Lead layer, substrate and inductor

Abstract

The application relates to the technical field of inductors, and discloses a lead layer, a substrate and an inductor, the lead layer comprising an insulating layer and an electrode, the electrode being arranged on the insulating layer, the electrode comprising a coil and an outer electrode part, the width of the coil being w, the outer electrode part being connected to one end of the coil, and the width of the connection between the lead-out part and the coil being c, c>w. The lead layer, the substrate and the inductor provided by the application have the advantages that the width of the connection between the outer electrode part and the coil is relatively large, the risk of virtual connection or even disconnection of the connection between the outer electrode part and the coil can be reduced, the occurrence of open circuit of the inductor can be avoided, and the production yield of the inductor is improved.

Description

Technical Field

[0001] This invention relates to the field of inductor technology, and more particularly to a lead layer, a substrate, and an inductor. Background Technology

[0002] In related technologies, the external electrodes of a surface-mount inductor are typically formed by stacking multiple external electrode layers, while the internal electrodes are formed by connecting multiple coil layers. Furthermore, the external electrode layer located in the lead layer is connected to the coil to achieve electrical connection between the external and internal electrodes. Existing surface-mount inductors typically require photolithography to form the preform, co-firing to form the ceramic body, and then electroplating to form the external electrodes.

[0003] However, during the formation of the embryo and ceramic body, the connection between the external electrode and the coil is prone to loose connection or even disconnection, resulting in an open circuit in the inductor and a low yield rate in inductor fabrication. Summary of the Invention

[0004] This invention discloses a lead layer, a substrate, and an inductor. The connection between the external electrode and the coil is wider, which can reduce the risk of loose connection or even disconnection at the connection between the external electrode and the coil, avoid open circuit in the inductor, and improve the inductor's fabrication yield.

[0005] In a first aspect, embodiments of the present invention disclose an inductor, including an insulating layer and an electrode. The electrode is disposed on the insulating layer and includes a coil and an external electrode portion. The width of the coil is w, and the external electrode portion is connected to one end of the coil. The width of the connection between the external electrode portion and the coil is c, where c > w.

[0006] As an optional implementation, in this embodiment of the invention, 1.2w ≤ c ≤ 5w.

[0007] As an optional implementation, in this embodiment of the invention, the external electrode portion includes a first extension portion and a second extension portion connected to each other. The first extension portion is located at one end edge of the insulating layer along the length direction of the lead layer, and the first extension portion extends along the width direction of the lead layer. One end of the coil is connected to the first extension portion. The second extension portion extends from the first extension portion in a direction away from the one end edge, and the second extension portion is located at one side edge of the insulating layer along the width direction.

[0008] As an optional implementation, in this embodiment of the invention, one end of the coil is connected to the side of the first extension away from the edge of that end.

[0009] As an optional implementation, in this embodiment of the invention, the coil includes a main body and a lead-out portion. The main body is configured in a wound shape, and the lead-out portion is connected to one end of the main body. The lead-out portion extends from one end of the main body along the width direction and is connected to the first extension portion. Along the length direction, the side of the lead-out portion facing the edge of the first end is flush with the side of the first extension portion away from the edge of the first end.

[0010] As an optional implementation, in this embodiment of the invention, the projection of the first extension portion onto the surface of the insulating layer along the thickness direction of the lead layer has a first side and a second side. The first side is disposed away from the second extension portion, and the second side is disposed away from the one-end edge. The lead-out portion has a third side facing the one-end edge. Along the length direction, the third side and the second side are located on the same straight line. The third side is connected to the main body portion and the first side. The first side is configured in an arc shape, or the first side is inclined to the third side.

[0011] As an optional implementation, in this embodiment of the invention, the first side is constructed in an arc shape, the radius of the arc of the first side is R, w≤R≤5w, or the first side is inclined to the third side, and the included angle between the first side and the third side is α, 120°≤α≤150°.

[0012] As an optional implementation, in this embodiment of the invention, the projection of the thickness direction of the lead layer onto the surface of the insulating layer, the first extension has a second side, the second side is disposed away from the one-end edge, the lead-out portion has a fourth side and a fifth side, the fourth side is disposed away from the one-end edge and is connected to the main body portion and the fifth side, the fifth side extends obliquely from the fourth side toward the first extension and is connected to the second side, and the extension direction of the fifth side is oblique to the width direction.

