A blind-mate radio frequency front-end assembly

Abstract

The application relates to the technical field of microwave and millimeter wave components, and particularly discloses a blind insertion type radio frequency front end component, which comprises a printed board, first front end devices and second front end devices arranged on the same side or symmetrical sides of the printed board, and a port blind insertion connector arranged on a radio frequency interface of the printed board; radio frequency signals between the port blind insertion connector, the first front end devices and the first front end devices and the second front end devices are transmitted through inner strip lines in the printed board. The application greatly reduces the volume and weight of the front end, is easy to integrate into a system, and effectively realizes the light weight and miniaturization of the electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of microwave and millimeter-wave component technology, and more specifically, to a blind-fit radio frequency front-end component. Background Technology

[0002] The utility model patent with authorization number CN209232790 U introduces a radio frequency front-end component using SIP packaging, which uses a silicon substrate to carry a bare chip and seals it by thermocompression. However, thermocompression sealing cannot guarantee airtightness. In addition, the thermal expansion coefficient of the silicon substrate used is significantly different from that of ordinary PCB boards, and the area cannot be too large. Otherwise, there is a risk of cracking under extreme high and low temperature conditions. Therefore, as described in the background art, it is only suitable for fields such as mobile phones and wearable devices where the working environment requirements are not high.

[0003] The invention patent with application number CN113556869 A introduces a tile-type front-end component non-ball-mounted vertical stacking structure, which is suitable for high-power application scenarios. The introduction of cooling plates and metal frames increases the volume, making it unsuitable for scenarios with lower power and strict volume requirements.

[0004] The invention patent with application number CN111929648 A introduces a W-band highly integrated radar front-end component based on LTCC. The inventor focuses on the solution, which uses embedded devices in the LTCC substrate to improve the integration, but does not mention the peripheral packaging.

[0005] The utility model patent with application number CN204258802 U introduces a miniaturized MIMO radio frequency front-end component, which includes a transceiver channel antenna, a polarization converter, a transceiver channel filter, a receiving module and a transmitting module. The multi-channel shared housing reduces the size, but it is still implemented by a hybrid integration method, so there is still considerable room for improvement in size and weight.

[0006] Currently, commonly used high-reliability connectors such as the J30J series and J63 series are relatively large in size; the 25-pin J30J connector measures 29.8×24.5×7.6mm, and the J63 connector measures 20.91×11.54×3.48mm. However, this invention draws on the gold finger pads commonly used in digital modules and integrates them on a composite substrate. Taking a single pad of 1.5×5mm and a spacing of 0.5mm as an example, the area of ​​a 25-pin connector is only 16×5mm, and the height is negligible. Existing technologies cannot meet the requirements of electronic devices for lightweight and miniaturization. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a blind-plug radio frequency front-end assembly, which greatly reduces the size and weight of the front-end and is easy to integrate into the system.

[0008] The solution adopted by this invention to solve the technical problem is:

[0009] A blind-mating radio frequency front-end assembly includes a printed circuit board, a first front-end device and a second front-end device disposed on the same side or symmetrically on both sides of the printed circuit board, and a port blind-mating connector disposed on the radio frequency interface of the printed circuit board.

[0010] The radio frequency signals between the port blind-mating connector and the first front-end device, and between the first front-end device and the second front-end device, are all transmitted through the inner band line in the printed circuit board.

[0011] In some possible implementations,

[0012] The port blind-mating connector includes an input port blind-mating connector and an output port blind-mating connector arranged on the same side;

[0013] Both the input port blind-mating connector and the output port blind-mating connector are SMPM connectors. Their transmission interfaces are surface-mounted on the printed circuit board and then connected to the printed circuit board by soldering.

[0014] In some possible implementations,

[0015] The printed circuit board is a digital-analog hybrid composite substrate.

[0016] In some possible implementations,

[0017] The first front-end device includes an input circuit connected to an input port and an output circuit connected to an output port; the input circuit, the second front-end device, and the output circuit are connected in sequence.

