Method for manufacturing an optical element

Abstract

An optical element and a manufacturing method of an optical element. The optical element includes a light-transmitting substrate, an optical layer, and a bonding layer. The optical layer is located on a surface of the light-transmitting substrate. The optical layer has a first surface and a second surface opposite to each other. The first surface is provided with a plurality of diffraction optical structures. The refractive index of the optical layer is 1 to 4. The bonding layer is sandwiched between the surface of the light-transmitting substrate and the second surface of the optical layer. The optical layer made of a high refractive index material is formed with a plurality of diffraction optical structures, so that an optical element with a higher diffraction angle can be obtained.

Description

Technical Field

[0001] This disclosure relates to an optical technology. More particularly, this disclosure relates to an optical element and a method for manufacturing the optical element. Background Technology

[0002] In the field of optics, the use of optical elements with high diffraction angles enables optical devices to achieve better optical performance. In traditional optical element manufacturing methods, an adhesive layer is first formed on a transparent substrate, and then the diffraction optical structure is directly imprinted into the adhesive layer. Therefore, refraction and diffraction are limited by the refractive index of the adhesive layer. Summary of the Invention

[0003] Therefore, one object of this disclosure is to provide an optical element and a method for manufacturing the optical element, wherein a plurality of diffraction optical structures are formed on an optical layer made of a high refractive index material, thereby obtaining an optical element with a higher diffraction angle.

[0004] To achieve the aforementioned objectives, this disclosure provides an optical element. This optical element includes a light-transmitting substrate, an optical layer, and an adhesive layer. The optical layer is located on the surface of the light-transmitting substrate. The optical layer has a first surface and a second surface opposite to each other. The first surface is provided with a plurality of diffraction optical structures. The refractive index of the optical layer is between 1 and 4. The adhesive layer is sandwiched between the surface of the light-transmitting substrate and the second surface of the optical layer.

[0005] According to one embodiment of this disclosure, the aforementioned adhesive layer comprises optically clear adhesive (OCA).

[0006] According to one embodiment of the present disclosure, the adhesive layer described above comprises a pressure-sensitive adhesive (PSA).

[0007] According to one embodiment of this disclosure, the refractive index of the aforementioned adhesive layer is 1 to 4.

[0008] To achieve the aforementioned objectives, this disclosure further discloses a method for manufacturing an optical element. In this method, a carrier plate is provided. A model layer is formed on the carrier plate. The model layer has a first surface and a second surface opposite to each other. The first surface is adjacent to the carrier plate, and the second surface is provided with a plurality of microstructures. The second surface of the model layer is subjected to an anti-adhesion treatment. After the anti-adhesion treatment, an optical layer is formed on the second surface of the model layer. The optical layer covers and fills the microstructures. A light-transmitting substrate is attached to the optical layer using an adhesive layer. The optical layer and the light-transmitting substrate are located on opposite sides of the adhesive layer. The carrier plate is removed from the model layer. The model layer is removed from the optical layer.

[0009] According to one embodiment of the present disclosure, the above-mentioned forming of the model layer on the carrier plate includes applying an adhesive layer on the carrier plate and forming microstructures on the surface of the adhesive layer to form the model layer.

[0010] According to one embodiment of the present disclosure, the formation of microstructures on the surface of the adhesive layer includes an imprinting step of pressing an imprinting mold onto the surface of the adhesive layer, curing the adhesive layer while the imprinting mold is pressed onto the surface of the adhesive layer, and removing the imprinting mold.

[0011] According to one embodiment of this disclosure, the cured adhesive layer includes ultraviolet light exposure treatment or thermal curing treatment.

[0012] According to one embodiment of the present disclosure, between providing a carrier plate and forming a model layer, the method further includes attaching an adhesive layer to the surface of the carrier plate, and the model layer being formed on the adhesive layer.

[0013] According to one embodiment of this disclosure, the aforementioned adhesive layer is an adhesive tape.

[0014] According to one embodiment of the present disclosure, the formation of the model layer includes coating an adhesive layer on an adhesive layer and forming microstructures on the surface of the adhesive layer to form the model layer.

[0015] According to one embodiment of the present disclosure, the removal of the carrier plate from the model layer includes: performing heat treatment to reduce the bonding force between the carrier plate and the adhesive layer; and separating the carrier plate from the adhesive layer.

