A method, device and computer storage medium for measuring height by scribe blade

Abstract

The application provides a scribe blade height measuring method, device and storage medium, wherein the scribe blade height measuring method comprises the following steps: determining a height measuring area on a scribing table in advance; performing abnormality detection on the height measuring area to determine an abnormal area in the height measuring area; contacting the scribe blade with a plurality of height measuring points in the height measuring area to obtain a plurality of scribe blade height values, the height measuring points avoiding the abnormal area; calculating a difference between a maximum value and a minimum value in the plurality of scribe blade height values; if the difference is less than a preset threshold, calculating an average value of the plurality of scribe blade height values as the radius of the scribe blade. The height measuring points used in the application all avoid the abnormal area, so that the radius of the scribe blade can be accurately obtained through height measurement. In addition, by comparing the difference between the maximum value and the minimum value in the scribe blade height values with the size of the preset threshold, the situation that the scribe blade is damaged is prevented, and the scribe blade height value measured is taken as the radius of the scribe blade.

Description

Technical Field

[0001] This application relates to the field of integrated circuit manufacturing, specifically a method, apparatus, and computer storage medium for measuring the height of a dicing blade. Background Technology

[0002] A dicing machine uses a circular dicing blade at a certain height above the wafer to dice it. The distance between the dicing blade and the dicing stage (hereinafter referred to as the dicing distance) determines the cutting depth of the wafer by the dicing blade. In the specific dicing operation, the appropriate dicing distance is determined in advance according to the required wafer cutting depth, and then the dicing height of the dicing blade (i.e., the height of the center of the dicing blade relative to the dicing stage) is adjusted to carry out dicing.

[0003] Since the dicing height of a dicing blade equals the distance between the dicing blade and the dicing table plus the radius of the dicing blade, once the dicing distance is determined, the dicing height can be calculated simply by obtaining the radius of the dicing blade. However, the dicing blade will wear down during use, causing its radius to decrease. Therefore, it is necessary to periodically obtain the radius of the dicing blade to precisely adjust its dicing height.

[0004] When no wafer is placed on the dicing stage, and the stage surface is sufficiently level, the height of the dicing blade when it descends and contacts the stage is its radius. Since the dicing blade is mounted on the spindle's drive end and its height is adjusted by the spindle, the height at which the dicing blade contacts the stage can be directly obtained from the spindle's control end, without the need for an additional ranging device for actual measurement.

[0005] Based on the above principle, in order to obtain the radius of the dicing blade, one feasible method is to control the rotating blade via the spindle to contact several height measuring points on the dicing stage, thereby obtaining several height values ​​of the dicing blade at these measuring points. Then, the average height value of these height values ​​is calculated, and this average height value can be used as the radius of the dicing blade.

[0006] However, the above height measurement method has the following problems: First, if there are abnormal areas (such as concave or convex areas) on the dicing platform, and one or more height measurements fall within these areas, the obtained average height value will deviate significantly from the radius of the dicing blade. This will ultimately prevent the accurate determination of the dicing blade's radius and may damage the blade. Second, if the dicing blade is damaged (typically with a notch on the blade edge), using the obtained average height value as the radius of the dicing blade to calculate the dicing height during the actual dicing process will inevitably lead to dicing failure. Summary of the Invention

[0007] To solve the above-mentioned technical problems, this application provides a method for measuring the height of a dicing blade, which adopts the following technical solution:

[0008] A method for measuring the height of a dicing blade, used to measure the height of a dicing blade to obtain its radius, the method comprising:

[0009] Pre-determine the height measurement area on the marking platform;

[0010] Anomaly detection is performed on the height measurement area to identify and locate abnormal areas within the area. Abnormal areas either protrude upwards from the marking platform or are recessed downwards from it.

[0011] The spindle controls the dicing blade to contact several height measuring points within the height measuring area to obtain several dicing blade height values, and the contacted height measuring points avoid abnormal areas.

[0012] Calculate the difference between the maximum and minimum values ​​of several dicing blade heights:

[0013] If the difference is less than a preset threshold, calculate the average of several dicing blade height values ​​and use it as the radius of the dicing blade.