[0018] In some possible implementations,

[0019] The input circuit includes a limiter, a high-pass filter, a first amplifier, a first digitally controlled attenuator, and a first equalizer connected in sequence; the first equalizer is connected to a second front-end device; and the limiter is connected to the input port.

[0020] In some possible implementations,

[0021] The output circuit includes a temperature compensation circuit, a second equalizer, a third amplifier, a second fixed attenuator, a coupler, a fourth amplifier, and a detector connected in sequence; the temperature compensation circuit is connected to the second front-end device.

[0022] In some possible implementations,

[0023] The second front-end device includes a first single-pole double-throw switch, a first-stage low-noise amplifier, a second single-pole double-throw switch, a low-pass filter, a third single-pole double-throw switch, a second-stage low-noise amplifier, a fourth single-pole double-throw switch, and a second amplifier, which are connected in sequence to the first equalizer; the second amplifier is connected to a temperature compensation circuit.

[0024] The first single-pole double-throw switch is connected to the second single-pole double-throw switch, and the third single-pole double-throw switch is connected to the fourth single-pole double-throw switch.

[0025] In some possible implementations,

[0026] The first front-end device also includes a power converter and a capacitor.

[0027] In some possible implementations,

[0028] The printed circuit board is provided with mounting positions for fixing the printed circuit board to the heat-conducting plate.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] This invention provides a three-dimensional integrated radio frequency front-end component using a BGA interface SiP, which greatly reduces the front-end size and weight, facilitates system integration, and meets the requirements of lightweight and miniaturized electronic devices. Attached Figure Description

[0031] Figure 1 This is a top view of Embodiment 1 of the present invention;

[0032] Figure 2 This is a side view of Embodiment 1 of the present invention;

[0033] Figure 3 This is a top view of Embodiment 2 of the present invention;

[0034] Figure 4 This is a side view of Embodiment 2 of the present invention;

[0035] Figure 5 This is a schematic diagram of the link layout of the input circuit and output circuit in Embodiment 1 or Embodiment 2 of the present invention;

[0036] Figure 6 This is a schematic diagram of the link layout of the second front-end device in this invention;

[0037] The components include: 1. First front-end device; 2. Second front-end device; 3. Printed circuit board; 4. Blind-mating connector; 5. Low-frequency interface; 6. Limiter; 7. High-pass filter; 8. First amplifier; 9. First digitally controlled attenuator; 10. First equalizer; 11. First single-pole double-throw switch; 12. First-stage low-noise amplifier; 13. Second single-pole double-throw switch; 14. Low-pass filter; 15. Third single-pole double-throw switch; 16. Second-stage low-noise amplifier; 17. Fourth single-pole double-throw switch; 18. Second amplifier; 19. Temperature compensation circuit; 20. Second equalizer; 21. Third amplifier; 22. Second fixed attenuator; 23. Coupler; 24. Fourth amplifier; 25. Detector; 26. Power converter; 27. Capacitor; 60-Single-pole single-throw switch. Detailed Implementation

[0038] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," etc., do not indicate a quantity limitation, but rather indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. For example, multiple positioning posts refer to two or more positioning posts. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] The present invention will now be described in detail.

[0040] Example 1:

[0041] like Figure 1 , Figure 2 , Figure 5 , Figure 6 As shown, a blind-mating radio frequency front-end assembly includes a printed circuit board 3, a first front-end device 1 and a second front-end device 2 disposed on the same side of the printed circuit board 3, a port blind-mating connector 4 disposed on the radio frequency interface of the printed circuit board 3, and a pad disposed on the low frequency interface 5 of the printed circuit board 3.

[0042] The radio frequency signals between the port blind-mating connector 4 and the first front-end device 1, and between the first front-end device 1 and the second front-end device 2, are all transmitted through the inner band line in the printed circuit board 3.

[0043] The printed circuit board 3 is provided with a mounting position for fixing the printed circuit board 3 to the heat-conducting plate.