[0013] Secondly, embodiments of the present invention disclose a substrate including an inner electrode layer and a lead layer in the first aspect. The inner electrode layer has an inner electrode, and the lead layer is provided on both sides of the inner electrode layer along its own thickness direction. The two ends of the inner electrode are respectively electrically connected to the other end of the coil of the lead layer located on both sides of the inner electrode layer.

[0014] Thirdly, embodiments of the present invention disclose an inductor, including the substrate of the first aspect.

[0015] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0016] In this embodiment of the invention, electrodes are provided by an insulating layer, with the electrode portion of the electrode connected to one end of the coil. The width c of the connection between the outer electrode portion and the coil is greater than the width of the coil. This larger width at the connection between the outer electrode portion and the coil reduces the risk of incomplete connection or even disconnection, avoids open circuits in the inductor, and improves the inductor's manufacturing yield. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a lead layer disclosed in Embodiment 1 of the present invention;

[0019] Figure 2 This is a partial structural schematic diagram of a lead layer disclosed in Embodiment 1 of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of the substrate disclosed in Embodiment 2 of the present invention;

[0021] Figure 4 This is an exploded structural diagram of the matrix disclosed in Embodiment 2 of the present invention;

[0022] Figure 5 This is a simplified structural diagram of the inductor disclosed in Embodiment 3 of the present invention.

[0023] Explanation of main figure symbols

[0024] 100, Lead layer; 10, Insulating layer; 10a, One end edge; 10b, One side edge; 20, Electrode; 21, Coil; 211, Main body; 212, Lead-out portion; 212a, Third side; 212b, Fourth side; 212c, Fifth side; 22, Outer electrode portion; 221, Extension portion; 221a, First side; 221b, Second side; 222, Second extension portion; 200, Substrate; 201, Inner electrode layer; 300, Inductor; x, Width direction; y, Length direction. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0027] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0028] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0029] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0030] This invention discloses a lead layer, a substrate, and an inductor. The connection between the external electrode and the coil is wider, which can reduce the risk of loose connection or even disconnection at the connection between the external electrode and the coil, avoid the inductor from being open-circuited, and improve the inductor's fabrication yield.

[0031] Example 1

[0032] Please see Figure 1This is a schematic diagram of the structure of a lead layer 100 provided in Embodiment 1 of the present invention. The lead layer 100 includes an insulating layer 10 and an electrode 20. The electrode 20 is disposed on the insulating layer 10 and includes a coil 21 and an outer electrode portion 22. The width of the coil 21 is w, and the outer electrode portion 22 is connected to one end of the coil 21. The width of the connection between the outer electrode portion 22 and the coil 21 is c, where c > w.

[0033] Wherein, the outer electrode part 22 is connected to one end of the coil 21, and the outline of the outer electrode part 22 and the outline of the coil 21 form two intersection points. The width c of the connection between the outer electrode part 22 and the coil 21 can be understood as the distance between the two intersection points, that is, the length of the line connecting the two intersection points.

[0034] When the lead layer 100 is applied to an inductor, the inductor needs to be fabricated using photolithography and co-firing processes. During photolithography, developer tends to accumulate at the corner where the external electrode 22 connects to the coil 21, causing over-development. If the width of the connection between the external electrode 22 and the coil 21 is small, over-development can easily lead to a loose connection or even a break in the connection. During co-firing, due to the difference in shrinkage rate and temperature shrinkage curve between the insulating layer 10 and the electrode 20, tensile stress is generated at the connection between the external electrode 22 and the coil 21. If the width of the connection between the external electrode 22 and the coil 21 is small, this tensile stress can easily lead to a loose connection or even a break in the connection.

[0035] Therefore, in this embodiment, the electrode 20 is provided by the insulating layer 10. The electrode 20 part of the electrode 20 is connected to one end of the coil 21, and the width c of the connection between the outer electrode part 22 and the coil 21 is greater than the width of the coil 21. In this way, the connection between the outer electrode part 22 and the coil 21 is larger, which can reduce the risk of false connection or even disconnection at the connection between the outer electrode part 22 and the coil 21, avoid the inductor from being open-circuited, and improve the inductor manufacturing yield.