[0014] In some embodiments, when the difference is greater than or equal to a preset threshold, a damage detection is performed on the dicing blade; if the dicing blade is damaged, it is replaced; otherwise, the height of the dicing blade is measured again.

[0015] In some embodiments, anomaly detection in the height measurement area includes: acquiring an image of the height measurement area; performing image analysis on the image of the height measurement area to determine and locate abnormal areas within the height measurement area.

[0016] In some embodiments, before the dicing blade contacts several height measuring points within the height measuring area via the spindle control, the dicing blade height measuring method includes: pre-determining N height measuring points within the height measuring area, with the N height measuring points evenly distributed within the height measuring area; and removing the height measuring points located in abnormal areas from the N height measuring points to obtain several height measuring points.

[0017] In some embodiments, N height measurement points are evenly arranged in rows and columns on the height measurement area, wherein the distance between each position point in the same row is equal to the distance between each position point in the same column; the height measurement points on the periphery maintain a predetermined safe distance from the edge of the marking platform.

[0018] In some embodiments, the spindle controls the scribe blade to contact several height measurement points within the height measurement area to obtain several scribe blade height values. This includes: determining a height measurement stepping path within the height measurement area; controlling the scribe blade to step along the height measurement stepping path via the spindle; and after each step: determining whether the current height measurement point directly below the scribe blade is located in an abnormal area; if so, controlling the scribe blade to step above the next height measurement point via the spindle; otherwise, controlling the scribe blade to descend and contact the current height measurement point via the spindle to obtain a scribe blade height value.

[0019] In some embodiments, the height measurement stepping path includes at least one straight path, which is parallel to the length or width direction of the height measurement area; controlling the scribe blade to step along the height measurement stepping path by the spindle includes: for each straight path, determining the stepping start point, stepping end point, and stepping distance value at each step; controlling the scribe blade to step from the stepping start point to the stepping end point by the spindle.

[0020] In some embodiments, the height measurement stepping path includes at least two straight paths, the stepping distance value being equal to the distance between the two adjacent straight paths; the stepping start point and stepping end point on each straight path maintain a predetermined safe distance from the edge of the grading platform.

[0021] Compared with existing methods for measuring the height of a dicing blade, the method provided in this application has the following advantages: The measuring points used in this application all avoid abnormal areas, thus ensuring that the radius of the dicing blade can be accurately obtained through height measurement and preventing damage to the dicing blade when it comes into contact with abnormal areas. Furthermore, by comparing the difference between the maximum and minimum height values ​​of the dicing blade with a preset threshold, the method prevents the measured height value from being used as the radius of the dicing blade in the event of blade damage.

[0022] This application also provides a slit height compensation device, which includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes the at least one program instruction to implement the slit height compensation method as described in any of the above claims.

[0023] This application also provides a computer storage medium storing at least one program instruction, which is loaded and executed by a processor to implement the slicing height compensation method described in any of the preceding claims. Attached Figure Description

[0024] Figure 1 This is a flowchart illustrating the execution of the dicing blade height measurement method in the embodiments of this application;

[0025] Figure 2 This is a flowchart illustrating the execution of the dicing blade height measurement method in the embodiments of this application;

[0026] Figure 3 This is a diagram showing the distribution of the height measurement area and height measurement points in the first embodiment of this application;

[0027] Figure 4 This is a diagram showing the distribution of the height measurement area and height measurement points in the second embodiment of this application;

[0028] Figure 5 This is a diagram showing the distribution of the height measurement area and height measurement points in the third embodiment of this application. Detailed Implementation

[0029] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0032] The dicing blade is typically circular and is mounted on the spindle above the dicing stage. The spindle can raise and lower the dicing blade to adjust its height, and it can also rotate and translate the dicing blade at high speed to dic the wafer.

[0033] As described in the background section above, before the actual dicing is performed, the dicing blade needs to be measured to obtain its radius value. Then, based on the radius value of the dicing blade and the required distance between the dicing blade and the dicing table, the dicing height of the dicing blade required during the dicing process is calculated.

