Cooling system, data center arrangement and control method of a cooling system

Abstract

The application provides a cooling system, which comprises a heat pipe system and a liquid cooling system, the liquid cooling system forms a circulating cooling flow path, at least one cold plate heat exchanger is arranged on the circulating cooling flow path, and the cold plate heat exchanger is arranged in the cabinet body and used for cooling a load to be cooled; the heat pipe system comprises at least one heat pipe, the at least one heat pipe has an evaporation section and a condensation section, the evaporation section is used for being coupled with the circulating cooling flow path to absorb heat of the circulating cooling flow path, and the condensation section is arranged outside the cabinet body and used for releasing heat to the external environment. In the application, the heat pipe heat exchange structure and the heat exchange pipeline are combined to perform heat exchange on the cooling liquid in the cold plate heat exchanger, so that the intermediate heat exchanger is replaced, the heat exchange efficiency can be improved, the cost can be saved, the assembly components can be reduced, and the production effect is improved.

Description

Technical Field

[0001] This invention relates to the field of server rack cooling technology, and more specifically, to a cooling system, a data center setup, and a control method for the cooling system. Background Technology

[0002] With the booming development of mobile internet, cloud computing and big data, data centers supporting mobile internet, cloud computing and big data are growing explosively, and the performance requirements for server equipment are getting higher and higher. The reliability of electronic components is sensitive to temperature, which poses a severe challenge to traditional low thermal efficiency air cooling technology. Therefore, liquid cooling technology has gradually become a research hotspot for heat dissipation technology of high-density servers.

[0003] Cold plate liquid cooling technology is relatively mature and has been widely used. High heat flux density electronic components generate enormous heat during operation. To avoid excessively high temperatures affecting the performance and operational stability of electronic components, a liquid cooling plate is placed in direct contact with the electronic components. The low-temperature coolant flows within the liquid cooling plate, absorbing the heat generated by the electronic components, and then the heat is transferred to the outdoor environment through an intermediate heat exchanger.

[0004] However, the heat exchange efficiency of the intermediate heat exchanger is limited. If the temperature of the cryogenic coolant cannot be reduced quickly, it will affect the cooling efficiency of the liquid cooling plate and the normal operation of the electronic components in the cabinet. Summary of the Invention

[0005] This application is based on the inventor's discovery and understanding of the following problems and facts.

[0006] The present invention aims to at least partially solve one of the above-mentioned technical problems.

[0007] According to a first aspect of this disclosure, a cooling system is provided, the cooling system being applied to a server rack, the server rack including a cabinet, the cabinet housing multiple loads to be cooled, including: a heat pipe system and a liquid cooling system.

[0008] The liquid cooling system forms a circulating cooling flow path, and at least one cold plate heat exchanger is provided on the circulating cooling flow path. The cold plate heat exchanger is located inside the cabinet and is used to cool the load to be dissipated.

[0009] The heat pipe system includes at least one heat pipe having an evaporation section and a condensation section. The evaporation section is used to thermally couple with the circulating cooling flow path to absorb heat from the circulating cooling flow path, and the condensation section is located outside the cabinet to release heat to the external environment.

[0010] In some embodiments, the heat exchange pipeline includes: an inlet pipe, an outlet pipe, and a return pipe;

[0011] The inlet and outlet of the cold plate heat exchanger are connected to the inlet pipe and the outlet pipe, respectively. The two ends of the return pipe are connected to the inlet pipe and the outlet pipe, respectively. A pumping device is installed in the return pipe.

[0012] The evaporation section is provided in both the inlet pipe and the outlet pipe.

[0013] In some embodiments, each of the cold plate heat exchangers includes a plurality of interconnected liquid cooling plates for contacting the load to be cooled.

[0014] In some embodiments, each of the cold plate heat exchangers is provided with a flow regulating valve in the pipeline connecting it to the liquid inlet pipe.

[0015] In some embodiments, the lowest end of the condensation section is higher than the highest end of the evaporation section.

[0016] In some embodiments, it also includes:

[0017] A waste heat recovery device, comprising: a water storage tank, a waste heat recovery inlet pipe, and a waste heat recovery return pipe;

[0018] The waste heat recovery inlet pipe and the waste heat recovery return pipe are respectively connected to the inlet and outlet of the water storage tank, and the condensation section is installed in the water storage tank.