[0044] The mounting positions are multiple semi-circular slots located on both sides of the printed circuit board 3, which are different from the blind-mating connector 4 on the port; the printed circuit board 3 can be fixed to the heat-conducting plate using head screws.

[0045] In some possible implementations,

[0046] The port blind-mating connector 4 includes an input port blind-mating connector and an output port blind-mating connector arranged on the same side;

[0047] Both the input port blind-mating connector and the output port blind-mating connector are SMPM connectors. Their transmission interfaces are surface-mounted and soldered onto the printed circuit board 3, and then connected to the printed circuit board 3 by soldering.

[0048] The SMPM connector is used for mating connection with the connector on the female connector of this invention;

[0049] The SMPM connector has four pins that are directly inserted into the printed circuit board 3. Its signal transmission interface is surface-mounted on the printed circuit board 3, and the four pins are also reinforced by soldering to enhance the reliability during blind mating.

[0050] In some possible implementations,

[0051] The printed circuit board 3 is a digital-analog hybrid composite substrate.

[0052] In some possible implementations,

[0053] The first front-end device 1 includes an input circuit connected to the input port and an output circuit connected to the output port; the input circuit, the second front-end device 2, and the output circuit are connected in sequence.

[0054] In some possible implementations,

[0055] The input circuit includes a limiter 6, a high-pass filter 7, a first amplifier 8, a first digitally controlled attenuator 9, and a first equalizer 10, which are connected in sequence and used to protect subsequent devices; the first equalizer 10 is connected to the second front-end device 2; and the limiter 6 is connected to the input port.

[0056] The radio frequency signal enters the first front-end device 1 through the SMPM connector of the input port, and after passing through the limiter 6, high-pass filter 7, first amplifier 8, first digitally controlled attenuator 9, and first equalizer 10, it is output to the second front-end device 2.

[0057] In some possible implementations,

[0058] The output circuit includes a temperature compensation circuit 19, a second equalizer 20, a third amplifier 21, a second fixed attenuator 22, a coupler 23, a fourth amplifier 24, and a detector 25 connected in sequence; the temperature compensation circuit 19 is connected to the second front-end device 2.

[0059] After passing through the second front-end device 2, the radio frequency signal enters the output circuit of the first front-end device 1 via the internal trace of the printed circuit board 3. After passing through the temperature compensation circuit 19, the second equalizer 20, the third amplifier 21, the second fixed attenuator 22, and the coupler 23, part of the radio frequency signal is output from the SMPM connector set on the output port. At the same time, the radio frequency signal is output from its coupling end after passing through the coupler 23, and is output through the fourth amplifier 24, the detector 25, and the pad set at the low frequency interface 5.

[0060] In some possible implementations,

[0061] The second front-end device 2 includes a first single-pole double-throw switch 11, a first-stage low-noise amplifier 12, a second single-pole double-throw switch 13, a low-pass filter 14, a third single-pole double-throw switch 15, a second-stage low-noise amplifier 16, a fourth single-pole double-throw switch 17, and a second amplifier 18, which are connected in sequence to the first equalizer 10; the second amplifier 18 is connected to the temperature compensation circuit 19.

[0062] The first single-pole double-throw switch 11 is connected to the second single-pole double-throw switch 13, and the third single-pole double-throw switch 15 is connected to the fourth single-pole double-throw switch 17.

[0063] The radio frequency signal is transmitted to the second front-end device 2 via the internal wiring of the printed circuit board 3. After passing through the first single-pole double-throw switch 11, the first-stage low-noise amplifier 12, the second single-pole double-throw switch 13, the low-pass filter 14, the third single-pole double-throw switch 15, the second-stage low-noise amplifier 16, the fourth single-pole double-throw switch 17, and the second amplifier 18, it is output to the output circuit of the first front-end device 1.

[0064] In some possible implementations,

[0065] The first front-end device 1 also includes a power converter 26 and a capacitor 27.

