A device and method for detecting the sealability of a wafer packaging bag

Abstract

The embodiment of the present application discloses a device and method for detecting the sealing property of a wafer packaging bag, the device comprising: two rollers for rolling along the longitudinal direction of a long-strip-shaped sealing part of the wafer packaging bag in a manner of clamping the sealing part and without changing the shape of the sealing part, wherein the sealing part is formed by two bag body parts of the wafer packaging bag being close to each other; an acquisition unit for acquiring the real-time distance between the two rollers during the rolling of the two rollers; a comparison unit for comparing the real-time distance with a reference distance; and a judgment unit for judging that the wafer packaging bag is not sealed when there is an out-of-limit distance greater than the reference distance in the real-time distance.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer manufacturing, and more particularly to an apparatus and method for detecting the sealing performance of wafer packaging bags. Background Technology

[0002] For the production of semiconductor wafers, it is usually necessary to first pull crystal rods using a crystal pulling furnace, then cut the crystal rods into multiple crystal rod segments, and then cut each crystal rod segment into thin initial wafers using methods such as multi-wire cutting. After the initial wafers undergo polishing, cleaning, and possible epitaxial processes, the finished wafers can be obtained.

[0003] Finished wafers leave the high-cleanliness environment and are transported under normal conditions before being shipped. Normal environments often contain a large number of contaminants such as particles and metals. If the product packaging is not properly sealed, it can easily contaminate the wafers, rendering them unusable and resulting in product waste. Therefore, testing the sealing effect before shipment has a significant impact on product quality.

[0004] Traditional inspection methods typically involve photographing the sealed area of ​​the wafer packaging bag and then performing image analysis or visual inspection. For image analysis, the results are easily affected by environmental factors such as shooting angle and lighting. Since the judgment accuracy of the image inspection system is relatively low, false detections are prone to occur. Moreover, it requires a stable camera system, a stable lighting system, and a stable image inspection system, resulting in high setup costs, maintenance costs, and maintenance difficulties. As for visual inspection, since it requires manual judgment, the judgment accuracy is relatively unstable, and it is easy to miss defects. Furthermore, it is difficult to trace defects after shipment. Summary of the Invention

[0005] To address the aforementioned technical problems, the present invention aims to provide an apparatus and method for detecting the sealing performance of wafer packaging bags, thereby avoiding various problems arising from image analysis and visual inspection after taking photos.

[0006] The technical solution of this invention is implemented as follows:

[0007] In a first aspect, embodiments of the present invention provide an apparatus for detecting the sealing performance of wafer packaging bags, the apparatus comprising:

[0008] Two rollers are used to roll along the longitudinal direction of the wafer packaging bag in a manner that clamps the elongated sealing portion of the wafer packaging bag without changing the shape of the sealing portion, wherein the sealing portion is formed by two bag body portions of the wafer packaging bag being close to each other;

[0009] An acquisition unit is used to acquire the real-time distance between the two rollers during the rolling process of the two rollers;

[0010] The comparison unit is used to compare the real-time spacing with the reference spacing;

[0011] The determination unit is used to determine that the wafer packaging bag is not sealed when there is an excessive gap in the real-time gap that is greater than the reference gap.

[0012] When using the apparatus according to the above embodiments of the present invention, it is easy to roll the two rollers along the sealing portion, and the acquisition of real-time spacing, comparison of real-time spacing with reference spacing, and determination of whether the wafer packaging bag is sealed can all be completed automatically. Unlike image analysis and inspection after taking a picture, it is no longer affected by environmental factors such as shooting angle and lighting, and it eliminates the need for complex systems such as cameras, lighting, and image detection, thus reducing costs. Furthermore, compared to manual judgment, it ensures judgment accuracy and enables traceability of defects.