[0019] According to an embodiment of a second aspect of the present invention, a data center setup is provided, comprising:

[0020] Multiple server racks and multiple of the aforementioned cooling systems.

[0021] In some embodiments, each of the evaporation sections of the cooling system is provided with an insulation section and a condensation section;

[0022] Alternatively, multiple cooling systems may be provided with a condensation section, and the evaporation section of each cooling system may be connected to the condensation section via an insulation section.

[0023] According to an embodiment of a third aspect of the present invention, a method for controlling a cooling system is provided, comprising: acquiring the heat dissipation requirements of a load to be cooled;

[0024] Adjust the cooling intensity according to the heat dissipation requirements of the load to be cooled.

[0025] In some embodiments, obtaining the heat dissipation requirements of the load to be cooled includes:

[0026] Obtain the temperature of each of the loads to be cooled;

[0027] The average temperature of the load to be cooled is derived from the temperature of each load to be cooled.

[0028] In some embodiments, adjusting the cooling intensity according to the heat dissipation requirements of the load to be cooled includes:

[0029] Adjust the flow rate of the coolant in the heat exchange pipeline according to the average temperature of the load to be cooled.

[0030] In some embodiments, if the average temperature of the load to be cooled is greater than 0.8 to 0.9 times the allowable temperature, the power of the pumping device is increased until the average temperature of the load to be cooled is lower than 0.8-0.9 times the allowable temperature but greater than 0.6-0.7 times the allowable temperature, then the increase in the power of the pumping device is stopped and maintained.

[0031] If the average temperature of the load to be cooled is less than 0.6-0.7 times the allowable temperature, the power of the pumping device is reduced until the average temperature of the load to be cooled exceeds 0.6-0.7 times the allowable temperature but is less than 0.8-0.9 times the allowable temperature. Then, the power reduction of the pumping device is stopped and maintained.

[0032] According to the cooling system of the present invention, the coolant in the cooling structure can be transported to the heat exchange pipeline, and then the heat of the coolant can be quickly removed by the evaporation section of the heat pipe heat exchange structure set in the heat exchange pipeline. There is no need to set up an intermediate heat exchanger. Instead, the heat pipe heat exchange structure and the cold plate liquid-cooled cabinet are integrated into one unit. The coolant in the cold plate heat exchanger of the cabinet is cooled by the heat pipe heat exchange system. This not only saves costs, but also greatly improves the heat exchange efficiency by exchanging heat through the contact between the evaporation section and the coolant, thus meeting the heat dissipation requirements of the cabinet.

[0033] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a structure according to an embodiment of the present invention;

[0035] Figure 2 This is an embodiment of the present invention. Figure 1 Schematic diagram of the cross-sectional structure at point AA;

[0036] Figure 3 This is an embodiment of the present invention. Figure 2 Schematic diagram of the cross-sectional structure at point BB;

[0037] Figure 4 This is a structural schematic diagram from another perspective of an embodiment of the present invention.

[0038] Figure Labels

[0039] 1. Condensation section; 2. Insulation section; 3. Evaporation section; 4. Liquid outlet pipe; 5. Liquid outlet pipe connector; 6. Liquid pump device; 7. Liquid inlet pipe; 8. Liquid inlet pipe connector; 9. Liquid return pipe; 10. Liquid cooling plate; 11. Cabinet. Detailed Implementation

[0040] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0041] Throughout the specification and claims, the following terms will have at least the meaning explicitly associated herein, unless the context otherwise requires. The meanings defined below are not intended to limit the terms, but are merely illustrative examples.

[0042] In the description of this invention, the phrase "in one embodiment" does not necessarily refer to the same embodiment, although it may refer to the same embodiment. Similarly, the phrase "in some embodiments," as used herein, does not necessarily refer to the same embodiment when used multiple times, although it may refer to the same embodiment. As used herein, the term "or" is an inclusive "or" operator and is equivalent to the term "and / or," unless the context clearly specifies otherwise. The term "based on" is not exclusive and allows for reliance on additional factors not described, unless the context clearly specifies otherwise. The word "exemplary" herein means "used as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior to or better than other embodiments. The scope of this invention is limited only by the scope of the appended claims, and any examples set forth in this specification are not intended to be limiting, but merely illustrate some of the many possible embodiments of the claimed invention. The various embodiments provided in this invention should not be construed as limiting the scope of protection of this invention.