[0016] According to one embodiment of the present disclosure, the removal of the carrier plate from the model layer includes laser ablation of the adhesive layer and separation of the carrier plate from the adhesive layer.

[0017] According to one embodiment of this disclosure, the removal of the carrier from the model layer includes an etching step of the carrier to reduce its size.

[0018] According to one embodiment of the present disclosure, the removal of the model layer from the optical layer includes adhering tape to the adhesive layer and using the tape to pull the adhesive layer away from the model layer from the optical layer.

[0019] According to one embodiment of the present disclosure, the removal of the model layer from the optical layer includes an etching step of the adhesion layer and the model layer.

[0020] According to one embodiment of the present disclosure, the removal of the model layer from the optical layer includes a chemical soaking step to remove the adhesive layer and the model layer.

[0021] According to one embodiment of the present disclosure, the above-mentioned anti-adhesion treatment includes depositing an anti-adhesion material on the second surface of the model layer, or performing a surface modification treatment on the second surface of the model layer.

[0022] According to one embodiment of the present disclosure, the formation of the optical layer includes using atomic layer deposition (ALD), etching, sputtering, vapor deposition, imprinting, or spin coating.

[0023] According to one embodiment of the present disclosure, the refractive index of the optical layer is 1 to 4.

[0024] According to one embodiment of the present disclosure, between forming the optical layer and attaching the light-transmitting substrate onto the optical layer, the above method further includes a plasma cleaning step of the optical layer.

[0025] According to one embodiment of this disclosure, the above-described plasma cleaning step includes the use of oxygen plasma. The cleaning method is not limited thereto.

[0026] According to one embodiment of the present disclosure, the above-mentioned attachment of the light-transmitting substrate to the optical layer using the adhesive layer includes attaching the adhesive layer to the optical layer and attaching the light-transmitting substrate to the adhesive layer.

[0027] According to one embodiment of the present disclosure, the adhesive layer described above comprises a pressure-sensitive adhesive.

[0028] According to one embodiment of the present disclosure, the above-mentioned method of attaching a light-transmitting substrate to an optical layer using an adhesive layer includes coating a transparent optical adhesive on the optical layer to form the adhesive layer, and attaching the light-transmitting substrate to the adhesive layer.

[0029] According to one embodiment of the present disclosure, the removal of the carrier plate from the model layer includes performing heat treatment to reduce the bonding force between the carrier plate and the model layer, and separating the carrier plate from the model layer.

[0030] According to one embodiment of this disclosure, the removal of the carrier from the model layer includes an etching step of the carrier to reduce its size.

[0031] According to one embodiment of this disclosure, the removal of the model layer from the optical layer includes an etching step of the model layer.

[0032] According to one embodiment of this disclosure, the removal of the model layer from the optical layer includes a chemical soaking step to remove the model layer.

[0033] According to one embodiment of the present disclosure, before forming the model layer on the carrier plate, the above method further includes a plasma cleaning step of the carrier plate. Attached Figure Description

[0034] A better understanding of the features disclosed herein can be obtained from the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the features are not drawn to scale. In fact, the dimensions of the features may be arbitrarily increased or decreased for clarity of discussion.

[0035] Figures 1 to 9 , Figure 10A , Figure 11 , Figure 12A , Figure 13, Figure 14 , Figure 15A ,and Figure 16 This is a schematic diagram illustrating an intermediate stage of a method for manufacturing an optical element according to one embodiment of the present disclosure;

[0036] Figure 10B This is a schematic diagram illustrating the formation of an adhesion layer on an optical layer according to another embodiment of the present disclosure;

[0037] Figure 12B This is a schematic diagram illustrating a laser ablation step of the adhesion layer according to another embodiment of the present disclosure;

[0038] Figure 12C This is a schematic diagram illustrating the etching steps of a substrate according to another embodiment of the present disclosure;

[0039] Figure 15B This is a schematic diagram illustrating the etching steps of the adhesion layer and the model layer according to another embodiment of this disclosure;

[0040] Figure 15C This is a schematic diagram illustrating the chemical soaking step of the adhesive layer and the model layer according to another embodiment of the present disclosure;

[0041] Figures 17 to 24 , Figure 25A , Figure 26 , Figure 27A ,and Figure 28A This is a schematic diagram illustrating an intermediate stage of a method for manufacturing an optical element according to one embodiment of the present disclosure;

[0042] Figure 25B This is a schematic diagram illustrating the formation of an adhesion layer on an optical layer according to another embodiment of the present disclosure;

[0043] Figure 27B This is a schematic diagram illustrating an etching step of a substrate according to another embodiment of the present disclosure;

[0044] Figure 28B This is a schematic diagram illustrating a chemical soaking step of the adhesive layer and the model layer according to another embodiment of the present disclosure.

