Film loading device and automatic film loading apparatus

Abstract

The application discloses a device for loading a wafer and an automatic wafer loading equipment. The device for loading a wafer comprises a wafer loading workbench, a first moving module and a second moving module. The wafer loading workbench is provided with accommodating grooves and accommodating cavities arranged in sequence along a first direction, the accommodating grooves extend along the first direction and are communicated with the accommodating cavities, the accommodating cavities extend through the wafer loading workbench along a second direction, and the first direction intersects with the second direction. The first moving module is provided with a pushing piece movably arranged along the first direction relative to the wafer loading workbench, and at least a part of the pushing piece is arranged in and out of the accommodating grooves from a side of the accommodating grooves away from the accommodating cavities along the first direction. The second moving module is provided with a supporting piece movably arranged along the second direction relative to the wafer loading workbench, and the supporting piece is at least partially arranged in the accommodating cavities. The device for loading a wafer disclosed by the application reduces assembly errors, improves assembly accuracy, and correspondingly reduces the control difficulty of the first moving module and the second moving module.

Description

Technical Field

[0001] This application belongs to the field of dosing box manufacturing technology, and in particular relates to a tablet loading device and an automatic tablet loading equipment. Background Technology

[0002] A thermoluminescent dosimeter is a device that records cumulative radiation dose using the principle of thermoluminescence. The thermoluminescent dosimeter heats the receiving element and uses a photomultiplier tube to measure the thermoluminescence output, thus reading the radiation dose value. Due to its low attenuation and ease of wear, it is widely used in various radiation-related work fields.

[0003] To address the issues of low efficiency and high labor costs associated with manual assembly of thermoluminescent dosimeters, some existing technologies employ a retrieval mechanism to automatically retrieve the thermoluminescent dosimeter and place it into the dosimeter box. However, the movement of this retrieval mechanism is complex, making it difficult to achieve precise positioning between the thermoluminescent dosimeter and the dosimeter box, resulting in high control complexity. Summary of the Invention

[0004] This application provides a wafer loading device and an automatic wafer loading equipment to improve assembly accuracy and reduce control difficulty.

[0005] According to a first aspect of this application, this application provides a wafer loading apparatus, comprising: a wafer loading platform having a receiving groove and a receiving cavity arranged sequentially along a first direction, the receiving groove extending along the first direction and communicating with the receiving cavity, the receiving cavity extending through the wafer loading platform along a second direction, the first direction intersecting the second direction; a first moving module having a pushing member movably disposed relative to the wafer loading platform along the first direction, at least a portion of the pushing member entering and exiting the receiving groove from a side of the receiving groove away from the receiving cavity along the first direction; and a second moving module having a support member movably disposed relative to the wafer loading platform along the second direction, the support member being at least partially located in the receiving cavity.

[0006] Optionally, the bisecting plane of the receiving groove perpendicular to the third direction and the bisecting plane of the receiving cavity perpendicular to the third direction coincide, and the first direction, the second direction and the third direction are perpendicular to each other.

[0007] Optionally, the mounting device further includes a fixing module having a first fixing member and a second fixing member disposed opposite each other along a third direction, the first direction, the second direction and the third direction being perpendicular to each other, the first fixing member and the second fixing member being configured to move toward each other towards the interior of the receiving cavity along the third direction and / or move away from each other towards the exterior of the receiving cavity along the third direction, so that the distance between the first fixing member and the second fixing member is adjustable.

[0008] Optionally, the first fixing member has a fixing surface and a limiting surface on the side facing the second fixing member. The fixing surface is perpendicular to the third direction, and the limiting surface is located on the side of the fixing surface away from the receiving groove along the first direction. The limiting surface is perpendicular to the first direction and faces the receiving groove. The second fixing member has a pressure-applying part protruding towards the first fixing member on the side facing the first fixing member. An elastic buffer is provided on the pressure-applying part.

[0009] Optionally, the fixed module further includes a drive mechanism, a first connector and a second connector, the first connector being connected to the drive mechanism and the first fixed member, and the second connector being connected to the drive mechanism and the second fixed member; and the first connector and the first fixed member, as well as the second connector and the second fixed member, each have two interfaces perpendicular to the first direction and the third direction, respectively.

[0010] Optionally, the first direction is parallel to the horizontal direction, the second direction is parallel to the vertical direction, the support member is located below the fixed module, and the support member includes a support portion inside the receiving cavity, the support portion protruding upward along the second direction.