[0036] For example, 1.2w ≤ c ≤ 5w. If w < c < 1.2w, the width of the connection between the external electrode 22 and the coil 21 is slightly larger than the width of the coil 21, and the reduction in the risk of a loose connection or even a break at the connection between the external electrode 22 and the coil 21 is relatively small. If c > 5w, the width of the connection between the external electrode 22 and the coil 21 is too large compared to the width of the coil 21. Even if the reduction in the risk of a loose connection or even a break at the connection between the external electrode 22 and the coil 21 is already achieved, the connection area between the external electrode 22 and the coil 21 is too large, which easily generates parasitic capacitance, and the distance to other parts of the electrode 20 is too close, which easily leads to a short circuit, affecting the performance of the lead layer 100. Therefore, the width c of the connection between the external electrode 22 and the coil 21 can be 1.2w ≤ c ≤ 5w, which can effectively reduce the risk of a loose connection or even a break at the connection between the external electrode 22 and the coil 21, while avoiding the generation of parasitic capacitance, short circuits, and improving the performance of the lead layer 100. Furthermore, the width c at the connection between the external electrode 22 and the coil 21 can be 1.2w, 1.4w, 1.6w, 1.8w, 2w, 2.5w, 3w, 3.5w, 4w, 4.5w, 5w, etc., and this embodiment does not make a specific limitation on it.

[0037] In some embodiments, the external electrode portion 22 includes a first extension portion 221 and a second extension portion 222 connected to each other. The first extension portion 221 is located at one end edge 10a of the insulating layer 10 along the length direction y of the lead layer 100, and the first extension portion 221 extends along the width direction x of the lead layer 100. One end of the coil 21 is connected to the first extension portion 221. The second extension portion 222 extends from the first extension portion 221 in a direction away from the one end edge 10a, and the second extension portion 222 is located at one side edge 10b of the insulating layer 10 along the width direction x. In this way, with the first extension 221 located at one end edge 10a along the length direction y of the insulating layer 10, and the second extension 222 extending from the first extension 221 in a direction away from the end edge 10a and located at one side edge 10b along the width direction x of the insulating layer 10, the external electrode portion 22 is L-shaped and located at the corner of the insulating layer 10 (the junction of one end edge 10a and one side edge 10b), which can increase the exposed area of ​​the external electrode portion 22, thereby improving the reliability of the lead layer 100 to achieve electrical connection with other components through the external electrode portion 22.

[0038] For example, one end of the coil 21 is connected to the side of the first extension 221 away from one end edge 10a. Thus, by connecting one end of the coil 21 to the side of the first extension 221 away from one end edge 10a, the connection point between the coil 21 and the first extension 221 is located on the side of the first extension 221 away from one end edge 10a. The first extension 221 extends along the width direction x, and the side of the first extension 221 away from one end edge 10a has a longer dimension. This allows for a larger width at the connection point between the coil 21 and the first extension 221. Compared to a design where the coil 21 is connected to the side of the first extension 221 away from one end edge 10b, increasing the width of the connection point does not lead to an increase in the dimension of the first extension 221 along the length direction y. This ensures a larger distance between the first extension 221 and other parts of the electrode 20 along the length direction y, avoiding parasitic capacitance and short circuits.

[0039] In some embodiments, the coil 21 includes a main body 211 and a lead-out portion 212. The main body 211 is configured in a wound shape, and the lead-out portion 212 is connected to one end of the main body 211. The lead-out portion 212 extends from one end of the main body 211 along the width direction x and connects to the first extension portion 221. Along the length direction y, the side of the lead-out portion 212 facing one end edge 10a is flush with the side of the first extension portion 221 opposite to one end edge 10a. In this way, the connection between the main body 211 and the first extension portion 221 is achieved through the lead-out portion 212. On the other hand, along the length direction y, the side of the lead-out portion 212 facing one end edge 10a is flush with the side of the first extension portion 221 away from one end edge 10a. When the lead-out portion 212 extends along the width direction x to the side of the first extension portion 221 away from one end edge 10a, it can be directly connected to the side of the first extension portion 221 away from one end edge 10a. Moreover, there is no gap between the lead-out portion 212 and the first extension portion 221, which can reduce the overall size of the first extension portion 221 and the lead-out portion 212 along the length direction y, thereby reducing the distance between the side of the lead-out portion 212 away from the first extension portion 221 and other parts of the electrode 20, and avoiding the occurrence of parasitic capacitance and short circuit.

[0040] For example, such as Figure 1 and Figure 2As shown, the projection along the thickness direction of the lead layer 100 onto the surface of the insulating layer 10 shows that the first extension 221 has a first side 221a and a second side 221b. The first side 221a is disposed away from the second extension 222, and the second side 221b is disposed away from one end edge 10a. The lead-out portion 212 has a third side 212a facing one end edge 10a. Along the length direction y, the third side 212a and the second side 221b are located on the same straight line. The third side 212a connects the main body portion 211 and the first side 221a. The first side 221a is constructed in an arc shape, or the first side 221a is inclined to the third side 212a. Thus, as... Figure 1 As shown, the first side 221a is constructed into an arc shape, or, as... Figure 2 As shown, the first side 221a is inclined to the third side 212a. Therefore, the corner position at the connection between the first side 221a and the third side 212a does not need to be set as a right angle. This can avoid the accumulation of developer at the corner position at the connection between the first side 221a and the third side 212a during the photolithography process, which would cause over-development at the connection and result in a loose connection or even a break at the connection between the first side 221a and the third side 212a.

