Power module, inverter, motor controller and vehicle

Abstract

The application discloses a power module, an inverter, a motor controller and a vehicle, and relates to the technical field of power modules, and discloses the power module, which comprises a substrate, a fluid channel is arranged in the substrate, a power chip is arranged on the substrate, a heat dissipation block is connected to a side of the power chip which is away from the substrate, the heat dissipation block is provided with a first fluid through hole, a first end of the first fluid through hole is connected to a first interface of the fluid channel, a second end of the first fluid through hole is connected to a second interface of the fluid channel, so as to form a fluid circulation loop, and a fluid pump is arranged on the fluid circulation loop and used for driving the fluid to circulate in the fluid circulation loop. The power module can improve the working environment temperature of the power chip and improve the use reliability of the power module.

Description

Technical Field

[0001] This invention relates to the field of power device technology, and in particular to a power module, inverter, motor controller, and vehicle. Background Technology

[0002] The power module consists of a power chip and an insulating substrate. The insulating substrate is composed of an upper metal layer, an insulating material, and a lower metal layer. The bottom of the power chip is soldered to the upper metal layer of the insulating substrate, which not only conducts heat generated by the chip but also enables electrical connection to the outside through bonding wires, lead terminals, and other structures.

[0003] In related technologies, the heat generated by the power chip is transferred downwards through a base plate structure with heat sink fins or heat dissipation pins, connected to a lower metal layer of an insulating substrate. This heat is then transferred to a cooling liquid located in a water tank below the base plate, with its flow rate and temperature steadily controlled by an independent cooling circulation system. However, due to the use of insulating materials in the insulating substrate, a temperature gradient is established between its upper and lower surfaces. While advancements in power chip and packaging technologies have increased the energy density of power modules, they have also led to a rapid increase in the junction temperature within the power module, consequently widening the temperature gradient between the upper and lower surfaces of the insulating substrate. This results in two main problems: firstly, the increased junction temperature significantly increases the chip's failure rate, necessitating limitations on power chip power loss to meet junction temperature requirements, thus limiting the maximum output current; secondly, the increased internal temperature gradient within the power module increases the stress on the power chip solder and bonding pads, consequently reducing the reliability of the power module. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a power module that can improve the operating temperature of power chips and enhance the reliability of the power module.

[0005] The second objective of this invention is to provide an inverter.

[0006] The third objective of this invention is to provide a motor controller.

[0007] The fourth objective of this invention is to provide a vehicle.

[0008] To address the aforementioned problems, a first aspect of the present invention provides a power module, comprising: a substrate having a fluid channel therein; a power chip disposed on the substrate; a heat sink connected to the side of the power chip away from the substrate, the heat sink having a first fluid through-hole, a first end of the first fluid through-hole being connected to a first interface of the fluid channel, and a second end of the first fluid through-hole being connected to a second interface of the fluid channel to form a fluid circulation loop; and a fluid pump disposed on the fluid circulation loop for driving fluid to circulate in the fluid circulation loop.

[0009] According to the power module of the present invention, by connecting a heat sink to the side of the power chip away from the substrate, the heat generated by the power chip can be transferred to the fluid circulation loop through the first fluid through hole of the heat sink. Thus, under the drive of the fluid pump, the cooling cycle can be carried out as the fluid flows in the fluid circulation loop, thereby effectively improving the operating temperature of the power chip, improving the reliability of the power module, and also effectively solving the problem of limited current capability caused by excessive junction temperature of the power chip, thereby improving the current capability of the power module.

[0010] In some embodiments, the substrate includes a first substrate having a first fluid channel, a first interface of the first fluid channel being connected to a first end of the first fluid through-hole, and a second interface of the first fluid channel being connected to a second end of the first fluid through-hole to form a first fluid circulation loop; the power chip includes a first power chip disposed on the first substrate, and the side of the first power chip away from the first substrate being connected to the lower surface of the heat sink; the fluid pump is used to drive fluid to circulate in the first fluid circulation loop.

[0011] In some embodiments, the heat sink includes: a cavity defining the first fluid through-hole; a first heat sink with its lower surface connected to the side of the first power chip away from the first substrate; and a first insulating layer located between the cavity and the first heat sink.

[0012] In some embodiments, a front electrode of the first power chip is disposed on the side of the first power chip away from the first substrate; the heat sink further includes an ear-shaped portion disposed on the side of the first heat sink, the ear-shaped portion being provided with an electrode lead-out pad, the electrode lead-out pad being connected to the front electrode of the first power chip.

[0013] In some embodiments, the fluid pump includes: a housing disposed on the first substrate, the housing defining a pump cavity; a pump body disposed in the pump cavity, the pump body defining a second fluid through-hole, the second fluid through-hole communicating with the first fluid through-hole and the first fluid channel; an upper electrode disposed on the upper surface of the pump body, a lower electrode disposed on the lower surface of the pump body, and a permanent magnet disposed on the side surface of the pump body; when the upper electrode and the lower electrode are energized, an electric field is generated, the permanent magnet generates a magnetic field, and the electric field and the magnetic field drive the flow of conductive fluid in the second fluid through-hole.

[0014] In some embodiments, the first substrate includes a first metal layer, a second insulating layer, and a second metal layer stacked sequentially; wherein, a first fluid channel is formed in the first metal layer, the first fluid channel having a first fluid inlet and a first fluid outlet; the first insulating layer has a first channel hole and a second channel hole, the first channel hole being connected to the first fluid inlet and the second channel hole being connected to the first fluid outlet; the second metal layer has a third channel hole and a fourth channel hole, the third channel hole being connected to the first channel hole to serve as a first interface of the first fluid channel, and the fourth channel hole being connected to the second channel hole to serve as a second interface of the first fluid channel.

[0015] In some embodiments, the second metal layer is further provided with a first connection pad corresponding to and connected to the back electrode of the first power chip, the upper electrode of the fluid pump, the lower electrode, the housing and the electrode lead-out pad, and a first lead-out pad corresponding to and connected to the first connection pad.

[0016] In some embodiments, the substrate further includes a second substrate having a second fluid channel, a first interface of the second fluid channel being connected to a first end of the first fluid through-hole, and a second interface of the second fluid channel being connected to a second end of the first fluid through-hole to form a second fluid circulation loop; the power chip further includes a second power chip disposed on the second substrate, and the side of the second power chip away from the second substrate being connected to the upper surface of the heat sink; the fluid pump is further used to drive fluid to circulate in the second fluid circulation loop.

[0017] In some embodiments, the heat sink further includes: a second heat sink, the upper surface of which is connected to the side of the second power chip away from the second substrate; and a second insulating layer located between the second heat sink and the cavity.

[0018] In some embodiments, a front electrode of the second power chip is provided on the side of the second power chip away from the second substrate; the electrode lead-out pad is also connected to the front electrode of the second power chip.

[0019] In some embodiments, the second substrate includes: a third metal layer in which a second fluid channel is formed, the second fluid channel having a second fluid inlet and a second fluid outlet; a second insulating layer disposed on the third metal layer, the second insulating layer having a fifth channel hole and a sixth channel hole, the fifth channel hole being connected to the second fluid inlet and the sixth channel hole being connected to the second fluid outlet; and a fourth metal layer disposed on the second insulating layer, the fourth metal layer having a seventh channel hole and an eighth channel hole, the seventh channel hole being connected to the fifth channel hole to serve as a first interface of the second fluid channel, and the eighth channel hole being connected to the sixth channel hole to serve as a second interface of the second fluid channel.