[0011] Optionally, the first moving module further includes a first moving mechanism, which is located on one side of the loading platform along a third direction, with the first direction, the second direction, and the third direction being perpendicular to each other; and the pushing member includes a fixed part fixedly connected to the first moving mechanism, a pushing part for entering and exiting the receiving slot, and a connecting part connected between the fixed part and the pushing part, with the fixed part and the pushing part both extending along the first direction, and the connecting part extending along the third direction.

[0012] Optionally, the end of the receiving groove away from the receiving cavity is open at one end of the loading platform along the first direction, and the end of the loading platform is also provided with a recessed portion that is recessed downward along the second direction. The recessed portion communicates with the end of the receiving groove away from the receiving cavity on the side of the receiving groove facing the first moving module.

[0013] Optionally, the mounting platform includes a first working platform and a second working platform arranged along a first direction. The first working platform is lower than the second working platform in a second direction. The first working platform and the second working platform are connected by a connecting wall perpendicular to the first direction. A through groove is provided at the bottom of the connecting wall. A receiving groove is provided on the first working platform, and the top opening of the receiving cavity is provided on the second working platform. The receiving groove is connected to the receiving cavity through the through groove.

[0014] Optionally, a limiting structure is provided on the section of the pusher for entering and exiting the receiving groove, and the limiting structure abuts against the connecting wall when the pusher enters the receiving groove along the first direction and reaches a preset distance.

[0015] Optionally, the cavity is provided with a guide portion inside, which extends radially inward from at least a portion of the periphery of the opening of the cavity toward the interior of the cavity.

[0016] According to a second aspect of this application, embodiments of this application also provide an automatic tablet loading device, which includes a first feeding device, a second feeding device, and a tablet loading device according to any of the above-described schemes, wherein the first feeding device is configured to place a first material into the receiving groove of the tablet loading device, the second feeding device is configured to place a second material into the receiving cavity of the tablet loading device, and the tablet loading device is configured to push the first material in the receiving groove into the second material.

[0017] The loading apparatus provided in this application includes a loading platform, a first moving module, and a second moving module. The loading platform has a receiving groove and a receiving cavity arranged along a first direction. The receiving groove extends along the first direction and communicates with the receiving cavity, while the receiving cavity extends along a second direction. The receiving groove is used to accommodate a sheet-like first material, and the receiving cavity is used to accommodate a second material with a receiving space. The first moving module has a pusher movably arranged along the first direction. The pusher can enter and exit the receiving groove from the side of the receiving groove opposite to the receiving cavity, thereby pushing the first material in the receiving groove along the first direction. The second moving module has a support movably arranged along the second direction. The support can support the second material loaded into the receiving cavity. The height of the second material can be adjusted by the movement of the support along the second direction, thereby allowing the first material to be loaded into the corresponding space layer of the second material. Since the receiving groove and the receiving cavity are arranged and connected along the first direction, it is equivalent to the first material in the receiving groove and the second material in the receiving cavity being pre-positioned in one direction. Therefore, the pushing component and the supporting component only need to move along the other two directions in three-dimensional space to accurately load the first material into the second material. The movement direction of the pushing component and the supporting component is simplified, which reduces the error and improves the assembly accuracy. At the same time, it also reduces the control difficulty of the first moving module and the second moving module. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a wafer loading apparatus provided in one embodiment of this application.

[0020] Figure 2 yes Figure 1 The exploded view of the mounting device is shown.

[0021] Figure 3 yes Figure 1 A schematic diagram of the fixed module of the mounting device shown.

[0022] Figure 4 yes Figure 1 A schematic diagram of the structure of the second moving module of the loading device shown.

[0023] Figure 5 yes Figure 1 A schematic diagram of the structure of the first moving module of the mounting device shown.

[0024] Figure 6 yes Figure 1 A schematic diagram of the mounting platform of the mounting device shown.

[0025] Figure 7 yes Figure 6 Another structural diagram of the mounting platform shown.

[0026] Figure 8 This is a schematic diagram of the structure of an automated wafer loading device provided in one embodiment of this application. Detailed Implementation

[0027] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.

