Wafer post-processing apparatus

Abstract

The application discloses a wafer post-processing device, which comprises a box body, a clamping assembly arranged in the box body and used for clamping and driving the wafer to rotate, a rolling brush arranged in the box body and used for brushing the wafer, and a liquid guide assembly which can be moved to the lower side of the rolling brush to receive and / or guide the liquid drops dropped from the rolling brush and prevent the wafer from being polluted.

Description

Technical Field

[0001] This invention belongs to the field of wafer post-processing technology, and more specifically, relates to a wafer post-processing apparatus. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, dicing, packaging, and testing.

[0003] Chemical Mechanical Polishing (CMP) is one of the five core processes in wafer manufacturing. It is an ultra-precision surface processing technology that achieves global planarization. After CMP, wafers require post-processing such as cleaning and drying to prevent contamination of semiconductor devices by trace ions and metal particles, thus ensuring the performance and yield of semiconductor devices.

[0004] Wafer cleaning methods include roller brush cleaning and megasonic cleaning, among which roller brush cleaning is one of the most commonly used methods. Depending on the state of the wafer being cleaned, roller brush cleaning is further divided into vertical roller brush cleaning and horizontal roller brush cleaning.

[0005] During horizontal wafer cleaning, the cleaning brush is located on the upper and / or lower side of the wafer, and liquid is introduced into it to keep it in an immersion state; the cleaning brush rolls around its own axis and contacts the wafer surface, while the liquid supply unit sprays cleaning liquid toward the wafer surface to remove particles attached to the wafer surface.

[0006] During wafer cleaning, particles detached from the wafer surface may adhere to the cleaning brush surface, and these particles can mix with the internal liquid to form a contaminant solution. After the wafer cleaning is complete, the contaminant droplets on the cleaning brush will fall off under gravity; however, if the cleaning brush is located on top of the wafer, the contaminant solution on it will fall directly onto the wafer surface, affecting the cleaning effect.

[0007] In existing technologies, cleaning brushes are moved horizontally toward the outside of the wafer to prevent droplets from falling onto the wafer surface, such as... Figure 1 As shown. However, this method cannot prevent contaminant droplets from falling onto the wafer surface during the movement of the cleaning brush, which will affect the post-processing effect of the wafer. Summary of the Invention

[0008] This invention provides a wafer post-processing apparatus, which aims to at least solve one of the technical problems existing in the prior art.

[0009] An embodiment of the present invention provides a wafer post-processing apparatus, comprising:

[0010] Box;

[0011] Clamping assembly, located in the housing, is used to clamp and drive the wafer to rotate;

[0012] A roller brush, installed inside the housing, is used to clean the wafers;

[0013] A liquid guiding component that can move to the underside of the roller brush to catch and / or guide droplets falling from the roller brush to prevent contamination of the wafer.

[0014] In some embodiments, the liquid guiding assembly includes a liquid guiding element whose shape matches that of the roller brush.

[0015] In some embodiments, the liquid guiding element is a rectangular groove with openings at both ends, and the bottom of the rectangular groove is provided with a guiding surface to guide the droplets thereon toward both sides.

[0016] In some embodiments, the guide surface extends downward and outward from the center of the liquid guiding element.

[0017] In some embodiments, the liquid guiding element is provided with a pair of guiding surfaces, the included angle between the guiding surfaces being less than or equal to 170°.

[0018] In some embodiments, the liquid guiding element is made of a hydrophobic material.

[0019] In some embodiments, the liquid guiding assembly further includes at least one connecting rod fixed to the liquid guiding member; the liquid guiding member is capable of oscillating and moving to the underside of the roller brush.

[0020] In some embodiments, the wafer post-processing apparatus further includes a purging assembly disposed in a housing and capable of spraying gas toward a guide liquid element to remove droplets adhering thereto.

[0021] In some embodiments, the liquid guiding component is provided with multiple Peltier elements that are evenly distributed inside the component.

[0022] In some embodiments, when the liquid guiding element is located below the roller brush, the cooling section of the Peltier element is activated to freeze the droplets falling from the roller brush; when the liquid guiding element is away from the roller brush, the heating section of the Peltier element is activated to heat and remove the frozen droplets.