[0045] [Symbol Explanation]

[0046] 100: Optical Components

[0047] 110: Carrier board

[0048] 112: Surface

[0049] 114: Surface

[0050] 120: Adhesive layer

[0051] 130: Fixture

[0052] 140: Roller

[0053] 150: Model Layer

[0054] 152: First Surface

[0055] 154: Second Surface

[0056] 156: Microstructure

[0057] 158: Adhesive layer

[0058] 158a: Surface

[0059] 158b: Pattern Structure

[0060] 160: Imprinting mold

[0061] 162: Pattern Structure

[0062] 170: Roller

[0063] 180: Optical layer

[0064] 182: Optical Materials

[0065] 183: First Surface

[0066] 184: Second Surface

[0067] 186: Diffraction optical structure

[0068] 190: Plasma

[0069] 192: Product

[0070] 200: Transparent substrate

[0071] 202: Surface

[0072] 210a: Next layer

[0073] 210b: Transparent optical adhesive

[0074] 220: Heat treatment

[0075] 230: Laser device

[0076] 240: Tape

[0077] 250: Etching agent

[0078] 252: Product

[0079] 260: Etching agent

[0080] 262: Product

[0081] 270: Chemicals

[0082] 272: Container

[0083] 280: Plasma

[0084] 282: Product

[0085] 290: Etching agent

[0086] 292: Product

[0087] 300: Chemicals

[0088] 302: Container

[0089] P1: Anti-adhesion material Detailed Implementation

[0090] The embodiments of this disclosure are discussed in detail below. However, it is understood that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific contexts. The embodiments discussed and disclosed are for illustrative purposes only and are not intended to limit the scope of this disclosure. All embodiments of this disclosure reveal many different features that can be implemented individually or in combination as needed.

[0091] Furthermore, the terms “first,” “second,” and similar terms used herein are not intended to indicate order or sequence, but are used only to distinguish elements or operations described using the same technical terms.

[0092] The spatial relationship between the two components described in this disclosure applies not only to the orientation shown in the accompanying drawings, but also to orientations not shown in the drawings, such as inverted orientations. Furthermore, the terms "connection," "electrical connection," or similar expressions used in this disclosure to refer to the two components are not limited to direct or electrical connections between the two components, but may also include indirect or electrical connections as needed.

[0093] Please refer to Figures 1 to 9 , Figure 10A , Figure 11 , Figure 12A , Figure 13 , Figure 14 , Figure 15A ,and Figure 16 This is a schematic diagram illustrating an intermediate stage of a method for manufacturing an optical element according to an embodiment of this disclosure. Manufacturing Figure 16 When providing the optical element 100, a carrier plate 110 can be provided first, such as... Figure 1 As shown. The carrier plate 110 can be a flat plate. For example, the carrier plate 110 has two opposing surfaces 112 and 114, wherein at least surface 112 is planar. The carrier plate 110 can be a glass plate. For example, the thickness of the carrier plate 110 can be 300 μm.

[0094] Next, the adhesive layer 120 can be attached to the surface 112 of the carrier plate 110, such as... Figure 2 As shown. Because the surface 112 of the carrier plate 110 is flat, the adhesive layer 120 can be smoothly attached to the surface 112. Please refer again. Figure 1 In some embodiments, the adhesive layer 120 is held in place by a clamp 130. Then, for example, a roller 140 can be used to press the adhesive layer 120 onto the surface 112 of the carrier plate 110. The adhesive layer 120 may be adhesive tape.

[0095] After the adhesive layer 120 is attached to the carrier plate 110, a layer can be formed on the adhesive layer 120. Figure 6 The model layer 150 is shown. The model layer 150 has a first surface 152 and a second surface 154, wherein the first surface 152 and the second surface 154 are opposite to each other. The first surface 152 is adjacent to the adhesive layer 120. For example, the first surface 152 may directly contact the adhesive layer 120. The second surface 154 is provided with a plurality of microstructures 156.

