Display module, manufacturing method thereof and mobile terminal

Abstract

The application discloses a display module, a manufacturing method thereof and a mobile terminal. The display module comprises a substrate, a driving circuit layer, a chip on film and a signal trace layer. The driving circuit layer is arranged on one side of the substrate. The chip on film is arranged on the side of the substrate away from the driving circuit layer. One end of the signal trace layer is connected with the driving circuit layer, and the other end of the signal trace layer is connected with the chip on film. The signal trace layer comprises a plurality of fan-out traces. The fan-out traces are arranged on the side of the substrate away from the driving circuit layer. The display module further comprises a sacrifice layer. The sacrifice layer is used for absorbing and / or reflecting laser. The sacrifice layer is arranged between the fan-out traces and the substrate. The orthographic projection of the plurality of fan-out traces on the sacrifice layer is located in the sacrifice layer. Therefore, the process of adding photoresist on the front side of the substrate to protect the driving circuit layer before the back side process of the existing display module can be omitted, and the process flow of the display module is simplified.

Description

Technical Field

[0001] This invention relates to the field of display, and in particular to a display module and its manufacturing method, as well as a mobile terminal. Background Technology

[0002] With the development of electronic technology, electronic devices such as mobile phones and tablets have become an indispensable part of people's daily life and work. Conventional display modules need to use module bonding processes such as flip-chip film or flexible circuit board bonding to input the driving signals required by the display module into the surface. Due to the limitations of the bonding process, the display module design usually needs to first gather the in-surface signal lines through the fan-out area and concentrate them on a small bonding area, and then bond the flip-chip film or flexible circuit board to this area to form an electrical connection area between the edges of the glass substrate, which makes the bezel area usually larger.

[0003] Currently, to reduce bezels, a common solution in existing display products is to fabricate fan-out traces and bonding terminals on the back of the display module substrate. This method requires signal traces to be placed on both the front and back of the display module substrate. On the one hand, this increases the back bonding process, leading to an increase in the photomask process, which in turn increases manufacturing costs and processing time. On the other hand, before fabricating the back process, photoresist needs to be added to the front of the substrate to protect the display circuit. This is to prevent the laser from shining through the traces and onto the display circuit when the traces are fabricated by laser engraving on the side of the substrate away from the display circuit, causing scratches and deterioration of the display circuit. At the same time, the substrate also needs to be flipped, making the manufacturing process of the display module cumbersome. Summary of the Invention

[0004] This application provides a display module and its manufacturing method, as well as a mobile terminal, to alleviate the shortcomings of related technologies.

[0005] To achieve the above effects, the technical solution provided in this application is as follows:

[0006] This application provides a display module, including:

[0007] Base;

[0008] A driving circuit layer is disposed on one side of the substrate;

[0009] A flip-chip thin film is disposed on the side of the substrate away from the driving circuit layer;

[0010] A signal trace layer, one end of which is connected to the driving circuit layer, and the other end of which is connected to the flip-chip film;

[0011] The signal trace layer includes multiple fan-out traces located on the side of the substrate away from the driving circuit layer. The display module also includes a sacrificial layer for absorbing and / or reflecting laser light. The sacrificial layer is located at least between the fan-out traces and the substrate, and the orthographic projection of the multiple fan-out traces onto the sacrificial layer is located within the sacrificial layer.

[0012] In the display module provided in this application embodiment, the sacrificial layer includes a reflective layer, which is one of a metal reflective layer, an inorganic reflective layer, or an organic reflective layer. The reflective layer is used to reflect the laser light that passes through the signal trace layer and irradiates the driving circuit layer.

[0013] In the display module provided in this application embodiment, the sacrificial layer includes a metal reflective layer and an insulating layer. The metal reflective layer is located between the insulating layer and the signal trace layer. The orthographic projection of the metal reflective layer on the insulating layer is located within the insulating layer. The orthographic projection of the multiple fan-out traces on the metal reflective layer is located within the metal reflective layer.

[0014] In the display module provided in the embodiments of this application, the thickness of the signal trace layer is greater than or equal to 1000 nanometers and less than or equal to 1500 nanometers; the thickness of the reflective layer is greater than or equal to 200 nanometers and less than or equal to 400 nanometers; and the thickness of the insulating layer is greater than or equal to 500 nanometers and less than or equal to 1000 nanometers.

[0015] In the display module provided in this application embodiment, the sacrificial layer includes an inorganic reflective layer, which is located between the substrate and the signal trace layer; the orthogonal projection of the multiple fan-out traces on the inorganic reflective layer is located within the inorganic reflective layer.