[0023] The beneficial effects of this invention include:

[0024] a. Configure a liquid guiding component for the wafer post-processing unit, wherein the liquid guiding component can be moved to the underside of the roller brush to prevent contaminant liquid (droplets) on the roller brush from falling onto the wafer surface, so as to obtain a good cleaning effect;

[0025] b. The shape and size of the liquid guiding component are matched with the roller brush to reduce space occupation, expand the working space inside the wafer post-processing device, and improve the convenience of operation.

[0026] c. The liquid guiding component is equipped with a pair of guiding surfaces to guide the falling droplets toward both ends of the liquid guiding component, that is, to guide the droplets to the outside of the wafer, so as to avoid the impact of the falling droplets on the wafer cleaning effect.

[0027] d. The wafer post-processing unit is equipped with a purging assembly to spray gas toward the liquid guide when the liquid guide is deflected to the side of the roller brush, thereby removing residual droplets on it;

[0028] e. The liquid guide is equipped with a Peltier element to handle the contaminant liquid falling from the roller brush by freezing and thawing, so as to prevent the contaminant liquid from falling onto the wafer surface. Attached Figure Description

[0029] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0030] Figure 1 This is a schematic diagram of the contaminant liquid from the cleaning brush falling towards the wafer surface in existing technology;

[0031] Figure 2 This is a schematic diagram of a wafer post-processing apparatus provided in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of a clamping assembly provided in an embodiment of the present invention;

[0033] Figure 4 yes Figure 2 Side view of the corresponding wafer post-processing unit;

[0034] Figure 5 This is a schematic diagram of a liquid guiding component provided in an embodiment of the present invention;

[0035] Figure 6 yes Figure 5 Longitudinal sectional view of the central fluid guide component;

[0036] Figure 7 This is a longitudinal cross-sectional view of the liquid guiding component positioned between the roller brush and the wafer;

[0037] Figure 8 This is a schematic diagram of a wafer post-processing apparatus with a purge assembly provided in an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of a liquid guiding component provided in another embodiment of the present invention;

[0039] Figure 10 This is a schematic diagram of a Peltier element provided in an embodiment of the present invention. Detailed Implementation

[0040] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0041] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0042] In this invention, a wafer (W) is also called a substrate, with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0043] In the field of wafer manufacturing, post-processing of wafers refers to the cleaning and / or drying of wafers. In this invention, post-processing of wafers includes at least a wafer brushing process.

[0044] Figure 2 This is a schematic diagram of a wafer post-processing apparatus 100 provided in an embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0045] The cabinet 10 is typically provided with a switch door (not shown) on its side for loading and unloading wafers;

[0046] The clamping assembly 20 is disposed in the housing 10 to horizontally clamp the wafer, and a rotary drive motor is disposed at the lower part of the clamping assembly 20 to drive the wafer W to rotate around its central axis.

[0047] A roller brush 30 is disposed in the housing 10 and located on the upper side of the wafer W. The roller brush 30 can roll around the axis to brush away contaminants such as particulate matter remaining on the wafer surface.

[0048] Figure 3 yes Figure 2 The top view of the clamping assembly 20 in the embodiment shows that the clamping assembly 20 typically includes four support rollers 21. Each support roller 21 is a rotating body with a slot on its outer periphery. The edge of the wafer W abuts in the slot. Under the action of friction, the rotating support rollers 21 drive the wafer W to rotate around its central axis.

[0049] Furthermore, the wafer post-processing apparatus 100 is also equipped with a liquid inlet mechanism (not shown), which is connected to the interior of the roller brush 30 to continuously supply liquid to the roller brush 30, keeping the roller brush 30 moist. The roller brush 30 is made of a porous material capable of absorbing a large amount of liquid. This liquid can be an acidic or alkaline solution, or it can be deionized water. The liquid inlet mechanism is connected to the liquid inlet end of the roller brush 30 to fill the interior of the roller brush 30 with liquid; after being filled with liquid, the roller brush 30 softens to allow for contact brushing of the wafer W.

[0050] Furthermore, the wafer post-processing apparatus 100 also includes a liquid supply assembly (not shown). During wafer cleaning, the liquid supply assembly can spray chemical liquid toward the wafer surface, and the rolling brush 30 contacts the rotating wafer to remove contaminants such as particulate matter remaining on the wafer surface.

[0051] Figure 2 In the embodiment shown, the roller brush 30 is fixed on the roller brush base 31, and a drive motor (not shown) is provided at the end of the roller brush 30 to drive the roller brush 30 to roll around its axis.

