schematic diagram of the jig mechanism in an avoidance state according to an embodiment of the present invention; Figure 10 This is an exploded view of a fixture mechanism according to an embodiment of the present invention; Figure 11 This is a side view of a jig mechanism according to an embodiment of the present invention in an avoidance state; Among them, 1000, disassembly device; 100, disassembly mechanism; 200, jig mechanism; 300, platform; 301, positioning hole; 302, adjusting groove; 10, push head; 20, moving part; 21, sliding seat; 211, slider; 22, lifting seat; 23, support frame; 231, third fixing component; 24, rotating frame; 25, height adjusting component; 251, height bolt; 252, height limiting plate; 26, height driving component; 261, height spring; 262, guide post; 30, base; 31, first sliding groove; 32, length adjusting groove; 40, drive... Moving part; 41, adjusting rod; 42, fixed frame; 50, fixed seat; 51, top wall; 52, baffle wall; 53, fourth slide groove; 54, second slide groove; 541, limiting member; 55, fifth slide groove; 551, positioning slide groove; 61, movable limiting structure; 611, push block; 612, width driving member; 613, width limiting member; 62, limiting part; 621, stop bar; 622, bracket; 71, first blocking member; 711, first fixing member; 72, second blocking member; 80, handle; 400, carrier plate; 401, pad block; 402, chip. Detailed Implementation

[0026] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of the present invention.

[0027] It should be understood that terms such as “above,” “over,” “below,” and “under” used herein to indicate spatial relative position are for illustrative purposes to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms “spatial relative position” may be intended to include different orientations of the equipment in use or operation other than those shown in the figures.

[0028] One embodiment of the present invention provides a chip removal device for quickly removing chips from a carrier board to achieve chip recycling.

[0029] The disassembly device 1000 in this embodiment is a disassembly device used to disassemble the chip 402 fixed on the carrier board 400, such as... Figures 1-4 As shown, it includes a disassembly mechanism 100 and a fixture mechanism 200, a carrier board 400 and a chip 402 as follows: Figure 5 As shown. The disassembly mechanism 100 is disposed on one side of the fixture mechanism 200 in the first direction. The fixture mechanism 200 is used to fix the carrier plate 400. The carrier plate 400 is provided with a chip 402. The disassembly mechanism 100 is used to disassemble the chip 402 on the carrier plate 400.

[0030] Chip 402 can adopt a COC (chip on ceramic) packaging design. Here, chip 402 refers to the entire COC assembly. Of course, in other embodiments, chip can also specifically refer to a single semiconductor chip. The COC assembly and the carrier board 400 are usually fixed with adhesive. When disassembling, the assembly is first heated to soften the adhesive layer, and then separated from the carrier board 400.

[0031] To facilitate heating of the chip 402, the fixture mechanism 200 may include a handle 80 for easy gripping and operation. The disassembly mechanism 100 includes a pusher 10. After the chip 402 is heated and the adhesive layer is softened, while keeping the carrier plate 400 relatively fixed, the pusher 10 applies a lateral force to the chip 402 against its side, thereby releasing the chip 402 from the carrier plate 400.

[0032] To clearly illustrate the positions and directions described in this embodiment, the disassembly mechanism 100 and the fixture mechanism 200 are arranged sequentially along a first direction, which is the direction from the disassembly mechanism 100 to the fixture mechanism 200. The pusher head 10 pushes the chip 402 on the carrier plate 400 along the first direction.

[0033] For some types of carrier boards 400, such as the optical module carrier board 400 described in the background art, a plurality of chips 402 are sequentially arranged on the carrier board 400 along the second direction. The disassembly device 1000 of this embodiment can disassemble all the chips 402 on such a carrier board 400. Figure 2 and Figure 3 For example, the fixture mechanism 200 can move along the second direction, so as to Figure 2 medium to Figure 3 Taking the changing state as an example, Figure 2 The central fixture mechanism 200 moves along the second direction to Figure 3 The position is determined so that the pusher 10 is aligned with different chipsets on the carrier board 400. The first direction and the second direction can be perpendicular to each other, and the first direction and the second direction can be referenced. Figure 2 As shown.

