Bone conduction speaker device

CN117528322BActive Publication Date: 2026-07-03SHENZHEN SHOKZ CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN SHOKZ CO LTD
Filing Date
2019-01-05
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In bone conduction speakers, as the functions become more complex, the number of wires inside the core housing increases, taking up a lot of space and easily causing vibrations and noises, which affects the sound quality.

Method used

Flexible circuit boards are used to set pads inside the mechanism housing, and wires are connected by flexible leads to optimize the wiring layout, reduce wire slack, and avoid vibration and abnormal noise.

Benefits of technology

The wiring layout inside the housing of the headphone core has been optimized, saving space and improving the sound quality of the headphone core.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117528322B_ABST
    Figure CN117528322B_ABST
Patent Text Reader

Abstract

This application discloses a bone conduction speaker device, comprising: a core housing, a flexible circuit board, an earphone core, and an ear hook. The core housing includes a peripheral sidewall and a bottom wall, forming an accommodating space; the flexible circuit board is disposed inside the core housing and has multiple first pads and two second pads, the flexible circuit board including a main circuit board and a branch circuit board; the earphone core is placed inside the core housing and connected to the two second pads, the main circuit board being located on the side of the earphone core facing the bottom wall; the ear hook is provided with multiple ear hook wires, the multiple ear hook wires including two audio signal wires, which are respectively soldered to the two first pads; the multiple first pads are disposed at the end of the main circuit board away from the branch circuit board and closer to the ear hook than the two second pads, the two second pads are disposed at the end of the branch circuit board away from the main circuit board, the branch circuit board being bent toward the open end.
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