[0066] The power converter 26 is used to convert the external input power signal into the voltage value required by the internal components, so as to prevent the poor quality of the external power signal from affecting the working state of the internal components of the front-end components; the capacitor 27 filters the power signal.

[0067] The front-end component using this embodiment has a thickness of 4mm and a weight of less than 20g, while traditional hybrid integrated RF front-end components have a thickness of more than 8mm and a weight of more than 50g, which can greatly reduce the size and weight of the receiving array.

[0068] Example 2:

[0069] like Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, the difference between this embodiment and the previous embodiment is that the first front-end device 1 and the second front-end device 2 are installed on the front and back surfaces of the printed circuit board 3, and the mounting position is located on the side of the printed circuit board 3 away from the port blind connector 4.

[0070] The front-end component used in this embodiment has a thickness of 7mm and a weight of less than 20g, while traditional hybrid integrated RF front-end components have a thickness of more than 8mm and a weight of more than 50g, which can greatly reduce the size and weight of the receiving array.

[0071] When the front-end components (first front-end device 1 and second front-end device 2) operate with a wide frequency band, the filter bank can filter out unwanted signals within the passband; the first digitally controlled attenuator 9 is used to adjust the average gain of the front-end components and the amplitude consistency among multiple components; the first equalizer 10 and the second equalizer 20 can improve the gain flatness of the entire front-end components; the power converter 26 is used to convert the external input power signal into the voltage value required internally, preventing the poor quality of the external power signal from affecting the working state of the internal devices of the front-end components; the three-stage amplifier formed by the first amplifier 8, the second amplifier 18, and the third amplifier 21 can offset the insertion loss of passive devices in the link, and at the same time, it works with the first digitally controlled attenuator 9 to adjust to obtain the ideal gain value.

[0072] This invention is particularly suitable for receiver arrays, where each front-end component is a complete channel, which can be arbitrarily expanded according to the array size, exhibiting strong versatility. In array applications, each channel is completely independent, with channel isolation reaching 70dBc, compared to only 40dBc for ordinary multi-channel hybrid integrated front-end components; the blind-mating design using SMPM connectors facilitates assembly, disassembly, and troubleshooting.

[0073] This invention uses a motherboard embedded coupler that plugs into the front-end component. The front-end component can receive signals input from the antenna end, perform coupling self-tests, and report the working status of the front-end component. When powered on, faults can be detected in time and located for repair.

[0074] Compared to the J63 connector, the area is reduced by more than 67%, and the mating length is reduced by more than 50%.

[0075] Compared to the extremely high mating accuracy requirements of ordinary connectors in existing units, with mating accuracy requirements in the X / Y direction of ±0.02mm, which far exceeds the processing accuracy capability of printed circuit boards, the mating accuracy requirements of the pads proposed in this invention are greatly reduced, and ±0.1mm and above are acceptable.

[0076] The printed circuit boards 3 in the first front-end device 1 and the second front-end device 2 respectively adopt hermetically sealed ceramic substrates, with a maximum area of ​​25×25mm, which can realize high-density complex function integration; compared with silicon-based substrates, the maximum size can only be 15×15mm, and the integration density is relatively high.

[0077] Furthermore, a single-pole single-throw switch 60 is provided between the limiter 6 and the high-pass filter 7; it is turned on during normal reception and turned off when the system acquires the noise floor to isolate external signals, eliminate electromagnetic signal interference in the space environment, and improve the system's receiving sensitivity.

[0078] A high-pass filter 7 is set before the first amplifier 8 to effectively filter out low-frequency signals and their harmonics outside the operating bandwidth, ensuring the accuracy of direction finding.

[0079] The first amplifier 8 is a low-noise amplifier. The first amplifier 8 adopts a high-gain, low-noise model. The low noise ensures the system sensitivity, and the high gain can effectively reduce the impact of subsequent links on the noise figure.

[0080] The switching filter, consisting of a single-pole double-throw switch and a filter, effectively filters out large spatial interference signals from 4G and 5G communications when operating in broadband receiving mode, ensuring direction finding accuracy.