[0041] As an optional implementation, the first side 221a is constructed in an arc shape, with a radius of R, where w ≤ R ≤ 5w. Thus, if R < w or R > 5w, the arc design of the first side 221a has a poor effect on improving developer accumulation. When using photolithography, developer easily accumulates at the corner where the external electrode 22 connects to the coil 21, causing over-development at the connection. The developer erodes the electrode 20, resulting in a narrower connection between the external electrode 22 and the coil 21, leading to a loose connection or even disconnection. Furthermore, when using a co-firing process, if the width of the connection between the external electrode 22 and the coil 21 is narrow, the tensile stress can easily cause a loose connection or even disconnection at the connection. Therefore, the radius R of the arc of the first side 221a can be w ≤ R ≤ 5w. The arc design of the first side 221a has a better effect on improving the accumulation of developer and avoiding excessive corrosion of the electrode 20 by the developer. The width of the connection between the outer electrode part 22 and the coil 21 is large, which can avoid the occurrence of loose connection or even disconnection at the connection between the outer electrode part 22 and the coil 21. Moreover, the radius R of the arc of the first side 221a can be w, 2w, 3w, 4w, 5w, etc., and this embodiment does not make a specific limitation on it.

[0042] As another optional implementation, the first side 221a is inclined to the third side 212a, and the included angle between the first side 221a and the third side 212a is α, where 120°≤α≤150°. Thus, if α<120° or α>150°, the inclined design of the first side 221a has a poor effect on improving developer accumulation. When using photolithography, developer easily accumulates at the corner where the external electrode 22 connects to the coil 21, causing over-development at the connection. The developer erodes the electrode 20, resulting in a smaller width at the connection between the external electrode 22 and the coil 21, leading to a loose connection or even disconnection. Furthermore, when using a co-firing process, if the width of the connection between the external electrode 22 and the coil 21 is small, the tensile stress can easily cause a loose connection or even disconnection at the connection between the external electrode 22 and the coil 21. Therefore, the included angle α between the first side 221a and the third side 212a can be 120°≤α≤150°. The beveled design of the first side 221a has a better effect on improving the accumulation of developer and avoids excessive corrosion of the electrode 20 by the developer. The wider width at the connection between the outer electrode 22 and the coil 21 can prevent the connection between the outer electrode 22 and the coil 21 from being loose or even broken. Moreover, the included angle α between the first side 221a and the third side 212a can be 120°, 125°, 130°, 135°, 140°, 145°, 150°, etc., and this embodiment does not make a specific limitation on it.

[0043] In some embodiments, such as Figure 1 As shown, the thickness direction of the lead layer 100 is projected onto the surface of the insulating layer 10. The first extension 221 has a second side 221b, which is disposed away from one end edge 10a. The lead-out portion 212 has a fourth side 212b and a fifth side 212c. The fourth side 212b is disposed away from one end edge 10a and is connected to the main body portion 211 and the fifth side 212c. The fifth side 212c extends obliquely from the fourth side 212b toward the first extension 221 and is connected to the second side 221b. The extension direction of the fifth side 212c is oblique to the width direction x. In this way, by adopting the design of the fifth side 212c extending at an angle, while keeping the width c at the connection between the outer electrode part 22 and the coil 21 unchanged, it is not necessary to use the right-angle side connection method (that is, the extension direction of the fifth side 212c is consistent with the length direction y, and the extension length of the fourth side 212b is larger). This reduces the area of ​​the lead-out part 212, thereby reducing the distance between the lead-out part 212 and other parts of the electrode 20, and avoiding the occurrence of parasitic capacitance and short circuit.

[0044] Among them, such as Figure 1As shown, the width c at the connection between the external electrode 22 and the coil 21 specifically refers to the distance between the intersection of the first side 221a and the third side 212a and the intersection of the second side 221b and the fifth side 212c, that is, the length of the line connecting the two intersection points.