[0034] The first and second directions can both be parallel to the horizontal plane. The two sides perpendicular to the horizontal plane are defined as up and down respectively. Up and down can also refer to the up and down in physics. The horizontal plane can also refer to the horizontal plane in physics. The chip 402 is located above the carrier plate 400 and aligned with the chip 402. The pusher 10 removes the chip 402 above the carrier plate 400.

[0035] The disassembly device 1000 also includes a platform 300, such as Figure 1 As shown, the disassembly mechanism 100 and the fixture mechanism 200 are detachably mounted on the platform 300 along the first direction. The disassembly mechanism 100 and the fixture mechanism 200 will be described in detail below.

[0036] Disassembly mechanism 100 like Figure 2 As shown, the disassembly mechanism 100 includes a base 30, a movable part 20 movably connected to the base 30, a pusher head 10 rotatably connected to the movable part 20, and a drive part 40 for driving the movable part 20. The pusher head 10 has a pushing state and a releasing state. The pusher head 10 reciprocates around the movable part 20 between the pushing state and the releasing state. The drive part 40 is used to drive the movable part 20 to slide along the first direction to drive the pusher head 10 to slide.

[0037] Release state can be referenced Figure 1 As shown, the feeding status can be referenced. Figures 2-4 As shown.

[0038] In the released state, the unloading plate 400 can be loaded and unloaded at the fixture mechanism 200; In the pushing state, the pusher head 10 is directed toward the chip 402 to be disassembled on the fixture mechanism 200, and the drive unit 40 drives the pusher head 10 to move toward the chip 402 in the first direction to push the chip 402 to separate from the carrier board 400.

[0039] In the released state, the carrier plate 400 can be placed on the fixture mechanism 200 from top to bottom, and can also be removed from the fixture mechanism 200. The pusher head 10 will not interfere with the removal and placement of the carrier plate 400 on the fixture mechanism 200. After the carrier plate 400 is fixed on the fixture mechanism 200, the pusher head 10 is flipped to switch to the pushing state, so that the pusher head 10 is aligned with the chip 402 to be removed. The drive unit 40 drives the movable unit 20 to move, and the pusher head 10 moves together with the movable unit 20 to push the chip 402 and remove the chip 402 from the carrier plate 400.

[0040] Specifically, the base 30 includes a first slide groove 31 extending along a first direction, and the movable part 20 is slidably connected to the first slide groove 31. The structure of the first slide groove 31 can be referred to Figure 6As shown, there are two opposing first slide grooves 31 on the base 30. The movable part 20 includes a slider 211 that is at least partially embedded in the first slide groove 31. The slider 211 is located between the two first slide grooves 31. The driving part 40 drives the slider 211 to slide in the first slide groove 31 along a first direction to drive the movable part 20 and the push head 10 to slide.

[0041] The disassembly mechanism 100 is mounted on the stage 300 via a first adjustment structure, allowing the position of the disassembly mechanism 100 on the stage 300 to be adjusted along a first direction. When disassembling different models of products or when the specifications of the carrier board 400 are different, the position of the disassembly mechanism 100 on the stage 300 can be adjusted so that the pushing part of the pusher used to push the chip is close to the proximal end of the chip. Thus, when disassembling chips on carrier boards of different specifications, the drive unit only needs to drive the pusher to move a small distance to remove the chip. In this way, the drive unit only needs to drive a short stroke during disassembly, without the need for an excessively long stroke, saving disassembly time. For example, the disassembly mechanism 100 can move a sufficient amount in the first direction to meet the different needs of long and short carrier boards 400. By setting the first adjustment structure, the disassembly mechanism 100 can be adapted to carrier boards 400 of different lengths, and can be used to disassemble chips 402 of various product specifications without changing the disassembly device 1000.

[0042] Furthermore, the first adjustment structure includes multiple positioning holes 301 disposed on the platform 300, a length adjustment groove 32 disposed on the base 30, and a first fastener passing through the positioning holes 301 and the length adjustment groove 32 to fix the positions of the platform 300 and the base 30 relative to each other. The first fastener is detachably connected to the platform 300 and the base 30. The multiple positioning holes 301 are arranged along a first direction, and the length adjustment groove 32 is an elongated groove extending along the first direction. The multiple positioning holes 301 and the length adjustment groove 32 cooperate to adjust the relative position of the base 30 on the platform 300. The first fastener can be a bolt, which passes through a positioning hole 301 on the platform 300 and the length adjustment groove 32 on the base 30 sequentially from above or from below. After the base 30 is moved to a suitable position by adjusting the relative position of the length adjustment groove 32 and the positioning hole 301, the first fastener fixes the base 30 and the platform 300 relative to each other. In this embodiment, the positioning hole is a circular hole. In other embodiments, the positioning hole may also be an elongated hole extending along the first direction, so as to finely adjust the relative position of the disassembly mechanism 100 and the platform 300 in the first direction.