[0016] In the display module provided in the embodiments of this application, the reflective layer has a rough structure on the side near the substrate, and the shape of the rough structure is one or more of sawtooth, wavy and concave-convex.

[0017] In the display module provided in the embodiments of this application, the sacrificial layer includes a first sacrificial sublayer and a second sacrificial sublayer that are interconnected. The first sacrificial sublayer is located on the side of the substrate away from the driving circuit layer, and the second sacrificial sublayer extends from one end of the first sacrificial sublayer in a direction away from the flip-chip film, and the second sacrificial sublayer covers part of the side surface of the substrate.

[0018] In the display module provided in the embodiments of this application, the sacrificial layer includes a light-absorbing layer, which is used to absorb the laser light that passes through the signal trace layer and irradiates the driving circuit layer, and the absorption efficiency of the light-absorbing layer for the laser light is greater than the absorption efficiency of the substrate for the laser light light.

[0019] This application also provides a method for manufacturing a display module, including the following steps:

[0020] A substrate is provided on which a driving circuit layer is formed;

[0021] A sacrificial layer is formed on the side of the substrate away from the driving circuit layer, the sacrificial layer being used to absorb and / or reflect laser light;

[0022] A signal trace layer is formed on the side of the sacrificial layer away from the substrate. One end of the signal trace layer is connected to the driving circuit layer. The signal trace layer includes multiple fan-out traces located on the side of the substrate away from the driving circuit layer, and the orthogonal projection of the multiple fan-out traces on the sacrificial layer is located within the sacrificial layer.

[0023] A flip-chip film is provided, the flip-chip film is disposed on the side of the substrate away from the driving circuit layer, and the flip-chip film is connected to the other end of the signal trace.

[0024] This application embodiment also provides a mobile terminal, the mobile terminal including a terminal body and any of the above-described display modules, the terminal body and the display module being integrated into one unit.

[0025] The beneficial effects of this application embodiment are as follows: This application embodiment sets the signal trace layer to include multiple fan-out traces, which are located on the side of the substrate away from the driving circuit layer. The display module also includes a sacrificial layer, which is located at least between the multiple fan-out traces and the substrate. The orthographic projection of the multiple fan-out traces on the sacrificial layer is located within the sacrificial layer. The sacrificial layer is used to absorb / or reflect the laser light that shines on the driving circuit layer through the fan-out traces. This is to prevent the laser light from shining on the driving circuit layer through the fan-out traces when the fan-out traces are made by laser engraving on the side of the substrate away from the driving circuit layer, which would cause scratches and deterioration of the driving circuit layer, thereby improving the yield of the display module. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a first structure of the display module provided in an embodiment of this application;

[0028] Figure 2 for Figure 1 Enlarged schematic diagram of the intermediate reflective layer;

[0029] Figure 3 This is a schematic diagram of the structure of the second display module provided in the embodiments of this application;

[0030] Figure 4 This is a schematic diagram of the structure of the third display module provided in the embodiments of this application;

[0031] Figure 5 This is a schematic diagram of the structure of the fourth display module provided in the embodiments of this application;

[0032] Figure 6 This is a schematic diagram of the structure of the fifth display module provided in the embodiments of this application;

[0033] Figure 7 A flowchart illustrating the manufacturing method of the display module provided in the embodiments of this application;

[0034] Figures 8A to 8F for Figure 7 The diagram shows the structural process flow chart for the manufacturing of the display module. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] This application provides a display module, a method for manufacturing the same, and a mobile terminal. These will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0040] Please see Figures 1 to 8F This application provides a display module and its manufacturing method, as well as a mobile terminal. The display module 1 includes a substrate 11, a driving circuit layer 12, a flip-chip film 13, and a signal routing layer 141. The driving circuit layer 12 is disposed on the substrate 11. The flip-chip film 13 is disposed on the side of the substrate 11 away from the driving circuit layer 12. One end of the signal routing layer 141 is connected to the driving circuit layer 12, and the other end of the signal routing layer 141 is connected to the flip-chip film 13. The signal routing layer 141 includes multiple fan-out routing lines 141A, which are located on the side of the substrate 11 away from the driving circuit layer 12. The display module 1 also includes a sacrificial layer 142, which is used to absorb and / or reflect laser light. The sacrificial layer 142 is located at least between the fan-out routing lines 141A and the substrate 11, and the orthographic projection of the multiple fan-out routing lines 141A on the sacrificial layer 142 is located within the sacrificial layer 142.