[0043] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0045] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] With the booming development of mobile internet, cloud computing and big data, data centers supporting mobile internet, cloud computing and big data are growing explosively, and the performance requirements for server equipment are getting higher and higher. The reliability of electronic components is sensitive to temperature, which poses a severe challenge to traditional low thermal efficiency air cooling technology. Therefore, liquid cooling technology has gradually become a research hotspot for heat dissipation technology of high-density servers.

[0048] On the one hand, in the existing technology, the cold plate heat exchanger in the cabinet usually cools down each load to be cooled, and then the intermediate heat exchanger releases heat to the coolant in the cold plate heat exchanger. However, the efficiency of the intermediate heat exchanger is limited. If the temperature of the low-temperature coolant cannot be reduced quickly, it will affect the cooling efficiency of the cold plate heat exchanger, affect the normal operation of the load to be cooled in the cabinet, and affect the service life of the load to be cooled.

[0049] Example 1

[0050] Based on this, such as Figures 1-4As shown, according to an embodiment of the present invention, a cooling system is applied to a server rack, the server rack including a cabinet, and multiple loads to be cooled are disposed within the cabinet, including: a heat pipe system and a liquid cooling system.

[0051] The liquid cooling system forms a circulating cooling flow path, and at least one cold plate heat exchanger is provided on the circulating cooling flow path. The cold plate heat exchanger is located inside the cabinet and is used to cool the load to be dissipated.

[0052] The heat pipe system includes at least one heat pipe having an evaporation section 3 and a condensation section 1. The evaporation section 3 is used for thermal coupling with the circulating cooling flow path to absorb heat from the circulating cooling flow path, and the condensation section 1 is located outside the cabinet to release heat to the external environment.

[0053] Specifically, the load to be cooled can be the central processing unit (CPU). Since the CPU generates a lot of heat when it is working, the air cooling system in the rack alone cannot meet the CPU's heat dissipation needs. In the existing technology, a cold plate heat exchanger is used to dissipate heat from the CPU and other electronic components with large heat dissipation requirements.

[0054] The cooling structure includes multiple cold plate heat exchangers. Each cold plate heat exchanger can correspond to one layer of electronic units in the cabinet. The cold plate heat exchanger can be equipped with multiple interconnected liquid cooling plates 10. Each liquid cooling plate 10 corresponds to a load to be cooled in this layer of electronic units. It provides targeted cooling for loads with high cooling requirements, ensures the normal operation of the loads to be cooled, and avoids excessive temperature from affecting the performance of the electronic units or even affecting the lifespan of the electronic units.

[0055] This application replaces the intermediate heat exchanger with heat exchange piping and a heat pipe heat exchange structure integrated into the cabinet. The coolant, which has absorbed a large amount of heat in the cold plate heat exchanger, enters the heat exchange piping and comes into full contact with the evaporation section 3 of the heat pipe heat exchange structure. This allows the refrigerant in the evaporation section 3 to absorb a large amount of heat and vaporize. The vaporized refrigerant then enters the condensation section 1 through the insulation section 2, condenses in the condensation section 1, and flows back into the evaporation section 3. The coolant that has released heat returns to the cold plate heat exchanger through the heat exchange piping for the next round of cooling. By improving the cabinet and heat exchange piping, not only can the intermediate heat exchanger be eliminated, reducing assembly parts, saving costs, and improving production assembly efficiency, but the coolant can also quickly release heat during circulation, allowing for faster circulation, improving coolant utilization efficiency, increasing the heat release efficiency of the coolant, and enhancing the cooling intensity of the cold plate refrigerator.

[0056] The coolant can be deionized water or propylene glycol solution.

[0057] According to the cooling system of the present invention, the coolant in the cooling structure can be transported to the heat exchange pipeline, and then the heat of the coolant can be quickly removed by the evaporation section 3 of the heat pipe heat exchange structure set in the heat exchange pipeline. There is no need to set up an intermediate heat exchanger. Instead, the heat pipe heat exchange structure and the cold plate liquid-cooled cabinet are integrated into one unit. The coolant in the cold plate heat exchanger of the cabinet is cooled by the heat pipe heat exchange system. This not only saves costs, but also greatly improves the heat exchange efficiency by exchanging heat through the contact between the evaporation section 3 and the coolant, thus meeting the heat dissipation requirements of the cabinet.