[0043] like Figure 1-6As shown, the movable part 20 includes a sliding seat 21, a support frame 23, and a rotating frame 24. The rotating frame 24 and the support frame 23 are mounted on the sliding seat 21. The sliding seat 21 is slidably connected to the base 30. The push head 10 is rotatably connected to the rotating frame 24. A third fixing member 231 for fixing the push head 10 is provided on the support frame 23. In the pushing state, the push head 10 abuts against the support frame 23.

[0044] The support frame 23 is used to limit the position of the push head 10 to support the push head 10 in the pushing state. The surface of the support frame 23 can be set to be parallel to the horizontal plane, so that the push head 10 also moves along the first direction on the horizontal plane to push the chip 402 in a straight manner.

[0045] The third fixing member 231 can be a magnet, and the push head 10 can be made of a ferromagnetic material, such as iron. When the push head 10 rotates to the pushing state, it will be attracted and connected to the third fixing member 231, thus preventing the push head 10 from accidentally opening when disassembling the chip 402. Furthermore, since the main force generated when the push head 10 disassembles the chip 402 is lateral pushing force and lateral resistance, with very little vertical force, the third fixing member 231 can secure the push head 10 even with relatively small forces. When it is necessary to rotate the push head 10 to the release state, simply lift the push head 10 upwards to overcome the magnetic attraction.

[0046] The rotating frame 24 may include two oppositely arranged bases and a pin. The bases are provided with through holes, and the end of the push head 10 connected to the rotating frame 24 is also provided with a through hole. The pin passes through the through hole of one base, the through hole of the push head 10, and the through hole of the other base in sequence, and is then fixed with a retaining ring or nut, so that the push head 10 can rotate around the rotating frame 24.

[0047] One embodiment of the disassembly mechanism 100, such as Figure 1-4 As shown, the sliding seat 21, the support frame 23, and the rotating frame 24 are integrally formed. The sliding seat 21 has the aforementioned sliders 211 on both sides. The sliders 211 are at least partially embedded in the first groove 31 of the base 30, so that the sliders 211 slide in the first groove 31 along the first direction, thereby limiting the sliding seat 21 to slide in the first direction.

[0048] In another embodiment of the disassembly mechanism 100, such as Figures 6-8 As shown, the movable part 20 also includes a sliding seat 21, a lifting seat 22, and a lifting mechanism. The sliding seat 21 is slidably connected to the base 30, and the lifting seat 22 is connected to the sliding seat 21 via the lifting mechanism. A rotating frame 24 and a support frame 23 are provided on the lifting seat 22. The sliding seat 21 can slide along the first slide groove 31, and the lifting seat 22 can move vertically via the lifting mechanism. The base 30 is provided with the aforementioned first slide groove 31, and the sliding seat 21 includes the aforementioned slider 211, which is at least partially disposed within the first slide groove 31.

[0049] In this embodiment, alignment can be achieved by adjusting the height of the pusher head 10 for chips 402 located at different heights. For example, in... Figure 7 When the position of chip 402 is relatively low, the height of pusher 10 is adjusted downwards; Figure 8 When the position of chip 402 is relatively high, the height of the pusher head 10 is adjusted upwards. In this way, the disassembly device 1000 can be used for carrier boards 400 of different heights, and chips 402 of different specifications of products can be disassembled without changing the disassembly device 1000.