[0041] It should be noted that, currently, in order to reduce bezels, a common solution in existing display products is to fabricate the fan-out traces and bonding terminals on the back of the display module substrate. This method requires signal traces to be set on both the front and back of the display module substrate. On the one hand, this increases the back bonding process, which leads to an increase in the photomask process, thereby increasing manufacturing costs and process time. On the other hand, before fabricating the back process, photoresist needs to be added to the front of the substrate to protect the display circuit. This is to prevent the laser from shining through the traces and onto the display circuit when the traces are fabricated by laser engraving on the side of the substrate away from the display circuit, causing scratches and deterioration of the display circuit. At the same time, the substrate also needs to be flipped, making the manufacturing process of the display module cumbersome.

[0042] It is understood that, in this embodiment of the application, the signal trace layer includes multiple fan-out traces located on the side of the substrate away from the driving circuit layer. The display module also includes a sacrificial layer, which is located at least between the fan-out traces and the substrate. The orthographic projection of the multiple fan-out traces onto the sacrificial layer is located within the sacrificial layer. The sacrificial layer is used to absorb / or reflect the laser light that shines on the driving circuit layer through the fan-out traces. This prevents the laser light from shining on the driving circuit layer through the fan-out traces when the fan-out traces are made by laser engraving on the side of the substrate away from the driving circuit layer, thus avoiding scratches and deterioration of the driving circuit layer. This improves the yield of the display module. At the same time, it eliminates the need for adding photoresist to the front of the substrate to protect the driving circuit layer before the back-side fabrication process of existing display modules, simplifying the process flow of the display module and further saving the manufacturing cost of the display module.

[0043] The technical solution of this application will now be described in conjunction with specific embodiments.

[0044] Example 1

[0045] Please see Figure 1 This is a schematic diagram of the first structure of the display module provided in the embodiments of this application.

[0046] This embodiment provides a display module 1, which includes a substrate 11, a driving circuit layer 12, a flip-chip film 13, and a signal routing layer 141. The driving circuit layer 12 is disposed on the substrate 11. The flip-chip film 13 is disposed on the side of the substrate 11 away from the driving circuit layer 12. One end of the signal routing layer 141 is connected to the driving circuit layer 12, and the other end of the signal routing layer 141 is connected to the flip-chip film 13.

[0047] Furthermore, in this embodiment, the substrate 11 can be a rigid substrate or a flexible substrate. When the substrate 11 is a rigid substrate, the material of the substrate 11 includes, but is not limited to, one of metal or glass. The material of the signal trace layer 141 includes, but is not limited to, at least one of the following metals: molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), and tungsten (W). Preferably, this embodiment uses glass as an example to illustrate the technical solution of this application.

[0048] In this embodiment, the signal routing layer 141 includes multiple fan-out routing lines 141A and multiple connection routing lines 141B. Each connection routing line 141B is configured corresponding to one fan-out routing line 141A. One end of each connection routing line 141B is connected to the driving circuit layer 12, and the other end of each connection routing line 141B is connected to one end of each fan-out routing line 141A. The other end of each fan-out routing line 141A is connected to the flip-chip film 13. The fan-out routing line 141A is located on the side of the substrate 11 away from the driving circuit layer 12.

[0049] Furthermore, the display module 1 also includes a sacrificial layer 142, which is used to absorb or reflect laser light. The sacrificial layer 142 is located at least between the fan-out trace 141A and the substrate 11. Specifically, in this embodiment, the sacrificial layer 142 is located between the fan-out trace 141A and the substrate 11. In another embodiment, such as... Figure 5 As shown, the sacrificial layer 142 includes a first sacrificial sublayer 1421 and a second sacrificial sublayer 1422 that are interconnected. The first sacrificial sublayer 1421 is located between the fan-out trace 141A and the substrate 11. The second sacrificial sublayer 1422 extends from one end of the first sacrificial sublayer 1421 in a direction away from the flip-chip film 13, and the second sacrificial sublayer 1422 covers at least a portion of the side surface of the substrate 11.

[0050] Specifically, in this embodiment, a fan-out region 100 is provided on the side of the substrate 11 away from the driving circuit layer 12, the fan-out trace 141A is located within the fan-out region 100, the sacrificial layer 142 includes a reflective layer 142A, the reflective layer 142A is one of a metal reflective layer 142A1, an inorganic reflective layer 142A2 or an organic reflective layer, the orthographic projection of the plurality of fan-out traces 141A on the reflective layer 142A is located within the reflective layer 142A, the reflective layer 142A is used to reflect the laser light that passes through the signal trace layer 141 and illuminates the driving circuit layer 12; preferably, the reflective layer 142A is a metal reflective layer 142A1, the material of the metal reflective layer 142A1 includes but is not limited to one of aluminum, copper or titanium.