[0058] In some embodiments, the heat exchange pipeline includes: an inlet pipe 7, an outlet pipe 4, and a return pipe 9;

[0059] The inlet and outlet of the cold plate heat exchanger are connected to the inlet pipe 7 and the outlet pipe 4, respectively. The two ends of the return pipe 9 are connected to the inlet pipe 7 and the outlet pipe 4, respectively. A pumping device 6 is installed in the return pipe 9.

[0060] Both the inlet pipe 7 and the outlet pipe 4 are equipped with an evaporation section 3.

[0061] Specifically, the inlet pipe 7 and outlet pipe 4 can be rigid pipes with a large diameter. The inlet pipe 7 and outlet pipe 4 can be fixed to the outer walls of both sides of the cabinet, and the return pipe 9 can be fixed to the outer wall of the bottom side of the cabinet. The coolant in the heat exchange pipeline can enter the cold plate heat exchanger from the inlet pipe 7. After heat exchange with the load to be cooled through the cold plate heat exchanger, a large amount of heat energy is removed and the coolant enters the outlet pipe 4 from the cold plate heat exchanger. The coolant in the outlet pipe 4 is driven by the pump device 6 in the return pipe 9 to flow back into the inlet pipe 7 and re-enter the cold plate heat exchanger to complete the circulation of the coolant. During this circulation process, when the coolant flows in the inlet pipe 7 and outlet pipe 4, it can fully contact the evaporation section 3 and transfer heat to the coolant in the evaporation section 3 to complete the heat release. This replaces the intermediate heat exchanger in the prior art, which can not only improve the heat exchange efficiency but also save costs.

[0062] The liquid pump device can be a water pump, which can provide power for the coolant.

[0063] In some embodiments, each cold plate heat exchanger includes a plurality of interconnected liquid cooling plates 10, which are used to contact the load to be cooled.

[0064] Specifically, the liquid cooling plates 10 can be connected in series and placed one by one on the load to be cooled according to the flow direction of the coolant, from large to small. They can also be connected in parallel to make the temperature of the coolant entering each liquid cooling plate 10 the same and the cooling intensity of each liquid cooling plate 10 the same. The liquid cooling plates 10 are in direct contact with the load to be cooled, and can quickly remove the heat dissipated by the load.

[0065] In some embodiments, a flow regulating valve is provided in the pipeline connecting each cold plate heat exchanger to the liquid inlet pipe 7.

[0066] Specifically, the inlet pipe 7 and the outlet pipe 4 are each equipped with multiple inlet pipe 7 connectors and outlet pipe 4 connectors. The cold plate heat exchanger is connected to the inlet pipe 7 connectors and outlet pipe 4 connectors via pipelines. A flow regulating valve is installed in the pipeline between the inlet pipe 7 and the cold plate heat exchanger. The flow regulating valve can be electrically connected to the control module of the cabinet. By adjusting the flow regulating valve, the flow rate of the coolant entering the cold plate heat exchanger from the inlet pipe 7 can be changed. In this way, the cooling intensity of the cold plate heat exchanger can be adjusted according to different heat dissipation needs, so that the cooling system can meet the cooling needs while reducing energy consumption.

[0067] In some embodiments, the lowest end of the condensation section 1 is higher than the highest end of the evaporation section 3.

[0068] Specifically, the height difference between the condensing section 1 and the evaporating section 3 not only allows the vaporized coolant to enter the condensing section 1 more smoothly, but also allows the liquid coolant in the condensing section 1 to enter the evaporating section 3 under the action of gravity. This eliminates the need for an additional liquid pump, effectively saving energy and reducing cooling costs.

[0069] In some embodiments, it also includes:

[0070] The waste heat recovery device includes: a water storage tank, a waste heat recovery inlet pipe, and a waste heat recovery return pipe;

[0071] The waste heat recovery inlet pipe and waste heat recovery return pipe are connected to the inlet and outlet of the water storage tank, respectively, and the condensation section 1 is installed in the water storage tank.