[0050] Continue as Figures 6-8 As shown, the lifting unit includes a height adjusting member 25 for limiting the lifting seat 22 from moving away from the sliding seat 21, and a height driving member 26 for driving the lifting seat 22 away from the sliding seat 21. The height adjusting member 25 includes a height bolt 251, and the height driving member 26 includes a height spring 261 and a guide post 262. The lifting seat 22 is provided with a guide hole that mates with the guide post 262 and a through hole that mates with the height bolt 251. The height spring 261 is sleeved on the guide post 262 and abuts against the sliding seat 21 and the lifting seat 22. The height spring 261 is always in a compressed state. The lifting seat 22 is located above the sliding seat 21. One end of the height bolt 251 is connected to the sliding seat 21, and the other end is provided with a head. The lifting seat 22 is located below the head. When the height bolt 251 is rotated to rise, its head rises, creating space between the lifting seat 22 and the bolt head. The lifting seat 22 is driven upward by the height spring 261 until the lifting seat abuts against the head. This causes the pusher 10 on the lifting seat 22 to move upward and horizontally. Conversely, it causes the pusher 10 to move downward and horizontally, thus achieving the effect of the pusher 10 moving up and down.

[0051] In other embodiments, the height drive may consist only of a height compression spring, fitted onto a height bolt, located between the lifting seat and the sliding seat 21.

[0052] In another embodiment, the height adjustment component 25 further includes a height limiting plate 252. The lifting seat 22 is located below the height limiting plate 252, which is an annular plate covering the edge of the lifting seat 22. A through hole for engaging with the height bolt 251 is provided on the height limiting plate 252. One end of the height bolt 251 passes through the through hole in the height limiting plate 252 and locks onto the sliding seat 21. When the height bolt 251 is rotated to rise, its head rises, creating space above the height limiting plate 252. The lifting seat 22, driven by the height spring 261, pushes the height limiting plate 252 upward until the height limiting plate 252 abuts against the head of the height bolt 251, thus causing the pusher head 10 to move upward. Alternatively, when the height bolt 251 is rotated to descend, its head descends, the height limiting plate 252 moves downward, pressing down on the lifting seat 22, thus causing the pusher head 10 to move downward. By adjusting the height adjustment component 25, the pusher head 10 can move up and down.

[0053] Furthermore, such as Figures 1-3 As shown, the drive unit 40 includes a fixed frame 42 and an adjusting rod 41. The fixed frame 42 is fixed relative to the base 30. The adjusting rod 41 passes through the fixed frame 42 and is threadedly connected to the fixed frame 42. One end of the adjusting rod 41 is a free end, and the other end is connected to the movable part 20. Since the adjusting rod 41 is threadedly connected to the fixed frame 42, when the adjusting rod 41 is rotated, it can generate movement in the first direction. A knob can be set on the free end of the adjusting rod 41. One end of the adjusting rod 41 connected to the movable part 20 is fixed relative to it. The knob drives the adjusting rod 41 to rotate relative to the fixed frame 42, so that the adjusting rod 41 moves forward or backward in the first direction, thereby driving the movable part 20 to slide in the first slide groove 31, so that the push head 10 abuts against the chip 402 and pushes the chip 402 away from the carrier plate 400, or causes the push head 10 to retract and reset or move away from the chip 402. The adjusting rod 41 is mainly used to drive the pusher 10 to disassemble the chip 402. When the pusher 10 needs to move away from the carrier board 400, it can be flipped from the pushing state to the releasing state.

[0054] 200 jigs The fixture mechanism 200 in this embodiment is as follows: Figure 2 , 3 As shown in Figures 9-11, the fixture mechanism 200, which is arranged opposite to the pusher head 10, includes a fixed seat 50 for placing the carrier plate 400. The fixed seat 50 is provided with a baffle 52 and a movable limiting structure 61 arranged opposite to the baffle 52. The baffle 52 and the movable limiting structure 61 are used to accommodate the carrier plate 400. The movable limiting structure 61 is used to abut the carrier plate 400 against the baffle 52.

[0055] like Figure 2 and 10 As shown, the fixed base 50 includes a fourth slide groove 53, and the movable limiting structure 61 includes a push block 611 and a width driving member 612. The push block 611 is slidably connected to the fourth slide groove 53, and the width driving member 612 drives the push block 611 to move towards the baffle 52. The space between the baffle 52 and the push block 611 is used to accommodate the carrier plate 400.

[0056] The fourth slide groove 53 extends towards the clamping carrier plate 400, that is, parallel to the second direction. The fourth slide groove 53 may include two slide grooves located on both sides of the push block 611 with opposite openings, as shown in the diagram. Figure 10 As shown, two sliders are also provided on both sides of the push block 611. The sliders of the push block 611 are embedded in the fourth slide groove 53 and can move along the fourth slide groove 53.