[0013] Furthermore, for a more stringent test of the wafer packaging bag's seal, the reference spacing can be set smaller. This way, even a small gap between the two bag sections will indicate the wafer packaging bag is not sealed. Conversely, for a more lenient test, the reference spacing can be set larger. This way, only a significant gap between the two bag sections will indicate the wafer packaging bag is not sealed. Thus, the stringency of the test can be easily adjusted by changing the reference spacing.

[0014] Preferably, the acquisition unit includes:

[0015] A position sensor is used to detect the real-time position of the two rollers in the direction in which the sealing part is clamped;

[0016] A calculator for calculating the real-time distance based on the real-time location.

[0017] Preferably, the position sensor includes two sensor parts corresponding to the two rollers respectively, and each sensor part is configured to remain fixed relative to the rotation center of the corresponding roller.

[0018] In this way, each sensor component can move with the corresponding roller, thereby making the detected position more precise and thus enabling a more accurate determination of the sealing of the wafer packaging bag.

[0019] Preferably, the two rollers are respectively connected to the inner wall of the frame of the device by helical springs, the stiffness of the helical springs being between 50 N / m and 100 N / m, so that even if the helical springs are compressed during the rolling of the two rollers along the longitudinal direction of the sealing part, the resulting elastic restoring force will not cause the shape of the sealing part to change.

[0020] In this way, under the action of the helical spring, the two rollers can clamp the sealing part of the wafer packaging bag. In addition, since the stiffness of the helical spring is small or its flexibility is large, even if deformation occurs, it will not exert a large force on the sealing part through the rollers, thereby avoiding deformation of the sealing part and ensuring the accuracy of the sealing test.

[0021] Preferably, the device further includes a guide rail and a bracket, the bracket being provided with a guide rail mating part that matches the guide rail, so that the bracket can move along the guide rail, and the frame being disposed on the bracket so that when the bracket moves along the guide rail, the two rollers roll longitudinally along the sealing part.

[0022] In this way, guided by the guide rail, the two rollers can roll smoothly in a simpler way.

[0023] Preferably, the support includes a telescopic rod for moving the frame relative to the wafer packaging bag by extending or retracting it.

[0024] This ensures that the wafer packaging bag is positioned to avoid interference with the equipment during the testing process. For example, the telescopic rod can retract to position the frame away from the wafer packaging bag, and after the wafer packaging bag is in place, the telescopic rod can extend to position the frame in a position where testing can be performed.

[0025] Preferably, the bracket further includes a rotating rod disposed between the telescopic rod and the frame, the rotating rod being configured to be perpendicular to the telescopic rod and to rotate about the telescopic rod.

[0026] In this way, it can be ensured that the wafer packaging bag is positioned in a way that does not interfere with the equipment during the testing process. In addition, after the wafer packaging bag is in place, the frame can be used to perform the test by rotating the rotating rod.

[0027] Preferably, each roller is supported by a carrier, a first end of the helical spring is fixed to the carrier, a second end of the helical spring is fixed to the frame, and the frame is provided with a moving guide for guiding the carrier to move in the direction in which the sealing part is clamped.

[0028] In this way, as the roller moves in the direction in which it is clamped by the sealing part, it is guided not only by the helical spring but also by the guide groove, which makes the movement of the roller more stable and ensures the accuracy of the sealing test.

[0029] Secondly, embodiments of the present invention provide a method for detecting the sealing performance of wafer packaging bags, the method comprising:

[0030] Two rollers are made to roll along the longitudinal direction of the sealing portion in a manner that clamps the elongated sealing portion of the wafer packaging bag without changing the shape of the sealing portion, wherein the sealing portion is formed by the two bag body portions of the wafer packaging bag being close to each other;

[0031] The real-time distance between the two rollers is obtained during the rolling process of the two rollers;

[0032] Compare the real-time spacing with the reference spacing;

[0033] When there is an excessive gap in the real-time gap that is greater than the reference gap, it is determined that the wafer packaging bag is not sealed.