[0051] It is understood that in this embodiment, the reflective layer 142A is set as a metal reflective layer 142A1, which is located between the fan-out trace 141A and the substrate 11. The orthographic projection of the multiple fan-out traces 141A on the reflective layer 142A is located within the reflective layer 142A. The metal reflective layer 142A1 is used to reflect the laser light that passes through the fan-out traces 141A and irradiates the driving circuit layer 12. This is to prevent the laser light from passing through the fan-out traces 141A and irradiating the driving circuit layer 12 when the fan-out traces 141A are made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, which would cause scratches and deterioration of the driving circuit layer 12, thereby improving the yield of the display module 1.

[0052] Furthermore, in this embodiment, the sacrificial layer 142 further includes an insulating layer 142B, and the metal reflective layer 142A1 is located between the insulating layer 142B and the signal trace layer 141. The orthographic projection of the metal reflective layer 142A1 onto the insulating layer 142B is located within the insulating layer 142B. Preferably, the material of the insulating layer 142B includes, but is not limited to, one of polyimide (PI), silicon oxide (SiOX), silicon nitride (SiNX), or aluminum oxide (AL2O3).

[0053] It is understood that, in this embodiment, the reflective layer 142A is a metal reflective layer 142A1, and the signal trace layer 141 is made of metal. By setting the metal reflective layer 142A1 between the insulating layer 142B and the signal trace layer 141, the orthographic projection of the metal reflective layer 142A1 on the insulating layer 142B is located within the insulating layer 142B, thereby avoiding direct contact between the metal reflective layer 142A1 and the signal trace layer 141, which would affect the signal transmission of the signal trace layer 141.

[0054] It should be noted that, in this embodiment, the thickness of the signal trace layer 141 is greater than or equal to 1000 nanometers and less than or equal to 1500 nanometers, the thickness of the reflective layer 142A is greater than or equal to 200 nanometers and less than or equal to 400 nanometers, and the thickness of the insulating layer 142B is greater than or equal to 500 nanometers and less than or equal to 1000 nanometers; wherein, the thickness of the signal trace layer 141 is preferably one of 1000 nanometers, 1200 nanometers, or 1400 nanometers, the thickness of the reflective layer 142A is preferably one of 200 nanometers, 300 nanometers, or 400 nanometers, and the thickness of the insulating layer 142B is preferably one of 500 nanometers, 700 nanometers, or 900 nanometers.

[0055] Furthermore, please combine Figure 1 and Figure 2 ;in, Figure 2 for Figure 1 A magnified schematic diagram of the middle reflective layer.

[0056] In this embodiment, the reflective layer 142A has a rough structure 1420A on the side near the substrate 11. The rough structure 1420A has a shape that is one or more of sawtooth, wavy, and concave-convex. Specifically, in this embodiment, the rough structure 1420A includes a plurality of grooves 1421A and a plurality of protrusions 1422A. The plurality of grooves 1421A are spaced apart from each other. Preferably, the plurality of grooves 1421A are equally spaced apart. The plurality of protrusions 1422A are spaced apart from each other. Preferably, the plurality of protrusions 1422A are equally spaced apart. The protrusions 1422A are arc-shaped structures.

[0057] It is understood that in this embodiment, by setting a rough structure 1420A on the side of the reflective layer 142A close to the substrate 11, when the fan-out trace 141A is made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, the rough structure 1420A is easily laser-etched away, thereby reducing the laser energy and thus reducing the risk of the driving circuit layer 12 being degraded by the laser.

[0058] It should be noted that, in Figure 1 and Figure 2In the illustrated embodiment, the display module 1 further includes a connection terminal 15, a plurality of light-emitting elements 16, and a driving circuit board 17. The connection terminal 15 is located on the side of the substrate 11 near the driving circuit layer 12, and the connection trace 141B is located on the side of the substrate 11 near the connection terminal 15. One end of the connection terminal 15 is connected to the driving circuit layer 12, and the other end of the connection terminal 15 is connected to the connection trace 141B. Specifically, the connection trace 141B includes, but is not limited to, silver paste or metal trace. Preferably, the connection trace 141B is a metal trace. The fan-out trace 141A and the connection trace 141B can be integrally formed, thereby simplifying the process flow of the display module 1 and saving the manufacturing cost of the display module 1.

[0059] The light-emitting element 16 is located on the side of the driving circuit layer 12 away from the substrate 11. The light-emitting element 16 is connected to the driving circuit layer 12. The light-emitting element 16 can be a mini light-emitting diode (Mini-LED) or a micro light-emitting diode (Micro-LED). An array of multiple light-emitting elements 16 is arranged on the substrate 11, and the size and row and column spacing of the light-emitting elements 16 can be set according to actual needs. The driving circuit board 17 is located on the side of the flip-chip film 13 away from the substrate 11. The driving circuit board 17 is connected to the flip-chip film 13. The driving circuit board 17 includes, but is not limited to, one of a printed circuit board (PCB) or a flexible printed circuit (FPC).

