Bone conduction speaker device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN SHOKZ CO LTD
- Filing Date
- 2019-01-05
- Publication Date
- 2026-07-03
AI Technical Summary
In bone conduction speakers, as the functions become more complex, the number of wires inside the core housing increases, taking up a lot of space and easily causing vibrations and noises, which affects the sound quality.
Flexible circuit boards are used to set pads inside the mechanism housing, and wires are connected by flexible leads to optimize the wiring layout, reduce wire slack, and avoid vibration and abnormal noise.
The wiring layout inside the housing of the headphone core has been optimized, saving space and improving the sound quality of the headphone core.
Smart Images

Figure CN117528322B_ABST