[0034] Preferably, obtaining the real-time distance between the two rollers includes:

[0035] Detect the real-time position of the two rollers in the direction in which the sealing part is clamped;

[0036] The real-time distance is calculated based on the real-time location. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of an apparatus for detecting the sealing performance of a wafer packaging bag according to an embodiment of the present invention, wherein the wafer packaging bag and its sealing portion are shown;

[0038] Figure 2 For along Figure 1 A sectional view diagram cut by line AA in the middle;

[0039] Figure 3 A graph representing the good sealing performance of the wafer packaging bag;

[0040] Figure 4 A graph illustrating poor sealing of wafer packaging bags;

[0041] Figure 5 This is a schematic diagram of the components of the acquisition unit of the apparatus according to an embodiment of the present invention;

[0042] Figure 6 This is a schematic diagram illustrating the arrangement of the two sensor portions of the position sensor in an embodiment of the present invention.

[0043] Figure 7 A schematic diagram illustrating how the two rollers of the device according to an embodiment of the present invention not only clamp the sealing portion of the wafer packaging bag but also do not change the shape of the sealing portion;

[0044] Figure 8 This is a schematic diagram of the guide rail, bracket, and the connection relationship between the frame and the bracket in a device according to an embodiment of the present invention;

[0045] Figure 9 This is a schematic diagram of a method for detecting the airtightness of wafer packaging bags according to an embodiment of the present invention. Detailed Implementation

[0046] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0047] See Figure 1 and Figure 2 This invention provides a device 1 for detecting the sealing performance of a wafer packaging bag B, specifically in... Figure 1 As shown, wafer W is housed in wafer cassette C, and wafer packaging bag B packages the wafer cassette C and the wafer W housed in the wafer cassette C as a whole. The device 1 may include:

[0048] As in Figure 1 and Figure 2 The two rollers 10 shown are used to roll along the longitudinal direction D1 of the sealing portion S in a manner that clamps the elongated sealing portion S of the wafer packaging bag B without changing the shape of the sealing portion S. Figure 1 The arrows near the rolling axes of the two rollers 10 schematically illustrate this rolling motion. Figure 2 The rolling is schematically illustrated by arrows within two rollers 10, wherein the sealing portion S is formed by the two bag portions B1 and B2 of the wafer packaging bag B being brought close together, wherein... Figure 1 The sealing part S is schematically shown in the part within the dashed box in the wafer packaging bag B. It can be understood that the body of the wafer packaging bag B is sheet-like. When the two different parts of the wafer packaging bag B are attached to each other or in a parallel manner, a seal can be formed on the wafer packaging bag B.

[0049] Acquisition unit 20 is used to acquire the real-time distance RS between the two rollers 10 during the rolling process, such as specifically in Figure 2 As shown in the figure, in addition, Figure 2 For example, the distance between the centers of the two rollers 10 is taken as the aforementioned spacing RS;

[0050] Comparison unit 30 is used to compare the real-time spacing RS with the reference spacing SS, where the reference spacing SS is... Figure 2 This is illustrated by the dashed arrow in the image;

[0051] Determination unit 40 is used to determine that the wafer packaging bag B is not sealed when there is an excess spacing OS greater than the reference spacing SS in the real-time spacing RS. Figure 2 As shown in the figure, when the two rollers 10 roll to the position indicated by the dotted line on the right, the distance between the two rollers 10 is greater than the reference distance SS, thus generating an over-limit distance OS.

[0052] Regarding the sealing of the wafer packaging bag B, it is understood that if the two bag portions B1 and B2 forming the sealing part S are generally flat or smooth, it indicates that there are no gaps between these two bag portions B1 and B2, thus achieving a relatively good seal. Conversely, if at least one of the two bag portions B1 and B2 forming the sealing part S is not flat but has wrinkles, such as... Figure 2 When the two rollers 10 roll to the position shown by the dotted line on the right, the corresponding local area indicates that there is a gap between the two bag parts B1 and B2, resulting in poor sealing. Therefore, in the apparatus 1 according to the above embodiment of the present invention, by rolling the two rollers 10 along the sealing portion S and simultaneously obtaining the distance between the two rollers 10, it is possible to determine whether the two bag parts B1 and B2 forming the sealing portion S are flat or have wrinkles, and thereby further determine whether the sealing performance of the wafer packaging bag B is good.