[0030] Figure 1This is a schematic diagram of the structure of a wafer loading apparatus provided in one embodiment of this application. Figure 2 yes Figure 1 The diagram shows an exploded view of the mounting apparatus. For ease of understanding... Figure 1 The diagram also shows material 1 and material 2. (Refer to...) Figure 1 and Figure 2 The wafer loading apparatus 100 provided in this application embodiment includes a wafer loading platform 10, a first moving module 20, and a second moving module 30. The wafer loading platform 10 has a receiving groove 11 and a receiving cavity 12 sequentially arranged along a first direction X. The receiving groove 11 extends along the first direction X and communicates with the receiving cavity 12. The receiving cavity 12 extends through the wafer loading platform 10 along a second direction Y, where the first direction X and the second direction Y intersect. The first moving module 20 has a pushing member 21 movably disposed relative to the wafer loading platform 10 along the first direction X. At least a portion of the pushing member 21 enters and exits the receiving groove 11 from the side of the receiving groove 11 opposite to the receiving cavity 12 along the first direction X. The second moving module 30 has a support member 31 movably disposed relative to the wafer loading platform 10 along the second direction Y. The support member 31 is at least partially located within the receiving cavity 12.

[0031] The receiving groove 11 and the receiving cavity 12 are arranged successively along the first direction X. The receiving groove 11 and the receiving cavity 12 are adjacent to each other, which facilitates the connection between the end of the receiving groove 11 and the receiving cavity 12.

[0032] The first direction X can be parallel to the horizontal direction, and the second direction Y can be parallel to the vertical direction, so as to facilitate the placement of materials in the receiving tank 11 and the receiving cavity 12.

[0033] The section of the pusher 21 used for entering and exiting the receiving groove 11 can be matched with the shape of the receiving groove 11 so that the pusher 21 can reliably contact the sheet material in the receiving groove 11, thereby pushing the sheet material in the receiving groove 11 more stably and reliably. Specifically, the height of the section of the pusher 21 used for entering and exiting the receiving groove 11 along the second direction Y is approximately the same as the depth of the receiving groove 11 along the second direction Y, and the width of the section of the pusher 21 used for entering and exiting the receiving groove 11 along the third direction Z is approximately the same as the width of the receiving groove 11 along the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0034] The portion of the support member 31 located in the receiving cavity 12 can support the second material 2 loaded into the receiving cavity 12. The structural form of the support member 31 includes, but is not limited to, a support plate, a support arm, a support block, etc.

[0035] The loading apparatus 100 provided in this application embodiment includes a loading platform 10, a first moving module 20, and a second moving module 30. The loading platform 10 has a receiving groove 11 and a receiving cavity 12 arranged along a first direction X. The receiving groove 11 extends along the first direction X and communicates with the receiving cavity 12, and the receiving cavity 12 extends along a second direction Y. The receiving groove 11 is used to accommodate a sheet-like first material 1, and the receiving cavity 12 is used to accommodate a second material 2 having a receiving space. The first moving module 20 has a pusher 21 movably arranged along the first direction X. The pusher 21 can enter and exit the receiving groove 11 from the side of the receiving groove 11 opposite to the receiving cavity 12, thereby pushing the first material 1 in the receiving groove 11 along the first direction X. The second moving module 30 has a support 31 movably arranged along the second direction Y. The support 31 can support the second material 2 loaded into the receiving cavity 12. The height of the second material 2 can be adjusted by the movement of the support 31 along the second direction Y, thereby allowing the first material 1 to be loaded into the corresponding space layer of the second material 2. Since the receiving groove 11 and the receiving cavity 12 are arranged and connected along the first direction X, the receiving groove 11 and the receiving cavity 12 themselves can play a certain limiting role. It is equivalent to the first material 1 in the receiving groove 11 and the second material 2 in the receiving cavity 12 being pre-positioned in one direction. Therefore, the pushing member 21 and the supporting member 31 only need to move along the other two directions in three-dimensional space to accurately load the first material 1 into the corresponding space of the second material 2. The movement direction of the pushing member 21 and the supporting member 31 is singular, which reduces the error and improves the assembly accuracy. At the same time, it also reduces the control difficulty of the first moving module 20 and the second moving module 30.

[0036] In some embodiments, the bisecting plane of the receiving groove 11 perpendicular to the third direction Z and the bisecting plane of the receiving cavity 12 perpendicular to the third direction Z coincide, and the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0037] The bisecting plane of the receiving groove 11 perpendicular to the third direction Z is a plane that passes through the center line of the receiving groove 11 along the third direction Z and is perpendicular to the third direction Z. Similarly, the bisecting plane of the receiving cavity 12 perpendicular to the third direction Z is a plane that passes through the center line of the receiving cavity 12 along the third direction Z and is perpendicular to the third direction Z.