[0020] In some embodiments, the second metal layer is further provided with a second connection pad corresponding to and connected to the back electrode of the first power chip, the lower electrode of the fluid pump, the housing and the electrode lead-out pad, and a second lead-out pad corresponding to and connected to the second connection pad; the fourth metal layer is further provided with a third connection pad corresponding to and connected to the back electrode of the second power chip, the upper electrode of the fluid pump and the housing, and a third lead-out pad corresponding to and connected to the third connection pad.

[0021] In some embodiments, the housing includes: an insulating housing portion, a first metal housing portion, and a second metal housing portion, the insulating housing portion, the first metal housing portion, and the second metal housing portion together defining the pump body cavity; the first metal housing portion is located on the side near the upper electrode and is used to connect the upper electrode and the substrate; the second metal housing portion is located on the side near the lower electrode and is used to connect the lower electrode and the substrate.

[0022] In some embodiments, the housing is a metal housing; a third insulating layer is provided on the outside of the upper electrode, and one end of the upper electrode is led out to connect with the substrate; a fourth insulating layer is provided on the outside of the lower electrode, and one end of the lower electrode is led out to connect with the substrate.

[0023] In some embodiments, the heat sink further includes an insulating member, which covers the wall of the first fluid through hole or is sleeved on the first fluid through hole.

[0024] In some embodiments, the fluid channel is either straight or curved.

[0025] In some embodiments, the power module further includes a heat sink disposed on the side of the substrate away from the power chip.

[0026] A second aspect of the present invention provides an inverter including at least one power module as described in the above embodiments.

[0027] The inverter according to the embodiments of the present invention, by employing the power module provided in the above embodiments, can improve the operating temperature of the power chip and enhance the reliability of the power module.

[0028] A third aspect of the present invention provides a motor controller, including at least one power module as described in the above embodiments.

[0029] According to the motor controller of the present invention, by employing the power module provided in the above embodiments, the operating temperature of the power chip can be improved, and the reliability of the power module can be enhanced.

[0030] A fourth aspect of the present invention provides a vehicle including the motor controller described in the above embodiments.

[0031] According to the vehicle of the present invention, by employing the motor controller provided in the above embodiments, the operating temperature of the power chip can be improved, and the reliability of the power module can be enhanced.

[0032] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0034] Figure 1 This is a schematic diagram of the structure of a power module according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of a power module in the prior art;

[0036] Figure 3 This is a schematic diagram of the structure of a power module according to another embodiment of the present invention;

[0037] Figure 4 In the figures (a)-(c), the top view, side view and front view of a heat sink according to an embodiment of the present invention are respectively.

[0038] Figure 5 In the figures (d)-(f), the top view, side view and front view of the heat sink block of another embodiment of the present invention are respectively.

[0039] Figure 6 In the figures (g)-(i), the top view, side view and front view of a fluid pump according to an embodiment of the present invention are respectively.

[0040] Figure 7 This is a schematic diagram of the structure of a power module according to another embodiment of the present invention;

[0041] Figure 8 This is a schematic diagram of the structure of a first substrate according to an embodiment of the present invention;

[0042] Figure 9 This is a schematic diagram of the pad design for the second metal layer according to an embodiment of the present invention;

[0043] Figure 10 This is a schematic diagram of the structure of a power module according to another embodiment of the present invention;

[0044] Figure 11 In the figures (j)-(k), the front view and the side view of a T-shaped manifold according to an embodiment of the present invention are respectively.

[0045] Figure 12 This is a schematic diagram of the heat transfer path within a power module according to an embodiment of the present invention;

[0046] Figure 13 This is a front view of a heat sink according to an embodiment of the present invention;

[0047] Figure 14 This is a schematic diagram of the structure of a second substrate according to an embodiment of the present invention;

[0048] Figure 15 In the diagram, (l)-(m) are schematic diagrams of the pad design of the second and fourth metal layers in an embodiment of the present invention, respectively.

[0049] Figure 16 In the diagram, (n)-(q) represent the top view, side view, and front view of a fluid pump according to another embodiment of the present invention, respectively.

[0050] Figure 17 In the diagram, (r)-(t) represent the top view, side view, and front view of a fluid pump according to another embodiment of the present invention, respectively.

[0051] Figure 18 In this context, (u)-(w) represent the top view, side view, and front view of the heat sink according to another embodiment of the present invention, respectively.

[0052] Figure 19 This is a schematic diagram of a first fluid channel according to an embodiment of the present invention;

[0053] Figure 20This is a schematic diagram of a second fluid channel according to an embodiment of the present invention;

[0054] Figure 21 This is a structural block diagram of an inverter according to an embodiment of the present invention;

[0055] Figure 22 This is a structural block diagram of a motor controller according to an embodiment of the present invention;

[0056] Figure 23 This is a structural block diagram of a vehicle according to an embodiment of the present invention.

[0057] Figure label:

[0058] Power module 10;

[0059] 1. Substrate; 2. Power chip; 3. Heat sink; 4. Fluid pump; 6. Heat sink;

[0060] Fluid channel 5; First fluid through hole 31; First interface 111; Second interface 112;

[0061] First substrate 11; Second substrate 12; First fluid channel 51; First power chip 21;

[0062] Cavity 32; First heat sink 33; First insulating layer 34; Ear-shaped portion 35; Lower surface 331 of the first heat sink;

[0063] 41. Housing; 42. Pump body cavity; 43. Pump body; 44. Second fluid passage; 45. Upper electrode; 46. Lower electrode; 47. Permanent magnet;

[0064] First metal layer 113; second insulating layer 114; second metal layer 115; first fluid inlet 1131; second fluid outlet 1132; first channel hole 1141; second channel hole 1142; third channel hole 1151; fourth channel hole 1152;

[0065] Second fluid channel 52; First interface 121 of the second fluid channel; Second interface 122 of the second fluid channel;

[0066] Second power chip 22; Second heat sink 36; Third insulating layer 37; Upper surface 361 of the second heat sink;

[0067] Third metal layer 123; Fourth insulating layer 124; Fourth metal layer 125; Second fluid inlet 1231; Second fluid outlet 1232; Fifth channel hole 1241; Sixth channel hole 1242; Seventh channel hole 1251; Eighth channel hole 1252;

[0068] Insulating housing portion 411; First metal housing portion 412; Second metal housing portion 413;

[0069] Fifth insulating layer 48; Sixth insulating layer 49; Insulating component 38;

[0070] The following are the components of the first power chip: back electrode pad 101; lower electrode pad 103; housing pad 104; bonding pad for the front electrode of the first power chip 105; lead-out pad for the back electrode of the first power chip 106; lead-out pad for the lower electrode 108; lead-out pad for the front electrode of the first power chip 109; back electrode pad 221; upper electrode pad 222; top housing pad 223; bonding pad for the front electrode of the second power chip 224; lead-out pad for the back electrode of the second power chip 225; lead-out pad for the upper electrode 226; lead-out pad for the front electrode of the second power chip 227; low current lead-out pad 110.