[0060] Example 2

[0061] Please see Figure 3 This is a schematic diagram of the structure of the second display module provided in the embodiments of this application.

[0062] In this embodiment, the structure of the display module is similar to / the same as the first structure of the display module provided in Embodiment 1 above. Please refer to the description of the display module in the above embodiments for details, which will not be repeated here. The difference between the two is:

[0063] In this embodiment, the reflective layer 142A is an inorganic reflective layer 142A2, and the orthographic projection of the multiple fan-out traces 141A on the inorganic reflective layer 142A2 is located within the inorganic reflective layer 142A2. The material of the inorganic reflective layer 142A2 includes, but is not limited to, silicon oxide (SiOX), silicon nitride (SiNX), or a stack thereof.

[0064] It is understood that in this embodiment, by setting the sacrificial layer 142 to include a reflective layer 142A, the reflective layer 142A being an inorganic reflective layer 142A2, the inorganic reflective layer 142A2 is used to reflect the laser light that passes through the fan-out trace 141A and irradiates the driving circuit layer 12, so as to avoid the laser light passing through the fan-out trace 141A and irradiating the driving circuit layer 12 when the fan-out trace 141A is made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, causing scratches and deterioration of the driving circuit layer 12, thereby improving the yield of the display module 1; at the same time, compared with the first embodiment, this embodiment does not require an insulating layer 142B between the reflective layer 142A and the signal trace layer 141, simplifying the process flow of the display module 1 and saving the manufacturing cost of the display module 1.

[0065] It is understood that the sacrificial layer 142 in this embodiment includes a reflective layer 142A, and the reflective layer 142A is an inorganic reflective layer 142A2. The materials of the inorganic reflective layer 142A2, including but not limited to silicon oxide (SiOX), silicon nitride (SiNX), or their stacks, are only used as examples. For example, in another embodiment, the reflective layer 142A is an organic reflective layer. That is, this embodiment does not specifically limit the material of the reflective layer 142A.

[0066] Example 3

[0067] Please see Figure 4 This is a schematic diagram of the structure of the third display module provided in the embodiments of this application.

[0068] In this embodiment, the structure of the display module is similar to / the same as the second structure of the display module provided in Embodiment 2 above. Please refer to the description of the display module in the above embodiments for details, which will not be repeated here. The difference between the two is:

[0069] In this embodiment, the sacrificial layer 142 includes a light-absorbing layer 142C, which is located between the fan-out traces 141A and the substrate 11. The orthographic projections of the multiple fan-out traces 141A onto the light-absorbing layer 142C are located within the light-absorbing layer 142C. The light-absorbing layer 142C is used to absorb the laser light that passes through the fan-out traces 141A and irradiates the driving circuit layer 12, so as to prevent the laser light from passing through the fan-out traces 141A and irradiating the driving circuit layer 12 when the fan-out traces 141A are made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, thus preventing the driving circuit layer from being damaged. The presence of scratches on layer 12 leads to degradation, thereby improving the yield of the display module 1. Simultaneously, it eliminates the need for adding photoresist on the front side of the substrate to protect the driving circuit layer 12 before the back-side processing of existing display modules, simplifying the display module's manufacturing process and further reducing production costs. Furthermore, by setting the light-absorbing layer 142C to have a higher laser absorption efficiency than the substrate 11, even with significant boundary deviations in the laser engraving process, the substrate 11 outside the sacrificial layer 142 will not be peeled off, thus improving the precision of the laser engraving process.

[0070] It should be noted that, in this embodiment, the material of the light-absorbing layer 142C may include a material that has strong absorption of laser light and can withstand high temperatures (e.g., ≥430°C), and this embodiment does not impose specific limitations on this.

[0071] Example 4

[0072] Please see Figure 5 This is a schematic diagram of the structure of the fourth display module provided in the embodiments of this application.

[0073] In this embodiment, the structure of the display module is similar to / the same as the first structure of the display module provided in Embodiment 1 above. Please refer to the description of the display module in the above embodiments for details, which will not be repeated here. The difference between the two is:

[0074] In this embodiment, the sacrificial layer 142 includes a first sacrificial sublayer 1421 and a second sacrificial sublayer 1422 that are interconnected. The first sacrificial sublayer 1421 is located on the side of the substrate 11 away from the driving circuit layer 12. The second sacrificial sublayer 1422 extends from one end of the first sacrificial sublayer 1421 in a direction away from the flip-chip film 13, and the second sacrificial sublayer 1422 covers at least a portion of the side surface of the substrate 11.