[0052] Furthermore, a loading member 32 is provided above the roller brush base 31, which can adjust the vertical position of the roller brush base 31, thereby changing the contact state between the roller brush 30 and the wafer W. In some embodiments, a pressure sensor 33 is provided between the loading member 32 and the roller brush base 31 to monitor the brushing force applied by the roller brush 30 to the wafer surface and control the cleaning state of the wafer.

[0053] When the wafer post-processing apparatus 100 is in operation, the roller brush 30 abuts against the surface of the rotating wafer W. At the same time, the roller brush 30 rolls around its axis under the drive of a drive motor (not shown). The liquid supply assembly sprays chemical liquid toward the wafer to change the adhesion between the particles and the wafer surface. Under the scrubbing force applied by the roller brush 30, the particles remaining on the wafer surface are peeled off, thereby obtaining a wafer with a clean surface.

[0054] During the washing process, the detached particles may adhere to the surface of the roller brush 30 and mix with the liquid that wets the roller brush 30, making the liquid on the roller brush 30 a new source of pollution.

[0055] After the wafer has finished washing, the roller brush base 31 and the roller brush 30 on it move upward and away from the wafer to perform surface cleaning and other operations, and then are transferred to the next process. Before the wafer is transferred to the next process, the roller brush 30 containing the contaminant liquid is always above the wafer W; the contaminant liquid may fall onto the surface of the wafer W under the action of gravity, thus affecting the washing effect of the wafer.

[0056] To address the aforementioned problems, the wafer post-processing apparatus 100 provided by this invention further includes a liquid guiding assembly 40, such as... Figure 2 As shown, Figure 4 yes Figure 2 The corresponding side view of the wafer post-processing apparatus 100. The liquid guiding assembly 40 can be moved to the underside of the roller brush 30 to catch the droplets falling from the roller brush 30 and guide them toward the outside of the wafer W when the wafer post-processing apparatus 100 is in standby mode, preventing droplets containing contaminants from falling onto the wafer surface.

[0057] Figure 2 In this embodiment, the liquid guiding assembly 40 includes a liquid guiding element 41 to guide the droplets falling from the roller brush 30. Specifically, after the roller brush 30 moves upward and separates from the wafer W, the liquid guiding element 41 of the liquid guiding assembly 40 can move between the roller brush 30 and the wafer W to guide the droplets falling from the roller brush 30 and prevent droplets containing particulate matter (contaminating liquid) from falling onto the wafer surface.

[0058] Furthermore, the fluid guiding assembly 40 also includes at least one connecting rod 42, such as Figure 4 As shown, the connecting rod 42 is fixed to the side of the liquid guiding member 41; the assembly formed by the connecting rod 42 and the liquid guiding member 41 can move toward the lower side of the roller brush 30 in a swinging manner, so that the liquid guiding member 41 swings to the lower side of the roller brush 30.

[0059] Figure 2 In the embodiment shown, there is a pair of connecting rods 42, which are arranged parallel to each other on the side of the liquid guiding member 41. Figure 4(as shown), to avoid interference between the liquid guiding assembly 40 and the brush 30 and its matching components forming the brushing module; as a variant of this embodiment, the distance between adjacent connecting rods 42 can also be greater than the length of the brushing module to avoid interference between the two.

[0060] When the wafer post-processing unit 100 is operating, to avoid interference between the roller brush 30 and the liquid guide 41, the assembly formed by the connecting rod 42 and the liquid guide 41 needs to swing away from the wafer W. It should be noted that the swinging operation of the liquid guide 41 is completed inside the housing 10, and the liquid guide 41 should at least swing away from the edge of the wafer W. That is, the liquid guide 41 should swing to the outside of the edge of the wafer W to avoid the influence of residual liquid droplets on the wafer cleaning effect.

[0061] It is understandable that the liquid guiding component 41 can also be moved between the roller brush 30 and the wafer W in other ways, such as horizontal movement, or a combination of vertical and horizontal movement. The movement method of the liquid guiding component 41 needs to take into account factors such as the working space of the housing 10 and the simplicity of the operation, so as to maximize the convenience of operation while ensuring reliable operation.

[0062] Figure 5 This is a schematic diagram of a liquid guiding component 41 provided in an embodiment of the present invention. The liquid guiding component 41 has a rectangular groove structure, which makes the liquid guiding component 41 match the shape of the roller brush 30, so as to control the external size of the liquid guiding component 41 and increase the working space inside the box 10.