[0072] Specifically, the low-temperature environment of the condensing section 1 can be a water storage tank. The cooling section can be completely submerged in the coolant in the water storage tank. The waste heat recovery inlet pipe is connected to the external cold source water circuit. The water storage tank can continuously replace the coolant in the tank through the waste heat recovery inlet pipe and the waste heat recovery pipe. The coolant can not only quickly remove the heat from the condensing section 1 and liquefy the internal coolant, but also carry the heat to the next device, which can be a heating device or other machines that need a heat source, to achieve waste heat recovery.

[0073] Example 2

[0074] This application also provides a data center facility, including: multiple server racks 11 and multiple cooling systems as described above.

[0075] Specifically, the data center setup may include multiple server racks 11, and each server rack 11 may correspond to a cooling system for cooling, ensuring that the electronic components inside the rack operate normally and avoiding overheating.

[0076] In some embodiments, each cooling system evaporation section 3 is provided with an insulation section 2 and a condensation section 1;

[0077] Alternatively, multiple cooling systems may be provided with a condensation section 1, and the evaporation section 3 of each cooling system may be connected to the condensation section 1 through an insulation section 2.

[0078] Specifically, each cabinet's cooling system can be equipped with an insulation section 2 and a condensation section 1 to cool the coolant, or the coolant in each cabinet's cooling system can be transported through the insulation section 2 to a condensation section 1 for centralized cooling of the coolant in each cooling system.

[0079] Example 3

[0080] This application also provides a method for controlling a cooling system, including:

[0081] Obtain the heat dissipation requirements of the load to be cooled;

[0082] Adjust the cooling intensity according to the heat dissipation requirements of the load to be cooled.

[0083] Specifically, the higher the temperature of the load to be cooled, the greater the cooling demand. The load to be cooled can be a central processing unit (CPU). The CPU has a built-in temperature acquisition module that transmits the temperature signal to the control module. The control module can then control the cooling intensity of the cooling system based on the real-time temperature signal. This can meet the cooling demand of the load to be cooled while reducing energy consumption and saving energy.

[0084] In some embodiments, the temperature of each load to be cooled is obtained;

[0085] The average temperature of the load to be cooled is derived from the temperature of each load to be cooled.

[0086] Specifically, the heat dissipation requirements of the load to be cooled depend on the heat generated by the load. Under the premise that other conditions remain unchanged, the higher the temperature of the load to be cooled, the greater the heat generated by the load and the higher the heat dissipation requirements. The temperature acquisition module of the central processing unit can obtain the real-time temperature and transmit the temperature signal to the control module. The control module can process the temperature signal, add up the temperatures of each load to be cooled, and then divide by the number of loads to be cooled to obtain the average temperature of the load to be cooled.

[0087] In some embodiments, the flow rate of coolant in the cold plate heat exchanger is adjusted according to the temperature of each load to be cooled.

[0088] Specifically, the faster the coolant flows in the cold plate heat exchanger, the higher the cooling intensity of the cold plate heat exchanger. By regulating the flow rate of the coolant entering each cold plate heat exchanger through the flow regulating valve, the coolant distribution can be more reasonable, and each load to be cooled can be effectively cooled.

[0089] In some embodiments, the flow rate of the coolant in the heat exchange pipeline is adjusted according to the average temperature of the load to be cooled.

[0090] Specifically, when the average temperature of the load to be cooled is high, the circulation speed of the coolant can be increased by the pump device 6, and when the average temperature is low, the power of the pump device 6 can be reduced to reduce energy consumption.

[0091] In some embodiments, if the average temperature of the load to be cooled is greater than 0.8 to 0.9 times the allowable temperature, the power of the pumping device 6 is increased until the average temperature of the load to be cooled is lower than 0.8-0.9 times the allowable temperature but greater than 0.6-0.7 times the allowable temperature, then the increase in the power of the pumping device 6 is stopped and maintained.

[0092] If the average temperature of the load to be cooled is less than 0.6-0.7 times the allowable temperature, reduce the power of the pump device 6 until the average temperature of the load to be cooled exceeds 0.6-0.7 times the allowable temperature but is less than 0.8-0.9 times the allowable temperature. Then stop reducing the power of the pump device 6 and maintain it.

[0093] Specifically, the power of the pump device 6 can be controlled by the control module of the cabinet based on the temperature signal collected by the load to be cooled, and the cooling intensity of the cooling system can be adjusted so that the load to be cooled is in a good operating temperature range, while minimizing energy consumption and saving energy.