[0034] Existing methods for measuring the height of a dicing blade have the following problems: First, when there are abnormal areas (such as recessed or raised areas) on the dicing table, if one or more measurements fall within these abnormal areas, the obtained average height value will deviate significantly from the radius of the dicing blade. This will ultimately lead to an inaccurate determination of the blade's radius and may also damage the blade. Second, if the dicing blade is damaged (typically with a notch on the blade edge), using the average height value as the radius to calculate the actual dicing height will ultimately result in dicing failure.

[0035] To address the aforementioned problems with existing methods for measuring the height of dicing blades, this application provides a method for measuring the height of dicing blades that can accurately obtain the radius of the dicing blade by measuring its height, while avoiding damage when the dicing blade comes into contact with abnormal areas. Furthermore, this method prevents the measured height of the dicing blade from being used as its radius in cases where the dicing blade is damaged.

[0036] like Figure 1 As shown, the dicing blade height measurement method in this embodiment includes the following steps:

[0037] Step 100: Pre-determine the height measurement area on the marking table.

[0038] The height measurement area in this application is generally set as a rectangle.

[0039] The elevation measurement area can be flexibly selected based on the actual structure of the marking platform and specific elevation measurement requirements. For example, ... Figure 1 As shown, the entire surface of the marking platform 1 can be defined as the height measurement area.

[0040] For example Figure 2 As shown, one side of the marking platform 1 is defined as the height measurement area. Of course, a rectangular area of ​​a predetermined size at the center of the marking platform 1 can also be defined as the height measurement area.

[0041] Step 200: Perform anomaly detection on the height measurement area to identify and locate abnormal areas within the height measurement area. Abnormal areas either protrude upwards from the marking platform or are recessed downwards from the marking platform.

[0042] As those skilled in the art know, after prolonged use, the dicing stage 1 may wear down, resulting in recessed or raised areas, i.e., abnormal areas, appearing on its surface. If one or more measuring points fall within these abnormal areas, the average height of the dicing blade will deviate significantly from its radius, ultimately making it impossible to accurately determine the radius of the dicing blade.

[0043] Therefore, it is necessary to perform anomaly detection on the dicing stage 1 to detect these abnormal areas and locate them, so as to ensure that these abnormal areas can be avoided during subsequent height measurement and ultimately ensure that the radius of the dicing blade is accurately obtained.

[0044] Since the reflective properties of protruding or recessed abnormal areas are significantly different from those of normal smooth horizontal areas, abnormal areas can be accurately identified and located by acquiring images of the dicing platform 1 and analyzing the images of the height measurement area using image analysis technology.

[0045] Based on this consideration, the specific implementation process of anomaly detection in step 200 can be optionally as follows:

[0046] Images of the height measurement area are acquired using a high-resolution industrial camera.

[0047] Then, image analysis technology is used to analyze the images of the altimeter area to identify and locate abnormal areas within the altimeter area. In this way, the location information of the abnormal areas can be obtained.

[0048] Of course, other anomaly detection methods, such as using a laser rangefinder to perform a full scan of the dicing stage 1, can also be used to detect and locate abnormal areas.

[0049] To improve the efficiency of height measurement, an anomaly detection can be performed only once before the initial height measurement. Subsequent height measurements at each point can then use the location information of the anomaly area obtained from this initial detection as a reference to avoid those areas. Alternatively, to improve the accuracy of anomaly detection, an anomaly detection can be performed before each contact height measurement at every point.

[0050] Step 300: Control the dicing blade to contact several height measurement points within the height measurement area via the spindle to obtain several dicing blade height values. The contacted height measurement points avoid abnormal areas.

[0051] The following two examples will exemplify how to implement the method of avoiding abnormal areas at the height measurement point.

[0052] The first implementation method;

[0053] Before step 300, in which the spindle-controlled dicing blade contacts several height measurement points within the height measurement area, several height measurement points that avoid abnormal areas are first identified within the height measurement area. The specific process is as follows:

[0054] Step 1: Predetermine N height measurement points within the height measurement area, and arrange the N height measurement points evenly within the height measurement area.