[0096] In some embodiments, when fabricating the model layer 150, an adhesive layer 158 is applied to the adhesive layer 120, such as... Figure 3 As shown. For example, an adhesive layer 158 can be formed on the adhesive layer 120 using a spin coating method. Next, microstructures 156 are formed on the surface 158a of the adhesive layer 158, thereby forming a model layer 150 having the microstructures 156. That is, the model layer 150 is composed of the adhesive layer 158. In some embodiments, when forming the microstructures 156, an imprinting step is performed on the surface 158a of the adhesive layer 158 using an imprinting mold 160. The imprinting mold 160 includes a pattern structure 162. In this imprinting step, as... Figure 4 and Figure 5 As shown, before the adhesive layer 158 has hardened, the embossing mold 160 presses onto the surface 158a of the adhesive layer 158, thus partially embedding the adhesive layer 158 into the pattern structure 162. The embossing step can be performed using a roller 170 to press the embossing mold 160 onto the surface 158a of the adhesive layer 158.

[0097] In some embodiments, such as Figure 5As shown, when the embossing mold 160 presses onto the surface 158a of the adhesive layer 158, the adhesive layer 158 is cured to maintain the shape of the surface 158a. Therefore, after curing, a pattern structure 158b, opposite to the pattern structure 162 of the embossing mold 160, is formed on the surface 158a of the adhesive layer 158. In some exemplary embodiments, ultraviolet (UV) light is used to cure the adhesive layer 158 to perform UV exposure treatment on the adhesive layer 158. In embodiments where UV light is used to cure the adhesive layer 158, the embossing mold 160 is transparent to UV light. Alternatively, UV light is used to thermally cure the adhesive layer 158. The adhesive layer 158 can be cured by thermal curing. The material of the embossing mold 160 can be, for example, a resin polymer, a metal, or an oxide, but the material of the embossing mold 160 is not limited to these. Next, as... Figure 6 As shown, the embossing mold 160 is removed, thus completing the fabrication of the microstructure 156 of the model layer 150.

[0098] After the model layer 150 is formed, the second surface 154 of the model layer 150 can be subjected to an anti-adhesion treatment. In some embodiments, such as Figure 7 As shown, during the anti-adhesion treatment, the stacked structure including the carrier plate 110, the adhesive layer 120, and the model layer 150 is flipped, and an anti-adhesion material P1 is deposited on the second surface 154 of the model layer 150 using, for example, vapor deposition. In another embodiment, during the anti-adhesion treatment, the second surface 154 of the model layer 150 is surface-modified to give the second surface 154 anti-adhesion properties. Plasma can be used for the surface modification treatment.

[0099] After anti-adhesion treatment, an optical layer 180 can be formed on the second surface 154 of the model layer 150 using methods such as atomic layer deposition, etching, sputtering, evaporation, imprinting, or spin coating. The optical layer 180 covers and fills the microstructures 156 of the model layer 150, such that a surface structure opposite to the morphology of the second surface 154 of the model layer 150 is formed on the optical layer 180. In some exemplary embodiments, such as... Figure 8 As shown, optical material 182 is deposited on the second surface 154 of the model layer 150 to form an optical layer 180 on the second surface 154. The optical layer 180 is formed of a high refractive index material. For example, the refractive index of the optical layer 180 may be from 1 to 4.

[0100] In some embodiments, after the optical layer 180 is formed, the stacked structure comprising the carrier plate 110, the adhesive layer 120, the model layer 150, and the optical layer 180 is flipped. Then, as... Figure 9As shown, an electroplating cleaning step can be selectively performed on optical layer 180 to clean optical layer 180 using plasma 190. For example, plasma 190 can be oxygen plasma. During the plasma cleaning step, product 192 is extracted. Product 192 can be water and / or carbon dioxide.

[0101] Next, as Figure 11 As shown, the light-transmitting substrate 200 can be attached to the optical layer 180 using the adhesive layer 210a, so the optical layer 180 and the light-transmitting substrate 200 are located on opposite sides of the adhesive layer 210a. The light-transmitting substrate 200 is a substrate with a high refractive index. In some exemplary embodiments, the light-transmitting substrate 200 may be a glass substrate or a fused silica substrate.