[0057] like Figure 10As shown, the movable limiting structure 61 may further include a width limiting member 613, which is fixedly connected to the fixed base 50. The width driving member 612 may be a spring, which is compressed and abuts against the width limiting member 613 and the push block 611. The width driving member 612 drives the push block 611 to slide in the second direction. When the width of the carrier plate 400 is narrow, the spring release is large; when the width of the carrier plate 400 is wide, the spring is compressed more. That is to say, the jig mechanism 200 of this embodiment can be applied to carrier plates 400 of different widths, realizing the disassembly and recycling of chips on carrier plates 400 of different widths using the same set of disassembly devices 1000.

[0058] Additionally, a top wall 51 may be provided on the mounting base 50, such as... Figure 2 , 9 As shown in Figure 10, the top wall 51 is located on the side of the fixed base 50 that is relatively far away from the push head 10, and blocks the movement of the carrier plate 400 in the first direction. When the carrier plate 400 is placed on the fixed base 50, the end of the carrier plate 400 away from the disassembly mechanism 100 abuts against the top wall 51, which is used to prevent the carrier plate 400 from moving in the first direction when the push head 10 pushes the disassembly chip 402 in the first direction.

[0059] Furthermore, such as Figure 2 , 10 As shown in Figure 11, the fixture mechanism 200 includes a limiting part 62, which includes a bracket 622 and a stop bar 621. The bracket 622 is mounted on the fixed base 50 via a second adjustment structure, which is used to adjust the position of the bracket 622 on the fixed base 50 and fix the bracket 622 on the fixed base 50. The stop bar 621 is rotatably connected to the bracket 622 and has a blocking state and a yielding state. The stop bar 621 reciprocates around the bracket 622 between the blocking state and the yielding state. When in the blocking state, the stop bar 621 extends along a second direction.

[0060] like Figure 5 As shown, a pad 401 is provided on the carrier board 400, and the chip 402 is disposed on the pad 401. When the pusher 10 is in the pushing state and the stop bar 621 is in the blocking state, the stop bar 621 blocks one side of the pad 401, the pusher 10 is located on one side of the pad 401 and abuts against the end face of the chip 402 to be removed, and the stop bar 621 is located on the other side of the pad 401 to restrict the movement of the pad 401. Figure 4 and 5As shown, the pusher head 10 moves in the first direction, causing the chip 402 to tend to move in the first direction. This tendency causes the chip 402 to exert a force in the first direction on the pad 401. If the pad 401 is not securely connected to the carrier board 400, the chip 402 may be disassembled along with the pad 401. To avoid this situation, a stop bar 621 is provided on one side of the pad 401 in the first direction. The stop bar 621 abuts against the pad 401 but not against the chip 402. This ensures that when the chip 402 is pushed, the pad 401 is held in place by the stop bar 621 and does not move, allowing only the chip 402 to move in the first direction, thus ensuring that the chip 402 can be smoothly separated from the pad 401.

[0061] like Figure 10 As shown, the bracket 622 may include two opposing support parts and a pin. The support parts are provided with through holes. The end of the stop bar 621 connected to the bracket 622 is also provided with a through hole. The pin passes through the through hole of one support part, the through hole of the stop bar 621 and the through hole of the other support part in sequence, and is then fixed with a retaining ring or nut, so that the stop bar 621 can be rotated around the bracket 622. Figure 9 and Figure 11 In the middle, the stop bar 621 rotates to the avoidance position, in Figures 1-3 In the middle, the stop bar 621 rotates to the blocking state.

[0062] Furthermore, the fixing base 50 includes a fifth slide groove 55, and the bracket 622 is slidably connected to the fifth slide groove 55. The fifth slide groove 55 can be parallel to the first direction. Depending on the different positions of the pad 401, the bracket 622 can be adjusted to slide to different positions in the fifth slide groove 55, so that the stop bar 621 blocks the pad 401 at different positions on the right side. This makes the disassembly device 1000 suitable for carrier boards 400 with different chip positions, and multiple chips can be disassembled without replacing the disassembly device 1000.