[0053] When using the apparatus 1 according to the above embodiment of the present invention, it is easy to roll the two rollers 10 along the sealing portion S, and the acquisition of the real-time pitch RS, the comparison of the real-time pitch RS with the reference pitch SS, and the determination of whether the wafer packaging bag B is sealed can all be completed automatically. Unlike image analysis and inspection after taking a picture, it is no longer affected by environmental factors such as shooting angle and lighting, and it eliminates the need for a complex system of cameras, lighting, and image detection, thus reducing costs. Furthermore, compared to manual judgment, it ensures judgment accuracy and allows for tracing the source of defects.

[0054] The detection results of the apparatus 1 according to the above embodiments of the present invention can also be reflected in, for example... Figure 3 and Figure 4 The graph shown in the image. Figure 3 and Figure 4Similarly, the horizontal axis X represents the position of the two rollers 10 as they roll along the sealing part S, and the vertical axis Y represents the real-time spacing RS obtained by the acquisition unit 20. Figure 3 In the middle, the real-time spacing RS is always less than the reference spacing SS, which means that... Figure 3 This indicates that the sealing of wafer packaging bag B is good. Figure 4 In the real-time spacing RS, a portion is larger than the reference spacing SS, meaning that... Figure 4 This indicates that the wafer packaging bag B has poor sealing or that the wafer packaging bag B is not sealed.

[0055] Understandably, if a stricter test is desired for the sealing of wafer packaging bag B, the reference spacing SS can be set to a smaller value. In this case, if there is a small gap between the two bag parts B1 and B2, wafer packaging bag B will be considered unsealed. Conversely, if a more lenient test is desired for the sealing of wafer packaging bag B, the reference spacing SS can be set to a larger value. In this case, wafer packaging bag B will only be considered unsealed if there is a large gap between the two bag parts B1 and B2.

[0056] In a preferred embodiment of the present invention, see Figure 5 The acquisition unit 20 may include:

[0057] Position sensor 21 is used to detect the real-time position of the two rollers 10 in the direction D2 where the sealing part S is clamped, as shown in [reference]. Figure 2 Easier to understand;

[0058] Calculator 22 is used to calculate the real-time spacing RS based on the real-time position detected by position sensor 21.

[0059] For example, when position sensor 21 detects Figure 2 The position of the upper center roller 10 is indicated by a first distance relative to a reference object in direction D2, which is detected by the position sensor 21. Figure 2 When the position of the lower center roller 10 is represented by the second distance in direction D2 relative to the same reference object, the calculator 22 calculates the difference between the first distance and the second distance to obtain the real-time spacing RS.

[0060] In a preferred embodiment of the present invention, see Figure 6 The position sensor 21 may include two sensor portions 21A and 21B corresponding to the two rollers 10 respectively, and each sensor portion 21A or 21B is configured to remain fixed relative to the rotation center 10C of the corresponding roller 10.

[0061] In this way, each sensor part 21A or 21B can follow the corresponding roller 10, thereby making the detected position more accurate and thus enabling a more accurate determination of the sealing performance of the wafer packaging bag B.

[0062] In a preferred embodiment of the present invention, see Figure 7 and combined Figure 2 The two rollers 10 can be connected to the inner wall of the frame 60 of the device 1 by means of a helical spring 50. The stiffness of the helical spring 50 can be between 50 N / m and 100 N / m, so that even if the helical spring 50 is compressed during the rolling of the two rollers 10 along the longitudinal direction D1 of the sealing part S, the resulting elastic restoring force will not cause the shape of the sealing part S to change.