[0071] Inverter 20; Motor controller 30; Vehicle 100. Detailed Implementation

[0072] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0073] To address the aforementioned problems, a first aspect of the present invention provides a power module that can improve the operating temperature of the power chip and enhance the reliability of the power module.

[0074] The following is for reference. Figure 1 The power module described in the embodiments of the present invention, such as Figure 1 As shown, the power module 10 includes a substrate 1, a power chip 2, a heat sink 3, and a fluid pump 4.

[0075] The substrate 1 has a fluid channel 5; the power chip 2 is disposed on the substrate 1; the heat sink 3 is connected to the side of the power chip 2 away from the substrate 1, the heat sink 3 has a first fluid through hole 31, the first end of the first fluid through hole 31 is connected to the first interface 111 of the fluid channel 5, and the second end of the first fluid through hole 31 is connected to the second interface 112 of the fluid channel 5 to form a fluid circulation loop; the fluid pump 4 is disposed on the fluid circulation loop and is used to drive the fluid to circulate in the fluid circulation loop.

[0076] In some embodiments, the substrate 1 may be made of insulating material. In actual use, a temperature gradient will be established on both sides of the substrate 1. Based on this, a good working environment can be provided for the cooling cycle through the fluid circulation loop in this application, which facilitates the transport of the heat generated by the power chip 2 from the hot end of the substrate 1 to the cold end of the substrate 1 to achieve the purpose of cooling cycle.

[0077] In this embodiment, the distribution of the fluid channels 5 within the substrate 1 can be adaptively adjusted according to the shape of the substrate 1, and there are no limitations on this. For example, refer to... Figure 1 As shown, the substrate 1 is rectangular in shape, and the fluid channels 5 can be uniformly distributed in the substrate 1 along the first direction, wherein the first direction is the length direction of the substrate 1.

[0078] In some embodiments, the heat sink 3 is used to transfer the heat generated by the power chip 2 and conduct the fluid in the fluid circulation loop. The heat sink 3 can be made of a metal material with high thermal conductivity. The first fluid through-hole 31 of the heat sink 3 is used to conduct the fluid. Based on this, when the heat sink 3 is disposed on the side of the power chip 2 away from the substrate 1, i.e., the top surface where the front electrode of the power chip 2 is located, the heat sink 3 can transfer part of the heat from the power chip 2 to the first fluid through-hole 31 for cooling circulation through the fluid circulation loop, thereby improving the heat dissipation capacity of the top surface of the power chip 2 and reducing the junction temperature of the power chip. Here, the junction temperature of the power chip 2 refers to the highest operating temperature inside the power chip.

[0079] In some embodiments, the power chip 2 can be an IGBT (Insulated Gate Bipolar Transistor), an FRD (Fast Recovery Diode), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), or other semiconductor devices.

[0080] Specifically, in related technologies, such as Figure 2 As shown, power chips generate heat during operation, creating a temperature gradient across the substrate. However, with advancements in power chip and packaging technologies, while increasing the energy density of power modules, the junction temperature inside the module also rises rapidly, correspondingly increasing the temperature gradient across the substrate. This limits the output current of the power chip and affects the reliability of the power module. To address these issues, reference... Figure 1As shown, this application connects a heat sink 3 to the side of the power chip 2 away from the substrate 1. The fluid channel 5 in the substrate 1 is connected to both ends of the first fluid through hole 31 to form a fluid circulation loop. The fluid is driven by the fluid pump 4 to circulate in the fluid circulation loop. Thus, the heat generated on the side of the power chip 2 away from the substrate 1 can be transferred to the fluid circulation loop through the heat sink 3. Under the drive of the fluid pump 4, the fluid flows in the fluid circulation loop and cools the power chip 2, thereby achieving heat dissipation and reducing the junction temperature of the power chip 2. At the same time, under the action of the fluid pump 4, the heat generated by the power chip is transported from the hot end of the substrate 1 to the cold end of the substrate 1, effectively reducing the temperature gradient difference between the two sides of the substrate 1, effectively improving the operating temperature of the power chip 2. It can also effectively solve the problem of limited current capability of the power chip 2 due to excessive junction temperature, improve the current capability of the power module 10. In addition, it also helps to reduce the stress between the power chip solder and the bonding wire solder joint, improving the reliability of the power module 10.

[0081] According to the power module 10 of the present invention, by connecting a heat sink 3 to the side of the power chip 2 away from the substrate 1, the heat generated by the power chip 2 can be transferred to the fluid circulation loop through the first fluid through hole 31 of the heat sink 3. Thus, under the drive of the fluid pump 4, the cooling cycle can be carried out as the fluid flows in the fluid circulation loop, thereby effectively improving the operating temperature of the power chip 2, improving the reliability of the power module 10, and also effectively solving the problem of limited current capability caused by excessive junction temperature of the power chip 2, thereby improving the current capability of the power module 10.

[0082] In some embodiments, such as Figure 3 As shown, substrate 1 includes a first substrate 11, which has a first fluid channel 51. A first interface 111 of the first fluid channel 51 is connected to a first end of a first fluid through-hole 31, and a second interface 112 of the first fluid channel 51 is connected to a second end of the first fluid through-hole 31, forming a first fluid circulation loop. Power chip 2 includes a first power chip 21, which is disposed on the first substrate 11, and the side of the first power chip 21 away from the first substrate 11 is connected to the lower surface of the heat sink 3. Fluid pump 4 drives the fluid to circulate in the first fluid circulation loop. Therefore, the heat generated by the first power chip 21 can be cooled and circulated by the fluid flowing in the first fluid circulation loop under the drive of the fluid pump 4, thereby effectively improving the operating temperature of the first power chip 21, increasing the reliability of the power module 10, and improving the current-carrying capacity of the power module 10.

[0083] Regarding the structure of heat sink 3, as follows: Figure 4As shown, the heat sink 3 includes a cavity 32 and a first fluid through hole 31. The lower surface a of the cavity 32 is connected to the side of the first power chip 21 away from the first substrate 11, so as to absorb the heat generated by the first power chip 21 and transfer the generated heat to the cold end of the first substrate 11 through the first fluid circulation loop to achieve the purpose of cooling circulation.

[0084] In some embodiments, to facilitate the extraction of the electrodes of the first power chip 21, the contact area between the heat sink 3 and the first power chip 21 is smaller than the area of ​​the front electrode of the first power chip 21.

[0085] It should be noted that there can be one or more first power chips 21. In order to solve the problem of limited current capability caused by excessive junction temperature of power chips, regardless of the number of first power chips 21, a heat sink 3 can be set on each first power chip 21 and form a first fluid circulation loop with the first fluid channel 51. Thus, under the drive of the fluid pump 4, heat dissipation of all first power chips 21 can be achieved, effectively improving the operating temperature of power chip 2, improving the reliability of power module 10, and improving the current capability of power module 10.

[0086] In some embodiments, such as Figure 5 As shown, the heat sink 3 includes a cavity 32, a first heat sink 33, and a first insulating layer 34.

[0087] The cavity 32 defines a first fluid through-hole 31; the lower surface 331 of the first heat sink 33 is connected to the side of the first power chip 21 away from the first substrate 11; and the first insulating layer 34 is located between the cavity 32 and the first heat sink 33.