[0045] Embodiment 1 of the present invention provides a lead layer 100, through which an electrode 20 is disposed via an insulating layer 10. The electrode 20 portion of the electrode 20 is connected to one end of a coil 21, and the width c of the connection between the outer electrode portion 22 and the coil 21 is greater than the width of the coil 21. In this way, the connection between the outer electrode portion 22 and the coil 21 is larger, which can reduce the risk of loose connection or even disconnection at the connection between the outer electrode portion 22 and the coil 21, avoid the occurrence of open circuit in the inductor, and improve the manufacturing yield of the inductor.

[0046] Example 2

[0047] Please refer to the following: Figure 3 and Figure 4 This is a schematic diagram of the structure of a substrate 200 provided in Embodiment 2 of the present invention. The substrate 200 includes an inner electrode layer 201 and a lead layer 100 as in Embodiment 1. The inner electrode layer 201 has an inner electrode, and lead layers 100 are provided on both sides of the inner electrode layer 201 along its own thickness direction. The two ends of the inner electrode are respectively electrically connected to the other end of the coil of the lead layer 100 located on both sides of the inner electrode layer 201.

[0048] There may be multiple inner electrode layers 201, which are stacked sequentially along the thickness direction, and adjacent inner electrode layers 201 are electrically connected along the inner electrode.

[0049] Embodiment 2 of the present invention provides a substrate 200 with a larger width at the connection between the external electrode and the coil, which can reduce the risk of loose connection or even disconnection at the connection between the external electrode and the coil, avoid the inductor from being open-circuited, and improve the inductor manufacturing yield.

[0050] Example 3

[0051] Please see Figure 5 An inductor 300 provided in Embodiment 3 of the present invention includes the substrate 200 of Embodiment 2.

[0052] Embodiment 3 of the present invention provides an inductor 300 that can avoid the occurrence of open circuit in the inductor 300 and improve the fabrication yield of the inductor 300.

[0053] The foregoing has provided a detailed description of a lead layer, substrate, and inductor disclosed in the embodiments of the present invention. This document uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the lead layer, substrate, and inductor of the present invention and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A lead layer, characterized in that, include: Insulating layer; as well as Electrode, the electrode being disposed on the insulating layer, the electrode comprising: A coil, the width of which is w, the coil includes a main body and a lead-out portion, the main body is configured to be wound, the lead-out portion is connected to one end of the main body, and the lead-out portion extends from one end of the main body along the width direction; as well as The external electrode portion includes a first extension portion and a second extension portion connected to each other. The first extension portion is located at one end edge of the insulating layer along the length direction of the lead layer, and the first extension portion extends along the width direction of the lead layer. One end of the lead-out portion is connected to the side of the first extension portion away from the one end edge. Along the length direction, the side of the lead-out portion facing the one end edge is flush with the side of the first extension portion away from the one end edge. The second extension portion extends from the first extension portion in a direction away from the one end edge, and the second extension portion is located at one edge of the insulating layer along the width direction. The width of the connection between the external electrode portion and the coil is c, where c > w.

2. The lead layer according to claim 1, characterized in that, 1.2w≤c≤5w.

3. The lead layer according to claim 1, characterized in that, The projection of the lead layer onto the surface of the insulating layer along its thickness direction, the first extension has a first side and a second side, the first side being disposed away from the second extension, the second side being disposed away from the one-end edge, the lead-out portion having a third side facing the one-end edge, the third side being collinear with the second side along its length direction, the third side being connected to the main body and the first side, the first side being configured in an arc shape, or the first side being inclined to the third side.

4. The lead layer according to claim 3, characterized in that, The first side is constructed in an arc shape, and the radius of the arc of the first side is R, w≤R≤5w, or the first side is inclined to the third side, and the included angle between the first side and the third side is α, 120°≤α≤150°.

5. The lead layer according to claim 1, characterized in that, The projection of the thickness direction of the lead layer onto the surface of the insulating layer; the first extension has a second side, which is disposed away from the edge of the first end; the lead-out portion has a fourth side and a fifth side, which is disposed away from the edge of the first end and is connected to the main body and the fifth side; the fifth side extends obliquely from the fourth side toward the first extension and is connected to the second side; the extension direction of the fifth side is oblique to the width direction.

6. A matrix, characterized in that, The device includes an inner electrode layer and a lead layer as described in any one of claims 1 to 5. The inner electrode layer has an inner electrode, and the lead layer is provided on both sides of the inner electrode layer along its own thickness direction. The two ends of the inner electrode are respectively electrically connected to the other end of the coil of the lead layer located on both sides of the inner electrode layer.

7. An inductor, characterized in that, Includes the matrix as described in claim 6.

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