[0075] Specifically, in this embodiment, both the first sacrificial sublayer 1421 and the second sacrificial sublayer 1422 are used to reflect laser light. The first sacrificial sublayer 1421 includes a first reflective layer (not marked in the figure), and the second sacrificial sublayer 1422 includes a second reflective layer (not marked in the figure). Both the first and second reflective layers are metal reflective layers 142A1. The materials of the first and second reflective layers include, but are not limited to, aluminum, copper, or titanium. The first and second reflective layers can be integrally formed.

[0076] In this embodiment, the orthographic projection of the plurality of fan-out traces 141A on the first reflective layer is located within the first reflective layer; the orthographic projection of the connecting trace 141B on the side of the substrate 11 is located within the second reflective layer.

[0077] It is understood that in this embodiment, by setting the first reflective layer as a metal reflective layer 142A1, the orthographic projection of the multiple fan-out traces 141A on the first reflective layer is located within the first reflective layer. The first reflective layer is used to reflect the laser light that passes through the fan-out traces 141A and irradiates the driving circuit layer 12, so as to avoid the laser light passing through the fan-out traces 141A and irradiating the driving circuit layer 12 when the fan-out traces 141A are made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, which would cause scratches on the driving circuit layer 12 and deteriorate it, thereby improving the yield of the display module 1.

[0078] Meanwhile, by setting the second reflective layer as a metal reflective layer 142A1, the orthographic projection of the connecting trace 141B on the side of the substrate 11 is located within the second reflective layer. The second reflective layer is used to reflect the laser light that shines on the substrate 11 through the connecting trace 141B, so as to avoid the laser light shining on the substrate 11 through the connecting trace 141B when the connecting trace 141B is made on the side of the substrate 11 by laser engraving, which would cause scratches on the side of the substrate 11.

[0079] It should be noted that, in this embodiment, the first reflective layer and the second reflective layer can be integrally formed, thereby simplifying the process flow of the display module 1 and saving the manufacturing cost of the display module 1.

[0080] Furthermore, in this embodiment, the first sacrificial layer 142 further includes a first insulating layer (not marked in the figure), the first reflective layer is located between the first insulating layer and the fan-out trace 141A, and the orthographic projection of the first reflective layer on the first insulating layer is located within the first insulating layer; the second sacrificial layer 142 further includes a second insulating layer (not marked in the figure), the second reflective layer is located between the second insulating layer and the connection trace 141B, and the orthographic projection of the second reflective layer on the second insulating layer is located within the second insulating layer; wherein, the first insulating layer and the second insulating layer can be integrally formed.

[0081] Example 6

[0082] Please see Figure 6 This is a schematic diagram of the structure of the fifth display module provided in the embodiments of this application.

[0083] In this embodiment, the structure of the display module is similar to / the same as the first structure of the display module provided in Embodiment 1 above. Please refer to the description of the display module in the above embodiments for details, which will not be repeated here. The difference between the two is:

[0084] In this embodiment, the sacrificial layer 142 is used to absorb and reflect laser light. The sacrificial layer 142 includes a reflective layer 142A and a light-absorbing layer 142C. The reflective layer 142A is located between the fan-out trace 141A and the substrate 11. The light-absorbing layer 142C is located between the reflective layer 142A and the fan-out trace 141A. The orthographic projection of the multiple fan-out traces 141A on the light-absorbing layer 142C is located within the light-absorbing layer 142C. The orthographic projection of the light-absorbing layer 142C on the substrate 11 completely overlaps with the orthographic projection of the reflective layer 142A on the substrate 11.

[0085] It is understood that in this embodiment, the sacrificial layer 142 includes a reflective layer 142A and a light-absorbing layer 142C. The light-absorbing layer 142C is used to absorb the laser light that passes through the fan-out trace 141A and irradiates the driving circuit layer 12. The reflective layer 142A is used to reflect the laser light that passes through the light-absorbing layer 142C and irradiates the driving circuit layer 12. This is to prevent the laser light from passing through the fan-out trace 141A and irradiating the driving circuit layer 12 when the fan-out trace 141A is made by laser engraving on the side of the substrate 11 away from the driving circuit layer 12, which would cause scratches and deterioration of the driving circuit layer 12, thereby improving the yield of the display module 1.

[0086] Furthermore, the reflective layer 142A includes, but is not limited to, one of a metal reflective layer, an inorganic reflective layer, or an organic reflective layer. The material of the light-absorbing layer 142C may include a material that has strong absorption properties for laser light and can withstand high temperatures (e.g., ≥430°C). However, when the reflective layer 142A is a metal reflective layer, the light-absorbing layer 142C may be an insulating layer. By setting the orthographic projection of the light-absorbing layer 142C on the substrate 11 to overlap with the orthographic projection of the reflective layer 142A on the substrate 11, direct contact between the metal reflective layer and the signal trace layer is avoided, thus preventing the signal transmission of the signal trace layer 141 from being affected.