[0088] Specifically, since the heat sink 3 is made of a metal material with high thermal conductivity, that is, both the cavity 32 and the first heat sink 33 are made of metal, and the metal material has a certain degree of conductivity, this application adds a first insulating layer 34 between the cavity 32 and the first heat sink 33. In this way, the high thermal conductivity requirement of the heat sink 3 can be met, and the conductivity between the heat sink 3 and the first power chip 21 can be reduced.

[0089] In some embodiments, while meeting the insulation performance requirements of the power module 10, there are no restrictions on the thickness and material selection of the first insulating layer 34. For example, the material of the first insulating layer 34 can be Si3N4 or Al2O3, and the processing technology of the first insulating layer 34 can be metal-ceramic bonding or spraying, etc., without limitation.

[0090] In some embodiments, such as Figure 4As shown in Figure 5, the side of the first power chip 21 away from the first substrate 11 is provided with a front electrode of the first power chip; furthermore, in order to facilitate the bonding wire lead-out of the front electrode of the first power chip, the heat sink 3 in this application also includes an ear-shaped portion 35, which is provided on the side of the first heat sink 33. The ear-shaped portion 35 is provided with an electrode lead-out pad, which is connected to the front electrode of the first power chip. This facilitates the interconnection of the front electrode of the first power chip with the first substrate 11 through the electrode lead-out pad and bonding wire of the ear-shaped portion 35, thereby realizing the electrical connection between the first power chip 21 and the first substrate 11.

[0091] In some embodiments, provided that the electrode lead-out pads of the ear-shaped portion 35 on the front electrode of the first power chip are connected to facilitate wire bonding, the location and arrangement of the ear-shaped portion 35 are not limited. For example, Figure 4 As shown in Figure 5, two ear-shaped portions can be symmetrically arranged on both sides of the heat sink 3.

[0092] In some embodiments, such as Figure 6 As shown, the fluid pump 4 includes a housing 41, a pump body 43, a second fluid through hole 44, an upper electrode 45, a lower electrode 46, and a permanent magnet 47.

[0093] The housing 41 is disposed on the first substrate 11 and defines a pump body cavity 42; the pump body 43 is disposed in the pump body cavity 42 and defines a second fluid through hole 44, which communicates with the first fluid through hole 31 and the first fluid channel 51; an upper electrode 45 is disposed on the upper surface of the pump body 43, a lower electrode 46 is disposed on the lower surface of the pump body 43, and a permanent magnet 47 is disposed on the side surface of the pump body 43.

[0094] For details, please refer to Figure 3 As shown, the second end of the first fluid through-hole 31 is connected to the second interface 112 of the first fluid channel 51 via an L-shaped manifold, and the second end of the first fluid through-hole 31 is connected to the first end of the second fluid through-hole 44 via a straight manifold. The second end of the second fluid through-hole 44 is connected to the first interface 111 of the first fluid channel 51 via an L-shaped manifold, thus forming a first fluid circulation loop. The fluid in the fluid circulation loop is a conductive fluid. When a voltage is applied to the upper electrode 45 and the lower electrode 46, i.e., when the upper and lower electrodes are energized, an electric field is generated, and the permanent magnet generates a magnetic field. Therefore, according to the MHD effect, a Lorentz force will be generated in the direction perpendicular to the magnetic and electric fields, thereby driving the conductive fluid in the second fluid through-hole 44 to flow, so that the fluid flows from the fluid inlet of the second fluid through-hole 44 to the fluid outlet of the second fluid through-hole 44, realizing the cooling circulation of the fluid in the first fluid circulation loop.

[0095] It should be noted that in this application, the external magnetic field required by the fluid pump 4 is directly generated by the permanent magnet 47. Due to the volume limitation of the pump body 43, a soft magnetic circuit is not required. Furthermore, the pump body cavity 42 of the fluid pump 4 can be designed in any shape, for example... Figure 6 As shown, the pump body cavity 42 can be a cuboid.

[0096] In some embodiments, the diameters of the fluid inlet and fluid outlet of the second fluid through-hole 44 can be designed to be smaller than the size of the pump body cavity 42, thereby effectively increasing the fluid flow rate in the fluid circulation loop.

[0097] In some embodiments, such as Figure 7 As shown, the first substrate 11 includes a first metal layer 113, a second insulating layer 114, and a second metal layer 115 stacked sequentially.

[0098] Among them, reference Figure 7 and Figure 8 As shown, a first fluid channel 51 is formed in the first metal layer 113, the first fluid channel 51 having a first fluid inlet 1131 and a first fluid outlet 1132; the second insulating layer 114 has a first channel hole 1141 and a second channel hole 1142, the first channel hole 1141 being connected to the first fluid inlet 1131, and the second channel hole 1142 being connected to the first fluid outlet 1132; the second metal layer 115 has a third channel hole 1151 and a fourth channel hole 1152, the third channel hole 1151 being connected to the first channel hole 1141 to serve as a first interface 111 of the first fluid channel 51, and the fourth channel hole 1152 being connected to the second channel hole 1142 to serve as a second interface 112 of the first fluid channel 51. Therefore, by adding channel holes in the vertical direction of the first substrate 11 to allow fluid to be introduced and discharged into the first fluid channel 51, the heat absorbed by the first power chip 21 can be transferred to the first fluid channel 51 for cooling and heat dissipation under the action of the fluid pump 4, effectively improving the operating environment temperature of the power chip 2 and improving the reliability of the power module 10.

[0099] In some embodiments, the second metal layer 115 is further provided with a first connection pad corresponding to the back electrode of the first power chip 21, the upper electrode 45 of the fluid pump 4, the lower electrode 46, the housing 41 and the electrode lead-out pad, and a first lead-out pad corresponding to the first connection pad. This design allows the copper plating design on the second metal layer 115 to be adapted to the layout of the fluid pump 4 and the first power chip 21.

[0100] For details, please refer to Figure 9As shown, the first connection pad includes a back electrode pad 101, an upper electrode bonding pad 102, a lower electrode pad 103, a housing pad 104, and a bonding pad 105 for the front electrode of the first power chip 21; the first lead-out pad includes a lead-out pad 106 for the back electrode of the first power chip 21, a lead-out pad 107 for the upper electrode, a lead-out pad 108 for the lower electrode, and a lead-out pad 109 for the front electrode of the first power chip 21. The first power chip 21 is soldered to the second metal layer 115 of the first substrate 11 via the back electrode pad 101, wherein the area of ​​the back electrode pad 101 of the first power chip 21 is larger than the area of ​​the back electrode of the first power chip 21. The back electrode of the first power chip 21 is connected to the lead-out pad 106 of the back electrode of the first power chip 21 via a trace on the second metal layer 115, and is connected to the corresponding lead-out terminal via the lead-out pad 106 of the back electrode of the first power chip 21. The front electrode of the first power chip 21 is connected to the bonding pad 105 of the front electrode of the first power chip 21 via an electrode lead-out pad and a bonding wire. The bonding pad 105 of the front electrode of the first power chip 21 extends on the second metal layer 115 to the lead-out pad 109 of the front electrode of the first power chip 21, and is finally connected to the outside via the corresponding lead-out terminal. The base of the fluid pump 4 housing is connected to the housing pad 104, thereby fixing the pump housing. The lower electrode 46 of the fluid pump 4 is connected to the lower electrode pad 103, and is connected to the corresponding lead-out terminal via the lead-out pad 108 of the lower electrode. The upper electrode 45 of the fluid pump 4 is connected to the upper electrode bonding pad 102 via a bonding wire, and is connected to the lead-out terminal via the lead-out pad 107 of the upper electrode, thereby realizing the electrical connection between the first power chip 21, the first substrate 11, and the outside.