[0063] This implementation example Figure 10 and 11 As shown, the fifth slide groove 55 includes two slide grooves with openings opposite each other. The bracket 622 includes sliders that are respectively embedded in the two fifth slide grooves 55. The bracket 622 can slide along the fifth slide groove 55. The second adjustment structure includes a positioning slide groove 551 provided on the side of the fifth slide groove 55 and a fastener. The bracket 622 is fixedly connected to the fixed base 50 by the fastener. The fastener can be a bolt, and a screw hole can be provided on the bracket 622. The bolt passes through the positioning slide groove 551 and is fixed with the screw hole. When it is necessary to change the position of the stop bar 621, the fastener is loosened, the bracket 622 is moved to the appropriate position, and then the bracket 622 is fixed by the fastener. In some other embodiments, the positioning slide groove can also be provided at the bottom of the fifth slide groove.

[0064] Furthermore, such as Figure 2 and 3As shown, the disassembly device 1000 also includes a quick-positioning part quickly positioned on the stage 300. The quick-positioning part includes a first blocking member 71 and a second blocking member 72, which are arranged opposite each other along a second direction. The fixture mechanism 200 has a first position close to the first blocking member 71 and / or a second position close to the second blocking member 72. The fixing seat 50 of the fixture mechanism 200 is positioned between the first blocking member 71 and the second blocking member 72 to limit the sliding position of the fixing seat 50 along the second direction, allowing the set of chips to be disassembled to be quickly aligned with the push head. Figure 2 and Figure 3 As shown, the positions of the first blocking member 71 and the second blocking member 72 are arranged such that when the fixed base 50 slides along the second direction to be close to the first blocking member 71, the push head 10 can be aligned with one of the sets of chips, and when the fixed base 50 slides along the second direction to be close to the second blocking member 72, the push head 10 can be aligned with the other set of chips, thereby realizing the rapid positioning of the fixed base 50 so that a set of chips on it can be quickly aligned with the push head 10.

[0065] Continue as Figure 2 As shown, the quick positioning part also includes an adjustment groove 302 provided on the platform 300. The adjustment groove 302 extends along the second direction. The first blocking member 71 and the second blocking member 72 are arranged side by side above the adjustment groove 302 along the second direction. The distance between the first blocking member 71 and the second blocking member 72 can be adjusted according to the different product specifications to be disassembled. After the distance between the first blocking member 71 and the second blocking member 72 is adjusted, the fastener passes through the adjustment groove 302 to fix the first blocking member 71 and the second blocking member 72 on the platform 300.

[0066] like Figure 3 As shown, the first blocking member 71 also includes a first fixing member 711, and the second blocking member 72 also includes a second fixing member. Both the first fixing member 711 and the second fixing member are used to fix the fixing base 50. Both the first fixing member 711 and the second fixing member can be made of magnets, and the fixing base 50 is made of a ferromagnetic material, such as iron, which can generate an attractive force with the magnet. When the fixing base 50 moves to a position close to the first blocking member 71 or the second blocking member 72, it automatically attracts the magnet, achieving rapid positioning and preventing errors caused by incomplete movement.

[0067] like Figure 2 As shown, one of the fixed base 50 or the platform 300 is provided with a second slide groove 54, and the other is provided with a limiting member 541. The second slide groove 54 extends along a second direction, and the limiting member 541 passes through the second slide groove 54 to guide the fixture mechanism 200 to slide along the second direction on the platform 300, preventing it from sliding in the first direction or other directions. In this embodiment, refer to... Figure 2 or Figure 10As shown, the second slide groove 54 is disposed on the fixed base 50, and the limiting member 541 passes through the fixed base 50 and is connected to the platform 300. The limiting member 541 can be a bolt, and the platform 300 is provided with a threaded hole. The diameter of the bolt is almost equal to the width of the second slide groove 54. Multiple limiting members 541 can be provided to increase the stability of the sliding of the fixed base 50. In other embodiments, the limiting member 541 can also be a protrusion or the like disposed on the platform 300, with the protrusion extending into the second slide groove 54.

[0068] Under the constraint of the second slide 54 and the limiting member 541, the jig mechanism 200 can slide only along the second direction on the stage 300. The sliding of the jig mechanism 200 facilitates chip removal from products with more chips 402. For example, if eight chips 402 are sequentially arranged on the carrier 400 along the second direction, the pusher head 10 can remove four chips 402 at a time. With four chips as a group, the pusher head can be aligned with one group of chips to remove four chips 402 first. Figure 2 As shown, after dismantling, the jig mechanism 200 is slid along the second direction, for example, slid to... Figure 3 Positioning the pusher head so that it aligns with another set of chips, the other four chips 402 are removed. In this way, by simply sliding the fixture mechanism 200 along the second direction, the pusher head 10 can be aligned with the set of chips to be removed in sequence, and multiple sets of chips on the carrier board can be removed in sequence. This facilitates the removal of products with multiple sets of chips and makes the fixture mechanism 200 applicable to carrier boards 400 of different widths, effectively improving the chip removal efficiency.