[0102] In some embodiments, such as Figure 10A As shown, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, an adhesive layer 210a is attached to the optical layer 180, and then the light-transmitting substrate 200 is placed on and attached to the adhesive layer 210a. In such an embodiment, the adhesive layer 210a is double-sided adhesive tape. The adhesive layer 210a may contain a pressure-sensitive adhesive. The adhesive layer 210a is transparent. The haze of the adhesive layer 210a may be, for example, less than 0.5%, but this disclosure is not limited thereto. In some exemplary embodiments, the material of the adhesive layer 210a is a high refractive index material. For example, the refractive index of the adhesive layer 210a may be from 1 to 4.

[0103] In some embodiments, such as Figure 10B As shown, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, a transparent optical adhesive 210b is coated onto the optical layer 180 to form an adhesive layer. The transparent optical adhesive 210b can be formed on the optical layer 180 by spin coating. Next, the light-transmitting substrate 200 is placed and attached to the adhesive layer composed of the transparent optical adhesive 210b. The haze of the transparent optical adhesive 210b may be, for example, less than 0.5%, but this disclosure is not limited thereto. In some exemplary embodiments, the material of the transparent optical adhesive 210b is a high refractive index material. For example, the refractive index of the transparent optical adhesive 210b may be from 1 to 4.

[0104] Next, as Figure 13 As shown, the carrier plate 110 is removed from the adhesive layer 120. In some embodiments, such as Figure 12A As shown, during the removal of the carrier plate 110, a heat treatment 220 is performed to reduce the bonding force between the carrier plate 110 and the adhesive layer 120. Therefore, after the heat treatment 220, the carrier plate 110 and the adhesive layer 120 can be more easily separated from each other. In another embodiment, as... Figure 12BAs shown, in the operation of removing the carrier plate 110, the adhesion layer 120 is first laser-etched using the laser device 230, so the carrier plate 110 and the adhesion layer 120 can be easily separated from each other. In another embodiment, as Figure 12C As shown, in the removal of carrier plate 110, an etchant 250 is used to etch the carrier plate 110 to reduce its size until it is removed. In embodiments where the carrier plate 110 is formed of silicon dioxide (SiO2), the etchant 250 may be hydrogen fluoride (HF), and the product 252 generated during the etching step is silicon tetrafluoride (SiF4) and water (H2O). In embodiments where the carrier plate 110 is formed of calcium metasilicate (CaSiO3), the etchant 250 may be hydrogen fluoride, and the product 252 is silicon tetrafluoride, water, and calcium fluoride (CaF2).

[0105] After the carrier plate 110 is removed, the adhesive layer 120 and the model layer 150 can be removed from the optical layer 180. The adhesive layer 120 and the model layer 150 can be removed simultaneously. For example, in the operation of removing the adhesive layer 120 and the model layer 150, such as... Figure 14 As shown, tape 240 can be adhered to adhesive layer 120. In some embodiments, tape 240 can be held in place by clamp 130. Then, roller 140 can be used to press tape 240 onto adhesive layer 120. Subsequently, as... Figure 15A and Figure 16 As shown, the adhesive layer 120 and the model layer 150 can be separated by tape 240 to complete the fabrication of the optical element 100.

[0106] Because the second surface 154 of the model layer 150 has been treated with an anti-adhesion coating, the bonding force between the second surface 154 of the model layer 150 and the optical layer 180 is less than the bonding force between the first surface 152 of the model layer 150 and the adhesive layer 120. Therefore, the model layer 150 can be successfully separated from the optical layer 180, and the adhesive layer 120 can be easily pulled apart from the model layer 150.

[0107] In other embodiments, such as Figure 15B As shown, in the operation of removing the adhesive layer 120 and the model layer 150, an etchant 260 is used to etch away the adhesive layer 120 and the model layer 150. For example, the etchant 260 may contain argon (Ar2) and chlorine (Cl2). During the etching step, some products 262 are generated and extracted.

[0108] In some other embodiments, such as Figure 15CAs shown, in the operation of removing the adhesive layer 120 and the model layer 150, a chemical immersion step is performed on the adhesive layer 120 and the model layer 150 by immersing them in a chemical reagent 270. For example, in the chemical immersion step, the stacked structure including the light-transmitting substrate 200, the adhesive layer 210a, the optical layer 180, the model layer 150, and the adhesive layer 120 is immersed in the chemical reagent 270 in a container 272. After immersion in the chemical reagent 270, the adhesive layer 120 and the model layer 150 can be removed from the optical layer 180. In some exemplary embodiments, the chemical reagent 270 is the EKC series residual remover developed by DuPont EKC Technologies.