[0101] In some embodiments, a low-current lead-out pad 110 is also provided on the second metal layer 115, and the low-current electrode on the top of the first power chip 21 is connected to the low-current lead-out pad 110 through a bonding wire, thereby achieving electrical connection with the outside by using a low-current pin.

[0102] In some embodiments, such as Figure 10As shown, substrate 1 further includes a second substrate 12, which has a second fluid channel 52. The first interface 121 of the second fluid channel 52 is connected to the first end of the first fluid through-hole 31, and the second interface 122 of the second fluid channel 52 is connected to the second end of the first fluid through-hole 31 to form a second fluid circulation loop. Power chip 2 further includes a second power chip 22, which is disposed on the second substrate 12, and the side of the second power chip 22 away from the second substrate 12 is connected to the upper surface of the heat sink 3. Fluid pump 4 is also used to drive fluid to circulate in the second fluid circulation loop. Thus, the heat generated by the second power chip 22 can be cooled and circulated by the flow of fluid in the second fluid circulation loop under the drive of fluid pump 4, thereby effectively improving the operating temperature of the second power chip 22, improving the reliability of the power module 10, and improving the current capability of the power module 10.

[0103] Specifically, for double-sided power modules, refer to... Figure 10 As shown, the power module 10 adopts a 3D stacked design, that is, the first power chip 21 and the second power chip 22 are connected to the lower and upper surfaces of the heat sink 3, respectively. The heat sink 3 not only forms a heat dissipation channel for the first power chip 21 and the second power chip 22, but also realizes the interconnection between the first power chip 21 and the second power chip 22. Thus, they are symmetrically distributed in the vertical direction of the power module 10, which can improve the integration of the power module, make the heat source distribution within the structure more balanced, improve heat dissipation efficiency, avoid thermal runaway problems, and improve the reliability of the power module.

[0104] In this embodiment, the heat sink 3, the first substrate 11, the second substrate 12, and the fluid pump 4 are connected via a manifold. Figure 10 As shown, the second end of the first fluid through-hole 31 is connected to the second interface 112 of the first fluid channel 51 and the second interface 122 of the second fluid channel 52 through a T-shaped manifold. The second end of the first fluid through-hole 31 is connected to the first end of the second fluid through-hole 44 through a straight manifold. The second end of the second fluid through-hole 44 is connected to the first interface 111 of the first fluid channel 51 and the first interface 121 of the second fluid channel 52 through a T-shaped manifold. Thus, a first fluid circulation loop and a second fluid circulation loop are formed on both sides of the heat sink 3, respectively. Under the action of the fluid pump 4, the fluid is cooled and circulated in the first fluid circulation loop and the second fluid circulation loop.

[0105] Among them, for the structure of the T-shaped manifold, such as Figure 11As shown, the T-shaped manifold is a three-terminal fluid channel with a first port 7, a second port 8, and a third port 9. The first port 7 and the second port 8 form a branch pipe, and the third port 9 is the main pipe. Based on this, if the fluid circulation direction within the fluid circulation loop is clockwise, the fluid from the manifold between the fluid pump 4 and the substrate 1 flows out of the main pipe, passes through the fluid circulation loop, and then enters the branch pipe; and the fluid from the manifold between the heat sink 3 and the substrate 1, driven by the fluid pump 4, flows out of the branch pipe and then into the main pipe. It can be understood that the fluid circulation direction within the fluid circulation loop can also be set counterclockwise, in which case the direction of fluid entering and exiting the manifold is exactly opposite to the direction of fluid entering and exiting the manifold when the circulation direction is clockwise.

[0106] for Figure 10 The power module 10 shown, in actual use, has both the first fluid circulation loop and the second fluid circulation loop driven by the fluid pump 4 embedded within the module, as referenced. Figure 12 As shown, the dashed arrows indicate the heat transfer path of the second power chip 22 driven by the fluid pump 4, following the fluid flow. This demonstrates that the heat generated by the second power chip 22 is transferred from the hot end to the cold end of the second substrate 12, thus dissipating heat from the second power chip 22. It is understood that the heat transfer path for the first power chip 21 is similar to that for the second power chip 22, differing only in direction; therefore, it will not be described in detail here.

[0107] It should be noted that there can be one or more second power chips 22. In order to solve the problem of limited current capability caused by excessive junction temperature of power chips, regardless of the number of second power chips 22, a heat sink 3 can be connected to each second power chip 22 and form a second fluid circulation loop with the second fluid channel 52. Thus, under the drive of the fluid pump 4, heat dissipation of all second power chips 22 can be achieved, effectively improving the operating temperature of the power chip 2, improving the reliability of the power module 10, and improving the current capability of the power module 10.

[0108] In some embodiments, such as Figure 13 As shown, the heat sink 3 also includes a second heat sink 36 and a third insulating layer 37.

[0109] The upper surface 361 of the second heat sink 36 is connected to the side of the second power chip 22 away from the second substrate 12. Since the heat sink 3 is made of a metal material with high thermal conductivity, that is, both the cavity 32 and the second heat sink 36 are made of metal, and the metal material has a certain degree of conductivity, this application adds a third insulating layer 37 between the second heat sink 36 and the cavity 32. This satisfies the requirement of high thermal conductivity of the heat sink 3 and also reduces the conductivity between the heat sink 3 and the second power chip 22.

[0110] In some embodiments, the thickness and material of the third insulating layer 37 are not limited, provided that the insulation performance requirements of the power module 10 are met. For example, the material of the third insulating layer 37 can be Si3N4 or Al2O3, and the processing technology of the third insulating layer 37 can be metal-ceramic bonding or spraying, etc., without limitation.

[0111] In some embodiments, a front electrode of the second power chip 22 is provided on the side of the second power chip 22 away from the second substrate 12; the electrode lead-out pad is also connected to the front electrode of the second power chip, that is, the first power chip 21 and the second power chip 22 share the electrode lead-out pad for bonding wire lead-out, thereby facilitating the interconnection of the front electrode of the second power chip with the second substrate 12 via the electrode lead-out pad and bonding wire of the ear-shaped portion 35, and realizing the electrical connection between the second power chip 22 and the second substrate 12.

[0112] In some embodiments, such as Figure 10 and Figure 14 As shown, the second substrate 12 includes a third metal layer 123, a fourth insulating layer 124, and a fourth metal layer 125.