[0069] Compared with the prior art, this embodiment has the following beneficial effects: (1) The disassembly device 1000 is designed with a flip-up pusher 10, which can quickly disassemble the chip 402. First, the pusher 10 is rotated to the release state, and the carrier plate 400 is fixed by the fixture mechanism 200. Then, the pusher 10 is rotated to the pushing state. In the pushing state, the pusher is close to the end face of the chip. Then, the pusher 10 is driven by the drive unit 40 to disassemble the chip 402. After the disassembly is completed, the pusher 10 is rotated to the release state, and the carrier plate can be removed to complete the disassembly of the chip 402. The loading and unloading time of the carrier plate 400 is greatly shortened, thereby improving the speed of chip 402 disassembly, facilitating the recycling of chip 402, and improving production efficiency.

[0070] (2) The disassembly device 1000 can be used for various specifications of carrier boards 400 with different lengths, widths, heights, number of chips, and chip positions. It can unify multiple disassembly requirements onto the same disassembly device 1000, and can disassemble multiple chips 402 without replacing the disassembly device 1000, thereby further reducing the cost of recycling chips 402.

[0071] (3) By setting the limiting part 62, the baffle 621 blocks the pad 401, preventing the chip 402 from being disassembled along with the pad 401. This ensures that the pad 401 does not shift when the chip 402 is pushed, thus guaranteeing that the chip 402 can be smoothly separated from the pad 401. Furthermore, the position of the baffle 621 is adjustable, making it suitable for carrier boards 400 with different pad 401 positions.

[0072] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0073] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A chip removal device for removing a chip fixed to a carrier board, characterized in that, The chip removal device includes: A fixture mechanism used to hold the carrier board containing the chip to be removed; A disassembly mechanism is disposed on one side of the fixture mechanism in a first direction. The disassembly mechanism includes a movable part, a driving part, a base, and a pusher rotatably connected to the movable part. The driving part is used to drive the movable part to slide along the first direction to drive the pusher to slide. The pusher has a pushing state and a releasing state. The pusher can reciprocate around the movable part between the pushing state and the releasing state. The movable part includes a sliding seat, a rotating frame, and a support frame. The rotating frame and the support frame are disposed on the sliding seat. The sliding seat is slidably connected to the base, and the pusher is rotatably connected to the rotating frame. The support frame is disposed between the rotating frame and the fixture mechanism. The support frame is used to limit the rotation position of the pusher so that the pusher abuts against and is supported on the support frame in the pushing state. In the released state, the carrier plate can be loaded and unloaded by the fixture mechanism, and the pusher will not interfere with the removal and placement of the carrier plate by the fixture mechanism; In the pushing state, the pusher head is directed toward the chip to be disassembled on the fixture mechanism, and the drive unit drives the pusher head to move toward the fixture mechanism to push the chip to separate from the carrier board.

2. The disassembly device according to claim 1, characterized in that, The chip removal device further includes a platform, and the fixture mechanism and the removal mechanism are detachably mounted on the platform along the first direction.

3. The disassembly device according to claim 2, characterized in that, The base is mounted on the platform, and the movable part is slidably connected to the base along the first direction.

4. The disassembly device according to claim 3, characterized in that, The base is mounted on the platform via a first adjustment structure, which is used to adjust the position of the base on the platform and fix the base on the platform.

5. The disassembly device according to claim 3, characterized in that, The drive unit includes a fixed frame and an adjusting rod. The fixed frame is fixed relative to the base. The adjusting rod passes through the fixed frame and is threadedly connected to the fixed frame. One end of the adjusting rod is a free end, and the other end is connected to the movable part.

6. The disassembly device according to claim 1, characterized in that, The support frame is provided with a third fixing member for fixing the push head.

7. The disassembly device according to claim 6, characterized in that, The movable part also includes a lifting seat and a lifting part. The lifting seat is connected to the sliding seat through the lifting part, and the rotating frame and the support frame are mounted on the lifting seat.