[0063] In this way, under the action of the helical spring 50, the two rollers 10 can clamp the sealing part S of the wafer packaging bag B. In addition, since the stiffness of the helical spring 50 is small or its flexibility is large, even if it is deformed, it will not exert a large force on the sealing part S through the rollers 10, thereby avoiding deformation of the sealing part S and ensuring the accuracy of the sealing test.

[0064] In a preferred embodiment of the present invention, see Figure 8 and combined Figure 7 , Figure 1 and Figure 2 The device 1 may further include a guide rail 70 and a bracket 80. The bracket 80 may be provided with a guide rail mating part 81 that matches the guide rail 70, so that the bracket 80 can move along the guide rail 70, that is, when it is in contact with the guide rail 70, it can move along the guide rail 70. Figure 8 The page moves vertically, and the frame 60 can be set on the bracket 80 so that when the bracket 80 moves along the guide rail 70, the two rollers 10 roll along the longitudinal direction D1 of the sealing part S.

[0065] In this way, guided by the guide rail 70, the two rollers 10 can be made to roll smoothly in a simpler way.

[0066] In a preferred embodiment of the invention, see still Figure 8 The bracket 80 may include a telescopic rod 82, which is used for telescopic movement (e.g., in...) Figure 8 (Indicated schematically by a hollow arrow) the frame 60 is moved relative to the wafer packaging bag B.

[0067] This ensures that wafer packaging bag B is positioned appropriately for testing without interfering with device 1, for example, the telescopic rod 82 can retract to... Figure 8The position indicated by the dashed line is such that the frame 60 is positioned to avoid interference with the device 1. Additionally, after the wafer packaging bag B is in place, the telescopic rod 82 can extend to... Figure 8 The frame 60 is positioned as shown by the solid line in order to perform the detection.

[0068] In a preferred embodiment of the invention, see still Figure 8 The bracket 80 may also include a rotating rod 83 disposed between the telescopic rod 82 and the frame 60. The rotating rod 83 is configured to be perpendicular to the telescopic rod 82 and to rotate about the telescopic rod 82, as in... Figure 8 It is schematically shown by the arrow near the rotating rod 83.

[0069] In this way, it can be ensured that the wafer packaging bag B is positioned in a way that does not interfere with the device 1 during the inspection process. In addition, after the wafer packaging bag B is in place, the frame 60 can perform the inspection by rotating the rotating rod 83.

[0070] In a preferred embodiment of the invention, see [link to previous section] Figure 7 Each roller 10 can be supported by a carrier 90, the first end of the helical spring 50 can be fixed to the carrier 90, and the second end of the helical spring 50 can be fixed to the frame 60. Additionally, although not shown in detail in the accompanying drawings, the combination... Figure 7 It is easy to understand that the frame 60 may be provided with a moving guide for guiding the carrier 90 to move in the direction D2 where the sealing part S is clamped. For example, a guide groove may be formed in the frame 60, and the carrier 90 may be configured to match the guide groove so that the carrier 90 can move in the guide groove.

[0071] In this way, as the roller 10 moves in the direction D2 where the sealing part S is clamped, it is guided not only by the helical spring 50 but also by the guide groove, which makes the movement of the roller 10 more stable and ensures the accuracy of the sealing test.

[0072] See Figure 9 and combined Figure 1 and Figure 2 This invention also provides a method for detecting the sealing performance of a wafer packaging bag B, the method comprising:

[0073] S901: The two rollers 10 are rolled along the longitudinal direction D1 of the sealing part S in a manner that clamps the elongated sealing part S of the wafer packaging bag B without changing the shape of the sealing part S, wherein the sealing part S is formed by the two bag body parts B1 and B2 of the wafer packaging bag B being close to each other.

