Light-emitting panel and its preparation method, light-emitting device

Abstract

A light-emitting panel includes a display area (AA) and a peripheral area (BB) located on at least one side of the display area (AA). The display area (AA) is provided with at least one light-emitting element (10). The light-emitting element (10) includes a first electrode (101), a second electrode (102), and an organic light-emitting layer (103) disposed between the first electrode (101) and the second electrode (102). In a direction perpendicular to the light-emitting panel, the light-emitting panel includes at least a substrate (200), and a first conductive layer (21) and a second conductive layer (22) located on the substrate (200). The first conductive layer (21) includes at least one first signal line (11). The second conductive layer (22) includes the first electrode (101) of the light-emitting element (10). The first conductive layer (21) is in direct contact with the second conductive layer (22), and the first electrode (101) of the light-emitting element (10) is connected to the first signal line (11).

Description

Technical Field

[0001] This article relates to, but is not limited to, the field of display technology, and in particular to a light-emitting panel and its preparation method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and quantum dot light-emitting diodes (QLEDs) are active light-emitting display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0004] This disclosure provides a light-emitting panel, a method for preparing the same, and a light-emitting device.

[0005] On one hand, this embodiment provides a light-emitting panel, including: a display area and a peripheral area located on at least one side of the display area. The display area is provided with at least one light-emitting element, the light-emitting element including: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. In a direction perpendicular to the light-emitting panel, the light-emitting panel includes at least: a substrate, and a first conductive layer and a second conductive layer disposed on the substrate. The first conductive layer includes: at least one first signal trace. The second conductive layer includes: a first electrode of the light-emitting element. Wherein, the first conductive layer and the second conductive layer are in direct contact, and the first electrode of the light-emitting element is directly connected to the first signal trace; or, a first insulating layer is disposed between the first conductive layer and the second conductive layer, the first electrode of the light-emitting element is connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer on the substrate overlaps with the orthographic projection of the light-emitting portion of the light-emitting element on the substrate.

[0006] In some exemplary embodiments, the first signal trace in the display area includes a first extension; the first extension is mesh-shaped, and the orthographic projection of the first extension on the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace on the substrate.

[0007] In some exemplary embodiments, the first signal trace further includes a second extension that extends from the display area to the peripheral area and is connected to the first extension.

[0008] In some exemplary embodiments, the display area is further provided with at least one auxiliary trace, which is in the same layer as the first electrode of the light-emitting element. The auxiliary trace is in direct contact with the second extension of the first signal trace, and the orthographic projection of the auxiliary trace on the substrate overlaps with the orthographic projection of the second extension of the first signal trace on the substrate.

[0009] In some exemplary embodiments, the second conductive layer is in direct contact with the first conductive layer, and the second conductive layer is located on the side of the first conductive layer away from the substrate.

[0010] In some exemplary embodiments, in the display area, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate.

[0011] In some exemplary embodiments, in the peripheral region, the orthographic projection of the second conductive layer on the substrate overlaps with the orthographic projection of the first conductive layer on the substrate.

[0012] In some exemplary embodiments, the second conductive layer is in direct contact with the first conductive layer, and the second conductive layer is located on the side of the first conductive layer closer to the substrate.

[0013] In some exemplary embodiments, the display area is further provided with a pixel definition layer having a plurality of pixel openings that expose at least a portion of the first electrode of the light-emitting element; the organic light-emitting layer of the light-emitting element contacts the first electrode of the light-emitting element through the pixel openings; the second electrode of the light-emitting element is located on the side of the pixel definition layer away from the substrate, and the second electrode of the light-emitting element contacts the organic light-emitting layer of the light-emitting element; the portion of the light-emitting element located at the pixel openings is used to emit light.

[0014] In some exemplary embodiments, the surrounding area is provided with a plurality of blocking dams, at least one of which surrounds the display area; the plurality of blocking dams are of the same layer as the pixel definition layer, and the plurality of blocking dams are arranged sequentially and continuously along a direction away from the display area.

[0015] In some exemplary embodiments, the total length of the plurality of barrier dams is greater than 144 micrometers along a direction away from the display area.

[0016] In some exemplary embodiments, the material of the first conductive layer includes a metallic material, and the material of the second conductive layer includes a transparent conductive material.

[0017] On the other hand, this embodiment provides a light-emitting device, including: a light-emitting panel as described above.

[0018] On the other hand, this embodiment provides a method for fabricating a light-emitting panel. The light-emitting panel includes a display area and a peripheral area located on at least one side of the display area. The display area is provided with at least one light-emitting element. The light-emitting element includes: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. The fabrication method includes: forming a first conductive layer and a second conductive layer on a substrate. The first conductive layer includes at least one first signal trace, and the second conductive layer includes: a first electrode of the light-emitting element; the first conductive layer and the second conductive layer are in direct contact, and the first electrode of the light-emitting element is connected to the first signal trace.

[0019] In some exemplary embodiments, the first signal trace in the display area includes a first extension; the first extension is mesh-shaped, and the orthographic projection of the first extension on the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace on the substrate.

[0020] In some exemplary embodiments, forming the first conductive layer and the second conductive layer on the substrate includes: sequentially forming the first conductive layer and the second conductive layer in direct contact on the substrate, wherein, in the display area, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate; or, sequentially forming the second conductive layer and the first conductive layer in direct contact on the substrate.

[0021] In some exemplary embodiments, the fabrication method further includes: forming a pixel definition layer on the substrate, the pixel definition layer having a plurality of pixel openings exposing at least a portion of the first electrode of the light-emitting element; forming an organic light-emitting layer and a second electrode of the light-emitting element; wherein the organic light-emitting layer of the light-emitting element is in contact with the first electrode of the light-emitting element through the pixel openings; and the second electrode of the light-emitting element is in contact with the organic light-emitting layer of the light-emitting element.

[0022] On the other hand, this disclosure provides a method for fabricating a light-emitting panel. The light-emitting panel includes a display area and a peripheral area located on at least one side of the display area. The display area is provided with at least one light-emitting element. The light-emitting element includes a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. The fabrication method includes sequentially forming a first conductive layer, a first insulating layer, and a second conductive layer on a substrate. The first conductive layer includes at least one first signal trace, and the second conductive layer includes a first electrode of the light-emitting element. The first electrode of the light-emitting element is connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer onto the substrate overlaps with the orthographic projection of the light-emitting portion of the light-emitting element onto the substrate.

[0023] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects will become clear. Attached Figure Description

[0024] The accompanying drawings are provided to illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shape and size of one or more components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure.