[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0095] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cooling system applied to a server rack, the server rack comprising a cabinet, wherein a plurality of loads to be cooled are disposed within the cabinet, characterized in that, The cooling system includes a heat pipe system and a liquid cooling system, wherein... The liquid cooling system forms a circulating cooling flow path, and at least one cold plate heat exchanger is provided on the circulating cooling flow path. The cold plate heat exchanger is located inside the cabinet and is used to cool the load to be dissipated. The heat pipe system includes at least one heat pipe having an evaporation section (3) and a condensation section (1). The evaporation section (3) is used to thermally couple with the circulating cooling flow path to absorb the heat of the circulating cooling flow path. The condensation section (1) is located outside the cabinet to release heat to the external environment. The circulating cooling path also includes: a pump (6), an inlet pipe (7), an outlet pipe (4), and a return pipe (9); The inlet of the cold plate heat exchanger is connected to the inlet pipe (7), and the outlet is connected to the outlet pipe (4). The two ends of the return pipe (9) are connected to the inlet pipe (7) and the outlet pipe (4) respectively. The pumping device (6) is installed on the return pipe (9). The liquid inlet pipe (7) and the liquid outlet pipe (4) are respectively provided with a heat pipe, and the liquid inlet pipe (7) and the liquid outlet pipe (4) are respectively coupled to the evaporation section (3) of the heat pipe on the same side.

2. The cooling system according to claim 1, characterized in that, The flow rate and / or velocity of the circulating cooling path are adjusted according to the heat dissipation requirements of the plurality of loads to be cooled.

3. The cooling system according to claim 1, characterized in that, The inlet pipe (7) and the outlet pipe (4) are respectively fitted together with the evaporation section (3) of the heat pipe on the same side.

4. The cooling system according to claim 3, characterized in that, The inlet pipe (7) and the outlet pipe (4) are located on both sides of the cabinet, and the return pipe (9) is located at the bottom of the cabinet. The lowest position of the condensing section (1) on the cabinet is higher than the highest position of the evaporating section (3) on the cabinet.

5. The cooling system according to claim 1, characterized in that, Also includes: A waste heat recovery device, comprising: a water storage tank, a waste heat recovery inlet pipe, and a waste heat recovery return pipe; The waste heat recovery inlet pipe and the waste heat recovery return pipe are respectively connected to the inlet and outlet of the water storage tank, and the condensation section (1) is installed in the water storage tank.

6. The cooling system according to claim 4, characterized in that, Each of the cold plate heat exchangers includes a plurality of interconnected liquid cooling plates (10), each of the liquid cooling plates (10) being used for heat exchange in contact with the load to be cooled; Each of the cold plate heat exchangers is equipped with a flow regulating valve in the pipeline connecting it to the liquid inlet pipe (7).

7. A data center facility, characterized in that, include: Multiple server racks and multiple cooling systems as described in any one of claims 1-6.

8. The data center facility according to claim 7, characterized in that, Each of the evaporation sections (3) of the cooling system is provided with an insulation section (2) and a condensation section (1); Alternatively, multiple cooling systems may be provided with a condensation section (1), and the evaporation section (3) of each cooling system may be connected to the condensation section (1) through an insulation section (2).

9. A control method for the cooling system according to any one of claims 1-6, characterized in that, include: Obtain the temperature of each of the loads to be cooled; The average temperature of the multiple loads to be cooled is derived based on the temperature of each of the loads to be cooled. Adjust the flow rate and / or velocity of the circulating cooling path according to the average temperature of the load to be cooled.

10. The control method according to claim 9, characterized in that, The step of adjusting the flow rate and / or velocity of the circulating cooling path according to the average temperature of the load to be cooled includes: If the average temperature of the load to be cooled is greater than or equal to the first preset temperature, the power of the pump device (6) is increased until the average temperature of the load to be cooled is lower than the first preset temperature but higher than the second preset temperature, then the power of the pump device (6) is stopped and maintained. If the average temperature of the load to be cooled is less than the second preset temperature, the power of the pumping device (6) is reduced until the average temperature of the load to be cooled is greater than the second preset temperature and less than the first preset temperature. Then the power reduction of the pumping device (6) is stopped and maintained. The first preset temperature is (0.8-0.9) times the maximum threshold temperature of the load to be cooled; The second preset temperature is (0.6-0.7) times the maximum threshold temperature of the load to be cooled.

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