[0038] In this embodiment, the bisecting plane of the receiving groove 11 perpendicular to the third direction Z is set to coincide with the bisecting plane of the receiving cavity 12 perpendicular to the third direction Z, which can further improve the positioning accuracy between the first material 1 in the receiving groove 11 and the second material 2 in the receiving cavity 12, thereby further improving the assembly accuracy of the loading device.

[0039] In some embodiments, the loading device 100 further includes a fixing module 40. Figure 3 yes Figure 1The diagram shows the structure of the fixing module of the mounting device. The fixing module 40 has a first fixing member 41 and a second fixing member 42 disposed opposite to each other along a third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. The first fixing member 41 and the second fixing member 42 are configured to move towards each other along the third direction Z toward the interior of the receiving cavity 12 and / or move away from each other along the third direction Z toward the exterior of the receiving cavity 12, so that the distance between the first fixing member 41 and the second fixing member 42 is adjustable.

[0040] The receiving cavity 12 may have a notch on each of its two opposite sidewalls along the third direction Z, so that the first fixing member 41 and the second fixing member 42 can enter and exit the receiving cavity 12 through the two notches respectively.

[0041] When the first fixing member 41 and the second fixing member 42 move toward each other along the third direction Z toward the interior of the receiving cavity 12, the second material 2 located in the receiving cavity 12 can be fixed along the third direction Z, the second material 2 is positioned, the possibility of the second material 2 being displaced during the process of the pusher 21 pushing the first material 1 into the second material 2 is reduced, and the assembly accuracy is further improved.

[0042] When the first fixing member 41 and the second fixing member 42 move away from each other along the third direction Z toward the outside of the receiving cavity 12, the second material 2 in the receiving cavity 12 can be released, thereby facilitating the removal of the second material 2 from the receiving cavity 12 or adjusting the position of the second material 2 in the receiving cavity 12.

[0043] In this embodiment, the distance between the first fixing member 41 and the second fixing member 42 is adjustable, and the clamping force of the first fixing member 41 and the second fixing member 42 on the second material can also be adjusted, which is suitable for positioning second materials of various specifications.

[0044] In some embodiments, the first fixing member 41 has a fixing surface 411 and a limiting surface 412 on the side facing the second fixing member 42. The fixing surface 411 is perpendicular to the third direction Z, and the limiting surface 412 is located on the side of the fixing surface 411 facing away from the receiving groove 11 along the first direction X. The limiting surface 412 is perpendicular to the first direction X and faces the receiving groove 11. The second fixing member 42 has a pressure-applying part 421 protruding towards the first fixing member 41 on the side facing the first fixing member 41, and the pressure-applying part 421 is provided with an elastic buffer.

[0045] When the first fixing member 41 and the second fixing member 42 are in the state of the second material 2 in the fixed receiving cavity 12, the fixing surface 411 is in contact with the surface of the second material 2, and the contact area is large, which not only makes the fixing reliable, but also makes it less likely to damage the second material 2.

[0046] The limiting surface 412 is perpendicular to the first direction X and faces the receiving groove 11, which can limit the second material 2 in the first direction X. When the second material 2 abuts against the limiting surface 412, the limiting surface 412 can prevent the second material 2 from moving away from the receiving groove 11 along the first direction X, so that the pushing member 21 can reliably push the first material 1 into the second material 2. The first fixing member 41 and the second fixing member 42 can simultaneously limit the second material 2 in the receiving cavity 12 in the first direction X and the third direction Z, which improves the positional accuracy of the second material 2 in the receiving cavity 12.

[0047] The pressure-applying part 421 protrudes towards the first fixing member 41, facilitating the installation of an elastic buffer on the pressure-applying part 421. The elastic buffer can generate appropriate elastic deformation, thereby buffering the pressure applied to the second material 2 by the second fixing member 42 and reducing the possibility of damage to the second material 2. Schematic, the elastic buffer can be a rubber pad, silicone pad, sponge pad, etc.