[0025] Figure 1 This is a schematic diagram of a light-emitting panel according to at least one embodiment of the present disclosure;

[0026] Figure 2 for Figure 1 A magnified view of a portion of the central region S1;

[0027] Figure 3 for Figure 2 A schematic diagram of the light-emitting panel after the second conductive layer has been formed;

[0028] Figure 4 for Figure 2 A schematic diagram of the light-emitting panel after the first conductive layer has been formed;

[0029] Figure 5A for Figure 2 A partial cross-sectional view along the Q-Q' direction;

[0030] Figure 5B for Figure 2 Another partial cross-sectional view along the Q-Q' direction;

[0031] Figure 6 for Figure 2 A magnified view of a portion of the central region S2;

[0032] Figure 7for Figure 6 A schematic diagram of the first conductive layer in the middle;

[0033] Figure 8 for Figure 6 A partial cross-sectional view along the R-R' direction;

[0034] Figure 9A for Figure 1 A partial cross-sectional view along the P-P' direction;

[0035] Figure 9B for Figure 1 A partial cross-sectional view along the U-U' direction;

[0036] Figure 10 This is an example diagram illustrating the fabrication process of a light-emitting panel according to at least one embodiment of the present disclosure;

[0037] Figure 11 for Figure 1 Another enlarged view of a portion of the central region S1;

[0038] Figure 12 for Figure 11 A partial cross-sectional view along the Q-Q' direction;

[0039] Figure 13 for Figure 2 Another partial cross-sectional view along the Q-Q' direction;

[0040] Figure 14 This is a schematic diagram of a light-emitting device according to at least one embodiment of the present disclosure. Detailed Implementation

[0041] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be changed to one or more forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0042] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, this disclosure is not necessarily limited to these dimensions, and the shape and size of one or more parts in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0043] The ordinal numbers “first,” “second,” “third,” etc., used in this disclosure are provided to avoid confusion among the constituent elements, not to limit the quantity. The term “multiple” in this disclosure refers to two or more quantities.

[0044] In this disclosure, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification of the specification, and does not imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately changed depending on the direction in which the constituent elements are described. Therefore, the description is not limited to the terms used in the specification and may be appropriately replaced as appropriate.

[0045] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate. "Electrical connection" includes situations where constituent elements are connected together by a component having some electrical function. There are no particular limitations on the term "component having some electrical function," as long as it enables the transmission of electrical signals between the connected constituent elements. Examples of "component having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with one or more functions.

[0046] In this disclosure, "parallel" refers to a state in which the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore can include a state in which the angle is greater than or equal to -5° and less than 5°. Furthermore, "perpendicular" refers to a state in which the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore can include a state in which the angle is greater than or equal to 85° and less than 95°.

[0047] In this disclosure, the terms "film" and "layer" can be interchanged. For example, sometimes "conductive layer" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer".

[0048] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, as are chamfers, curved edges, and other variations.

[0049] In this disclosure, "about" or "approximately" means without strictly defining the limits, allowing for the possibility of errors in the process and measurement.

[0050] This disclosure provides a light-emitting panel that can improve the display effect of the light-emitting panel and reduce costs.

[0051] The light-emitting panel provided in this embodiment includes a display area and a peripheral area located on at least one side of the display area. At least one light-emitting element is disposed in the display area. The light-emitting element includes a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. In a direction perpendicular to the light-emitting panel, the light-emitting panel includes at least a substrate and a first conductive layer and a second conductive layer disposed on the substrate. The first conductive layer includes at least one first signal trace. The second conductive layer includes at least one first electrode of the light-emitting element. The first conductive layer and the second conductive layer are in direct contact, and the first electrode of the light-emitting element is directly connected to the first signal trace. Alternatively, a first insulating layer is disposed between the first conductive layer and the second conductive layer, and the first electrode of the light-emitting element is connected to the first signal trace through a via in the first insulating layer, and the orthographic projection of the first insulating layer onto the substrate overlaps with the orthographic projection of the portion of the light-emitting element used for emitting light onto the substrate. In this example, the portion of the light-emitting element used for emitting light may refer to the overlapping portion of the first electrode, the organic light-emitting layer, and the second electrode of the light-emitting element.

[0052] In some exemplary embodiments, no insulating layer is provided between the first conductive layer and the second conductive layer of the light-emitting panel, and the first signal trace of the first conductive layer can be directly connected to the first electrode of the light-emitting element of the second conductive layer. This exemplary embodiment can reduce the fabrication process of the light-emitting panel and greatly reduce costs.

[0053] In some exemplary embodiments, the first conductive layer is located on the side of the second conductive layer closer to the substrate. A first insulating layer may be disposed between the first and second conductive layers. The first electrode of the light-emitting element can be connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer onto the substrate and the orthographic projection of the light-emitting portion of the light-emitting element onto the substrate may overlap. In this exemplary embodiment, by retaining the first insulating layer below the light-emitting portion of the light-emitting element, the unevenness of the first electrode of the light-emitting element caused by the residue from etching the first insulating layer can be avoided, thus preventing it from affecting the display effect.

[0054] In some exemplary embodiments, the first signal trace in the display area may include a first extension. The first extension may be mesh-shaped, and the orthographic projection of the first extension onto the substrate may overlap with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace onto the substrate. For example, the orthographic projection of the first electrode of the light-emitting element onto the substrate may cover the orthographic projection of the first extension of the electrically connected first signal trace onto the substrate. This prevents damage to the first conductive layer during the fabrication of the first electrode. In this example, by providing a mesh-shaped first extension, the resistance of the first signal trace can be reduced. Moreover, by having the mesh-shaped first extension contact the first electrode of the light-emitting element, a uniform current can be applied to the first electrode, allowing the light-emitting panel to emit light of uniform brightness.

[0055] In some exemplary embodiments, the first signal trace may further include a second extension. The second extension extends from the display area to a peripheral area and is connected to the first extension. For example, the first and second extensions of the first signal trace may be an integral structure. The second extension of the first signal trace extends to the peripheral area and may be electrically connected to a bonding pin in the bonding area. In some examples, the second extension of the first signal trace and the corresponding electrically connected bonding pin may be an integral structure.

[0056] In some exemplary embodiments, the display area may further include at least one auxiliary trace, which is co-layered with the first electrode of the light-emitting element. The auxiliary trace is in direct contact with the second extension of the first signal trace, and the orthographic projection of the auxiliary trace onto the substrate and the orthographic projection of the second extension of the first signal trace onto the substrate may overlap. For example, in the display area, the orthographic projection of the auxiliary trace onto the substrate may cover the orthographic projection of the second extension of the first signal trace onto the substrate. In this way, the auxiliary trace can be used to protect the second extension of the first signal trace in the display area, preventing damage to the first conductive layer during the fabrication of the auxiliary trace.