[0113] The third metal layer 123 has a second fluid channel 52, which has a second fluid inlet 1231 and a second fluid outlet 1232. A fourth insulating layer 124 is disposed on the third metal layer 123 and has a fifth channel hole 1241 and a sixth channel hole 1242. The fifth channel hole 1241 is connected to the second fluid inlet 1231 and the sixth channel hole 1242 is connected to the second fluid outlet 1232. A fourth metal layer 125 is disposed on the fourth insulating layer 124 and has a seventh channel hole 1251 and an eighth channel hole 1252. The seventh channel hole 1251 is connected to the fifth channel hole 1241 to serve as the first interface 121 of the second fluid channel 52, and the eighth channel hole 1252 is connected to the sixth channel hole 1242 to serve as the second interface 122 of the second fluid channel 52. Therefore, by adding channel holes in the vertical direction of the second substrate 12 to allow fluid to be introduced and discharged into the second fluid channel 52, the heat absorbed by the second power chip 22 can be transferred to the second fluid channel 52 for cooling and heat dissipation under the action of the fluid pump 4, effectively improving the operating environment temperature of the power chip 2 and improving the reliability of the power module 10.

[0114] In some embodiments, the second metal layer 115 is further provided with a second connection pad corresponding to the back electrode of the first power chip 21, the lower electrode 46 of the fluid pump 4, the housing 41 and the electrode lead-out pad, and a second lead-out pad corresponding to the second connection pad; the fourth metal layer 125 is further provided with a third connection pad corresponding to the back electrode of the second power chip 22, the upper electrode 45 of the fluid pump 4 and the housing 41, and a third lead-out pad corresponding to the third connection pad. This design allows the copper plating design on the second metal layer 115 and the fourth metal layer 125 to be adapted to the layout of the fluid pump 4, the first power chip 21 and the second power chip 22.

[0115] For details, please refer to Figure 15As shown, the second connection pad includes a back electrode pad 101, a lower electrode pad 103, a housing pad 104, and a bonding pad 105 for the front electrode of the first power chip 21; the second lead-out pad includes a lead-out pad 106 for the back electrode of the first power chip 21, a lead-out pad 108 for the lower electrode, and a lead-out pad 109 for the front electrode of the first power chip 21. The first power chip 21 is soldered to the second metal layer 115 of the first substrate 11 via the back electrode pad 101. The back electrode of the first power chip 21 is connected to the lead-out pad 106 of the back electrode of the first power chip 21 via traces on the second metal layer 115, and is connected to corresponding leads via the lead-out pad 106 of the back electrode of the first power chip 21. The front electrode of the first power chip 21 is connected to the bonding pad 105 of the front electrode of the first power chip 21 via electrode lead-out pads and bonding pads. The bonding pad 105 of the front electrode of the first power chip 21 extends onto the second metal layer 115, reaching the lead-out pad 109 of the front electrode of the first power chip 21, and finally connects to the outside through corresponding lead-out terminals. The base of the fluid pump 4 housing 41 is connected to the housing pad 104, thereby fixing the pump housing. The lower electrode 46 of the fluid pump 4 is connected to the lower electrode pad 103, and is connected to the corresponding lead-out terminal through the lead-out pad 108 of the lower electrode. Thus, the above design achieves electrical connection between the first power chip 21, the first substrate 11, and the outside.

[0116] Furthermore, the third connection pad includes a back electrode pad 221, an upper electrode pad 222, a housing top pad 223, and a bonding pad 224 for the front electrode of the second power chip 22; the third lead-out pad includes a lead-out pad 225 for the back electrode of the second power chip 22, a lead-out pad 226 for the upper electrode, and a lead-out pad 227 for the front electrode of the second power chip 22. The second power chip 22 is soldered to the fourth metal layer 125 of the second substrate 12 via the back electrode pad 221, and the area of ​​the back electrode pad 221 is larger than the area of ​​the back electrode of the second power chip 22. The back electrode of the second power chip 22 is connected to the lead-out pad 225 of the back electrode via traces on the second substrate 12, and is connected to the corresponding lead-out terminal via the lead-out pad 225. The front electrode of the second power chip 22 is connected to the bonding pad 224 of the front electrode via electrode lead-out pads and bonding pads on the heat sink ear-shaped portion. The bonding pad 224 of the front electrode extends onto the second substrate 12 via a trace to the lead-out pad 227 of the front electrode, and is ultimately connected to the outside via corresponding lead-out terminals. The top surface of the fluid pump housing 41 is connected to the top housing pad 223, thereby fixing the pump housing. The upper electrode 45 of the fluid pump is connected to the upper electrode pad 222 and is connected to the corresponding lead-out terminal via the lead-out pad 226 of the upper electrode. Thus, the above design achieves electrical connection between the second power chip 22, the second substrate 12, and the outside.

[0117] In some embodiments, the second metal layer 115 and the fourth metal layer 125 are further provided with low current lead-out pads 110, and the low current electrodes on the front side of the first power chip 21 and the front side of the second power chip 22 are connected to the low current lead-out pads 110 through bonding wires, thereby achieving electrical connection with the outside by using low current pins.

[0118] In some embodiments, such as Figure 16 As shown, the housing 41 includes an insulating housing portion 411, a first metal housing portion 412, and a second metal housing portion 413. The insulating housing portion 411, the first metal housing portion 412, and the second metal housing portion 413 together define the pump body cavity 42. The first metal housing portion 412 is located on the side near the upper electrode 45 and is used to connect the upper electrode 45 and the substrate 1. The second metal housing portion 413 is located on the side near the lower electrode 46 and is used to connect the lower electrode 46 and the substrate 1.

[0119] For example, for Figure 3 The power module shown, because the first power chip 21 is only connected to one side of the heat sink 3 in the power module 10, does not need to have a first metal housing part 412 on the side of the housing 41 near the upper electrode 45. Specifically, refer to... Figure 3 and Figure 17As shown, the housing 41 is made of insulating material. When the bottom end of the housing 41 is welded to the first substrate 11, the lower electrode 46 needs to be connected to the first substrate 11. Therefore, two second metal housing parts 413 are provided on the side of the housing 41 near the lower electrode 46, so as to facilitate the welding connection between the fluid pump 4 and the first substrate 11. At the same time, based on the above design, there is no need to consider the insulation design between the conductive fluid and the pump body cavity 42, and there is no need to apply insulating material to the inner wall of the pump body cavity 42, thereby effectively reducing the difficulty of the manufacturing process.

[0120] For example, for Figure 10 The power module shown has a first power chip 21 and a second power chip 22 connected to both sides of the heat sink 3. Therefore, a metal housing portion needs to be provided on both the side of the housing 41 near the upper electrode 45 and the side near the lower electrode 46. See the specific reference... Figure 15 As shown, the housing 41 is made of insulating material. When the top of the housing 41 is welded to the second substrate 12, the upper electrode 45 needs to be connected to the second substrate 12. Therefore, two first metal housing portions 412 are provided on the side of the housing 41 near the upper electrode 45. When the bottom of the housing 41 is welded to the first substrate 11, the lower electrode 46 needs to be connected to the first substrate 11. Therefore, two second metal housing portions 413 are provided on the side of the housing 41 near the lower electrode 46. Thus, by embedding metal material in both sides of the fluid pump 4 for connection with the first substrate 11 and the second substrate 12 respectively to form metal housing portions, the welding connection between the fluid pump 4 and the first substrate 11 and the second substrate 12 is facilitated. At the same time, based on the above design, there is no need to consider the insulation design between the conductive fluid and the pump body cavity 42.