[0109] Please continue to refer to Figure 16 The optical element 100 includes a light-transmitting substrate 200, an adhesive layer 210a, and an optical layer 180. The optical layer 180 has a first surface 183 and a second surface 184 located on opposite sides of the optical layer 180. The optical layer 180 is situated on the surface 202 of the light-transmitting substrate 200. The adhesive layer 210a is sandwiched between the surface 202 of the light-transmitting substrate 200 and the second surface 184 of the optical layer 180. After removing the model layer 150 from the first surface 183 of the optical layer 180, the first surface 183 forms a plurality of diffraction optical structures 186. For example, each diffraction optical structure 186 may be an inclined structure, a binary structure, a stepped structure, a triangular structure, or a trapezoidal structure.

[0110] Please refer to Figures 17 to 24 , Figure 25A , Figure 26 , Figure 27A ,and Figure 28A This is a schematic diagram illustrating an intermediate stage of a method for manufacturing an optical element according to an embodiment of the present disclosure. In this embodiment, the manufacturing process involves... Figure 16 When the optical element 100 is shown, a carrier plate 110 may be provided first. Before any material is formed on the carrier plate 110, a plasma cleaning step may be selectively performed on the carrier plate 110 to clean it using plasma 280. For example, the plasma may be oxygen plasma. During the plasma cleaning step, some products 282 are generated and extracted. Products 282 may be water and / or carbon dioxide. In embodiments where the carrier plate 110 is clean, the plasma cleaning step may be omitted.

[0111] Next, it can be formed directly on the surface 112 of the carrier plate 110. Figure 21 The model layer 150 is shown. A first surface 152 and a second surface 154 of the model layer 150 are opposite each other, with the first surface 152 adjacent to the carrier plate 110. For example, the first surface 152 may directly contact the surface 112 of the carrier plate 110. The second surface 154 is provided with a plurality of microstructures 156.

[0112] In some embodiments, such as Figure 18 As shown, when fabricating the model layer 150, an adhesive layer 158 can be applied to the surface 112 of the carrier plate 110 using, for example, spin coating. Next, microstructures 156 are formed on the surface 158a of the adhesive layer 158, thereby forming the model layer 150 having the microstructures 156. During the formation of the microstructures 156, an imprinting step can be performed on the surface 158a of the adhesive layer 158 using an imprinting die 160. In this imprinting step, as... Figure 19 and Figure 20 As shown, before the adhesive layer 158 has hardened, the embossing mold 160 is pressed onto the surface 158a of the adhesive layer 158, thus partially embedding the adhesive layer 158 into the pattern structure 162 of the embossing mold 160. The embossing step can be performed using a roller 170 to press the embossing mold 160 onto the surface 158a of the adhesive layer 158.

[0113] In some embodiments, such as Figure 20 As shown, when the impression mold 160 presses onto the surface 158a of the adhesive layer 158, the adhesive layer 158 is cured to maintain the shape of the surface 158a. After curing, a pattern structure 158b, opposite to the pattern structure 162 of the impression mold 160, is formed on the surface 158a of the adhesive layer 158. In the ultraviolet (UV) light embodiment, the adhesive layer 158 can be cured to perform UV light exposure treatment on the adhesive layer 158. The adhesive layer 158 is cured by thermal curing treatment using UV light. Alternatively, the adhesive layer 158 can be cured by thermal curing treatment. After curing, the impression mold 160 is removed, and the fabrication of the microstructure 156 of the model layer 150 is completed, as shown. Figure 21 As shown.

[0114] Next, an anti-adhesion treatment can be applied to the second surface 154 of the model layer 150. For example, such as... Figure 22 As shown, during the anti-adhesion treatment, the stacked structure including the carrier plate 110 and the model layer 150 is flipped, and then an anti-adhesion material P1 can be deposited on the second surface 154 of the model layer 150 by vapor deposition. In another embodiment, during the anti-adhesion treatment, the second surface 154 of the model layer 150 is surface-modified using, for example, plasma, to give the second surface 154 anti-adhesion properties.