[0057] In some exemplary embodiments, the second conductive layer is in direct contact with the first conductive layer, and the second conductive layer is located on the side of the first conductive layer away from the substrate. In some examples, in the display area, the orthographic projection of the second conductive layer onto the substrate may cover the orthographic projection of the first conductive layer onto the substrate. In this example, using the second conductive layer to protect the first conductive layer in the display area can prevent damage to the first conductive layer during fabrication and can save fabrication processes, thereby significantly reducing costs. In some examples, in the peripheral area, the orthographic projection of the second conductive layer onto the substrate may partially overlap with the orthographic projection of the first conductive layer onto the substrate. In this example, in the peripheral area, the second conductive layer can be used to surface the traces and pins of the first conductive layer to achieve a corrosion-resistant effect.

[0058] In some exemplary embodiments, the second conductive layer is in direct contact with the first conductive layer, and the second conductive layer may be located on the side of the first conductive layer closer to the substrate.

[0059] In some exemplary embodiments, the display area may further include a pixel definition layer. The pixel definition layer may have multiple pixel openings, which may expose at least a portion of the first electrode of the light-emitting element. The organic light-emitting layer of the light-emitting element may contact the first electrode of the light-emitting element through the pixel openings. The second electrode of the light-emitting element may be located on the side of the pixel definition layer away from the substrate, and the second electrode of the light-emitting element may contact the organic light-emitting layer of the light-emitting element. The portion of the light-emitting element located at the pixel opening is used for emitting light. In some examples, the portion of the light-emitting element used for emitting light may include multiple sub-light-emitting regions. Adjacent sub-light-emitting regions may be separated by the pixel definition layer. The organic light-emitting layers within adjacent sub-light-emitting regions may be connected or not connected. The sub-light-emitting region may be the region corresponding to the pixel opening of the pixel definition layer.

[0060] In some exemplary embodiments, the peripheral area may be provided with multiple barrier dams, which may be in the same layer as the pixel definition layer, and at least one barrier dam may surround the display area. The multiple barrier dams may be arranged sequentially and continuously along a direction away from the display area. In some examples, five consecutive barrier dams may be provided in the peripheral area. For example, the total length of the multiple barrier dams along the direction away from the display area may be greater than 144 micrometers, for example, approximately 360 micrometers. By providing a certain number of barrier dams, the encapsulation layer made of organic materials can be effectively blocked.

[0061] In some exemplary embodiments, the material of the first conductive layer may include a metallic material, and the material of the second conductive layer may include a transparent conductive material. The light-emitting panel provided in this example may employ a bottom-emitting structure, i.e., light is emitted from one side of the substrate. However, this embodiment is not limited to this.

[0062] The structure of this embodiment will be illustrated with some examples below.

[0063] Figure 1 This is a schematic diagram of a light-emitting panel according to at least one embodiment of the present disclosure. In some exemplary embodiments, such as Figure 1As shown, the light-emitting panel may include a display area AA and a peripheral area BB located around the display area AA. The peripheral area BB may include a binding area B1 located on one side of the display area AA and a border area B2 located on the other sides of the display area AA. For example, the peripheral area BB may be located around the display area AA, the binding area B1 may be located on the bottom side of the display area AA, and the border area B2 may include the left, top, and right sides of the display area AA. However, this embodiment is not limited in this respect. For example, the peripheral area BB may be located on at least one side of the display area AA, and the binding area B1 may be located on the top, left, or right side of the display area AA.

[0064] In some examples, such as Figure 1 As shown, the display area AA of the light-emitting panel can be quadrilateral. For example, it can be a parallelogram. However, this embodiment is not limited to this. For example, the display area AA of the light-emitting panel can be other shapes such as circle, ellipse, rectangle, pentagon or hexagon.

[0065] In some examples, such as Figure 1 As shown, the display area AA can be provided with multiple light-emitting elements 10. These multiple light-emitting elements 10 can be arranged regularly within the display area AA. For example, the multiple light-emitting elements 10 can be arranged in multiple columns along the first direction D1 and in multiple rows along the second direction D2 within the display area AA. The multiple light-emitting elements 10 arranged along the first direction D1 can be referred to as a row of light-emitting elements, and the multiple light-emitting elements 10 arranged along the second direction D2 can be referred to as a column of light-emitting elements. Figure 1 The light-emitting panel shown may include ten rows and twelve columns of light-emitting elements 10, with each row including six light-emitting elements 10 and each column including five light-emitting elements 10. Figure 1 The illustrated light-emitting panel may include a total of sixty light-emitting elements 10. However, this embodiment does not limit the number of light-emitting elements 10 included in the light-emitting panel. In some examples, the first direction D1 and the second direction D2 may intersect. For example, the angle between the first direction D1 in a counterclockwise direction and the second direction D2 may be approximately 108 degrees to 132 degrees, such as approximately 120 degrees. However, this embodiment is not limited in this respect. For example, if the display area of ​​the light-emitting panel can be rectangular, then the first direction and the second direction can be perpendicular to each other.

[0066] In some examples, such as Figure 1 As shown, the shape of the light-emitting element 10 can be triangular, for example, an equilateral triangle. For example, the side length of the light-emitting element 10 can be approximately 9 millimeters (mm) to 11 mm, such as approximately 10 mm. However, this embodiment is not limited to this. In other examples, the shape of the light-emitting element 10 can be other shapes such as rectangle, rhombus, pentagon, or hexagon.

[0067] In some examples, such as Figure 1 As shown, the color of light emitted by the light-emitting element 10 can be determined as needed. For example, the light-emitting element 10 can emit red, green, blue, or white light. In some examples, the light-emitting element 10 can be an organic light-emitting diode (OLED). The light-emitting element 10 may include a first electrode, a second electrode, and an organic light-emitting layer located between the first and second electrodes. Under the voltage drive of the first and second electrodes, the light-emitting characteristics of the organic material in the organic light-emitting layer can be used to emit light at the required grayscale. For example, the first electrode can be an anode, and the second electrode can be a cathode. However, this embodiment is not limited to this. In the embodiments of this disclosure, the portion of the light-emitting element used for emitting light may refer to the overlapping portion of the first electrode, the organic light-emitting layer, and the second electrode of the light-emitting element.

[0068] In some examples, such as Figure 1 As shown, the bonding area B1 can be provided with multiple bonding pins B11. For example, the multiple bonding pins B11 can be arranged sequentially along the first direction D1. Figure 1 The diagram only briefly illustrates several bonding pins and several signal traces. The multiple bonding pins B11 may include: at least one first ground pin, multiple first signal pins, and multiple second signal pins. The first ground pin may be located between the first signal pins and the second signal pins. The first ground pin may be electrically connected to the ground trace 13. For example, the ground trace 13 may be integral with at least one first ground pin and extend from the bonding region B1 to the frame region B2. The ground trace 13 may be arranged around the display area AA within the frame region B2. The second signal pins may be electrically connected to the second signal trace 12. For example, the second signal trace 12 may be integral with at least one second signal pin and extend from the bonding region B1 to the frame region B2. The second signal trace 12 may be arranged around the display area AA within the frame region B2. Within the frame region B2, the second signal trace 12 may be located on the side of the ground trace 13 away from the display area AA. However, this embodiment is not limited in this respect.