[0121] In some embodiments, the traces on substrate 1 can be extended in the same direction, for example... Figure 15 The traces on the first substrate 11 and the second substrate 12 shown extend in a single direction, which facilitates the single-sided lead-out design of the power module 10 terminals, facilitates the subsequent design of the vehicle inverter, and helps to improve the integration.

[0122] In some embodiments, such as Figure 6 As shown, the housing 41 is a metal housing. Furthermore, when the housing 41 of the fluid pump 4 is made of metal, since the metal housing is at a different potential from the upper electrode 45 and the lower electrode 46, it is necessary to add insulating material between the housing 41 and the upper electrode 45 and the lower electrode 46. Specifically, a fifth insulating layer 48 is provided on the outside of the upper electrode 45, and one end of the upper electrode 45 is led out to connect to the substrate 1; a sixth insulating layer 49 is provided on the outside of the lower electrode 46, and one end of the lower electrode 46 is led out to connect to the substrate 1. This design achieves the effect of mutual insulation between the metal housing and the upper electrode 45 and the lower electrode 46.

[0123] In some embodiments, when the housing 41 is made of metal, since the fluid is a conductive fluid, an insulating material can be applied to the inner wall of the pump body cavity 42 to ensure the insulation between the conductive fluid and the pump body cavity 42.

[0124] In some embodiments, since the fluid used in this application is a conductive fluid, the heat sink 3 also needs to be insulated from the conductive fluid. Specifically, the heat sink 3 also includes an insulating element 38, which covers the wall of the first fluid through hole 31 or is sleeved on the first fluid through hole 31, thereby achieving an insulating effect and preventing the fluid from forming an electrical connection with the electrodes of the power chip 2.

[0125] For example, refer to Figure 4 As shown, an insulating coating can be applied to the hole wall inside the first fluid through-hole 31 to form an insulating element 38 on the hole wall, or, as... Figure 18 As shown, the insulating component 38 is sleeved on the first fluid through hole 31 to achieve the effect of insulation, thereby effectively ensuring that there is no electrical connection between the fluid and the electrode of the first power chip 21.

[0126] In some embodiments, the fluid channel 5 is either straight or curved.

[0127] For example, refer to Figure 19 or Figure 20 As shown, both the first fluid channel 51 and the second fluid channel 52 adopt a serpentine curved channel design to form the cold end of the first fluid circulation loop, thereby increasing the heat exchange interface of the heat-conducting fluid and improving heat dissipation efficiency. Furthermore, based on the establishment of fluid flow channels on both sides of the substrate 1, that is, the two ends of the substrate 1 are designed with the first interface 111 and the second interface 112 of the fluid channel 5. The first interface 111, the first fluid through hole 31 of the heat sink 3, the second fluid through hole 44 of the fluid pump 4 and the second interface 112 are connected in sequence to form a fluid circulation loop. In this way, the heat generated by the power chip 2 can be transferred from the top of the substrate 1 to the fluid channel 5 at the bottom of the substrate 1, realizing the connection between the cold end and the hot end of the cooling channel.

[0128] In some embodiments, the power module 10 further includes a heat sink 6, which is disposed on the side of the substrate 1 away from the power chip 2. Thus, by utilizing the water-cooling design of the heat sink 6, the heat generated on the front side of the power chip 2 can be transferred to the cold end of the substrate 1 through a fluid circulation loop and the heat sink 6 can achieve heat dissipation through convection between the heat sink 6 and the coolant. At the same time, the heat generated on the back side of the power chip 2 can be directly transferred to the external liquid cooling loop through the substrate 1 and the heat sink 6. Therefore, this application combines the heat sink 6 with the embedded fluid circulation loop to transfer and dissipate the heat generated on both sides of the power chip 2 through the fluid circulation loop and the heat sink, which can further improve the heat dissipation efficiency, improve the temperature environment of the power chip 2, improve the current capability of the power module 10, and improve the reliability of the power module 10.

[0129] In this embodiment, the heat sink 6 can be disposed on the side of the substrate 1 away from the power chip 2 by welding.

[0130] Specifically, for Figure 3 The power module shown has a first fluid circulation loop driven by a fluid pump 4 embedded in the power module 10. By establishing fluid flow channels on both sides of the first substrate 11 to form the first fluid circulation loop, the heat generated on the side of the first power chip 21 away from the first substrate 11 (i.e., the front side of the first power chip 21) can be transferred from the hot end at the top of the first substrate 11 to the cold end at the bottom of the first substrate 11, realizing the connection between the cold end and the hot end of the cooling channel. Then, the excess heat in the first fluid channel 51 is transferred to the external liquid cooling cycle through the heat sink 6. At the same time, the heat generated on the side of the first power chip 21 close to the first substrate 11 is directly transferred to the external liquid cooling cycle through the first substrate 11 and the heat sink 6. Thus, the first power chip 21 is cooled by two parallel heat dissipation channels, thereby maximizing the heat dissipation efficiency of the external water cooling system, effectively reducing the junction temperature of the first power chip 21, effectively improving the operating environment temperature of the power chip 2, and improving the reliability of the power module 10.

[0131] For example, for Figure 10 The power module shown has a first fluid circulation loop and a second fluid circulation loop, both driven by a fluid pump 4 embedded in the power module 4. Based on parallel fluid channels established on the first substrate 11 and the second substrate 12, the fluid pump 4 drives the circulation. Figure 11As shown in the heat transfer path, the heat generated on the front of the first power chip 21 and the front of the second power chip 22 is transferred to the first fluid channel 51 located in the first metal layer 113 and the second fluid channel 52 located in the third metal layer 123 via the heat sink 3, and then the excess heat is transferred to the external liquid cooling cycle via the heat sink 6; at the same time, the heat generated on the back of the first power chip 21 and the back of the second power chip 22 is transferred to the external liquid cooling cycle via the correspondingly connected substrate 1 and heat sink 6, for example... Figure 11 The solid arrow points to the heat transfer path. Thus, by coupling a double-sided water-cooling design with a fluid circulation loop cooling design to achieve three-dimensional heat dissipation, multi-channel parallel cooling of the power chip is realized, effectively improving the current output capability and reliability of the power module.

[0132] It is understandable that the structural design of the power module 10 can be adapted to actual conditions and is not limited to... Figure 3 or Figure 10 The structure of the power module is shown.

[0133] Understandably, regardless Figure 3 or Figure 10 The power module shown is for reference. Figure 11 As shown, each power chip 2 has two parallel heat dissipation channels, namely heat dissipation channel b for transferring heat generated on the front side of the power chip 2 and heat dissipation channel c for transferring heat generated on the back side of the power chip 2. They are coupled to the heat sink 6 at the bottom of the corresponding substrate 1, and the heat is transferred to the external water cooling system through the fins or pins of the heat sink 6 to achieve heat dissipation of the power module.

[0134] A second aspect of the present invention provides an inverter, such as Figure 21 As shown, the inverter 20 includes at least one power module 10 as provided in the above embodiment.

[0135] The inverter 20 according to the embodiments of the present invention, by employing the power module 10 provided in the above embodiments, can improve the operating temperature of the power chip and improve the reliability of the power module.