[0115] After anti-adhesion treatment, an optical layer 180 can be formed on the second surface 154 of the model layer 150 using methods such as atomic layer deposition, etching, sputtering, evaporation, imprinting, or spin coating. Figure 23As shown, the optical layer 180 covers the microstructures 156 of the model layer 150 and fills the grooves of these microstructures 156, such that a surface structure opposite to the morphology of the second surface 154 of the model layer 150 is formed on the optical layer 180. During the formation of the optical layer 180, an optical material 182 is deposited on the second surface 154 of the model layer 150. The optical layer 180 is formed of a high refractive index material. For example, the refractive index of the optical layer 180 may be from 1 to 4.

[0116] In some embodiments, after the optical layer 180 is formed, the stacked structure including the carrier plate 110, the model layer 150, and the optical layer 180 is flipped. Then, as... Figure 24 As shown, an electroplating cleaning step can be selectively performed on optical layer 180 to clean it. The electroplating cleaning step is performed using plasma 190, such as oxygen plasma. During the electroplating cleaning step, product 192 is extracted. Product 192 can be water and / or carbon dioxide.

[0117] Subsequently, as Figure 26 As shown, the light-transmitting substrate 200 can be attached to the optical layer 180 using the adhesive layer 210a. Therefore, the optical layer 180 and the light-transmitting substrate 200 are located on opposite sides of the adhesive layer 210a.

[0118] In some embodiments, such as Figure 25A As shown, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, the adhesive layer 210a is first attached to the optical layer 180, and then the light-transmitting substrate 200 is placed on and attached to the adhesive layer 210a. In this embodiment, the adhesive layer 210a is double-sided adhesive tape. The adhesive layer 210a may contain a pressure-sensitive adhesive. The refractive index of the adhesive layer 210a may be from 1 to 4.

[0119] In some embodiments, such as Figure 25B As shown, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, a transparent optical adhesive 210b is applied to the optical layer 180 by, for example, spin coating to form an adhesive layer. Next, the light-transmitting substrate 200 is placed and attached to the adhesive layer composed of the transparent optical adhesive 210b. The refractive index of the transparent optical adhesive 210b can be from 1 to 4.

[0120] After attaching the light-transmitting substrate 200 to the optical layer 180, the carrier plate 110 is removed from the model layer 150. In some embodiments, such as Figure 27A As shown, during the removal of the carrier plate 110, a heat treatment 220 is performed to reduce the bonding force between the carrier plate 110 and the model layer 150. After the heat treatment 220, the carrier plate 110 and the model layer 150 can be separated from each other more easily.

[0121] In another embodiment, such as Figure 27B As shown, in the removal of carrier plate 110, an etchant 250 is used to etch the carrier plate 110 to reduce its size until it is removed. In embodiments where the carrier plate 110 is formed of silicon dioxide, the etchant 250 may be hydrogen fluoride, and the product 252 generated during the etching step is silicon tetrafluoride and water. In embodiments where the carrier plate 110 is formed of calcium metasilicate, the etchant 250 may be hydrogen fluoride, and the product 252 is silicon tetrafluoride, water, and calcium fluoride.

[0122] After the carrier plate 110 is removed, the model layer 150 can be removed from the optical layer 180. In some embodiments, such as Figure 28A As shown, in the operation of removing model layer 150, an etchant 290 is used to etch away model layer 150. For example, etchant 290 may contain argon and chlorine. During the etching step, some products 292 are generated and extracted.

[0123] In other embodiments, such as Figure 28B As shown, in the removal of the model layer 150, a chemical immersion step is performed by soaking the model layer 150 in a chemical solution 300. For example, in the chemical immersion step, the stacked structure including the light-transmitting substrate 200, the adhesive layer 210a, the optical layer 180, and the model layer 150 is immersed in the chemical solution 300 in a container 302. After immersion in the chemical solution 300, the model layer 150 can be removed from the optical layer 180, thus completing the fabrication of the optical element 100. In some exemplary embodiments, the chemical solution 300 is the EKC series residual remover developed by DuPont EKC Technologies.

[0124] As can be seen from the above embodiments, one advantage of this disclosure is that because many diffraction optical structures are formed on the optical layer made of a high refractive index material, an optical element with a higher diffraction angle can be obtained.

[0125] The features of several embodiments have been outlined above, thus enabling those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that they can readily use this disclosure as a basis to design or refine other processes and structures to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent architectures do not depart from the spirit and scope of this disclosure, and that various modifications, substitutions, and alternatives can be made without departing from the spirit and scope of this disclosure.