[0069] In some examples, such as Figure 1 As shown, the first signal pin can be electrically connected to the first signal trace 11. For example, multiple first signal pins and multiple first signal traces can be electrically connected in a one-to-one correspondence. A first signal trace 11 can be integrated with a first signal pin. At least one first signal trace 11 can extend from the bonding area B1 to the frame area B2 and be arranged on the side of the ground trace 13 near the display area AA; at least one first signal trace 11 can extend from the bonding area B1 to the display area AA and be arranged in the gap between the 2nth column and the 2n+1th column of light-emitting elements 10, where n is an integer greater than 0. For example, in Figure 1 In the example of numbering the light-emitting elements from left to right, multiple first signal lines 11 can be arranged between the second and third columns of light-emitting elements 10, between the fourth and fifth columns of light-emitting elements 10, between the sixth and seventh columns of light-emitting elements 10, between the eighth and ninth columns of light-emitting elements 10, and between the tenth and eleventh columns of light-emitting elements 10. The first signal lines 11 can also be arranged in the border areas B2 on the left and right sides of the display area AA.

[0070] In some examples, multiple first signal lines 11 can be electrically connected to multiple light-emitting elements 10 in a one-to-one correspondence. One first signal line 11 can be configured to provide a driving signal to one light-emitting element 10. However, this embodiment is not limited to this. For example, one first signal line can be electrically connected to multiple light-emitting elements and configured to provide driving signals to the multiple light-emitting elements.

[0071] Figure 2 for Figure 1 A magnified view of a portion of the central region S1. Figure 3 for Figure 2 A schematic diagram of the light-emitting panel after the second conductive layer has been formed. Figure 4 for Figure 2 A schematic diagram of the light-emitting panel after the first conductive layer has been formed. Figure 5A and Figure 5B for Figure 2 A partial cross-sectional view along the Q-Q' direction. Figure 6 for Figure 2 A magnified view of a portion of the central region S2. Figure 7 for Figure 6 A schematic diagram of the first conductive layer in the image. Figure 8 for Figure 6 A partial cross-sectional view along the R-R' direction.

[0072] In some exemplary implementations, such as Figures 2 to 8 As shown, in the direction perpendicular to the display substrate, the display area AA may include: a substrate 200, and a first conductive layer 21, a second conductive layer 22, a pixel definition layer 104, an organic light-emitting layer 103, and a third conductive layer 23 sequentially disposed on the substrate 200. In this example, the first conductive layer 21 and the second conductive layer 22 are in direct contact, and no insulating layer is disposed between the first conductive layer 21 and the second conductive layer 22.

[0073] In some examples, such as Figure 4 and Figure 7As shown, the first conductive layer 21 of the display area AA may include multiple first signal traces 11. Each first signal trace 11 may include a first extension 111 and a second extension 112. The second extension 112 may be arranged between adjacent columns of light-emitting elements, and the second extension 112 may extend from the display area AA to the peripheral area BB in one direction. For example, the second extension 112 may extend along a second direction D2. Multiple (e.g., eight or ten) second extensions 112 of the first signal traces may be arranged between adjacent columns of light-emitting elements. The second extensions 112 of the first signal traces 11 are electrically connected to the first extensions 111, and may be an integral structure. The orthographic projection of the first extension 111 onto the substrate 200 may overlap with the orthographic projection of the first electrode 101 of the light-emitting element onto the substrate 200. In some examples, such as... Figure 3 and Figure 6 As shown, the orthographic projection of the first electrode 101 of the light-emitting element onto the substrate 200 can cover the orthographic projection of the first extension 111 of the first signal trace 11 onto the substrate 200. Figure 4 As shown, the orthographic projection of the area where the first extension 111 is located onto the substrate 200 can be a triangle, such as an equilateral triangle. The first extension 111 can be grid-shaped. For example, the first extension 111 can include multiple grids, and the shape of the grids can include parallelograms and triangles. By setting the grid-shaped first extension 111, the resistance of the first signal trace 11 can be reduced. However, this embodiment does not limit the grid shape of the first extension. For example, the grid can be rectangular, rhomboid, pentagonal, or hexagonal, etc.

[0074] In some examples, such as Figure 3 and Figure 6 As shown, the second conductive layer 22 may include: first electrodes 101 of multiple light-emitting elements and multiple auxiliary traces 14. The first electrodes 101 of the light-emitting elements are in direct contact with the first extension 111 of the first signal trace 11, thereby achieving electrical connection between the first electrodes 101 of the light-emitting elements and the first signal trace 11. Figure 6 and Figure 8 As shown, within the display area, the orthographic projection of the auxiliary trace 14 onto the substrate 200 can cover the orthographic projection of the second extension 112 of the first signal trace 11 onto the substrate 200. In this example, the first conductive layer 21 of the display area AA can be covered by the second conductive layer 22, which can protect the first conductive layer 21 and prevent damage to the first conductive layer 21 during the fabrication process.

[0075] In some examples, the first electrode 101 of the light-emitting element 10 electrically connected to the first signal trace 11 and the auxiliary trace 14 covering the second extension 112 of the first signal trace 11 can be an integral structure. In this way, the second conductive layer 22 of the display area can be guaranteed to cover the first conductive layer 21.

[0076] In some examples, such as Figure 2 As shown, the pixel definition layer 104 may have multiple pixel openings 100 in the display area AA. The pixel definition layer 104 within the pixel openings 100 is removed, exposing at least a portion of the first electrode 101 of the light-emitting element 10. For example... Figure 5A and Figure 5B As shown, the organic light-emitting layer 103 can be located within the pixel opening 100, and contact the first electrode 101 of the light-emitting element 10 through the pixel opening 100. The third conductive layer 23 can include the second electrodes 102 of multiple light-emitting elements 10. The second electrodes 102 of the light-emitting elements 10 can be located on the side of the pixel definition layer 104 away from the substrate 200, and contact the organic light-emitting layer 103. In some examples, the second electrodes 102 of multiple light-emitting elements 10 can be a single structure. However, this embodiment is not limited to this.