[0048] In some embodiments, the fixing module 40 further includes a driving mechanism 43, a first connector 44, and a second connector 45. The first connector 44 is connected to the driving mechanism 43 and the first fixing member 41, and the second connector 45 is connected to the driving mechanism 43 and the second fixing member 42. The first connector 44 and the first fixing member 41, as well as the second connector 45 and the second fixing member 42, each have two interfaces, one perpendicular to the first direction X and the other perpendicular to the third direction Z, respectively.

[0049] The drive mechanism 43 can drive the first connecting member 44 and the second connecting member 45 to move in opposite directions along the third direction Z, thereby causing the first fixing member 41 and the second fixing member 42 to move in opposite directions along the third direction Z. The first connecting member 44 and the first fixing member 41, as well as the second connecting member 45 and the second fixing member 42, can be connected by suitable means such as screw connection, welding, or snap-fit.

[0050] The first connector 44 and the first fixing member 41, as well as the second connector 45 and the second fixing member 42, each have two interfaces that are perpendicular to the first direction X and the third direction Z, respectively. This can effectively prevent the first fixing member 41 from rotating relative to the first connector 44 and prevent the second fixing member 42 from rotating relative to the second connector 45, thereby improving the stability of the first fixing member 41 and the second fixing member 42.

[0051] Figure 4 yes Figure 1The schematic diagram of the second moving module of the loading device shown in the figure has, in some embodiments, a first direction X parallel to the horizontal direction and a second direction Y parallel to the vertical direction. The support member 31 is located below the fixed module 40. The support member 31 includes a support portion 311 inside the receiving cavity 12. The support portion 311 extends upward along the second direction Y.

[0052] The second moving module 30 may further include a second moving mechanism 32, with the support member 31 connected to the second moving mechanism 32 to move along the second direction Y under the drive of the second moving mechanism 32. The support member 31 also includes a connecting arm 312 connecting the second moving mechanism 32 and the support portion 311, the connecting arm 312 always being located below the fixed module 40. The support portion 311 extends upward from the end of the connecting arm 312. The lower surface of the connecting arm 312 is provided with reinforcing ribs to improve the structural strength of the connecting arm 312.

[0053] The second moving module 30 may further include a second guide rail 33 extending along the second direction Y, and the second moving mechanism 32 moves along the second guide rail 33. The second guide rail 33 may be located on one side of the loading platform 10 along the first direction X and is mounted on the vertical support frame 50.

[0054] The support member 31 is located below the fixed module 40, which not only has a compact structure but also makes it less likely to interfere with the fixed module 40 when the support member 31 moves along the second direction Y. The support part 311 extends upward along the second direction Y, which can compensate for the height difference between the support member 31 and the fixed module 40, so that the first fixing member 41 and the second fixing member 42 can fix the bottom of the second material 2, thereby facilitating the insertion of the first material 1 into the bottom space of the second material 2.

[0055] Figure 5 yes Figure 1 The schematic diagram of the first moving module of the wafer loading apparatus is shown. In some embodiments, the first moving module 20 further includes a first moving mechanism 22, which is located on one side of the wafer loading platform 10 along the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. The pushing member 21 includes a fixing part 211 fixedly connected to the first moving mechanism 22, a pushing part 212 for entering and exiting the receiving slot 11, and a connecting part 213 connecting the fixing part 211 and the pushing part 212. The fixing part 211 and the pushing part 212 both extend along the first direction X, and the connecting part 213 extends along the third direction Z.

[0056] The connection methods between the fixed part 211 and the first moving mechanism 22 include, but are not limited to, screw connection, snap-fit, welding, riveting, etc.

[0057] The fixing part 211, the pushing part 212, and the connecting part 213 can all be plate-shaped components. The fixing part 211, the pushing part 212, and the connecting part 213 can be integrally formed, and the two end faces of the fixing part 211, the pushing part 212, and the connecting part 213 opposite each other along the second direction Y are respectively flush, that is, the two end faces of the pushing member 21 opposite each other along the second direction Y are both flat planes.

[0058] The first moving module 20 may further include a first guide rail 23 extending along a first direction X, the first guide rail 23 being disposed on one side of the loading platform 10 along a third direction Z. The first moving mechanism 22 moves along the first guide rail 23. The first guide rail 23 may be mounted on a mounting bracket 24, the mounting bracket 24 being fixed to the loading platform 10 by screws or other suitable means.