[0063] The liquid guide 41 has openings at both ends to guide droplets falling to the bottom of the liquid guide 41 outwards.

[0064] Furthermore, the inner bottom surface of the liquid guiding member 41 is provided with a guiding surface 41a, which extends toward the opening at the end of the liquid guiding member 41 to guide the droplets falling from the roller brush 30 toward the end of the liquid guiding member 41.

[0065] Furthermore, the length of the liquid guiding component 41 needs to be greater than the outer diameter of the wafer W, so that the droplets gathered at the end of the liquid guiding component 41 can fall to the outside of the wafer W, thereby preventing the droplets from falling onto the wafer surface and causing secondary contamination.

[0066] Figure 6 yes Figure 5 In the longitudinal cross-sectional view, the guide surface 41a extends downward and outward from the middle of the self-guiding liquid member 41. With this configuration, droplets falling from the surface of the roller brush 30 can flow along the inclined guide surface 41a to the end of the self-guiding liquid member 41, and finally fall at the end of the self-guiding liquid member 41, that is, the guided and gathered droplets fall to the outside of the wafer.

[0067] Furthermore, the liquid guiding component 41 is provided with a pair of guiding surfaces 41a, and the two guiding surfaces 41a are symmetrically arranged on the liquid guiding component 41, so that the falling droplets can flow out from both ends of the liquid guiding component 41 in a roughly uniform manner.

[0068] The included angle between the guiding surfaces 41a of the liquid guiding component 41 is θ, which is less than or equal to 170°, in order to ensure the guiding capacity of the guiding surface 41a and prevent the droplets falling on the liquid guiding component 41 from accumulating excessively at the bottom of the rectangular groove and falling onto the wafer surface during the swinging process of the liquid guiding component 41.

[0069] As an embodiment of the present invention, the liquid guiding element 41 is made of a hydrophobic material to prevent droplets from accumulating on the guiding surface 41a. The liquid guiding element 41 can be made of materials such as polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), or polyether ether ketone (PEEK), which are hydrophobic and corrosion-resistant, suitable for the working environment of wafer post-processing.

[0070] It is understandable that the liquid guiding component 41 can also be made of metal plate; in order to ensure the hydrophobicity of the liquid guiding component 41, the surface of the liquid guiding component 41 that comes into contact with the falling droplets is coated with a hydrophobic coating, such as polytetrafluoroethylene, fluorinated polyethylene, fluorocarbon wax, etc., so that the liquid guiding component 41 has good liquid guiding performance.

[0071] Figure 7 This is a cross-sectional view of the liquid guiding component 41 located between the roller brush 30 and the wafer W, wherein the liquid guiding component 41 has a guiding surface 41a disposed inside. Since the guiding surface 41a is inclined from the middle of the liquid guiding component 41 to both ends, the distance between the guiding surface 41a at the middle position of the liquid guiding component 41 and the upper edge of the liquid guiding component 41 is the smallest.

[0072] In some embodiments, the minimum distance between the guide surface 41a at the middle position of the liquid guide 41 and the upper edge of the liquid guide 41 should be greater than 12mm, so as to prevent the droplets falling from the roller brush 30 from accumulating too quickly at this position and overflowing from the upper edge of the liquid guide 41, and the droplets overflowing from this position will fall directly onto the wafer surface.

[0073] The distance between the liquid guiding component 41 and the wafer W is H1, such as... Figure 7 As shown, the distance H1 should be greater than 15mm. If the distance between the liquid guiding component 41 and the wafer W is too small, the bottom of the liquid guiding component 41 may come into contact with the water film on the wafer surface, thus affecting the cleaning effect of the wafer.

[0074] The distance between the liquid guiding component 41 and the roller brush 30 is H2, and the value of the distance H2 ranges from 3mm to 10mm. If the distance H2 is too small, the liquid guiding component 41 may come into contact with the liquid film of the roller brush, causing cross-contamination; if the distance H2 is too large, the droplets falling on the liquid guiding component 41 may splash onto the wafer surface.

[0075] The following is combined Figure 2 and Figure 3 The following is a brief description of the operating steps of the wafer post-processing apparatus 100 provided by the present invention:

[0076] First, the switch door on the side of the housing 10 (not shown) is opened, and the robot arm places the wafer to be processed into the clamping assembly 20 inside the housing 10. The support roller 21 of the clamping assembly 20 horizontally clamps the wafer W and drives the wafer W to rotate around its central axis.