[0077] In some examples, such as Figure 2 As shown, the light-emitting element 10 may include multiple sub-light-emitting regions, with each sub-light-emitting region corresponding to a pixel opening 100. For example... Figure 5A and Figure 5B As shown, adjacent sub-light-emitting regions of the light-emitting element 10 can be separated by the pixel definition layer 104. The orthographic projection of the pixel definition layer 104 on the substrate 200 can cover the orthographic projection of the first signal trace 11 on the substrate 200. The shape of the sub-light-emitting region of the light-emitting element 10 can be approximately the same as the grid shape of the first extension 111 of the first signal trace 11. The orthographic projection of at least one grid of the first extension 111 can overlap with the orthographic projection of a sub-light-emitting region of the light-emitting element 10; for example, the orthographic projection of the grid can cover the orthographic projection of the sub-light-emitting region of the light-emitting element. For example, the shape of the sub-light-emitting region of the light-emitting element 10 can include a parallelogram or a triangle. However, this embodiment is not limited to this. In other examples, the shape of the sub-light-emitting region of the light-emitting element 10 can be a rectangle, a pentagon, or a hexagon, etc. In this example, by covering the first extension 111 of the first signal trace 11 with the pixel definition layer 104, the light-emitting element 10 is divided into multiple sub-light-emitting regions. This avoids the first extension 111 from affecting the light emission and ensures the flatness of the sub-light-emitting regions, thereby ensuring the light emission effect.

[0078] In some examples, such as Figure 5AAs shown, the organic light-emitting layers 103 of adjacent sub-light-emitting regions can be connected. For example, the height of the pixel definition layer 104 between adjacent sub-light-emitting regions of the light-emitting element 10 can be lower than the height of the pixel definition layer 104 between adjacent light-emitting elements 10, so that the organic light-emitting layers 103 between adjacent sub-light-emitting regions of the light-emitting element can be connected. In this example, the height of the pixel definition layer can refer to the vertical distance between the surface of the pixel definition layer away from the substrate and the surface of the substrate closer to the pixel definition layer.

[0079] In other examples, such as Figure 5B As shown, the organic light-emitting layers 103 of adjacent sub-light-emitting regions of the light-emitting element 10 may not be connected. The pixel definition layer 104 between adjacent sub-light-emitting regions of the light-emitting element 10 may be in contact with the second electrode 102 of the light-emitting element 10.

[0080] Figure 9A for Figure 1 A partial cross-sectional view along the P-P' direction. In some examples, such as... Figure 9A As shown, an encapsulation layer 24 is provided on the side of the second electrode 102 of the light-emitting element 10 away from the substrate 200. The encapsulation layer 24 may include a first encapsulation layer 241, a second encapsulation layer 242, and a third encapsulation layer 243 stacked sequentially. The first encapsulation layer 241 and the third encapsulation layer 243 may be made of inorganic materials, while the second encapsulation layer 242 may be made of organic materials. The second extension 112 of the first signal trace 11 can extend from the display area AA to the bonding area B1 and is electrically connected to the bonding pin B11 of the bonding area B1. In this example, the second extension 112 of the first signal trace 11 and the bonding pin B11 of the bonding area B1 can be an integral structure. A barrier dam area is provided in the peripheral area BB, and multiple barrier dams 41 are provided within the barrier dam area. For example, five barrier dams 41 are provided within the barrier dam area, and the five barrier dams 41 can be continuously arranged along the side away from the display area AA. The surface of the barrier dam area away from the substrate 200 can be wavy. The blocking dam 41 and the pixel definition layer 104 of the display area AA can be of the same layer structure. The first encapsulation layer 241 and the third encapsulation layer 243 of the encapsulation layer 24 can cover the surface of the multiple blocking dams 41 away from the substrate 200. By setting multiple blocking dams 41, the second encapsulation layer 242 made of organic materials can be blocked. In this example, each blocking dam 41 can be set in a ring structure around the display area AA in the peripheral area BB. Figure 9A As shown, a pin protection section 42 is also provided in the bonding area B1. The pin protection section 42 can be in the same layer as the pixel definition layer 104 of the display area AA. The pin protection section 42 can expose the bonding pins B11 of the bonding area B1.

[0081] In some examples, such as Figure 9A As shown, the second electrodes 102 of the plurality of light-emitting elements 10 in the display area AA can be an integral structure. The distance L1 between the edge of the second electrode 102 of the light-emitting element 10 and the edge of the pixel definition layer 104 can be approximately 300 micrometers. The distance L2 between the edge of the pixel definition layer 104 and the edge of the blocking dam area near the display area AA can be approximately 100 micrometers. The distance L3 between the edge of the blocking dam area near the display area AA and the edge away from the display area AA can be approximately 360 micrometers. In this example, the total length of the five blocking dams 41 along the direction away from the display area AA can be approximately 360 micrometers. The distance L4 between the edge of the blocking dam area away from the display area AA and the edges of the first encapsulation layer 241 and the third encapsulation layer 243 can be approximately 1600 micrometers. In the bonding area B1, the orthographic projections of the first encapsulation layer 241 and the third encapsulation layer 243 on the substrate 200 and the orthographic projection of the pin protection portion 42 on the substrate 200 can partially overlap. However, this embodiment is not limited to this.

[0082] Figure 9B for Figure 1 A partial cross-sectional view along the U-U' direction. In some examples, such as... Figure 9B As shown, the second conductive layer may include an auxiliary electrode 15 located in the peripheral region BB. The orthographic projection of the auxiliary electrode 15 onto the substrate 200 overlaps with the orthographic projection of the bonding pin B11 onto the substrate 200. The auxiliary electrode 15 may cover the side of the bonding pin B11 and expose the surface of the bonding pin B11 away from the substrate 200. In this example, using the second conductive layer to edge the bonding pin can prevent the bonding pin from being corroded.

[0083] In some examples, the auxiliary trace 14 can extend from the display area AA to the peripheral area BB, and the extension direction of the auxiliary trace 14 can be the same as the extension direction of the second extension 112 of its corresponding first signal trace 11. In the peripheral area BB, the orthographic projection of the auxiliary trace 14 onto the substrate 200 can overlap with the orthographic projection of the second extension 112 onto the substrate 200. In the peripheral area BB, the auxiliary trace 14 can cover the side of the second extension 112 and expose the surface of the second extension 112 away from the substrate 200. Regarding the overlap relationship between the auxiliary trace 14 and the second extension 112 in the peripheral area BB, refer to... Figure 9BThe overlap between the auxiliary electrode 15 and the bonding pin B11 shown is not described further here. In some examples, the first conductive layer of the peripheral region BB may include multiple first signal traces 11, second signal traces 12, ground traces 13, and multiple bonding pins B11. In the peripheral region BB, the traces and pins of the first conductive layer can be edge-protected by the second conductive layer. However, this embodiment is not limited to this. In other examples, the traces of the first conductive layer in the peripheral region BB may be covered by the second conductive layer, and the pins of the first conductive layer may be edge-protected by the second conductive layer.

[0084] The fabrication process of the light-emitting panel in this example is described below by way of example. The "patterning process" described in this disclosure includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; etching can be performed using any one or more of dry etching and wet etching, and this disclosure does not limit the methods. "Thin film" refers to a thin film of a certain material fabricated on a substrate using deposition, coating, or other processes. If the "thin film" does not require a patterning process during the entire fabrication process, it can also be called a "layer." If the "thin film" requires a patterning process during the entire fabrication process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." In the exemplary embodiments of this disclosure, "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0085] In some exemplary implementations, such as Figure 10 As shown, the fabrication process of the light-emitting panel may include the following operations.