[0059] The first moving mechanism 22 is located on one side of the loading platform 10 along the third direction Z, which can reduce the size of the loading device 100 in the first direction X and avoid the loading device 100 being too long in a single direction. The pushing member 21 includes a fixing part 211, a pushing part 212, and a connecting part 213, which allows the pushing part 212 to move along the first direction X based on the relative position of the first moving mechanism 22 and the loading platform 10. At the same time, it also improves the structural strength of the pushing member 21 and reduces the possibility of its breakage or deformation. The fixing part 211, the pushing part 212, and the connecting part 213 form a U-shaped structure, which reduces the possibility of the pushing member 21 colliding with the loading platform 10 during its movement along the first direction X.

[0060] Figure 6 yes Figure 1 The diagram shows the structure of the wafer loading platform of the wafer loading device. Figure 7 yes Figure 6 The diagram shows another view of the mounting platform. In some embodiments, the end of the receiving groove 11 that is away from the receiving cavity 12 is open at one end of the mounting platform 10 along the first direction X. This end of the mounting platform 10 is also provided with a recess 13 that is recessed downward along the second direction Y. The recess 13 communicates with the end of the receiving groove 11 that is away from the receiving cavity 12 on the side of the receiving groove 11 facing the first moving module 20.

[0061] The recessed direction of the receiving groove 11 is the same as the recessed direction of the recess 13.

[0062] The recess 13 may be located at the corner of the loading platform 10 along the third direction Z, close to the first moving module 20, with the first direction X, the second direction Y and the third direction Z being perpendicular to each other.

[0063] When the pusher 21 moves into the receiving groove 11 along the first direction X, the connecting part 213 may come into contact with the loading platform 10. To address this, in this embodiment, a recess 13 is provided on the side of the receiving groove 11 facing the first moving module 20, which communicates with the end of the receiving groove 11 opposite to the receiving cavity 12. The recess 13 can provide clearance space for the connecting part 213, thereby avoiding collision with the connecting part 213.

[0064] In some embodiments, the wafer loading platform 10 includes a first working platform 14 and a second working platform 15 arranged along a first direction X. The first working platform 14 is lower than the second working platform 15 in a second direction Y. The first working platform 14 and the second working platform 15 are connected by a connecting wall 16 perpendicular to the first direction X. A through groove 17 is provided at the bottom of the connecting wall 16. A receiving groove 11 is provided on the first working platform 14, and the top opening of the receiving cavity 12 is provided on the second working platform 15. The receiving groove 11 communicates with the receiving cavity 12 through the through groove 17.

[0065] The mounting platform 10 may further include a support platform 18 extending along the second direction Y, on which both the first mounting platform 14 and the second mounting platform 15 are supported. The support platform 18 may be fixed to a horizontal support frame 60, which may be fixedly connected to a vertical support frame 50 to improve support stability. The receiving cavity 12 may extend along the second direction Y through at least a portion of the second mounting platform 15 and the support platform 18. An opening 181 communicating with the receiving cavity 12 may be provided on one side of the support platform 18, extending along the second direction Y to allow the connecting arm 312 of the support member 31 to pass through and move along the opening 181 in the second direction Y.

[0066] The recess 13 may be formed at the end corner of the first working platform 14 away from the second working platform 15.

[0067] In this embodiment, the first working platform 14 and the second working platform 15 are configured with a height difference, which facilitates communication between the receiving groove 11 in the first working platform 14 and the central space of the receiving cavity 12 in the second working platform 15, thereby facilitating the assembly of materials. Furthermore, the second working platform 15 protrudes from the first working platform 14 along the second direction Y, and the peripheral wall of the second working platform 15 can form a limiting structure, which can provide a certain limiting effect on the second material 2 contained in the receiving cavity 12.

[0068] In some embodiments, a limiting structure 25 is provided on the section of the pusher 21 for entering and exiting the receiving groove 11. The limiting structure 25 abuts against the connecting wall 16 when the pusher 21 enters the receiving groove 11 along the first direction X and reaches a preset distance.

[0069] The limiting structure 25 can be provided on the side surface of the pushing part 212 opposite to the receiving groove 11, and protrude from the surface in the second direction Y in the direction opposite to the receiving groove 11 so as to abut against the connecting wall 16.

[0070] The connection methods between the limiting structure 25 and the pushing member 21 include, but are not limited to, screw connection, snap-fit, welding, riveting, etc.