[0136] A third aspect of the present invention provides a motor controller, such as... Figure 22 As shown, the motor controller 30 includes at least one power module 10 as provided in the above embodiment.

[0137] According to the embodiment of the present invention, the motor controller 30, by employing the power module 10 provided in the above embodiment, can improve the operating temperature of the power chip and enhance the reliability of the power module.

[0138] A fourth aspect of the present invention provides a vehicle, such as Figure 23 As shown, the vehicle 100 includes the motor controller 30 provided in the above embodiment.

[0139] According to the vehicle 100 of the present invention, by adopting the motor controller 30 provided in the above embodiment, the operating temperature of the power chip can be improved and the reliability of the power module can be enhanced.

[0140] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0141] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A power module, characterized in that, include: A substrate, wherein a fluid channel is provided within the substrate; A power chip, wherein the power chip is disposed on the substrate; A heat sink is connected to the side of the power chip away from the substrate. The heat sink has a first fluid through hole. A first end of the first fluid through hole is connected to a first interface of the fluid channel, and a second end of the first fluid through hole is connected to a second interface of the fluid channel to form a fluid circulation loop. A fluid pump is provided on the fluid circulation loop and is used to drive a conductive fluid to circulate in the fluid circulation loop using the principle of magnetohydrodynamics. The heat sink includes a cavity, a first heat sink, and a first insulating layer, wherein the first insulating layer is located between the cavity and the first heat sink; The substrate includes a first substrate, the first substrate having a first fluid channel, and the first substrate including a first metal layer, a second insulating layer and a second metal layer stacked sequentially. The first fluid channel is formed in the first metal layer, and the first fluid channel has a first fluid inlet and a first fluid outlet; The second insulating layer has a first channel hole and a second channel hole, the first channel hole being connected to the first fluid inlet and the second channel hole being connected to the first fluid outlet; The second metal layer has a third channel hole and a fourth channel hole. The third channel hole is connected to the first channel hole to serve as a first interface of the first fluid channel, and the fourth channel hole is connected to the second channel hole to serve as a second interface of the first fluid channel.

2. The power module according to claim 1, characterized in that, The first interface of the first fluid channel is connected to the first end of the first fluid through hole, and the second interface of the first fluid channel is connected to the second end of the first fluid through hole to form a first fluid circulation loop; The power chip includes a first power chip, which is disposed on the first substrate, and the side of the first power chip away from the first substrate is connected to the lower surface of the heat sink. The fluid pump is used to drive the fluid to circulate in the first fluid circulation loop.

3. The power module according to claim 2, characterized in that, The cavity defines the first fluid through-hole; the lower surface of the first heat sink is connected to the side of the first power chip away from the first substrate.

4. The power module according to claim 3, characterized in that, The side of the first power chip away from the first substrate is provided with a front electrode of the first power chip; The heat sink also includes an ear-shaped portion, which is disposed on the side of the first heat sink. The ear-shaped portion is provided with an electrode lead-out pad, which is connected to the front electrode of the first power chip.

5. The power module according to claim 4, characterized in that, The fluid pump includes: A housing disposed on the first substrate, the housing defining a pump body cavity; A pump body is disposed in the pump body cavity, and the pump body defines a second fluid through hole, which communicates with the first fluid through hole and the first fluid channel. An upper electrode is provided on the top of the pump body, a lower electrode is provided on the bottom of the pump body, and a permanent magnet is provided on the side of the pump body; When the upper electrode and the lower electrode are energized, an electric field is generated, and the permanent magnet generates a magnetic field. The electric field and the magnetic field drive the flow of conductive fluid in the second fluid through hole.

6. The power module according to claim 5, characterized in that, The second metal layer is further provided with a first connection pad that is connected to the back electrode of the first power chip, the upper electrode of the fluid pump, the lower electrode, the housing and the electrode lead-out pad, and a first lead-out pad that is connected to the first connection pad.

7. The power module according to claim 5, characterized in that, The substrate further includes a second substrate, the second substrate having a second fluid channel, a first interface of the second fluid channel being connected to a first end of the first fluid through hole, and a second interface of the second fluid channel being connected to a second end of the first fluid through hole to form a second fluid circulation loop; The power chip also includes a second power chip, which is disposed on the second substrate, and the side of the second power chip away from the second substrate is connected to the upper surface of the heat sink. The fluid pump is also used to drive the fluid to circulate in the second fluid circulation loop.

8. The power module according to claim 7, characterized in that, The heat sink also includes: The second heat sink has its upper surface connected to the side of the second power chip that is away from the second substrate. A third insulating layer is located between the second heat sink and the cavity.

9. The power module according to claim 8, characterized in that, The second power chip has a front electrode on the side away from the second substrate. The electrode lead-out pad is also connected to the front electrode of the second power chip.

10. The power module according to claim 9, characterized in that, The second substrate includes: A third metal layer, wherein the second fluid channel is formed in the third metal layer, the second fluid channel having a second fluid inlet and a second fluid outlet; A fourth insulating layer is disposed on the third metal layer. The fourth insulating layer has a fifth channel hole and a sixth channel hole. The fifth channel hole is connected to the second fluid inlet, and the sixth channel hole is connected to the second fluid outlet. A fourth metal layer is disposed on the fourth insulating layer. The fourth metal layer has a seventh channel hole and an eighth channel hole. The seventh channel hole is connected to the fifth channel hole to serve as a first interface of the second fluid channel, and the eighth channel hole is connected to the sixth channel hole to serve as a second interface of the second fluid channel.

11. The power module according to claim 10, characterized in that, The second metal layer is further provided with a second connection pad corresponding to the back electrode of the first power chip, the lower electrode of the fluid pump, the housing and the electrode lead-out pad, and a second lead-out pad corresponding to the second connection pad; The fourth metal layer is further provided with a third connection pad that is connected to the back electrode of the second power chip, the upper electrode of the fluid pump and the housing, and a third lead-out pad that is connected to the third connection pad.

12. The power module according to claim 5 or 11, characterized in that, The housing includes: An insulating housing portion, a first metal housing portion, and a second metal housing portion are provided, which together define the pump body cavity. The first metal housing portion is located on the side close to the upper electrode and is used to connect the upper electrode and the substrate; The second metal housing portion is located on the side near the lower electrode and is used to connect the lower electrode and the substrate.

13. The power module according to claim 5, characterized in that, The casing is a metal casing; A fifth insulating layer is provided on the outside of the upper electrode, and one end of the upper electrode is led out to connect with the substrate; A sixth insulating layer is provided on the outside of the lower electrode, and one end of the lower electrode is led out to connect to the substrate.

14. The power module according to claim 3 or 8, characterized in that, The heat sink further includes an insulating component, which covers the wall of the first fluid through hole or is sleeved on the first fluid through hole.

15. The power module according to any one of claims 1-10, characterized in that, The fluid channel can be straight or curved.

16. The power module according to claim 1, characterized in that, The power module also includes: A heat sink is disposed on the side of the substrate away from the power chip.

17. An inverter, characterized in that, It includes at least one power module as described in any one of claims 1-16.

18. A motor controller, characterized in that, It includes at least one power module as described in any one of claims 1-16.

19. A vehicle, characterized in that, Includes the motor controller as described in claim 18.

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