[0086] (1) Preparation of substrate.

[0087] In some exemplary embodiments, a glass substrate 300 is provided, on which a substrate 200 is formed. The substrate 200 may include a stacked flexible substrate 201, a barrier layer 202, and a buffer layer 203. The barrier layer 202 and the buffer layer 203 can be used to improve the water-blocking capability of the substrate 200. For example, the flexible substrate 201 may be made of materials such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, and the barrier layer 202 and the buffer layer 203 may be made of inorganic materials, such as any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or composite layers. For example, the barrier layer 202 may be made of SiOx, and the buffer layer 203 may be made of SiNx. However, this embodiment is not limited to this. In other examples, the substrate may be a rigid substrate, such as a glass substrate.

[0088] (2) Forming the first conductive layer.

[0089] In some exemplary embodiments, a first conductive film is deposited on the substrate 200 forming the aforementioned structure, and the first conductive film is patterned using a patterning process to form a first conductive layer 21. For example, the first conductive layer 21 may include: multiple first signal traces 11, second signal traces 12, ground traces 13, and multiple bonding pins B11. The multiple bonding pins B11 may be located in bonding region B1, the ground traces 13 and the second signal traces 12 may be located in peripheral region BB, and the first signal traces 11 may extend from peripheral region BB to display region AA. For example, the first signal traces 11 in display region AA may include: a first extension 111 and a second extension 112.

[0090] In some examples, the first conductive layer 21 can be made of a metallic material, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti. For example, the material of the first conductive layer 21 may include Ti / Al / Ti, or it may include Mo / Al / Mo.

[0091] (3) Forming a second conductive layer.

[0092] In some exemplary embodiments, a second conductive film is deposited on the substrate forming the aforementioned structure, and the second conductive film is patterned using a patterning process to form a second conductive layer 22 located in the display area AA. For example, the second conductive layer 22 may include: first electrodes 101 of a plurality of light-emitting elements 10 located in the display area AA, a plurality of auxiliary traces 14, and a plurality of auxiliary electrodes 15. The second conductive layer 22 in the display area AA may cover the first conductive layer 21 in the display area AA, thereby protecting the first conductive layer 21 and preventing damage to the first conductive layer 21 during the fabrication of the second conductive layer 22. For example, within the display area AA, the orthographic projection of the first electrode 101 of the light-emitting element 10 onto the substrate 200 may cover the orthographic projection of the first extension 111 of the first signal trace 11 onto the substrate 200, and the orthographic projection of the auxiliary trace 14 onto the substrate 200 may cover the orthographic projection of the second extension 112 of the first signal trace 11 onto the substrate 200.

[0093] (4) Form a pixel definition layer.

[0094] In some exemplary embodiments, a pixel definition film is coated on the substrate 200 on which the aforementioned pattern is formed, and a pixel definition layer 104 is formed by a masking, exposure, and development process. The pixel definition layer 104 may have a plurality of pixel openings 100 exposing the second conductive layer 22. The plurality of pixel openings 100 may be located within the display area AA. In some examples, the pixel definition layer 104 between adjacent sub-light-emitting regions of the light-emitting element 10 may be thinned, such that the height of the pixel definition layer between adjacent sub-light-emitting regions is less than the height of the pixel definition layer between adjacent light-emitting elements. In some examples, the pixel definition layer 104 may be made of organic materials such as polyimide, acrylic, or polyethylene terephthalate.

[0095] (5) Forming an organic light-emitting layer.

[0096] In some exemplary embodiments, an organic light-emitting layer 103 is formed within the aforementioned pixel opening 100, and the organic light-emitting layer 103 can contact the first electrode 101 of the light-emitting element. In some examples, a hole injection layer and a hole transport layer are sequentially deposited on the substrate 200 on which the aforementioned pattern is formed using an open mask, followed by the sequential deposition of a blue light-emitting layer, a green light-emitting layer, and a red light-emitting layer using an FMM, and then the sequential deposition of an electron transport layer and an electron injection layer using an open mask. In this example, the light-emitting element 10 can emit white light. However, this embodiment is not limited to this.

[0097] (6) Forming a third conductive layer.

[0098] In some exemplary embodiments, a third conductive film is deposited on the substrate 200 on which the aforementioned pattern is formed. The third conductive film is then patterned using a patterning process to form a third conductive layer 23. The third conductive layer 23 may include second electrodes 102 of a plurality of light-emitting elements. The second electrodes 102 of the plurality of light-emitting elements may be an integral structure. The second electrodes 102 may be formed on the pixel definition layer 104 and contact the organic light-emitting layer 103 of the light-emitting elements. The second electrodes 102 may be electrically connected to the second signal traces 12 located in the first conductive layer 21 in the border region B2.

[0099] (7) Forming an encapsulation layer.

[0100] In some exemplary embodiments, an encapsulation layer 24 is formed on the third conductive layer 23. The encapsulation layer 24 may include a stacked structure of inorganic / organic / inorganic materials. However, this embodiment is not limited thereto.

[0101] After the light-emitting panel is fabricated, the glass substrate 300 can be peeled off.

[0102] In some exemplary embodiments, the second conductive layer 22 may be made of a transparent conductive material, such as indium tin oxide (ITO). The third conductive layer 23 may be made of a reflective material such as a metal, such as silver (Ag). The light-emitting panel in this example may be a bottom-emitting structure, that is, the light-emitting panel emits light from the side of the substrate 200. However, this embodiment is not limited to this. In other examples, the light-emitting panel in this example may be a top-emitting structure, that is, the light-emitting panel emits light from the side away from the substrate. In these examples, the second conductive layer may be made of a reflective material such as a metal, and the third conductive layer may be made of a transparent conductive material.

[0103] The illumination display required by the light-emitting panel in this example does not require complex pixel circuits to control the light-emitting elements. Instead, the light-emitting elements are driven by driving signals derived from the first and second signal traces. By setting the first conductive layer 21 and the second conductive layer 22 in direct contact in the display area AA, the second conductive layer 22 can protect the first conductive layer 21, preventing damage to the first conductive layer 21 during the manufacturing process. Furthermore, there is no need to prepare an insulating layer between the first conductive layer 21 and the second conductive layer 22, which saves manufacturing steps and can significantly reduce costs.

[0104] Figure 11 for Figure 1 Another enlarged schematic diagram of a portion of the central region S1. Figure 12 for Figure 11 A partial cross-sectional view along Q-Q'. In some exemplary embodiments, such as... Figure 11 and Figure 12As shown, the display area AA may include: a substrate 200, a second conductive layer 22, a first conductive layer 21, a pixel definition layer 104, an organic light-emitting layer 103, and a third conductive layer 23 sequentially disposed on the substrate 200. In this example, no insulating layer is disposed between the first conductive layer 21 and the second conductive layer 22, and the first conductive layer 21 may be located on the side of the second conductive layer 22 away from the substrate 200.