[0071] In this embodiment of the application, a limiting structure 25 is provided on the pusher 21. The abutment between the limiting structure 25 and the connecting wall 16 can prevent the pusher 21 from continuing to move toward the receiving cavity 12, thereby preventing the pusher 21 from moving excessively in the first direction X and causing damage to materials or components.

[0072] In some embodiments, the interior of the receiving cavity 12 is provided with a guide portion 121, which extends radially inward from at least a portion of the periphery of the opening 122 of the receiving cavity 12 toward the interior of the receiving cavity 12.

[0073] The guide portion 121 may include four inclined guide surfaces that form a funnel-shaped structure.

[0074] In this embodiment of the application, the guide part 121 can be provided to guide the second material 2 that is loaded into the receiving cavity 12 from the opening of the receiving cavity 12, so as to facilitate the smooth loading of the second material 2 into the receiving cavity 12.

[0075] In some embodiments, the loading device 100 may further include a detection module, which may include multiple detection elements for detecting whether a first material 1 is placed in the receiving groove 11, the position of the pusher 21, whether a second material 2 is placed in the receiving cavity 12, and the position of the second material 2 in the receiving cavity 12, etc. When it is detected that the second material 2 is placed in the receiving cavity 12 and the second material 2 is in the target position in the receiving cavity 12, the fixing module 40 can be controlled to fix the second material 2. After detecting that the first material 1 is placed in the receiving groove 11, the pusher 21 is controlled to enter the receiving groove 11 along the first direction X, pushing the first material 1 in the receiving groove 11 to load the second material 2 located in the receiving cavity 12 along the first direction X. The pusher 21 is reset along the first direction X, the fixing module 40 releases the second material 2, the second moving module 30 drives the second material 2 to move along the second direction Y to the second station, and the second material 2 is fixed again by the fixing module 40. After detecting that the first material 1 has been placed in the receiving tank 11 again, the pusher 21 is controlled to enter the receiving tank 11 along the first direction X, pushing the first material 1 in the receiving tank 11 to load the second material 2 along the first direction X, and so on.

[0076] This application also provides an automated wafer loading device. Figure 8This is a schematic diagram of the structure of an automated wafer loading device provided in one embodiment of this application. For ease of understanding, Figure 8 The first material 1 and the second material 2 are also shown. The automatic tablet loading equipment 1000 provided in this application includes a first feeding device 200, a second feeding device 300, and a tablet loading device 100 of any of the above embodiments. The first feeding device 200 is configured to place the first material 1 into the receiving groove 11 of the tablet loading device 100, the second feeding device 300 is configured to place the second material 2 into the receiving cavity 12 of the tablet loading device 100, and the tablet loading device 100 is configured to push the first material 1 in the receiving groove 11 into the second material 2.

[0077] Both the first feeding device 200 and the second feeding device 300 can be electrically controlled robotic arms, robotic hands, robots, etc.

[0078] The second feeding device 300 can also be configured to remove the assembled second material 2 from the loading device 100. That is, the second feeding device 300 can also be used as a unloading device.

[0079] The automatic loading equipment 1000 of this application embodiment realizes automatic feeding and automatic assembly of the first material 1 and the second material 2, with a high degree of automation, high assembly efficiency, and reduced labor costs.

[0080] For example, the tablet loading apparatus 100 and automatic tablet loading equipment 1000 provided in this application embodiment are suitable for loading a first material 1 in the form of a tablet and a second material 2 having a receiving space. The first material 1 may be, for example, a dosage tablet. The second material 2 may be, for example, a dosage box. One second material 2 can be loaded with one first material 1, or multiple first materials 1 can be loaded.

[0081] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0082] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0083] In the description of the embodiments in this application, the term "and / or" is merely a description of the association relationship between related objects, indicating that three relationships can exist. For example, m and / or n can represent: m alone, m and n simultaneously, and n alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0084] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two).