[0087] This embodiment also provides a method for manufacturing a display module. Please refer to... Figure 1 , Figure 7 as well as Figures 8A to 8E ;in, Figure 7 A flowchart illustrating the manufacturing method of the display module provided in the embodiments of this application; Figures 8A to 8E for Figure 7 The diagram shows the structural process flow chart for the manufacturing of the display module.

[0088] It should be noted that this embodiment only describes the manufacturing method of the display module 1 provided in Embodiment 1 above, while the manufacturing methods of the display module 1 provided in Embodiments 2 to 4 are similar to the manufacturing method of the display module 1 provided in Embodiment 1, and this embodiment will not elaborate on them further.

[0089] In this embodiment, the method for manufacturing the display module includes the following steps:

[0090] Step S10: Provide a substrate 11, and form a driving circuit layer 12 on the substrate 11, wherein a fan-out region 100 is provided on the side of the substrate 11 away from the driving circuit layer 12, such as... Figure 8A As shown.

[0091] It should be noted that the substrate 11 can be a rigid substrate, and the material of the substrate 11 includes, but is not limited to, metal or glass; the driving circuit layer 12 includes components such as thin film transistors, which can be referred to in the prior art and will not be described in detail here.

[0092] Step S20: A sacrificial layer 142 is formed on the side of the substrate 11 away from the driving circuit layer 12. The sacrificial layer 142 is used to absorb and / or reflect laser light. Further, the sacrificial layer 142 is located within the fan-out region 100.

[0093] Specifically, in this embodiment, step S20 includes the following steps:

[0094] Step S21: A protective film 18 is formed on both the front and back sides of the substrate 11, such as... Figure 8B As shown.

[0095] It should be noted that, in this embodiment, the front side of the substrate 11 is the side of the substrate 11 close to the driving circuit layer 12, and the back side of the substrate 11 is the side of the substrate 11 away from the driving circuit layer 12. The material of the protective film 18 includes, but is not limited to, polyimide (PI). On the back side of the substrate 11, the protective film 18 is located in the area outside the fan-out region 100.

[0096] Step S22: A reflective layer 142A is formed on the back side of the substrate 11. The reflective layer 142A covers the protective film 18, and at least a portion of the reflective layer 142A is located within the fan-out region 100, such as... Figure 8C As shown.

[0097] Specifically, the reflective layer 142A is a metal reflective layer 142A1, and the material of the metal reflective layer 142A1 includes, but is not limited to, aluminum, copper or titanium. The method of fabricating the reflective layer 142A includes forming a metal layer on the back side of the substrate 11 using a physical vapor deposition (PVD) process.

[0098] Step S23: An insulating layer 142B is formed on the back side of the substrate 11, the insulating layer 142B covering the reflective layer 142A, and at least a portion of the insulating layer 142B is located within the fan-out region 100, such as... Figure 8D As shown.

[0099] Specifically, the material of the insulating layer 142B includes, but is not limited to, one of polyimide (PI), silicon oxide (SiOX), silicon nitride (SiNX), or aluminum oxide (AL2O3). Within the fan-out region 100, the orthographic projection of the insulating layer 142B on the substrate 11 covers the orthographic projection of the reflective layer 142A on the substrate 11.

[0100] Step S30: A signal trace layer 141 is formed on the side of the sacrificial layer 142 away from the substrate 11. One end of the signal trace layer 141 is connected to the driving circuit layer 12. The signal trace layer 141 includes a plurality of fan-out traces 141A. The fan-out traces 141A are located on the side of the substrate 11 away from the driving circuit layer 12, and the orthogonal projection of the plurality of fan-out traces 141A on the sacrificial layer 142 is located within the sacrificial layer 142.

[0101] Specifically, in this embodiment, step S30 includes the following steps:

[0102] Step S31: A signal routing layer 141 is formed on the front side, the back side, and the side surface of the substrate 11. The signal routing layer 141 covers the insulating layer 142B, and at least a portion of the signal routing layer 141 is located within the fan-out region 100, such as... Figure 8E As shown.

[0103] Specifically, the material of the signal trace layer 141 includes, but is not limited to, at least one metal selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), and tungsten (W).

[0104] Step S32: Remove the protective film 18, and use laser engraving technology to form multiple fan-out traces 141A in the fan-out area 100, and multiple connecting traces 141B on the front and side of the substrate 11, as shown. Figure 8F As shown.