[0105] In some examples, such as Figure 11 and Figure 12 As shown, the first conductive layer 21 of the display area AA may include multiple first signal traces 11. The second conductive layer 22 may include a first electrode 101 of the light-emitting element 10. The first conductive layer 21 and the second conductive layer 22 are in direct contact. The first electrode 101 of the light-emitting element 10 may be in direct contact with the first extension 111 of the first signal trace 11, thereby achieving electrical connection with the first signal trace 11. The orthographic projection of the second extension 112 of the first signal trace 11 onto the substrate 200 and the orthographic projection of the second conductive layer 22 onto the substrate 200 may not overlap.

[0106] In some examples, such as Figure 11 and Figure 12 As shown, in the fabrication process of the light-emitting panel, a wet etching process can be used to prepare the second conductive layer 22 and the first conductive layer 21 respectively. During the fabrication of the first conductive layer 21, an etching solution that does not damage the second conductive layer 22 can be used for etching. In some examples, the first conductive layer 21 can be made of a metallic material, and the second conductive layer 22 can be made of a transparent conductive material, such as ITO.

[0107] The remaining descriptions of the light-emitting panel in this embodiment can be found in the descriptions of the foregoing embodiments, and therefore will not be repeated here.

[0108] Figure 13 for Figure 2 Another partial cross-sectional view along the Q-Q' direction. In some exemplary embodiments, such as Figure 13 As shown, the display area AA may include: a substrate 200, a first conductive layer 21, a first insulating layer 210, a second conductive layer 22, a pixel definition layer 104, an organic light-emitting layer 103, and a third conductive layer 23 sequentially disposed on the substrate 200. In this example, a first insulating layer 210 is disposed between the first conductive layer 21 and the second conductive layer 22. For example, the first insulating layer 210 may be made of an inorganic material, such as any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or a composite layer.

[0109] In some examples, such as Figure 13 As shown, the second conductive layer 22 may include a first electrode 101 of the light-emitting element. The first electrode 101 of the light-emitting element can be electrically connected to the first signal trace 11 of the first conductive layer 21 through a via formed in the first insulating layer 210. For example, the first electrode 101 of the light-emitting element can be electrically connected to the first extension 111 of the first signal trace 11 through a via formed in the first insulating layer 210. In some examples, the first insulating layer 210 on the first extension 111 of the first signal trace 11 can be completely removed to expose the entire first extension 111; or, the first insulating layer 210 can be removed to expose a portion of the first extension 111. However, this embodiment is not limited to this.

[0110] In some examples, such as Figure 13 As shown, the orthographic projection of the light-emitting portion of the light-emitting element onto the substrate 200 and the orthographic projection of the first insulating layer 210 onto the substrate 200 may overlap. In other words, the first insulating layer 210 on the side of the first electrode 101 of the light-emitting element near the substrate 200 can be retained, and only the portion of the first insulating layer 210 that exposes the first signal trace 11 is removed, so that the surface of the light-emitting element near the substrate 200 can be a flat surface. This avoids the situation where the first electrode is uneven due to residue caused by etching the first insulating layer 210, thereby ensuring the display effect of the light-emitting panel.

[0111] The remaining descriptions of the light-emitting panel in this embodiment can be found in the descriptions of the foregoing embodiments, and therefore will not be repeated here.

[0112] This disclosure also provides a method for fabricating a display panel. The light-emitting panel includes a display area and a peripheral area located on at least one side of the display area. At least one light-emitting element is disposed in the display area, and the light-emitting element includes: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. The fabrication method includes: forming a first conductive layer and a second conductive layer on a substrate. The first conductive layer includes at least one first signal trace, and the second conductive layer includes: a first electrode of the light-emitting element; the first conductive layer and the second conductive layer are in direct contact, and the first electrode of the light-emitting element is connected to the first signal trace.

[0113] In some exemplary embodiments, the first signal trace in the display area may include a first extension. The first extension is mesh-shaped, and the orthographic projection of the first extension onto the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace onto the substrate.

[0114] In some exemplary embodiments, forming a first conductive layer and a second conductive layer on a substrate may include: forming a first conductive layer and a second conductive layer in direct contact sequentially on the substrate, wherein, in the display area, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate; or, forming a second conductive layer and a first conductive layer in direct contact sequentially on the substrate.

[0115] In some exemplary embodiments, the fabrication method of this embodiment may further include: forming a pixel definition layer on a substrate, the pixel definition layer having a plurality of pixel openings, the pixel openings exposing at least a portion of the first electrode of the light-emitting element; forming an organic light-emitting layer and a second electrode of the light-emitting element. The organic light-emitting layer of the light-emitting element is in contact with the first electrode of the light-emitting element through the pixel openings; the second electrode of the light-emitting element is in contact with the organic light-emitting layer of the light-emitting element.

[0116] The method for preparing the light-emitting panel in this embodiment can be referred to the description of the foregoing embodiment, and therefore will not be repeated here.

[0117] This disclosure also provides a method for fabricating a light-emitting panel. The light-emitting panel includes a display area and a peripheral area located on at least one side of the display area. At least one light-emitting element is disposed in the display area. The light-emitting element includes a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode. The fabrication method includes sequentially forming a first conductive layer, a first insulating layer, and a second conductive layer on a substrate. The first conductive layer includes at least one first signal trace. The second conductive layer includes a first electrode of the light-emitting element. The first electrode of the light-emitting element is connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer onto the substrate overlaps with the orthographic projection of the light-emitting portion of the light-emitting element onto the substrate.

[0118] The method for preparing the light-emitting panel in this embodiment can be referred to the description of the foregoing embodiment, and therefore will not be repeated here.

[0119] This disclosure also provides a light-emitting device, including a light-emitting panel as described above.

[0120] Figure 14 This is a schematic diagram of a light-emitting device according to at least one embodiment of the present disclosure. In some examples, such as... Figure 14 As shown, the light-emitting device 91 may include a light-emitting panel 910. In some examples, the bonding pins of the light-emitting panel may be bonded to a flexible printed circuit (FPC), which may also be electrically connected to a driver circuit board.

[0121] In some exemplary embodiments, the light-emitting panel 910 can be a flexible OLED display substrate or a QLED display substrate. The light-emitting device 91 can be any vehicle-mounted product or component with display function, such as a vehicle headlight, vehicle-mounted lighting device, or navigation system. The light-emitting panel of this embodiment can simplify the manufacturing process, improve the quality of the light-emitting panel, and reduce costs.