[0055] To simplify the setup and ensure that the N height measurement points are evenly distributed on the marking platform 1, optionally, the N height measurement points are evenly arranged in rows and columns within the height measurement area. When there are multiple rows and columns of height measurement points, the spacing between points in the same row is set to be equal to the spacing between points in the same column.

[0056] For example Figure 3 As shown, 100 elevation measurement points are pre-determined within the elevation measurement area. These 100 points are distributed in 10 rows and 10 columns within the area, and the spacing between points in the same row and between points in the same column are set to the same predetermined value. For example... Figure 2As shown, 10 height measurement points are pre-determined within the height measurement area. These 10 height measurement points are distributed in 1 row and 10 columns within the height measurement area, and the spacing between the 10 height measurement points is set to be equal.

[0057] Optionally, in order to prevent the scribe blade from touching the edge of the scribe table 1 during the height measurement process and causing damage to the scribe blade, each height measurement point located on the periphery maintains a predetermined safe distance from the edge of the scribe table 1.

[0058] Step 2: Remove the elevation measurement points located in abnormal areas from the N elevation measurement points to obtain a number of elevation measurement points.

[0059] Since step 200 above has already located the abnormal areas within the altimeter area, it is possible to determine whether each of the N altimeter points is located within an abnormal area. This allows for the elimination of altimeter points located in abnormal areas, thus obtaining the required number of altimeter points for contact altimeter measurement.

[0060] For example Figure 1 As shown, four of the pre-determined 100 altimeter points (the black dots in the figure) were removed because they were located in an abnormal area, resulting in 96 usable altimeter points. For example... Figure 2 As shown, two of the 10 pre-determined height measurement points were removed because they were located in an abnormal area (as shown by the black dots in the figure), resulting in 8 usable height measurement points.

[0061] After determining several height measurement points that avoid abnormal areas, step 300 can be formally implemented, in which the spindle controls the dicing blade to contact several height measurement points within the height measurement area, thereby obtaining several dicing blade height values.

[0062] For example, targeting Figure 1 The system uses 96 height measurement points, which are then controlled by the spindle to sequentially measure the height of each point using a scriber, resulting in 96 scriber height values. During the measurement process, the scriber must continue rotating. This ensures that the position of the scriber contacting the height measurement point is different for each measurement.

[0063] The second implementation method;

[0064] Step 300, which involves controlling the dicing blade to contact several height measurement points within the height measurement area via the spindle, includes the following steps:

[0065] Step 1: Determine the height measurement stepping path within the height measurement area.

[0066] Optional, such as Figure 5 As shown, the height measurement stepping path includes four straight paths: the first straight path L1, the second straight path L2, the third straight path L3, and the fourth straight path L4. These four straight paths connect with the height measurement area ( Figure 5 The length or width direction of the area containing the dashed box in the text is parallel.

[0067] Step 2: Control the dicing blade to move along the height measurement stepping path via the spindle. Each stepping operation completes:

[0068] Determine whether the current height measurement point directly below the dicing blade is in an abnormal area. If so, control the dicing blade to step above the next height measurement point via the spindle. Otherwise, control the dicing blade to descend and contact the current height measurement point via the spindle to obtain a dicing blade height value.

[0069] In other words, in this embodiment, it is not necessary to predetermine the height measurement point. Instead, the scriber is controlled to move within the height measurement area (or traverse the height measurement area) through a preset height measurement stepping path. After each step, the point directly below the scriber is identified as a potential height measurement point. If this point is not in an abnormal area, it is determined as a usable height measurement point, and contact height measurement is performed to obtain a scriber height value. If the point is in an abnormal area, it is abandoned, and the scriber is controlled to move above the next potential height measurement point.

[0070] Continue with Figure 5 Taking the illustrated embodiment as an example, the spindle controls the dicing blade to perform step height measurement on the first straight path L1, the second straight path L2, the third straight path L3, and the fourth straight path L4 in sequence.