[0077] Next, the loading component 32 moves the wetted roller brush 30 down and abuts against the surface of the rotating wafer W. The liquid supply component sprays chemical liquid toward the wafer W, and the rotating roller brush 30 removes the residual particles on the wafer surface. At this time, the liquid guiding component 40 in the housing 10 is tilted to one side of the clamping component 20 to avoid interference between the operation of the liquid guiding component 40 and the roller brush 30.

[0078] After the roller brush 30 completes the cleaning process according to the set parameters, the loading component 32 drives the roller brush 30 to move upward, and the rotary motor 44 of the liquid guiding component 40 drives the rotating shaft 43 to rotate, so that the liquid guiding component 41 moves between the roller brush 30 and the wafer W to catch the contaminant liquid that may fall from the roller brush 30.

[0079] Next, the wafer post-processing unit 100 performs other cleaning process steps, and finally removes the post-processed wafer from the clamping assembly 20 in the housing 10, and transfers it to the next process. After the post-processed wafer leaves the housing 10, the liquid guiding component 41 of the liquid guiding assembly 40 swings outward toward the clamping assembly 20 so that the roller brush 30 in the housing 10 can continue to process the next wafer.

[0080] Figure 8 This is a schematic diagram of a wafer post-processing apparatus 100 provided in another embodiment of the present invention. In this embodiment, the wafer post-processing apparatus 100 further includes a purging assembly 50, which is disposed in the housing 10 to purge residual droplets on the liquid guide 41 as needed, so as to avoid the residual droplets affecting the wafer cleaning effect.

[0081] In some embodiments, the purging assembly 50 may be a fluid tube with a nozzle attached to the connecting rod 42 to spray clean gas toward the guide fluid element 41 to remove contaminated liquid that may fall off during the oscillation process.

[0082] Specifically, when the liquid guiding component 41 moves away from the roller brush 30, the purging assembly 50 can spray clean gas, such as N2, towards the liquid guiding component 41 to remove droplets adhering to it. That is, during the washing operation in the wafer post-processing unit 100, to avoid interference between the liquid guiding component 41 and the roller brush 30, the liquid guiding component 41 needs to move away from the wafer W or the roller brush 30 and towards the inner wall of the housing 10. When the liquid guiding component 41 is stationary away from the roller brush 30, the purging assembly 50 sprays clean gas towards it to cause the droplets remaining on the surface of the liquid guiding component 41 to fall off prematurely, thereby preventing contaminated liquid from falling onto the wafer surface and interfering with the wafer post-processing effect.

[0083] In some embodiments, the swing angle of the assembly formed by the liquid guide 41 and the connecting rod 42 is 45 to 60°, and the swing speed of the assembly is 10 to 20 rad / min, so as to avoid the liquid inside the liquid guide 41 being thrown onto the wafer surface during the swing process and affecting the cleaning effect of the wafer.

[0084] Figure 9 This is a schematic diagram of a liquid guiding component 41 provided in another embodiment of the present invention. In this embodiment, a Peltier element 45 is provided inside the liquid guiding component 41 to freeze droplets that fall onto the liquid guiding component 41, thereby preventing the droplets from falling onto the wafer surface under the action of gravity.

[0085] The bottom surface inside the liquid guiding component 41 is provided with eight Peltier elements 45, which are symmetrically arranged on the guide surface 41a. It can be understood that the number of Peltier elements 45 may also be other, and they are roughly evenly distributed inside the liquid guiding component 41 in order to freeze the contaminated liquid that falls onto the liquid guiding component 41.

[0086] Since the liquid guide 41 equipped with the Peltier element 45 freezes the droplets through refrigeration, in some embodiments, the liquid guide 41 may not be equipped with a guide surface 41a for guiding the droplets. This is because when the liquid guide 41 is away from the roller brush 30, the liquid guide 41 itself is in an inclined state, and the thawed droplets can slide off the surface of the liquid guide 41 under the action of gravity.

[0087] Figure 10 This is a schematic diagram of a Peltier element 45 provided in some embodiments of the present invention. The Peltier element 45 includes a heating part 45a and a cooling part 45b, wherein the cooling part 45b is in contact with the inner bottom surface of the liquid guide member 41, and the heating part 45a is located on the opposite side of the cooling part 45b.