[0081] In the second front-end device 2, a low-pass filter 14 is provided between the first-stage low-noise amplifier 12 and the second-stage low-noise amplifier 16 to balance noise and filtering requirements. Placed after the first-stage low-noise amplifier 12, it reduces the impact on the noise figure; placed before the second-stage low-noise amplifier 16, it can promptly isolate high-frequency signals outside the operating frequency band, eliminate the influence of high-frequency out-of-band signals on the system noise floor, and improve the system's receiving sensitivity.

[0082] The first front-end device 1 includes a self-test branch formed by a fourth amplifier 24 and a detector 25, used for reporting operating status. A third amplifier 21 connects to a coupler 23, coupling the radio frequency signal in the link to the self-test branch. The self-test branch, equipped with a fourth amplifier 24, amplifies the coupled signal to the operating power range of the detector 25, which then outputs a self-test voltage. The system loads a self-test signal from the input of the front-end component, and the output voltage from the coupled detector branch is used by the back-end processor to collect and report the operating status, promptly identifying and replacing faulty components.

[0083] The third amplifier 21 adopts the low-gain, high-output P-1 model, which does not affect the link noise and ensures that the receiving link is not compressed under large signal input conditions, thus guaranteeing the linear dynamic range of the system.

[0084] This invention is not limited to the specific embodiments described above. The invention extends to any new feature or combination disclosed in this specification, as well as any new method or process step or combination disclosed herein.

Claims

1. A blind-mate radio frequency front-end assembly, characterized in that, It includes a printed circuit board, a first front-end device and a second front-end device disposed on the same side or symmetrically on both sides of the printed circuit board, and a port blind-mating connector disposed on the radio frequency interface of the printed circuit board. The radio frequency signals between the port blind-mating connector and the first front-end device, and between the first front-end device and the second front-end device, are all transmitted through the inner band line in the printed circuit board; the port blind-mating connector includes an input port blind-mating connector and an output port blind-mating connector arranged on the same side. Both the input port blind-mating connector and the output port blind-mating connector are SMPM connectors. Their transmission interfaces are surface-mounted and soldered onto the printed circuit board, and then connected to the printed circuit board by soldering. The printed circuit board is provided with mounting positions for fixing the printed circuit board to the heat-conducting plate.

2. The blind-plug radio frequency front-end assembly according to claim 1, characterized in that, The printed circuit board is a digital-analog hybrid composite substrate.

3. The blind-mate radio frequency front-end assembly according to claim 1, characterized in that, The first front-end device includes an input circuit connected to the input port and an output circuit connected to the output port; the input circuit, the second front-end device, and the output circuit are connected in sequence.

4. A blind-fit RF front-end assembly according to claim 3, characterized in that, The input circuit includes a limiter, a high-pass filter, a first amplifier, a first digitally controlled attenuator, and a first equalizer connected in sequence; the first equalizer is connected to a second front-end device; and the limiter is connected to the input port.

5. A blind-fit RF front-end assembly according to claim 4, characterized in that, The output circuit includes a temperature compensation circuit, a second equalizer, a third amplifier, a second fixed attenuator, a coupler, a fourth amplifier, and a detector connected in sequence; the temperature compensation circuit is connected to the second front-end device.

6. A blind-mate radio frequency front-end assembly according to claim 5, characterized in that, The second front-end device includes a first single-pole double-throw switch, a first-stage low-noise amplifier, a second single-pole double-throw switch, a low-pass filter, a third single-pole double-throw switch, a second-stage low-noise amplifier, a fourth single-pole double-throw switch, and a second amplifier, which are connected in sequence to the first equalizer; the second amplifier is connected to a temperature compensation circuit. The first single-pole double-throw switch is connected to the second single-pole double-throw switch, and the third single-pole double-throw switch is connected to the fourth single-pole double-throw switch.

7. A blind-fit RF front-end assembly according to claim 3, characterized in that, The first front-end device also includes a power converter and a capacitor.

Images