Claims

1. A method for manufacturing an optical element, characterized in that, The method includes: Provide a carrier board; An adhesive layer is attached to a surface of the carrier plate; A model layer is formed on the carrier plate, wherein the model layer is formed on the adhesive layer, the model layer has a first surface and a second surface opposite to each other, the first surface is adjacent to the carrier plate, and the second surface is provided with a plurality of microstructures; The second surface of the model layer is subjected to an anti-adhesion treatment. After the anti-adhesion treatment is performed, an optical layer is formed on the second surface of the model layer, wherein the optical layer covers and fills the plurality of microstructures; A light-transmitting substrate is attached to the optical layer using an adhesive layer, wherein the optical layer and the light-transmitting substrate are located on opposite sides of the adhesive layer. Remove the carrier plate from the model layer; and Removing the model layer from the optical layer, wherein removing the model layer from the optical layer includes: Adhere a piece of tape to the adhesive layer; and The adhesive tape is used to pull the adhesive layer away from the model layer and the optical layer.

2. The method as described in claim 1, characterized in that, The model layer formed on the carrier plate includes: Apply an adhesive layer to the carrier plate; and The plurality of microstructures are formed on one surface of the adhesive layer to form the model layer.

3. The method as described in claim 2, characterized in that, The plurality of microstructures formed on the surface of the adhesive layer include: An imprinting step is performed on the surface of the adhesive layer to press an imprinting mold onto the surface of the adhesive layer; When the embossing mold presses onto the surface of the adhesive layer, the adhesive layer is cured; and Remove the embossing mold.

4. The method as described in claim 3, characterized in that, Curing the adhesive layer involves either ultraviolet light exposure or a heat curing process.

5. The method as described in claim 1, characterized in that, The adhesive layer is a tape.

6. The method as described in claim 1, characterized in that, The model layer consists of: Apply an adhesive layer to the adhesive layer; and The plurality of microstructures are formed on one surface of the adhesive layer to form the model layer.

7. The method as described in claim 1, characterized in that, Removing the carrier plate from the model layer includes: A heat treatment is performed to reduce the bonding force between the carrier plate and the adhesive layer; and Separate the carrier plate from the adhesive layer.

8. The method as described in claim 1, characterized in that, Removing the carrier plate from the model layer includes: The adhesion layer was subjected to laser ablation; and Separate the carrier plate from the adhesive layer.

9. The method as described in claim 1, characterized in that, Removing the substrate from the model layer involves an etching step to reduce the size of the substrate.

10. The method as described in claim 1, characterized in that, Performing the anti-adhesion treatment includes depositing an anti-adhesion material on the second surface of the model layer, or performing a surface modification treatment on the second surface of the model layer.

11. The method as described in claim 1, characterized in that, The optical layer can be formed by using an atomic layer deposition method, an etching method, a sputtering method, a vapor deposition method, an imprinting method, or a spin coating method.

12. The method as described in claim 1, characterized in that, The refractive index of this optical layer is between 1 and 4.

13. The method as described in claim 1, characterized in that, Between forming the optical layer and attaching the light-transmitting substrate to the optical layer, the method further includes a plasma cleaning step for the optical layer.

14. The method as described in claim 13, characterized in that, The plasma cleaning process involves the use of oxygen plasma.

15. The method as described in claim 1, characterized in that, The process of attaching the light-transmitting substrate to the optical layer using the adhesive layer includes: The adhesive layer is attached to the optical layer; and The light-transmitting substrate is attached to the adhesive layer.

16. The method as described in claim 15, characterized in that, The adhesive layer contains a pressure-sensitive adhesive.

17. The method as described in claim 1, characterized in that, The process of attaching the light-transmitting substrate to the optical layer using the adhesive layer includes: A transparent optical adhesive is applied to the optical layer to form the adhesive layer; and The light-transmitting substrate is attached to the adhesive layer.

18. The method as described in claim 1, characterized in that, Removing the carrier plate from the model layer includes: A heat treatment is performed to reduce the bonding force between the carrier plate and the model layer; and Separate the carrier plate from the model layer.

19. The method as described in claim 1, characterized in that, Removing the substrate from the model layer involves an etching step to reduce the size of the substrate.

20. The method as described in claim 1, characterized in that, Before forming the model layer on the carrier, the method also includes a plasma cleaning step on the carrier.

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