[0071] Specifically, for each straight path, first determine the starting point (the point on the left in the diagram), the ending point (the point on the right in the diagram), and the step distance for each step. Then, control the dicing blade via the spindle to move it from the starting point to the ending point until the height measurement of the straight path is complete. For example... Figure 5 As shown:

[0072] Stepping 9 times on the first straight path L1, 8 valid dicing blade height values ​​are obtained. Stepping 9 times on the second straight path L2, 10 valid dicing blade height values ​​are obtained. Stepping 9 times on the third straight path L3, 9 valid dicing blade height values ​​are obtained. Stepping 9 times on the fourth straight path L4, 9 valid dicing blade height values ​​are obtained.

[0073] Figure 5 In the example, the final dicing blade height value was 36.

[0074] Similarly, in order to prevent the scribe blade from touching the edge of the scribe table 1 during the height measurement process and causing damage to the scribe blade, the starting point and ending point of each straight path are kept at a predetermined safe distance from the edge of the scribe table 1.

[0075] Step 400: Calculate the difference between the maximum and minimum values ​​among several dicing blade height values. If the difference is less than a preset threshold, calculate the average value of several dicing blade height values ​​as the radius of the dicing blade.

[0076] The most typical type of damage to a scribe blade is a notch on the blade edge. The radius of the scribe blade at the notch location will be significantly smaller than the radius at other locations. During contact height measurement, the scribe blade rotates, so the position where it contacts the measuring point varies each time. The notch location (especially when the notch is long or numerous) will generally also contact the measuring point and obtain the corresponding scribe blade height value, which will be significantly smaller than the radius of the scribe blade at other locations.

[0077] Therefore, if the difference between the maximum and minimum values ​​of several dicing blade heights is less than a preset threshold, the dicing blade can be considered undamaged. Otherwise, the dicing blade may be damaged. The preset threshold can be set according to specific circumstances. For example, in some embodiments, the preset threshold is set to 10 micrometers, that is, when the difference between the maximum and minimum values ​​of several dicing blade heights is less than 10 micrometers, the dicing blade can be considered undamaged.

[0078] Assuming the dicing blade is not damaged, the average of several dicing blade height values ​​is calculated as the radius of the dicing blade. For example, Figure 3 The average of the 96 dicing blade height values ​​in the embodiment, Figure 4 The average of the eight dicing blade height values ​​in the embodiment, Figure 5 The average value of the 36 dicing blade height values ​​in the embodiments is the radius of the dicing blade obtained in the corresponding embodiments.

[0079] Compared with existing methods for measuring the height of a dicing blade, the method provided in this application has the following advantages: The measurement points used avoid abnormal areas, thus ensuring accurate measurement of the blade's radius and preventing damage when the blade contacts abnormal areas. Furthermore, by comparing the difference between the maximum and minimum dicing blade height values ​​with a preset threshold, the method prevents the measured blade height from being used as the blade's radius in cases where the blade is damaged.

[0080] Optional, such as Figure 2 As shown, the dicing blade height measurement method in this embodiment of the application further includes the following steps:

[0081] Step 500: If the difference between the maximum and minimum values ​​of the calculated dicing blade height is greater than or equal to a preset threshold, a damage detection test is performed on the dicing blade. If the dicing blade is damaged, it is replaced; otherwise, the dicing blade height is measured again.

[0082] As described earlier, if the difference between the maximum and minimum calculated height values ​​of the dicing blade is greater than or equal to a preset threshold (e.g., 10 micrometers), the dicing blade may be damaged. Alternatively, it's also possible that during the contact height measurement process, the dicing blade failed to actually contact the measuring point. Therefore, damage detection of the dicing blade is necessary to determine if it is damaged.

[0083] If damage inspection confirms that the dicing blade is damaged, it needs to be replaced with a new one. Since the new dicing blade is unworn and its radius can be directly obtained from the product model table, there is no need to perform height measurement again. Before starting the actual dicing process, the dicing height can be calculated directly using the obtained radius value of the new dicing blade.

[0084] If the dicing blade is confirmed to be undamaged after damage inspection, it means that the height measurement at some height measurement points has failed. Therefore, the height measurement operation of the dicing blade needs to be repeated, that is, steps 100 to 400 above need to be repeated.