[0085] In the description of the embodiments of this application, the technical terms "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0086] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0087] In the embodiments of this application, "parallel" includes not only the case of absolute parallelism, but also the case of approximate parallelism as commonly understood in engineering; similarly, "perpendicular" also includes not only the case of absolute perpendicularity, but also the case of approximate perpendicularity as commonly understood in engineering. For example, if the angle between two directions is 85°-90°, the two directions can be considered perpendicular; if the angle between two directions is 0°-5°, the two directions can be considered parallel.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer loading apparatus, characterized in that, include: A wafer loading platform has a receiving slot and a receiving cavity arranged sequentially along a first direction. The receiving slot extends along the first direction and communicates with the receiving cavity. The receiving cavity extends through the wafer loading platform along a second direction, and the first direction intersects with the second direction. A first moving module has a pusher that is movably disposed relative to the loading platform along the first direction, at least a portion of the pusher moving in and out of the receiving groove from the side of the receiving groove opposite to the receiving cavity along the first direction; as well as The second moving module has a support member that is movably disposed relative to the mounting platform along the second direction, the support member being at least partially located in the receiving cavity; The mounting platform includes a first working platform and a second working platform arranged along the first direction. The first working platform is lower than the second working platform in the second direction. The first working platform and the second working platform are connected by a connecting wall perpendicular to the first direction. A through groove is provided at the bottom of the connecting wall. The receiving groove is provided on the first working platform. The top opening of the receiving cavity is provided on the second working platform. The receiving groove is connected to the receiving cavity through the through groove. The section of the pusher for entering and exiting the receiving groove is provided with a limiting structure, which extends protruding away from the receiving groove and is used to abut against the connecting wall.

2. The mounting apparatus according to claim 1, characterized in that, The bisecting plane of the receiving groove perpendicular to the third direction coincides with the bisecting plane of the receiving cavity perpendicular to the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other.

3. The mounting apparatus according to claim 1, characterized in that, Also includes: A fixing module has a first fixing member and a second fixing member disposed opposite each other along a third direction, the first direction, the second direction and the third direction being perpendicular to each other, the first fixing member and the second fixing member being configured to move toward each other toward the interior of the receiving cavity along the third direction and / or move away from each other toward the exterior of the receiving cavity along the third direction, so that the distance between the first fixing member and the second fixing member is adjustable.

4. The mounting apparatus according to claim 3, characterized in that, The first fixing member has a fixing surface and a limiting surface on the side facing the second fixing member. The fixing surface is perpendicular to the third direction, and the limiting surface is located on the side of the fixing surface away from the receiving groove along the first direction. The limiting surface is perpendicular to the first direction and faces the receiving groove. The second fastener has a pressure-applying part protruding towards the first fastener on the side facing the first fastener, and the pressure-applying part is provided with an elastic buffer.

5. The mounting apparatus according to claim 3, characterized in that, The fixing module further includes a driving mechanism, a first connecting member, and a second connecting member. The first connecting member is connected to the driving mechanism and the first fixing member, and the second connecting member is connected to the driving mechanism and the second fixing member. The first connector and the first fixing member, as well as the second connector and the second fixing member, each have two interfaces, one perpendicular to the first direction and the other perpendicular to the third direction.

6. The mounting apparatus according to claim 3, characterized in that, The first direction is parallel to the horizontal direction, the second direction is parallel to the vertical direction, the support member is located below the fixed module, the support member includes a support portion inside the receiving cavity, and the support portion extends upward along the second direction.

7. The mounting apparatus according to claim 1, characterized in that, The first moving module further includes a first moving mechanism, which is located on one side of the loading platform along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other; and The pushing member includes a fixed part fixedly connected to the first moving mechanism, a pushing part for entering and exiting the receiving groove, and a connecting part connected between the fixed part and the pushing part. The fixed part and the pushing part both extend along the first direction, and the connecting part extends along the third direction.

8. The mounting apparatus according to claim 7, characterized in that, The end of the receiving groove that is away from the receiving cavity is open at one end of the loading platform along the first direction. The end of the loading platform is also provided with a recess that is recessed downward along the second direction. The recess communicates with the end of the receiving groove that is away from the receiving cavity on the side of the receiving groove facing the first moving module.

9. The mounting apparatus according to claim 1, characterized in that, The limiting structure abuts against the connecting wall when the pushing member enters the receiving groove along the first direction and reaches a preset distance.

10. The mounting apparatus according to claim 1, characterized in that, The cavity is provided with a guide portion inside, which extends radially inward from at least a portion of the periphery of the opening of the cavity toward the interior of the cavity.

11. An automatic wafer loading device, characterized in that, It includes a first feeding device, a second feeding device, and a tablet loading device according to any one of claims 1-10. The first feeding device is configured to place the first material into the receiving slot of the tablet loading device, the second feeding device is configured to place the second material into the receiving cavity of the tablet loading device, and the tablet loading device is configured to push the first material in the receiving slot into the second material.

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