8. The disassembly device according to claim 1, characterized in that, The base includes a first slide groove extending along a first direction, the sliding seat is slidably connected to the first slide groove, and the driving unit drives the sliding seat to move along the first direction to drive the push head to move forward or backward along the first direction.

9. The disassembly device according to claim 2, characterized in that, The fixture mechanism includes a fixed base, one of which, or the platform, is provided with a second sliding groove, and the other is provided with a limiting member. The second sliding groove extends along a second direction, and the limiting member protrudes into the second sliding groove to guide the fixed base to move along the second direction on the platform. The second direction is perpendicular to the first direction.

10. The disassembly device according to claim 9, characterized in that, The chip removal device further includes a quick positioning part, which includes a first blocking member and a second blocking member. The first blocking member and the second blocking member are arranged opposite to each other along the second direction. The fixture mechanism is disposed between the first blocking member and the second blocking member. The fixture mechanism has a first position close to the first blocking member and / or a second position close to the second blocking member.

11. The disassembly device according to claim 10, characterized in that, The first blocking member includes a first fixing member, and the second blocking member includes a second fixing member. Both the first fixing member and the second fixing member are used to fix the fixing base.

12. The disassembly device according to claim 10, characterized in that, The quick positioning part also includes an adjustment groove located on the platform. Both the first blocking member and the second blocking member can be fixedly or slidably connected to the adjustment groove, which extends along the second direction.

13. A chip removal device for removing a chip fixed to a carrier board, characterized in that, The chip removal device includes a stage, a removal mechanism, and a fixture mechanism; The disassembly mechanism is mounted on the carrier platform. The disassembly mechanism includes a movable part, a pusher, a drive part, and a base. The drive part is used to drive the pusher to push the chip away from the carrier board. The movable part includes a sliding seat, a rotating frame, and a support frame. The rotating frame and the support frame are disposed on the sliding seat. The sliding seat is slidably connected to the base. The pusher is rotatably connected to the rotating frame. The support frame is disposed between the rotating frame and the fixture mechanism. The support frame is used to limit the rotation position of the pusher so that the pusher abuts against and is supported on the support frame in the pushing state. The pusher can reciprocate around the movable part between the pushing state and the release state. In the release state, the carrier board can be loaded and unloaded by the fixture mechanism, and the pusher will not interfere with the removal and placement of the carrier board into the fixture mechanism. The fixture mechanism is mounted on the platform and is disposed opposite to the pusher head; the fixture mechanism includes a fixed base, a baffle wall on the fixed base, and a movable limiting structure disposed opposite to the baffle wall, the baffle wall and the movable limiting structure are used to accommodate the carrier plate, and the movable limiting structure is used to abut the carrier plate against the baffle wall.

14. The disassembly device according to claim 13, characterized in that, The fixed base includes a fourth slide groove, and the movable limiting structure includes a push block and a width driving member. The push block is slidably connected to the fourth slide groove, and the width driving member drives the push block to move along the fourth slide groove toward the direction close to the baffle. The space between the baffle and the push block is used to accommodate the carrier plate.

15. The disassembly device according to claim 13, characterized in that, The carrier plate is provided with a pad, the chip is fixedly connected to the pad, the fixture mechanism includes a limiting part, the limiting part includes a bracket and a stop bar, the stop bar is rotatably connected to the bracket, the stop bar has a blocking state and an avoidance state, and the stop bar reciprocates around the bracket between the blocking state and the avoidance state; In the blocked state, the stop bar is located on the side of the pad block that is relatively far away from the disassembly mechanism to restrict the movement of the pad block; In the avoidance state, the carrier plate can be loaded and unloaded between the barrier and the movable limiting structure.

16. The disassembly device according to claim 15, characterized in that, The bracket is mounted on the fixed base via a second adjustment structure, which is used to adjust the position of the bracket on the fixed base and fix the bracket on the fixed base.

17. The disassembly device according to claim 13, characterized in that, The fixing base also includes a top wall, which is located on the side of the fixing base that is relatively far away from the push head, and blocks the movement of the carrier board of the chip to be removed in a first direction; the baffle and the movable limiting structure are arranged opposite to each other in a second direction, and the first direction and the second direction are perpendicular to each other.

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