[0085] In addition, this application also provides a dicing machine height measuring device, which includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes at least one program instruction to implement the dicing knife height measuring method as described in any of the above embodiments.

[0086] In addition, this application also provides a computer storage medium storing at least one program instruction, which is loaded and executed by a processor to implement the dicing blade height measurement method as described in any of the above embodiments.

[0087] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A method for measuring the height of a dicing blade, characterized in that, The method for measuring the height of a dicing blade to obtain its radius includes: Pre-determine the height measurement area on the marking platform; Anomaly detection is performed on the height measurement area to identify and locate abnormal areas within the height measurement area. The abnormal areas either protrude upwards from the grading platform or are recessed downwards into the grading platform. The spindle controls the dicing blade to contact several height measuring points within the height measuring area to obtain several dicing blade height values. During the height measuring process, the dicing blade continues to rotate. Each time a height is measured, the position of the dicing blade contacting the height measuring point is different. The several height measuring points contacted avoid the abnormal area. Calculate the difference between the maximum and minimum values ​​among the given dicing blade height values: If the difference is less than a preset threshold, the dicing blade is not damaged. The average of several dicing blade height values ​​is calculated as the radius of the dicing blade. If the difference is greater than or equal to the preset threshold, the dicing blade may be damaged, and damage detection should be performed on the dicing blade; If the dicing blade is damaged, replace it; otherwise, remeasure the height of the dicing blade. The anomaly detection of the height measurement area includes: Acquire an image of the height measurement area; By performing image analysis on the image of the height measurement area, abnormal areas within the height measurement area can be identified and located.

2. The dicing blade height measurement method as described in claim 1, characterized in that, Before the dicing blade, controlled by the spindle, contacts several height measuring points within the height measuring area, the dicing blade height measuring method includes: N height measurement points are predetermined within the height measurement area, and the N height measurement points are evenly distributed within the height measurement area; By removing the N height measurement points located in abnormal areas, a number of height measurement points are obtained.

3. The dicing blade height measurement method as described in claim 2, characterized in that, N height measurement points are evenly arranged in rows and columns within the height measurement area, wherein the distance between points in the same row is equal to the distance between points in the same column. The measuring point located on the periphery maintains a predetermined safe distance from the edge of the marking platform.

4. The dicing blade height measurement method as described in claim 1, characterized in that, The process of controlling the dicing blade to contact several height measuring points within the height measuring area via the spindle to obtain several dicing blade height values ​​includes: Determine the height measurement step path within the height measurement area; The dicing blade is controlled by the spindle to move along the height measurement stepping path. Each step is completed as follows: Determine whether the current height measurement point directly below the dicing blade is in an abnormal area. If so, control the dicing blade to step above the next height measurement point via the spindle. Otherwise, control the dicing blade to descend and contact the current height measurement point via the spindle to obtain a dicing blade height value.

5. The dicing blade height measurement method as described in claim 4, characterized in that, The height measurement stepping path includes at least one straight path, which is parallel to the length or width direction of the height measurement area. The stepping of the dicing blade along the height measuring stepping path by controlling the spindle includes: For each straight path, determine the step start point, step end point, and step distance value for each step on the straight path; The dicing blade is controlled by the spindle to move from the starting point to the ending point of the stepping.

6. The dicing blade height measurement method as described in claim 5, characterized in that: The height measurement stepping path includes at least two straight paths, and the stepping distance value is equal to the distance between the two adjacent straight paths; The starting and ending points of each step along the straight path maintain a predetermined safe distance from the edge of the grading table.

7. A height measuring device for a dicing machine, characterized in that, The dicing machine height measuring device includes a memory and a processor. The memory stores at least one program instruction, and the processor loads and executes at least one program instruction to implement the dicing blade height measuring method as described in any one of claims 1 to 6.

8. A computer storage medium, characterized in that, The computer storage medium stores at least one program instruction, which is loaded and executed by a processor to implement the dicing blade height measurement method as described in any one of claims 1 to 6.

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