[0122] The accompanying drawings in this disclosure only illustrate the structures involved in this disclosure; other structures can be referred to with common design. Unless otherwise specified, the embodiments and features described in these embodiments can be combined to obtain new embodiments. Those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this disclosure without departing from the spirit and scope of this disclosure, and all such modifications and substitutions should be covered within the scope of the claims of this disclosure.

Claims

1. A light-emitting panel, comprising: The display area and the surrounding area located on at least one side of the display area; The display area is provided with at least one light-emitting element, the light-emitting element comprising: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode; In a direction perpendicular to the light-emitting panel, the light-emitting panel includes at least: a substrate, and a first conductive layer and a second conductive layer disposed on the substrate; The first conductive layer includes: at least one first signal trace; The second conductive layer includes: the first electrode of the light-emitting element; In this configuration, the first conductive layer is in direct contact with the second conductive layer, and the first electrode of the light-emitting element is directly connected to the first signal trace; or, a first insulating layer is disposed between the first conductive layer and the second conductive layer, and the first electrode of the light-emitting element is connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer on the substrate overlaps with the orthographic projection of the portion of the light-emitting element used for emitting light on the substrate. The first signal trace in the display area includes: a first extension and a second extension; the orthographic projection of the first extension on the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace on the substrate; the second extension extends from the display area to the peripheral area, the second extension is connected to the first extension, and the second extension and the first extension are integral structures. In the display area, the orthographic projection of the second conductive layer onto the substrate covers the orthographic projection of the first conductive layer onto the substrate.

2. The light-emitting panel according to claim 1, wherein, The first extension is mesh-like.

3. The light-emitting panel according to claim 1, wherein, The display area is also provided with at least one auxiliary trace, which is in the same layer as the first electrode of the light-emitting element; The auxiliary trace is in direct contact with the second extension of the first signal trace, and the orthographic projection of the auxiliary trace on the substrate overlaps with the orthographic projection of the second extension of the first signal trace on the substrate.

4. The light-emitting panel according to any one of claims 1 to 3, wherein, The second conductive layer is in direct contact with the first conductive layer, and the second conductive layer is located on the side of the first conductive layer away from the substrate.

5. The light-emitting panel according to claim 4, wherein, In the surrounding area, the orthographic projection of the second conductive layer onto the substrate overlaps with the orthographic projection of the first conductive layer onto the substrate.

6. The light-emitting panel according to any one of claims 1 to 3, wherein, The second conductive layer is in direct contact with the first conductive layer, and the second conductive layer is located on the side of the first conductive layer closer to the substrate.

7. The light-emitting panel according to claim 1, wherein, The display area is further provided with a pixel definition layer, the pixel definition layer having a plurality of pixel openings, the pixel openings exposing at least a portion of the first electrode of the light-emitting element; the organic light-emitting layer of the light-emitting element is in contact with the first electrode of the light-emitting element through the pixel openings; the second electrode of the light-emitting element is located on the side of the pixel definition layer away from the substrate, and the second electrode of the light-emitting element is in contact with the organic light-emitting layer of the light-emitting element; the portion of the light-emitting element located at the pixel openings is used for emitting light.

8. The light-emitting panel according to claim 7, wherein, In the display area, the orthographic projection of the pixel definition layer onto the substrate covers the orthographic projection of the first conductive layer onto the substrate.

9. The light-emitting panel according to claim 7 or 8, wherein, The surrounding area is provided with multiple barriers, and at least one of the multiple barriers surrounds the display area; The plurality of blocking dams are in the same layer as the pixel definition layer, and the plurality of blocking dams are arranged sequentially and continuously along the direction away from the display area.

10. The light-emitting panel according to claim 9, wherein, Along the direction away from the display area, the total length of the plurality of barrier dams is greater than 144 micrometers.

11. The light-emitting panel according to claim 1, wherein, The first conductive layer is made of a metallic material, and the second conductive layer is made of a transparent conductive material.

12. A light-emitting device comprising a light-emitting panel as claimed in any one of claims 1 to 11.

13. A method for manufacturing a light-emitting panel, the light-emitting panel comprising a display area and a peripheral area located on at least one side of the display area, the display area being provided with at least one light-emitting element, the light-emitting element comprising: The fabrication method comprises: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode; A first conductive layer and a second conductive layer are formed on a substrate. The first conductive layer includes at least one first signal trace, and the second conductive layer includes a first electrode of the light-emitting element. The first conductive layer and the second conductive layer are in direct contact, and the first electrode of the light-emitting element is connected to the first signal trace. The first signal trace in the display area includes a first extension and a second extension; the orthographic projection of the first extension on the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace on the substrate; the second extension extends from the display area to the peripheral area, the second extension is connected to the first extension, and the second extension and the first extension are integral structures. In the display area, the orthographic projection of the second conductive layer onto the substrate covers the orthographic projection of the first conductive layer onto the substrate.

14. The preparation method according to claim 13, wherein, The first extension is mesh-like.

15. The preparation method according to claim 13 or 14, wherein, The formation of the first conductive layer and the second conductive layer on the substrate includes: A first conductive layer and a second conductive layer that are in direct contact are sequentially formed on the substrate. Alternatively, a second conductive layer and a first conductive layer that are in direct contact are sequentially formed on the substrate.

16. The preparation method according to claim 13, further comprising: A pixel definition layer is formed on the substrate, the pixel definition layer having a plurality of pixel openings, the pixel openings exposing at least a portion of the first electrode of the light-emitting element; An organic light-emitting layer and a second electrode are formed in the light-emitting element; wherein the organic light-emitting layer of the light-emitting element is in contact with the first electrode of the light-emitting element through the pixel opening; and the second electrode of the light-emitting element is in contact with the organic light-emitting layer of the light-emitting element.

17. A method for manufacturing a light-emitting panel, the light-emitting panel comprising a display area and a peripheral area located on at least one side of the display area, the display area being provided with at least one light-emitting element, the light-emitting element comprising: The fabrication method comprises: a first electrode, a second electrode, and an organic light-emitting layer disposed between the first electrode and the second electrode; A first conductive layer, a first insulating layer, and a second conductive layer are sequentially formed on a substrate. The first conductive layer includes at least one first signal trace, and the second conductive layer includes a first electrode of the light-emitting element. The first electrode of the light-emitting element is connected to the first signal trace through a via formed in the first insulating layer, and the orthographic projection of the first insulating layer on the substrate overlaps with the orthographic projection of the portion of the light-emitting element for emitting light on the substrate. The first signal trace in the display area includes a first extension and a second extension; the orthographic projection of the first extension on the substrate overlaps with the orthographic projection of the first electrode of the light-emitting element electrically connected to the first signal trace on the substrate; the second extension extends from the display area to the peripheral area, the second extension is connected to the first extension, and the second extension and the first extension are integral structures. In the display area, the orthographic projection of the second conductive layer onto the substrate covers the orthographic projection of the first conductive layer onto the substrate.

Images