[0105] One end of the connecting trace 141B is connected to the driving circuit layer 12, and the other end of the connecting trace 141B is connected to one end of the fan-out trace 141A.

[0106] Step S40: Provide a flip-chip film 13, the flip-chip film 13 is disposed on the side of the substrate 11 away from the driving circuit layer 12, and the flip-chip film 13 is connected to the other end of the signal trace 141.

[0107] Step S50: Provide a driving circuit board 17, which is connected to the flip-chip film 13.

[0108] This embodiment provides a mobile terminal, which includes a terminal body and a display module as described in any of the above embodiments, wherein the terminal body and the display module are integrated into one unit.

[0109] It is understood that the display module has been described in detail in the above embodiments, and will not be repeated here.

[0110] In specific applications, the mobile terminal can be the display screen of devices such as smartphones, tablets, laptops, smart bracelets, smartwatches, smart glasses, smart helmets, desktop computers, smart TVs, or digital cameras, and can even be applied to electronic devices with flexible displays.

[0111] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0112] The above provides a detailed description of a display module and its manufacturing method, as well as a mobile terminal, provided by the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, characterized in that, include: Base; A driving circuit layer is disposed on one side of the substrate; A flip-chip thin film is disposed on the side of the substrate away from the driving circuit layer; A signal trace layer, one end of which is connected to the driving circuit layer, and the other end of which is connected to the flip-chip film; The signal trace layer includes multiple fan-out traces located on the side of the substrate away from the driving circuit layer. The display module also includes a sacrificial layer comprising a metal reflective layer and a light-absorbing layer. The metal reflective layer reflects laser light passing through the signal trace layer and illuminating the driving circuit layer, while the light-absorbing layer absorbs the laser light passing through the signal trace layer and illuminating the driving circuit layer. The light-absorbing layer is located between the metal reflective layer and the fan-out traces, and the orthographic projection of the multiple fan-out traces onto the light-absorbing layer lies within the light-absorbing layer. The light-absorbing layer is an insulating layer, and the orthographic projection of the light-absorbing layer onto the substrate completely overlaps with the orthographic projection of the metal reflective layer onto the substrate.

2. The display module according to claim 1, characterized in that, The thickness of the signal trace layer is greater than or equal to 1000 nanometers and less than or equal to 1500 nanometers; the thickness of the reflective layer is greater than or equal to 200 nanometers and less than or equal to 400 nanometers; and the thickness of the insulating layer is greater than or equal to 500 nanometers and less than or equal to 1000 nanometers.

3. The display module according to claim 1, characterized in that, The reflective layer has a rough structure on the side near the substrate, and the rough structure is one or more of the following shapes: sawtooth, wavy, and concave-convex.

4. The display module according to claim 1, characterized in that, The sacrificial layer includes a first sacrificial sublayer and a second sacrificial sublayer that are interconnected. The first sacrificial sublayer is located on the side of the substrate away from the driving circuit layer. The second sacrificial sublayer extends from one end of the first sacrificial sublayer in a direction away from the flip-chip film and covers a portion of the side surface of the substrate.

5. The display module according to claim 1, characterized in that, The light-absorbing layer has a higher laser absorption efficiency than the substrate.

6. A method for manufacturing a display module, characterized in that, Includes the following steps: A substrate is provided on which a driving circuit layer is formed; A sacrificial layer is formed on the side of the substrate away from the driving circuit layer. The sacrificial layer includes a metal reflective layer and a light-absorbing layer. The metal reflective layer is used to reflect the laser light that passes through the signal trace layer and illuminates the driving circuit layer, and the light-absorbing layer is used to absorb the laser light that passes through the signal trace layer and illuminates the driving circuit layer. A signal trace layer is formed on the side of the sacrificial layer away from the substrate. One end of the signal trace layer is connected to the driving circuit layer. The signal trace layer includes multiple fan-out traces located on the side of the substrate away from the driving circuit layer. A light-absorbing layer is located between the metal reflective layer and the fan-out traces, and the orthogonal projections of the multiple fan-out traces on the light-absorbing layer are located within the light-absorbing layer. The light-absorbing layer is an insulating layer, and the orthogonal projection of the light-absorbing layer on the substrate overlaps with the orthogonal projection of the metal reflective layer on the substrate. A flip-chip film is provided, the flip-chip film is disposed on the side of the substrate away from the driving circuit layer, and the flip-chip film is connected to the other end of the signal trace.

7. A mobile terminal, characterized in that, The mobile terminal includes a terminal body and a display module as described in any one of claims 1-5, wherein the terminal body and the display module are integrated into one unit.

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