[0074] S902: Obtain the real-time distance RS between the two rollers 10 during the rolling process;

[0075] S903: Compare the real-time spacing RS with the reference spacing SS;

[0076] S904: When there is an excess spacing OS in the real-time spacing RS that is greater than the reference spacing SS, it is determined that the wafer packaging bag B is not sealed.

[0077] In a preferred embodiment of the present invention, obtaining the real-time distance RS between the two rollers 10 may include:

[0078] Detect the real-time position of the two rollers 10 in the direction D2 where the sealing part S is clamped;

[0079] The real-time spacing RS is calculated based on the real-time location.

[0080] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0081] It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict.

[0082] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An apparatus for detecting the sealing performance of wafer packaging bags, characterized in that, The device includes: Two rollers are used to roll along the longitudinal direction of the elongated sealing portion of the wafer packaging bag in a manner that clamps the sealing portion without changing its shape. The sealing portion is formed by two bag body portions of the wafer packaging bag being close to each other. The two rollers are respectively connected to the inner wall of the frame of the device by helical springs. The stiffness of the helical springs is between 50 N / m and 100 N / m, so that even if the helical springs are compressed during the rolling of the two rollers along the longitudinal direction of the sealing portion, the resulting elastic restoring force will not cause the shape of the sealing portion to change. An acquisition unit is used to acquire the real-time distance between the two rollers during the rolling process of the two rollers; The comparison unit is used to compare the real-time spacing with the reference spacing; The determination unit is used to determine that the wafer packaging bag is not sealed when there is an excessive gap in the real-time gap that is greater than the reference gap.

2. The apparatus according to claim 1, characterized in that, The acquisition unit includes: A position sensor is used to detect the real-time position of the two rollers in the direction in which the sealing part is clamped; A calculator for calculating the real-time distance based on the real-time location.

3. The apparatus according to claim 2, characterized in that, The position sensor includes two sensor parts corresponding to the two rollers respectively, and each sensor part is configured to remain fixed relative to the rotation center of the corresponding roller.

4. The apparatus according to claim 1, characterized in that, The device further includes a guide rail and a bracket. The bracket is provided with a guide rail mating part that matches the guide rail, so that the bracket can move along the guide rail. The frame is disposed on the bracket, so that when the bracket moves along the guide rail, the two rollers roll longitudinally along the sealing part.

5. The apparatus according to claim 4, characterized in that, The support includes a telescopic rod for moving the frame relative to the wafer packaging bag by extending and retracting.

6. The apparatus according to claim 5, characterized in that, The bracket also includes a rotating rod disposed between the telescopic rod and the frame, the rotating rod being configured to be perpendicular to the telescopic rod and to rotate about the telescopic rod.

7. The apparatus according to claim 1, characterized in that, Each roller is supported by a carrier, a first end of the helical spring is fixed to the carrier, a second end of the helical spring is fixed to the frame, and the frame is provided with a moving guide for guiding the carrier to move in the direction in which the sealing part is clamped.

8. A method for detecting the sealing performance of wafer packaging bags, characterized in that, The method is performed by the apparatus for detecting the airtightness of wafer packaging bags according to any one of claims 1 to 7, the method comprising: Two rollers are made to roll along the longitudinal direction of the sealing portion in a manner that clamps the elongated sealing portion of the wafer packaging bag without changing the shape of the sealing portion, wherein the sealing portion is formed by the two bag body portions of the wafer packaging bag being close to each other; The real-time distance between the two rollers is obtained during the rolling process of the two rollers; Compare the real-time spacing with the reference spacing; When there is an excessive gap in the real-time gap that is greater than the reference gap, it is determined that the wafer packaging bag is not sealed.

9. The method according to claim 8, characterized in that, The step of obtaining the real-time distance between the two rollers includes: Detect the real-time position of the two rollers in the direction in which the sealing part is clamped; The real-time distance is calculated based on the real-time location.

Images