[0088] Furthermore, the heating section 45a and the cooling section 45b can be made of materials with good thermal and electrical conductivity, such as aluminum and / or stainless steel; an N-type material section 45c and a P-type material section 45d are provided between the heating section 45a and the cooling section 45b, such as... Figure 10As shown. The N-type material section 45c contains phosphorus-doped silicon; while the P-type material section 45d contains boron-doped silicon.

[0089] Since the energy level of the P-type material is lower than that of the N-type material, when a positive direct current is applied to the Peltier element 45, charge carriers travel from the power source, from the P-type material section 45d through the cooling section 45b to the N-type material section 45c. During this process, the cooling section 45b absorbs heat from the outside. Then, the charge carriers travel from the N-type material section 45c through the heating section 45a and the power source to the P-type material section 45d. During this process, the heating section 45a dissipates heat to the outside.

[0090] When a reverse direct current is applied to the Peltier element 45, charge carriers travel from the power source, through the N-type material section 45c, and via the heating section 45a to the P-type material section 45d. During this process, the heating section 45a dissipates heat to the outside. Subsequently, the charge carriers travel from the P-type material section 45d through the cooling section 45b and the power source back to the N-type material section 45c. During this process, the cooling section 45b absorbs heat from the outside. Therefore, depending on the direction of the direct current applied to the Peltier element 45, the functions of the heating section 45a and the cooling section 45b within the Peltier element 45 will change.

[0091] Since the Peltier element 45 can achieve both cooling and heating, it can be used to handle droplets falling above the liquid guide 41.

[0092] Specifically, when the liquid guide 41 is located below the roller brush 30, the cooling part 45b of the Peltier element 45 is activated to freeze the droplets falling from the roller brush 30; when the liquid guide 41 is away from the roller brush 30, the heating part 45a of the Peltier element 45 is activated to heat and remove the frozen droplets.

[0093] In the embodiments provided by the present invention, the liquid guiding component 40 in the wafer post-processing device 100 is used for single-sided horizontal brushing of the wafer; it should be noted that the liquid guiding component 40 can also be used for double-sided horizontal brushing of the wafer, only requiring an additional brushing module for cleaning the back of the wafer to be configured in the housing 10.

[0094] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer post-processing apparatus, characterized in that, include: Box; Clamping assembly, located in the housing, is used to clamp and drive the wafer to rotate; A roller brush, located inside the housing and on the upper side of the wafer, is used to clean the wafer; A liquid guiding assembly includes a liquid guiding component, a connecting rod, and a rotary motor, wherein the rotary motor can drive the liquid guiding component to move in an oscillating manner between the roller brush and the wafer; After the roller brush completes the brushing and moves upward to separate from the wafer, the liquid guiding component can move to the lower side of the roller brush. The vertical distance between the liquid guiding component and the upper surface of the wafer is greater than 15mm to prevent the liquid guiding component from contacting the water film on the wafer surface. When the wafer post-processing device is in operation, the liquid guiding component is located entirely outside the edge of the wafer. The liquid guiding component is internally provided with multiple Peltier elements, which are evenly distributed. When the liquid guiding component is located below the roller brush, the cooling section of the Peltier element is activated to freeze the droplets falling from the roller brush. When the liquid guiding component is away from the roller brush, the heating section of the Peltier element is activated to heat and remove the frozen droplets.

2. The wafer post-processing apparatus as described in claim 1, characterized in that, The liquid guiding component is a rectangular groove with openings at both ends. The bottom of the rectangular groove is provided with a pair of guiding surfaces that extend downward and outward from the middle to guide the droplets on both sides. The minimum distance between the guiding surface at the middle position of the liquid guiding component and the upper edge of the liquid guiding component is greater than 12mm.

3. The wafer post-processing apparatus as described in claim 2, characterized in that, The included angle between a pair of guide surfaces is less than or equal to 170°.

4. The wafer post-processing apparatus as described in claim 1, characterized in that, The swing angle of the assembly formed by the liquid guiding component and its connecting rod is 45° to 60°, and the swing speed is 10 to 20 rad / min.

5. The wafer post-processing apparatus as described in claim 1, characterized in that, It also includes a purging assembly disposed in the housing; after the liquid guide is heated and thawed, the purging assembly sprays gas toward the liquid guide to remove residual droplets.

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